CN114561176B - Solvent-free high-elasticity epoxy pouring adhesive for repairing concrete movable crack and preparation method thereof - Google Patents
Solvent-free high-elasticity epoxy pouring adhesive for repairing concrete movable crack and preparation method thereof Download PDFInfo
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- CN114561176B CN114561176B CN202210147501.7A CN202210147501A CN114561176B CN 114561176 B CN114561176 B CN 114561176B CN 202210147501 A CN202210147501 A CN 202210147501A CN 114561176 B CN114561176 B CN 114561176B
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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Abstract
The invention relates to a solvent-free high-elasticity epoxy potting compound for repairing a concrete movable crack, which belongs to the field of potting compounds and is formed by mixing a component A and a component B, wherein the component A comprises epoxy resin and a modified epoxy polymer, and the component B comprises a compound amine curing agent and a modified rubber elastomer; the modified epoxy polymer is prepared by the reaction of 3-glycidol ether oxypropyl methyldimethoxysilane and hydroxyl-terminated organic silicon resin, wherein the reaction is the reaction of methoxyl and silicon hydroxyl. The modified epoxy polymer introduces organic silicon into the epoxy potting adhesive, so that the flexibility of the whole structure is improved, and the prepared potting adhesive has good elasticity. The modified rubber elastomer and the compound amine curing agent have excellent compatibility, can also participate in the curing reaction of the epoxy resin, can effectively improve the elasticity and mechanical property of an epoxy cured material, and has strong deformation resistance. The component A and the component B are low in viscosity, the glue mixing is easy, the operation manufacturability is good, and the obtained pouring glue and concrete have high bonding strength.
Description
Technical Field
The invention belongs to the field of pouring adhesives, and particularly relates to a solvent-free high-elasticity epoxy pouring adhesive for repairing a concrete movable crack and a preparation method thereof.
Background
Cracks are one of the most common diseases of concrete structures, are commonly existing in concrete projects such as bridges, tunnels, house buildings, hydraulic engineering and the like, and seriously reduce the safety, applicability, durability and attractiveness of the projects. Engineering experience shows that: the selection of the repair time and the repair quality are very critical to reducing and even solving the engineering damage of the concrete cracks. However, in the existing concrete crack repair, a unified repair method is mostly adopted, only structural characteristics such as crack width, depth and length are considered, a repair process and an adhesive are selected, and service characteristics such as crack activity, humidity and low temperature are not considered, so that the crack repair quality is generally poor, and the repair and rework phenomena are quite common. So that the crack pouring adhesive has single performance and lacks the design and manufacture of multiple functions and multiple working conditions.
The epoxy potting adhesive has the advantages of good stability, room temperature curing, small contractibility, strong bonding force and the like, can be tightly bonded with concrete when used for repairing cracks, and reduces the influence of the cracks on the structural performance. However, the current technical situation is that the conventional epoxy potting adhesive adopts a furfural-acetone dilution system, and has the performance defects of large shrinkage, low deformation, poor fatigue resistance and the like, and the environmental protection defects of large toxicity, strong pollution and the like in the use process. Especially for structures with frequent live load, such as bridge vehicle load, high-rise wind load and the like, the width of a large number of cracks of the structures is changed frequently (namely crack breathing effect), the conventional epoxy potting adhesive is adopted to repair the movable cracks, and the movable cracks are often failed for less than 1 year.
The invention Chinese patent CN102924117B discloses a low-viscosity dynamic load structure concrete crack repairing agent, and QS-BE epoxy toughening agent can improve the toughness of the repairing agent, but can not improve the elasticity of the repairing agent, and has failure risk in the concrete movable crack repairing process. China CN102775737B discloses a solvent-free elastic epoxy grouting material and a preparation method and application thereof, flexible epoxy resin of long-chain dihydric aliphatic alcohol is adopted to be introduced to participate in curing, the elongation of the obtained epoxy grouting material is still only about 10%, and the elastic interval is small. And the failure risk exists for repairing the movable crack with frequent movement and large deformation.
Aiming at the ubiquitous movable cracks of concrete, the method breaks through a plurality of technical limitations of conventional epoxy pouring, develops the solvent-free high-elasticity epoxy pouring adhesive suitable for the movable cracks, and is necessary for realizing the multifunctional and multi-working-condition design and manufacture of the epoxy pouring adhesive.
Disclosure of Invention
The invention aims to provide a solvent-free high-elasticity epoxy potting adhesive for repairing a concrete movable crack and a preparation method thereof, so as to solve the technical problems.
The solvent-free high-elasticity epoxy pouring adhesive for repairing the movable concrete crack is formed by mixing a component A and a component B, wherein the component A comprises 90-105 parts of epoxy resin, 10-20 parts of modified epoxy polymer, 12-14 parts of diluent, 0.5 part of defoaming agent, 0.2-0.5 part of flatting agent and 0-5 parts of toughening agent, and the component B comprises 111-140 parts of composite amine curing agent, 6-10 parts of accelerant and 5 parts of silane coupling agent;
the modified epoxy polymer is prepared by mixing 3-glycidyl ether oxypropyl methyldimethoxysilane and hydroxyl-terminated organic silicon resin according to the weight ratio of 100: (25-40) by weight ratio, wherein the reaction is the reaction of methoxyl and silicon hydroxyl.
The modified epoxy polymer of the present invention can be prepared by methods well known in the art, specifically see Gong Yanjiang, du Mingpeng, li Meijiang, etc. preparation and characterization of methoxy-terminated polysiloxane. 123-127. The reaction of the epoxy group and the silicon hydroxyl group can be carried out under the condition of no catalyst at more than 200 ℃ and under the condition of an alkaline catalyst at more than 100 ℃ because the reaction of the silicon hydroxyl group and the silicon hydroxyl group requires harsh conditions. Under the conditions of the present invention, the epoxy group does not react with the silicon hydroxyl group, and therefore, the present invention only relates to the reaction of the silicon hydroxyl group with the methoxy group. The organic silicon polymer has the advantages of good weather resistance, heat resistance, water resistance, low-temperature flexibility and the like, and is complementary with epoxy resin. The modified epoxy polymer in the invention utilizes 3-glycidol ether oxy propyl methyl dimethoxy silane to react with hydroxyl terminated organic silicon resin, and silicon hydroxyl in the hydroxyl terminated organic silicon resin reacts with methoxyl in the 3-glycidol ether oxy propyl methyl dimethoxy silane. The reaction does not need too high temperature, and the reaction condition is easy to realize. According to the invention, organic silicon is introduced into the epoxy potting adhesive, so that the flexibility of the whole structure is improved. When the using amount of the modified epoxy polymer is less than 10 parts, the introduced flexible molecular chains are relatively few, and the elasticity of the obtained cured product is not obviously improved. When the amount of the modified epoxy polymer is more than 20 parts, the introduced flexible molecular weight is relatively large, and although the elasticity of the cured product can be improved, the tensile strength of the cured product is reduced.
Preferably, the component B also comprises 10-15 parts of modified rubber elastomer, and the modified rubber elastomer is liquid amino-terminated butadiene-acrylonitrile rubber with 20-30% of acrylonitrile content. The modified rubber elastomer has excellent compatibility with amine curing agents, can participate in epoxy resin curing reaction, and can effectively improve the elasticity of epoxy cured materials.
Preferably, the modified epoxy polymer is prepared by mixing hydroxyl-terminated polymethylphenyl silicone resin and 3-glycidyl ether oxy propyl methyl dimethoxy silane according to the weight ratio of 100: (25-40) by weight ratio. Compared with hydroxyl-terminated polydimethyl organic silicon resin and hydroxyl-terminated polydiphenyl organic silicon resin, the hydroxyl-terminated polymethylphenyl organic silicon resin has better flexibility, better mechanical property and better comprehensive performance.
The reaction is the reaction of hydroxyl and methoxyl, and the specific reaction formula is as follows:
preferably, the epoxy resin in the component A is one or a mixture of more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin and hydrogenated bisphenol A epoxy resin.
Preferably, the epoxy resin in the component A is low-viscosity bisphenol A type epoxy resin or low-viscosity bisphenol F epoxy resin.
Preferably, the diluent in the component A is one or a mixture of more of alkyl glycidyl ether, butyl glycidyl ether, phenyl glycidyl ether, benzyl glycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether and butanediol glycidyl ether; the defoaming agent in the component A is BYK-A535, and the leveling agent in the component A is BYK-333.
Preferably, the composite amine curing agent in the component B is one or a mixture of more of polyether amine, polyamide curing agent, phenolic amine curing agent, alicyclic amine curing agent and aliphatic amine curing agent.
Preferably, the composite amine curing agent in the component B is one or a mixture of several of a low-viscosity polyamide curing agent, an anacardol modified amine curing agent, N-aminoethyl piperazine, isophorone diamine, triethylene tetramine, tetraethylene pentamine, 1,3-cyclohexyldimethylamine, N-dimethyl dipropylidene triamine and propylene oxide butyl ether-diethylene triamine adduct.
Preferably, the accelerator in the component B is 2, 4, 6-tris (dimethylaminomethyl) phenol, and the silane coupling agent in the component B is KH-550 coupling agent.
In addition, the invention also provides a preparation method of the solvent-free high-elasticity epoxy filling adhesive for repairing the movable concrete cracks, wherein the preparation of the component A comprises the following steps:
s11, sequentially adding hydroxyl-terminated organic silicon resin, 3-glycidyl ether oxypropyl methyldimethoxysilane and a catalyst into a three-neck flask with a reflux device, reacting for 4-6 h at 90 ℃ to obtain light yellow transparent viscous liquid which is modified epoxy polymer, and cooling to room temperature for later use;
s12, preheating the epoxy resin and the modified epoxy polymer at 60 ℃ for 6-8 hours in advance;
s13, adding epoxy resin, modified epoxy polymer and diluent into a reaction kettle in proportion at normal temperature, stirring for 15-20 min, and keeping the vacuum degree at-0.095 to-0.100 MPa;
s14, adding a defoaming agent, a leveling agent and a toughening agent in proportion, stirring for 10-15 min, and keeping the vacuum degree at-0.095 to-0.100 MPa;
s15, cleaning stirring teeth and the kettle wall, continuously stirring for 5-6 min, keeping the vacuum degree at-0.095 to-0.100 MPa, discharging and subpackaging to obtain a component A;
the preparation of the component B comprises the following steps:
s21, adding the composite amine curing agent, the modified rubber elastomer, the accelerator and the silane coupling agent into a dispersion kettle according to the proportion at room temperature, stirring for 10-15 min, and keeping the vacuum degree at-0.095-0.100 MPa;
s22, cleaning stirring teeth and the kettle wall, continuously stirring for 5-6 min, keeping the vacuum degree between-0.095 and-0.100 MPa, discharging and subpackaging to obtain the component B.
Compared with the prior art, the invention has the characteristics and beneficial effects that:
(1) The component A comprises epoxy resin and a modified epoxy polymer, the two raw materials react with the curing agent of the component B together, the modified epoxy polymer is prepared by condensation reaction of silicon hydroxyl in hydroxyl-terminated organic silicon resin and methoxyl in 3-glycidyl ether oxypropyl methyl dimethoxy silane, a cross-linking reaction cannot occur, a body type structure cannot be generated, the content of silicon-oxygen bonds in a main chain of the structure is almost 100%, the modified epoxy polymer introduces organic silicon into epoxy potting adhesive, the flexibility of the whole structure is improved, and the prepared potting adhesive is good in elasticity. The epoxy group reacts with the hydroxyl group under high temperature conditions and a catalyst is needed, which is mainly because the alcohol compound reacts with the epoxy group as an electrophilic reagent, and the alcohol compound has low electrophilicity, so that the alcohol compound and the epoxy group are generally not reacted at the temperature of less than 200 ℃ in the absence of the catalyst. In the application, the reaction conditions of the hydroxyl-terminated organic silicon resin and the 3-glycidyl ether oxypropyl methyldimethoxysilane are easy to realize, the reaction difficulty is reduced, and the yield is ensured.
(2) The component B comprises liquid amino nitrile rubber, the rubber elastomer structure has excellent compatibility with a compound amine curing agent, and can participate in the epoxy resin curing reaction, so that the elasticity and the mechanical property of an epoxy cured material can be effectively improved, and the deformation resistance is strong. The liquid amino-terminated butadiene-acrylonitrile rubber has active group amino, can be directly used as a curing agent of epoxy resin for toughening and modifying the epoxy resin, can omit a prepolymerization process, and has simple and convenient process.
(3) The component A and the component B have low viscosity, easy glue mixing and good operation manufacturability. The prepared pouring adhesive has high bonding strength with concrete, and the cohesive failure of the concrete can be realized by the forward-pulling bonding strength of the steel to the C45 concrete.
Detailed Description
In order to make the technical means, innovative features, objectives and functions realized by the present invention easy to understand, the present invention is further described below.
The embodiments described herein are specific embodiments of the present invention, and are intended to be illustrative and exemplary of the concepts of the present invention and should not be construed as limiting the scope of the embodiments of the present invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification of the present application, and these technical solutions include technical solutions which make any obvious replacement or modification for the embodiments described herein.
The invention provides a solvent-free high-elasticity epoxy potting adhesive for repairing a concrete movable crack, which is prepared by the following steps:
the preparation of the component A comprises the following steps:
s11, adding 25-40 parts of hydroxyl-terminated organic silicon resin, 100 parts of 3-glycidyl ether oxypropyl methyldimethoxysilane and a small amount of catalyst into a three-neck flask with a reflux device in sequence, reacting at 90 ℃ for 4-6 h to obtain light yellow transparent viscous liquid which is the modified epoxy polymer, and cooling to room temperature for later use.
S12, preheating 90-105 parts of epoxy resin and 10-20 parts of modified epoxy polymer at 60 ℃ for 6-8 hours.
S13, adding 90-105 parts of epoxy resin, 15-20 parts of modified epoxy polymer and 12-14 parts of diluent into a reaction kettle in proportion at normal temperature, stirring for 15-20 min, and keeping the vacuum degree at-0.095 to-0.100 MPa.
S14, adding 0.5 part of defoaming agent, 0.2-0.5 part of flatting agent and 0-5 parts of toughening agent in proportion, stirring for 10-15 min, and keeping the vacuum degree at-0.095 to-0.100 MPa.
S15, cleaning stirring teeth and the kettle wall, continuously stirring for 5-6 min, keeping the vacuum degree at-0.095 to-0.100 MPa, and then discharging and subpackaging to obtain the component A.
The preparation of the component B comprises the following steps:
s21, firstly adding 111-140 parts of composite amine curing agent, 10-15 parts of modified rubber elastomer, 6-10 parts of accelerator and 5 parts of silane coupling agent into a dispersion kettle at room temperature, stirring for 10-15 min, and keeping the vacuum degree at-0.095-0.100 MPa.
S22, cleaning stirring teeth and the kettle wall, continuously stirring for 5-6 min, keeping the vacuum degree at-0.095 to-0.100 MPa, and then discharging and subpackaging to obtain the component B.
In the following examples, A, B was used in the actual application in a weight ratio of a: b =100:35, mixing, and preparing a sample according to corresponding requirements after uniform mixing.
The epoxy resin in the component A is one or a mixture of more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin and hydrogenated bisphenol A type epoxy resin. The epoxy resin in the a component is more preferably a low viscosity bisphenol a type epoxy resin or a low viscosity bisphenol F type epoxy resin.
The hydroxyl-terminated silicone resin can be one or a mixture of more of hydroxyl-terminated polymethyl silicone resin, hydroxyl-terminated polyethyl silicone resin, hydroxyl-terminated polyphenyl silicone resin, hydroxyl-terminated polymethyl phenyl silicone resin and hydroxyl-terminated polyethyl phenyl silicone resin, and more preferably hydroxyl-terminated polymethyl phenyl silicone resin, because the hydroxyl-terminated polymethyl phenyl silicone resin has better flexibility, better mechanical property and better comprehensive performance at the same time. The diluent in the component A is a reactive epoxy diluent, preferably one or a mixture of more of alkyl glycidyl ether, butyl glycidyl ether, phenyl glycidyl ether, benzyl glycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether and butanediol glycidyl ether; the defoaming agent in the component A is a defoaming polymer solution without organic silicon, such as BYK-A535, and the leveling agent in the component A is polyether modified polydimethylsiloxane copolymer, such as BYK-333.
The composite amine curing agent in the component B is one or a mixture of more of polyether amine, polyamide curing agent, phenolic aldehyde amine curing agent, alicyclic amine curing agent and aliphatic amine curing agent. The composite amine curing agent in the component B is more preferably one or a mixture of a plurality of low-viscosity polyamide curing agent, cardanol modified amine curing agent, N-aminoethyl piperazine, isophorone diamine, triethylene tetramine, tetraethylene pentamine, 1,3-cyclohexyldimethylamine, N-dimethyl dipropylenetriamine and propylene oxide butyl ether-diethylenetriamine adduct.
The accelerator in the component B is 2, 4, 6-tri (dimethylaminomethyl) phenol, and the silane coupling agent in the component B is KH-550 coupling agent.
Example 1
Preparation of modified epoxy polymer: sequentially adding 100 parts by weight of hydroxyl-terminated polymethylphenyl silicone resin, 25 parts by weight of 3-glycidyl ether oxypropyl methyldimethoxysilane and 1% by weight of dibutyltin dilaurate into a three-neck flask with a reflux device, and reacting at 90 ℃ for 4-6 h to obtain a light yellow transparent viscous liquid, namely the modified epoxy polymer.
The component A comprises the following components in parts by weight:
90 parts of bisphenol A epoxy resin, 15 parts of bisphenol F epoxy resin, 15 parts of modified epoxy polymer, 10 parts of alkyl glycidyl ether, 2 parts of butanediol glycidyl ether, 0.5 part of defoaming agent and 0.5 part of flatting agent.
The component B comprises the following components in parts by weight:
1 part of triethylene tetramine, 10 parts of 651 low-viscosity polyamide, 60 parts of D230 polyether amine, 40 parts of isophorone diamine, 12 parts of modified rubber elastomer, 10 parts of accelerator and 5 parts of KH550 silane coupling agent.
Example 2
Preparation of modified epoxy polymer: sequentially adding 100 parts by weight of polymethylphenyl silicone resin, 33 parts by weight of 3-glycidyl ether oxypropyl methyldimethoxysilane and 1% by weight of dibutyltin dilaurate into a three-neck flask with a reflux device, and reacting at 90 ℃ for 4-6 h to obtain a light yellow transparent viscous liquid, namely the modified epoxy polymer.
The component A comprises the following components in parts by weight:
80 parts of bisphenol A epoxy resin, 20 parts of bisphenol F epoxy resin, 20 parts of modified epoxy polymer, 8 parts of alkyl glycidyl ether, 5 parts of butanediol glycidyl ether, 0.5 part of defoaming agent and 0.5 part of flatting agent.
The component B comprises the following components in parts by weight:
50 parts of D230 polyether amine, 30 parts of N-aminoethyl piperazine, 30 parts of isophorone diamine, 10 parts of 651 low-viscosity polyamide, 10 parts of modified rubber elastomer, 6 parts of accelerator and 5 parts of KH550 silane coupling agent.
Example 3
Preparation of modified epoxy polymer: sequentially adding 100 parts by weight of polymethylphenyl silicone resin, 40 parts by weight of 3-glycidyl ether oxypropyl methyldimethoxysilane and 1% by weight of dibutyltin dilaurate into a three-neck flask with a reflux device, and reacting at 90 ℃ for 4-6 h to obtain light yellow transparent viscous liquid, namely the modified epoxy polymer.
The component A comprises the following components in parts by weight:
70 parts of bisphenol A epoxy resin, 10 parts of hydrogenated bisphenol A epoxy resin, 10 parts of bisphenol F epoxy resin, 20 parts of modified epoxy polymer, 10 parts of alkyl glycidyl ether, 4 parts of butanediol glycidyl ether, 5 parts of toughening agent, 0.5 part of defoaming agent and 0.2 part of flatting agent.
The component B comprises the following components in parts by weight:
60 parts of D230 polyether amine, 30 parts of N-aminoethyl piperazine, 40 parts of isophorone diamine, 10 parts of 593 curing agent, 10 parts of modified rubber elastomer, 6 parts of accelerator and 5 parts of KH550 silane coupling agent.
Example 4
Preparation of modified epoxy polymer: sequentially adding 100 parts by weight of hydroxyl-terminated polymethylphenyl silicone resin, 25 parts by weight of 3-glycidyl ether oxypropyl methyldimethoxysilane and 1% by weight of dibutyltin dilaurate into a three-neck flask with a reflux device, and reacting at 90 ℃ for 4-6 h to obtain a light yellow transparent viscous liquid, namely the modified epoxy polymer.
The component A comprises the following components in parts by weight:
85 parts of bisphenol A epoxy resin, 20 parts of bisphenol F epoxy resin, 10 parts of modified epoxy polymer, 10 parts of alkyl glycidyl ether, 2 parts of butanediol glycidyl ether, 0.5 part of defoaming agent and 0.5 part of flatting agent.
The component B comprises the following components in parts by weight:
1 part of triethylene tetramine, 10 parts of 651 low-viscosity polyamide, 60 parts of D230 polyether amine, 40 parts of isophorone diamine, 15 parts of modified rubber elastomer, 10 parts of accelerator and 5 parts of KH550 silane coupling agent.
Example 5
Preparation of modified epoxy polymer: sequentially adding 100 parts by weight of polymethylphenyl silicone resin, 33 parts by weight of 3-glycidyl ether oxypropyl methyldimethoxysilane and 1% by weight of dibutyltin dilaurate into a three-neck flask with a reflux device, and reacting at 90 ℃ for 4-6 h to obtain light yellow transparent viscous liquid, namely the modified epoxy polymer.
The component A comprises the following components in parts by weight:
80 parts of bisphenol A epoxy resin, 20 parts of bisphenol F epoxy resin, 18 parts of modified epoxy polymer, 8 parts of alkyl glycidyl ether, 5 parts of butanediol glycidyl ether, 0.5 part of defoaming agent and 0.5 part of flatting agent.
The component B comprises the following components in parts by weight:
50 parts of D230 polyether amine, 30 parts of N-aminoethyl piperazine, 30 parts of isophorone diamine, 10 parts of 651 low-viscosity polyamide, 12 parts of modified rubber elastomer, 6 parts of accelerator and 5 parts of KH550 silane coupling agent.
Example 6
Preparation of modified epoxy polymer: sequentially adding 100 parts by weight of polymethylphenyl silicone resin, 40 parts by weight of 3-glycidyl ether oxypropyl methyldimethoxysilane and 1% by weight of dibutyltin dilaurate into a three-neck flask with a reflux device, and reacting at 90 ℃ for 4-6 h to obtain a light yellow transparent viscous liquid, namely the modified epoxy polymer.
The component A comprises the following components in parts by weight:
70 parts of bisphenol A epoxy resin, 10 parts of hydrogenated bisphenol A epoxy resin, 10 parts of bisphenol F epoxy resin, 20 parts of modified epoxy polymer, 10 parts of alkyl glycidyl ether, 4 parts of butanediol glycidyl ether, 5 parts of toughening agent, 0.5 part of defoaming agent and 0.2 part of flatting agent.
The component B comprises the following components in parts by weight:
60 parts of D230 polyether amine, 30 parts of N-aminoethyl piperazine, 40 parts of isophorone diamine, 10 parts of 593 curing agent, 15 parts of modified rubber elastomer, 6 parts of accelerator and 5 parts of KH550 silane coupling agent.
The performance of the epoxy potting adhesive for repairing concrete cracks in the above examples 1 to 6 is shown in the following table 1:
TABLE 1 Performance test results of the examples
1 Mixing viscosity: mixing A, B component thoroughly and uniformly, and testing according to GB 50728 appendix Q standard;
2 the working life is as follows: the A, B component is fully mixed evenly and tested according to GB/T7123.1 standard to obtain the product;
3 tensile strength and elongation: testing according to GB/T2567 standard;
4 the steel pair C45 concrete positive tensile bond strength: testing according to GB 50728 annex G standard;
5 unconstrained linear shrinkage: the results were tested according to HG/T2625 standard.
Comparative example 1
Unlike example 1, this comparative example was the same as example 1 except that no modified epoxy polymer was added.
Comparative example 2
Unlike example 1, the present comparative example was conducted in the same manner as example 1 except that the hydroxyl-terminated polymethylphenyl silicone resin was replaced with a hydroxyl-terminated polydimethyl silicone resin.
Comparative example 3
The comparative example was conducted in the same manner as in example 1 except that the modified rubber elastomer was not added in the comparative example. Also, comparative examples 1 to 3 were subjected to performance tests to obtain Table 2.
TABLE 2 Performance test results of examples and comparative examples
As is clear from a comparison between tables 1 and 2, in comparative example 1, the elongation is small and the unconstrained linear shrinkage is large, because the modified epoxy polymer is not added. The modified epoxy polymer is not added, and the modified epoxy polymer contains a silicon-oxygen bond with good flexibility, so that the elasticity of a cured material can be effectively improved, the elongation is improved, and the linear shrinkage rate is reduced.
In comparative example 2 the hydroxyl terminated polymethylphenyl silicone resin was replaced with a hydroxyl terminated polydimethyl silicone resin. This is because the hydroxyl-terminated polydimethyl silicone resin contains only alkyl groups and does not contain a phenyl rigid structure, and therefore, the mechanical strength of the cured product is reduced, and the tensile strength is also reduced.
In comparative example 3, the modified rubber elastomer was not added, and the elongation of the cured product was reduced and the linear shrinkage was increased. The modified rubber elastomer has a rubber structure with good flexibility, can participate in curing reaction together, generates a synergistic effect with the flexible modified epoxy resin in the component A, and can effectively improve the elasticity of a cured material, improve the elongation and reduce the linear shrinkage.
The above embodiments are merely illustrative, and not restrictive, of the scope of the claims, and other alternatives that may occur to those skilled in the art from consideration of the specification should be construed as being within the scope of the claims.
Claims (8)
1. The solvent-free high-elasticity epoxy filling adhesive for repairing the movable concrete crack is formed by mixing a component A and a component B, and is characterized in that: the component A comprises 90-105 parts of epoxy resin, 10-20 parts of modified epoxy polymer, 12-14 parts of diluent, 0.5 part of defoaming agent, 0.2-0.5 part of flatting agent and 0-5 parts of toughening agent, and the component B comprises 111-140 parts of composite amine curing agent, 6-10 parts of accelerator and 5 parts of silane coupling agent;
the modified epoxy polymer is prepared by mixing hydroxyl-terminated polymethylphenyl organosilicon resin and 3-glycidyl ether oxy propyl methyl dimethoxy silane according to the weight ratio of 100: (25-40) reacting in a weight ratio;
the component B also comprises 10-15 parts of modified rubber elastomer, wherein the modified rubber elastomer is liquid amino-terminated butadiene-acrylonitrile rubber with 20-30% of acrylonitrile content.
2. The solvent-free high-elasticity epoxy potting compound for repairing a concrete movable crack as claimed in claim 1, wherein: the epoxy resin in the component A is one or a mixture of more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin and hydrogenated bisphenol A type epoxy resin.
3. The solvent-free high-elasticity epoxy potting compound for repairing a concrete movable crack as claimed in claim 2, wherein: the epoxy resin in the component A is low-viscosity bisphenol A type epoxy resin or low-viscosity bisphenol F type epoxy resin.
4. The solvent-free high-elasticity epoxy potting compound for repairing a concrete movable crack as claimed in claim 1, wherein: the diluent in the component A is one or a mixture of more of alkyl glycidyl ether, phenyl glycidyl ether, benzyl glycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether and butanediol glycidyl ether; the defoaming agent in the component A is BYK-A535, and the leveling agent in the component A is BYK-333.
5. The solvent-free high-elasticity epoxy potting compound for repairing a concrete movable crack as claimed in claim 1, wherein: the composite amine curing agent in the component B is a mixture of a plurality of polyether amine, polyamide curing agent, phenolic aldehyde amine curing agent, alicyclic amine curing agent and aliphatic amine curing agent.
6. The solvent-free high-elasticity epoxy potting compound for repairing a concrete movable crack as claimed in claim 1, wherein: the composite amine curing agent in the component B is a mixture of a plurality of low-viscosity polyamide curing agent, cardanol modified amine curing agent, N-aminoethyl piperazine, isophorone diamine, triethylene tetramine, tetraethylene pentamine, 1,3-cyclohexyl dimethylamine, N-dimethyl propylene triamine and propylene oxide butyl ether-diethylene triamine adduct.
7. The solvent-free high-elasticity epoxy potting compound for repairing a concrete movable crack as claimed in claim 1, wherein: the accelerator in the component B is 2, 4, 6-tri (dimethylamino methyl) phenol, and the silane coupling agent in the component B is KH-550 coupling agent.
8. A method for preparing the solvent-free high-elasticity epoxy potting compound for repairing the movable concrete cracks as claimed in any one of claims 1 to 7,
the preparation of the component A comprises the following steps:
s11, sequentially adding hydroxyl-terminated polymethylphenyl silicone resin, 3-glycidyl ether oxypropyl methyldimethoxysilane and a catalyst into a three-neck flask with a reflux device, reacting for 4-6 h at 90 ℃ to obtain a light yellow transparent viscous liquid which is a modified epoxy polymer, and cooling to room temperature for later use;
s12, preheating the epoxy resin and the modified epoxy polymer at 60 ℃ for 6-8 hours in advance;
s13, adding the epoxy resin, the modified epoxy polymer and the diluent into a reaction kettle according to a ratio at normal temperature, stirring for 15-20 min, and keeping the vacuum degree at-0.095 to-0.100 MPa;
s14, adding a defoaming agent, a leveling agent and a toughening agent in proportion, stirring for 10-15 min, and keeping the vacuum degree at-0.095 to-0.100 MPa;
s15, cleaning stirring teeth and the kettle wall, continuously stirring for 5-6 min, keeping the vacuum degree at-0.095 to-0.100 MPa, discharging and subpackaging to obtain a component A;
the preparation of the component B comprises the following steps:
s21, adding the composite amine curing agent, the modified rubber elastomer, the accelerator and the silane coupling agent into a dispersion kettle according to the proportion at room temperature, stirring for 10-15 min, and keeping the vacuum degree at-0.095-0.100 MPa;
s22, cleaning stirring teeth and the kettle wall, continuously stirring for 5-6 min, keeping the vacuum degree at-0.095 to-0.100 MPa, and then discharging and subpackaging to obtain the component B.
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