CN1156204C - Integrated circuit baseplate column-like projection block forming method - Google Patents
Integrated circuit baseplate column-like projection block forming method Download PDFInfo
- Publication number
- CN1156204C CN1156204C CNB001244108A CN00124410A CN1156204C CN 1156204 C CN1156204 C CN 1156204C CN B001244108 A CNB001244108 A CN B001244108A CN 00124410 A CN00124410 A CN 00124410A CN 1156204 C CN1156204 C CN 1156204C
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- CN
- China
- Prior art keywords
- column
- integrated circuit
- veil
- projection block
- jointing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The present invention relates to a method for forming a columnar lug on a base board of an integrated circuit. In order to provide a manufacturing method of a base board of an integrated circuit having the advantages that the interval between a wafer and a base board is accurately controlled, the glue filling process is easy, the qualification rate of products is high, and the cost is low, the present invention is proposed. The method of the present invention comprises the following steps: a plating method is used for plating a copper line, a jointing shield with proper height is coated, the position of the jointing shield corresponding to the copper line is opened, and the copper on the bottom of the jointing shield is plated on a high position; subsequently, the fusing metal of tin-lead alloy is plated on the uppermost layer of the jointing shield, the jointing shield is removed, and then, a columnar lug is formed on the base board of an integrated circuit.
Description
Technical field
The invention belongs to the manufacture method of integrated circuit baseplate, particularly a kind of integrated circuit baseplate column-like projection block forming method.
Background technology
As shown in Figure 1 and Figure 2, to cover the practice that wafer (die) 2 ' is incorporated into substrate (substrate) 1 ' of crystalline substance (FlipChip) technology main flow, the be everlasting I/O place of wafer (die) 2 ' molds following layer (Under Bump Metallurgy, UMB) 21 ' back reshaping goes out wafer leypewter projection 22 ', again it is overturned the back and engage with the substrate 1 ' of the circuit 12 ' that performs in motherboard 11 ', and at this substrate 1 ' and wafer 2 ' joint appropriate location coating filler 3 '.
This crystal covered package technology of commonly using can not accurately be controlled its certain height.Reason be the substrate of the crystal covered package technology commonly used or the leypewter on the wafer fuse meet 100 ℃～350 ℃ high temperature behind the metal-plated height after, the alloy melting liquefy, wafer presses down because of gravity factor, make it highly be difficult for accurately control, make the engaging space of wafer leypewter projection and substrate become minimum, cause filler to be difficult for, the qualification rate of product can't be improved.
Summary of the invention
The purpose of this invention is to provide spacing between a kind of accurate control wafer and substrate, filler is easy, product percent of pass is high, cost is low integrated circuit baseplate column-like projection block forming method.
The present invention includes:
On motherboard, plate out copper wire, form substrate with galvanoplastic;
Cover one deck and engage veil on motherboard, it is the height of required column-like projection block highly just;
Offer opening in engaging veil corresponding to the copper wire position;
Step 4
On the copper wire of veil opening part, electroplate fine copper with electroplating technology, with in opening part moulding column fine copper;
Step 5
Tin-lead alloy plating fuses metal at column fine copper top, fuses metal level with the moulding leypewter, and makes it and to engage veil contour;
Step 6
Remove the joint veil, be convenient to integrated circuit baseplate moulding column-like projection block.
Since the present invention includes use galvanoplastic plate out copper wire, coating suitably height the joint veil, engage veil corresponding to copper wire position opening and the copper plating of its bottom is high, fuse metal and remove the joint veil with leypewter in its superiors' plating again, in integrated circuit baseplate moulding column-like projection block.Integrated circuit baseplate does to cover brilliant the combination by column-like projection block on it with wafer.Because utilizing, column-like projection block system electroplates fine copper growth height, so can obtain splendid gauge control precision with moulding column fine copper; By suitably controlling its height, can make things convenient for carrying out smoothly of filler operation to keep spacing between substrate and wafer; Fuse metal level because of on column-like projection block, plating leypewter in advance again, cover brilliant in conjunction with the time, wafer only need be made knitting layer, and no longer needs to make the leypewter projection, and the wafer that can avoid having experienced the superseded costliness of first-time qualification rate stands the risk that qualification rate is eliminated again.Not only accurately spacing between control wafer and substrate, filler are easy, and product percent of pass height, cost are low, thereby reach purpose of the present invention.
Description of drawings
Fig. 1, be known integrated circuit baseplate structural representation cutaway view.
Fig. 2, for the known chip architecture schematic sectional view that is used for integrated circuit.
Fig. 3,, known integrated circuit baseplate and wafer combine schematic diagram for covering crystalline substance.
Fig. 4, for molding substrate column-like projection block step 1 structural representation cutaway view of the present invention.
Fig. 5, for molding substrate column-like projection block step 2 structural representation cutaway view of the present invention.
Fig. 6, for molding substrate column-like projection block step 3 structural representation cutaway view of the present invention.
Fig. 7, for molding substrate column-like projection block step 4 structural representation cutaway view of the present invention.
Fig. 8, for molding substrate column-like projection block step 5 structural representation cutaway view of the present invention.
Fig. 9, for molding substrate column-like projection block step 6 structural representation cutaway view of the present invention.
Figure 10, combine schematic diagram for covering crystalline substance with the substrate of moulding column-like projection block of the present invention and wafer.
Embodiment
When the present invention system uses galvanoplastic making integrated circuit baseplate, utilize the suitably joint veil of height of coating, at the appropriate position opening of joint veil, and the copper plating of its bottom is high, fuse metal in its superiors' plating with leypewter again.
The present invention includes following steps:
As shown in Figure 4, on the motherboard 11 of substrate 1, plate out copper wire 12 with galvanoplastic earlier;
As shown in Figure 5, cover one deck and engage veil 13 on motherboard 11, it is the height of required column-like projection block 17 highly just;
As shown in Figure 6, offer opening 14 in engaging veil 13 corresponding to copper wire 12 positions;
Step 4
As shown in Figure 7, on the copper wire 12 at veil 13 openings 14 places, electroplate fine copper, with in opening 14 places moulding column fine copper 15 with electroplating technology;
Step 5
As shown in Figure 8, fuse metal, fuse metal level 16, and make it and to engage veil 13 contour with the moulding leypewter at column fine copper 15 top tin-lead alloy platings;
Step 6
As shown in Figure 9, remove and engage veil 13, be convenient to moulding column-like projection block 17 on the motherboard 11 of integrated circuit baseplate 1.
As shown in figure 10, when integrated circuit baseplate 1 covers brilliant the combination with wafer 2, do to cover brilliant the combination with wafer 2 by column-like projection block 17 on the substrate 1.Because column-like projection block 17 is to utilize to electroplate fine copper growth height with moulding column fine copper 15, so can obtain splendid gauge control precision; To keep substrate 1 and 2 spacings of wafer, can make things convenient for carrying out smoothly of filler operation by the height of suitably controlling column fine copper 15; Fuse metal level 16 because of on column-like projection block 17, plating leypewter in advance again, cover brilliant in conjunction with the time, wafer 2 only need be made knitting layer 21, and no longer needs to make the leypewter projection, and the wafer 2 that can avoid having experienced the superseded costliness of first-time qualification rate stands the risk that qualification rate is eliminated again.
Claims (1)
1, a kind of integrated circuit baseplate column-like projection block forming method, it comprises:
Step 1
On motherboard, plate out copper wire, form substrate with galvanoplastic;
It is characterized in that:
Step 2
Cover one deck and engage veil on motherboard, it highly is the height of required column-like projection block;
Step 3
Offer opening in engaging veil corresponding to the copper wire position;
Step 4
On the copper wire of veil opening part, electroplate fine copper with electroplating technology, with in opening part moulding column fine copper;
Step 5
Tin-lead alloy plating fuses metal at column fine copper top, fuses metal level with the moulding leypewter, and makes it and to engage veil contour;
Step 6
Remove the joint veil, be convenient to integrated circuit baseplate moulding column-like projection block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001244108A CN1156204C (en) | 2000-09-04 | 2000-09-04 | Integrated circuit baseplate column-like projection block forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001244108A CN1156204C (en) | 2000-09-04 | 2000-09-04 | Integrated circuit baseplate column-like projection block forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1342038A CN1342038A (en) | 2002-03-27 |
| CN1156204C true CN1156204C (en) | 2004-06-30 |
Family
ID=4590401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001244108A Expired - Fee Related CN1156204C (en) | 2000-09-04 | 2000-09-04 | Integrated circuit baseplate column-like projection block forming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1156204C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463305C (en) * | 2006-03-06 | 2009-02-18 | 番禺得意精密电子工业有限公司 | Electric connector and production thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101888747B (en) * | 2006-01-27 | 2012-09-05 | 揖斐电株式会社 | Method for manufacturing printed-circuit board |
-
2000
- 2000-09-04 CN CNB001244108A patent/CN1156204C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463305C (en) * | 2006-03-06 | 2009-02-18 | 番禺得意精密电子工业有限公司 | Electric connector and production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1342038A (en) | 2002-03-27 |
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| CF01 | Termination of patent right due to non-payment of annual fee |