CN1342038A - Integrated circuit baseplate column-like projection block forming method - Google Patents
Integrated circuit baseplate column-like projection block forming method Download PDFInfo
- Publication number
- CN1342038A CN1342038A CN 00124410 CN00124410A CN1342038A CN 1342038 A CN1342038 A CN 1342038A CN 00124410 CN00124410 CN 00124410 CN 00124410 A CN00124410 A CN 00124410A CN 1342038 A CN1342038 A CN 1342038A
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- China
- Prior art keywords
- column
- integrated circuit
- veil
- projection block
- copper
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Abstract
The invention discloses a method for forming a bulge in columnar shape on base plate of integrated circuit. The invented method provides merits of controlling the space between wafr and base plate accurately, easy for filling glue, high qualification rate of products and lower cost to make base plate of integrated circuit. The said buldge is made as follows. Copper circuitry is coated and then jointing shield film with suitable height is coated. The aperture is made in the jointing shield film where is corresponding to location of copper circuitry. Copper is coated once more of said position, then the fusional metal of tinsel is coated on top layer. The jointing shield film is removed, thus the bulge is made.
Description
The invention belongs to the manufacture method of integrated circuit baseplate, particularly a kind of integrated circuit baseplate column-like projection block forming method.
As shown in Figure 1 and Figure 2, to cover the practice that wafer (die) 2 ' is incorporated into substrate (subs trate) 1 ' of crystalline substance (FlipChip) technology main flow, the be everlasting I/O place of wafer (die) 2 ' molds following layer (Under Bump Metallurgy, UMB) 21 ' back reshaping goes out wafer leypewter projection 22 ', again it is overturned the back and engage with the substrate 1 ' of the circuit 12 ' that performs in motherboard 11 ', and at this substrate 1 ' and wafer 2 ' joint appropriate location coating filler 3 '.
This commonly use the crystal covered package technology can not accurately control its certain height.Reason is that the substrate of the crystal covered package technology commonly used or the leypewter on the wafer fuse metal in case after the high back of plating meets 100 ℃～350 ℃ high temperature, the alloy melting liquefy, wafer presses down because of gravity factor, make it highly be difficult for accurately control, make the engaging space of wafer leypewter projection and substrate become minimum, cause filler to be difficult for, the qualification rate of product can't be improved.
The purpose of this invention is to provide spacing between a kind of accurate control wafer and substrate, filler is easy, product percent of pass is high, cost is low integrated circuit baseplate column-like projection block forming method.
The present invention includes:
Earlier on motherboard, plate out copper wire with galvanoplastic;
Step 2
Cover one deck and engage veil on motherboard, it is the height of required column-like projection block highly just;
Offer opening in engaging veil corresponding to the copper wire position;
Step 4
On the copper wire of veil opening part, electroplate fine copper with electroplating technology, with in opening part moulding column fine copper;
Step 5
Tin-lead alloy plating fuses metal at column fine copper top, fuses metal level with the moulding leypewter, and makes it and to engage veil contour;
Step 6
Remove the joint veil, be convenient to integrated circuit baseplate moulding column-like projection block.
Since the present invention includes use galvanoplastic plate out copper wire, coating suitably height the joint veil, engage veil corresponding to copper wire position opening and the copper plating of its bottom is high, fuse metal and remove the joint veil with leypewter in its superiors' plating again, in integrated circuit baseplate moulding column-like projection block.Integrated circuit baseplate does to cover brilliant the combination by column-like projection block on it with wafer.Because utilizing, column-like projection block system electroplates fine copper growth height, so can obtain splendid gauge control precision with moulding column fine copper; By suitably controlling its height, can make things convenient for carrying out smoothly of filler operation to keep spacing between substrate and wafer; Fuse metal level because of on column-like projection block, plating leypewter in advance again, cover brilliant in conjunction with the time, wafer only need be made knitting layer, and no longer needs to make the leypewter projection, and the wafer that can avoid having experienced the superseded costliness of first-time qualification rate stands the risk that qualification rate is eliminated again.Not only accurately spacing between control wafer and substrate, filler are easy, and product percent of pass height, cost are low, thereby reach purpose of the present invention.
Fig. 1, be known integrated circuit baseplate structural representation cutaway view.
Fig. 2, for the known chip architecture schematic sectional view that is used for integrated circuit.
Fig. 3,, known integrated circuit baseplate and wafer combine schematic diagram for covering crystalline substance.
Fig. 4, for molding substrate column-like projection block step 1 structural representation cutaway view of the present invention.
Fig. 5, for molding substrate column-like projection block step 2 structural representation cutaway view of the present invention.
Fig. 6, for molding substrate column-like projection block step 3 structural representation cutaway view of the present invention.
Fig. 7, for molding substrate column-like projection block step 4 structural representation cutaway view of the present invention.
Fig. 8, for molding substrate column-like projection block step 5 structural representation cutaway view of the present invention.
Fig. 9, for molding substrate column-like projection block step 6 structural representation cutaway view of the present invention.
Figure 10, combine schematic diagram for covering crystalline substance with the substrate of moulding column-like projection block of the present invention and wafer.
Below in conjunction with accompanying drawing the present invention is further elaborated.
When the present invention system uses galvanoplastic making integrated circuit baseplate, utilize the suitably joint veil of height of coating, at the appropriate position opening of joint veil, and the copper plating of its bottom is high, fuse metal in its superiors' plating with leypewter again.
The present invention includes following steps:
As shown in Figure 4, on the motherboard 11 of substrate 1, plate out copper wire 12 with galvanoplastic earlier;
Step 2
As shown in Figure 5, cover one deck and engage veil 13 on motherboard 11, it is the height of required column-like projection block 17 highly just;
As shown in Figure 6, offer opening 14 in engaging veil 13 corresponding to copper wire 12 positions;
Step 4
As shown in Figure 7, on the copper wire 12 at veil 13 openings 14 places, electroplate fine copper, with in opening 14 places moulding column fine copper 15 with electroplating technology;
Step 5
As shown in Figure 8, fuse metal, fuse metal level 16, and make it and to engage veil 13 contour with the moulding leypewter at column fine copper 15 top tin-lead alloy platings;
Step 6
As shown in Figure 9, remove and engage veil 13, be convenient to moulding column-like projection block 17 on the motherboard 11 of integrated circuit baseplate 1.
As shown in figure 10, when integrated circuit baseplate 1 covers brilliant the combination with wafer 2, do to cover brilliant the combination with wafer 2 by column-like projection block 17 on the substrate 1.Because column-like projection block 17 is to utilize to electroplate fine copper growth height with moulding column fine copper 15, so can obtain splendid gauge control precision; To keep substrate 1 and 2 spacings of wafer, can make things convenient for carrying out smoothly of filler operation by the height of suitably controlling column fine copper 15; Fuse metal level 16 because of on column-like projection block 17, plating leypewter in advance again, cover brilliant in conjunction with the time, wafer 2 only need be made knitting layer 21, and no longer needs to make the leypewter projection, and the wafer 2 that can avoid having experienced the superseded costliness of first-time qualification rate stands the risk that qualification rate is eliminated again.
Claims (1)
1, a kind of integrated circuit baseplate column-like projection block forming method, it comprises:
Step 1
Earlier substrate is plated out copper wire with galvanoplastic on motherboard;
It is characterized in that:
Step 2
Cover one deck and engage veil on motherboard, it is the height of required column-like projection block highly just;
Step 3
Offer opening in engaging veil corresponding to the copper wire position;
Step 4
On the copper wire of veil opening part, electroplate fine copper with electroplating technology, with in opening part moulding column fine copper;
Step 5
Tin-lead alloy plating fuses metal at column fine copper top, fuses metal level with the moulding leypewter, and makes it and to engage veil contour;
Step 6
Remove the joint veil, be convenient to integrated circuit baseplate moulding column-like projection block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001244108A CN1156204C (en) | 2000-09-04 | 2000-09-04 | Integrated circuit baseplate column-like projection block forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001244108A CN1156204C (en) | 2000-09-04 | 2000-09-04 | Integrated circuit baseplate column-like projection block forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1342038A true CN1342038A (en) | 2002-03-27 |
| CN1156204C CN1156204C (en) | 2004-06-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001244108A Expired - Fee Related CN1156204C (en) | 2000-09-04 | 2000-09-04 | Integrated circuit baseplate column-like projection block forming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1156204C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101356642B (en) * | 2006-01-27 | 2010-09-01 | 揖斐电株式会社 | Printed-circuit board, and method for manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463305C (en) * | 2006-03-06 | 2009-02-18 | 番禺得意精密电子工业有限公司 | Electric connector and production thereof |
-
2000
- 2000-09-04 CN CNB001244108A patent/CN1156204C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101356642B (en) * | 2006-01-27 | 2010-09-01 | 揖斐电株式会社 | Printed-circuit board, and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1156204C (en) | 2004-06-30 |
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