CN115574996A - Touch force sensor, electronic equipment and packaging method of touch force sensor - Google Patents

Touch force sensor, electronic equipment and packaging method of touch force sensor Download PDF

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Publication number
CN115574996A
CN115574996A CN202211183006.8A CN202211183006A CN115574996A CN 115574996 A CN115574996 A CN 115574996A CN 202211183006 A CN202211183006 A CN 202211183006A CN 115574996 A CN115574996 A CN 115574996A
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CN
China
Prior art keywords
touch force
pressure sensing
substrate
positioning
sensing chip
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Pending
Application number
CN202211183006.8A
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Chinese (zh)
Inventor
缪建民
尹长通
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Sv Senstech Wuxi Co ltd
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Sv Senstech Wuxi Co ltd
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Application filed by Sv Senstech Wuxi Co ltd filed Critical Sv Senstech Wuxi Co ltd
Priority to CN202211183006.8A priority Critical patent/CN115574996A/en
Publication of CN115574996A publication Critical patent/CN115574996A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

The invention discloses a touch force sensor, electronic equipment and a packaging method of the touch force sensor. The method comprises the following steps: the device comprises a substrate, a pressure sensing chip, a positioning shell and a touch force structure; the pressure sensing chip is bound and connected on the substrate; the surface of the pressure sensing chip, which is far away from the substrate, is provided with a touch force sensing film pressing area, and the touch force sensing film pressing area is used for detecting the size of a touch force; the positioning shell comprises a positioning hole, and the positioning shell is bonded with the substrate; the touch force structure is placed in the positioning hole and is in contact with the touch force sensing film pressing area; the touch force structure is used for feeding back touch force to a touch force sensing film pressing area of the pressure sensing chip. The invention provides a touch force sensor, electronic equipment and a packaging method of the touch force sensor, which are beneficial to miniaturization and packaging, improve the packaging efficiency and improve the touch force detection sensitivity of the touch force sensor.

Description

Touch force sensor, electronic equipment and packaging method of touch force sensor
Technical Field
The embodiment of the invention relates to the technical field of sensors, in particular to a touch force sensor, electronic equipment and a packaging method of the touch force sensor.
Background
With the development of science and technology, sensors are more and more widely applied, wherein touch force sensors can be applied to medical, consumer electronics, industrial and other terminal devices.
However, most of the existing touch force sensors in the market are based on strain gauge type structural design, the structural size is large, the sensitivity is very low, the existing touch force sensors are not suitable for the miniaturized structural design of intelligent terminal equipment, and the high requirements of the structural design of the force sensors cannot be met.
Disclosure of Invention
The invention provides a touch force sensor, an electronic device and a packaging method of the touch force sensor, which are beneficial to miniaturization and packaging, improve packaging efficiency, reduce size and cost, and improve touch force detection sensitivity of the touch force sensor.
In a first aspect, an embodiment of the present invention provides a touch force sensor, including: the device comprises a substrate, a pressure sensing chip, a positioning shell, a fixed shell and a touch force structure;
the pressure sensing chip is bound and connected on the substrate; the surface of the pressure sensing chip, which is far away from the substrate, is provided with a touch force sensing film pressing area, and the touch force sensing film pressing area is used for detecting the size of a touch force;
the positioning shell comprises a positioning hole, and the positioning shell is bonded with the substrate; the touch force structure is placed in the positioning hole and is in contact with the touch force sensing film pressing area; the touch force structure is used for feeding back a touch force to a touch force sensing film pressing area of the pressure sensing chip;
the fixing shell comprises a fixing hole, the fixing shell is arranged outside the positioning shell, the fixing shell is bonded with the substrate, and the vertical projection of the fixing hole on the pressure sensing chip is in the vertical projection of the positioning hole on the pressure sensing chip; the geometric centers of the positioning hole, the fixing hole and the contact force sphere are on the same straight line.
Optionally, the touch force structure includes: a touch force sphere tangent to the touch force sensing die area; and the vertical projection of the positioning hole on the pressure sensing chip is superposed with the vertical projection of the contact force sphere on the sensing chip.
Optionally, the touch force sensor further includes a fixing housing, the fixing housing includes a fixing hole, the fixing housing is disposed outside the positioning housing, the fixing housing is bonded to the substrate, and a vertical projection of the fixing hole on the pressure sensing chip falls within a vertical projection of the positioning hole on the pressure sensing chip; the geometric centers of the positioning hole, the fixing hole and the contact force sphere are on the same straight line.
Optionally, the positioning housing and the fixing housing are both fixed on the substrate by an adhesive, and the adhesive includes at least one of glue, solder paste, or conductive adhesive.
Optionally, a vertical height difference between the positioning housing and the fixed housing is smaller than a radius of the contact force sphere.
Alternatively, the positioning housing and the fixing housing may be made of metal, plastic or other materials.
Optionally, the substrate may be a PCB, a ceramic sheet, or other materials.
Optionally, when the pressure sensing chip is a gauge pressure sensing chip, the base plate is provided with at least one air inlet, the pressure sensing chip is in projection on the base plate covers the air inlet, and the air inlet is used for space gas exchange between the positioning shell and the base plate.
Optionally, the positioning housing and the fixed housing have at least one air inlet hole, and the air inlet hole is used for exchanging air in a space formed by the positioning housing and the fixed housing and the substrate.
Optionally, the bonding mode of the pressure sensing chip and the substrate includes at least one of metal wire bonding and patch bonding.
Optionally, a bonding pad is further disposed on the bottom of the substrate, and the substrate is soldered to an external device through the bonding pad.
Optionally, the pressure sensing chip includes a MEMS piezoresistive or capacitive pressure sensing chip.
In a second aspect, embodiments of the present invention provide an electronic device, including any of the touch force sensors provided in embodiments of the present invention.
In a third aspect, an embodiment of the present invention provides a method for packaging any touch sensor, where the method includes:
binding the pressure sensing chip on the substrate;
bonding the positioning housing on the substrate;
placing the touch force structure in a positioning hole of the positioning shell;
the fixed housing is bonded on the substrate.
According to the embodiment of the invention, the pressure sensing chip is fixedly connected on the substrate, the positioning shell is adhered according to the first adhesive ring, the surface of the positioning shell is provided with the positioning hole, and the touch force structure is placed through the positioning hole so as to be in contact with the touch force sensing film pressing area of the pressure sensing chip. Therefore, the touch force structure is placed in the positioning hole, accurate contact with the touch force sensing film pressing area of the pressure sensing chip can be achieved, packaging efficiency is improved, the touch force structure is utilized to directly contact the film pressing area on the pressure sensing chip, and touch force detection sensitivity of the touch force sensor is improved. The fixed shell is pasted according to the second bonding ring, and a clamping hole is formed in the surface of the fixed shell, so that the touch force structure is prevented from being separated from the touch force sensor.
Drawings
Fig. 1 is a schematic top view of a touch sensor according to an embodiment of the present invention.
Fig. 2 is a schematic side view of a touch force sensor according to an embodiment of the present invention.
Fig. 3 is a schematic side view of another touch sensor according to an embodiment of the present invention.
Fig. 4 is a schematic flowchart of a method for packaging a touch sensor according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic top-view structural diagram of a touch sensor according to an embodiment of the present invention, fig. 2 is a schematic side-view structural diagram of a touch sensor according to an embodiment of the present invention, and fig. 3 is a schematic side-view structural diagram of another touch sensor according to an embodiment of the present invention, with reference to fig. 1, fig. 2, and fig. 3, including: substrate 110, pressure sensing chip 120, positioning housing 130, securing housing 310, and touch structure 140.
The pressure sensing chip 120 is bonded and bound to the substrate 110. The pressure sensing chip 120 is provided with a touch force sensing film area on the surface away from the substrate 110, and the touch force sensing film area is used for detecting the magnitude of touch force.
The positioning housing 130 includes a positioning hole 150, and the positioning housing 130 is adhered to the substrate 110. The touch structure 140 is placed in the registration hole 150 and the touch structure 140 is in contact with the touch sensing die area. The touch force structure 140 is used to feed back touch force to the touch force sensing die area of the pressure sensing die 120.
The fixing housing 310 includes a fixing hole 320, the fixing housing 310 is disposed outside the positioning housing 130, the fixing housing 310 is adhered to the substrate 110, and a vertical projection of the fixing hole 320 on the pressure sensing chip is within a vertical projection of the positioning hole 150 on the pressure sensing chip. The geometric centers of the positioning hole 150, the fixing hole 320 and the contact force sphere 210 are on the same line.
Specifically, the pressure sensing chip 120 is fixedly bonded to the substrate 110, the substrate 110 is used to carry the pressure sensing chip 120, the positioning housing 130 and the touch structure 140, the substrate 110 may be a PCB or a ceramic board, and in general, the PCB is used as the substrate 110 and a PCB copper clad laminate, and the pressure sensing chip 120 is bonded to the surface of the substrate 110. Illustratively, the pressure sensing chip comprises a MEMS pressure sensing chip, the size of the MEMS pressure sensing chip is usually several hundreds of micrometers to several millimeters, the thickness of the pressure sensing diaphragm in the sensing area is several micrometers to several tens of micrometers, the sensing principle can be piezoresistive type or capacitive type, and the application of the miniaturized touch force sensor is facilitated by taking the MEMS pressure sensing chip as a main sensing function. The first adhesive ring 160 is correspondingly disposed on the substrate 110, the pressure sensing chip 120 is surrounded by the first adhesive ring 160, and the positioning shell 130 is adhered according to the first adhesive ring 160, so that a protection space is formed between the positioning shell 130 and the substrate 110, thereby preventing the pressure sensing chip 120 from being collided by external extrusion. Furthermore, a positioning hole 150 is formed in the surface of the positioning housing 130, the positioning hole 150 penetrates through the positioning housing 130, the touch force structure 140 is placed according to the positioning hole 150, and the touch force structure 140 contacts with the touch force sensing film pressing area of the pressure sensing chip 120. The touch force structure 140 serves as a force signal transmission medium, and directly applies the applied external force to the touch force sensing die area of the pressure sensing chip 120, and the touch force sensing die area outputs a sensing signal according to the force signal. Illustratively, the touch force sensing pressure film region is a silicon elastic film, which deforms when subjected to a force, and the resistance bridge of the pressure sensing chip 120 generates a differential voltage output signal in linear proportion to the applied pressure. The shape of the positioning hole 150 is matched with the shape of the contact force structure 140, so that the contact force structure 140 is placed in the positioning hole 150 and can be in contact with the contact force sensing film pressing area of the pressure sensing chip 120, thereby improving the packaging efficiency, and the contact force structure 140 is utilized to directly contact the pressure sensing chip 120, so that the contact force detection sensitivity is improved. Illustratively, the tactile structure 140 is provided as a sphere or a cylinder, and the positioning hole 150 is circular.
The second adhesive ring 330 is correspondingly disposed on the substrate 110, the first adhesive ring 160 is surrounded by the second adhesive ring 330, and the fixing housing 310 is adhered along the second adhesive ring 330, so that the pressure sensing chip 120 is further protected by the protection space formed by the fixing housing 310 and the substrate 110. Furthermore, a fixing hole 320 is formed in the surface of the fixing housing 310, the fixing hole 320 penetrates through the fixing housing 310, and the geometric centers of the fixing hole 320 and the positioning hole 150 are on the same straight line, so that the geometric centers of the positioning hole 150, the fixing hole 320 and the contact force sphere 210 are distributed on the same straight line, a part of the contact force sphere 210 penetrates through the fixing hole 320, the contact position of the fixing hole 320 and the contact force sphere 210 is in a shape of a circle, and the horizontal direction and the vertical direction of the contact force sphere 210 can be limited by the fixing housing 310 and the positioning housing 130, so that the contact force sphere 210 is constantly kept in contact with the contact force sensing film area, and the working stability of the sensor and the sensitivity of sensing feedback are improved.
According to the embodiment of the invention, the pressure sensing chip is fixedly connected on the substrate, the positioning shell is adhered according to the first adhesive ring, the surface of the positioning shell is provided with the positioning hole, and the touch force structure is placed through the positioning hole so as to be in contact with the touch force sensing film pressing area of the pressure sensing chip. Therefore, the touch force structure is placed in the positioning hole, the touch force sensing film pressing area contact with the pressure sensing chip can be achieved, the processing structure is fixed by the aid of the fixing shell, packaging efficiency is improved, the touch force structure is directly contacted with the pressure sensing chip, and touch force detection sensitivity of the touch force sensor is improved.
With continued reference to fig. 2 and 3, optionally, the touch structure 140 includes: a touch force sphere 210, the touch force sphere 210 tangent to the touch force sensing die area. The vertical projection of positioning hole 150 on pressure sensing chip 120 coincides with the vertical projection of touch force sphere 210 on the sensing chip.
Specifically, the contact force sphere 210 is used as a detection point of the external force or the contact force, and an external object contacts the contact force sphere 210 to apply pressure to the contact force sphere 210, and feeds back the pressure to the pressure-sensitive film-pressing part of the pressure sensing chip 120 through the contact force sphere 210, thereby implementing the contact force sensing. For example, the contact force sphere 210 may be a metal steel ball or other hard materials, and the contact force sphere is not easily deformed slightly, so that the magnitude of the contact force can be better fed back, and the sensing accuracy is improved. The vertical projection of the positioning hole 150 in the touch force sensing film area falls into the touch force sensing film area, and the diameter of the positioning hole 150 is equal to the diameter of the touch force sphere 210, so that when the touch force sphere 210 is placed in the positioning hole 150, the touch force sphere 210 is tangent to the touch force sensing film area. The contact force sphere 210 can be constantly kept in contact with the contact force sensing film pressing area through the positioning of the positioning hole 150 on the contact force sphere 210, and in the packaging process, the contact force sphere 210 can be positioned and packaged only by placing the contact force sphere 210 in the positioning hole 150, so that the packaging efficiency is improved.
Optionally, the positioning housing 130 and the fixing housing 310 are fixed on the substrate 110 by an adhesive, and the adhesive includes at least one of glue, solder paste, or conductive adhesive. Specifically, the positioning housing 130 and the fixing housing 310 are respectively fixed along the corresponding bonding ring of the substrate 110 by an adhesive, wherein the adhesive may be glue, solder paste or conductive adhesive, and in practical applications, the adhesive is selected according to needs to realize the fixation.
Optionally, the vertical height difference between the positioning housing 130 and the fixed housing 310 is smaller than the radius of the touch force sphere 210.
Specifically, with continued reference to fig. 2 and 3, assuming that the height difference between the fixed housing 310 and the positioning housing 130 is X and the radius of the contact force sphere 210 is R, the radius R of the fixed hole 320 should satisfy R 2 -X 2 ＝r 2 . Wherein the length of the height difference X ranges between 0 and R. That is, the height of the fixing housing 310 is set within the hemispherical height of the touch force sphere 210 on the side away from the pressure sensing chip 120, so that the partial touch force sphere 210 can pass through the fixing hole 320, and the partial touch force sphere 210 passing through the fixing hole 320 can be used as a detection point of the external pressure. And the movement of the touch force sphere 210 in the vertical direction can be restricted, thereby ensuring the positional stability of the touch force sphere 210.
Referring to fig. 2, optionally, when the pressure sensing chip is a gauge pressure sensing chip, the base plate 110 is provided with at least one air inlet hole 340, a projection of the pressure sensing chip on the base plate 110 covers the air inlet hole 340, and the air inlet hole 340 is used for positioning a space formed by the housing 130 and the base plate 110 for gas exchange.
Specifically, the inlet port sets up on the base plate, and is relative with the back of pressure sensing chip, and inside external gas can pass through inlet port 340 and touch force sensor, formed the circulation of air, and the assurance touches force sensor inside and outside atmospheric pressure etc. and reduces the influence of gas pressure to touch force sensing.
Referring to fig. 3, alternatively, the substrate 110 does not need to be provided with the air inlet hole 340 when the pressure sensing chip is an absolute pressure sensing chip.
Optionally, the bonding manner of the pressure sensing chip 120 and the substrate 110 includes at least one of metal wire bonding and patch bonding.
Specifically, according to the positions and types of the leads of the pressure sensing chip 120 and the substrate 110, the bonding manner may be selected as a patch connection or a metal wire (gold wire, aluminum wire, or alloy wire, etc.) bonding connection. For example, referring to fig. 2 and 3, the embodiment of the invention selects a metal wire bonding manner to perform the bonding connection, where the metal wire bonding is a process of connecting the electrode on the pressure sensing chip 120 with the external lead by using a wire. The pressure sensing chip 120 is firstly bonded to the substrate 110 by the bonding adhesive 121, and then the electrodes of the pressure sensing chip 120 are connected to the external leads by the wires 360. Optionally, a pad is further disposed on the bottom of the substrate 110, and the substrate 110 is electrically connected to an external device through the pad. Specifically, the force signal is transmitted to the touch force sensing die area on the pressure sensing chip 120 through the touch force sphere 210, for example, the touch force sensing die area is set as a silicon elastic film, the silicon elastic film is deformed by stress, under the excitation of external voltage or current, the piezoresistive bridge integrated on the silicon elastic film of the pressure sensing chip 120 generates a differential voltage output signal in linear proportion to the applied pressure, and the signal is connected to an external circuit through the pin 220 of the substrate 110, so as to transmit the sensing signal.
The embodiment of the invention also provides electronic equipment comprising the any touch force sensor provided by the embodiment of the invention. Specifically, the electronic device is an application device composed of electronic components such as an integrated circuit, a PCB, a transistor, a resistor, a capacitor, and the like, and the electronic device has the same beneficial effects in production because the electronic device includes the touch force sensor of the present invention, and details are not repeated herein.
Fig. 4 is a schematic flow chart of a method for packaging a touch sensor according to an embodiment of the present invention, which includes the following specific steps:
and S110, binding the pressure sensing chip on the substrate.
Specifically, the pressure sensing chip is fixedly connected to the substrate by using an adhesive such as glue, the substrate is used for bearing the pressure sensing chip, the positioning housing and the touch force structure, and the pressure electric signal is connected to an external application device from the pressure sensing chip. The bonding mode of the pressure sensing chip and the substrate comprises at least one of metal wire bonding and patch bonding. According to the positions and types of the pins of the pressure sensing chip and the substrate, the binding mode can be selected to be patch connection or metal wire bonding connection. Illustratively, when the bonding manner is wire bonding, the pressure sensing chip is bonded to the substrate by adhesive, and then the metal wire is used to bond the electrode on the pressure sensing chip to the substrate pin.
And S120, adhering a positioning shell on the substrate.
Specifically, a first adhesive ring is correspondingly arranged on the substrate and surrounds the pressure sensing chip, and the positioning shell is adhered along the first adhesive ring, so that the positioning shell and the substrate form a protection space, and the pressure sensing chip is prevented from being extruded and collided by the outside. The positioning shell is provided with the positioning hole, wherein the shape and the size of the positioning hole are matched with those of the touch force structure, the touch force structure is placed in the positioning hole, and the touch force structure can be in contact with the touch force sensing press film area of the pressure sensing chip.
S130, placing a touch force structure in the positioning hole of the positioning shell.
Specifically, the positioning hole penetrates through the positioning shell, the touch force structure is placed according to the positioning hole, and the touch force structure is in contact with the touch force sensing film pressing area of the pressure sensing chip. The touch force structure is used as a force signal transmission medium, the applied external force is directly applied to a touch force sensing film pressing area of the pressure sensing chip, the film pressing deformation is caused by the touch force sensing film pressing area according to the force signal, and then the sensing signal is output according to the piezoresistive or capacitance principle.
And S140, adhering and fixing a shell on the substrate.
Specifically, the second adhesive ring is correspondingly arranged on the substrate, the first adhesive ring is enclosed by the second adhesive ring, and the fixed shell is adhered along the second adhesive ring, so that the pressure sensing chip is further protected by a protection space formed by the fixed shell and the substrate. Further, be provided with the fixed orifices on the fixed casing surface, the fixed orifices runs through fixed casing, the fixed orifices is on the collinear with the geometric centre of locating hole, therefore, the locating hole, the fixed orifices distributes on the collinear with the spheroidal geometric centre of touch force, when touching the power structure and be spherical, the diameter of fixed orifices is less than touches power spheroid diameter, partly touch power spheroid passes the fixed orifices, the fixed orifices is anastomotic with partly touch power spheroid contact position shape, through fixed casing and location shell, can restrict and touch power spheroid horizontal direction and vertical direction position, thereby play and keep constantly touching power spheroid and touch power sensing pressure membrane region and contact, thereby the job stabilization nature of sensor and the sensitivity of sensing feedback have been improved. The step S140 may be selected according to the actual structure or omitted.
According to the embodiment of the invention, the pressure sensing chip is fixedly connected to the substrate, the positioning shell is adhered according to the first adhesive ring, the surface of the positioning shell is provided with the positioning hole, and the touch force structure is placed through the positioning hole, so that the touch force structure is in contact with the touch force sensing film pressing area of the pressure sensing chip. Therefore, the touch force structure is placed in the positioning hole, the touch force sensing film pressing area of the pressure sensing chip can be contacted, the packaging efficiency is improved, the touch force structure is utilized to directly contact the pressure sensing chip, and the touch force detection sensitivity of the touch force sensor is improved.
Finally, it should be noted that: the above examples are only for illustrating the technical solutions of the present invention, and are not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for some of the features described therein. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A touch force sensor, comprising: the device comprises a substrate, a pressure sensing chip, a positioning shell, a touch force structure and a fixed shell;
the pressure sensing chip is bound and connected on the substrate; the surface of the pressure sensing chip, which is far away from the substrate, is provided with a touch force sensing film pressing area, and the touch force sensing film pressing area is used for detecting the size of a touch force;
the positioning shell comprises a positioning hole, and the positioning shell is bonded with the substrate; the touch force structure is placed in the positioning hole and is in contact with the touch force sensing film pressing area; the touch force structure is used for feeding back a touch force to a touch force sensing film pressing area of the pressure sensing chip;
the fixing shell comprises a fixing hole, the fixing shell is arranged outside the positioning shell, the fixing shell is bonded with the substrate, and the vertical projection of the fixing hole on the pressure sensing chip is in the vertical projection of the positioning hole on the pressure sensing chip; the geometric centers of the positioning hole, the fixing hole and the contact force sphere are on the same straight line.
2. A touch force sensor as recited in claim 1, wherein said touch force structure comprises: a touch force sphere tangent to the touch force sensing die area; and the vertical projection of the positioning hole on the pressure sensing chip is superposed with the vertical projection of the contact force sphere on the sensing chip.
3. A touch force sensor according to claim 1, wherein said positioning housing and said securing housing are each secured to said substrate by an adhesive comprising at least one of glue, solder paste or conductive glue.
4. Touch force sensor according to claim 1, characterized in that the vertical height difference between the positioning housing and the fixed housing is smaller than the radius of the touch force sphere.
5. The touch force sensor of claim 1, wherein when the pressure sensor chip is a gauge pressure sensor chip, the base plate is provided with at least one air inlet hole, and a projection of the pressure sensor chip on the base plate covers the air inlet hole, and the air inlet hole is used for air exchange between the positioning housing and the base plate.
6. A touch force sensor according to claim 1, wherein said pressure sensing die is bonded to said substrate in a manner that includes at least one of wire bonding and patch bonding.
7. Touch force sensor according to claim 1, characterized in that the base plate is also provided with pads on its bottom, through which the base plate is soldered to an external device.
8. The touch force sensor of claim 1, wherein the pressure sensing die comprises a MEMS piezoresistive or capacitive pressure sensing die.
9. An electronic device comprising the touch force sensor of any one of claims 1-8.
10. A method of packaging a touch force sensor according to any of claims 1-8, comprising:
binding the pressure sensing chip on the substrate;
bonding the positioning housing on the substrate;
placing the touch force structure in a positioning hole of the positioning shell;
the fixed housing is bonded on the substrate.
CN202211183006.8A 2022-09-27 2022-09-27 Touch force sensor, electronic equipment and packaging method of touch force sensor Pending CN115574996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211183006.8A CN115574996A (en) 2022-09-27 2022-09-27 Touch force sensor, electronic equipment and packaging method of touch force sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211183006.8A CN115574996A (en) 2022-09-27 2022-09-27 Touch force sensor, electronic equipment and packaging method of touch force sensor

Publications (1)

Publication Number Publication Date
CN115574996A true CN115574996A (en) 2023-01-06

Family

ID=84583956

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211183006.8A Pending CN115574996A (en) 2022-09-27 2022-09-27 Touch force sensor, electronic equipment and packaging method of touch force sensor

Country Status (1)

Country Link
CN (1) CN115574996A (en)

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