CN115521744A - Elastic epoxy adhesive and preparation method and application thereof - Google Patents
Elastic epoxy adhesive and preparation method and application thereof Download PDFInfo
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- CN115521744A CN115521744A CN202211374244.7A CN202211374244A CN115521744A CN 115521744 A CN115521744 A CN 115521744A CN 202211374244 A CN202211374244 A CN 202211374244A CN 115521744 A CN115521744 A CN 115521744A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Abstract
The invention provides an elastic epoxy adhesive and a preparation method and application thereof, and belongs to the technical field of adhesive materials. The elastic epoxy adhesive provided by the invention comprises a certain amount of a component A and a component B, and the component A and the component B are subjected to curing reaction in a using process in a synergistic manner by controlling the type and the weight fraction of the preparation raw materials of the component A and the type and the weight fraction of the preparation raw materials of the component B, so that the elastic epoxy adhesive has high strength, high toughness and high elasticity, can realize flexible connection between equipment and equipment or between equipment and a base body, and achieves an excellent damping effect. The elastic epoxy adhesive provided by the invention has the advantages that the bonding strength can reach 2.5MPa, the tensile strength can reach 2.2MPa, the elongation at break can reach 100%, and the compressive strength can reach 15MPa.
Description
Technical Field
The invention relates to the technical field of adhesive materials, in particular to an elastic epoxy adhesive and a preparation method and application thereof.
Background
In the prior art, the vibration is generally absorbed by a metal spring, a rubber gasket or a prefabricated rubber pad, so that the problem of resonance existing in rigid connection between equipment or between the equipment and a base body is solved. In addition, the existing epoxy adhesive generally has higher strength, higher brittleness (i.e., low toughness) and low elasticity, and when the toughness and the elasticity are higher, the strength and the rigidity are lower, and the high strength, the high toughness and the high elasticity cannot be considered at the same time, so that the problem of resonance of rigid connection between equipment cannot be effectively solved by the epoxy adhesive in the prior art, i.e., a better damping effect cannot be achieved. Therefore, the problem to be solved in the prior art is to provide an epoxy adhesive with high strength, high toughness and high elasticity so as to effectively realize flexible connection between devices or between a device and a substrate and achieve an excellent damping effect.
Disclosure of Invention
The elastic epoxy adhesive provided by the invention has high strength, high toughness and high elasticity, can realize flexible connection between equipment or between the equipment and a matrix, and achieves an excellent damping effect.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides an elastic epoxy adhesive which comprises a component A and a component B, wherein the mass ratio of the component A to the component B is 1: (0.8-1.5);
the component A is prepared from the following raw materials in parts by weight: 80-89 parts of bisphenol A epoxy resin, 20-30 parts of bisphenol F epoxy resin, 10-18 parts of polyglycol diglycidyl ether, 8-12 parts of ethylene glycol diglycidyl ether, 8-12 parts of neopentyl glycol diglycidyl ether, 1-3 parts of silane coupling agent and 10.1-0.5 part of first organic silicon defoamer;
the component B is prepared from the following raw materials in parts by weight: 100 to 120 parts of modified curing agent, 1 to 3 parts of DMP30 accelerator and 0.1 to 0.4 part of second organic silicon defoamer.
Preferably, the mass ratio of the component A to the component B is 1: (1-1.3).
Preferably, the silane coupling agent is one or more of propyltrimethoxysilane and aminopropyltriethoxysilane.
Preferably, the first silicone defoamer is an a530 defoamer.
Preferably, the modified curing agent is one or more of aliphatic amine, benzyl alcohol, isophorone diamine, ethylene diamine, triethylene tetramine and polyether amine D230.
Preferably, the second silicone defoamer is an a530 defoamer.
Preferably, the preparation method of the component A comprises the following steps: and mixing bisphenol A epoxy resin, bisphenol F epoxy resin, polyglycol diglycidyl ether, glycol diglycidyl ether, neopentyl glycol diglycidyl ether, a silane coupling agent and a first organic silicon defoaming agent to obtain a component A.
Preferably, the preparation method of the component B comprises the following steps: and mixing the modified curing agent, the DMP30 accelerator and the second organic silicon defoamer to obtain a component B.
The invention also provides the application of the elastic epoxy adhesive in the technical scheme in a damping material.
Preferably, the use method of the elastic epoxy adhesive comprises the following steps:
mixing the component A and the component B to obtain a mixture;
and filling the mixture into a part to be damped for curing reaction, so as to realize the aim of damping by using the elastic epoxy adhesive.
The invention provides an elastic epoxy adhesive which comprises a component A and a component B, wherein the mass ratio of the component A to the component B is 1: (0.8-1.5); the component A is prepared from the following raw materials in parts by weight: 80-89 parts of bisphenol A epoxy resin, 20-30 parts of bisphenol F epoxy resin, 10-18 parts of polyglycol diglycidyl ether, 8-12 parts of ethylene glycol diglycidyl ether, 8-12 parts of neopentyl glycol diglycidyl ether, 1-3 parts of silane coupling agent and 10.1-0.5 part of first organic silicon defoamer; the component B is prepared from the following raw materials in parts by weight: 100 to 120 parts of modified curing agent, 1 to 3 parts of DMP30 accelerator and 0.1 to 0.4 part of second organic silicon defoamer. According to the invention, bisphenol A epoxy resin is used as a raw material for preparing the component A, so that the reaction of the bisphenol A epoxy resin and a modified curing agent is utilized to improve the comprehensive mechanical property of the prepared elastic epoxy adhesive, and the problems of overlarge brittleness, low strength, poor fatigue resistance and the like of the elastic epoxy adhesive are avoided; bisphenol F epoxy resin is used as a raw material for preparing the component A and is used for improving the chemical resistance and the high temperature resistance of the elastic epoxy adhesive; the polyglycol diglycidyl ether is used as a raw material for preparing the component A and is used as a difunctional epoxy resin (bisphenol A epoxy resin and bisphenol F epoxy resin) reactive diluent, so that the flexibility is good, the bisphenol A epoxy resin is endowed with flexibility, and the elongation at break and the impact strength of the prepared elastic epoxy adhesive are improved; ethylene glycol diglycidyl ether is used as a raw material for preparing the component A, is used as an active epoxy diluent, is mainly used for reducing the viscosity of bisphenol A epoxy resin and bisphenol F epoxy resin, is favorable for forming chain and net structures during the curing reaction in the use process of the subsequent elastic epoxy adhesive, and improves the mechanical properties of the resin formed after the curing reaction, such as tensile strength, bending strength, compressive strength, impact strength and the like; neopentyl glycol diglycidyl ether is used as a raw material for preparing the component A and is used as a reactive diluent of bisphenol A epoxy resin and bisphenol F epoxy resin, so that the reactivity of the bisphenol A epoxy resin and the bisphenol F epoxy resin with a modified curing agent can be reduced under the same temperature condition, and more operable time can be given; the first organic silicon defoaming agent is used as the raw material for preparing the first component so as to reduce the generation of bubbles in the curing reaction process of the elastic epoxy adhesive in use and ensure the compactness of the elastic epoxy adhesive; the modified curing agent is used as a raw material for preparing the component B to play a role in curing, so that the effect of converting liquid into solid in a mixture obtained by mixing the component A and the component B in the using process of the elastic epoxy adhesive is promoted, the phenomena that the explosion polymerization and the curing reaction are carried out too fast when the using amount of the modified curing agent is too high and the curing reaction cannot be carried out or the curing time is long and the curing reaction cannot be carried out fully when the using amount of the modified curing agent is too low are avoided, and the comprehensive performance of the prepared elastic epoxy adhesive is reduced; DMP30 accelerant is used as raw material for preparing the component B, so as to adjust the curing time in the using process of the elastic epoxy adhesive, and the elastic epoxy adhesive can be conveniently used; and a second organic silicon defoaming agent is used as a raw material for preparing the component B, so that the phenomenon that bubbles are generated in the use or stirring process of the elastic epoxy adhesive to influence the performance of the elastic epoxy adhesive is avoided. The elastic epoxy adhesive has high strength, high toughness and high elasticity under the synergistic action of all the components, can realize flexible connection between equipment or between the equipment and a base body, and achieves an excellent shock absorption effect. The results of the examples show that the elastic epoxy adhesive provided by the invention has the advantages that the bonding strength can reach 2.5MPa, the tensile strength can reach 2.2MPa, the elongation at break can reach 100%, and the compressive strength can reach 15MPa, which indicates that the elastic epoxy adhesive provided by the invention has good adhesion performance, high strength, high toughness and high elasticity, can realize flexible connection between equipment and equipment or between equipment and a base body, and achieves excellent shock absorption effect.
Detailed Description
The invention provides an elastic epoxy adhesive which comprises a component A and a component B, wherein the mass ratio of the component A to the component B is 1: (0.8-1.5);
the component A is prepared from the following raw materials in parts by weight: 80-89 parts of bisphenol A epoxy resin, 20-30 parts of bisphenol F epoxy resin, 10-18 parts of polyglycol diglycidyl ether, 8-12 parts of ethylene glycol diglycidyl ether, 8-12 parts of neopentyl glycol diglycidyl ether, 1-3 parts of silane coupling agent and 0.1-0.5 part of first organic silicon defoamer;
the component B is prepared from the following raw materials in parts by weight: 100 to 120 parts of modified curing agent, 1 to 3 parts of DMP30 accelerator and 0.1 to 0.4 part of second organic silicon defoamer.
The elastic epoxy adhesive provided by the invention comprises a component A and a component B. In the invention, the mass ratio of the component A to the component B is 1: (0.8 to 1.5), more preferably 1: (1-1.3). The invention controls the mass ratio of the component A to the component B within the range so as to obtain the elastic epoxy adhesive with good comprehensive performance.
In the invention, the component A is preferably prepared from the following raw materials in parts by weight: 82-86 parts of bisphenol A epoxy resin, 22-28 parts of bisphenol F epoxy resin, 12-16 parts of polyglycol diglycidyl ether, 9-11 parts of ethylene glycol diglycidyl ether, 9-11 parts of neopentyl glycol diglycidyl ether, 1.5-2.5 parts of a silane coupling agent, and 0.2-0.4 part of a first organic silicon defoamer, more preferably 85 parts of bisphenol A epoxy resin, 25 parts of bisphenol F epoxy resin, 15 parts of polyglycol diglycidyl ether, 10 parts of ethylene glycol diglycidyl ether, 10 parts of neopentyl glycol diglycidyl ether, 2 parts of a silane coupling agent, and 0.3 part of the first organic silicon defoamer.
In the invention, the raw materials for preparing the A component comprise 80-89 parts of bisphenol A epoxy resin, preferably 82-86 parts of bisphenol A epoxy resin, and more preferably 85 parts of bisphenol A epoxy resin. In the invention, bisphenol A epoxy resin is used as a raw material for preparing the component A, and the dosage of the bisphenol A epoxy resin is controlled within the range, so that the comprehensive mechanical property of the prepared elastic epoxy adhesive is improved by utilizing the reaction of the bisphenol A epoxy resin and the modified curing agent, and the problems of overlarge brittleness, low strength, poor fatigue resistance and the like of the elastic epoxy adhesive caused by overhigh or overlow dosage of the bisphenol A epoxy resin are avoided.
The raw materials for preparing the component A comprise 20 to 30 parts of bisphenol F epoxy resin, preferably 22 to 28 parts of bisphenol F epoxy resin, and more preferably 25 parts of bisphenol A epoxy resin, wherein the weight of the bisphenol A epoxy resin is 80 to 89 parts. In the present invention, bisphenol F epoxy resin is used as a raw material for preparing the a component and the amount thereof is controlled within the above range for improving chemical resistance and high temperature resistance of the elastic epoxy adhesive.
The raw materials for preparing the component A comprise 10-18 parts of polyglycol diglycidyl ether, preferably 12-16 parts of the polyglycol diglycidyl ether, and more preferably 15 parts of the polyglycol diglycidyl ether, wherein the weight of the bisphenol A epoxy resin is 80-89 parts. In the invention, the polyglycol diglycidyl ether is used as a raw material for preparing the component A, and the dosage of the polyglycol diglycidyl ether is controlled to be in the range, so that the polyglycol diglycidyl ether can be used as a bifunctional epoxy resin (bisphenol A epoxy resin and bisphenol F epoxy resin) reactive diluent, has good flexibility, endows the bisphenol A epoxy resin with flexibility, and improves the elongation at break and the impact strength of the prepared elastic epoxy adhesive.
The raw materials for preparing the component A comprise 8 to 12 parts of ethylene glycol diglycidyl ether, preferably 9 to 11 parts of ethylene glycol diglycidyl ether, and more preferably 10 parts of bisphenol A epoxy resin by weight of 80 to 89 parts of the bisphenol A epoxy resin. In the invention, ethylene glycol diglycidyl ether is used as a raw material for preparing the component A, the dosage of the ethylene glycol diglycidyl ether is controlled within the range, and the ethylene glycol diglycidyl ether is used as an active epoxy diluent, is mainly used for reducing the viscosity of bisphenol A epoxy resin and bisphenol F epoxy resin, is beneficial to forming chain and net structures during the curing reaction in the subsequent use process, and improves the mechanical properties of the resin formed after the curing reaction, such as tensile strength, bending strength, compressive strength, impact strength and the like.
The raw materials for preparing the component A comprise 8-12 parts of neopentyl glycol diglycidyl ether, preferably 9-11 parts of neopentyl glycol diglycidyl ether, and more preferably 10 parts of bisphenol A epoxy resin, wherein the weight of the bisphenol A epoxy resin is 80-89 parts. In the present invention, the neopentyl glycol diglycidyl ether is used as a raw material for preparing the A component and the amount thereof is controlled to be in the above range, and is used as a reactive diluent for the bisphenol A epoxy resin and the bisphenol F epoxy resin, so that the reactivity of the bisphenol A epoxy resin and the bisphenol F epoxy resin with the modified curing agent can be reduced under the same temperature condition, and more operable time can be given.
The raw materials for preparing the component A comprise 1-3 parts of silane coupling agent, preferably 1.5-2.5 parts, and more preferably 2 parts by weight of bisphenol A epoxy resin, accounting for 80-89 parts by weight of the bisphenol A epoxy resin. In the present invention, the silane coupling agent is preferably one or more of propyltrimethoxysilane and aminopropyltriethoxysilane. In the invention, the silane coupling agent is used as the raw material for preparing the component A, and the dosage of the silane coupling agent is controlled within the range, so that the adhesive force of the elastic epoxy adhesive is improved, and the elastic epoxy adhesive is promoted to be better bonded with equipment and a matrix.
The raw materials for preparing the component A comprise 0.1-0.5 part of first organic silicon defoamer, preferably 0.2-0.4 part of first organic silicon defoamer, and more preferably 0.3 part of first organic silicon defoamer, based on 80-89 parts of bisphenol A epoxy resin. In the present invention, the first silicone antifoaming agent is preferably an a530 antifoaming agent. In the invention, the first organic silicon defoamer is used as a raw material for preparing the component A, and the dosage of the first organic silicon defoamer is controlled within the range, so that bubbles generated in the process of curing reaction of the elastic epoxy adhesive in use are reduced, and the compactness of the elastic epoxy adhesive is ensured.
In the present invention, the preparation method of the component A preferably comprises the following steps: and mixing bisphenol A epoxy resin, bisphenol F epoxy resin, polyglycol diglycidyl ether, ethylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, a silane coupling agent and a first organic silicon defoamer to obtain a component A.
The invention has no special limitation on the mixing sequence of the raw materials, and can realize the uniform mixing of the components. In the present invention, the mixing is preferably performed under stirring. The invention has no special limit on the stirring speed, and can realize the uniform mixing of all the components. In the present invention, the mixing time is preferably 30 to 45min; the temperature of the mixing is preferably 5 to 35 ℃. The invention controls the mixing time and temperature in the above range to obtain the component A with better performance, thereby obtaining the elastic epoxy adhesive with better comprehensive performance.
In the invention, the component B preferably comprises 100 to 120 parts by weight of modified curing agent, preferably 105 to 115 parts by weight, and more preferably 110 parts by weight. In the invention, the modified curing agent is used as the raw material for preparing the component B, and the dosage of the modified curing agent is controlled within the range so as to play a role in curing, so that the effect of converting liquid into solid in a mixture obtained by mixing the component A and the component B in the using process of the elastic epoxy adhesive is promoted, the phenomena that the explosive polymerization and the curing reaction are too fast caused by over-high dosage of the modified curing agent are avoided, and the phenomena that the curing reaction cannot be carried out or the curing time is long and the curing reaction cannot be fully carried out caused by over-low dosage of the modified curing agent are avoided, so that the comprehensive performance of the prepared elastic epoxy adhesive is reduced. In the invention, the modified curing agent is preferably one or more of aliphatic amine, benzyl alcohol, isophorone diamine, ethylene diamine, triethylene tetramine and polyether amine D230.
The raw materials for preparing the component B comprise 1-3 parts of DMP30 accelerator, preferably 1.5-2.5 parts, and more preferably 2 parts, based on 100-120 parts of modified curing agent. In the invention, the DMP30 accelerator is used as a raw material for preparing the component B, and the dosage of the DMP30 accelerator is controlled to be in the range so as to adjust the curing time in the using process of the elastic epoxy adhesive and facilitate the better use of the elastic epoxy adhesive.
The raw materials for preparing the component B comprise 0.1 to 0.4 part of second organic silicon defoaming agent, preferably 0.2 to 0.35 part, and more preferably 0.25 part by weight of modified curing agent. In the present invention, the second silicone antifoaming agent is preferably an a530 antifoaming agent. In the invention, the second organic silicon defoamer is used as a raw material for preparing the component B, and the dosage of the second organic silicon defoamer is controlled to be within the range, so that bubbles generated in the using or stirring process of the elastic epoxy adhesive are prevented from influencing the performance of the elastic epoxy adhesive.
In the present invention, the preparation method of the component b preferably comprises the following steps: and mixing the modified curing agent, the DMP30 accelerator and the second organic silicon defoaming agent to obtain a component B.
The invention has no special limitation on the mixing sequence of the raw materials, and can realize the uniform mixing of the components. In the present invention, the mixing is preferably performed under stirring. The invention has no special limit on the stirring speed, and can realize the uniform mixing of all the components. In the present invention, the mixing time is preferably 28 to 55min, more preferably 30min; the temperature of the mixing is preferably room temperature. The invention controls the mixing time and temperature in the above range to obtain the component B with better performance, thereby obtaining the elastic epoxy adhesive with better comprehensive performance.
The invention also provides the application of the elastic epoxy adhesive in the technical scheme in a damping material.
In the present invention, the method for using the elastic epoxy adhesive preferably comprises the following steps:
mixing the component A and the component B to obtain a mixture;
and filling the mixture into a position to be damped for curing reaction, so as to realize the purpose of damping by using the elastic epoxy adhesive.
In the present invention, the component A and the component B are preferably mixed to obtain a mixture.
In the present invention, the mixing of the component a and the component b is preferably performed under stirring.
The invention has no special limit on the stirring speed, and can realize the uniform mixing of all the components.
After the mixture is obtained, the mixture is filled in a position to be damped for curing reaction, and the aim of damping by using the elastic epoxy adhesive is fulfilled.
The filling mode is not particularly limited, and the technical scheme commonly used in the field can be adopted. In the present invention, the portion to be damped is preferably a connection portion between the device and the apparatus or between the device and the base body. In the present invention, the apparatus is preferably a precision instrument. In an embodiment of the invention, the location to be damped may particularly preferably be a node of a mounting connection between the engine and the engine mount or a node of a connection between an on-board device and the vehicle.
In the present invention, the temperature of the curing reaction is preferably 0 to 50 ℃ C, more preferably 5 to 40 ℃ C. In the present invention, the time for the curing reaction is preferably 0.5 to 4 days, and more preferably 1 to 3 days. According to the invention, the temperature and time of the curing reaction are controlled within the above range, so that the components are fully subjected to the curing reaction, and the elastic epoxy adhesive with better performance is obtained.
The application method of the elastic epoxy adhesive provided by the invention is simple to operate, mild in reaction conditions and suitable for large-scale production and application.
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The elastic epoxy adhesive is composed of a component A and a component B, wherein the mass ratio of the component A to the component B is 1:1.1;
the component A is prepared from the following raw materials in parts by weight: 85 parts of bisphenol A epoxy resin, 25 parts of bisphenol F epoxy resin, 15 parts of polyglycol diglycidyl ether, 10 parts of ethylene glycol diglycidyl ether, 10 parts of neopentyl glycol diglycidyl ether, 2 parts of a silane coupling agent and 0.3 part of a first organic silicon defoaming agent;
the preparation method of the component A comprises the following steps: uniformly mixing bisphenol A epoxy resin, bisphenol F epoxy resin, polyglycol diglycidyl ether, ethylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, a silane coupling agent and a first organic silicon defoaming agent at room temperature to obtain a component A;
the component B is prepared from the following raw materials in parts by weight: 110 parts of modified curing agent, 2 parts of DMP30 accelerator and 0.25 part of second organic silicon defoamer;
the preparation method of the component B comprises the following steps: and uniformly mixing the modified curing agent, the DMP30 accelerator and the second organic silicon defoaming agent at room temperature to obtain a component B.
Application example 1
The method of using the elastomeric epoxy adhesive described in example 1:
mixing the component A and the component B to obtain a mixture;
and filling the mixture into a part to be damped, and carrying out curing reaction for 1d at room temperature, thereby achieving the purpose of damping by using the elastic epoxy adhesive.
The part to be damped is a node for installing and connecting the engine and the engine base.
The appearances of the component a and the component b prepared in example 1 were observed, and the adhesive strength, tensile strength, elongation at break and compressive strength of the elastic epoxy adhesive at the part to be subjected to vibration damping after the curing reaction described in application example 1 were examined by using the methods of GB-50728-2011, and the results are shown in table 1.
Table 1 adhesive strength, tensile strength, elongation at break and compressive strength of the elastic epoxy adhesive of the portion to be damped after the curing reaction described in application example 1
In conclusion, the bonding strength of the elastic epoxy adhesive provided by the invention can reach 2.5MPa, the tensile strength can reach 2.2MPa, the elongation at break can reach 100%, and the compressive strength can reach 15MPa, which shows that the elastic epoxy adhesive provided by the invention has good adhesion, high strength, high toughness and high elasticity. The elastic epoxy adhesive provided by the invention comprises a certain amount of a component A and a component B, and the component A and the component B are subjected to curing reaction in a using process in cooperation with the control of the type and the weight fraction of the raw materials for preparing the component A and the type and the weight fraction of the raw materials for preparing the component B, so that the elastic epoxy adhesive has high strength, high toughness and high elasticity, can realize flexible connection between equipment and equipment or between the equipment and a substrate, and achieves an excellent damping effect.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The elastic epoxy adhesive comprises a component A and a component B, wherein the mass ratio of the component A to the component B is 1: (0.8-1.5);
the component A is prepared from the following raw materials in parts by weight: 80-89 parts of bisphenol A epoxy resin, 20-30 parts of bisphenol F epoxy resin, 10-18 parts of polyglycol diglycidyl ether, 8-12 parts of ethylene glycol diglycidyl ether, 8-12 parts of neopentyl glycol diglycidyl ether, 1-3 parts of silane coupling agent and 0.1-0.5 part of first organic silicon defoamer;
the component B is prepared from the following raw materials in parts by weight: 100 to 120 parts of modified curing agent, 1 to 3 parts of DMP30 accelerator and 0.1 to 0.4 part of second organic silicon defoamer.
2. The elastic epoxy adhesive as claimed in claim 1, wherein the mass ratio of the component A to the component B is 1: (1-1.3).
3. The elastomeric epoxy adhesive of claim 1, wherein the silane coupling agent is one or more of propyltrimethoxysilane and aminopropyltriethoxysilane.
4. The elastomeric epoxy adhesive of claim 1, wherein the first silicone defoamer is an a530 defoamer.
5. The elastic epoxy adhesive according to claim 1, wherein the modified curing agent is one or more of aliphatic amine, benzyl alcohol, isophorone diamine, ethylene diamine, triethylene tetramine, and polyether amine D230.
6. The elastomeric epoxy adhesive of claim 1, wherein the second silicone defoamer is an a530 defoamer.
7. The elastic epoxy adhesive as claimed in claim 1, wherein the preparation method of the component A comprises the following steps: and mixing bisphenol A epoxy resin, bisphenol F epoxy resin, polyglycol diglycidyl ether, glycol diglycidyl ether, neopentyl glycol diglycidyl ether, a silane coupling agent and a first organic silicon defoaming agent to obtain a component A.
8. The elastic epoxy adhesive as claimed in claim 1, wherein the preparation method of the component B comprises the following steps: and mixing the modified curing agent, the DMP30 accelerator and the second organic silicon defoamer to obtain a component B.
9. Use of the elastomeric epoxy adhesive of any one of claims 1 to 8 in vibration damping materials.
10. The use of the elastomeric epoxy adhesive of claim 9 as a vibration dampening material, wherein the elastomeric epoxy adhesive is used in a method comprising the steps of:
mixing the component A and the component B to obtain a mixture;
and filling the mixture into a part to be damped for curing reaction, so as to realize the aim of damping by using the elastic epoxy adhesive.
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| CN202211374244.7A CN115521744A (en) | 2022-11-04 | 2022-11-04 | Elastic epoxy adhesive and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211374244.7A CN115521744A (en) | 2022-11-04 | 2022-11-04 | Elastic epoxy adhesive and preparation method and application thereof |
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| JP2006131661A (en) * | 2004-11-02 | 2006-05-25 | Japan Epoxy Resin Kk | Epoxy resin composition and epoxy resin-cured material |
| CN112391136A (en) * | 2020-04-17 | 2021-02-23 | 潼灏(上海)材料科技有限公司 | Epoxy resin composition for steel bridge deck pavement bonding layer and preparation method thereof |
| CN112300741A (en) * | 2020-11-16 | 2021-02-02 | 上海汉司实业有限公司 | Epoxy adhesive with high elongation at break and high tensile strength and capable of being rapidly cured and preparation method thereof |
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