CN115558437A - UV (ultraviolet) curing conductive material and preparation method thereof - Google Patents
UV (ultraviolet) curing conductive material and preparation method thereof Download PDFInfo
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- CN115558437A CN115558437A CN202211196221.1A CN202211196221A CN115558437A CN 115558437 A CN115558437 A CN 115558437A CN 202211196221 A CN202211196221 A CN 202211196221A CN 115558437 A CN115558437 A CN 115558437A
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- 239000004020 conductor Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 35
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 34
- 229920002635 polyurethane Polymers 0.000 claims abstract description 24
- 239000004814 polyurethane Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052709 silver Inorganic materials 0.000 claims abstract description 19
- 239000004332 silver Substances 0.000 claims abstract description 19
- 239000011231 conductive filler Substances 0.000 claims abstract description 14
- 238000003848 UV Light-Curing Methods 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000178 monomer Substances 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000007822 coupling agent Substances 0.000 claims abstract description 5
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 3
- 238000002156 mixing Methods 0.000 claims description 8
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- BDAHDQGVJHDLHQ-UHFFFAOYSA-N [2-(1-hydroxycyclohexyl)phenyl]-phenylmethanone Chemical compound C=1C=CC=C(C(=O)C=2C=CC=CC=2)C=1C1(O)CCCCC1 BDAHDQGVJHDLHQ-UHFFFAOYSA-N 0.000 claims description 3
- YMCOIFVFCYKISC-UHFFFAOYSA-N ethoxy-[2-(2,4,6-trimethylbenzoyl)phenyl]phosphinic acid Chemical compound CCOP(O)(=O)c1ccccc1C(=O)c1c(C)cc(C)cc1C YMCOIFVFCYKISC-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 claims description 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims description 2
- -1 4-methylthiophenyl Chemical group 0.000 claims description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 2
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 claims description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 2
- 125000005442 diisocyanate group Chemical group 0.000 claims description 2
- 150000002009 diols Chemical class 0.000 claims description 2
- VPASWAQPISSKJP-UHFFFAOYSA-N ethyl prop-2-enoate;isocyanic acid Chemical compound N=C=O.CCOC(=O)C=C VPASWAQPISSKJP-UHFFFAOYSA-N 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims 1
- 239000012957 2-hydroxy-2-methyl-1-phenylpropanone Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 24
- 230000001070 adhesive effect Effects 0.000 abstract description 24
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 238000001723 curing Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical compound C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 241000234282 Allium Species 0.000 description 1
- 235000002732 Allium cepa var. cepa Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DTGKSKDOIYIVQL-MRTMQBJTSA-N Isoborneol Natural products C1C[C@@]2(C)[C@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-MRTMQBJTSA-N 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- CKDOCTFBFTVPSN-UHFFFAOYSA-N borneol Natural products C1CC2(C)C(C)CC1C2(C)C CKDOCTFBFTVPSN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Abstract
The invention provides a UV curing conductive material and a preparation method thereof, wherein the raw materials of the conductive material comprise, by mass, 20-50% of polyurethane acrylate, 10-30% of acrylic monomer, 2-5% of photoinitiator, 0.5-5% of coupling agent, 0.5-2% of flatting agent, 15-50% of conductive filler and 0.2-0.5% of defoaming agent; wherein the polyurethane acrylate comprises 2-functionality-degree polyurethane acrylate and 9-functionality-degree polyurethane acrylate, and the mass ratio of the 2-functionality-degree acrylate to the 9-functionality-degree acrylate is 3-10: 1; the conductive filler is composed of micron flaky silver-coated copper powder and micron spherical silver powder, and the mass ratio of the flaky silver-coated copper powder to the spherical silver powder is (2-10): 1; the UV curing conductive material provided by the invention not only has excellent conductivity, but also has high surface hardness, good wear resistance and good adhesive force, and can be widely applied to coating of various base materials.
Description
Technical Field
The invention relates to the technical field of conductive adhesives, in particular to a UV (ultraviolet) curing conductive material and a preparation method thereof.
Background
With the rapid development of the electronic industry, the microelectronic packaging technology is developing in the direction of high speed, high density, light weight and miniaturization, and some conventional soldering materials such as Sn-Pb are far from meeting the technical requirement of such refinement, so that research and development of new materials with low energy consumption and environmental friendliness have become a necessary development trend.
And the conductive paste is called a new connecting material replacing Sn-Pb solder with its excellent characteristics. The conductive adhesive is a composite material of a high-molecular polymer and conductive particles, wherein the polymer endows the connection performance and the conductive particles endow the conductive performance. The conductive adhesive has certain toughness, can reduce and eliminate thermal stress, improves the reliability of devices, and meets the requirement of fine line connection of electronic components. According to the curing system, the conductive adhesive may be classified into a room temperature curing conductive adhesive, a medium temperature curing conductive adhesive, a high temperature curing conductive adhesive, a UV (ultraviolet) curing conductive adhesive, and the like. Compared with the common conductive adhesive, the ultraviolet curing conductive adhesive combines an ultraviolet curing technology with the conductive adhesive, endows the conductive adhesive with new performance and expands the application range of the conductive adhesive. The method has the characteristics of low curing temperature, high curing speed, simple equipment and the like, and has the advantages of small environmental pollution, low energy consumption, high efficiency and good chemical stability because the synthetic process does not contain solvent and heating is not needed during curing. For example, patent CN112358841a discloses a UV-cured transparent conductive adhesive, which provides a flexible conductive adhesive with excellent properties such as high transparency, bending resistance, excellent heat resistance and high adhesion, and has the characteristics of UV and thermal curing, but the property of thermal curing is required, which affects the reliability of electronic components and has poor dual-curing storage stability; patent CN105838310a discloses a UV-cured carbon/silver coated copper conductive adhesive for onions, which has the advantages of simple preparation process, high curing speed and environmental protection, but is poor in flexibility, low in adhesive force and high in resistivity.
Therefore, the development of a UV conductive material with excellent comprehensive performance, i.e., excellent conductivity, adhesion, flexibility and hardness, for electronic devices and electronic components is urgently needed to meet the development needs of the electronic industry, and has great significance.
Disclosure of Invention
Based on the technical problems in the prior art, the invention provides a UV-curable conductive material which has good flexibility and adhesion and low resistivity and can be widely applied to coating of various substrates.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the UV curing conductive material comprises the following raw materials in percentage by weight:
wherein the urethane acrylate comprises 2-functionality urethane acrylate and 9-functionality urethane acrylate, and the weight ratio of the 2-functionality acrylate to the 9-functionality acrylate is 3-10: 1; the conductive filler comprises micron flaky silver-coated copper powder and micron spherical silver powder, wherein the weight ratio of the flaky silver-coated copper powder to the spherical silver powder is (2-10): 1.
in some embodiments, the 2-functionality urethane acrylate has a viscosity of 2000 to 8000cps at 60 ℃; the 9-functionality polyurethane acrylate has a viscosity of 8000-15000 cps at 60 deg.C.
In some embodiments, the 2-functionality polyurethane acrylate polyester diol is prepared by reacting an isocyanate ethyl acrylate; the 9-functionality-degree polyurethane acrylate is prepared by reacting trihydroxy polyether ester, diisocyanate and pentaerythritol triacrylate; the trihydroxy polyether ester is prepared by reacting one or two of ethylene oxide or propylene oxide with dimethylolpropionic acid.
In some embodiments, the 2-functional polyurethane acrylate is one or more of guangzhou australian FSP8672, FSP8240, FSP8750, baojun chemical QF061, 2213, 2892, and the 9-functional polyurethane acrylate is one or two of U.S. sandoma CN9013S, guangzhou australian FSP 73298.
In some embodiments, the flake silver-coated copper powder is 1 to 20 μm; the grain diameter of the spherical silver powder is 1-5 mu m.
In some embodiments, the acrylic monomer comprises at least one of acryloyl morpholine, isobornyl acrylate, tetrahydrofurfuryl acrylate, cyclotrimethylolpropane formal acrylate, isooctyl acrylate, isononyl acrylate.
In some embodiments, the photoinitiator comprises at least one of 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester, 2-hydroxy-2-methyl-1-phenyl acetone, 1-hydroxycyclohexyl benzophenone, bis (2,4,6-trimethylbenzoyl) phenylphosphorus oxide, 2-methyl-1- (4-methylthiophenyl) -2-morpholin-1-one, a' -dimethylbenzyl ketal, isopropyl thioxanthone.
In some embodiments, the coupling agent comprises at least one of KH550, KH560, KH 570.
In some embodiments, the leveling agent comprises at least one of BYK330, BYK354, leid Rad1705, leid Rad1707, leid Rad 152.
In some embodiments, the defoamer comprises at least one of BYK-A555, BYK054, BYK-024, digao-N, digao 833, FOAM BAN 3633E, FOAM BAN 155
The invention also provides a preparation method of the UV-curable conductive material of any one of the embodiments, which comprises the following steps:
s1, uniformly mixing the polyurethane acrylate, an acrylic monomer, a leveling agent and a defoaming agent according to the raw material ratio to obtain an active mixed system;
s2, uniformly mixing the photoinitiator and the coupling agent, and adding the mixture into the active mixed system to obtain an active organic carrier;
s3, adding the conductive filler into the active organic carrier, and uniformly mixing to obtain a conductive material;
and S4, vacuumizing the conductive filler to obtain the uniform bubble-free conductive material.
Compared with the prior art, the invention has the following beneficial effects:
in the technical scheme of the invention, the 2-functionality polyurethane acrylate and the 9-functionality polyurethane acrylate are mixed according to a specific proportion for use, so that the conductive adhesive has excellent strength, adhesive force, flexibility, surface hardness and wear resistance; the use of the 2-functionality-degree acrylate endows the conductive adhesive with excellent strength, bonding force and flexibility, the addition of the 9-functionality-degree polyurethane acrylate can improve the crosslinking degree, intermolecular shrinkage force is formed by crosslinking and curing, so that a more compact conductive channel can be formed by the conductive filler filled among molecules of the conductive adhesive, the conductive performance of the conductive adhesive is improved, and intermolecular force is improved by crosslinking and curing, so that the hardness and the wear resistance of the conductive adhesive are improved. By adding the acrylic acid monomer, the curing efficiency of the conductive material can be improved, and the effects of diluting and adjusting viscosity are achieved, so that the dispersion of the solid conductive filler in the polyurethane acrylate is facilitated, the resistivity is reduced, and the conductivity of the conductive material is improved; the conductive filler is composed of flake silver-coated copper powder and spherical silver powder in a specific mass ratio, the polyurethane acrylate is used as a carrier of the conductive filler, the flake silver-coated copper powder forms a conductive channel in line contact or surface contact in the molecular gap of the polyurethane acrylate, larger contact area and contact probability can be provided, the conductivity of the conductive material is higher, the percolation threshold value is lower, a certain amount of spherical silver powder is added to fill in the gap of the conductive channel formed by the flake silver-coated copper, the thickness of an isolation layer can be further reduced, the contact probability can be further improved, the resistance of the conductive material is further reduced, and the conductivity of the conductive material is improved.
The UV curing conductive material provided by the invention not only has excellent conductivity, but also has good flexibility, excellent adhesion, surface hardness and wear resistance, and can be widely applied to coating of various base materials.
The preparation method of the UV curing conductive material provided by the invention is simple in preparation process and applicable to industrial production.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms than those specifically described herein, and it will be apparent to those skilled in the art that many more modifications are possible without departing from the spirit and scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1
The UV-curable conductive material comprises the following raw materials:
wherein the flaky silver-coated copper powder is 15 μm, and the particle size of the spherical silver powder is 5 μm;
the preparation method of the UV-curable conductive material of the present embodiment includes the following steps:
s1, uniformly mixing 2-functionality polyurethane acrylate, 9-functionality polyurethane acrylate, isoborneol acrylate, tetrahydrofurfuryl acrylate, leAd Rad152 and Digao-N according to a raw material ratio to obtain an active mixed system;
s2, mixing and uniformly stirring 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester, 1-hydroxycyclohexyl benzophenone and KH550, and adding the mixture into the active mixed system obtained in the step S1 to obtain an active organic carrier;
and S3, adding the silver-coated copper powder and the silver powder into the active organic carrier obtained in the step S2 according to the ratio, uniformly stirring, and then vacuumizing to obtain the uniform bubble-free conductive material.
Example 2
A UV-curable conductive material comprising the following components:
wherein the flaky silver-coated copper powder is 15 μm, and the particle diameter of the spherical silver powder is 5 μm.
The method of manufacturing the conductive material of this example is the same as that of example 1.
Example 3
A UV-curable conductive material comprising the following components:
wherein the flaky silver-coated copper powder is 15 μm, and the particle diameter of the spherical silver powder is 5 μm.
The method of manufacturing the conductive material of this example is the same as that of example 1.
Example 4
A UV-curable conductive material comprising the following components:
wherein the flaky silver-coated copper powder is 15 μm, and the particle diameter of the spherical silver powder is 5 μm.
Comparative example 1
Comparative example 1 differs from example 1 in that the conductive filler is added to 260g of only 15 μm flake-like silver-coated copper powder; the preparation method was the same as that of example 1.
Comparative example 2
Comparative example 2 differs from example 1 in that the conductive filler was 235g of 15 μm flake-like silver-coated copper powder and 25g of 5 μm flake-like silver powder; the preparation method was the same as that of example 1.
Comparative example 3
The ratio of the 2 functionality to the 9 functionality is 12:1, other conditions were the same as in example 1.
The conductive materials obtained in the examples and comparative examples were subjected to the relevant performance tests as follows, and the test results are shown in table 1.
The conductive materials obtained in examples and comparative examples were coated on a glass substrate and placed at a wavelength of 395nm and 4000mW/cm 2 And (4) curing under an ultraviolet intensity UV curing machine. And (3) performance testing:
resistivity: reference is made to GB/1410-2006 test methods for solid insulation volume resistivity and surface resistivity.
Pencil hardness: the hardness of the coating pencil is determined by referring to a GB 6739-86 coating pencil hardness method
Adhesion force: reference/T1720-88 coating adhesion assay. The classification is 7 grades, the best grade 1 and the worst grade 7.
Wear resistance: RCA test, 175g,500 + -50 times.
Table 1 resistivity test results of examples and comparative examples
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. The UV curing conductive material is characterized by comprising the following raw materials in percentage by weight:
the polyurethane acrylate comprises 2-functionality polyurethane acrylate and 9-functionality polyurethane acrylate, and the mass ratio of the 2-functionality acrylate to the 9-functionality acrylate is 3-10: 1; the conductive filler comprises micron flaky silver-coated copper powder and micron spherical silver powder, wherein the mass ratio of the flaky silver-coated copper powder to the spherical silver powder is (2-10): 1.
2. the UV curable conductive material according to claim 1, wherein the 2-functional urethane acrylate has a viscosity of 2000 to 8000cps at 60 ℃; the 9-functionality polyurethane acrylate has a viscosity of 8000-15000 cps at 60 deg.C.
3. The UV-curable conductive material according to claim 1, wherein the 2-functional urethane acrylate is prepared by reacting polyester diol with isocyanate ethyl acrylate; the 9-functionality-degree polyurethane acrylate is prepared by reacting trihydroxy polyether ester, diisocyanate and pentaerythritol triacrylate; the trihydroxy polyether ester is prepared by reacting one or two of ethylene oxide or propylene oxide with dimethylolpropionic acid.
4. The UV-curable conductive material according to claim 1, wherein the flake silver-coated copper powder is 1 to 20 μm; the grain diameter of the spherical silver powder is 1-5 mu m.
5. The UV-curable conductive material according to claim 1, wherein the acrylic monomer comprises at least one of acryloyl morpholine, isobornyl acrylate, tetrahydrofurfuryl acrylate, cyclotrimethylolpropane formal acrylate, isooctyl acrylate, and isononyl acrylate.
6. The UV-curable conductive material according to claim 1, wherein the photoinitiator comprises at least one of 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester, 2-hydroxy-2-methyl-1-phenylpropanone, 1-hydroxycyclohexyl benzophenone, bis (2,4,6-trimethylbenzoyl) phenylphosphorus oxide, 2-methyl-1- (4-methylthiophenyl) -2-morpholin-1-one, a' -dimethylbenzyl ketal, and isopropylthioxanthone.
7. The UV-curable conductive material according to claim 1, wherein the coupling agent comprises at least one of KH550, KH560 and KH 570.
8. The UV-curable conductive material according to claim 1, wherein the leveling agent comprises at least one of BYK330, BYK354, leAd Rad1705, leAd Rad1707, leAd Rad 152.
9. The method for producing a UV curable conductive material according to any one of claims 1 to 8, comprising the steps of:
s1, uniformly mixing the polyurethane acrylate, an acrylic monomer, a leveling agent and a defoaming agent according to the raw material ratio to obtain an active mixed system;
s2, uniformly mixing the photoinitiator and the coupling agent, and adding the mixture into the active mixed system to obtain an active organic carrier;
s3, adding the conductive filler into the active organic carrier, and uniformly mixing to obtain a conductive material;
and S4, vacuumizing the conductive filler to obtain the uniform bubble-free conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211196221.1A CN115558437A (en) | 2022-09-29 | 2022-09-29 | UV (ultraviolet) curing conductive material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211196221.1A CN115558437A (en) | 2022-09-29 | 2022-09-29 | UV (ultraviolet) curing conductive material and preparation method thereof |
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| CN110699969A (en) * | 2019-09-26 | 2020-01-17 | 江苏利田科技股份有限公司 | Ultraviolet-curing coating adhesive for textile fabric based on multifunctional polyurethane acrylate and preparation method and application thereof |
| CN110714336A (en) * | 2019-09-26 | 2020-01-21 | 江苏利田科技股份有限公司 | 9-functionality-degree PUA-based ultraviolet-curing coating adhesive for textile fabric and preparation method and application thereof |
| JP2020094170A (en) * | 2018-12-06 | 2020-06-18 | 東洋インキＳｃホールディングス株式会社 | Conductive composition for molded film, molded film and production method of the same, and molded article and production method of the same |
| CN112795285A (en) * | 2020-12-28 | 2021-05-14 | 中海油常州涂料化工研究院有限公司 | Ultraviolet curing coating and preparation method thereof |
| CN113066600A (en) * | 2021-03-24 | 2021-07-02 | 北京梦之墨科技有限公司 | Conductive paste and electronic device |
| CN113621339A (en) * | 2021-08-05 | 2021-11-09 | 上海昀通电子科技有限公司 | Photochromic welding spot protective adhesive and preparation method and application thereof |
| CN114864178A (en) * | 2022-04-25 | 2022-08-05 | 深圳市通泰盈科技股份有限公司 | UV (ultraviolet) curing conductive silver paste and preparation method thereof |
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| JP2020094170A (en) * | 2018-12-06 | 2020-06-18 | 東洋インキＳｃホールディングス株式会社 | Conductive composition for molded film, molded film and production method of the same, and molded article and production method of the same |
| CN110699969A (en) * | 2019-09-26 | 2020-01-17 | 江苏利田科技股份有限公司 | Ultraviolet-curing coating adhesive for textile fabric based on multifunctional polyurethane acrylate and preparation method and application thereof |
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