CN115542609B

CN115542609B - Light source assembly and backlight module

Info

Publication number: CN115542609B
Application number: CN202211241791.8A
Authority: CN
Inventors: 陈如星; 柯耀作
Original assignee: Xiamen Tianma Microelectronics Co Ltd
Current assignee: Xiamen Tianma Microelectronics Co Ltd
Priority date: 2022-10-11
Filing date: 2022-10-11
Publication date: 2024-01-26
Anticipated expiration: 2042-10-11
Also published as: CN115542609A

Abstract

The invention discloses a light source assembly and a backlight module, which belong to the technical field of luminous display, wherein the light source assembly comprises a light bar and a flexible circuit board, and the flexible circuit board is in binding electric connection with the light bar in a non-light source area of the light source assembly; the light bar comprises a first substrate and a first circuit layer, the light bar of the light source area comprises a plurality of light sources, and the flexible circuit board comprises a second substrate and a second circuit layer; in the non-light source region, the first substrate comprises a first hollowed-out portion penetrating at least the thickness of the first substrate and exposing the first circuit layer, the second substrate comprises a second hollowed-out portion penetrating at least the thickness of the second substrate and exposing the second circuit layer, the first hollowed-out portion comprises a first edge close to the light source region, the second hollowed-out portion comprises a second edge close to the light source region, the first hollowed-out portion and the second hollowed-out portion at least partially overlap, and the first edge and the second edge do not overlap. The backlight module comprises the light source component. The invention can reduce the fracture and failure probability of the backlight light source component and improve the yield and performance of the product.

Description

Light source assembly and backlight module

Technical Field

The invention relates to the technical field of luminous display, in particular to a light source assembly and a backlight module.

Background

The backlight module is one of the components in the liquid crystal display device, and the light source is the core device of the backlight module. The light source generally comprises a flexible circuit board and a light bar, and the flexible circuit board is used for transmitting a light-emitting signal output by the control chip to the light bar. The flexible circuit board (Flexible Printed Circuit Board) is called a flexible board for short, and is called an FPC in industry, and is a printed circuit board made of flexible insulating base materials (mainly polyimide or polyester films). The flexible printed circuit board can be freely bent, rolled and folded, has the advantages of small volume, light weight, heat dissipation, weldability, easiness in assembly and connection, lower comprehensive cost and the like, has certain market advantages compared with a hard board, and is suitable for the requirements of the development of electronic products in the high-density, miniaturized and high-reliability directions. The welding finger of the flexible circuit board is connected with other structural bodies through soldering tin, and the product function is realized by conducting current.

However, in the prior art, because the anti-stress capability of the welding position of the flexible circuit board is low, the problems of breakage, gold finger separation, welding position falling and the like are easy to occur in the production, transportation and assembly processes, and the false welding is caused, so that the short circuit and the open circuit of the product are caused, the transmission of luminous signals is influenced, and the backlight function is disabled.

Therefore, the light source assembly and the backlight module, which can reduce the probability of breakage and failure of the backlight source assembly and improve the yield and performance of products by reducing the contact stress of the welding position of the flexible circuit board, are provided, and are technical problems to be solved by those skilled in the art.

Disclosure of Invention

In view of this, the invention provides a light source assembly and a backlight module, which are used for solving the problems that the stress resistance of the welding position of a flexible circuit board in the prior art is low, and the poor welding easily occurs, so that the backlight function is invalid and the product performance is affected.

The invention discloses a light source component, which comprises: the light source assembly comprises a light source area and a non-light source area; in the non-light source area, the flexible circuit board is in binding electric connection with the light bar; the light bar comprises a first substrate and a first circuit layer positioned at one side of the first substrate, the light bar of the light source area comprises a plurality of light sources, and the light sources are positioned at one side of the first circuit layer away from the first substrate; the flexible circuit board comprises a second substrate and a second circuit layer positioned at one side of the second substrate, the second substrate is positioned at one side of the first substrate, which is away from the first circuit layer, and the second circuit layer is positioned at one side of the second substrate, which is away from the first substrate; in the non-light source region, the first substrate comprises a first hollowed-out part, and the first hollowed-out part at least penetrates through the thickness of the first substrate to expose the first circuit layer; the second substrate comprises a second hollowed-out part, and the second hollowed-out part at least penetrates through the thickness of the second substrate to expose the second circuit layer; in the direction parallel to the plane of the first substrate, the first hollowed-out part comprises a first edge close to the light source area, and the second hollowed-out part comprises a second edge close to the light source area; in the direction perpendicular to the plane of the first substrate, the area of the first hollowed-out part and the area of the second hollowed-out part are at least partially overlapped, and the first edge and the second edge are not overlapped.

Based on the same inventive concept, the invention also discloses a backlight module, which comprises the light source assembly.

Compared with the prior art, the light source assembly and the backlight module provided by the invention have the advantages that at least the following effects are realized:

the light source assembly comprises a light bar and a flexible circuit board, wherein the light bar of a light source area of the light source assembly comprises a plurality of light sources, the light source area can be understood as an area, in the light source assembly, of the light bar, a plurality of light sources are arranged on the light bar, the non-light source area can be understood as an area, in the light source assembly, outside the light sources, of the light bar, and an area, in which the flexible circuit board is located, of the light source area, and the flexible circuit board is electrically connected with the light bar in a binding mode in the non-light source area, so that the light emitting effect of the light source in the light source area is prevented from being influenced. After the flexible circuit board of the light source assembly is bound and electrically connected with the light bar, the light-emitting signals output by the control chip arranged on the flexible circuit board are transmitted to the light bar so as to drive a plurality of light sources on the light bar to emit light, and the effect of providing a backlight light source is achieved. In the non-light source region of the light source assembly, the first substrate of the light bar comprises a first hollowed-out portion, and the first hollowed-out portion can be understood as a region of the light bar facing one side of the flexible circuit board, where the first circuit layer is exposed. The second substrate of the flexible circuit board comprises a second hollowed-out portion, and the second hollowed-out portion can be understood as an area of the flexible circuit board facing one side of the light bar, where the second circuit layer is exposed. The invention is arranged in a direction parallel to the plane of the first substrate, the first hollowed-out part comprises a first edge close to the light source area, and the second hollowed-out part comprises a second edge close to the light source area; in the direction perpendicular to the plane of the first substrate, the area of the first hollowed-out part and the area of the second hollowed-out part are at least partially overlapped, the first edge and the second edge are not overlapped, namely, the boundary of the first hollowed-out part, which is used for exposing the first circuit layer, of the light bar towards one side of the flexible circuit board is staggered with the boundary of the second hollowed-out part, which is used for exposing the second circuit layer, of the flexible circuit board towards one side of the light bar, so that when the first substrate and the second substrate are overlapped to realize the binding electric connection of the light bar and the flexible circuit board, the boundary stress of the hollowed-out part is dispersed, the stress concentration is reduced, and even when the first substrate and the second substrate are overlapped to bind the light bar and the flexible circuit board, the problem of breakage of the first edge, which is close to the light source area, is close to the second edge, which is close to the light source area, is caused by the stress concentration is reduced, is further beneficial to reducing the hollowed-out, the probability of false welding after the binding of the light bar and the flexible circuit board is improved, and the luminous effect of the light source component is ensured.

Of course, it is not necessary for any one product to practice the invention to achieve all of the technical effects described above at the same time.

Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic plan view of a light source assembly according to an embodiment of the present invention;

FIG. 2 is a schematic view of the cross-sectional structure in the direction A-A' of FIG. 1;

FIG. 3 is an enlarged view of a portion of the light bar of FIG. 1 at a first hollowed-out portion;

fig. 4 is a partial enlarged view of a second hollowed-out portion of the flexible circuit board in fig. 1;

FIG. 5 is a schematic view of a partial cross-sectional structure of the light bar of FIGS. 3 and 4 after being bonded to a flexible circuit board;

FIG. 6 is a schematic view of another cross-sectional structure in the direction A-A' of FIG. 1;

FIG. 7 is a schematic view of another cross-sectional structure in the direction A-A' of FIG. 1;

FIG. 8 is a schematic view of another planar structure of a light source assembly according to an embodiment of the present invention;

FIG. 9 is a schematic view showing a sectional structure in the direction B-B' in FIG. 8;

FIG. 10 is a schematic view of a partial enlarged structure of the light bar in FIG. 8 within the first hollow portion;

FIG. 11 is a schematic view of the cross-sectional structure in the direction C-C' of FIG. 8;

FIG. 12 is a schematic view of a partial enlarged structure of the region of the first subsection in FIG. 8;

fig. 13 is a schematic plan view of a backlight module according to an embodiment of the invention.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims (the claims) and their equivalents. The embodiments provided by the embodiments of the present invention may be combined with each other without contradiction.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic plan view of a light source assembly according to an embodiment of the present invention, fig. 2 is a schematic sectional view of A-A' in fig. 1 (it can be understood that, for clarity of illustrating the structure of the embodiment, transparency filling is performed in fig. 1), a light source assembly 000 according to the embodiment includes: a light bar 10 and a flexible wiring board 20, the light source assembly 000 includes a light source area FA and a non-light source area NFA; in the non-light source area NFA, the flexible circuit board 20 is electrically connected with the light bar 10 in a binding manner;

The light bar 10 comprises a first substrate 101 and a first circuit layer 102 positioned on one side of the first substrate 101, the light bar 10 of the light source area FA comprises a plurality of light sources 100, and the light sources 100 are positioned on one side of the first circuit layer 102 facing away from the first substrate 101;

the flexible circuit board 20 comprises a second substrate 201 and a second circuit layer 202 positioned on one side of the second substrate 201, wherein the second substrate 201 is positioned on one side of the first substrate 101 away from the first circuit layer 102, and the second circuit layer 202 is positioned on one side of the second substrate 201 away from the first substrate 101;

in the non-light source area FA, the first substrate 101 includes a first hollowed-out portion 101K, where the first hollowed-out portion 101K at least penetrates through the thickness of the first substrate 101 to expose the first circuit layer 102; the second substrate 201 includes a second hollowed-out portion 201K, where the second hollowed-out portion 201K at least penetrates through the thickness of the second substrate 201 to expose the second circuit layer 202;

in a direction X parallel to a plane of the first substrate 101, the first hollowed-out portion 101K includes a first edge 101K1 adjacent to the light source area FA, and the second hollowed-out portion 201K includes a second edge 201K1 adjacent to the light source area FA;

in the direction Z perpendicular to the plane of the first substrate 101, the area where the first hollowed-out portion 101K is located and the area where the second hollowed-out portion 201K is located at least partially overlap, and the first edge 101K1 and the second edge 201K1 do not overlap.

Specifically, the light source assembly 000 provided in this embodiment may be applied to a backlight module of a liquid crystal display device, and provide a backlight source for the backlight module, so that the liquid crystal display device changes the polarization state of light rays of the backlight module including the light source assembly 000, and realizes penetration and blocking of a light path by means of upper and lower polarizers disposed outside the liquid crystal display device to control the light transmission amount, and finally refracts the light rays of the backlight module to generate a display screen. The light source assembly 000 of the present embodiment includes the light bar 10 and the flexible circuit board 20, wherein the light source assembly 000 includes a light source area FA and a non-light source area NFA, the light bar 10 of the light source area FA includes a plurality of light sources 100, and the light sources 100 may be a chip with a light emitting function such as a light emitting diode, etc., which is not limited in this embodiment. The light source area FA of the light source assembly 000 can be understood as an area of the light source assembly 000 where the light bar 10 is provided with a plurality of light sources 100, and the arrangement mode of the plurality of light sources 100 on the light bar 10 is not limited in this embodiment, and when the backlight module applying the light source assembly 000 is a side-in backlight, the plurality of light sources 100 can be arranged in a long strip form to form the light bar structure shown in this embodiment; alternatively, in other alternative embodiments, the backlight module to which the light source assembly 000 is applied may be a direct type backlight, and the plurality of light sources 100 may be arranged in an array to form the light bar structure shown in this embodiment, which is not limited in this embodiment. It should be understood that fig. 1 of the present embodiment illustrates the structure of the light bar 10 of the present embodiment by arranging a plurality of light sources 100 in a strip structure. The non-light source area NFA of the light source assembly 000 can be understood as an area of the light source assembly 000 except for the plurality of light sources 100 on the light bar 10 and an area of the flexible circuit board 20, where the flexible circuit board 20 of the embodiment is electrically connected with the light bar 10 in a binding manner in the non-light source area NFA, so as to avoid affecting the light emitting effect of the light sources 100 in the light source area FA. After the flexible circuit board 20 of the light source assembly 000 of the present embodiment is electrically connected to the light bar 10, the light emitting signals output by a control chip (not illustrated) disposed on the flexible circuit board 20 are transmitted to the light bar 10, so as to drive the light sources 100 on the light bar 10 to emit light, so as to achieve the effect of providing backlight light sources.

The light bar 10 of this embodiment includes a first substrate 101 and a first circuit layer 102 located on one side of the first substrate 101, where the plurality of light sources 100 are located on one side of the first circuit layer 102 facing away from the first substrate 101, and the first substrate 101 may be used as a protective layer of the light bar 10 to protect the first circuit layer 102 of the light bar 10, and the first circuit layer 102 located on one side of the first substrate 101 is used to set a driving circuit for driving the light sources 100 to emit light, so as to provide light signals for the plurality of light sources 100 on one side of the first circuit layer 102 facing away from the first substrate 101.

The flexible circuit board 20 of this embodiment includes a second substrate 201 and a second circuit layer 202 located on one side of the second substrate 201, where the second substrate 201 is located on one side of the first substrate 101 away from the first circuit layer 102, and the second circuit layer 202 is located on one side of the second substrate 201 away from the first substrate 101, and the second substrate 201 may serve as a protection layer of the flexible circuit board 20 to protect the second circuit layer 202 of the flexible circuit board 20, and the second circuit layer 202 located on one side of the second substrate 201 is used to set a signal routing structure for transmitting a light-emitting signal, so that after the flexible circuit board 20 is electrically connected with the light bar 10 in a non-light source area NFA binding manner, the signal routing structure of the second circuit layer 202 transmits a signal for driving the light to the first circuit layer 102 of the light bar 10 and to the plurality of light sources 100 on the light bar 10 to drive the light sources 100 on the light bar 10 to emit light.

In the non-light source area FA of the light source assembly 000, the first substrate 101 of the light bar 10 includes a first hollowed-out portion 101K, the first hollowed-out portion 101K at least penetrates through the thickness of the first substrate 101 to expose the first circuit layer 102, that is, the first hollowed-out portion 101K can be understood as an area of the light bar 10 facing the flexible circuit board 20 and exposing the first circuit layer 102. In the non-light source area FA of the light source assembly 000, the second substrate 201 of the flexible circuit board 20 includes a second hollowed-out portion 201K, the second hollowed-out portion 201K penetrates at least through the thickness of the second substrate 201, and the second circuit layer 202 is exposed, that is, the second hollowed-out portion 201K can be understood as an area of the flexible circuit board 20 facing the light bar 10, where the second circuit layer 202 is exposed. Optionally, the first hollow portion 101K exposing the first circuit layer 102 may be provided with an effective bonding pad (not numbered in the drawing) of the light bar 10, the second hollow portion 201K exposing the second circuit layer 202 may be provided with an effective bonding portion (not numbered in the drawing) of the flexible circuit board 20, and by bonding the effective bonding pad of the first hollow portion 101K and the effective bonding portion of the second hollow portion 201K in a one-to-one correspondence manner, a fixed structure that the flexible circuit board 20 and the light bar 10 are electrically connected in a non-light source area NFA is realized, and a light emitting signal output by a control chip disposed on the flexible circuit board 20 is sequentially transmitted to a driving circuit of the first circuit layer 102 in the light bar 10 through a signal routing of the second circuit layer 202 in the flexible circuit board 20, the effective bonding portion of the second hollow portion 201K, and the effective bonding pad on the light bar 10, so as to control the light source 100 on the light bar 10 to emit light.

In the prior art, after the flexible circuit board and the lamp strip are bound and fixed, the flexible circuit board is also required to be bent to the back of the component for facilitating subsequent assembly, the bent flexible circuit board can generate a pulling force on the lamp strip at the moment, after the effective welding part and the corresponding effective welding pad are welded through a welding process, visual appearance inspection, rosin water wiping and other processing procedures are generally required, so that operators inevitably have actions of manually stirring the welding position and pulling the welding position, the flexible circuit board and the welding position of the lamp strip are caused to be broken, namely, the finished product is easy to generate a cold welding problem in the subsequent assembly process, the yield of the product is reduced, and the light emitting quality and the light emitting effect are not effectively ensured.

In order to solve the above-mentioned problem, the present embodiment is disposed in a direction X parallel to the plane of the first substrate 101, the first hollowed-out portion 101K includes a first edge 101K1 near the light source area FA, and the second hollowed-out portion 201K includes a second edge 201K1 near the light source area FA; in the direction Z perpendicular to the plane of the first substrate 101, the area where the first hollowed-out portion 101K is located and the area where the second hollowed-out portion 201K is located are at least partially overlapped, the first edge 101K1 and the second edge 201K1 are not overlapped, that is, the boundary of the first hollowed-out portion 101K of the light bar 10 facing the flexible circuit board 20 side for exposing the first circuit layer 102 is staggered with the boundary of the second hollowed-out portion 201K of the flexible circuit board 20 facing the light bar 10 side for exposing the second circuit layer 202, so that when the first substrate 101 and the second substrate 201 are overlapped to realize the binding electrical connection of the light bar 10 and the flexible circuit board 20, the boundary stress of the hollowed-out parts is dispersed, so that stress concentration is reduced, even when the first substrate 101 and the second substrate 201 are overlapped to bind and electrically connect the light bar 10 and the flexible circuit board 20, the fracture problem caused by stress concentration of the first edge 101K1, close to the light source area FA, of the first hollowed-out part 101K and the second edge 201K, close to the light source area FA, of the second hollowed-out part 201K can be reduced, the probability of cold joint after binding the light bar 10 and the flexible circuit board 20 is reduced, the product yield is improved, and the luminous effect of the light source assembly 000 is ensured.

It should be understood that, in fig. 1 of the present embodiment, only the first hollow portion 101K of the first substrate 101 and the second hollow portion 201K of the second substrate 201 are illustrated as square examples, and in specific implementation, the shapes of the first hollow portion 101K and the second hollow portion 201K of the first substrate 101 include, but are not limited to, that when the first hollow portion 101K of the first substrate 101 and the second hollow portion 201K of the second substrate 201 are square, the first edge 101K1 near the light source area FA and the second edge 201K1 near the light source area FA can be understood as straight edges, and when the first hollow portion 101K of the first substrate 101 and the second hollow portion 201K of the second substrate 201 are in other shapes such as circles or ovals, the first edge 101K1 near the light source area FA and the second edge 201K1 near the light source area FA can be understood as arc edges, and the embodiment is not limited thereto, and only needs to satisfy the requirement that in the direction Z perpendicular to the plane where the first substrate 101 is located, the first hollow portion 101K overlaps the second edge 201K and the second edge 201K is not overlapped with the first edge 1, and the stress concentration can be reduced at least in the embodiment that the first edge 201K is not overlapped with the first edge 1.

It should be noted that, in this embodiment, the structure of the light source assembly 000 is only shown as an example, and in the specific implementation, the structure of the light source assembly 000 includes, but is not limited to, other structures capable of realizing the light emission of the light source 100 driving the light bar 10, such as other electronic components and the like, which may be further disposed on the flexible circuit board 20, and the embodiment is not described herein, and the embodiment may be specifically understood with reference to the structure of the light source assembly for providing backlight in the related art.

In some alternative embodiments, please refer to fig. 1, fig. 2, fig. 3 and fig. 4 in combination, fig. 3 is a partially enlarged view of a first hollowed-out portion of the light bar in fig. 1, fig. 4 is a partially enlarged view of a second hollowed-out portion of the flexible circuit board in fig. 1 (for clarity of illustrating the structure of this embodiment, fig. 3 and fig. 4 are filled with transparency), in this embodiment, in a direction X parallel to a plane of the first substrate 101, the first edge 101K1 is located on a side of the second edge 201K1 near the light source area FA.

The embodiment explains that when the first hollowed-out portion 101K exposing the first circuit layer 102 and the second hollowed-out portion 201K exposing the second circuit layer 202 are correspondingly welded to realize the fixed structure that the flexible circuit board 20 and the light bar 10 are electrically connected in the non-light source area NFA binding manner, the first edge 101K1 of the first hollowed-out portion 101K near the light source area FA and the second edge 201K1 of the second hollowed-out portion 201K near the light source area FA are arranged to be not overlapped, i.e. staggered, and at the same time, the area of the first hollowed-out portion 101K of the first substrate 101 of the light bar 10 can be larger, i.e. the first edge 101K1 of the first hollowed-out portion 101K near the light source area FA is closer to the light source area FA than the second edge 201K1 of the second hollowed-out portion 201K near the light source area FA, so that when the effective bonding pad 1020 of the first circuit layer 102 is arranged in the first hollowed-out portion 101K, the conductive parts 300 such as soldering tin welded with the effective welding part 2020 of the second circuit layer 202 in the second hollowed-out part 201K can be far away from the driving circuit of the first circuit layer 102 of the light bar 10, so that the conductive parts 300 such as soldering tin with heat energy positioned at the overlapping area of the second hollowed-out part 201K and the first hollowed-out part 101K can be far away from the driving circuit 10200 of the first circuit layer 102 (as shown in fig. 5, fig. 5 is a partial cross-sectional structure schematic diagram after the light bar and the flexible circuit board are bound, as shown in fig. 3 and fig. 4), the stress concentration is reduced, and meanwhile, the conductive parts such as soldering tin with heat energy can be prevented from affecting the transmission performance of the driving circuit 10200 of the first circuit layer 102 of the light bar 10, thereby being beneficial to ensuring the light emitting effect of the light bar 10.

It should be understood that fig. 3, fig. 5 and fig. 5 are only schematic structural views illustrating the structure of the conductive portion 300 such as the solder soldering portion 2020 between the effective soldering pad 1020 and the effective soldering portion 2020 and the second conductive portion 202 between the effective soldering portion 1020 and the second conductive portion 1020 in the first hollow portion 101K and the second conductive portion 202 in the first conductive portion 102 when the light bar 10 and the flexible circuit board 20 are electrically connected in the non-light source area NFA, and in particular, the soldering structure and the design structure of the soldering portion may include, but are not limited to, other structures capable of realizing the electrical connection between the light bar 10 and the flexible circuit board 20, and the embodiment is not limited thereto, and fig. 3-5 are only for illustrating the beneficial effect of the present embodiment when the first edge 101K1 is located on the side of the second edge 201K1 closer to the light source area FA in the direction X parallel to the plane of the first substrate 101.

Alternatively, as shown in fig. 1 to 5, the minimum distance D between the first edge 101K1 and the second edge 201K1 in the direction X parallel to the plane of the first substrate 101 is greater than or equal to 0.3mm.

The present embodiment illustrates that by correspondingly welding the first hollowed-out portion 101K exposing the first circuit layer 102 and the second hollowed-out portion 201K exposing the second circuit layer 202, when the flexible circuit board 20 and the light bar 10 are in a fixed structure of binding and electrically connecting in the non-light source area NFA, the first edge 101K1 of the first hollowed-out portion 101K near the light source area FA and the second edge 201K1 of the second hollowed-out portion 201K near the light source area FA are not overlapped, i.e. staggered, and at the same time, may be also set in the direction X parallel to the plane of the first substrate 101, the minimum distance D between the first edge 101K1 and the second edge 201K1 needs to be greater than or equal to 0.3mm, the problem of breakage caused by concentrated stress at the boundary positions of the first hollowed-out portion 101K and the second hollowed-out portion 201K when materials of the first substrate 101 and the second substrate 201 are stacked together due to the fact that the distance between the first edge 101K1 and the second edge 201K1 is too small, can be avoided, and therefore the minimum distance D between the first edge 101K1, close to the light source area FA, of the first hollowed-out portion 101K and the second edge 201K, close to the light source area FA, of the second hollowed-out portion 201K needs to be larger than or equal to 0.3mm, so that the boundary stress of the hollowed-out portion is more dispersed, stress concentration is effectively reduced, the virtual welding probability after binding of the light bar 10 and the flexible circuit board 20 is further reduced, and the light emitting effect of the light source assembly 000 is guaranteed.

In some alternative embodiments, referring to fig. 1 and fig. 6 in combination, fig. 6 is a schematic view of another cross-sectional structure in the direction A-A' in fig. 1, in this embodiment, in the non-light source area NFA, a side of the light bar 10 facing the flexible circuit board 20 includes a plurality of first bonding pads 103, where the first bonding pads 103 are located in an area where the first hollowed-out portion 101K is located; the side of the flexible circuit board 20 facing the light bar 10 comprises a plurality of second bonding pads 203, and the second bonding pads 203 are positioned in the area where the second hollowed-out parts 201K are positioned;

the flexible circuit board 20 and the light bar 10 are electrically connected in a binding manner through the first bonding pad 103 and the second bonding pad 203.

The present embodiment illustrates that when the flexible circuit board 20 of the light source assembly 000 is electrically connected to the light bar 10 in a binding manner, and a light emitting signal output by a control chip (not illustrated in the drawing) disposed on the flexible circuit board 20 is transmitted to the light bar 10 to drive the plurality of light sources 100 on the light bar 10 to emit light to achieve the effect of providing backlight light, the plurality of first bonding pads 103 may be disposed on the side of the light bar 10 of the non-light source area NFA toward the flexible circuit board 20, such that the first bonding pads 103 are disposed in the area of the first hollowed-out portion 101K, the plurality of second bonding pads 203 may be disposed on the side of the flexible circuit board 20 toward the light bar 10, such that the second bonding pads 203 are disposed in the area of the second hollowed-out portion 201K, when one first bonding pad 103 is electrically connected with one second bonding pad 203 in a one-to-one correspondence manner, the flexible circuit board 20 and the light bar 10 achieve the fixing effect of the bonding electrical connection, so that the light emitting signals output by the control chip arranged on the flexible circuit board 20 can be sequentially transmitted to the driving circuit 10200 of the first circuit layer 102 in the light bar 10 through the signal routing (not illustrated in the figure) of the second circuit layer 202 in the flexible circuit board 20, the second bonding pad 203 in the second hollowed-out portion 201K of the flexible circuit board 20 and the first bonding pad 103 in the first hollowed-out portion 101K of the light bar 10, so as to control the light source 100 on the light bar 10 to emit light, and achieve the effect of electric signal transmission.

It can be appreciated that the first bonding pad 103 disposed in the area of the first hollowed-out portion 101K in this embodiment may be fabricated on the first circuit layer 102 of the light bar 10, that is, the first bonding pad 103 is fabricated by using the metal layer of the first circuit layer 102 (in this case, the first bonding pad 103 may be understood as the effective bonding pad 1020 of the first circuit layer 102 in fig. 5), the second bonding pad 203 disposed in the area of the second hollowed-out portion 201K may be fabricated on the second circuit layer 202 of the flexible circuit board 20, that is, the second bonding pad 203 is fabricated by using the metal layer of the second circuit layer 202 (in this case, the second bonding pad 203 may be understood as the effective bonding portion 2020 of the second circuit layer 202 in fig. 5), and there is no need to additionally provide the conductive film layer to fabricate the first bonding pad 103 on the side of the first circuit layer 102 away from the first substrate 101, and there is no need to additionally provide the conductive film layer to fabricate the second bonding pad 203 on the side of the second circuit layer 202 away from the second substrate 201, thereby being beneficial to reduce the overall thickness of the light source assembly 000.

Alternatively, referring to fig. 1 and 7 in combination, fig. 7 is a schematic view of another cross-sectional structure in the direction A-A' in fig. 1, in this embodiment, the first bonding pad 103 and the second bonding pad 203 are electrically connected by binding with the first solder portion 30, that is, in this embodiment, the bonding electrical connection between the light bar 10 and the flexible circuit board 20 may be connected by the first solder portion 30 located between the first bonding pad 103 and the second bonding pad 203, so as to achieve the effect of transmitting the electrical signal between the flexible circuit board 20 and the light source 100 on the light bar 10.

Further optionally, as shown in fig. 1 and fig. 7, the first solder portion 30 is located between the first bonding pad 103 and the second bonding pad 203 in the area where the second hollowed-out portion 201K is located, so that the first solder portion 30 is far away from the driving circuit of the first circuit layer 102 of the light bar 10, and further, the first solder portion 30 with heat energy located in the overlapping area of the second hollowed-out portion 201K and the first hollowed-out portion 101K can be far away from the driving circuit 10200 of the first circuit layer 102, so that stress concentration is reduced, and meanwhile, the first solder portion 30 with heat energy can be prevented from affecting the transmission performance of the driving circuit 10200 of the first circuit layer 102 of the light bar 10, which is beneficial to ensuring the light emitting effect of the light bar 10.

Note that, in this embodiment, the conductive portion for soldering the first pad 103 of the light bar 10 and the second pad 203 of the flexible circuit board 20 may be the first solder portion 30 of a solder material, and in a specific implementation, the material of the conductive portion for soldering the first pad 103 of the light bar 10 and the second pad 203 of the flexible circuit board 20 may include, but is not limited to, any other conductive material.

It should be understood that, in the drawings of the present embodiment, in order to clearly illustrate the first hollowed-out portion 101K and the second hollowed-out portion 201K, the space volumes of the first hollowed-out portion 101K and the second hollowed-out portion 201K are illustrated in a larger range, and in the specific implementation, the thicknesses of the first substrate 101 and the second substrate 201 may not be illustrated in the proportion illustrated, and fig. 7 is only for clearly illustrating the structure of the first solder portion between the first pad 103 and the second pad 203, that is, the actual size of the first solder portion is not illustrated in fig. 7, and the thickness of the substrate and the film layer structure of the circuit layer may be set according to the actual design requirement.

In some alternative embodiments, please refer to fig. 8 and 9 in combination, fig. 8 is a schematic plan view of another light source assembly provided in the embodiment of the present invention, fig. 9 is a schematic cross-sectional view of the direction B-B' in fig. 8 (it will be understood that, for clarity of illustrating the structure of the embodiment, transparency filling is performed in fig. 8), in this embodiment, the light bar 10 includes a first protection layer 104, where the first protection layer 104 is located on a side of the first circuit layer 102 facing away from the first substrate 101;

the first protection layer 104 includes a third hollow portion 104K, and the third hollow portion 104K penetrates through the thickness of the first protection layer 104 to expose the first circuit layer 102;

in a direction Z perpendicular to a plane in which the first substrate 101 is located, a region in which the third hollowed-out portion 104K is located at least partially overlaps with a region in which the first hollowed-out portion 101K is located;

the light bar 10 includes a plurality of first through holes 10K, the first through holes 10K at least partially overlap the first pads 103 in a direction Z perpendicular to a plane of the first substrate 101, and the first through holes 10K penetrate through a thickness of the first circuit layer 102;

in the region where the third hollowed-out portion 104K is located, the side of the first circuit layer 102 facing away from the first substrate 101 includes the second solder portion 40, and the first solder portion 30 and the second solder portion 40 are connected by the third solder portion 50 filled in the first through hole 10K.

The present embodiment illustrates that the light bar 10 may further include a first protection layer 104, where the first protection layer 104 is located on a side of the first circuit layer 102 facing away from the first substrate 101, and the first protection layer 104 is configured to function to protect the first circuit layer 102 of the light bar 10. The first protection layer 104 includes a third hollow portion 104K, where the third hollow portion 104K penetrates through the thickness of the first protection layer 104 to expose the first circuit layer 102, that is, the third hollow portion 104K may be understood as an area of the light bar 10, which is away from the side of the flexible circuit board 20 and exposes the first circuit layer 102. In the direction Z perpendicular to the plane where the first substrate 101 is located, the area where the third hollowed-out portion 104K is located at least partially overlaps with the area where the first hollowed-out portion 101K is located, that is, the areas where the first hollowed-out portion 101K and the third hollowed-out portion 104K on the upper and lower sides of the first circuit layer 102 are located may be substantially coincident. The light bar 10 of this embodiment includes a plurality of first through holes 10K, where the first through holes 10K at least partially overlap with the first pads 103 in the direction Z perpendicular to the plane of the first substrate 101, and the first through holes 10K penetrate through the thickness of the first circuit layer 102, and when the first pads 103 are made of metal film layers in the first circuit layer 102, the first through holes 10K can be understood as structures penetrating through the first pads 103 and other metal film layers in the first circuit layer 102. When the light bar 10 and the flexible circuit board 20 of the present embodiment are electrically connected in the non-light source area NFA, the second solder portion 40 may be disposed on the side of the first circuit layer 102 facing away from the first substrate 101 in the area where the third hollowed portion 104K is located, and the electrical connection between the first solder portion 30 located on the side of the first bonding pad 103 facing toward the flexible circuit board 20 and the second solder portion 40 located on the side of the first bonding pad 103 facing away from the flexible circuit board 20 may be achieved through the third solder portion 50 filled in the first through hole 10K. In the process of manufacturing the light source assembly 000 of this embodiment, the light bar 10 is located above the flexible circuit board 20, the first through hole 10K penetrating the light bar 10 at the position of the first bonding pad 103 can be understood as a solder passing hole, during soldering, a solder gun can be used to brush solder on one side of the first circuit layer 102 of the third hollowed-out portion 104K, which is far away from the flexible circuit board 20, the solder passes through the first through hole 10K to form a first solder part 30 between the first bonding pad 103 and the second bonding pad 203, the solder continues to brush solder in the first through hole 10K to form a third solder part 50 filled in the first through hole 10K, and the solder continues to brush solder on one side of the first circuit layer 102, which is far away from the flexible circuit board 20, to finally form a second solder part 40, so that a stable electrical connection between the first bonding pad 103 and the second bonding pad 203 is realized through the first solder part 30, the second solder part 40 and the third solder part 50, thereby being beneficial to ensure an electrical transmission effect between the flexible circuit board 20 and the light bar 10.

Optionally, a second protection layer may also be disposed on a side of the second circuit layer 202 of the flexible circuit board 20 away from the second substrate 201, where the second protection layer is used to protect the second circuit layer 202 of the flexible circuit board 20, and the second protection layer may be disposed on a whole side of the second circuit layer 202 away from the second substrate 201 (not illustrated in the drawings), and further optionally, the manufacturing materials of the first substrate 101, the second substrate 201, the first protection layer 104 and the second protection layer in this embodiment may be the same, for example, may be all insulation materials such as polyimide.

In some alternative embodiments, please refer to fig. 8, 9 and 10 in combination, fig. 10 is a schematic view of a partial enlarged structure of the light bar in fig. 8 within the first hollowed-out portion (it can be understood that, for clarity of illustrating the structure of this embodiment, transparency filling is performed in fig. 10), in this embodiment, one first bonding pad 103 corresponds to a plurality of first through holes 10K, and the plurality of first through holes 10K are arranged along a length extending direction (such as a direction X illustrated in the drawing) of the first bonding pad 103;

along the arrangement direction of the plurality of first pads 103 (for example, a second direction Y in the drawing, the second direction Y intersects with the direction X in a direction parallel to the plane of the first substrate 101 or is perpendicular to each other), the first through holes 10K corresponding to the adjacent two first pads 103 are staggered from each other.

The present embodiment explains that a plurality of first through holes 10K penetrating through the thickness of the light bar 10 may be provided in the region corresponding to one first bonding pad 103, and the plurality of first through holes 10K are arranged along the length extending direction (direction X as illustrated in the figure) of the first bonding pad 103 (as illustrated in fig. 8); optionally, along the arrangement direction of the plurality of first bonding pads 103 (for example, the second direction Y in the drawing, the second direction Y intersects with the direction X in a direction parallel to the plane where the first substrate 101 is located or is perpendicular to each other), the first through holes 10K corresponding to the two adjacent first bonding pads 103 are staggered, that is, in the second direction Y, the same number of first through holes 10K corresponding to different first bonding pads 103 are not in a straight line, and the connecting lines of the first through holes 10K corresponding to at least three adjacent first bonding pads 103 are non-straight lines and staggered with each other, so as to avoid stress concentration in the second direction Y caused by the opening of the first through holes 10K, thereby being beneficial to improving the capability of the shock-resistant light bar 10 in the area of the first hollowed-out portion 101K.

It should be understood that, in the drawings of the present embodiment, only the first through holes 10K are illustrated as circles, and the shapes of the first through holes 10K include, but are not limited to, those of the first through holes 10K corresponding to the positions of the first pads 103 are illustrated as examples, and in the drawings of the present embodiment, the number of the first through holes 10K corresponding to the positions of the first pads 103 includes, but is not limited to, those of the first through holes 10K corresponding to the positions of the first pads 103 are illustrated as examples, and other arrangements are also possible, so that the present embodiment is not limited thereto.

In some alternative embodiments, please refer to fig. 8, 9 and 11 in combination, fig. 11 is a schematic cross-sectional structure of the direction C-C' in fig. 8, in which the first circuit layer 102 includes a plurality of signal traces 1021, the same signal trace 1021 includes at least a first sub-section 10211 and a second sub-section 10212 connected to each other, and the first sub-section 10211 is located at least in a region where the first hollowed-out portion 101K is located;

the first circuit layer 102 includes at least a first sub-layer 102A, a second sub-layer 102B, and a first insulating layer 102C between the first sub-layer 102A and the second sub-layer 102B;

the first subsection 10211 includes a first wire 10211A and a second wire 10211B connected in parallel, the first wire 10211A being located in the first sub-layer 102A and the second wire 10211B being located in the second sub-layer 102B;

the first conductive line 10211A and the second conductive line 10211B of one first sub-section 10211 are connected in parallel through a plurality of second through holes 102CK, the second through holes 102CK penetrating the first insulating layer 102C.

The embodiment explains that the driving circuit of the light bar 10 for driving the light source 100 of the first circuit layer 102 to emit light may include at least a plurality of signal traces 1021, and at least one of the plurality of signal traces 1021 is used for electrically connecting the first bonding pad 103 with the light source 100, so as to transmit the light emission control signal provided by the flexible circuit board 20 to the light source 100, so that the light source 100 on the light bar 10 emits light. The same signal trace 1021 at least comprises a first sub-section 10211 and a second sub-section 10212 which are connected with each other, wherein the first sub-section 10211 at least comprises a partial section located in the area where the first hollowed-out portion 101K is located, and optionally, the first sub-section 10211 may also be located in the area where the first hollowed-out portion 101K formed in the first substrate 101 is located. In this embodiment, the first sub-section 10211 of one signal trace 1021 at least partially located in the range of the first hollow portion 101K is configured as at least a dual-layer trace structure, specifically, the first sub-section 10211 of the same signal trace 1021 includes a first conductive wire 10211A and a second conductive wire 10211B connected in parallel, the first conductive wire 10211A is located in the first sub-layer 102A of the first trace layer 102, the second conductive wire 10211B is located in the second sub-layer 102B of the first trace layer 102, the first conductive wire 10211A and the second conductive wire 10211B of the first sub-section 10211 are connected in parallel through a plurality of second through holes 102CK penetrating through the first insulating layer 102C, so that the first sub-section 10211 at least partially located in the range of the first hollow portion 101K is at least a dual-layer trace structure, even if the lamp strip 10 breaks at the boundary position of the first hollow portion 101K exposed at the first hollow portion 101K due to the stress concentration problem, the electric signal can be guaranteed to be further broken at the boundary position of the first hollow portion 101K, and the same electric signal trace 102 can be further transmitted through the first conductive wire 10211A of the dual-layer 10211B, if the first sub-layer 10211A is further broken, the light source 11 can be further transmitted from the first sub-section 102A, and the second sub-section 10211 can be further light source 11, and the light source 11 can be further transmitted through the first conductive wire 10211, and the first sub-section 102 can be realized, and the light source 11, and the light source can be further, and the light source 11 can be further light source 11.

It should be understood that fig. 11 of the present embodiment is merely an exemplary illustration of the film layer structure of the first circuit layer 102, and the film layer circuit structure of the first circuit layer 102 includes, but is not limited to, this, and the film layer structure can be understood with reference to the light bar structure including the light source 100 in the related art. Fig. 11 of the present embodiment is merely an exemplary illustration of the layout and the number of the second through holes 102CK connected in parallel with the double-layer wiring structure, and in the specific implementation, the layout and the number of the second through holes 102CK penetrating the first insulating layer 102C include, but are not limited to, but may be other design structures.

In the drawings of the present embodiment, the first sub-layer 102A is only illustrated as an example on the side of the second sub-layer 102B facing the first substrate 101, and in a specific implementation, the second sub-layer 102B may also be located on the side of the first sub-layer 102A facing the first substrate 101, which is not limited in this embodiment, and only needs to satisfy a structure that at least a part of the first sub-section 10211 located in the first hollowed-out portion 101K is a double-layer wiring parallel connection.

Alternatively, as shown in fig. 11, the first sub-section 10211 overlaps at least part of the first substrate 101 in a direction Z perpendicular to the plane in which the first substrate 101 lies.

The present embodiment explains that the first sub-section 10211 configured as the dual-layer wiring parallel structure is at least located within the range of the first hollowed-out portion 101K, and the first sub-section 10211 overlaps at least part of the first substrate 101 in the direction Z perpendicular to the plane where the first substrate 101 is located, that is, the first sub-section 10211 of at least part of the section is also located within the partial area of the first substrate 101 that is not hollowed out, so that the first sub-section 10211 of the dual-layer wiring structure extends and is disposed at least to the area with the first substrate 101, and the electrical connection effect of the signal wiring of the light source area FA and the first sub-section 10211 of the dual-layer wiring structure can be ensured.

In some alternative embodiments, please refer to fig. 8, 9, 11 and 12 in combination, fig. 12 is a partially enlarged schematic view of the area of the first subsection in fig. 8 (it will be understood that, for clarity of illustration of the structure of the embodiment, the transparency filling is performed in fig. 12), and in this embodiment, the outer diameter W1 of the second through hole 10CK is smaller than or equal to the width W2 of the first subsection 10211.

The embodiment explains that the first subsection 10211 at least located in the range of the first hollowed-out portion 101K is designed into a structure with double-layer wiring in parallel, when the first conducting wire 10211A located in the first subsection 102A and the second conducting wire 10211B located in the second subsection 102B are connected in parallel through a plurality of through holes penetrating through the first insulating layer 102C, the outer diameter W1 of the second through hole 10CK formed in the first insulating layer 102C needs to be set smaller than or equal to the width W2 of the first subsection 10211, and further, the first conducting wire 10211A or the second conducting wire 10211B of the first subsection 10211 is prevented from being broken when the outer diameter W1 of the second through hole 10CK exceeds the width W2 of the first subsection 10211 too much, which is beneficial for guaranteeing the electrical signal transmission stability of the first subsection 10211 of the double-layer wiring structure.

In some alternative embodiments, please refer to fig. 13, fig. 13 is a schematic plan view of a backlight module according to an embodiment of the present invention (it can be understood that, for clarity of illustration of the structure of the embodiment, transparency filling is performed in fig. 13), and the backlight module 111 according to the embodiment includes the light source assembly 000 according to the above embodiment of the present invention. It is to be understood that the backlight module 111 provided in the embodiment of the invention can be applied to other display devices having liquid crystal display panels, such as computers, televisions, vehicle-mounted display devices, etc., which is not particularly limited in the invention. The backlight module 111 provided in the embodiment of the present invention has the beneficial effects of the light source assembly 000 provided in the embodiment of the present invention, and the specific description of the light source assembly 000 in the above embodiments may be referred to in the embodiments, which is not repeated herein.

According to the embodiment, the light source assembly and the backlight module provided by the invention have the following beneficial effects:

While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A light source assembly, comprising: the light source assembly comprises a light source area and a non-light source area; in the non-light source area, the flexible circuit board is in binding electric connection with the light bar;

the light bar comprises a first substrate and a first circuit layer positioned at one side of the first substrate, the light bar of the light source area comprises a plurality of light sources, and the light sources are positioned at one side of the first circuit layer away from the first substrate;

the flexible circuit board comprises a second substrate and a second circuit layer positioned at one side of the second substrate, wherein the second substrate is positioned at one side of the first substrate, which is away from the first circuit layer, and the second circuit layer is positioned at one side of the second substrate, which is away from the first substrate;

In the non-light source region, the first substrate comprises a first hollowed-out part, and the first hollowed-out part at least penetrates through the thickness of the first substrate to expose the first circuit layer; the second substrate comprises a second hollowed-out part, and the second hollowed-out part at least penetrates through the thickness of the second substrate to expose the second circuit layer;

in the direction parallel to the plane of the first substrate, the first hollowed-out part comprises a first edge close to the light source area, and the second hollowed-out part comprises a second edge close to the light source area;

in the direction perpendicular to the plane of the first substrate, the area of the first hollowed-out part and the area of the second hollowed-out part at least partially overlap, and the first edge and the second edge do not overlap.

2. A light source assembly as recited in claim 1, wherein the first edge is located on a side of the second edge adjacent the light source region in a direction parallel to a plane in which the first substrate lies.

3. The light source assembly of claim 1, wherein a minimum distance between the first edge and the second edge in a direction parallel to a plane in which the first substrate lies is greater than or equal to 0.3mm.

4. The light source assembly of claim 1 wherein the light source assembly comprises,

the light bar comprises a plurality of first bonding pads on one side of the light bar facing the flexible circuit board in the non-light source area, wherein the first bonding pads are positioned in the area where the first hollowed-out part is positioned; the side, facing the light bar, of the flexible circuit board comprises a plurality of second bonding pads, and the second bonding pads are located in the area where the second hollowed-out parts are located;

the flexible circuit board is correspondingly and electrically connected with the light bar through the first bonding pad and the second bonding pad.

5. The light source assembly of claim 4, wherein the first bonding pad and the second bonding pad are electrically connected by a first solder bond.

6. The light source assembly of claim 5, wherein the first solder portion is located between the first bonding pad and the second bonding pad in an area where the second hollowed-out portion is located.

7. The light source assembly of claim 5, wherein the light bar comprises a first protective layer on a side of the first circuit layer facing away from the first substrate;

the first protection layer comprises a third hollowed-out part, and the third hollowed-out part penetrates through the thickness of the first protection layer to expose the first circuit layer;

In the direction perpendicular to the plane where the first substrate is located, the area where the third hollowed-out part is located at least partially overlaps with the area where the first hollowed-out part is located;

the light bar comprises a plurality of first through holes, and the first through holes at least partially overlap with the first bonding pads in the direction perpendicular to the plane of the first substrate, and penetrate through the thickness of the first circuit layer;

in the region where the third hollowed-out part is located, one side, away from the first substrate, of the first circuit layer comprises a second soldering tin part, and the first soldering tin part is connected with the second soldering tin part through a third soldering tin part filled in the first through hole.

8. The light source module of claim 7, wherein one of the first bonding pads corresponds to a plurality of the first through holes, and the plurality of first through holes are arranged along a length extending direction of the first bonding pad;

and the first through holes corresponding to the adjacent two first bonding pads are staggered along the arrangement direction of the plurality of first bonding pads.

9. The light source assembly of claim 1 wherein the light source assembly comprises,

the first circuit layer comprises a plurality of signal wires, the same signal wire at least comprises a first subsection and a second subsection which are mutually connected, and the first subsection is at least positioned in the area where the first hollowed-out part is positioned;

The first circuit layer at least comprises a first sub-layer, a second sub-layer and a first insulating layer positioned between the first sub-layer and the second sub-layer;

the first subsection comprises a first wire and a second wire which are connected in parallel, wherein the first wire is positioned on the first sublayer, and the second wire is positioned on the second sublayer;

the first wire and the second wire of one of the first subsections are connected in parallel through a plurality of second through holes, and the second through holes penetrate through the first insulating layer.

10. The light source assembly of claim 9, wherein the first sub-segment overlaps at least a portion of the first substrate in a direction perpendicular to a plane in which the first substrate lies.

11. The light source assembly of claim 9, wherein an outer diameter of the second through hole is less than or equal to a width of the first subsection.

12. A backlight module comprising the light source assembly of any one of claims 1-11.