CN115584472A - Magnetron sputtering coating machine - Google Patents

Magnetron sputtering coating machine Download PDF

Info

Publication number
CN115584472A
CN115584472A CN202211366586.4A CN202211366586A CN115584472A CN 115584472 A CN115584472 A CN 115584472A CN 202211366586 A CN202211366586 A CN 202211366586A CN 115584472 A CN115584472 A CN 115584472A
Authority
CN
China
Prior art keywords
coating chamber
chamber
sputtering coating
evaporation
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211366586.4A
Other languages
Chinese (zh)
Inventor
周征华
李龙哲
朱显君
夏伟
李花
张亚芹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Hana Technology Equipment Co ltd
Original Assignee
Shanghai Hana Technology Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Hana Technology Equipment Co ltd filed Critical Shanghai Hana Technology Equipment Co ltd
Priority to CN202211366586.4A priority Critical patent/CN115584472A/en
Publication of CN115584472A publication Critical patent/CN115584472A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention belongs to the field of coating equipment and discloses a magnetron sputtering coating machine which comprises an evaporation coating chamber, a sputtering coating chamber and a flap valve, wherein the flap valve is arranged between the evaporation coating chamber and the sputtering coating chamber and can be opened and closed; the evaporation coating chamber is provided with a chamber door which can be opened and closed, a pretreatment mechanism, an AF evaporation mechanism and a transfer mechanism are arranged in the evaporation coating chamber, and a sputtering mechanism is arranged in the sputtering coating chamber; the transfer mechanism can move back and forth along the direction from the evaporation coating chamber to the sputtering coating chamber and is used for placing the tool plate with the product to be processed into the sputtering coating chamber and picking up the tool plate with the processed product from the sputtering coating chamber. The sputtering coating chamber can always keep a vacuum state without re-vacuumizing, can realize continuous sputtering coating of products, and greatly improves the production efficiency.

Description

Magnetron sputtering coating machine
Technical Field
The invention relates to the technical field of coating equipment, in particular to a magnetron sputtering coating machine.
Background
Magnetron sputtering is one of the important methods for vacuum coating, and has the advantages of high control precision of film thickness, good coating uniformity and the like. Magnetron sputtering needs to be carried out at a certain temperature and a certain vacuum degree, a product to be coated needs to be pretreated (surface activation treatment) before sputtering coating so as to increase the surface adhesive force of the product to be coated, and after sputtering coating is finished, a layer of fingerprint-proof film needs to be coated on the surface of the product after sputtering coating.
At present, the steps of surface activation treatment, sputtering coating, fingerprint-proof film coating and the like are all completed in a chamber, after the coating of a coated product is completed, the vacuum degree of the chamber needs to be reduced, then a chamber door is opened to take out the coated product, and a new product to be coated is put in for coating. Therefore, when each product is coated, the chamber needs to be vacuumized again, and then the steps of surface activation treatment, sputtering coating, fingerprint-proof coating and the like are carried out, and the process from low vacuum to high vacuum takes time, so that the coating efficiency of the product is low.
Disclosure of Invention
The invention aims to provide a magnetron sputtering coating machine, which can realize continuous sputtering coating of products and greatly improve the production efficiency.
The technical scheme provided by the invention is as follows:
a magnetron sputtering coating machine comprises an evaporation coating chamber, a sputtering coating chamber and a flap valve which is arranged between the evaporation coating chamber and the sputtering coating chamber and can be opened and closed, wherein the evaporation coating chamber is communicated with the sputtering coating chamber when the flap valve is opened, and the evaporation coating chamber and the sputtering coating chamber are separated into two independent chambers when the flap valve is closed;
the evaporation coating chamber is provided with a chamber door capable of being opened and closed, a pretreatment mechanism, an AF evaporation mechanism and a transfer mechanism are arranged in the evaporation coating chamber, and a sputtering mechanism is arranged in the sputtering coating chamber;
the transfer mechanism can move back and forth along the direction from the evaporation coating chamber to the sputtering coating chamber and is used for placing the tool plate with the product to be processed into the sputtering coating chamber and picking up the tool plate with the processed product from the sputtering coating chamber.
In some embodiments, the transfer mechanism includes a moving assembly and a magnetic member, the moving assembly is movable to and fro along the direction from the evaporation coating chamber to the sputtering coating chamber, and the magnetic member is arranged on the moving assembly and is used for sucking the tooling plate in the sputtering coating chamber.
In some embodiments, the moving assembly comprises a base, a rotating disc and a bracket, the base can move back and forth along the direction from the evaporation coating chamber to the sputtering coating chamber, the rotating disc can be rotatably arranged relative to the base along the horizontal direction, the bracket is arranged on the rotating disc, and the magnetic part is respectively arranged on one side of the bracket close to the chamber door and one side of the bracket close to the flap valve.
In some embodiments, the inner side of the chamber door is provided with a first substrate frame for placing a tooling plate; and a second substrate frame for placing a tooling plate is arranged in the sputtering coating chamber.
In some embodiments, the movement assembly further comprises a first movement limit switch disposed below one of the magnetic members and a second movement limit switch disposed below the other of the magnetic members.
In some embodiments, the tooling plate is provided with a hanging hole, and the first substrate holder and the second substrate holder are respectively provided with a hanging piece matched with the hanging hole;
the movable assembly further comprises a lifting rod and a connecting piece, the lifting rod can lift along the height direction of the support, the magnetic piece is connected with the lifting rod through the connecting piece, and the lifting rod lifts and is used for hanging the tooling plate on the magnetic piece on the hanging piece or taking the tooling plate off the hanging piece.
In some embodiments, the moving assembly further includes an upper limit switch and a lower limit switch, and the upper limit switch and the lower limit switch are respectively disposed on the bracket and respectively located at upper and lower sides of the connecting member, and are used for limiting the lifting displacement of the lifting rod.
In some embodiments, the chamber door inner side is provided with a rotating mechanism, and the rotating mechanism is provided with a plurality of first substrate holders at intervals along the circumferential direction.
In some embodiments, the number of the chamber doors is two, two chamber doors are respectively arranged on two sides of the evaporation coating chamber, and the two chamber doors are used alternately.
The invention has the technical effects that: the flap valve separates the evaporation coating chamber and the sputtering coating chamber into two independent chambers, the time for performing pretreatment and fingerprint-proof coating in the evaporation coating chamber is far shorter than the time for sputtering coating, one product completes fingerprint-proof coating, re-vacuumizing and pretreatment in the evaporation coating chamber, the other product just completes sputtering coating in the sputtering coating chamber, then the product after pretreatment is put into the sputtering coating chamber by the transfer mechanism, the product after sputtering coating in the sputtering coating chamber is taken out, sputtering of the next product is performed, the sputtering coating chamber can always keep a vacuum state, re-vacuumizing is not needed, continuous sputtering coating of the product can be realized, and the production efficiency is greatly improved.
Drawings
The invention is described in further detail below with reference to the following figures and detailed description:
FIG. 1 is a schematic structural diagram of a magnetron sputtering coating machine provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a transfer mechanism according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a transfer mechanism provided in an embodiment of the present application at a viewing angle after a tooling plate is sucked by the transfer mechanism;
fig. 4 is a schematic structural diagram of another view angle after the transfer mechanism provided in the embodiment of the present application sucks a tooling plate;
FIG. 5 is a schematic structural diagram of a chamber door provided in an embodiment of the present application;
fig. 6 is a schematic structural view of two chamber doors provided on an evaporation coating chamber according to an embodiment of the present application.
The reference numbers indicate:
10. an evaporation coating chamber; 11. a chamber door; 12. a first substrate holder; 121. a suspension member; 13. a rotation mechanism; 20. a sputtering coating chamber; 30. a transfer mechanism; 31. a moving assembly; 311. a base; 312. rotating the disc; 313. a support; 314. a first movement limit switch; 315. a second movement limit switch; 316. a lifting rod; 317. a connecting member; 318. an upper limit switch; 319. a lower limit switch; 32. a magnetic member; 40. assembling a plate; 41. hanging holes; 50. and (5) producing the product.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
In this context, it is to be understood that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, in the description of the present application, the terms "first," "second," and the like are used only for distinguishing the description, and are not intended to indicate or imply relative importance.
In one embodiment of the present application, as shown in fig. 1, 2 and 5, a magnetron sputtering coating machine includes an evaporation coating chamber 10, a sputtering coating chamber 20 and a flap valve arranged between the evaporation coating chamber 10 and the sputtering coating chamber 20 and capable of being opened and closed, wherein the evaporation coating chamber 10 is communicated with the sputtering coating chamber 20 when the flap valve is opened, and the evaporation coating chamber 10 and the sputtering coating chamber 20 are divided into two independent chambers when the flap valve is closed; a chamber door 11 which can be opened and closed is arranged on the evaporation coating chamber 10, a pretreatment mechanism, an AF evaporation mechanism and a transfer mechanism 30 are arranged in the evaporation coating chamber 10, and a sputtering mechanism is arranged in the sputtering coating chamber 20; the transfer mechanism 30 is capable of moving back and forth along the direction from the evaporation coating chamber 10 to the sputtering coating chamber 20, and is used for placing the tool plate 40 with the product 50 to be processed into the sputtering coating chamber 20 and picking up the tool plate 40 with the processed product 50 from the sputtering coating chamber 20.
Specifically, a flap valve is arranged between the evaporation coating chamber 10 and the sputtering coating chamber 20, the flap valve can divide the evaporation coating chamber 10 and the sputtering coating chamber 20 into two independent chambers, a pretreatment mechanism and an AF evaporation mechanism are arranged in the evaporation coating chamber 10, the pretreatment mechanism is used for performing pretreatment such as plasma cleaning and surface activation on the product 50, and the AF evaporation mechanism is used for performing fingerprint-resistant coating on the product 50; the sputtering coating chamber 20 is provided with a sputtering mechanism for sputtering coating the product 50.
The product 50 to be coated is placed on the tool plate 40 and is pretreated in the evaporation coating chamber 10 to increase the adhesive force of the product 50, then magnetron sputtering coating is carried out in the sputtering coating chamber 20, and after the sputtering coating is finished, the product enters the evaporation coating chamber 10 to be subjected to anti-fingerprint coating.
It is understood that the evaporation coating chamber 10 is further provided with mechanisms necessary for performing the pre-treatment and anti-fingerprint coating of the product 50, such as a vacuum pumping mechanism, a vacuum measuring mechanism, and the like. The sputtering coating chamber 20 is also provided with mechanisms required for completing sputtering of the product 50, such as a target material, a sputtering power supply, a CCR ion source, a medium frequency power supply, a heating mechanism, a vacuum pumping mechanism, a vacuum exhaust mechanism, a vacuum measuring mechanism and the like.
According to the invention, an evaporation coating chamber 10 and a sputtering coating chamber 20 are separated into two independent chambers through a flap valve, a product 50 is firstly pretreated in the evaporation coating chamber 10, then the product is conveyed into the sputtering coating chamber 20 by a transfer mechanism 30 for sputtering, after sputtering is finished, the sputtered product 50 is taken out from the sputtering coating chamber 20 by the transfer mechanism 30 and enters the evaporation coating chamber 10 for anti-fingerprint coating, when the product 50 is exchanged between the evaporation coating chamber 10 and the sputtering coating chamber 20, a chamber door 11 of the evaporation coating chamber 10 is closed, the sputtering coating chamber 20 and the evaporation coating chamber 10 are both kept in a vacuum state, after the product 50 is subjected to anti-fingerprint coating, the chamber door 11 of the evaporation coating chamber 10 is opened to take out the coated product 50 from the evaporation coating chamber 10, at the moment, the coating chamber 20 is sealed by the flap valve, the sputtering coating chamber 20 is still kept in a vacuum state, and the newly-put product 50 can be sputtered and coated.
Although the chamber door 11 of the evaporation coating chamber 10 is opened, the evaporation coating chamber 10 cannot be kept in a vacuum state, and the evaporation coating chamber 10 needs to be vacuumized again when the pretreatment is carried out, because the time required by the pretreatment and the anti-fingerprint coating is less than the time required by the sputter coating, after the anti-fingerprint coating, the vacuumization again and the pretreatment of one product 50 are completed in the evaporation coating chamber 10, the sputter coating of the other product 50 is just completed in the sputter coating chamber, then the transfer mechanism 30 puts the product 50 which has completed the pretreatment into the sputter coating chamber 20, takes out the product which has completed the sputter coating in the sputter coating chamber 20, and carries out the sputtering of the next product 50, the sputter coating chamber 20 can always keep in a vacuum state, the vacuum pumping again is not needed, the continuous production of the product 50 can be realized, and the production efficiency is greatly improved.
In some embodiments, as shown in fig. 2 and 3, the transfer mechanism 30 includes a moving assembly 31 and a magnetic member 32, the moving assembly 31 is reciprocally movable along the direction from the evaporation coating chamber 10 to the sputtering coating chamber 20, and the magnetic member 32 is disposed on the moving assembly 31 for sucking the tooling plate 40 in the sputtering coating chamber 20.
The moving component 31 can move in the evaporation coating chamber 10, a moving guide rail can be arranged in the evaporation coating chamber 10, and the moving component 31 is driven by a motor and moves along the moving guide rail. When a workpiece needs to be taken out of the sputtering coating chamber 20, the flap valve is opened, the moving assembly 31 moves towards the sputtering coating chamber 20, then the tooling plate 40 (a product which is subjected to pretreatment is placed on the tooling plate) on the transfer mechanism 30 is placed in the sputtering coating chamber 20, the tooling plate 40 (a product which is subjected to sputtering is placed on the tooling plate) placed in the sputtering coating chamber 20 is sucked through the magnetic part 32, then the moving assembly 31 is far away from the sputtering coating chamber 20, the flap valve is closed, the sputtered product continues to finish fingerprint-proof coating in the evaporation coating chamber 10, and the pretreated product continues to be subjected to sputtering coating in the sputtering coating chamber 20.
In some embodiments, as shown in fig. 2, the moving assembly 31 includes a base 311, a rotating disc 312 and a bracket 313, the base 311 is reciprocally movable along the direction from the evaporation coating chamber 10 to the sputtering coating chamber 20, the rotating disc 312 is rotatably disposed along the horizontal direction relative to the base 311, the bracket 313 is disposed on the rotating disc 312, and the magnetic members 32 are respectively disposed on one side of the bracket 313 close to the chamber door 11 and one side of the bracket 313 close to the flap valve.
The base 311 is driven by a motor to move in the evaporation coating chamber 10, and the base 311 drives the rotating disk 312, the bracket 313 and the magnetic member 32 to move together when moving. The rotary disk 312 is rotatable relative to the base 311, and when the rotary disk 312 rotates, the bracket 313 and the magnetic member 32 are driven to rotate together. The rotating disk 312 may be driven to rotate by a motor, a gear, or the like.
The two sides of the bracket 313 are respectively provided with the magnetic part 32, the magnetic part 32 close to one side of the chamber door 11 can suck a tool plate 40 (a product which is subjected to pretreatment is placed on the tool plate), when the moving component 31 moves to a position close to the sputter coating chamber 20, the magnetic part 32 close to one side of the sputter coating chamber 20 on the bracket 313 sucks the tool plate 40 (a product which is subjected to sputtering is placed on the tool plate) placed in the sputter coating chamber 20, then the rotating disc 312 rotates, the tool plate 40 (a product which is subjected to pretreatment is placed on the tool plate) on the magnetic part 32 at the other side of the bracket 313 is placed in the sputter coating chamber 20, so that the tool plate 40 on which a product to be sputtered is placed in the sputter coating chamber 20, and the tool plate 40 on which a product to be sputtered is placed is picked up from the sputter coating chamber 20.
As a modification, a rotating frame may be provided in the sputter coating chamber 20, the rotating disc 312 is not provided on the moving assembly 31, the magnetic member 32 is provided on the support 313 only near one side of the flap valve, the moving assembly 31 first places the pre-processed product tooling plate 40 on the magnetic member 32 on the empty space of the rotating frame, then the rotating frame rotates, and the magnetic member 32 on the moving assembly 31 removes the sputtered product tooling plate 40 from the rotating frame, so as to achieve the picking and placing of the tooling plate 40.
As shown in fig. 5, the inner side surface of the chamber door 11 is provided with a first substrate holder 12 for placing the tooling plate 40; a second substrate holder for holding a tooling plate 40 is provided in the sputter coating chamber 20.
When the transferring mechanism 30 moves to one side close to the chamber door 11, the magnetic part 32 on one side of the support 313 absorbs the tooling plate 40 on the first substrate frame 12, then the transferring mechanism 30 moves to one side close to the flap valve and opens the flap valve, the magnetic part 32 on the other side of the support 313 absorbs the tooling plate 40 on the second substrate frame, then the rotating disk 312 rotates, the absorbed tooling plate 40 on the first substrate frame 12 is placed on the second substrate frame of the sputter coating chamber 20, and finally the flap valve is closed.
As shown in fig. 2, the moving assembly 31 further includes a first moving limit switch 314 and a second moving limit switch 315, wherein the first moving limit switch 314 is disposed below one of the magnetic members 32, and the second moving limit switch 315 is disposed below the other magnetic member 32. The first moving limit switch 314 and the second moving limit switch 315 can limit the moving stroke of the moving assembly 31, so that the magnetic member 32 can accurately suck the tooling plates 40 on the first substrate holder 12 and the second substrate holder.
As shown in fig. 3 and 4, the tooling plate 40 is provided with a hanging hole 41, and the first substrate holder 12 and the second substrate holder are respectively provided with a hanging part 121 matched with the hanging hole 41; the moving assembly 31 further includes a lifting rod 316 and a connecting member 317, the lifting rod 316 can be lifted along the height direction of the support 313, the magnetic member 32 is connected to the lifting rod 316 through the connecting member 317, and the lifting rod 316 is lifted for hanging the tooling plate 40 on the magnetic member 32 on the hanger 121 or removing the tooling plate 40 from the hanger 121.
The lifting rod 316 can be driven to lift through a motor, a screw rod assembly and the like. The moving assembly 31 moves to the side of the first substrate holder 12 or the second substrate holder, the magnetic member 32 attracts the tooling plate 40, then the lifting rod 316 is lifted to drive the magnetic member 32 and the tooling plate 40 to lift together, the tooling plate 40 is taken down from the first substrate holder 12 or the second substrate holder, then the rotating disc 312 rotates, and the tooling plate 40 on the other side of the support 313 is placed on the first substrate holder 12 or the second substrate holder. The hanging hole 41 on the tooling plate 40 is gourd-shaped, the upper end of the hanging hole 41 is narrow and the lower end is wide, so that the hanging hole 41 can be hung on the hanging piece 121, and the end part of the hanging piece 121 can be provided with a limiting piece to prevent the tooling plate 40 from falling off the hanging piece 121.
As shown in fig. 3, the moving assembly 31 further includes an upper limit switch 318 and a lower limit switch 319, and the upper limit switch 318 and the lower limit switch 319 are respectively disposed on the bracket 313 and respectively located at the upper side and the lower side of the connecting member 317, and are used for limiting the lifting displacement of the lifting rod 316. The upper limit switch 318 and the lower limit switch 319 can limit the lifting of the lifting rod 316, so that the magnetic member 32 can accurately complete the picking and placing of the tooling plate 40.
In some embodiments, as shown in FIG. 5, the chamber door 11 is provided with a rotating mechanism 13 on the inner side surface, and the rotating mechanism 13 is provided with a plurality of first substrate holders 12 at intervals along the circumferential direction. A plurality of tooling plates 40 can be placed on each first substrate frame 12, and the first substrate frames 12 can rotate to realize continuous uninterrupted production and greatly improve the production efficiency.
The number of the chamber doors 11 is two, as shown in fig. 6, the two chamber doors 11 are respectively disposed on two sides of the evaporation coating chamber 10, and the two chamber doors 11 are used alternately. Set up two cavity door 11, after all the products on first cavity door 11 all accomplished the coating film, open cavity door 11, then close second cavity door 11, then carry out the coating film to the product on second cavity door 11, save the time of placing the product to improve production efficiency.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and amendments can be made without departing from the principle of the present invention, and these modifications and amendments should also be considered as the protection scope of the present invention.

Claims (9)

1. A magnetron sputtering coating machine is characterized by comprising an evaporation coating chamber, a sputtering coating chamber and a flap valve which is arranged between the evaporation coating chamber and the sputtering coating chamber and can be opened and closed, wherein the evaporation coating chamber is communicated with the sputtering coating chamber when the flap valve is opened, and the evaporation coating chamber and the sputtering coating chamber are separated into two independent chambers when the flap valve is closed;
the evaporation coating chamber is provided with a chamber door capable of being opened and closed, a pretreatment mechanism, an AF evaporation mechanism and a transfer mechanism are arranged in the evaporation coating chamber, and a sputtering mechanism is arranged in the sputtering coating chamber;
the transfer mechanism can move back and forth along the direction from the evaporation coating chamber to the sputtering coating chamber and is used for placing the tool plate with the product to be processed into the sputtering coating chamber and picking up the tool plate with the processed product from the sputtering coating chamber.
2. The magnetron sputtering coating machine of claim 1 wherein,
the moving mechanism comprises a moving assembly and a magnetic part, the moving assembly can move back and forth along the direction from the evaporation coating chamber to the sputtering coating chamber, and the magnetic part is arranged on the moving assembly and used for sucking the tooling plate in the sputtering coating chamber.
3. The magnetron sputtering coating machine of claim 2 wherein,
the movable assembly comprises a base, a rotating disc and a support, the base is arranged along the direction from the evaporation coating chamber to the sputtering coating chamber and can move in a reciprocating mode, the rotating disc is opposite to the base in the horizontal direction and can rotate, the support is arranged on the rotating disc, the support is close to one side of the chamber door and one side of the support, close to the flap valve, of the support are respectively provided with the magnetic parts.
4. The magnetron sputtering coating machine of claim 3 wherein,
a first substrate frame for placing a tooling plate is arranged on the inner side surface of the chamber door;
and a second substrate frame for placing a tooling plate is arranged in the sputtering coating chamber.
5. The magnetron sputtering coating machine of claim 3 wherein,
the moving assembly further comprises a first moving limit switch and a second moving limit switch, the first moving limit switch is arranged below one of the magnetic pieces, and the second moving limit switch is arranged below the other magnetic piece.
6. The magnetron sputtering coating machine of claim 4 wherein,
hanging holes are formed in the tooling plate, and hanging parts matched with the hanging holes are respectively arranged on the first substrate frame and the second substrate frame;
the movable assembly further comprises a lifting rod and a connecting piece, the lifting rod can lift along the height direction of the support, the magnetic piece is connected with the lifting rod through the connecting piece, and the lifting rod lifts and is used for hanging the tooling plate on the magnetic piece on the hanging piece or taking the tooling plate off the hanging piece.
7. The magnetron sputtering coating machine of claim 6 wherein,
the movable assembly further comprises an upper limit switch and a lower limit switch, the upper limit switch and the lower limit switch are respectively arranged on the support and are respectively located on the upper side and the lower side of the connecting piece and used for limiting the lifting displacement of the lifting rod.
8. A magnetron sputter coating machine according to any one of claims 1 to 7, characterized in that,
the inner side surface of the chamber door is provided with a rotating mechanism, and the rotating mechanism is provided with a plurality of first substrate frames at intervals along the circumferential direction.
9. The magnetron sputtering coating machine of claim 8 wherein,
the number of the chamber doors is two, the two chamber doors are respectively arranged on two sides of the evaporation coating chamber, and the two chamber doors are used alternately.
CN202211366586.4A 2022-11-01 2022-11-01 Magnetron sputtering coating machine Pending CN115584472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211366586.4A CN115584472A (en) 2022-11-01 2022-11-01 Magnetron sputtering coating machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211366586.4A CN115584472A (en) 2022-11-01 2022-11-01 Magnetron sputtering coating machine

Publications (1)

Publication Number Publication Date
CN115584472A true CN115584472A (en) 2023-01-10

Family

ID=84781485

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211366586.4A Pending CN115584472A (en) 2022-11-01 2022-11-01 Magnetron sputtering coating machine

Country Status (1)

Country Link
CN (1) CN115584472A (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183547A (en) * 1989-09-13 1993-02-02 Sony Corporation Sputtering apparatus and system for sputtering employing same
KR20030089501A (en) * 2002-05-17 2003-11-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing apparatus
JP2006274396A (en) * 2005-03-30 2006-10-12 Showa Shinku:Kk Method and apparatus for forming thin film
CN104213086A (en) * 2014-09-12 2014-12-17 光驰科技(上海)有限公司 Double-arm automatic substrate loading type sputter coating method and device
CN108914081A (en) * 2018-09-30 2018-11-30 佛山市钜仕泰粉末冶金有限公司 A kind of magnetron sputtering film production line
CN209397258U (en) * 2018-12-07 2019-09-17 沈阳爱科斯科技有限公司 Continuous vacuum coating device and coating system
CN209537613U (en) * 2018-11-29 2019-10-25 爱发科豪威光电薄膜科技(深圳)有限公司 Slice loading and unloading device and magnetic-controlled sputtering coating equipment
CN111286705A (en) * 2018-12-06 2020-06-16 北京华业阳光新能源有限公司 Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment
CN111747112A (en) * 2020-07-29 2020-10-09 福州鸿基自动化设备有限公司 Magnetic attraction type workpiece grabbing accurate positioning device
CN112267101A (en) * 2020-11-27 2021-01-26 光驰科技(上海)有限公司 Continuous automatic conveying sputtering film forming device with revolution and rotation structure
CN112708866A (en) * 2020-12-23 2021-04-27 青岛大学 Flexible substrate continuous coating machine based on magnetron sputtering technology and coating method thereof
JP6868929B1 (en) * 2020-07-30 2021-05-12 株式会社シンクロン Transfer device and film formation device using it
CN113278937A (en) * 2021-05-21 2021-08-20 安徽亦高光电科技有限责任公司 Functional film production process and equipment
CN216155954U (en) * 2021-08-24 2022-04-01 湘潭宏大真空技术股份有限公司 Multi-chamber vacuum magnetron sputtering coating device

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183547A (en) * 1989-09-13 1993-02-02 Sony Corporation Sputtering apparatus and system for sputtering employing same
KR20030089501A (en) * 2002-05-17 2003-11-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing apparatus
JP2006274396A (en) * 2005-03-30 2006-10-12 Showa Shinku:Kk Method and apparatus for forming thin film
CN104213086A (en) * 2014-09-12 2014-12-17 光驰科技(上海)有限公司 Double-arm automatic substrate loading type sputter coating method and device
CN108914081A (en) * 2018-09-30 2018-11-30 佛山市钜仕泰粉末冶金有限公司 A kind of magnetron sputtering film production line
CN209537613U (en) * 2018-11-29 2019-10-25 爱发科豪威光电薄膜科技(深圳)有限公司 Slice loading and unloading device and magnetic-controlled sputtering coating equipment
CN111286705A (en) * 2018-12-06 2020-06-16 北京华业阳光新能源有限公司 Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment
CN209397258U (en) * 2018-12-07 2019-09-17 沈阳爱科斯科技有限公司 Continuous vacuum coating device and coating system
CN111747112A (en) * 2020-07-29 2020-10-09 福州鸿基自动化设备有限公司 Magnetic attraction type workpiece grabbing accurate positioning device
JP6868929B1 (en) * 2020-07-30 2021-05-12 株式会社シンクロン Transfer device and film formation device using it
CN112267101A (en) * 2020-11-27 2021-01-26 光驰科技(上海)有限公司 Continuous automatic conveying sputtering film forming device with revolution and rotation structure
CN112708866A (en) * 2020-12-23 2021-04-27 青岛大学 Flexible substrate continuous coating machine based on magnetron sputtering technology and coating method thereof
CN113278937A (en) * 2021-05-21 2021-08-20 安徽亦高光电科技有限责任公司 Functional film production process and equipment
CN216155954U (en) * 2021-08-24 2022-04-01 湘潭宏大真空技术股份有限公司 Multi-chamber vacuum magnetron sputtering coating device

Similar Documents

Publication Publication Date Title
KR100189675B1 (en) Sputtering apparatus and sputtering processing system using the same
WO2006025336A1 (en) Film forming equipment
CN213388871U (en) Double-sided coating film turning device and coating machine
WO2014089948A1 (en) Multi-functional continuous magneto-controlled sputter coating device
CN108642452B (en) Vacuum coating machine for processing metallized film of capacitor
CN104213086B (en) Double-arm automatic substrate loading type sputter coating method and device
CN102936100A (en) Rotary type continuous coating device and method thereof
CN112708866A (en) Flexible substrate continuous coating machine based on magnetron sputtering technology and coating method thereof
CN113186499A (en) High-energy pulse arc evaporation source
CN115584472A (en) Magnetron sputtering coating machine
US20180312963A1 (en) Substrate bearing assembly and magnetron sputtering device
CN202968686U (en) Rotary continuous coating device
CN217809639U (en) Vacuum coating machine
CN101353778B (en) Sputtering type film coating apparatus and film coating method
CN214830638U (en) Single-chamber magnetron sputtering vacuum coating machine
CN205774780U (en) Stacking-type Sputting film-plating apparatus
CN204455282U (en) The continuous film plating machine of thin sheet glass aluminium mirror
CN219886167U (en) Continuous resistance electron beam evaporation coating device
CN108385081B (en) Automatic coating device in two storehouses
CN112267101A (en) Continuous automatic conveying sputtering film forming device with revolution and rotation structure
CN217149295U (en) Multifunctional magnetron sputtering vacuum coating machine
CN219297634U (en) Magnetic control vacuum coating machine
CN118028753B (en) Preparation device and preparation method of transparent conductive film material
CN219114850U (en) Target imprinting device
CN212152431U (en) Coating device of multi-curved-surface valve rod

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination