CN115529747B - Multilayer board production line and multilayer circuit board processing method - Google Patents
Multilayer board production line and multilayer circuit board processing method Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the field of circuit board processing, and aims to solve the problem that accumulated errors are large in the process of aligning a plurality of core plates due to multiple times of alignment in the process of processing a multilayer board, in particular to a multilayer board production line, which comprises: at least one FRCC material processing unit; a multi-layer board composite unit; at least one stripping device. The invention also discloses a method for processing the multilayer circuit board. The multilayer board production line disclosed by the invention is matched with the FRCC material with a novel structure, so that the processing flow of the multilayer circuit board is simplified, the cover opening process of the multilayer circuit board is simplified, the processing precision and efficiency of the multilayer circuit board are improved, the consumption of auxiliary materials such as release films and the like and manual operation can be reduced, the production cost is effectively reduced, the consumption of water, electricity and gas is reduced, and the generation and discharge of industrial garbage are reduced.
Description
Technical Field
The invention relates to the field of circuit board processing, in particular to a multilayer board production line and a multilayer circuit board processing method.
Background
The traditional multilayer circuit board product is mainly manufactured by laminating a single-sided copper-clad plate and a double-layer circuit board or a multilayer circuit board, wherein the layers are bonded by a bonding material consisting of a release film, a semi-cured adhesive and the release film from top to bottom, and the process flow comprises the steps of feeding the single-sided copper-clad plate, cutting and drilling; feeding a bonding material, cutting and drilling; peeling off a release film of the bonding material by laminating equipment, laminating the semi-cured adhesive on the single-sided copper-clad plate, peeling off another release film of the bonding material by laminating equipment, bonding the release film with a double-layer circuit board or a multi-layer circuit board, and preparing the multi-layer circuit board with the required number of layers by processes of dry film laminating, exposure, development, etching and electroplating; the process is tedious, the equipment structure is complicated, a large amount of manpower is needed for operation, a large amount of water and electricity are consumed, all processes are mutually independent and are usually a certain process or a plurality of processes are independently operated, so that the defects of labor cost rise, raw material waste, uneven product quality, huge investment of production equipment, large occupied area of a factory building and the like are caused.
Above-mentioned process has caused the waste and the artificial waste of type membrane to in operation process, because every workman's the skilled proficiency degree is different, lead to product quality to have the height to have low, in addition, many inlayer cores need carry out the accuracy and counterpoint at the riveting in-process, have improved the accuracy control requirement of processing, and have counterpoint many times in the processing, many cores can cause the accumulative error great at the in-process of counterpointing like this, lead to the layer offset of counterpointing big.
In the multi-layer board pressing process, bubbles are easily pressed into the surface of the semi-cured rubber sheet contacting the copper-clad board, so that the performance of the multi-layer circuit board is influenced.
A traditional uncovering process of a multilayer circuit board comprises the following steps:
attaching an uncovering pattern on an FPC (Flexible Printed Circuit Board): die cutting of the uncovering pattern PI and the high temperature resistant protective film → transfer of the PET protective film to the FPC → removal of the redundant PET protective film and reservation of the PI protective film and the high temperature resistant protective film at the uncovering position on the FPC;
2. bonding material (from top to bottom include in proper order from type membrane + semi-cured glue + from type membrane) preprocessing: cutting the adhesive material → perforating or windowing → tearing off the PET release film;
3. compounding a multilayer board: single-sided FCCL (Flexible Copper Clad Laminate) → opening → aligning with semi-cured adhesive and low-temperature compounding → tearing off release paper → aligning and compounding on inner layer FPC → high-temperature pressing;
4. preparing a multilayer circuit board: pretreatment → dry film pasting → exposure pattern → development → electroplating → etching → pattern removal dry film → surface formation of multi-layer board circuit and connection inner layer hole structure → pattern opening position required by laser cutting machine → low-viscosity adhesive tape compounding and adhesion window opening position to remove the window opening position PI and high-temperature resistant protective film.
The uncapping process is complex and the production efficiency is low.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides a multilayer board production line, simplifies the processing flow of a multilayer circuit board by using a novel structural FRCC (flexible resin coated copper) material, simplifies the cover opening process of the multilayer circuit board, improves the processing precision and efficiency of the multilayer circuit board, can also reduce the consumption of auxiliary materials such as a release film and manual operation, effectively reduces the production cost, reduces the consumption of water, electricity and gas, and reduces the generation and discharge of industrial garbage.
A multi-layer board production line comprising:
at least one FRCC material processing unit: the device comprises an unwinding roller and a conveying device which are sequentially arranged along the processing direction, wherein the unwinding roller conveys the FRCC material to the conveying device, and a cutting device for punching and/or cutting the FRCC material is arranged at the conveying device;
a multiwall sheet composite unit: the hot-pressing device comprises a circuit board conveying device, a positioning device, a prepressing device and a hot-pressing device which are sequentially arranged along the processing direction, wherein the circuit board conveying device conveys a circuit board to the prepressing device;
and the at least one stripping device comprises a guide unwinding roller, a stripping positioning roller and a release film winding roller, wherein after the punched and/or cut FRCC material is conveyed to the stripping positioning roller through the guide unwinding roller, the release film is stripped and conveyed to the release film winding roller for winding, and the FRCC material stripped from the release film is conveyed to the alignment device.
As a further improvement of the invention, the conveying device comprises a pair of conveying rollers oppositely arranged along the processing direction and a conveying belt sleeved outside the two conveying rollers, wherein a supporting plate is arranged between the two conveying rollers and on one side deviating from the carrying surface of the conveying belt, tooth-shaped stripes are uniformly distributed on the carrying surface of the conveying belt, and the cutting device punches and/or cuts the FRCC material at the position of the supporting plate according to the circuit board pattern.
As a further improvement of the present invention, the FRCC material processing unit further includes a squeeze film roller respectively disposed at both ends of the conveying device, wherein the lower end of the squeeze film roller is lower than the upper end of the conveying roller and the upper end of the unwinding roller respectively.
As a further improvement of the invention, the device also comprises at least one FRCC material turnover device, wherein the FRCC material turnover device comprises at least two rollers which are arranged up and down, and the punched and/or cut FRCC material is conveyed to the stripping device after being turned over by the two rollers in sequence.
As a further improvement of the invention, the FRCC material processing unit further comprises at least one FRCC material winding roll, and the FRCC material after punching and/or cutting is conveyed to the FRCC material winding roll for winding; and transferring the coiled FRCC material to a guide unreeling roller for unreeling.
As a further improvement of the invention, the device also comprises at least one leakage detection and repair system, which is used for detecting the cutting surface of the FRCC material after the release film is stripped, and the leakage detection and repair system comprises a graph detection device and a visual detection device; the visual detection device is provided with a leak repairing mechanical arm.
As a further improvement of the invention, the alignment device comprises at least one horizontal positioning roller, at least one horizontal guide roller, an alignment system and an alignment detection system, wherein the horizontal positioning roller and the horizontal guide roller are horizontally arranged, the FRCC material stripped from the release film sequentially passes through the horizontal positioning roller and the horizontal guide roller, the horizontal positioning roller and the horizontal guide roller enable the FRCC material to be horizontally conveyed and parallel to the circuit board, and the alignment system is used for aligning the positioning holes and/or the uncapping patterns of the FRCC material with the positioning holes and/or the uncapping patterns of the circuit board;
the alignment detection system comprises a detection platform, and the detection platform is in communication connection with an acquisition module, an offset detection module, an alignment analysis module and a storage module;
the acquisition module comprises a searchlight and a camera which are arranged on the upper side of the core plate;
the offset detection module is used for carrying out offset detection on the release film after the core plate is aligned every time, and the offset detection process comprises the following steps: before the alignment begins, starting a searchlight, carrying out image shooting on a lower-layer core plate through a camera, marking the shot image as an initial image, amplifying the initial image into a pixel grid image, carrying out image processing on the pixel grid image to obtain a gray value of each pixel grid, obtaining a gray threshold value HDmin through a storage module, marking the pixel grid of the initial image as an initial pixel grid, marking the total number of the initial pixel grid as u, comparing the gray values of the initial pixel grid with the gray threshold value HDmin one by one, marking the number of the initial pixel grid with the gray value smaller than the gray threshold value HDmin as m, and marking the ratio of the m to the u as a standard ratio BZ; obtaining standard thresholds BZmin and BZmax by carrying out numerical calculation on a standard ratio BZ, wherein BZmin is a minimum standard threshold, BZmax is a maximum standard threshold, and a standard range is formed by the minimum standard threshold BZmin and the maximum standard threshold BZmax;
after the alignment is finished, a camera is adopted to shoot images of the upper layer core board, the obtained images are marked as comparison images, the comparison images are amplified to be pixel grid images, the pixel grid images are subjected to image processing to obtain the gray value of each pixel grid, the pixel grids of the comparison images are marked as comparison pixel grids, the gray values of the comparison pixel grids are compared with a gray threshold one by one, the number of the comparison pixel grids with the gray value smaller than the gray threshold is marked as e, the ratio of the e to the u is marked as an offset ratio PY, and the offset ratio is compared with standard thresholds BZmin and BZmax: if PY is less than or equal to BZmin or PY is more than or equal to BZmax, judging that the core plate is unqualified in alignment, and sending an unqualified in alignment signal to the detection platform by the alignment detection module; if BZmin is less than PY and less than BZmax, judging that the core board is qualified in alignment, and sending an alignment qualified signal to the detection platform by the alignment detection module;
the detection platform sends an alignment analysis signal to the alignment analysis module after receiving the alignment unqualified signal, and the alignment analysis module detects and analyzes the rotating speed of the horizontal guide roller after receiving the alignment analysis signal:
if the number of the horizontal guide rollers is one, directly acquiring a rotating speed value ZS of the horizontal guide rollers, acquiring rotating speed ranges ZSMin and ZSMax through a storage module, wherein ZSMin is a minimum rotating speed threshold value, ZSMax is a maximum rotating speed threshold value, comparing the rotating speed value ZS of the horizontal guide rollers with the rotating speed threshold values ZSMin and ZSMax, and judging the reason of unqualified alignment according to the comparison result of the rotating speed value ZS and the rotating speed threshold values ZSMin and ZSMax;
if the number of the horizontal guide rollers is not one, marking the horizontal guide rollers as i, i =1,2, \ 8230, wherein n and n are positive integers, obtaining the rotating speed value of the horizontal guide rollers and marking the rotating speed value as ZSi, establishing a rotating speed set { ZS1, ZS2, \8230;, ZSn } by the n rotating speed values ZSi, respectively obtaining a rotating speed mean value and a difference coefficient by carrying out mean value calculation and variance calculation on the rotating speed set, and judging whether the rotating speed mean value and the difference coefficient meet requirements or not.
As a further improvement of the invention, the prepressing device is a pair of prepressing press wheels, and the FRCC material and the circuit board which are aligned pass through the prepressing press wheels simultaneously, so that the FRCC material is attached to the circuit board.
As a further improvement of the invention, a circuit board detection device is arranged between the circuit board conveying device and the pre-pressing pinch roller and is used for detecting the circuit board.
As a further improvement of the invention, the multilayer board composite unit also comprises a tunnel type oven, and the multilayer board pressed by the hot pressing device is baked by the tunnel type oven.
As a further improvement of the invention, the multilayer board punching and checking system also comprises a punching and checking system which is used for punching and/or cutting the multilayer board baked by the tunnel type oven to form through holes and/or blind holes and checking and confirming the holes or the patterns on the multilayer board.
As a further improvement of the invention, the cutting device comprises at least one or more than two of an intelligent laser cutting device, a circular knife die cutting device and a stamping die cutting device.
As a further improvement of the invention, the FRCC material processing unit further includes a protective film unwinding device, which includes a protective film unwinding roller and a protective film winding roller, the protective film unwinding roller transmits the protective film to the pre-pressing device, the protective film covers the FRCC material and passes through the pre-pressing device and the hot-pressing device together with the FRCC material and the circuit board, so as to complete the press-fitting of the FRCC material and the circuit board to form a multi-layer board, and then the protective film is transmitted to the protective film winding roller for winding.
As a further improvement of the invention, the protective film is a PET film, a silicon gel film or TPX (4-methyl pentane-1 polymer).
As a further improvement of the invention, the hot pressing device comprises at least one pair of hot pressing rollers or a flat plate hot pressing device, wherein the flat plate hot pressing device comprises at least one group of hot pressing flat plates which are oppositely arranged up and down and an annular rail which is arranged corresponding to the hot pressing flat plates, the hot pressing flat plates are movably connected with the annular rail, and the annular rail enables the hot pressing flat plates to move along the processing direction of the multi-layer plate composite unit and continuously move along the annular rail back to the initial position after the pressing is completed.
As a further improvement of the invention, the multi-layer board cutting device further comprises a multi-layer board winding roller or a multi-layer board cutting device, the multi-layer board processed by the multi-layer board covering unit is conveyed to the multi-layer board winding roller or the multi-layer board cutting device, and the multi-layer board is wound by the multi-layer board winding roller; or the multilayer board cutting device cuts the multilayer board into sheets, and the sheets of the multilayer board are sequentially stacked through a manipulator; and forming a circuit on the FRCC material by the rolled multilayer board or the multilayer board cut into sheets through the processes of dry film pasting, exposure, development, etching and electroplating to manufacture the multilayer circuit board.
The invention also discloses a method for processing the multilayer circuit board, which comprises the following steps:
s1, preprocessing an FRCC material: firstly, placing a roll-shaped FRCC material on an unwinding roller, starting an FRCC material processing unit, conveying the FRCC material to a conveying device, and punching and/or cutting the FRCC material by a cutting device;
s2, stripping a release film: conveying the FRCC material processed in the step S1 to a stripping device, stripping a release film on the FRCC material by the stripping device, and conveying the FRCC material subjected to stripping of the release film to an alignment device;
s3, compounding a multilayer board: when the FRCC material after the release film is stripped is conveyed to the aligning device, the circuit board conveying device synchronously conveys the circuit board to the aligning device, at the moment, the semi-solidified glue layer of the FRCC material faces the circuit board, the aligning of the FRCC material and the circuit board is completed through the aligning device, and then the FRCC material and the circuit board are sequentially conveyed to the pre-pressing device and the hot-pressing device to be pressed, so that the multilayer board is formed.
As a further improvement of the invention, in step S1, after punching and/or cutting by the cutting device, positioning holes and/or uncapping patterns are formed on the FRCC material, when the uncapping patterns need to be formed on the FRCC material, the unwinding roller faces the cutting device from the release film of the FRCC material in the process of conveying the FRCC material to the conveying device, and the cutting device only cuts contour lines of corresponding shapes on the release film according to the uncapping patterns; when the positioning holes are only required to be formed on the FRCC material, the orientation of the release film in the conveying process of the FRCC material is not limited.
As a further improvement of the invention, in step S2, when the release film of the FRCC material has a contour line of the uncapping figure, the release film with a corresponding shape is remained on the FRCC material after the release film is peeled and at the uncapping position.
As a further improvement of the present invention, in step S2, the uncovering pattern on the FRCC material after the release film is peeled off is detected by the pattern detection device and the detection result is recorded, and then the visual detection device is used to detect whether the release film at the uncovering position falls off, and the leak repairing manipulator is controlled to supplement the release film with a corresponding shape at the falling position.
As a further improvement of the invention, in step S2, the circuit board detection device detects the circuit board transmitted by the circuit board conveying device and records the detection result, the horizontal positioning roller and the horizontal guide roller horizontally transmit the FRCC material stripped of the release film and are parallel to the circuit board, meanwhile, an alignment system is used for aligning the positioning holes and/or the uncapping patterns on the FRCC material with the positioning holes and/or the uncapping patterns on the circuit board, the aligned FRCC material and the circuit board pass through two pre-pressing rollers for pre-pressing and then are transmitted to a hot-pressing device for hot-pressing.
As a further improvement of the invention, in step S2, the protective film is conveyed to the prepressing device through the protective film unwinding roller, so that the protective film covers the FRCC material and passes through the prepressing device and the hot-pressing device together with the FRCC material and the circuit board, and the FRCC material and the circuit board are pressed together to form a multilayer board, at this time, the protective film is conveyed to the protective film winding roller for winding, and the multilayer board pressed by the hot-pressing device is baked through the tunnel oven to form a multilayer board with stable performance, the multilayer board is conveyed to the punching inspection system, and the punching inspection system punches holes on the FRCC material of the multilayer board to form through holes and blind holes and inspects and confirms holes and patterns on the multilayer board; and finally, rolling or cutting the multilayer board into sheets.
The processing method of the multilayer circuit board further comprises the following steps:
s4, forming a circuit on the FRCC material by the multilayer board through processes including dry film pasting, exposure, development, electroplating and etching line, obtaining a multilayer circuit board, etching copper on the FRCC material and at the uncovering position to form an opening corresponding to the uncovering pattern, and enabling release films reserved on the FRCC material to correspond to the opening one by one;
s5, uncovering: cutting the FRCC material along the edge of the opening formed by etching in the step S4, and stripping the residual FRCC material at the cut part to finish uncovering;
and S6, repeating the steps S2, S3, S4 and S5 on the multilayer line board after the cover is opened until the multilayer line board with the required number of layers is obtained.
The invention has the beneficial effects that:
(1) Compared with the traditional process of laminating and bonding materials comprising release films, semi-curing glue and release films between a single-sided board and a double-sided board, the novel FRCC material is prepared by compounding the semi-curing glue layer and the traditional single-sided board through a coating process, and the multi-layer board production line disclosed by the invention is matched to realize the automatic production of the multi-layer circuit board, improve the processing precision and yield of the multi-layer board, simplify the production process flow of the multi-layer circuit board, reduce the use amount of the release films, effectively save the material cost and the labor cost, reduce the use amount of water, electricity and gas and reduce the generation and emission of industrial garbage;
(2) The FRCC material is directly attached to the circuit board, and bubbles pressed in between layers can be discharged from through holes on the circuit board, so that the problem that the bubbles are easily pressed in between layers of a multi-layer board is solved, and the performance reliability of the multi-layer circuit board is improved;
(3) The coincidence degree of the core plate is detected and analyzed by the alignment detection module after each alignment, so that the phenomenon of deviation after core plate pressing is avoided, the standard range of the first alignment detection is adopted as a reference in each alignment detection, and the problem that the deviation of the multi-layer plate is large due to the fact that the single alignment detection is qualified and the multi-layer plate is accumulated layer by layer is avoided.
(4) Compared with the existing cover opening process of the multilayer circuit board, the cover opening process of the FRCC material is adopted, the cover is opened by using high-temperature PET to replace PI, and the process flow comprises the following steps: laser pattern on PET → PET outside the peeling pattern → contraposition → multilayer stitching → etching → cutting → uncovering the cover, the advantages are as follows:
a. the material cost is saved: the cost of the inner layer CVL covering film plus the PI protective film is saved;
b. the process flow is saved: omitting the lamination flow of the covering film and the PI protective film;
c. the process precision is improved: the alignment of the cover opening area is only affected by the circuit precision, and the alignment precision is improved qualitatively compared with that of the traditional process;
d. the material produced by the high-temperature release film can be directly cut by laser and then is suitable for uncovering, the release film is recycled, the cost can be reduced, and the competitiveness is improved.
Drawings
In order to more clearly illustrate the technical solutions in the present embodiment or the prior art, the drawings needed to be used in the description of the embodiment or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic plan view of an FRCC material processing unit of the present invention;
FIG. 2 is a schematic plan view of a multi-layer board composite unit of the present invention using a hot press roll;
FIG. 3 is a schematic plan view of a cutting surface of FRCC material of the present invention;
FIG. 4 is an enlarged view of a position to be uncapped after the FRCC material is stripped from the release film;
FIG. 5 is a schematic view of a conveyor according to the present invention;
FIG. 6 is a schematic view of the structure of the carousel of the present invention;
FIG. 7 is a schematic view of the peeling apparatus of the present invention;
FIG. 8 is a schematic view of the structure of each step hole in the multilayer wiring board of the present invention;
FIG. 9 is a schematic plan view of the cutting apparatus of the present invention employing a circular knife die cutting apparatus;
FIG. 10 is a schematic plan view of a cutting apparatus of the present invention using a punching die;
FIG. 11 is a schematic plan view of a multi-layer board composite unit of the present invention using a flat plate hot press apparatus;
fig. 12 to 15 are explanatory views of the decapping process of the present invention;
fig. 16 is a schematic plan view of an FRCC material processing unit in accordance with another embodiment of the present invention;
fig. 17 is a schematic plan view of a second FRCC material processing unit according to an embodiment of the present invention;
FIG. 18 is a schematic plan view of a second multi-layer board composite unit according to an embodiment of the present invention;
fig. 19 is a prior art cover opening flowchart of a multilayer circuit board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present embodiments more clear, the technical solutions in the present embodiments will be clearly and completely described below, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1 and fig. 2, the present embodiment provides a multi-layer board production line, including:
at least one FRCC material processing unit 1: the device comprises an unwinding roller 11 and a conveying device 12 which are sequentially arranged along the processing direction, wherein the unwinding roller 11 conveys the FRCC material 3 to the conveying device 12, and a cutting device 13 for punching and/or cutting the FRCC material 3 is arranged at the conveying device 12;
a multilayer board composite unit 2: the automatic positioning device comprises a circuit board conveying device 21, an aligning device 22, a pre-pressing device 23 and a hot-pressing device 24 which are sequentially arranged along the processing direction, wherein the circuit board conveying device 21 conveys a circuit board 6 to the aligning device 23;
at least one peeling device 4, which includes a guiding unwinding roller 41, a peeling positioning roller 42, and a release film winding roller 43, after the punched and/or cut FRCC material 4 is conveyed to the peeling positioning roller 42 through the guiding unwinding roller 41, the release film is peeled and conveyed to the release film winding roller 43 for winding, and the FRCC material 3 after peeling the release film is conveyed to the aligning device 22.
In the present embodiment, as shown in fig. 12, the FRCC material 3 sequentially includes, from bottom to top, a copper layer 31, a cured film layer 32, a semi-cured adhesive layer 33, and a release film layer 34.
Specifically, the semi-cured adhesive layer 33 is formed by a coating process; thus, the cured thin film layer 32 and the prepreg layer 33 are tightly bonded, and bubbles are not easily generated between the layers.
The release film layer 34 is a high temperature PET material. When the high-temperature PET is cut, carbonization cannot occur due to temperature rise, and impurities are prevented from being introduced into the FRCC material 3.
Specifically, the FRCC material 3 is sequentially conveyed on the multilayer board production line, the FRCC material 3 is punched and/or cut by the FRCC material processing unit 1, so that positioning holes and/or cover opening patterns corresponding to circuit board patterns are formed on the FRCC material 3, and then the release film 34 on the FRCC material 3 is peeled off by the peeling device 4, as shown in fig. 3 and 4; conveying the FRCC material 3 with the release film peeled off to a multilayer board composite unit 2, aligning and pressing the FRCC material 3 and a circuit board 6 by a circuit board conveying device 21, an aligning device 22 and a prepressing device 23, and performing hot pressing by a hot pressing device 24 to completely cure the semi-cured glue layer to form a multilayer board; the peeling device 4 can convey the FRCC material 3 forwards stably and recover the peeled release film 34, and the recovered release film 34 can be reused, so that the cost is reduced, and the competitiveness is improved.
Compared with the traditional process of laminating and bonding a single-sided board and a double-sided board by using a material consisting of a release film, a semi-cured adhesive and the release film, the novel FRCC material 3 is prepared by compounding the semi-cured adhesive layer and the traditional single-sided board through a coating process, and the automatic production of the multilayer circuit board is realized by matching with the multilayer board production line of the embodiment, so that the processing precision and yield of the multilayer board are improved, the production process flow of the multilayer circuit board is simplified, the use amount of the release film is reduced, the material cost and the labor cost are effectively saved, the water, electricity and gas use amount is reduced, and the generation and the emission of industrial garbage are reduced; the FRCC material 3 is directly attached to the circuit board, bubbles pressed in between layers can be discharged from through holes in the circuit board, the problem that the bubbles are easily pressed in between layers of a multi-layer board is solved, and the performance reliability of the multi-layer circuit board is improved.
As shown in fig. 5, in the embodiment, the conveying device 12 includes a pair of conveying rollers 121 disposed oppositely along the processing direction, and a conveying belt 122 sleeved outside the two conveying rollers 121, wherein a supporting plate 123 is disposed between the two conveying rollers 121 and on a side away from a carrying surface of the conveying belt 122, toothed stripes are uniformly distributed on the carrying surface of the conveying belt 122, and the cutting device 13 punches and/or cuts the FRCC material 3 at the supporting plate 123 according to the circuit board pattern. Compare with direct to carrying out the tractive conveying to FRCC material 3, convey through setting up conveyer 12, avoid FRCC material 3 to appear rocking and dislocation phenomenon in the data send process for cutting device 13 carries out accurate punching and/or cutting to FRCC material 3.
In this embodiment, as shown in fig. 1, the FRCC material processing unit 1 further includes a squeeze film roller 14 respectively disposed at two ends of the conveying device 12, wherein a lower end of the squeeze film roller 14 is lower than an upper end of the conveying roller 121 and an upper end of the unwinding roller 11. The squeeze film roller 14 compresses the FRCC material 3 at the two ends of the conveying device 12 downwards, so that the FRCC material 3 is tightly attached to the conveying belt 122, and the relative movement between the FRCC material 3 and the conveying belt 122 in the conveying process is avoided, so that the FRCC material 3 is stably conveyed, and the punching and/or cutting accuracy of the cutting device 13 on the FRCC material 3 is improved.
In this embodiment, still include an at least FRCC material turning device 15, this FRCC material turning device 15 includes two at least running rollers 151 that set up from top to bottom, FRCC material 3 after punching and/or cutting conveys to stripping off device 4 after two running rollers 151 overturn in proper order, through setting up at least an FRCC material turning device 15 that corresponds with FRCC material processing unit 1, change the orientation of cutting face of FRCC material 3 after the cutting, make the semi-solid glue layer 33 of FRCC material 3 towards circuit board 6 in follow-up course of working, realize the laminating of FRCC material 3 and circuit board 6, whole production line compact structure and can continuous production.
Of course, in other embodiments, as shown in fig. 16, FRCC material processing unit 1 further includes at least one FRCC material take-up roll 16, and FRCC material 3 after punching and/or cutting is conveyed to FRCC material take-up roll 16 for taking-up; the FRCC material 3 after rolling is transferred to the guiding unwinding roller 41 for unwinding, so that the orientation of the cutting surface of the FRCC material does not need to be changed by arranging the FRCC material overturning device 15.
In this embodiment, the device further comprises at least one leakage detecting and repairing system 5 for detecting the cut surface of the FRCC material 3 after the release film is peeled off, wherein the leakage detecting and repairing system 5 comprises a graph detection device 51 and a visual detection device 52; the visual inspection device 52 is provided with a leak repairing robot. Whether the graph on the cutting surface of the FRCC material 3 is complete or not is checked through the graph detection device 51, the result is recorded, meanwhile, whether the release film 34 'falls off at the position where the cover is to be opened or not is checked, and the visual detection device 52 controls the leakage repairing mechanical arm to perform leakage repairing on the release film 34' falling off at the position where the cover is opened. Specifically, the pattern inspection device 51 may be an AOI pattern inspection device, and the visual inspection device 52 may be a CCD visual inspection device.
In this embodiment, as shown in fig. 2, the alignment device 22 includes at least one horizontal positioning roller 221, at least one horizontal guiding roller 222, an alignment system 223 and an alignment detection system, the horizontal positioning roller 221 and the horizontal guiding roller 222 are horizontally disposed, the FRCC material 3 after being peeled off from the release film sequentially passes through the horizontal positioning roller 221 and the horizontal guiding roller 222, the horizontal positioning roller 221 and the horizontal guiding roller 22 enable the FRCC material 3 to be horizontally conveyed and parallel to the circuit board 6, and the alignment system 223 is used for aligning the positioning holes and/or the uncovering patterns of the FRCC material 3 with the positioning holes and/or the uncovering patterns of the circuit board 6, so as to realize accurate alignment of the FRCC material 3 with the circuit board 6, and facilitate improvement of the processing precision of the multilayer circuit board. Specifically, the alignment system 223 is a CCD vision-assisted alignment system.
The alignment detection system comprises a detection platform, and the detection platform is in communication connection with an acquisition module, an offset detection module, an alignment analysis module and a storage module.
The acquisition module comprises a searchlight and a camera which are arranged on the upper side of the core plate.
The offset detection module is used for carrying out offset detection on the release film after the core plate is aligned every time, and the offset detection process comprises the following steps: before the alignment begins, starting a searchlight, carrying out image shooting on a lower-layer core plate through a camera, marking the shot image as an initial image, amplifying the initial image into a pixel grid image, carrying out image processing on the pixel grid image to obtain a gray value of each pixel grid, obtaining a gray threshold value HDmin through a storage module, marking the pixel grid of the initial image as an initial pixel grid, marking the total number of the initial pixel grid as u, comparing the gray values of the initial pixel grid with the gray threshold value HDmin one by one, marking the number of the initial pixel grid with the gray value smaller than the gray threshold value HDmin as m, and marking the ratio of the m to the u as a standard ratio BZ; standard thresholds BZmin and BZmax are obtained through formulas BZmin = alpha 1 xBZ and BZmax = alpha 2 xBZ, wherein alpha 1 and alpha 2 are proportional coefficients, alpha 1 is more than or equal to 0.95 and less than or equal to 0.98, alpha 2 is more than or equal to 1.02 and less than or equal to 1.05, BZmin is a minimum standard threshold, BZmax is a maximum standard threshold, and a standard range is formed by the minimum standard threshold BZmin and the maximum standard threshold BZmax.
After the alignment is finished, a camera is adopted to shoot an image of the upper core plate, the obtained image is marked as a contrast image, the contrast image is amplified into a pixel grid image, the pixel grid image is subjected to image processing to obtain a gray value of each pixel grid, the pixel grids of the contrast image are marked as contrast pixel grids, the gray values of the contrast pixel grids are compared with a gray threshold one by one, the number of the contrast pixel grids with the gray values smaller than the gray threshold is marked as e, the ratio of the e to the u is marked as an offset ratio PY, the deviation degree of the offset ratio PY and a standard range represents the deviation degree of the upper core plate and the lower core plate after the alignment, and after the alignment is finished, the offset ratio is compared with the standard thresholds BZmin and BZmax: if PY is less than or equal to BZmin or PY is more than or equal to BZmax, judging that the core plate is unqualified in alignment, sending an unqualified in alignment signal to the detection platform by the alignment detection module, and analyzing the reason causing unqualified in alignment by the alignment analysis module when the alignment is unqualified; if BZmin is less than PY and less than BZmax, the core board is judged to be qualified in alignment, and the alignment detection module sends an alignment qualified signal to the detection platform.
All adopt counterpoint detection module to detect the core skew degree after counterpoint is accomplished every time to guarantee that the pressfitting position homoenergetic of each layer core can meet the demands, and counterpoint each time detects time measuring and all adopts the standard range of counterpoint when detecting for the first time as the reference, the gradual skew appears and leads to the unqualified phenomenon of multiply wood when avoiding appearing above-mentioned layer core as the reference, open the searchlight as supplementary when not detecting, got rid of the influence of normal illumination difference to the testing result, further guarantee to counterpoint and detect the precision.
The detection platform sends the alignment analysis signal to the alignment analysis module after receiving the alignment unqualified signal, and the alignment analysis module detects and analyzes the rotating speed of the horizontal guide roller after receiving the alignment analysis signal:
if the number of the horizontal guide rollers is one, directly acquiring the rotating speed value ZS of the horizontal guide rollers, acquiring rotating speed ranges ZSMin and ZSMax through a storage module, wherein ZSMin is a minimum rotating speed threshold value, ZSMax is a maximum rotating speed threshold value, and comparing the rotating speed value ZS of the horizontal guide rollers with the rotating speed threshold values ZSMin and ZSMax: if ZS is less than or equal to ZSMin or ZS is greater than or equal to ZSMax, the rotating speed of the horizontal guide roller is judged to be unqualified, the reason of unqualified alignment is caused by the fault of the alignment device 22, and the alignment analysis module sends an alignment maintenance signal to the detection platform; if Zsmin is more than ZS and less than Znmax, the rotating speed of the horizontal guide roller is judged to be qualified, the reason of unqualified alignment is caused by the fault of the circuit board conveying device 21, and the alignment analysis module sends a conveying detection signal to the detection platform;
if the number of the horizontal guide rollers is not one, marking the horizontal guide rollers as i, i =1,2, \ 8230, wherein n and n are positive integers, obtaining the rotating speed value of the horizontal guide rollers and marking the rotating speed value as ZSi, establishing a rotating speed set { ZS1, ZS2, \ 8230 } and ZSn } for the n rotating speed values ZSi, respectively obtaining a rotating speed mean value and a difference coefficient by carrying out mean value calculation and variance calculation on the rotating speed set, judging whether the rotating speed mean value and the difference coefficient meet the requirements or not, if the rotating speed mean value and the difference coefficient do not meet the requirements, judging that the rotating speed of the horizontal guide rollers is unqualified, and if the rotating speed mean value and the difference coefficient do not meet the requirements, sending an alignment maintenance signal to a detection platform by an alignment device 22 fault, and sending an alignment maintenance signal to the alignment analysis module; if the mean value of the rotating speed and the numerical value of the difference coefficient meet the requirements at the same time, the rotating speed of the horizontal guide roller is judged to be qualified, the reason that the alignment is unqualified is caused by the fault of the circuit board conveying device 21, and the alignment analysis module sends a conveying detection signal to the detection platform.
Adopt the counterpoint analysis module to carry out detection analysis to the reason that leads to counterpoint unqualified when counterpointing to according to the different detection scheme of structural design collocation of aligning device 22, judge circuit board conveyor 21 trouble or aligning device 22 trouble through the detection and analysis result, thereby avoid equipment trouble to follow-up core counterpoint cause the influence, also can improve the maintenance efficiency to equipment trouble simultaneously.
In this embodiment, the pre-pressing device 23 is a pair of pre-pressing wheels 231, and the FRCC material 3 and the circuit board 6 after alignment pass through the pre-pressing wheels 231 at the same time, so that the FRCC material 3 is attached to the circuit board 6.
In this embodiment, a circuit board detection device 28 is disposed between the circuit board conveying device 21 and the pre-pressing device 23 for detecting the circuit board. Specifically, the circuit board inspection device 28 is an AOI circuit board inspection device.
In order to fully cure the semi-cured glue layer 33 and improve the performance reliability of the circuit board, the multilayer board composite unit 2 further comprises a tunnel oven 27, and the multilayer board laminated by the hot pressing device 24 is baked by the tunnel oven 27.
In this embodiment, the system further comprises a punching inspection system 7, which is used for punching and/or cutting the multilayer board baked by the tunnel oven 27 and rolled by the press roller 29 to form through holes and/or blind holes, and inspecting and confirming the holes or patterns on the multilayer board. Specifically, the punch checking system 7 is an ESI punch checking system.
As shown in fig. 1, 9 and 10, the cutting device 13 includes at least one or more of an intelligent laser cutting device 131, a circular knife die cutting device 132 and a punching die cutting device 133. Specifically, intelligence laser cutting device 131 removes and punches and/or cuts FRCC material 3 according to the circuit board figure in conveyer 12's top, laser cutting has the characteristics that the precision is high, adopt laser cutting can effectively improve the precision of punching and/or cutting the figure, and circular knife cutting device 132 and punching press cutting device 133, equipment cost is lower, when being used for punching and/or cutting the great figure of aperture or cutting area, cutting efficiency is higher, has obvious advantage.
In actual production, can choose for use cutting device according to the precision and the cutting area of cutting figure, of course, also can cooperate the use together with one or two kinds in intelligent laser cutting device 131, circular knife cutting device 132 and punching press cutting device 133, guarantee the precision of punching and/or cutting figure, simultaneously, improve production efficiency.
In this embodiment, the FRCC material processing unit further includes a protection film unwinding device 26, which includes a protection film unwinding roller 261 and a protection film winding roller 262, the protection film unwinding roller 261 transmits the protection film to the pre-pressing device 23, the protection film covers the FRCC material 3 and passes through the pre-pressing device 23 and the hot-pressing device 24 along with the FRCC material 3 and the circuit board 6, the FRCC material 3 and the circuit board 6 are attached and pressed to form a multi-layer board, and then the protection film is transmitted to the protection film winding roller 262 for winding. Specifically, the protection film is the PET membrane, pellosil or TPX, above-mentioned protection film material is softer or take place to soften under the condition of being heated, consequently, when passing through hot press unit 24, form in the hot pressing process with circuit board figure assorted pressfitting figure, and drive FRCC material 3 and warp, make the clearance between the abundant filling circuit of semi-solid glue film 33 on the FRCC material 3, thereby make FRCC material 3 and circuit board 6 closely laminate, compare in hot press unit 24 directly to FRCC material 3 hot pressing and compare, use the material softer or take place the softened protection film to keep apart by being heated between FRCC material 3 and hot press unit 24, the pressfitting effect is better.
As shown in fig. 2, 6 and 11, the hot pressing device 24 includes at least one pair of hot pressing rollers 241 or a flat plate hot pressing device 242, wherein the flat plate hot pressing device 242 includes at least one set of hot pressing flat plates 2421 disposed opposite to each other up and down, and an annular rail 2422 disposed corresponding to the hot pressing flat plates 2421, the hot pressing flat plates 2421 are movably connected to the annular rail 2422, and the annular rail 2422 moves the hot pressing flat plates 2421 along the processing direction of the multi-layer board combining unit 2, and continues to move along the annular rail 2422 to the initial position after the pressing is completed. Specifically, when the FRCC material 3 and the circuit board 6 which are pre-pressed are conveyed to the flat plate hot press device 242, the two opposite hot press flat plates 2421 are oppositely pressed to perform hot pressing on the FRCC material 3 and the circuit board 6, and move forward along the circular rail 2422 in synchronization with the FRCC material 3 and the circuit board 6 until the pressing time reaches the preset time, at this time, the hot press flat plates 2421 which are pressed together are separated, and continue to move back to the initial position along the circular rail 2422, wait for the FRCC material 3 and the circuit board 6 conveyed by the pre-press device 23, and repeat the above actions, so that the hot press multi-layer plate 2421 can continuously move and press along the circular rail 2422 by reasonably setting the number of the hot press flat plates 2421 according to the conveying frequency of the composite unit 2, thereby avoiding pressure leakage and effectively improving the pressing effect.
As shown in fig. 2, according to the production process requirement, a multilayer plate winding roller 251 or a multilayer plate cutting device 252 is further included, the multilayer plate processed by the multilayer plate composite unit 2 is conveyed to the multilayer plate winding roller 251 or the multilayer plate cutting device 252, and the multilayer plate is wound by the multilayer plate winding roller 251; or the multilayer board cutting device 252 cuts the multilayer board into sheets, and the sheets of the multilayer board are stacked in sequence by the manipulator; and carrying out exposure development and circuit board etching on the rolled multilayer board or the multilayer board cut into sheets to form the multilayer circuit board.
Example two
As shown in fig. 7 and fig. 18, the main difference between the second embodiment and the first embodiment is that in the material processing unit 1, the release film of the FRCC material is deviated from the cutting device to be conveyed, the cutting device punches/or cuts the FRCC material, only positioning holes are formed in the FRCC material, so that the punched and/or cut FRCC material is directly conveyed to the peeling device 4 through at least one guide roller 17 to peel off the protective film, and then conveyed to the multi-layer board combining unit 2 to be sequentially aligned, pre-pressed and hot-pressed, so that the FRCC material 3 and the circuit board 6 are pressed together to form a multi-layer board, and the punched and drilled FRCC material does not need to be turned over or rolled, and the leakage detecting and repairing system 5 does not need to be arranged to detect the cutting surface of the FRCC material.
EXAMPLE III
The third embodiment discloses a multilayer circuit board processing method, which comprises the following steps:
s1, preprocessing an FRCC material: firstly, placing a roll-shaped FRCC material 3 on an unwinding roller 11, starting an FRCC material processing unit 1, conveying the FRCC material 3 to a conveying device 12, and punching and/or cutting the FRCC material 3 by a cutting device 13;
s2, stripping a release film: conveying the FRCC material 3 processed in the step S1 to a stripping device 4, stripping a release film on the FRCC material 3 by the stripping device 4, and conveying the FRCC material 3 stripped of the release film to an alignment device 22;
s3, compounding a multilayer board: when the FRCC material 3 with the release film 34 peeled off is transferred to the alignment device 22, the circuit board conveying device 21 synchronously transfers the circuit board to the alignment device 22, at this time, the semi-cured glue layer 33 of the FRCC material 3 faces the circuit board 6, the alignment between the FRCC material 3 and the circuit board 6 is completed by the alignment device 22, and then the FRCC material is sequentially transferred to the pre-pressing device and the hot-pressing device 24 for pressing, so as to form a multilayer board, as shown in fig. 13.
Specifically, in the step S1, after punching and/or cutting by the cutting device 13, positioning holes and/or uncovering patterns are formed on the FRCC material 3, when the uncovering patterns need to be formed on the FRCC material 3, the release film of the FRCC material 3 faces the cutting device 13 in the process of conveying the FRCC material 3 to the conveying device 12 by the unwinding roller 11, and the cutting device 13 only cuts contour lines of corresponding shapes on the release film 34 according to the uncovering patterns; when the positioning holes are only required to be formed on the FRCC material 3, the orientation of the release film 34 in the conveying process of the FRCC material 3 is not limited; meanwhile, in step S2, when the release film 34 of the FRCC material 3 has the outline of the uncapping figure, the release film 34' with the corresponding shape remains on the FRCC material 3 after peeling the release film and at the uncapping position, as shown in fig. 12.
Specifically, in step S2, the opening pattern on the FRCC material 3 after peeling off the release film is detected by the pattern detection device 5, and a detection result is recorded, and then the visual detection device 52 detects whether the release film 34' at the opening position is peeled off, and controls the leak repairing manipulator to supplement the release film with a corresponding shape at the peeling position.
Specifically, in step S2, the circuit board detection device 28 detects the circuit board conveyed by the circuit board conveying device 21 and records the detection result, the horizontal positioning roller 221 and the horizontal guide roller 222 horizontally convey the FRCC material 3 after peeling off the release film and are parallel to the circuit board 6, meanwhile, the alignment system 223 is used to align the positioning holes and/or the uncapping patterns on the FRCC material 3 with the positioning holes and/or the uncapping patterns on the circuit board 6, and the aligned FRCC material 3 and the circuit board 6 pass through the two pre-pressing rollers 231 to be pre-pressed and then are conveyed to the hot-pressing device 24 to be hot-pressed.
In step S2, the protective film is further conveyed to the pre-pressing device 23 through the protective film unwinding roller 261, so that the protective film covers the FRCC material 3 and passes through the pre-pressing device 23 and the hot-pressing device 24 together with the FRCC material 3 and the circuit board 6, and the FRCC material 3 and the circuit board 6 are pressed together to form a multilayer board, at this time, the protective film is conveyed to the protective film winding roller 262 to be wound, the multilayer board pressed and formed by the hot-pressing device 24 is baked through the tunnel oven 27 to form a multilayer board with stable performance, the multilayer board is conveyed to the punching inspection system 7, the punching inspection system 7 punches holes on the FRCC material 3 of the multilayer board to form through holes and blind holes, and inspects and confirms holes and patterns on the multilayer board; and finally, winding or cutting the multilayer board into sheets. In the hot pressing process, a protective film is used for isolation between the hot pressing device 24 and the FRCC material 3, the gap between circuits is fully filled by the semi-cured glue layer 33 on the FRCC material 3, the FRCC material 3 and the circuit board 6 are tightly attached, and the pressing effect is better.
Specifically, the processing method of the multilayer circuit board further comprises the following steps:
s4, forming a circuit on the FRCC material 3 by the multilayer board through processes including dry film pasting, exposure, development, electroplating and etching to obtain a multilayer circuit board, etching copper on the FRCC material 3 and at the uncovering position to form an opening 9 corresponding to the uncovering pattern, and enabling release films 34' reserved on the FRCC material 3 to correspond to the opening 9 one by one;
s5, uncovering: cutting the FRCC material along the edge of the opening formed by etching in the step S4, and stripping the residual FRCC material at the cut part to finish uncovering; when the FRCC material 3 is laminated with the circuit board 6, because the semi-cured adhesive 33 is isolated from the circuit board 6 by the remaining release film 34' at the position corresponding to the opening 9 and is not bonded together, the rest FRCC material can be easily stripped after the cured insulating film layer and the adhesive layer are cut off;
and S6, repeating the steps S2, S3, S4 and S5 on the multi-layer circuit board after the cover is opened until the multi-layer circuit board with the required number of layers is obtained.
As shown in fig. 8, the opening and covering method in the multilayer circuit board processing method of the embodiment not only can form a common through hole 81 in the multilayer circuit board, but also solves the problems of difficult processing and low processing accuracy of the 1-step hole 82, the 2-step staggered hole 83 and the 2-step overlapped hole 84 in the multilayer circuit board. As shown in fig. 19, a conventional cover opening method for a multi-layer flexible circuit board, which is used for opening a cover on a multi-layer flexible circuit board formed by bonding a single-sided board 10 and a double-sided board 30, includes the following steps:
(1) Etching the copper layer 101 of the single-sided board 10 to form a first opening;
(2) Pseudo-jointing the single panel 10 and the combined glue 20, and etching the PI layer of the single panel 10 and the combined glue 20 to form a second opening, wherein the aperture of the second opening is smaller than that of the first opening;
(3) The single-sided board 10 and the combined adhesive 20 which are connected in a temporary manner are connected with the double-sided board 30 in a local manner, so that the first opening and the second opening form an opening cover area 40, the copper surface on one side of the double-sided board 30 forms the bottom of the opening cover area 40, and the hole wall of the first opening and the hole wall of the second opening form the side wall of the opening cover area 40;
(4) Plating copper layers 50 on the bottom and sidewalls of the open-cap region 40;
(5) Covering the mouth part of the second opening connected with the first opening with a dry film 60 to form a covering area of the dry film 6 on the hole wall of at least the second opening and the bottom of the cover opening area 40;
(6) Selectively plating the area not covered by the dry film 60 to form a selective plating layer 70;
(7) Removing the dry film 60;
(8) The copper layer 50 in the covered area of the dry film 60 is etched.
Compared with the existing cover opening process of the multilayer circuit board, the cover opening process of the FRCC material is adopted, the cover is opened by using high-temperature PET to replace PI, and the process flow comprises the following steps: laser pattern on PET → PET outside the lift-off pattern → alignment → multi-layer lamination → etching → cutting → uncovering the cover, the advantages are as follows:
a. the material cost is saved: the cost of the inner layer CVL covering film plus the PI protective film is saved;
b. the process flow is saved: omitting the lamination flow of the covering film and the PI protective film;
c. the process precision is improved: the alignment of the cover opening area is only affected by the circuit precision, and the alignment precision is improved qualitatively compared with that of the traditional process;
d. the material produced by the high-temperature release film can be directly cut by laser and then is suitable for uncovering, the release film is recycled, the cost can be reduced, and the competitiveness is improved.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (21)
1. Multiply wood production line, its characterized in that includes:
at least one FRCC material processing unit: the device comprises an unwinding roller and a conveying device which are sequentially arranged along the processing direction, wherein the unwinding roller conveys the FRCC material to the conveying device, and a cutting device for punching and/or cutting the FRCC material is arranged at the conveying device;
a multi-layer board composite unit: the hot-pressing device comprises a circuit board conveying device, a positioning device, a prepressing device and a hot-pressing device which are sequentially arranged along the processing direction, wherein the circuit board conveying device conveys a circuit board to the prepressing device;
the peeling device comprises a guide unwinding roller, a peeling positioning roller and a release film winding roller, wherein after the punched and/or cut FRCC material is conveyed to the peeling positioning roller through the guide unwinding roller, the release film is peeled and conveyed to the release film winding roller for winding, and the FRCC material after the release film is peeled is conveyed to the alignment device;
the alignment device comprises at least one horizontal positioning roller, at least one horizontal guide roller, an alignment system and an alignment detection system, wherein the horizontal positioning roller and the horizontal guide roller are horizontally arranged, the FRCC material stripped from the release film sequentially passes through the horizontal positioning roller and the horizontal guide roller, the horizontal positioning roller and the horizontal guide roller enable the FRCC material to be horizontally conveyed and parallel to the circuit board, and the alignment system is used for aligning the positioning holes and/or the uncapping patterns of the FRCC material with the positioning holes and/or the uncapping patterns of the circuit board;
the alignment detection system comprises a detection platform, and the detection platform is in communication connection with an acquisition module, an offset detection module, an alignment analysis module and a storage module;
the acquisition module comprises a searchlight and a camera which are arranged on the upper side of the core plate;
the offset detection module is used for carrying out offset detection on the release film after the core plate is aligned every time, and the offset detection process comprises the following steps: before the alignment begins, starting a searchlight, carrying out image shooting on a lower-layer core plate through a camera, marking the shot image as an initial image, amplifying the initial image into a pixel grid image, carrying out image processing on the pixel grid image to obtain a gray value of each pixel grid, obtaining a gray threshold value HDmin through a storage module, marking the pixel grid of the initial image as an initial pixel grid, marking the total number of the initial pixel grid as u, comparing the gray values of the initial pixel grid with the gray threshold value HDmin one by one, marking the number of the initial pixel grid with the gray value smaller than the gray threshold value HDmin as m, and marking the ratio of the m to the u as a standard ratio BZ; obtaining standard thresholds BZmin and BZmax by carrying out numerical calculation on the standard ratio BZ, wherein BZmin is a minimum standard threshold, BZmax is a maximum standard threshold, and a standard range is formed by the minimum standard threshold BZmin and the maximum standard threshold BZmax;
after the alignment is finished, a camera is adopted to shoot images of the upper layer core board, the obtained images are marked as comparison images, the comparison images are amplified to be pixel grid images, the pixel grid images are subjected to image processing to obtain the gray value of each pixel grid, the pixel grids of the comparison images are marked as comparison pixel grids, the gray values of the comparison pixel grids are compared with a gray threshold one by one, the number of the comparison pixel grids with the gray value smaller than the gray threshold is marked as e, the ratio of the e to the u is marked as an offset ratio PY, and the offset ratio is compared with standard thresholds BZmin and BZmax: if PY is less than or equal to BZmin or PY is more than or equal to BZmax, judging that the core plate is unqualified in alignment, and sending an unqualified in alignment signal to the detection platform by the alignment detection module; if BZmin is less than PY and less than BZmax, judging that the core board is qualified in alignment, and sending an alignment qualified signal to the detection platform by the alignment detection module;
the detection platform sends an alignment analysis signal to the alignment analysis module after receiving the alignment unqualified signal, and the alignment analysis module detects and analyzes the rotating speed of the horizontal guide roller after receiving the alignment analysis signal;
if the number of the horizontal guide rollers is one, directly acquiring a rotating speed value ZS of the horizontal guide rollers, acquiring rotating speed ranges ZSMin and ZSMax through a storage module, wherein ZSMin is a minimum rotating speed threshold value, ZSMax is a maximum rotating speed threshold value, comparing the rotating speed value ZS of the horizontal guide rollers with the rotating speed threshold values ZSMin and ZSMax, and judging the reason of unqualified alignment according to the comparison result of the rotating speed value ZS and the rotating speed threshold values ZSMin and ZSMax;
if the number of the horizontal guide rollers is not one, the horizontal guide rollers are marked as i, i =1,2, \8230, n and n are positive integers, the rotating speed values of the horizontal guide rollers are obtained and marked as ZSi, rotating speed sets { ZS1, ZS2, \8230;, ZSn } are established for the n rotating speed values ZSi, average value calculation and variance calculation are carried out on the rotating speed sets to obtain rotating speed average values and difference coefficients respectively, and whether the rotating speed average values and the difference coefficients meet requirements or not is judged.
2. The multi-layer board production line as claimed in claim 1, wherein the conveying device comprises a pair of conveying rollers oppositely arranged along the processing direction and a conveying belt sleeved outside the two conveying rollers, wherein a supporting plate is arranged between the two conveying rollers and on the side away from the carrying surface of the conveying belt, the carrying surface of the conveying belt is provided with uniformly distributed toothed stripes, and the cutting device punches and/or cuts the FRCC material according to the circuit board pattern at the position of the supporting plate.
3. The multi-layer board production line as claimed in claim 2, wherein the FRCC material processing unit further comprises a squeeze film roller disposed at both ends of the conveying device, respectively, wherein the lower end of the squeeze film roller is lower than the upper end of the conveying roller and the upper end of the unwinding roller, respectively.
4. The multi-layer board production line as claimed in claim 1, further comprising at least one FRCC material turnover device, wherein the FRCC material turnover device comprises at least two rollers arranged up and down, and the perforated and/or cut FRCC material is turned over by the two rollers in sequence and then conveyed to the peeling device.
5. The multi-layer board production line as claimed in claim 1, wherein the FRCC material processing unit further comprises at least one FRCC material take-up roll, and the punched and/or cut FRCC material is conveyed to the FRCC material take-up roll for taking up; and transferring the coiled FRCC material to a guide unreeling roller for unreeling.
6. The multi-layer board production line as claimed in claim 1, further comprising at least one leakage inspection and repair system for inspecting the cut surface of the FRCC material after peeling the release film, wherein the leakage inspection and repair system comprises a pattern detection device and a visual detection device; the visual detection device is provided with a leak repairing mechanical arm.
7. The multi-layer board production line as claimed in claim 1, wherein the pre-pressing device is a pair of pre-pressing rollers, and the aligned FRCC material and the circuit board simultaneously pass through the pre-pressing rollers to adhere the FRCC material to the circuit board.
8. The multilayer board production line as claimed in claim 1, wherein a circuit board detection device is arranged between the circuit board conveying device and the pre-pressing wheel for detecting the circuit board.
9. The multilayer board production line according to claim 1, wherein the multilayer board composite unit further comprises a tunnel oven through which the multilayer boards laminated by the hot press are baked.
10. The multi-layer board production line of claim 8, further comprising a hole punching inspection system for punching and/or cutting the multi-layer board after the tunnel oven baking, forming through holes and/or blind holes, and inspecting the holes or patterns on the multi-layer board.
11. The multi-layer board production line as claimed in claim 1, wherein the cutting device comprises at least one or more of an intelligent laser cutting device, a circular knife die cutting device, and a stamping die cutting device.
12. The multi-layer board production line as claimed in claim 1, wherein the FRCC material processing unit further comprises a protective film unwinding device including a protective film unwinding roller and a protective film winding roller, the protective film unwinding roller transmits the protective film to the pre-pressing device, the protective film covers the FRCC material and passes through the pre-pressing device and the hot-pressing device together with the FRCC material and the circuit board, the FRCC material and the circuit board are laminated to form the multi-layer board, and then the protective film is transmitted to the protective film winding roller for winding.
13. The multilayer board production line according to claim 12, wherein the protective film is a PET film, a silicone film, or TPX.
14. The multi-layer board production line according to claim 1, wherein the hot pressing device comprises at least one pair of hot pressing rollers or a flat board hot pressing device, wherein the flat board hot pressing device comprises at least one group of hot pressing flat boards which are arranged oppositely up and down and an annular rail which is arranged correspondingly to the hot pressing flat boards, the hot pressing flat boards are movably connected with the annular rail, and the annular rail enables the hot pressing flat boards to move along the processing direction of the multi-layer board composite unit and continues to move back to the initial position along the annular rail after the pressing is completed.
15. The multilayer board production line according to claim 1, further comprising a multilayer board take-up roll or a multilayer board cutting device, wherein the multilayer board processed by the multilayer board laminating unit is conveyed to the multilayer board take-up roll or the multilayer board cutting device, and the multilayer board take-up roll takes up the multilayer board; or the multilayer board cutting device cuts the multilayer board into sheets, and the sheets of the multilayer board are sequentially stacked through a manipulator; and forming a circuit on the FRCC material by the rolled multilayer board or the multilayer board cut into sheets through the processes of dry film pasting, exposure, development, etching and electroplating to manufacture the multilayer circuit board.
16. A multilayer circuit board processing method is characterized by comprising the following steps:
s1, preprocessing an FRCC material: firstly, placing a roll-shaped FRCC material on an unwinding roller, starting an FRCC material processing unit, conveying the FRCC material to a conveying device, and punching and/or cutting the FRCC material by a cutting device;
s2, stripping a release film: conveying the FRCC material processed in the step S1 to a stripping device, stripping a release film on the FRCC material by the stripping device, and conveying the FRCC material subjected to stripping of the release film to an alignment device;
s3, compounding a multilayer board: when the FRCC material after stripping the release film is conveyed to the aligning device, the circuit board conveying device synchronously conveys the circuit board to the aligning device, at the moment, the semi-cured glue layer of the FRCC material faces the circuit board, the aligning device is used for completing the aligning of the FRCC material and the circuit board, and then the FRCC material and the circuit board are sequentially conveyed to the pre-pressing device and the hot-pressing device for pressing to form a multilayer board;
in the step S1, after being cut by a cutting device, an uncovering pattern is formed on the FRCC material, when the uncovering pattern needs to be formed on the FRCC material, a release film of the FRCC material faces the cutting device in the process that an unwinding roller conveys the FRCC material to a conveying device, and the cutting device only cuts contour lines in corresponding shapes on the release film according to the uncovering pattern;
in step S2, when the release film of the FRCC material has the outline of the opening pattern, the release film with the corresponding shape is retained on the FRCC material after the release film is peeled and at the opening position.
17. The method of processing a multilayer wiring board according to claim 16, wherein in step S1, after the holes are punched by the cutting means, the positioning holes are formed in the FRCC material, and when the positioning holes only need to be formed in the FRCC material, there is no limitation on the orientation of the release film during the transportation of the FRCC material.
18. The processing method of the multilayer circuit board according to claim 16, wherein in the step S2, the opening pattern on the FRCC material after peeling off the release film is detected by a pattern detection device and the detection result is recorded, then a visual detection device is used to detect whether the release film at the opening position is fallen off, and a leak repairing manipulator is controlled to supplement the release film with a corresponding shape at the falling position.
19. The processing method of the multi-layer circuit board according to claim 16, wherein in the step S2, the circuit board detection device detects the circuit board conveyed by the circuit board conveying device and records the detection result, the horizontal positioning roller and the horizontal guide roller horizontally convey the FRCC material stripped from the release film and are parallel to the circuit board, meanwhile, the alignment system is used to align the positioning holes and/or the uncovering patterns on the FRCC material with the positioning holes and/or the uncovering patterns on the circuit board, the aligned FRCC material and the circuit board pass through two pre-pressing rollers to be pre-pressed, and then are conveyed to the hot-pressing device to be hot-pressed.
20. The method of processing a multilayer circuit board according to claim 16, wherein in step S2, the protective film is further conveyed to a pre-pressing device through a protective film unwinding roller, so that the protective film covers the FRCC material and passes through the pre-pressing device and the hot-pressing device together with the FRCC material and the circuit board, and the FRCC material and the circuit board are laminated to form a multilayer board, at this time, the protective film is conveyed to a protective film winding roller for winding, and the multilayer board laminated by the hot-pressing device is baked in a tunnel oven to form a multilayer board with stable performance, the multilayer board is conveyed to a punching inspection system, and the punching inspection system punches holes on the FRCC material of the multilayer board to form through holes and blind holes and inspects and confirms the holes and patterns on the multilayer board; and finally, winding or cutting the multilayer board into sheets.
21. The method of processing a multilayer wiring board according to claim 16, further comprising the steps of:
s4, forming a circuit on the FRCC material through the processes of dry film pasting, exposure, development, electroplating and etching lines on the multilayer board to obtain a multilayer circuit board, and etching copper on the FRCC material at the uncovering position to form an opening corresponding to the uncovering pattern;
s5, uncovering: cutting the FRCC material along the edge of the opening formed by etching in the step S4, and stripping the residual FRCC material at the cut part to finish uncovering;
and S6, repeating the steps S2, S3, S4 and S5 on the multi-layer circuit board after the cover is opened until the multi-layer circuit board with the required number of layers is obtained.
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| CN202210545619.5A CN115529747B (en) | 2022-05-19 | 2022-05-19 | Multilayer board production line and multilayer circuit board processing method |
| PCT/CN2023/092897 WO2023221809A1 (en) | 2022-05-19 | 2023-05-09 | Multilayer board production line and multilayer circuit board processing method |
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| CN202210545619.5A CN115529747B (en) | 2022-05-19 | 2022-05-19 | Multilayer board production line and multilayer circuit board processing method |
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| CN117601548B (en) * | 2023-12-27 | 2024-05-28 | 苏州市华扬电子有限公司 | High-precision die cutting laminating device and automatic laminating method |
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| CN107241865A (en) * | 2017-07-19 | 2017-10-10 | 东莞市营特电子科技有限公司 | Manufacture the equipment and its technique of FPC |
| CN109435422A (en) * | 2018-11-21 | 2019-03-08 | 王蒙蒙 | A kind of copper-clad plate production equipment and copper-clad plate processing method |
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| JP3983552B2 (en) * | 2002-01-16 | 2007-09-26 | 三井金属鉱業株式会社 | MATERIAL OF MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING DOUBLE PRINTED WIRING BOARD |
| TWI336603B (en) * | 2004-12-03 | 2011-01-21 | Ngk Spark Plug Co | Method and apparatus for producing a wiring board, including film-peeling |
| CN101472404B (en) * | 2007-12-25 | 2011-12-07 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN108215370B (en) * | 2016-12-09 | 2019-09-13 | 松本涂层科技（昆山）有限公司 | A kind of flexible circuit board pressing resistance glue release paper and manufacturing process |
| CN206389630U (en) * | 2017-01-04 | 2017-08-08 | 嘉联益电子(昆山)有限公司 | Volume to volume circuit board pressing equipment |
| JP2019140286A (en) * | 2018-02-13 | 2019-08-22 | 日本メクトロン株式会社 | Method for manufacturing flexible printed board and apparatus for manufacturing flexible printed board |
| CN110177434B (en) * | 2019-02-20 | 2021-11-23 | 淳华科技(昆山)有限公司 | Soft circuit board cover-removing equipment |
| CN115529747B (en) * | 2022-05-19 | 2023-04-07 | 世大新材料(深圳)有限公司 | Multilayer board production line and multilayer circuit board processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107241865A (en) * | 2017-07-19 | 2017-10-10 | 东莞市营特电子科技有限公司 | Manufacture the equipment and its technique of FPC |
| CN109435422A (en) * | 2018-11-21 | 2019-03-08 | 王蒙蒙 | A kind of copper-clad plate production equipment and copper-clad plate processing method |
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Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Patentee after: Shida new material (Shenzhen) Co.,Ltd. Country or region after: China Address before: 518118 3rd Floor, Building A1, No. 9 Songzikeng Reservoir Road, Laokeng Community, Longtian Street, Pingshan District, Shenzhen, Guangdong Patentee before: Shida new material (Shenzhen) Co.,Ltd. Country or region before: China |