CN115635413A - Polishing apparatus and polishing method - Google Patents

Abstract

The grinding device comprises a grinding base, a light emitter and a light sensor, wherein the grinding base is provided with a grinding surface, the grinding surface is used for grinding a piece to be ground, and the piece to be ground is provided with a needle point; the emitting end of the light emitter and the sensing end of the light sensor are both positioned on the plane of the grinding surface, and light rays emitted by the light emitter are attached to the grinding surface and face the light sensor; the end face of the needle point is abutted against the grinding surface and shields the light from emitting to the light sensor to form the grinding state of the grinding device. The grinding device can grind the end face of the needle point so as to enable the end face of the needle point to form a plane, and the ground needle point can be used for preparing a needle-point-shaped sample to be detected again, so that the preparation cost of the sample to be detected is reduced. Therefore, according to the grinding device and the grinding method provided by the disclosure, the needle point ground by the grinding device can be used for preparing a needle-point-shaped sample to be detected again, so that the utilization rate of the needle point carrying platform is improved, and the preparation cost of the sample to be detected is reduced.

Description

Polishing apparatus and polishing method

Technical Field

The present disclosure relates to the field of semiconductor technologies, and in particular, to a polishing apparatus and a polishing method.

Background

With the development of the semiconductor industry, the size of semiconductor devices is continuously reduced. In the semiconductor device, the performance of the semiconductor device can be improved by doping different trace elements or changing the distribution of the trace elements. Therefore, detecting the distribution of each element in the small-sized semiconductor device on the three-dimensional structure (i.e. three-dimensional reconstruction) is of great significance for guiding the preparation of the semiconductor device.

In the related art, in the process of three-dimensional reconstruction of a semiconductor device, a sample to be measured needs to be extracted from the semiconductor device, the sample to be measured needs to be fixed on a tip stage, and a Focused Ion Beam (FIB) is used to perform circular cutting on the sample to be measured on the tip stage to form a tip-shaped sample to be measured.

However, the needle tip carrier is a disposable material, which results in a high preparation cost of the sample to be measured in the shape of the needle tip.

Disclosure of Invention

The embodiment of the disclosure provides a grinding device and a grinding method, and a needle point ground by the grinding device can be used for preparing a needle-point-shaped sample to be detected again, so that the utilization rate of a needle point carrying platform is improved, and the preparation cost of the sample to be detected is reduced.

The embodiment of the disclosure provides the following technical scheme:

a first aspect of embodiments of the present disclosure provides a grinding apparatus, including: the grinding base is provided with a grinding surface, the grinding surface is used for grinding a to-be-ground piece, and the to-be-ground piece is provided with a needle point; the emitting end of the light emitter and the sensing end of the light sensor are both positioned on the plane of the grinding surface, and light rays emitted by the light emitter are attached to the grinding surface and face the light sensor; the end face of the needle point is abutted against the grinding surface and shields the light from emitting to the light sensor, so that the grinding state of the grinding device is formed.

The grinding device provided by the embodiment of the disclosure can comprise a grinding base, a light emitter and a light sensor, wherein the grinding base is provided with a grinding surface, the grinding surface is used for grinding a piece to be ground, the piece to be ground is provided with a needle point, and the needle point is used for bearing a sample to be tested. The transmitting end of the light emitter and the sensing end of the light sensor are both located on the plane of the grinding surface, light rays emitted by the light emitter are attached to the grinding surface and face the light sensor, and the light sensor can receive the light rays emitted by the light emitter. When the end face of the needle point is abutted to the grinding surface, the end face of the needle point can shield light to prevent the light from being emitted to the light sensor, and the grinding surface of the grinding device rotates to grind the end face of the needle point to form a grinding state of the grinding device. At the moment, the grinding device can grind the end face of the needle point so as to enable the end face of the needle point to form a plane, and the ground needle point can be used for preparing a needle-point-shaped sample to be detected again, so that the utilization rate of the needle point carrier is improved, and the preparation cost of the sample to be detected is reduced.

In a possible embodiment, the grinding device further comprises a support member, the support member is arranged on one side of the grinding base close to the grinding surface, and the light emitter and the light sensor are arranged on the support member, and the support member is used for supporting the member to be ground.

In a possible embodiment, a distance adjusting piece is arranged between the supporting piece and the grinding base, the distance adjusting piece is movably connected to at least one of the supporting piece and the grinding base, and the distance adjusting piece is used for adjusting the distance between the supporting piece and the grinding base.

By adjusting the distance adjusting piece, the emitting end of the light emitter and the sensing end of the light sensor are positioned on the plane of the grinding surface.

In one possible embodiment, the support member has a distance adjustment hole in which the distance adjustment member is inserted, an inner wall surface of the distance adjustment hole has an internal thread, an outer wall surface of the distance adjustment member has an external thread, and the internal thread and the external thread are engaged; the feed amount per revolution of the distance adjusting piece ranges from 1mm/R to 5mm/R.

The feeding amount of the distance adjusting piece per rotation can be prevented from being too small, so that the adjusting time is prevented from being too long; the feed amount per revolution of the distance adjusting piece can be prevented from being too large, so that the adjusting precision is prevented from being too low.

In a possible embodiment, the grinding device further comprises a driving assembly and a fixing member, wherein the driving assembly is arranged on the supporting member, the driving assembly is connected with the fixing member, the fixing member is used for being connected with the member to be ground, and the driving assembly is used for driving the fixing member to move in a direction close to or far away from the grinding surface.

In a possible embodiment, the grinding device further comprises a controller, wherein the controller is electrically connected with the light sensor and the driving component respectively; the controller is configured to control the driving assembly to drive the fixing piece to move along the direction close to the grinding surface, so that the end face of the needle tip abuts against the grinding surface and blocks light from emitting to the light sensor, and the driving assembly is controlled to stop working.

The controller automatically controls the movement of the fixing piece, so that the grinding of the needle point is more convenient.

In a possible embodiment, the fixing member includes a transmission portion and a fixing portion connected to each other, the fixing portion is connected to the driving assembly through the transmission portion, the fixing portion is used for being connected to the member to be ground, and the driving assembly is used for driving the transmission portion to move in a direction close to or away from the grinding surface, so that the fixing member moves in a direction close to or away from the grinding surface.

In one possible embodiment, the end of the fixing portion facing the abrasive surface is provided with a plurality of clamping portions, the plurality of clamping portions being arranged at intervals in the circumferential direction of the fixing portion, and clamping areas being formed between the plurality of clamping portions.

The needle point carrier is clamped by the clamping part, so that the operation is convenient.

In one possible embodiment, the clamping portion includes an elastic portion and two abutting portions, the two abutting portions being located at both ends of the elastic portion in the thickness direction of the grinding bed, respectively; the distance between each clamping part and the center of the clamping area is increased and then decreased along the thickness direction of the grinding base.

The elastic part can generate larger deformation, so that the clamping area is suitable for needle tip carriers with different volumes, and the applicable scene of the fixing part is enriched. The two abutting parts can abut against the edges of the two opposite ends of the bearing table in the thickness direction respectively so as to limit the bearing table in the thickness direction.

In one possible embodiment, the grinding device further comprises a telescopic assembly, the telescopic assembly is located between the fixed member and the supporting member, one end of the telescopic assembly is connected with the fixed member, and the other end of the telescopic assembly is connected to the supporting member; the telescopic direction of the telescopic assembly is the same as the moving direction of the fixing piece.

The telescopic assembly can play a limiting role in the first transmission part of the first driving assembly and the second transmission part of the fixing piece, so that the first transmission part and the second transmission part are stably linked, and the first transmission part and the second transmission part are prevented from being separated. In addition, the telescopic assembly can prevent the second transmission part from rotating under the driving of the first transmission part, so that the rotary motion of the first transmission part is converted into the linear motion of the second transmission part along the thickness direction of the grinding base.

In a possible implementation manner, the telescopic assembly comprises a first telescopic piece and a second telescopic piece, the first telescopic piece and the second telescopic piece are sleeved with each other, the first telescopic piece and the second telescopic piece are movably connected along the telescopic direction, the first telescopic piece is connected with the fixing piece, and the second telescopic piece is connected to the supporting piece.

The structure of the telescopic assembly is simpler.

A second aspect of an embodiment of the present disclosure provides a grinding method, including: providing a grinding device and a piece to be ground; the grinding device comprises a grinding base, a light emitter and a light sensor, wherein the grinding base is provided with a grinding surface, the grinding surface is used for grinding a to-be-ground piece, the to-be-ground piece is provided with a needle point, and the end surface of the needle point is uneven; regulating and controlling the light emitter and the light sensor so that the emitting end of the light emitter and the sensing end of the light sensor are both positioned on the plane of the grinding surface, and the light emitted by the light emitter is attached to the grinding surface and faces the light sensor; the end face of the needle point is controlled to abut against the grinding face, and light rays are shielded from being emitted to the light sensor; the controlled grinding surface grinds the end surface of the needle tip so that the end surface of the needle tip forms a plane.

According to the grinding method provided by the embodiment of the disclosure, the grinding method can be applied to a grinding device, the grinding device can grind the end face of the needle point so as to enable the end face of the needle point to form a plane, and the ground needle point can be used for preparing a needle point-shaped sample to be detected again, so that the utilization rate of the needle point carrier is improved, and the preparation cost of the sample to be detected is reduced.

In a possible implementation, the method for regulating the light emitter and the light sensor specifically includes: the distance adjusting piece is used for adjusting and controlling the distance between the transmitting end, the sensing end and the grinding surface along the thickness direction of the grinding base.

By adjusting the distance adjusting piece, the emitting end of the light emitter and the sensing end of the light sensor 1 are positioned on the plane of the grinding surface.

In one possible embodiment, the member to be ground is connected to a fixed part of the grinding device; the terminal surface butt abrasive surface of control needle point specifically includes: acquiring a sensing signal of a light sensor, and generating a driving signal according to the sensing signal; and driving a driving component of the grinding device according to the driving signal, controlling the driving component to drive the fixing part to move along the direction close to the grinding surface so as to enable the end surface of the needle point to abut against the grinding surface and shield the light from emitting to the light sensor, and controlling the driving component to stop working.

The controller automatically controls the movement of the fixing piece, so that the grinding of the needle point is more convenient.

In one possible embodiment, the rotational speed of the grinding surface is in the range of 90R/min to 110R/min: and/or the grinding time range is 3min-4min.

The construction of the present disclosure and other objects and advantages thereof will be more apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to clearly illustrate the embodiments or technical solutions of the present disclosure, the drawings used in the embodiments or technical solutions of the present disclosure will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a polishing apparatus provided in the embodiment of the present disclosure, on which a tip carrier is fixed;

fig. 2 is a schematic structural diagram of a needle tip carrier fixed on a fixing member according to an embodiment of the present disclosure;

fig. 3 is another schematic structural diagram of a polishing apparatus with a needle tip carrier fixed thereon according to an embodiment of the disclosure;

fig. 4 is another schematic structural diagram of the fixing member having the needle tip carrier fixed thereon according to the embodiment of the disclosure;

fig. 5 is a schematic structural diagram of a polishing apparatus provided in an embodiment of the present disclosure;

fig. 6 is a schematic flow chart of a polishing method according to an embodiment of the disclosure;

fig. 7 is a schematic diagram of cleaning a needle tip carrier by using an ultrasonic cleaning apparatus according to an embodiment of the present disclosure.

Description of reference numerals:

100: a grinding device; 110: grinding the base; 111: grinding the surface;

112: a bearing surface; 121: a light emitter; 122: a light sensor;

123: a switch; 130: a support member; 131: a first support section;

132: a second support portion; 133: a third support portion; 140: a distance adjusting member;

150: a first drive assembly; 151: a first driving member; 152: a protective cover;

153: a first transmission unit; 160: a fixing member; 162: a second transmission part;

163: a fixed part; 164: a clamping portion; 1641: an abutting portion;

1642: an elastic portion; 165: a clamping area; 170: a telescoping assembly;

171: a first telescoping member; 172: a second telescoping member; 180: a level gauge;

200: a needle tip carrying platform; 210: a needle tip; 220: a bearing table;

300: an ultrasonic cleaning instrument.

Detailed Description

In the related art, in the process of three-dimensional reconstruction of a semiconductor device, a sample to be measured needs to be extracted from the semiconductor device, and the sample to be measured needs to be prepared into a sample to be measured in a needle point shape. The sample to be measured can be fixed by the needle point carrying platform, an annular groove is formed in the end face of the needle point carrying platform, the needle point in the annular groove is used for fixing the sample to be measured, and the sample to be measured on the needle point carrying platform is subjected to circular cutting by the focused ion beam to form the sample to be measured in the shape of the needle point.

However, after the sample to be tested is tested, the sample to be tested remains on the surface of the needle point in the annular groove, so that the needle point carrier cannot be reused. If the cutting technology is adopted to remove the residual sample, the surface of the needle point in the annular groove becomes uneven, and the residual sample cannot be used for fixing the sample to be measured again. Therefore, the needle tip carrier is a disposable consumable, and is discarded after being used once, thereby causing higher preparation cost of the sample to be detected.

The embodiment of the disclosure provides a grinding device and a grinding method, the grinding device can comprise a grinding base, a light emitter and a light sensor, the grinding base is provided with a grinding surface, the grinding surface is used for grinding a to-be-ground piece, the to-be-ground piece is provided with a needle point, and the needle point is used for bearing a to-be-tested sample. The transmitting end of the light emitter and the sensing end of the light sensor are both located on the plane where the grinding surface is located, light rays emitted by the light emitter are attached to the grinding surface and face the light sensor, and the light sensor can receive the light rays emitted by the light emitter. When the end face of the needle point is abutted to the grinding surface, the end face of the needle point can shield light to prevent the light from being emitted to the light sensor, and the grinding surface of the grinding device rotates to grind the end face of the needle point to form a grinding state of the grinding device. At the moment, the grinding device can grind the end face of the needle point so as to enable the end face of the needle point to form a plane, and the ground needle point can be used for preparing a needle-point-shaped sample to be detected again, so that the utilization rate of the needle point carrier is improved, and the preparation cost of the sample to be detected is reduced.

To make the objects, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are some, but not all embodiments of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

The following describes a polishing apparatus 100 provided in an embodiment of the present disclosure with reference to fig. 1 to 7.

Referring to fig. 1, the polishing apparatus 100 may include a polishing base 110, the polishing base 110 having a polishing surface 111, and the polishing surface 111 may be used to polish an object to be polished. The polishing surface 111 may be located on the top surface of the polishing base 110. After the member to be polished is abutted against the polishing surface 111, the polishing surface 111 can be rotated, so that the polishing surface 111 polishes the member to be polished.

The polishing base 110 may have a carrying surface 112, and the carrying surface 112 may be used for carrying other components of the polishing apparatus 100. The bearing surface 112 may be located on the top surface of the polishing base 110. For example, the carrying surface 112 may surround the outer periphery of the grinding surface 111, and the carrying surface 112 and the grinding surface 111 may be spaced apart from each other, so as to prevent the grinding surface 111 from interacting with the carrying surface 112 during rotation.

For example, the polishing base 110 may include a polishing portion disposed corresponding to the polishing surface 111, and a top surface of the polishing portion forms the polishing surface 111. The grinding part can be located in the middle of the grinding base 110, and the periphery of the grinding part can be surrounded with a bearing part which can protect the grinding part. The bearing part is disposed corresponding to the bearing surface 112, and the top surface of the bearing part forms the bearing surface 112.

Illustratively, the object to be abraded may be a tip carrier 200 or other object to be abraded. The embodiment of the disclosure takes a workpiece to be polished as a tip carrier 200 as an example. The tip stage 200 may be used to carry a sample to be measured in the shape of a tip. Referring to fig. 2, the tip carrier 200 may include a tip 210 and a carrier 220, wherein the carrier 220 is used for carrying the tip 210, so as to facilitate the use and fixing of the tip carrier 200. The material of the tip 210 may be a metal, such as copper. As described in the related art, the end surface of the tip 210 becomes uneven after the sample test.

Referring to fig. 3, the abrading device 100 may include a light emitter 121 and a light sensor 122, the light emitter 121 configured to emit light toward the light sensor 122, and the light sensor 122 configured to receive light emitted from the light emitter 121. The light emitter 121 has an emitting end, which is a light exit port of the light emitter 121; the optical sensor 122 has a sensing end, which is a light receiving port of the optical sensor 122, and a connection line between the emitting end and the sensing end can be regarded as a propagation path of light. The emitting end and the sensing end can be both located on the plane of the polishing surface 111, so that the light emitted by the light emitter 121 is attached to the polishing surface 111.

Referring to fig. 3, when the end surface of the tip 210 abuts against the polishing surface 111, the end surface of the tip 210 may be located on the propagation path of the light, the end surface of the tip 210 will block the light from emitting to the photo-sensor 122, so that the photo-sensor 122 cannot receive the light, thereby forming a polishing state of the polishing apparatus 100, and the polishing surface 111 rotates to polish the end surface of the tip 210. The end surface of the needle point 210 is ground and then becomes a plane, so that the needle point 210 can be repeatedly used for preparing a needle-point-shaped sample to be detected, the utilization rate of the needle-point carrier 200 is improved, and the preparation cost of the sample to be detected is reduced. It is also possible to avoid the shortage of goods due to the long ordering period of the needle tip carrier 200. Wherein the arrow a in fig. 3 shows that light is blocked by the end face of the tip 210 from being emitted toward the photosensor 122.

Referring to fig. 3, the grinding apparatus 100 may include a support 130, and the support 130 may be disposed at a side of the grinding base 110 adjacent to the grinding surface 111. For example, the supporting member 130 may be disposed on the carrying surface 112. Support 130 may be used to support tip carrier 200.

The polishing apparatus 100 may include a driving assembly (the driving assembly may be a first driving assembly 150) and a fixing member 160, the first driving assembly 150 is disposed on the support 130, the first driving assembly 150 is connected to the fixing member 160, and the fixing member 160 is used for connecting to the tip stage 200. The fixing member 160 and the polishing surface 111 are disposed at an interval, and the first driving assembly 150 is configured to drive the fixing member 160 to move along a direction close to or away from the polishing surface 111, so as to drive the tip carrier 200 to move along a direction close to or away from the polishing surface 111. The grinding base 110 may further be provided with a second driving component, and when the needle tip 210 abuts against the grinding surface 111, the second driving component may be configured to drive the grinding portion to rotate so as to drive the grinding surface 111 to rotate, so that the grinding surface 111 grinds the needle tip 210.

Referring to fig. 3, the polishing apparatus 100 may include a first direction X, a second direction Y, and a third direction Z, where the first direction X, the second direction Y, and the third direction Z are different, for example, the first direction X, the second direction Y, and the third direction Z may be perpendicular to each other. For example, the first direction X may be a width direction of the polishing apparatus 100, the second direction Y may be a length direction of the polishing apparatus 100, and the third direction Z may be a thickness direction of the polishing apparatus 100. The length, width, thickness, etc. in the embodiments of the present application are for convenience of description only, and do not imply any limitation on the dimensions. For example, the width may be greater than, equal to, or less than the length. For example, the grinding base 110 and the supporting member 130 may be arranged adjacently along the third direction Z, and the fixing member 160 and the grinding surface 111 are spaced apart along the third direction Z.

In some embodiments, the polishing apparatus 100 may comprise a controller electrically connected to the first driving assembly 150, the second driving assembly, and the photo sensor 122, respectively. The controller can control the first driving assembly 150 to drive the fixing member 160 to move, and the controller can control the second driving assembly to drive the polishing surface 111 to rotate.

When the optical sensor 122 receives light, the optical sensor 122 generates a sensing signal, which is a first sensing signal, the controller obtains the first sensing signal and generates a first driving signal according to the first sensing signal, and the first driving signal is used for driving the first driving assembly 150 to work so as to drive the fixing member 160 to move close to the polishing surface 111 along the third direction Z. The controller may also be configured to control the second drive assembly to cease operation when the fixture 160 is moved in a direction proximate the abrasive surface 111. When the end surface of the needle tip 210 moves to abut against the polishing surface 111, the end surface of the needle tip 210 blocks light to be emitted to the light sensor 122, and the light sensor 122 generates a second sensing signal. After the controller acquires the second sensing signal, a second driving signal is generated according to the second sensing signal, and the second driving signal is used for driving the second driving assembly to work so as to drive the grinding surface 111 to rotate, thereby grinding the end surface of the needle point 210. The controller may be further configured to control the first driving assembly 150 to stop working when the end surface of the tip 210 moves to abut against the grinding surface 111.

Referring to fig. 3, the supporting member 130 may include a first supporting portion 131 and a second supporting portion 132 disposed opposite to each other, and the first supporting portion 131 and the second supporting portion 132 may be both located on the carrying surface 112. The first and second support portions 131 and 132 are disposed opposite to each other at an interval along the XY plane. For example, the first and second supporting parts 131 and 132 may be oppositely disposed in the first direction X. A third support 133 may be disposed between the first support 131 and the second support 132, one end of the third support 133 being connected to the first support 131, and the other end of the third support 133 being connected to the second support 132. The third supporting portion 133 is spaced from the polishing surface 111 along the third direction Z. The first driving assembly 150 may be disposed on the third supporting part 133.

For example, the light emitter 121 and the light sensor 122 may be disposed on the support 130. For example, the light emitter 121 may be disposed at one of the first and second supporting parts 131 and 132, and the light sensor 122 may be disposed at the other of the first and second supporting parts 131 and 132. The polishing surface 111 is located between the first support 131 and the second support 132. The polishing surface 111 may protrude from the supporting surface 112 toward the supporting member 130, and the polishing surface 111 is higher than the supporting surface 112, so that the emitting end of the light emitter 121 and the sensing end of the light sensor 122 are disposed on the plane of the polishing surface 111.

In some embodiments, referring to fig. 3, a level 180 may be disposed on the support 130, and the level 180 may be located on any one of the first support 131, the second support 132, and the third support 133. For example, the level 180 may be located on a top surface of the support 130 to facilitate viewing of the level 180. The level gauge 180 may be used to determine the position of a horizontal plane for assisting the horizontal adjustment of the support 130 to make the support 130 in a horizontal state, thereby ensuring the surface flatness of the end surface of the ground tip 210. Wherein, the carrying surface 112 and the grinding surface 111 can be parallel to the horizontal plane, the level gauge 180 can be used to determine whether the top surface provided with the level gauge 180 is in the horizontal state, and when the top surface provided with the level gauge 180 is parallel to the horizontal plane, the supporting member 130 is in the horizontal state.

In some embodiments, referring to fig. 3, a distance adjusting member 140 is disposed between the supporting member 130 and the grinding base 110, and the distance adjusting member 140 may be used to adjust the distance between the supporting member 130 and the grinding base 110. The support 130 may be in a horizontal state by adjusting the distance adjustment member 140. In addition, the distance adjusting member 140 can be adjusted to make the emitting end of the light emitter 121 and the sensing end of the light sensor 122 located on the plane of the grinding surface 111.

The distance adjustment member 140 provided in the embodiment of the present disclosure is explained below.

Referring to fig. 3, distance adjusters 140 may be positioned between the bottom of support member 130 and load-supporting surface 112. The distance adjusters 140 may be a plurality, with a plurality of distance adjusters 140 spaced along the bearing surface 112. A portion of the distance-adjusting member 140 may be positioned between the first supporting part 131 and the carrying surface 112, and another portion of the distance-adjusting member 140 may be positioned between the second supporting part 132 and the carrying surface 112. The distance adjusting members 140 between the first supporting portion 131 and the carrying surface 112 may be 1, 2, 3, 4, or 5 or more; the distance adjuster 140 between the second supporting portion 132 and the carrying surface 112 may be 1, 2, 3, 4, or 5 or more. For example, the number of the distance adjusting members 140 between the first supporting portion 131 and the carrying surface 112 may be 4, and the 4 distance adjusting members 140 are distributed at intervals on the edge of the bottom surface of the first supporting portion 131, so that the distance adjusting members 140 have a better supporting effect on the first supporting portion 131. The number of the distance adjusting members 140 between the second supporting portion 132 and the carrying surface 112 may be 4, and the 4 distance adjusting members 140 are spaced at the edge of the bottom surface of the second supporting portion 132, so that the distance adjusting members 140 can support the second supporting portion 132 well.

Wherein, the distance adjusting member 140 can be movably connected to at least one of the supporting member 130 and the grinding base 110. The distance adjusting member 140 and the supporting member 130 may be movably disposed along the third direction Z, or the distance adjusting member 140 and the grinding base 110 may be movably disposed along the third direction Z, or the distance adjusting member 140 and the supporting member 130 may be movably disposed along the third direction Z, and the distance adjusting member 140 and the grinding base 110 may be movably disposed along the third direction Z.

The embodiment of the present disclosure is described by taking an example of the arrangement of the distance adjuster 140 and the support 130 moving in the third direction Z.

The supporting member 130 may have a distance adjusting hole in which the top end of the distance adjusting member 140 is inserted, an inner wall surface of the distance adjusting hole having an internal thread, and an outer wall surface of the distance adjusting member 140 having an external thread, the internal thread and the external thread being engaged. When the distance adjusting member 140 rotates, the internal thread and the external thread rotate with each other, and the distance adjusting member 140 and the supporting member 130 move with each other along the third direction Z to drive the supporting member 130 to move along the third direction Z, so as to adjust the distance between the supporting member 130 and the carrying surface 112.

For example, the feeding amount per rotation of the distance adjusting member 140 may range from 1mm/R to 5mm/R, which is equivalent to the distance that the supporting member 130 moves in the third direction Z per rotation of the distance adjusting member 140 ranges from 1mm to 5mm. Thereby avoiding the feeding amount per revolution of the distance adjusting member 140 from being too small, and avoiding the adjusting time from being too long; it is also possible to avoid an excessively large feed per revolution of the distance adjusting member 140, thereby avoiding an excessively low adjustment accuracy. For example, the feed per revolution of the distance adjuster 140 may be 1mm/R, 2mm/R, 3mm/R, 4mm/R, 5mm/R, or any value between 1mm/R and 5mm/R.

The cooperation between the first driving assembly 150 and the fixing member 160 provided by the embodiment of the present disclosure is explained as follows.

Referring to fig. 1 and 3, the first drive assembly 150 may include a protective cover 152 and a first drive 151, for example, the first drive 151 may be a motor. The protective cover 152 may cover the outside of the first driving member 151 to protect the first driving member 151. The protective cover 152 may also cover the outer side of the fixing member 160 to protect the fixing member 160. When the rotating shaft of the first driving member 151 rotates, the fixing member 160 can be driven to move along the third direction Z. The first driving member 151 and the fixing member 160 can be engaged with each other by a rack and a gear, or by an internal thread and an external thread, so that the first driving member 151 drives the fixing member 160 to move along the third direction Z.

Referring to fig. 3, a first transmission portion 153 is disposed on a rotation shaft of the first driving member 151, a second transmission portion 162 is disposed at an end of the fixing member 160 away from the grinding surface 111, and the first transmission portion 153 and the second transmission portion 162 are linked with each other. When the first transmission portion 153 rotates, the second transmission portion 162 may be driven to move along the third direction Z. For example, the first transmission part 153 has a first external thread, and the second transmission part 162 has a second external thread, and the first external thread and the second external thread are engaged. The first driving member 151 drives the first transmission portion 153 to rotate, and drives the second transmission member to move along the third direction Z through the cooperation of the first external thread and the second external thread.

For example, the distance that the first transmission portion 153 moves the fixing member 160 along the third direction Z is less than or equal to 10mm per rotation, so that the distance between the fixing member 160 and the grinding surface 111 can be adjusted with high precision. For example, the distance that the first transmission portion 153 can move the fixing member 160 along the third direction Z per rotation is 1mm, 3mm, 5mm, 7mm, 9mm, 10mm, or any value less than 10 mm.

Referring to fig. 2, the grinding apparatus 100 may further include a telescopic assembly 170, and the telescopic assembly 170 is telescopic in the same direction as the moving direction of the fixing member 160. The telescopic direction of the telescopic assembly 170 may be a third direction Z. As the fixture 160 moves in a direction against the abrasive surface 111, the retraction assembly 170 expands; as the fixture 160 moves in a direction away from the abrasive surface 111, the retraction assembly 170 contracts. The telescopic assembly 170 is located between the fixing member 160 and the supporting member 130, and the fixing member 160 and the supporting member 130 are connected through the telescopic assembly 170 to prevent the fixing member 160 from separating from the supporting member 130. One end of the telescopic assembly 170 is connected to the fixing member 160, and the other end of the telescopic assembly 170 is connected to the support 130. The telescopic assembly 170 may limit the first transmission part 153 and the second transmission part 162, so that the first transmission part 153 and the second transmission part 162 are stably linked to avoid separation between the first transmission part 153 and the second transmission part 162. In addition, the telescopic assembly 170 may prevent the second transmission part 162 from rotating under the driving of the first transmission part 153, so as to convert the rotation of the first transmission part 153 into the linear motion of the second transmission part 162 along the third direction Z.

Wherein the telescoping assembly 170 may be directly connected to the support 130, or the telescoping assembly 170 may be indirectly connected to the support 130 via other structural members. For example, the telescoping assembly 170 may be coupled to the support 130 via the first drive 151. The telescopic assembly 170 may be sleeved outside the first transmission part 153 and the second transmission part 162 to protect the first transmission part 153 and the second transmission part 162.

Illustratively, the telescopic assembly 170 may include a first telescopic member 171 and a second telescopic member 172, the first telescopic member 171 and the second telescopic member 172 are sleeved with each other, the first telescopic member 171 and the second telescopic member 172 are movably connected along a telescopic direction, the first telescopic member 171 is connected to the fixing member 160, and the second telescopic member 172 is connected to the supporting member 130. As the fixed member 160 moves in a direction against the abrasive surface 111, the first expansion member 171 moves in a direction against the abrasive surface 111 to expand the expansion assembly 170. As the fixture 160 moves in a direction away from the abrasive surface 111, the first retractor member 171 moves in a direction away from the abrasive surface 111 to retract the retraction assembly 170.

The fixing member 160 provided in the embodiment of the present disclosure is explained below.

Referring to fig. 4 and 5, the fixing member 160 may include a fixing portion 163 connected to the second transmission portion 162, and the fixing portion 163 is connected to the first driving assembly 150 through the second transmission portion 162. The fixing portion 163 is configured to be connected to the tip stage 200, and the first driving assembly 150 is configured to drive the second transmission portion 162 to move in a direction close to or away from the polishing surface 111, so that the fixing portion 163 moves in a direction close to or away from the polishing surface 111. The fixing portion 163 is provided with a plurality of clamping portions 164 at one end facing the polishing surface 111, the clamping portions 164 are arranged at intervals along the circumferential direction of the fixing portion 163, a clamping area 165 (fig. 5) is formed between the clamping portions 164, and the carrier 220 of the tip stage 200 can be fixed in the clamping area 165 by the clamping portions 164. For example, the number of the clamping portions 164 may be 2, 3, 4, or 5 and more.

Illustratively, the clamping portion 164 may include an elastic portion 1642 and two abutting portions 1641, the two abutting portions 1641 being respectively located at both ends of the elastic portion 1642 in the thickness direction (third direction Z) of the polishing base 110. When the carrier stage 220 is located in the clamping area 165, the two abutting portions 1641 may abut against the edges of the two opposite ends of the carrier stage 220 along the third direction Z, respectively, so as to limit the position of the carrier stage 220 along the third direction Z. The elastic portion 1642 can generate a large deformation, so that the clamping region 165 can be applied to various needle tip carriers 200 with different volumes, thereby enriching the application scenes of the fixing portion 163. Along the thickness direction of the grinding base 110, the distance between each clamping portion 164 and the center of the clamping area 165 is increased and then decreased, so that the abutting portion 1641 can better limit the position of the carrier stage 220 along the third direction Z.

For example, the elastic portion 1642 may include a first extension and a second extension oppositely disposed along the third direction Z, a third extension is disposed between the first extension and the second extension, the third extension is located at one end of the first extension and the second extension facing away from the center of the clamping region 165, and the two abutting portions 1641 are respectively located at one end of the first extension and the second extension close to the center of the clamping region 165. The third extension may be arc-shaped, and the third extension is bent towards a side facing away from the center of the clamping area 165, so that the third extension may provide a larger deformation space. In addition, the distance of the first and second extensions in the third direction Z gradually decreases in the direction from the edge of the clamping area 165 to the center of the clamping area 165. The distance between the two abutments 1641 can be made closer to provide a greater clamping force to the carrier table 220. The first and second extensions may have a larger deformation space, which is beneficial for the clamping area 165 to be suitable for various needle tip carriers 200 with different volumes.

The following describes a polishing method provided in an embodiment of the present disclosure.

The polishing method can be applied to the polishing apparatus 100 in the above-described embodiment. Referring to fig. 6, the grinding method may include:

s100: a grinding device and an element to be ground are provided.

First, a grinding apparatus 100 and a member to be ground are provided, and the grinding apparatus 100 may be used to grind the member to be ground. Referring to fig. 1, the polishing apparatus 100 may include a polishing base 110, a light emitter 121, and a light sensor 122, the polishing base 110 having a polishing surface 111, the polishing surface 111 being used for polishing a member to be polished. The member to be ground may have a tip 210, and the end surface of the tip 210 may be rugged before grinding. For example, the object to be ground may be a tip stage 200.

S200: the light emitter and the light sensor are regulated and controlled so that the emitting end of the light emitter and the sensing end of the light sensor are both located on the plane of the grinding surface, and light rays emitted by the light emitter are attached to the grinding surface and face the light sensor.

Referring to fig. 3, a support 130 is disposed on the grinding base 110, and both the light emitter 121 and the light sensor 122 may be disposed on the support 130. The distance between the supporting member 130 and the carrying surface 112 of the polishing base 110 is adjusted by the distance adjusting member 140, so as to adjust the distance between the emitting end of the light emitter 121, the sensing end of the light sensor 122 and the polishing surface 111 along the third direction Z. When the emitting end of the light emitter 121 and the sensing end of the light sensor 122 are both located on the plane of the polishing surface 111, the light emitted by the light emitter 121 is attached to the polishing surface 111 and directed toward the light sensor 122. The support 130 may also be adjusted to be in a horizontal state by the distance adjusting member 140. In addition, a level 180 is provided on the support 130, and the level 180 may be used to determine the level state of the support 130,

for example, the grinding device 100 may include a controller, and the distance adjustment member 140 may be controlled by the controller, or the distance adjustment member 140 may be manually adjusted. The support 130 may be provided with a switch 123 (fig. 4) connected to the light emitter 121, the switch 123 may control the light emitter 121 to be turned on or off, and the switch 123 may be operated manually or by a controller.

S300: the end face of the control needle point is abutted against the grinding face and shields the light from emitting to the light sensor.

Referring to fig. 3, the polishing apparatus 100 may include a first driving assembly 150, wherein the first driving assembly 150 is electrically connected to a controller, and the controller is configured to control the first driving assembly 150 to drive the fixing portion 163 to move along the third direction Z. For example, the controller may be configured to control the first driving assembly 150 to drive the fixing portion 163 to move in a direction close to the polishing surface 111, so that the end surface of the tip 210 abuts against the polishing surface 111.

The process of controlling the end face of the tip 210 to abut the abrasive surface 111 may be: the tip stage 200 is fixed to the fixing portion 163. The switch 123 is controlled to turn on the light emitter 121, the light emitter 121 emits light, when the light sensor 122 receives the light, the light sensor 122 generates a first sensing signal, after the controller obtains the first sensing signal, a first driving signal is generated according to the first sensing signal, and the first driving signal is used for driving the first driving assembly 150 to work so as to drive the fixing portion 163 to move close to the grinding surface 111 along the third direction Z. When the end surface of the needle tip 210 moves to abut against the grinding surface 111, the end surface of the needle tip 210 blocks light to emit to the light sensor 122, and the controller controls the first driving assembly 150 to stop working. The controller controls the first driving assembly 150, the second driving assembly, etc. to automatically work, so that the polishing apparatus 100 is convenient to use.

S400: the controlled grinding surface grinds the end surface of the needle tip so that the end surface of the needle tip forms a plane.

The polishing apparatus 100 may include a second driving component electrically connected to the controller, and the second driving component is configured to drive the polishing surface 111 to rotate so as to polish the end surface of the tip 210.

The process of controlling the grinding surface 111 to grind the end surface of the tip 210 may be: when the end surface of the tip 210 moves to abut against the polishing surface 111, the end surface of the tip 210 may block the light from emitting to the photo-sensor 122, and the photo-sensor 122 generates a second sensing signal. After the controller acquires the second sensing signal, a second driving signal is generated according to the second sensing signal, and the second driving signal is used for driving the second driving assembly to work so as to drive the grinding surface 111 to rotate, so that the end surface of the needle point 210 is ground into a plane. After a certain grinding time, the controller may be further configured to control the second driving assembly to stop moving, and control the first driving assembly 150 to drive the fixing portion 163 to move in a direction away from the grinding surface 111, so that the needle tip 210 is separated from the grinding surface 111, and the fixing portion 163 may return to the initial position.

When the end surface of the needle 210 moves to abut against the grinding surface 111, the controller may be further configured to control the first driving assembly 150 to stop working. The controller may also be configured to control the second drive assembly to cease operation when the fixture 160 is moved in a direction proximate the abrasive surface 111.

Illustratively, the rotation speed of the grinding surface 111 may range from 90R/min to 110R/min, so as to avoid the rotation speed of the grinding surface 111 being too low, and thus avoid the grinding speed being too slow; and the rotation speed of the polishing surface 111 can be prevented from being too high, so as to prevent the polishing speed from being too high. For example, the rotational speed of the abrasive surface 111 may be 90R/min, 95R/min, 100R/min, 105R/min, 110R/min, or any value between 90R/min and 110R/min.

For example, the grinding time may be 3min to 4min, so that the grinding time is prevented from being too short, and the flatness of the end face of the needle tip 210 is prevented from being poor after grinding; it is also possible to avoid grinding for too long a time to avoid over-grinding of the tip 210. For example, the time of milling can be 3min, 3.2min, 3.4min, 3.6min, 3.8min, 4min, or any value between 3min-4min.

Referring to fig. 7, after finishing the grinding, the tip stage 200 may be removed from the fixing portion 163, and the tip 210 may be cleaned by the ultrasonic cleaning apparatus 300. To remove impurities introduced by the tip 210 during the grinding process.

It should be noted that the numerical values and numerical ranges related to the embodiments of the present disclosure are approximate values, and there may be a certain range of errors depending on the manufacturing process, and the error may be considered as negligible by those skilled in the art.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present disclosure, and not for limiting the same; while the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims (15)

1. A grinding apparatus, comprising: the grinding base is provided with a grinding surface, the grinding surface is used for grinding a piece to be ground, and the piece to be ground is provided with a needle point;

the emitting end of the light emitter and the sensing end of the light sensor are both positioned on the plane of the grinding surface, and light rays emitted by the light emitter are attached to the grinding surface and face the light sensor;

the end face of the needle point is abutted against the grinding face and shields the light rays from being emitted to the light sensor, so that the grinding state of the grinding device is formed.

2. The abrading apparatus of claim 1, further comprising a support disposed on a side of the abrading substrate adjacent the abrading surface, the light emitter and light sensor being disposed on the support, the support being configured to support the item to be abraded.

3. The abrading apparatus of claim 2, wherein a distance adjustment member is disposed between the support member and the abrading base, the distance adjustment member being movably coupled to at least one of the support member and the abrading base, the distance adjustment member being configured to adjust a distance between the support member and the abrading base.

4. The grinding apparatus as set forth in claim 3, wherein the support member has a distance adjustment hole in which the distance adjustment member is inserted, an inner wall surface of the distance adjustment hole has an internal thread, an outer wall surface of the distance adjustment member has an external thread, and the internal thread and the external thread are engaged;

the feeding amount per revolution of the distance adjusting piece ranges from 1mm/R to 5mm/R.

5. The grinding device according to any one of claims 2 to 4, further comprising a driving assembly and a fixing member, wherein the driving assembly is disposed on the supporting member, the driving assembly is connected to the fixing member, the fixing member is used for being connected to the member to be ground, and the driving assembly is used for driving the fixing member to move in a direction close to or away from the grinding surface.

6. The abrading apparatus of claim 5, further comprising a controller electrically connected to the light sensor and the drive assembly, respectively;

the controller is configured to control the driving assembly to drive the fixing piece to move in a direction close to the grinding surface, so that the end surface of the needle tip abuts against the grinding surface and shields the light from emitting to the light sensor, and the driving assembly is controlled to stop working.

7. The grinding device as claimed in claim 5, wherein the fixing member includes a transmission portion and a fixing portion connected to each other, the fixing portion is connected to the driving assembly through the transmission portion, the fixing portion is used for being connected to the member to be ground, and the driving assembly is used for driving the transmission portion to move in a direction close to or away from the grinding surface, so that the fixing member moves in a direction close to or away from the grinding surface.

8. The abrading device as recited in claim 7, wherein the fixed portion is provided with a plurality of gripping portions at an end thereof facing the abrasive surface, the plurality of gripping portions being spaced apart along a circumferential direction of the fixed portion, and a gripping area being formed between the plurality of gripping portions.

9. The grinding apparatus according to claim 8, wherein the clamping portion includes an elastic portion and two abutting portions, the two abutting portions being located at both ends of the elastic portion in a thickness direction of the grinding base, respectively;

along the thickness direction of the grinding base, the distance between each clamping part and the center of the clamping area is increased and then reduced.

10. The abrading apparatus of claim 5, further comprising a telescoping assembly positioned between the stationary member and the support member, one end of the telescoping assembly being connected to the stationary member and the other end of the telescoping assembly being connected to the support member;

the telescopic direction of the telescopic assembly is the same as the moving direction of the fixing piece.

11. The abrading apparatus of claim 10, wherein the telescoping assembly comprises a first telescoping member and a second telescoping member, the first telescoping member and the second telescoping member being nested within one another, the first telescoping member and the second telescoping member being movably coupled along the telescoping direction, the first telescoping member being coupled to the fixed member, the second telescoping member being coupled to the support member.

12. A method of grinding, comprising:

providing a grinding device and a piece to be ground; the grinding device comprises a grinding base, a light emitter and a light sensor, wherein the grinding base is provided with a grinding surface, the grinding surface is used for grinding the to-be-ground piece, the to-be-ground piece is provided with a needle point, and the end surface of the needle point is uneven;

regulating the light emitter and the light sensor so that the emitting end of the light emitter and the sensing end of the light sensor are both positioned on the plane of the grinding surface, and the light emitted by the light emitter is attached to the grinding surface and faces the light sensor;

controlling the end surface of the needle point to abut against the grinding surface and shielding the light to emit to the light sensor;

and controlling the grinding surface to grind the end surface of the needle tip so as to enable the end surface of the needle tip to form a plane.

13. The abrading method of claim 12, wherein the step of conditioning the light emitter and the light sensor comprises:

a distance adjusting part for adjusting and controlling the grinding device, wherein the distance adjusting part is configured to adjust the distance between the transmitting end, the sensing end and the grinding surface along the thickness direction of the grinding base.

14. The polishing method according to claim 12, wherein the member to be polished is attached to a fixing portion of the polishing apparatus; control the terminal surface butt of needle point the abrasive surface specifically includes:

acquiring a sensing signal of the light sensor, and generating a driving signal according to the sensing signal;

and driving a driving component of the grinding device according to the driving signal, controlling the driving component to drive the fixing part to move along the direction close to the grinding surface so as to enable the end surface of the needle point to abut against the grinding surface and shield the light from emitting to the light sensor, and controlling the driving component to stop working.

15. The grinding method according to any one of claims 12 to 14, wherein the rotation speed of the grinding surface is in the range of 90R/min to 110R/min:

and/or the grinding time range is 3min-4min.

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