CN115617138A

CN115617138A - Heat sink for wafer processing system

Info

Publication number: CN115617138A
Application number: CN202211240893.8A
Authority: CN
Inventors: 何伟; 祝夭龙
Original assignee: Beijing Lynxi Technology Co Ltd
Current assignee: Beijing Lynxi Technology Co Ltd
Priority date: 2022-10-11
Filing date: 2022-10-11
Publication date: 2023-01-17

Abstract

The disclosure provides a heat dissipation device for a wafer processing system, and belongs to the technical field of computers. The heat dissipating double-fuselage includes: a cooling space provided with a cooling liquid in which the wafer processing system is immersed; and the condensation space is communicated with the cooling space through an exhaust valve, and the vaporized cooling liquid in the cooling space enters the condensation space for condensation treatment. According to the embodiment of the disclosure, the wafer processing system can be efficiently cooled, the working condition stability of the wafer processing system is guaranteed, and the wafer processing system can stably and reliably run.

Description

Heat sink for wafer processing system

Technical Field

The present disclosure relates to the field of computer technologies, and in particular, to a heat dissipation device for a wafer processing system.

Background

When a processing system such as a computer executes a task, power consumption may be high, a device heating phenomenon may be easily generated, and in a serious case, the operation performance of the processing system may be reduced. In the related art, an air cooling technology is generally adopted, and heat conduction, convection, radiation heat exchange and other treatments are performed by utilizing gaps among equipment components and a shell, so that heat of heating components can be dissipated to the surrounding environment, and the purpose of cooling the components is achieved. However, in the case of a high heat flow density, the heat dissipation effect may be poor due to the local heat island effect, and the power consumption and noise are relatively large.

Disclosure of Invention

The present disclosure provides a heat dissipation device for a wafer processing system.

The present disclosure provides a heat dissipation device for a wafer processing system, the heat dissipation device comprising: a cooling space provided with a cooling liquid, wherein the wafer processing system is immersed in the cooling liquid; and the condensation space is communicated with the cooling space through an exhaust valve, and the vaporized cooling liquid in the cooling space enters the condensation space for condensation treatment.

According to the embodiment provided by the disclosure, in the heat dissipation device for performing heat dissipation treatment on the wafer processing system, the cooling space and the condensation space are arranged, the condensation space is communicated with the cooling space through the exhaust valve, the cooling liquid is arranged in the cooling space, the wafer processing system is immersed in the cooling liquid, when the cooling liquid in the cooling space exchanges heat with the wafer processing system, the heat of the wafer processing system is taken away to form the cooling liquid in a gas state, the vaporized cooling liquid enters the condensation space based on the exhaust valve, is subjected to condensation treatment, and becomes the cooling liquid in a liquid state again, and cooling heat dissipation treatment on the wafer processing system can be realized based on the heat dissipation device, so that the wafer processing system is ensured to execute tasks in a proper working condition state, and the wafer processing system can stably and reliably run.

It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present disclosure, nor do they limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The accompanying drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the principles of the disclosure and not to limit the disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:

fig. 1 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 5 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 7 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 8 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure;

fig. 10 is a schematic diagram of a data center provided by an embodiment of the present disclosure;

fig. 11 is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the disclosure;

FIG. 12 is a flow chart of a processing method provided by an embodiment of the present disclosure;

fig. 13 is a block diagram of an electronic device provided by an embodiment of the present disclosure;

fig. 14 is a block diagram of an electronic device provided in an embodiment of the present disclosure.

Detailed Description

To facilitate a better understanding of the technical aspects of the present disclosure, exemplary embodiments of the present disclosure are described below in conjunction with the accompanying drawings, wherein various details of the embodiments of the present disclosure are included to facilitate an understanding, and they should be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

Embodiments of the present disclosure and features of embodiments may be combined with each other without conflict.

As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "made from" \8230; \8230 ";" made from ";" specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

When a processing chip (e.g., a computer server chip) executes a task, power consumption is usually increased, so that a large amount of heat is generated, and if the heat dissipation and cooling process is not performed in time, the working condition of the chip may be unstable or abnormal, and the task cannot be executed any more. For chips with higher integration, the generated heat is relatively more, and the liquid phase required for heat dissipation and cooling is correspondingly higher.

In the related art, in electronic equipment, an air cooling technology is mainly adopted to cool a processing chip, namely, air is used for directly cooling heating components of the electronic equipment, and gaps between the equipment components and a shell are used for heat conduction, convection and radiation heat exchange, so that the purpose of cooling the heating components by radiating heat to the surrounding environment is achieved. The air cooling technology is generally suitable for scenes with low heat flux density of the server, the problems of local heat island effect and noise are serious, and the air cooling energy consumption is high. Data centers typically have hundreds or thousands of computer servers, with over half the energy used to supply air-cooled cooling equipment, and the energy consumption is high. Therefore, how to reduce the energy consumption of the cooling device becomes a problem to be solved.

In the embodiments of the present disclosure, the processing device is prepared based on an undivided wafer, so that hundreds of processor chips can be included on one wafer, thereby obtaining the wafer processing device, and a wafer-based processing system (i.e., a wafer server) can be constructed by integrating other functional chips. The wafer processing system can provide the computing power of hundreds of traditional servers, and the overall energy consumption can be obviously reduced. However, the heat flux density of a wafer processing system is high compared to that of a single chip, and if a reasonably effective heat dissipation control technology is not adopted, the performance and the service life of the wafer processing system are seriously influenced.

In view of the above, the present disclosure provides a heat dissipation apparatus for a wafer processing system, including a cooling space and a condensation space, wherein a cooling liquid is disposed in the cooling space, the wafer processing system is immersed in the cooling liquid, and heat exchange can be performed between the wafer processing system and the cooling liquid, so as to carry heat of the wafer processing system, the condensation space is communicated with the cooling space through an exhaust valve, and after the cooling liquid in the cooling space is heated and vaporized, the vaporized cooling liquid enters the condensation space through the exhaust valve for condensation processing, and with the heat dissipation apparatus, the wafer processing system can be guaranteed to perform tasks in an appropriate working condition state, so that the wafer processing system can operate stably and reliably, and the lifetime of the wafer processing system can be prolonged.

The wafer processing system of the embodiment of the disclosure may be configured as an electronic device such as a terminal device or a server, where the terminal device may be a User Equipment (UE), a mobile device, a User terminal, a cellular phone, a cordless phone, a Personal Digital Assistant (PDA), a handheld device, a computing device, a vehicle-mounted device, a wearable device, or the like, and the processing method of the wafer processing system may be implemented by a processor calling a computer-readable program instruction stored in a memory. Alternatively, the processing method may be performed by a server.

A first aspect of the embodiments of the present disclosure provides a heat dissipation device for a wafer processing system.

Fig. 1 is a schematic view illustrating a heat dissipation device for a wafer processing system according to an embodiment of the disclosure. Referring to fig. 1, the heat sink 100 includes: a cooling space 110 provided with a cooling liquid 130, the wafer processing system 140 being immersed in the cooling liquid 130; the condensing space 120 is communicated with the cooling space 110 through an exhaust valve 150, and the vaporized cooling liquid in the cooling space 110 enters the condensing space 120 for condensation.

In some alternative implementations, one or more wafer processing devices are included in the wafer processing system, and the wafer processing devices are processing devices prepared based on unsingulated wafers. Illustratively, a plurality of chips are prepared on a wafer, and the wafer processing apparatus is obtained directly based on an undivided wafer without dicing the wafer.

Illustratively, the plurality of chips prepared on the wafer include computing chips, memory chips, communication chips, etc., and there may be one-to-one, one-to-many, many-to-many, etc. connections among the plurality of chips, so that the wafer has the capability of handling various tasks. It should be noted that the number, types, connection relationships, and the like of the chips in the wafer processing apparatus are all described above by way of example, and the embodiments of the disclosure do not limit this.

In some alternative implementations, the wafer processing system is placed in a frame, which may serve to protect the wafer processing system, and which may be used to form the respective cooling space and condensation space. The frame body has a corresponding cavity structure, and the cavity may be a regular structure such as a cube, a cylinder, or an irregular structure, which is not limited in the embodiments of the present disclosure.

In some alternative implementations, one or more wafer processing systems may be disposed in one frame. When a plurality of wafer processing systems are arranged in one frame body, the wafer processing systems can be arranged at intervals so as to increase the heat exchange area between the wafer processing systems and the cooling liquid and improve the cooling efficiency.

In some alternative implementations, the wafer processing system includes at least one wafer processing device and at least one wafer stage for carrying the wafer processing device. Further, the wafer processing apparatus needs to be fixed to the wafer stage in consideration of the fact that the wafer is brittle and has insufficient toughness, and the wafer processing apparatus may be damaged or the connecting lines between the chips may be broken during operations such as transportation. Any one or more of a plurality of fixing manners may be adopted between the wafer processing apparatus and the wafer platform, which is not limited in the embodiments of the present disclosure.

For example, the wafer processing apparatus may be fixed on the wafer stage by an adhesive, a suction unit, and/or a fixing clip.

For example, the wafer processing device is fixed on the wafer platform by an adhesive, and/or the wafer processing device is adsorbed on the wafer platform by the adsorption unit, so that the wafer processing device is fixed, and/or the wafer processing device is fixed on the wafer platform by a fixing elastic sheet, and/or a groove is arranged on the wafer platform, so that the wafer processing device is fixed in the groove, and the wafer processing device is prevented from being displaced. Wherein the adsorption unit includes a functional unit provided based on air pressure, magnetic force, or the like as an adsorption force.

Fig. 2 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the disclosure. Referring to fig. 2, the scattering device includes: the frame 200, the cooling space 210 and the condensing space 220, wherein the cooling space 210 is provided with a cooling liquid 230, and the wafer processing system 240 is fixed on the wafer stage 241 and is immersed in the cooling liquid 230. Moreover, a partition plate 260 is provided inside the housing 200 such that a region between the upper half of the housing 200 and the partition plate 260 constitutes the condensation space 220, a region between the lower half of the housing 200 and the partition plate 260 constitutes the cooling space 210, and at least one exhaust valve 250 is provided on the partition plate 260 such that the vaporized coolant in the cooling space 210 can enter the condensation space 220 to be condensed.

In some optional implementations, the wafer processing system further includes at least one external circuit board, the wafer processing apparatus is connected to the at least one external circuit board, and the external circuit board is fixed in the frame, and the external circuit board can provide at least one of power, a communication function, a storage function, and a clock function for the wafer processing apparatus, so as to enrich the functions of the wafer processing system or expand the processing/storage capability of the wafer processing system. The external circuit board is fixed at any position of the frame, or fixed on the wafer stage (for example, fixed outside the wafer processing apparatus on the wafer stage), which is not limited in the embodiments of the present disclosure.

It should be noted that, when a wafer processing apparatus is disposed in the housing, the wafer processing apparatus and the housing constitute a wafer processing system (i.e., a wafer server), which can be used to perform each task to be processed more independently. When a plurality of wafer processing apparatuses are provided in the housing, the plurality of wafer processing apparatuses may be connected to each other to form a large-scale processing system for executing a large-scale job to be processed, or the plurality of wafer processing apparatuses may be regarded as a plurality of processing systems independent of each other, and each processing system may individually execute a job to be processed assigned.

In some alternative implementations, the wafer processing system may be disposed at the bottom of the frame, and/or the wafer processing system may be disposed at a predetermined height from the bottom of the frame.

In summary, in the embodiment of the present disclosure, in order to cool down the wafer processing system and avoid the wafer processing system from malfunctioning due to an excessively high temperature, a liquid cooling method is adopted to cool down the wafer processing system. The liquid cooling Technology is a cooling method that uses a liquid with a high specific heat capacity (i.e., a cooling liquid) as a heat transfer medium to satisfy heat dissipation requirements of Information Technology (IT) equipment such as a server.

It should be noted that, in the air cooling technology, the heat dissipation effect is greatly affected by environmental factors such as a natural cold source and weather, so the site selection of the data center based on the air cooling technology is limited, and when the power consumption of the key chip and related components is continuously increased, the number, working strength and working time of related devices such as a compressor and a fan need to be increased to improve the cooling effect, thereby causing high power consumption. In contrast, in the liquid cooling technology, for the same volume of heat transfer medium, the speed of heat transfer of the cooling liquid is six times that of air, so the liquid cooling mode can obtain a better cooling effect under the same power consumption, and the optimization of the cooling efficiency and the power consumption is realized. In addition, the liquid cooling system is hardly influenced by environmental factors and can be arranged at any position where cooling treatment is needed, so that site selection of the data center is more flexible, and because the liquid cooling technology does not need to use equipment such as a compressor and a fan, noise generated by cooling can be effectively reduced, and cooling experience of a user is improved.

In some alternative implementations, a cooling liquid may be disposed in the frame, and the wafer processing system may be cooled by immersing or partially immersing the wafer processing system in the cooling liquid. The immersed liquid cooling technology is a cooling mode with high efficiency in liquid cooling, heat is transferred to cooling liquid from heating components of the wafer processing system by immersing the wafer processing system in the cooling liquid, and then the heat can be further transferred to the external environment by utilizing an external fluid circulation and/or evaporative cooling heat dissipation mode, so that the effect of high-efficiency cooling is achieved.

It should be noted that immersion cooling has a relatively larger contact area between the wafer processing system and the cooling fluid than partial immersion cooling, and thus the heat dissipation efficiency and cooling efficiency are relatively high. However, the cooling liquid required for immersion cooling is usually more than that for partial immersion cooling, in other words, the partial immersion cooling can save the usage amount of the cooling liquid. In practical applications, a suitable cooling manner may be selected according to any one or more of experience, statistical data, actual cooling requirements, and the like, which is not limited by the embodiments of the present disclosure.

In some optional implementations, the cooling liquid is a liquid with thermal conductivity, vaporization performance meeting preset performance conditions, and insulation performance.

Illustratively, an electronic fluorinated liquid is used as the cooling liquid, which is superior in heat transfer to water, while having insulating properties. The electronic fluorine cooling liquid is a colorless transparent liquid with low viscosity, nonflammability, non-conductivity and high safety performance, which is incompatible with water, and the wafer processing device (and an external circuit board connected with the wafer processing device) can be immersed/soaked in the electronic fluorine liquid in view of the characteristics.

For example, a phase-change electron fluoride liquid having a boiling point of 40 ℃ to 61 ℃ may be used as the cooling liquid. The electronic fluorinated liquid exchanges heat with the wafer processing device, absorbs the heat of the wafer processing device, and is vaporized when the temperature of the electronic fluorinated liquid is higher than the boiling point, so that the vaporized electronic fluorinated liquid is formed.

It should be noted that, the above reference to the cooling liquid is only an example, and other liquids meeting relevant performance conditions may be used as the cooling liquid, and the cooling liquid is not limited in the embodiments of the present disclosure.

In some alternative implementations, there are a number of situations in which a cooling fluid is provided in a cooling space: when the cooling liquid is less and the wafer processing system has a certain height from the bottom of the cooling space, the cooling liquid may not contact the wafer processing system (i.e. the cooling liquid does not soak the wafer processing system), in this case, the cooling treatment of the wafer processing system is mainly realized by two-stage heat exchange between the wafer processing system and air, the air and the cooling liquid; when the cooling liquid is more but not enough to immerse the whole wafer processing system, the part of the wafer processing system, which is in contact with the cooling liquid, is cooled through the cooling liquid, and the part, which is not in contact with the cooling liquid, takes away heat through heat exchange with air, so that cooling processing is realized; when the cooling liquid is enough and can immerse the whole wafer processing system, the outer surface of the wafer processing system is in direct contact with the cooling liquid, so that heat can be taken away through heat exchange with the cooling liquid, and efficient cooling processing is realized.

It should be understood that when the wafer processing system is disposed at the bottom of the cooling space, less cooling liquid is required to immerse the wafer processing system, but the bottom of the wafer processing system cannot directly contact the cooling liquid, which may affect the cooling efficiency; when the wafer processing system is arranged at a position away from the preset height of the bottom of the cooling space, more cooling liquid is needed to immerse the wafer processing system, but the cooling liquid can be in contact with the upper surface and the lower surface of the wafer processing system, so that the heat exchange area is large, and the cooling efficiency is correspondingly high.

A heat dissipation device for a wafer processing system according to an embodiment of the present disclosure is described with reference to fig. 3-6.

Fig. 3 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the disclosure. Referring to fig. 3, the heat sink 300 includes: the cooling space 310, the condensing space 320, and the wafer processing systems 341 to 34n disposed in the cooling space 310, and the cooling space 310 is disposed with a cooling liquid 330, the cooling liquid 330 submerges the wafer processing systems 341 to 34n, wherein n is an integer greater than 1.

As shown in fig. 3, in the cooling space 320, the wafer processing systems 341 to 34n are sequentially distributed from top to bottom along the longitudinal direction, and the wafer processing systems are spaced apart from each other by a corresponding distance and are immersed in the cooling liquid 330, so that the outer surfaces of the wafer processing systems can exchange heat with the cooling liquid, thereby improving the cooling efficiency.

Fig. 4 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the disclosure. Referring to fig. 4, the heat sink 400 includes: the cooling space 410, the condensation space 420, and the wafer processing systems 441-44m disposed in the cooling space 410, and the cooling space 410 is provided with a cooling liquid 430, the cooling liquid 430 submerges the wafer processing systems 441-44m, wherein m is an integer greater than 1.

As shown in fig. 4, in the cooling space 410, the wafer processing systems 441-44m are distributed in sequence from left to right along the transverse direction, and the wafer processing systems are separated by a corresponding distance, so that the wafer processing systems can be separated by the cooling liquid, and the cooling liquid 430 immerses the plurality of wafer processing systems to realize the cooling process for the wafer processing systems.

In some optional implementations, a plurality of wafer processing systems may be disposed in both the horizontal direction and the vertical direction, so that more wafer processing systems are accommodated in a single cooling space, thereby achieving uniform cooling processing of more wafer processing systems with less cooling liquid and improving the utilization rate of the cooling liquid.

Fig. 5 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the disclosure. Referring to fig. 5, the heat sink 500 includes: the cooling space 510, the condensing space 520, and the wafer processing systems 5411-54ji disposed in the cooling space 510, and a cooling liquid 530 disposed in the cooling space 510, the cooling liquid 530 submerging the wafer processing systems 5411-54ji, wherein i and j are each an integer greater than 1.

As shown in fig. 5, i × j wafer processing systems are arranged in an array in the cooling space 510, i wafer processing systems are arranged in each row in the horizontal direction, and j wafer processing systems are arranged in each column in the vertical direction, and the i × j wafer processing systems are immersed in the cooling liquid 530 for performing cooling processing uniformly.

In the heat dissipation device shown in fig. 3-5, the wafer processing system is immersed in the cooling liquid, which may improve cooling efficiency, but requires a larger amount of cooling liquid. Thus, in some alternative implementations, portions of the wafer processing system may be immersed in the cooling fluid while the remaining portions are exposed to air, thereby reducing the amount of cooling fluid used.

Fig. 6 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure. Referring to fig. 6, the heat sink 600 includes: a cooling space 610, a condensing space 620, and a wafer processing system 641-64q disposed in the cooling space 610, wherein q is an integer greater than 1.

As shown in fig. 6, wafer processing systems 621-62q are vertically fixed in cooling space 610 with a distance maintained between the wafer processing systems. The cooling space 610 is provided with a cooling liquid 630 therein, and the liquid level of the cooling liquid 630 is lower than the height of the wafer processing system 641-64q itself, so that only a portion of the wafer processing system 641-64q is immersed in the cooling liquid.

Fig. 7 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure. Referring to fig. 7, the heat sink 700 includes: the cooling space 710, the condensation space 720, and wafer processing systems 741-74k disposed in the cooling space 710, where k is an integer greater than 1.

As shown in fig. 7, the cooling space 710 is provided with a cooling liquid 730, and the liquid level of the cooling liquid 730 is lower than that of the wafer processing system 741, so that a part of the wafer processing system is exposed to air, and the rest of the wafer processing system (e.g., the wafer processing system 74 k) is immersed in the cooling liquid 730.

As can be seen from the heat dissipation apparatus shown in fig. 6 and 7, in the case that the cooling liquid is limited, a part of the wafer processing system may be immersed in the cooling liquid, and the rest of the wafer processing system may be exposed to the air, or a part of the entire wafer processing system may be immersed in the cooling liquid, and the rest of the wafer processing system may be exposed to the air.

For the cooling mode which can only soak partial area of the wafer processing system, which areas of the wafer processing system are soaked and which areas are exposed in the air can be reasonably selected, so that the cooling effect is improved to the maximum extent.

The heat dissipation device for a wafer processing system shown in fig. 6 is taken as an example for illustration. In the heat dissipation device shown in fig. 6, the chip region with relatively high heat generation degree in each wafer processing system may be immersed in the cooling liquid, so as to implement efficient cooling processing by directly performing heat exchange with the cooling liquid, and expose the chip region with relatively low heat generation degree in the air, and the cooling requirement may be met by heat exchange with the air.

The heat dissipation device for a wafer processing system shown in fig. 7 is taken as an example for explanation. In the heat dissipation device shown in fig. 7, the wafer processing system with relatively high heat generation degree can be immersed in the cooling liquid to implement efficient cooling treatment by directly performing heat exchange with the cooling liquid, and the wafer processing system with relatively low heat generation degree is exposed in the air, and the cooling requirement can be met by heat exchange with the air.

In some alternative implementations, the heating degree of each region in the wafer processing system can be determined according to the calculated force, considering that a certain positive correlation exists between the calculated force of the chip and the heat generated by the chip. For example, the chip area/wafer processing system with relatively strong calculation power may be immersed in the cooling liquid, and the chip area/wafer processing system with relatively weak calculation power may be directly exposed to the air, so that under the condition that the cooling liquid is limited and the entire wafer processing system or the entire wafer processing system cannot be immersed, the temperature of the chip/wafer processing system with severe heating degree is preferentially reduced, so that the chip/wafer processing system with strong calculation power may not generate excessive heating to cause unstable working conditions, and the stable operation of the wafer processing system is ensured.

It should be noted that the number and distribution of the wafer processing systems in the above heat dissipation devices are only examples, and the embodiments of the disclosure do not limit the number and distribution.

It should be noted that, in the schematic view of the heat dissipation device, the wafer processing device in the wafer processing system may be fixed based on a wafer stage (not shown), or may be fixed in other manners, which is not limited in the embodiment of the disclosure.

In some alternative implementations, the wafer processing system may be cooled by phase-change heat dissipation, that is, the heat dissipation is achieved by different states of the cooling liquid at different temperatures. The wafer processing system is exemplarily arranged in the frame body, and the frame body can be divided into two spaces, wherein one space is used for bearing the cooling liquid so as to carry out cooling treatment, and the other space is used for carrying out condensation treatment of the cooling liquid so as to recycle the condensed cooling liquid and reduce the consumption of the cooling liquid.

In some optional implementations, a partition is disposed between the wafer processing system and the top of the frame, a condensation space is formed between the partition and the top of the frame, and a cooling space is formed between the partition and the bottom of the frame; the partition plate is provided with at least one exhaust valve, and the exhaust valve is used for enabling the vaporized cooling liquid in the cooling space to enter the condensation space for condensation treatment to obtain condensed cooling liquid; the vaporized cooling liquid is a cooling liquid in a gas state, which is formed after the cooling liquid absorbs the heat of the wafer processing device and reaches the vaporization temperature.

In other words, the upper half space of the housing is defined as a condensation space and the lower half space is defined as a cooling space, with the partition plate as a boundary. When the cooling liquid in the cooling space absorbs the heat of the wafer processing system and reaches the boiling point, the cooling liquid is vaporized to form vaporized cooling liquid, and the air pressure of the cooling space is increased, so that the vaporized cooling liquid enters the condensation space through the exhaust valve on the partition plate. In the condensation space, the vaporized coolant is cooled by heat exchange with air or the like, and condensed into a liquefied state to obtain a condensed coolant.

In some optional implementation modes, a liquid storage tank can be arranged outside the heat dissipation device, cooling liquid is stored in the liquid storage tank, the frame body is connected with a preset transmission pipeline, the transmission pipeline and the liquid storage tank are connected, and therefore supply and recovery of the cooling liquid are achieved, on one hand, smooth supply of the cooling liquid is guaranteed, sufficient cooling liquid in a cooling space is guaranteed to cool a wafer processing system, on the other hand, the cooling liquid is reasonably recovered and reused, utilization efficiency of the cooling liquid is improved, and consumption of the cooling liquid is reduced.

In some optional implementations, the cooling space may be connected to a first transmission pipe (for example, a frame constituting the cooling space may be connected to the first transmission pipe), and the first transmission pipe is connected to the liquid storage tank, and is used for inputting and outputting the cooling liquid to and from the cooling space; wherein, the liquid storage pot is used for storing the coolant.

In some optional implementations, the condensation space may be connected to a second transport pipe (e.g., a frame constituting the condensation space may be connected to the second transport pipe), and the second transport pipe is connected to the liquid storage tank for collecting the condensed cooling liquid into the liquid storage tank.

In some optional implementations, the first transmission pipeline is provided with at least one first valve, and the first valve is used for controlling the communication state of the cooling liquid in the cooling space and the liquid storage tank; and/or the second transmission pipeline is provided with at least one second valve, and the second valve is used for controlling the circulation state of the condensed cooling liquid in the condensing space and the liquid storage tank.

Fig. 8 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure. Referring to fig. 8, the heat dissipating device includes: frame 810, wafer processing system 820, coolant 830, wafer stage 840, baffle 850, exhaust valve 851, reservoir 860, first transfer line 861, second transfer line 862, and fill line 863.

As shown in fig. 8, the wafer processing system 820 is mounted on a wafer stage 840, and the wafer stage 840 is disposed in the middle of the cavity of the frame 810 so as to have a predetermined distance from the bottom of the frame 810. A partition 850 is provided between the wafer processing system 820 and the top of the housing 810, the housing 810 is divided by the partition 850 into a condensation space formed from the top of the housing 810 to the partition 850 and a cooling space formed from the partition 850 to the bottom of the housing 810, and the partition 850 is provided with a plurality of exhaust valves 851. The bottom position that corresponds the framework in the cooling space is connected with first transmission pipeline 861, and first transmission pipeline 861 is connected with liquid storage pot 860 for supply to the coolant liquid of cooling space, the bottom position that corresponds the framework in the condensation space is connected with second transmission pipeline 862, and second transmission pipeline 862 is connected with liquid storage pot 860, is arranged in retrieving the condensed coolant liquid to liquid storage pot 860. Further, considering that the coolant may be lost to some extent during the cooling process, when the volume of the coolant in the liquid storage tank 860 does not meet the use requirement, new coolant may be added through the liquid adding pipe 863.

In some alternative implementations, when the coolant in the cooling space is heated and vaporized, the air pressure in the space below the partition 850 is increased, and the vaporized coolant enters the condensing space above the partition 850 through the exhaust valve 851, so as to take away the heat in the cooling space. The vaporized coolant exchanges heat with air in the condensation space, and the condensed coolant condensed into a liquid state flows back to the liquid reservoir 860 through the second transfer pipe 862 connected to the side surface of the frame 810.

In order to improve the condensation speed of the vaporized cooling liquid, the cooling efficiency of the condensation space can be improved by improving the box body material and/or additionally arranging a condensation unit.

In some alternative implementations, the box material of the condensation space can be made of a heat conducting material and/or at least one first cooling unit can be provided in the condensation space; the first cooling unit is used for cooling the condensation space.

In other words, the box body of the condensing space can be made of a material with good heat conduction performance, so that the heat exchange rate of the vaporized cooling liquid and the ambient air in the box body is accelerated, and the box body is rapidly changed into the condensed cooling liquid in a liquid state. The cooling mode can finish condensation treatment based on room temperature, and is relatively energy-saving and environment-friendly. Of course, the condensing speed of the vaporized cooling liquid may also be accelerated by additionally providing the first cooling unit in the condensing space, which is not limited by the embodiment of the disclosure.

In addition, the cooling effect can be ensured by monitoring the liquid level height of the cooling liquid in the cooling space to ensure that enough cooling liquid is available in the cooling space to carry out cooling treatment on the wafer processing device in a manner of considering that a certain positive correlation exists between the volume of the cooling liquid and the cooling speed in the cooling space.

In some alternative implementations, the cooling space is provided with at least one liquid level sensor; the liquid level sensor is used for acquiring the liquid level of the cooling liquid and sending a liquid supplementing message under the condition that the liquid level is lower than a preset liquid level threshold, and the liquid supplementing message is used for indicating that the cooling liquid is supplemented to the cooling space.

The preset liquid level threshold value can be set according to experience, statistical data and actual cooling requirements, and can be flexibly adjusted at any time, which is not limited by the embodiment of the disclosure.

At least one liquid level sensor is arranged on the partition board or at a preset position on the side face of the frame body, and the liquid level sensor is connected with a preset management terminal and/or a management server. And when the liquid level of the cooling liquid is lower than a preset liquid level threshold value, the liquid level sensor sends a liquid supplementing message to the management terminal and/or the management server, wherein the liquid supplementing message comprises the current liquid level. After receiving the liquid supplementing message, the management terminal and/or the management server calculates the volume of the cooling liquid to be supplemented according to the current liquid level, opens a valve (for example, a first valve) between the liquid storage tank and the cooling space, and adds the cooling liquid with the corresponding volume into the cooling space.

In some optional implementation manners, in order to facilitate carrying or maintaining the wafer processing system, the cooling liquid is prevented from leaking or damaging the chip during the carrying or maintaining process, and therefore, a control module may be disposed in the heat dissipation device to control the opening and closing of the first valve and the second valve, so as to reduce the risk of leakage of the cooling liquid.

In some optional implementations, the control module is configured to, in response to a system handling or maintenance request, place the first valve and the second valve in an open state to discharge the coolant in the cooling space to the reservoir, discharge the condensed coolant in the condensing space to the reservoir, and perform a handling or maintenance process;

and/or the presence of a gas in the gas,

and the control module is used for responding to the system installation request, setting the first valve and the second valve into an opening state, extracting the cooling liquid in the liquid storage tank into the cooling space so as to carry out cooling treatment on the wafer processing device, and discharging the condensed cooling liquid in the condensation space from the second valve to the liquid storage tank.

Illustratively, before the wafer processing system is transported or repaired, a system transport or repair request is sent to the control module, and the control module responds to the system transport or repair request, and the control module sets the first valve and the second valve to be in an open state, discharges the cooling liquid in the cooling space into the liquid storage tank, pumps the cooling liquid in the condensation space back into the liquid storage tank, closes the first valve and the second valve, detaches the connected first transport pipeline and the second transport pipeline, and executes the transport or repair process.

When the wafer processing apparatus is transported to a predetermined position or maintained, a system installation process is required. Illustratively, the first transmission pipeline and the second transmission pipeline are respectively connected to corresponding positions, and send a system installation request to the control module, and the control module responds to the system installation request, opens the first valve and the second valve, and pumps the cooling liquid in the liquid storage tank into the cooling space, so as to cool the wafer processing device, and facilitate discharging the generated condensed cooling liquid of the subsequent condensation space from the second valve into the liquid storage tank.

In some optional implementation manners, at least one second cooling unit may be disposed in the liquid storage tank, and the cooling liquid in the liquid storage tank is cooled by the second cooling unit, so that the temperature of the cooling liquid entering the cooling space is low, and thus the wafer processing device can be efficiently cooled, and the cooling efficiency is improved.

Further, a cooling duct may be provided in the cooling space and/or the condensing space, and a cooling liquid may be provided in the cooling duct to improve cooling efficiency. The air in the condensing space and the condensed cooling liquid in the cooling pipeline can exchange heat with each other to reduce the temperature of the air in the condensing space and the temperature of the condensed cooling liquid in the cooling pipeline. The condensed fluid in the cooling pipeline may be the cooling fluid in the liquid storage tank, or may be other cooling fluids, which is not limited in the embodiment of the disclosure.

In some optional implementations, the cooling space is provided with at least one first cooling pipeline, and a first liquid inlet and a first liquid outlet of the first cooling pipeline are both connected with the liquid storage tank, so that the cooling liquid in the liquid storage tank enters the first cooling pipeline through the first liquid inlet and flows back to the liquid storage tank from the first liquid outlet through flowing;

and/or the presence of a gas in the gas,

the condensation space is provided with at least one second cooling pipeline, and a second liquid inlet and a second liquid outlet of the second cooling pipeline are both connected with the liquid storage tank, so that cooling liquid in the liquid storage tank enters the second cooling pipeline through the second liquid inlet and flows back to the liquid storage tank from the second liquid outlet through flowing.

Fig. 9 is a schematic view of a heat dissipation device for a wafer processing system according to an embodiment of the present disclosure. Referring to fig. 9, the heat dissipating device includes: frame 910, wafer processing system 920, cooling liquid 930, wafer stage 940, partition 950, exhaust valve 951, reservoir 960, first transfer line 961, second transfer line 962, second cooling unit 963, first cooling line 971, and second cooling line 972.

As shown in fig. 9, the second cooling unit 963 disposed in the liquid storage tank 960 may cool the cooling liquid therein, and a first cooling pipe 971 is disposed in the cooling space, and a first liquid inlet and a first liquid outlet of the first cooling pipe 971 are connected to the liquid storage tank 960, so that the cooling liquid in the liquid storage tank 960 enters the first cooling pipe 971 through the first liquid inlet and flows back to the liquid storage tank 960 from the first liquid outlet by flowing, thereby taking away heat of the cooling liquid in the cooling space.

A second cooling pipe 972 is disposed in the condensation space, and a second liquid inlet and a second liquid outlet of the second cooling pipe 972 are both connected to the liquid storage tank 960, so that the cooling liquid in the liquid storage tank 960 enters the second cooling pipe 972 through the second liquid inlet and flows back to the liquid storage tank 960 from the second liquid outlet through flowing, thereby taking away heat in the condensation space.

It should be noted that the first cooling duct and the second cooling duct in fig. 9 are only used for schematic illustration, and are not used to limit the actual number and the actual positions of the first cooling duct and the second cooling duct.

It is further noted that the reservoir may be in fluid communication with one or more of the cooling spaces or the condensing space conduits to provide cooling fluid to the wafer processing system in the communicating cooling space or to cool vaporized cooling fluid in the communicating condensing space and to recover condensed cooling fluid in the condensing space.

For example, one reservoir may be connected to the frame of a plurality of wafer processing systems for providing cooling fluid to the plurality of wafer processing systems.

Illustratively, the data center has several wafer processing systems, and the frame bodies of the wafer processing systems are connected with the same liquid storage tank. In other words, multiple wafer processing systems in a data center may use cooling fluid in the same reservoir for cooling.

Fig. 10 is a schematic diagram of a data center according to an embodiment of the present disclosure. Referring to fig. 10, the data center includes a wafer processing system 1011, a wafer processing system 1012, \8230 \ 8230:, t wafer processing systems 101, and the wafer processing systems are provided with corresponding heat dissipation devices, and the heat dissipation devices are collectively connected to a liquid storage tank 1030 through respective transfer pipes 1020, so as to perform cooling processing on the corresponding wafer processing systems by using cooling liquid in the liquid storage tank 1030, wherein t is an integer greater than 1.

It should be noted that, in the embodiment of the present disclosure, besides the heat dissipation device disposed based on the cooling liquid, an air cooling device may be disposed, so as to perform heat dissipation and cooling on the wafer processing system based on two cooling manners, i.e., liquid cooling and air cooling, thereby improving the cooling efficiency and the cooling effect.

Illustratively, in addition to injecting the cooling fluid into the enclosure, at least one fan may be provided outside the heat sink (e.g., outside the condensing device) to accelerate condensation.

It should be understood that, in practical application, only the liquid cooling mode is adopted, or the liquid cooling mode and the air cooling mode are adopted at the same time, and the liquid cooling mode and the air cooling mode can be flexibly set according to cooling requirements, energy consumption requirements and the like, and the embodiment of the disclosure does not limit the liquid cooling mode and the air cooling mode.

In the embodiment of the disclosure, in the heat dissipation device for performing heat dissipation processing on the wafer processing system, a cooling space and a condensation space are arranged, the condensation space is communicated with the cooling space through an exhaust valve, and a cooling liquid is arranged in the cooling space, the wafer processing system is immersed in the cooling liquid, when the cooling liquid in the cooling space exchanges heat with the wafer processing system to take away heat of the wafer processing system to form the cooling liquid in a gas state, the vaporized cooling liquid enters the condensation space based on the exhaust valve, and is subjected to condensation processing to become the cooling liquid in a liquid state again, and cooling heat dissipation processing on the wafer processing system can be realized based on the heat dissipation device, so that the wafer processing system is ensured to execute tasks in a proper working condition state, and the wafer processing system can stably and reliably run.

A second aspect of the embodiments of the present disclosure provides a method for manufacturing a heat dissipation device.

Fig. 11 is a flowchart of a method for manufacturing a heat dissipation device, which can be applied to manufacture a heat dissipation device of a wafer processing system according to an embodiment of the disclosure. Referring to fig. 11, the method for manufacturing the heat dissipation device includes:

in step S111, a cooling space and a condensing space are prepared, wherein the wafer processing system to be cooled is disposed in the cooling space, and the cooling space and the condensing space are communicated through an exhaust valve.

In step S112, a cooling liquid is injected into the cooling space, so that the cooling liquid submerges the wafer processing system to be cooled, and the vaporized condensate in the cooling space enters the condensation space through the exhaust valve for condensation.

In some alternative implementations, the wafer processing system is placed in a frame, and the cooling space and the condensing space can be prepared in the frame by arranging a partition in the inner cavity of the frame.

In some optional implementations, a partition plate is disposed between the wafer processing apparatus and the top of the frame, and the partition plate is provided with at least one exhaust valve, wherein a condensation space is formed between the partition plate and the top of the frame, and a cooling space is formed between the partition plate and the bottom of the frame. When the cooling liquid in the cooling space is heated and vaporized, the air pressure of the space at the lower part of the partition plate is increased, and the vaporized cooling liquid enters the condensation space at the upper part of the partition plate through the exhaust valve, so that the heat of the cooling space is taken away. The vaporized coolant exchanges heat with air in the condensing space and is condensed into a condensed coolant in a liquid form.

In some alternative implementations, a cooling fluid is injected into the frame to cool the wafer processing system. The wafer processing system comprises one or more wafer processing devices, wherein the wafer processing devices are processing devices prepared on the basis of unsingulated wafers.

In some alternative implementations, the wafer processing system is disposed at the bottom of the frame, and/or the wafer processing system is disposed at a predetermined height from the bottom of the frame.

The volume of the cooling liquid injected into the cooling space may be set according to the number of the wafer processing systems, the positions of the wafer processing systems in the frame, the heat dissipation requirement, and the like, which is not limited in the embodiments of the present disclosure.

In some alternative implementations, an amount of cooling fluid may be injected into the cooling space based on the highest position of the wafer processing system in the cooling space such that the cooling fluid can submerge the wafer processing system to effect a cooling process on the wafer processing system.

In some alternative implementations, in consideration of saving the cooling liquid, a corresponding volume of cooling liquid may be injected into the cooling space, so that the cooling liquid may soak a part of the area of the wafer processing system to implement the cooling process on the wafer processing system.

It should be noted that, in the embodiment of the present disclosure, besides the cooling liquid is injected into the cooling space to perform liquid cooling on the wafer processing system, an air cooling module may be further disposed in the wafer processing system, so as to perform heat dissipation and cooling on the wafer processing system based on two cooling modes, namely liquid cooling and air cooling, thereby improving the cooling efficiency and the cooling effect.

The air-cooled cooling module comprises at least one fan arranged in the frame body and a ventilation opening arranged on the frame body, the fan rotates and improves the circulation speed of air inside and outside the frame body based on the ventilation opening, and heat of the wafer processing system is taken away by heat exchange between the air and the wafer processing system, so that cooling processing of the wafer processing system is achieved.

According to the embodiment of the disclosure, the cooling space and the condensation space are prepared, and the cooling liquid is injected into the cooling space where the wafer processing system is located so as to immerse the wafer processing system, so that the cooling treatment of the wafer processing system is realized through the heat exchange between the cooling liquid and the wafer processing system and the heat of the wafer processing system, the stability of the wafer processing system is guaranteed, and the reliability and the service life of the wafer processing system are increased.

A third aspect of the embodiments of the present disclosure provides a processing method.

Fig. 12 is a flowchart of a processing method that can be applied to a wafer processing system according to an embodiment of the present disclosure. Referring to fig. 12, the processing method includes:

in step S121, in response to the received task processing request, executing the task to be processed; the wafer processing system adopts the wafer processing system in any one of the embodiments of the present disclosure, and the heat dissipation device in any one of the embodiments of the present disclosure is used for performing heat dissipation processing on the wafer processing system.

In some possible implementations, the task processing request is used to instruct the wafer processing system to perform a pending task based on the wafer processing device and/or the external circuit board. The task to be processed comprises any one of an image processing task, a voice processing task, a text processing task and a video processing task.

It should be noted that, the above to-be-processed task is only an example, and the to-be-processed task is not limited by the embodiment of the present disclosure.

It should also be noted that, in some alternative implementations, the operating parameters of the heat dissipation device may be adjusted in real time according to the task to be processed, so as to improve the heat dissipation efficiency or reduce the energy consumption caused by heat dissipation.

For example, when the calculation amount of the task to be processed is large, the power consumption required for executing the task to be processed is correspondingly large, and the heating degree of the wafer processing system is high, so a corresponding adjustment request can be sent to the heat dissipation device, so that the heat dissipation device adjusts the corresponding operating parameter (for example, the temperature of the cooling liquid is adjusted to be low, and/or the capacity of the cooling liquid in the cooling space is increased, and/or the opening degree of the exhaust valve is increased) in response to the adjustment request. And vice versa, and will not be described further herein.

It is understood that the above-mentioned method embodiments of the present disclosure can be combined with each other to form a combined embodiment without departing from the logic of the principle, which is limited by the space, and the detailed description of the present disclosure is omitted. Those skilled in the art will appreciate that in the above methods of the specific embodiments, the specific order of execution of the steps should be determined by their function and possibly their inherent logic.

In addition, the present disclosure also provides an electronic device and a computer-readable storage medium, which can be used to implement any one of the processing methods provided by the present disclosure, and the corresponding technical solutions and descriptions and corresponding descriptions in the method sections are not repeated.

Fig. 13 is a block diagram of an electronic device provided in an embodiment of the present disclosure.

Referring to fig. 13, an embodiment of the present disclosure provides an electronic device including: at least one processor 1301; at least one memory 1302, and one or more I/O interfaces 1303 connected between the processor 1301 and the memory 1302; the memory 1302 stores one or more computer programs that are executable by the at least one processor 1301 and are executed by the at least one processor 1301, so that the at least one processor 1301 can perform the processing methods described above.

In other words, the electronic device is a hardware system corresponding to the wafer processing system, which is a processing system obtained by preparing a wafer processing apparatus on a complete uncut wafer and packaging the wafer processing apparatus in a frame, and can be used to perform any task to be processed.

In some possible implementations, in the wafer processing system, the wafer processing apparatus includes at least one computing chip and at least one memory chip, an inter-chip interconnection structure is formed between the computing chip and the memory chip, and the wafer processing apparatus is packaged in a frame of the wafer processing system, and a cooling liquid is injected into the frame. In the electronic device manufactured based on the wafer processing system, the processor 1301 corresponds to a computing chip in the wafer processing apparatus and is configured to provide computing power, the memory 1302 corresponds to a memory chip and is configured to provide a memory function, the I/O interface 1303 corresponds to an inter-chip interconnection structure between the computing chip and the memory chip and is configured to enable data to be transmitted between the computing chip and the memory chip, and heat generated by the computing chip during a processing task can be taken away by the cooling liquid, so that cooling processing of the wafer processing system is achieved. Through the organic combination among the computing power, the storage function and the data transmission function, the electronic equipment can execute corresponding tasks to be processed, and the stable and reliable operation of the wafer processing system can be guaranteed through the arrangement of the cooling liquid.

Referring to fig. 14, an embodiment of the present disclosure provides an electronic device including a plurality of processing cores 1401 and a network on chip 1402, where the plurality of processing cores 1401 are all connected to the network on chip 1402, and the network on chip 1402 is configured to interact data between the plurality of processing cores and external data.

One or more instructions are stored in the one or more processing cores 1401, and the one or more instructions are executed by the one or more processing cores 1401 to enable the one or more processing cores 1401 to perform the processing methods described above.

In some embodiments, the electronic device may be a brain-like chip, since the brain-like chip may adopt a vectorization calculation manner, and needs to call in parameters such as weight information of the neural network model through an external memory, for example, a Double Data Rate (DDR) synchronous dynamic random access memory. Therefore, the operation efficiency of batch processing is high in the embodiment of the disclosure.

In some possible implementations, in the wafer processing system, the wafer processing apparatus includes at least one computing chip, the computing chip includes a plurality of processing cores belonging to the multi-core processing chip, and at least some of the processing cores are interconnected by an on-chip network, and the wafer processing apparatus is packaged in a frame of the wafer processing system, and a cooling liquid is injected into the frame. In the electronic device manufactured based on the wafer server, the plurality of processing cores 1401 correspond to the plurality of processing cores of the computing chip and are used for providing computing capability, the network-on-chip 1402 corresponds to the network-on-chip among the plurality of processing cores of the computing chip and is used for data interaction among the processing cores, and the wafer processing device can be cooled by setting the cooling liquid, so that the wafer processing system can be stably and reliably operated.

Embodiments of the present disclosure also provide a computer-readable storage medium on which a computer program is stored, wherein the computer program, when executed by a processor/processing core, implements the processing method described above. The computer readable storage medium may be a volatile or non-volatile computer readable storage medium.

Embodiments of the present disclosure also provide a computer program product, which includes computer readable code or a non-volatile computer readable storage medium carrying computer readable code, and when the computer readable code runs in a processor of an electronic device, the processor in the electronic device executes the processing method.

It will be understood by those of ordinary skill in the art that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. In a hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable storage media, which may include computer storage media (or non-transitory media) and communication media (or transitory media).

Example embodiments have been disclosed herein, and although specific terms are employed, they are used and should be interpreted in a generic and descriptive sense only and not for purposes of limitation. In some instances, features, characteristics and/or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics and/or elements described in connection with other embodiments, unless expressly stated otherwise, as would be apparent to one skilled in the art. Accordingly, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the disclosure as set forth in the appended claims.

Claims

1. A heat dissipation device for a wafer processing system, comprising:

a cooling space provided with a cooling liquid, wherein the wafer processing system is immersed in the cooling liquid;

and the condensation space is communicated with the cooling space through an exhaust valve, and the vaporized cooling liquid in the cooling space enters the condensation space for condensation treatment.

2. The heat dissipating device of claim 1, comprising: the cooling space is provided with at least one liquid level sensor;

the liquid level sensor is used for acquiring the liquid level of the cooling liquid and sending a liquid supplementing message under the condition that the liquid level is lower than a preset liquid level threshold, wherein the liquid supplementing message is used for indicating that the cooling liquid is supplemented to the cooling space.

3. The heat dissipating device of claim 1, comprising: the box body material of the condensation space is made of heat conducting material, and/or the condensation space is provided with at least one first cooling unit;

wherein the first cooling unit is used for cooling the condensation space.

4. The heat dissipating device of claim 1, comprising: the cooling space is connected with a first transmission pipeline, and the first transmission pipeline is connected with the liquid storage tank and used for inputting and outputting cooling liquid with the cooling space;

wherein, the liquid storage pot is used for storing the coolant liquid.

5. The heat dissipating device of claim 4, comprising: the condensation space is connected with a second transmission pipeline, and the second transmission pipeline is connected with the liquid storage tank and is used for collecting the condensed cooling liquid into the liquid storage tank.

6. The heat dissipating device of claim 5, comprising: the first transmission pipeline is provided with at least one first valve, and the first valve is used for controlling the circulation state of the cooling liquid in the cooling space and the liquid storage tank;

and/or the presence of a gas in the gas,

the second transmission pipeline is provided with at least one second valve, and the second valve is used for controlling the circulation state of the condensed cooling liquid in the condensation space and the liquid storage tank.

7. The heat dissipating device of claim 6, comprising: the heat dissipation device also comprises a control module;

the control module is used for responding to a system carrying or maintenance request, setting the first valve and the second valve to be in an opening state, discharging the cooling liquid in the cooling space to the liquid storage tank, discharging the condensed cooling liquid in the condensing space to the liquid storage tank, and carrying or maintaining;

and/or the presence of a gas in the gas,

the control module is used for setting the first valve and the second valve to be in an open state in response to a system installation request, and extracting cooling liquid in the liquid storage tank into the cooling space so as to carry out cooling treatment on the wafer processing system, so that condensed cooling liquid in the condensation space is discharged from the second valve to the liquid storage tank.

8. The heat dissipating device of claim 4, comprising: and at least one second cooling unit is arranged in the liquid storage tank and is used for cooling the cooling liquid in the liquid storage tank.

9. The heat dissipating device of claim 8, comprising: the cooling space is provided with at least one first cooling pipeline, and a first liquid inlet and a first liquid outlet of the first cooling pipeline are both connected with the liquid storage tank, so that cooling liquid in the liquid storage tank enters the first cooling pipeline through the first liquid inlet and flows back to the liquid storage tank from the first liquid outlet through flowing;

and/or the presence of a gas in the gas,

the condensation space is provided with at least one second cooling pipeline, a second inlet and a second liquid outlet of the second cooling pipeline are both connected with the liquid storage tank, so that cooling liquid in the liquid storage tank passes through the second inlet to enter the second cooling pipeline, and flows back to the liquid storage tank from the second liquid outlet.

10. The heat dissipating device of claim 1, comprising: and the liquid storage tank is communicated with one or more cooling spaces or condensation space pipelines.

11. The heat dissipating device of claim 10, comprising: the wafer processing system comprises at least one wafer processing device and at least one wafer platform, wherein the wafer platform is used for bearing the wafer processing device, and the wafer processing device is fixed on the wafer platform.

12. The heat dissipating device of claim 11, comprising: the wafer processing device is connected with at least one external circuit board, and the external circuit board provides at least one of electric energy, a communication function, a storage function and a clock function for the wafer processing device;

the wafer processing device is fixed on the wafer platform through an adhesive, an adsorption unit and/or a fixing elastic sheet.

13. The heat dissipating device of claim 11, comprising: at least one third cooling pipeline is arranged on the inner wall of the wafer platform and/or the heat dissipation device;

a third liquid inlet and a third liquid outlet of the third cooling pipeline are both connected with a liquid storage tank, so that cooling liquid in the liquid storage tank enters the third cooling pipeline through the third liquid inlet and flows back to the liquid storage tank from the third liquid outlet through flowing;

and/or the presence of a gas in the gas,

and external cooling liquid flows into the third cooling pipeline through the third liquid inlet and flows out of the third liquid outlet after flowing, wherein the external cooling liquid is cooling liquid except the cooling liquid in the liquid storage tank.

14. The heat dissipating device of claim 1, comprising: the cooling liquid comprises liquid which has heat-conducting property and vaporization property meeting preset performance conditions and is insulating.