CN115340838A - Epoxy resin adhesive for repairing building cracks and preparation method thereof - Google Patents
Epoxy resin adhesive for repairing building cracks and preparation method thereof Download PDFInfo
- Publication number
- CN115340838A CN115340838A CN202210765267.4A CN202210765267A CN115340838A CN 115340838 A CN115340838 A CN 115340838A CN 202210765267 A CN202210765267 A CN 202210765267A CN 115340838 A CN115340838 A CN 115340838A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- parts
- agent
- component
- repairing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of epoxy resin repairing adhesives and discloses an epoxy resin adhesive for repairing a building crack, which comprises a component A and a component B, wherein the component A comprises the following raw materials in parts by weight: 100 parts of bisphenol A epoxy resin, 10-15 parts of toughening agent, 5-10 parts of reactive diluent and 2-4 parts of thixotropic agent, wherein the component B comprises the following raw materials in parts by weight: 30-55 parts of a composite curing agent. The epoxy resin adhesive for repairing the building crack and the preparation method thereof have excellent thixotropy and good construction performance, and do not flow in the face-up construction; the coating is resistant to corrosion of acid and alkali media, high in curing speed at normal temperature, free of volatile matters, non-toxic and harmless; the adhesive strength is high, and the toughness and the impact resistance are good; the method is mainly used for reinforcing and leveling the building structure, and can also be used in the fields of anti-carbonization/anti-corrosion surface protection of the concrete surface, concrete structure defect repair, concrete structure crack grouting and joint sealing, adhesive injection nozzle, edge sealing in pouring and bonding steel reinforcement and the like.
Description
Technical Field
The invention relates to the technical field of epoxy resin repairing adhesives, in particular to an epoxy resin adhesive for repairing a building crack and a preparation method thereof.
Background
Epoxy repair glue is a structure reinforcing and leveling glue, and the prior art has the following problems: 1. the similar repair glue has viscosity stagnation, unsmooth construction or flowing phenomenon during face-up construction, which wastes engineering materials and affects construction environment; 2. the similar repair glue has the problems of excessive filling material, insufficient material toughness and the like; 3. it is not allowed to be used in a humid environment; 4. the epoxy resin adhesive has a single function, and the application provides the epoxy resin adhesive for repairing the building crack and the preparation method thereof.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the epoxy resin adhesive for repairing the building crack and the preparation method thereof, which have the advantages of good construction performance, strong toughness, rich functions and the like, and solve the problems of the traditional epoxy resin repairing adhesive.
(II) technical scheme
In order to realize the purposes of good construction performance, strong toughness and rich functions, the invention provides the following technical scheme: the epoxy resin adhesive for repairing the building crack comprises a component A and a component B, wherein the component A comprises the following raw materials in parts by weight: 100 parts of bisphenol A epoxy resin, 10-15 parts of toughening agent, 5-10 parts of reactive diluent, 2-4 parts of thixotropic agent and 100-150 parts of filler, wherein the component B comprises the following raw materials in parts by weight: 30-55 parts of composite curing agent, 1-3 parts of accelerator, 1-3 parts of coupling agent, 1-3 parts of thixotropic agent and 30-50 parts of active filler.
Further, the blending ratio of the component A to the component B is 3:1, and the curing construction is carried out at normal temperature.
Furthermore, the toughening agent is a mixture of a polymer and a Qishi toughening agent QS-N, wherein the polymer is provided with different active end groups and different types of chain segments are connected through ester bonds or urethane bonds.
Further, the reactive diluent is benzyl glycidyl ether, and the bisphenol A type epoxy resin is E-51.
Further, the composite curing agent is prepared by compounding low molecular weight polyamide, ester cyclic amine and mannich modified phenolic aldehyde amine (T5).
Further, the thixotropic agent is white carbon black, namely gas-phase silica, the accelerator is DMP-30, the filler is 400-mesh silicon powder, and the active filler is active silicon powder which is prepared by carrying out active treatment on refined silicon powder by using a compound silane coupling agent formula according to a specific process.
Furthermore, the accelerating agent is 2,4, 6-trimethyl aminophenol, and the coupling agent is a silane coupling agent, namely gamma-aminopropyl triethoxysilane.
The invention aims to solve another technical problem of providing an epoxy resin adhesive for repairing a building crack and a preparation method thereof, wherein the epoxy resin adhesive comprises the following steps:
1) Respectively weighing bisphenol A type epoxy resin and a filler as A group of spare materials according to the raw material composition of the epoxy resin adhesive for repairing the building crack;
2) Sequentially adding an active diluent and a thixotropic agent into the epoxy resin, uniformly mixing by using a stirrer, gradually adding a toughening agent in the mixing process, and continuously stirring for 30 minutes to obtain a component A;
3) Elutriating the active filler, heating and drying, sequentially adding the composite curing agent, the accelerator, the coupling agent and the thixotropic agent, stirring, continuously stirring for 50 minutes, adding the defoaming agent in the stirring process, and finally drying again to obtain a component B;
4) And adding the component B into the component A, stirring and mixing uniformly, then carrying out vacuum defoaming treatment, then adding a curing agent, stirring and mixing uniformly, and thus obtaining the epoxy resin adhesive for repairing the building crack.
(III) advantageous effects
Compared with the prior art, the invention provides the epoxy resin adhesive for repairing the building crack and the preparation method thereof, and the epoxy resin adhesive has the following beneficial effects:
the epoxy resin adhesive for repairing the building crack and the preparation method thereof have excellent thixotropy and good construction performance, and do not flow in the face-up construction; the coating is resistant to corrosion of acid and alkali media, fast in curing speed at normal temperature, free of volatile matters, non-toxic and harmless; the adhesive strength is high, and the toughness and the impact resistance are good; the method is mainly used for reinforcing and leveling the building structure, and can also be used in the fields of anti-carbonization/anti-corrosion surface protection of the concrete surface, defect repair of the concrete structure, grouting and sealing of cracks of the concrete structure, sticking of a glue injection nozzle, pouring of a bonded steel, edge sealing in reinforcement and the like.
Drawings
FIG. 1 is a table of results of an embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An epoxy resin adhesive for repairing building cracks comprises a component A and a component B, wherein the blending ratio of the component A to the component B is 3:1, and the epoxy resin adhesive is cured and constructed at normal temperature.
Wherein, the component A comprises bisphenol A type epoxy resin, a toughening agent, an active diluent, a thixotropic agent and a filler, and the component B comprises a composite curing agent, an accelerator, a coupling agent, a thixotropic agent and an active filler.
The toughening agent is a mixture of a polymer and a Qishi toughening agent QS-N, wherein the polymer is provided with different active end groups and different chain segments are connected through ester bonds or urethane bonds.
Secondly, the active diluent is benzyl glycidyl ether, the bisphenol A epoxy resin is E-51, and the composite curing agent is prepared by compounding low molecular weight polyamide, ester cyclic amine and mannich modified phenolic amine (T5).
The thixotropic agent is prepared by adopting white carbon black, namely fumed silica, an accelerant is DMP-30, a filler is 400-mesh silica micropowder, and an active filler is active silica micropowder, and the refined silica micropowder is prepared by using a formula of a composite silane coupling agent and performing active treatment according to a specific process.
Finally, 2,4, 6-trimethylaminophenol is used as the accelerator, and the silane coupling agent is gamma-aminopropyltriethoxysilane as the coupling agent.
The invention aims to solve another technical problem of providing an epoxy resin adhesive for repairing a building crack and a preparation method thereof, wherein the epoxy resin adhesive comprises the following steps:
1) Respectively weighing bisphenol A type epoxy resin and a filler as A group of spare materials according to the raw material composition of the epoxy resin adhesive for repairing the building crack;
2) Sequentially adding an active diluent and a thixotropic agent into the epoxy resin, uniformly mixing by using a stirrer, gradually adding a toughening agent in the mixing process, and continuously stirring for 30 minutes to obtain a component A;
3) Elutriating the active filler, heating and drying, sequentially adding the composite curing agent, the accelerator, the coupling agent and the thixotropic agent, stirring, continuously stirring for 50 minutes, adding the defoaming agent in the stirring process, and finally drying again to obtain a component B;
4) And adding the component B into the component A, stirring and mixing uniformly, then carrying out vacuum defoaming treatment, then adding a curing agent, stirring and mixing uniformly, and thus obtaining the epoxy resin adhesive for repairing the building crack.
Example one:
the epoxy resin for repairing the building crack is prepared from the following materials in parts by mass:
and (2) component A:
a main agent: bisphenol A type epoxy resin E-51100 parts
A toughening agent: 14 parts of Qishi toughening agent
Active diluent: benzyl glycidyl ether 6 parts
Thixotropic agent: white carbon black (fumed silica) 3 parts
Filling: 120 portions of 400-mesh silicon micropowder
The component B comprises:
curing agent: 35 portions of compound curing agent
Accelerator (b): DMP-301.5 parts
Coupling agent: KH-5502 parts
Thixotropic agent: white carbon black (fumed silica) 2 parts
Active filler: 40 parts of active silicon micro powder
The mass ratio of the component A to the component B is 3
The implementation results are as follows: the product detection result is shown in FIG. 1
Example two:
the epoxy resin for repairing the building crack is prepared from the following materials in parts by mass: the component A comprises:
the main agent is as follows: bisphenol A type epoxy resin E-51100 parts
A toughening agent: 13 portions of Qishi toughening agent
Active diluent: benzyl glycidyl ether 7 parts
Thixotropic agent: white carbon black (fumed silica) 3 parts
Filling: 120 portions of 400-mesh silicon micropowder
The component B comprises:
curing agent: 35 portions of compound curing agent
Accelerator (b): DMP-302 parts
Coupling agent: KH-5502 parts
Thixotropic agent: white carbon black (fumed silica) 2 parts of active filler: 40 parts of active silicon micro powder
The mass ratio of the component A to the component B is 3
The implementation results are as follows: the product detection result is shown in figure 1
Example three:
the epoxy resin for repairing the building crack is prepared from the following materials in percentage by mass: and (2) component A:
a main agent: bisphenol A type epoxy resin E-51100 parts
A toughening agent: 12 parts of Qishi toughening agent
Active diluent: 8 parts of benzyl glycidyl ether
Thixotropic agent: white carbon black (fumed silica) 2.5 parts
Filling: 120 portions of 400-mesh silicon micropowder
The component B comprises:
curing agent: 40 parts of compound curing agent
Accelerator (b): DMP-301.5 parts
Coupling agent: KH-5502 parts
Thixotropic agent: white carbon black (fumed silica) 2 parts
Active filler: 40 parts of active silicon micro powder
The mass ratio of the component A to the component B is 3
The implementation results are as follows: the product detection result is shown in FIG. 1
Example four:
the epoxy resin for repairing the building crack is prepared from the following materials in percentage by mass:
the component A comprises:
a main agent: bisphenol A type epoxy resin E-51100 parts
A toughening agent: 15 parts of Qishi toughening agent
Active diluent: benzyl glycidyl ether 5 parts
Thixotropic agent: white carbon black (fumed silica) 2.5 parts
Filling: 120 portions of 400-mesh silicon micropowder
The component B comprises:
curing agent: 40 parts of compound curing agent
Accelerator (b): DMP-301.5 parts
Coupling agent: KH-5502 parts
Thixotropic agent: white carbon black (fumed silica) 2 parts
Active filler: 40 parts of active silicon micro powder
The mass ratio of the component A to the component B is 3
The implementation results are as follows: the product detection results are shown in FIG. 1, and the steps of the 4 embodiments are the same.
The working principle is as follows: bisphenol A epoxy resin is a glycidyl ether high polymer material prepared by condensation polymerization of bisphenol A (diphenol propane) and epoxy chloropropane in an alkaline medium, and has the advantages of good performance, wide source, low price, easy processing, small shrinkage rate and no toxicity and odor of a cured product. Therefore, the compound bisphenol A epoxy resin is selected as the main agent of the epoxy resin repairing adhesive. The toughening agent is a polymer mixture with different active end groups connecting different chain segments through ester bonds or urethane bonds, active groups are contained in CC (polymer main chain) molecules of the toughening agent and react with the active groups in the epoxy resin to form a sea-island structure with CC dispersed phases as islands and connecting phase epoxy resin as sea, so that the toughening purpose is achieved, the tensile shear strength is greatly improved, and the fracture energy is improved from 1006J/square meter to 1220J/square meter; the tensile strength is improved by 27.8 percent. The benzyl glycidyl ether is used as an active diluent, so that the viscosity of the repair adhesive can be reduced, the fluidity and the wettability of the repair adhesive can be improved, the repair adhesive can participate in the curing reaction of the epoxy resin due to the active groups in the structure to become a part of a finally formed network structure of the main resin, and the defect that the adhesive force of the adhesive layer is reduced due to solvent volatilization is avoided. The curing agent is compounded by low molecular weight polyamide and alicyclic amine, so that the advantages of large proportion of polyamide, low exothermic peak, wide formula range, good rigidity, high strength and toughness and the like are reserved, the alicyclic amine and the low molecular weight polyamide can make up for each other, the viscosity of a system is reduced, the lasting calorific value of the alicyclic amine and the low molecular weight polyamide is kept to promote the curing effect of the molecular weight polyamide, more fillers can be added, the cost is reduced, the performance is not reduced, the heat resistance is improved, the curing agent can be applied to the environment of 10 ℃ below zero, and the application range of the building structural adhesive is greatly expanded. White carbon black (fumed silica) is introduced as a thixotropic agent, so that the viscosity of the high thixotropic modified epoxy resin steel bonding adhesive is reduced under the action of external force, the high thixotropic modified epoxy resin steel bonding adhesive is convenient to paint, the viscosity is increased when the high thixotropic modified epoxy resin steel bonding adhesive is static, the adhesive liquid cannot flow randomly, and the high thixotropic modified epoxy resin steel bonding adhesive can be applied to thin-layer construction uniformly. The compound curing agent is easy to mix with epoxy resin in a liquidization way, and has good intermiscibility; the proportion is not too strict, and the affinity of the resin, the raw materials and the auxiliary materials can be improved. The addition of the accelerator DMP-30 further improves the fixed telephone capacity, the coupling agent is a compound with different property groups at two ends of the molecule, and the two end groups can be respectively combined with adhesive molecules and an adhesive to play a role of a bridge, so that the molecular adhesive force between an adhesive layer and concrete (such as a base material) is greatly increased. The active silicon powder is prepared by using a formula of a composite silane coupling agent for refined silicon powder and performing active treatment according to a specific process. Can effectively improve the binding power and the interface hydrophobic property of the epoxy resin and the silicon micropowder, and reacts and crosslinks with a resin curing agent, thereby improving the mechanical strength, the elastic modulus, the thermal aging property, the weather resistance and the like of a cured product.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The epoxy resin adhesive for repairing the building crack is characterized by comprising a component A and a component B, wherein the component A comprises the following raw materials in parts by weight: 100 parts of bisphenol A epoxy resin, 10-15 parts of toughening agent, 5-10 parts of reactive diluent, 2-4 parts of thixotropic agent and 100-150 parts of filler, wherein the component B comprises the following raw materials in parts by weight: 30-55 parts of composite curing agent, 1-3 parts of accelerator, 1-3 parts of coupling agent, 1-3 parts of thixotropic agent, 30-50 parts of active filler and 4-8 parts of defoaming agent.
2. The epoxy resin adhesive for repairing the building crack as claimed in claim 1, wherein the blending ratio of the component A to the component B is 3:1, and the epoxy resin adhesive is cured at normal temperature.
3. The epoxy resin adhesive for repairing construction cracks of claim 1, wherein the toughening agent is a mixture of a polymer with different active end groups and different types of chain segments connected through ester bonds or urethane bonds and a Qishi toughening agent QS-N.
4. The epoxy resin adhesive for repairing construction cracks of claim 1, wherein the reactive diluent is benzyl glycidyl ether, and the bisphenol A epoxy resin is E-51.
5. The epoxy resin adhesive for repairing the building crack as claimed in claim 1, wherein the composite curing agent is prepared by compounding low molecular weight polyamide, ester cyclic amine and mannich modified phenolic aldehyde amine (T5).
6. The epoxy resin adhesive for repairing the building crack as claimed in claim 1, wherein the thixotropic agent is white carbon black, i.e., fumed silica, the accelerator is DMP-30, the filler is 400-mesh silica powder, and the active filler is active silica powder prepared by performing active treatment on refined silica powder by using a compound silane coupling agent formula according to a specific process.
7. The epoxy resin adhesive for repairing construction cracks of claim 1, wherein the accelerator is 2,4, 6-trimethylaminophenol, and the coupling agent is a silane coupling agent, i.e., gamma-aminopropyltriethoxysilane.
8. The preparation method of the epoxy resin adhesive for repairing the building crack is characterized by comprising the following steps of:
1) Respectively weighing bisphenol A type epoxy resin and a filler as A group of spare materials according to the raw material composition of the epoxy resin adhesive for repairing the building crack;
2) Sequentially adding an active diluent and a thixotropic agent into the epoxy resin, uniformly mixing by using a stirrer, gradually adding a toughening agent in the mixing process, and continuously stirring for 30 minutes to obtain a component A;
3) Elutriating the active filler, heating and drying, sequentially adding the composite curing agent, the accelerator, the coupling agent and the thixotropic agent, stirring, continuously stirring for 50 minutes, adding the defoaming agent in the stirring process, and finally drying again to obtain a component B;
4) And adding the component B into the component A, stirring and mixing uniformly, then carrying out vacuum defoaming treatment, then adding a curing agent, stirring and mixing uniformly, and thus obtaining the epoxy resin adhesive for repairing the building crack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210765267.4A CN115340838A (en) | 2022-07-01 | 2022-07-01 | Epoxy resin adhesive for repairing building cracks and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210765267.4A CN115340838A (en) | 2022-07-01 | 2022-07-01 | Epoxy resin adhesive for repairing building cracks and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115340838A true CN115340838A (en) | 2022-11-15 |
Family
ID=83948674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210765267.4A Pending CN115340838A (en) | 2022-07-01 | 2022-07-01 | Epoxy resin adhesive for repairing building cracks and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115340838A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116042149A (en) * | 2022-12-29 | 2023-05-02 | 威海晨源分子新材料有限公司 | Concrete repair adhesive, preparation method and application thereof |
| CN116285601A (en) * | 2023-03-27 | 2023-06-23 | 广东长大道路养护有限公司 | Concrete protective material and preparation method thereof |
| CN116285815A (en) * | 2023-03-15 | 2023-06-23 | 中德新亚建筑材料有限公司 | Epoxy resin adhesive for repairing building cracks and preparation method thereof |
-
2022
- 2022-07-01 CN CN202210765267.4A patent/CN115340838A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116042149A (en) * | 2022-12-29 | 2023-05-02 | 威海晨源分子新材料有限公司 | Concrete repair adhesive, preparation method and application thereof |
| CN116285815A (en) * | 2023-03-15 | 2023-06-23 | 中德新亚建筑材料有限公司 | Epoxy resin adhesive for repairing building cracks and preparation method thereof |
| CN116285601A (en) * | 2023-03-27 | 2023-06-23 | 广东长大道路养护有限公司 | Concrete protective material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115340838A (en) | Epoxy resin adhesive for repairing building cracks and preparation method thereof | |
| CN105925228A (en) | Multi-purpose modified epoxy resin adhesive | |
| CN110256994B (en) | High-adhesion silane modified polyether sealant for prefabricated building and preparation method thereof | |
| CN111607312B (en) | Toughened abrasion-resistant epoxy resin daub and preparation method thereof | |
| CN111040701A (en) | High-temperature-resistant and high-toughness epoxy resin adhesive and preparation method thereof | |
| CN114574134B (en) | Solvent-free low-shrinkage epoxy potting adhesive for repairing concrete cracks and preparation method thereof | |
| CN106010406A (en) | Modified epoxy resin anchor adhesive with high strength and toughness | |
| CN112408879B (en) | High-strength fast-curing epoxy/styrene-acrylic resin composite grouting repair material and preparation method and application thereof | |
| CN114836156B (en) | Epoxy adhesive capable of being constructed with water and application thereof | |
| CN106047254A (en) | Epoxy sticky steel glue with high strength and high breaking elongation and preparation method of epoxy sticky steel glue | |
| CN114933782B (en) | Epoxy resin grouting material and preparation method thereof | |
| KR20130026519A (en) | Curable compositions | |
| CN113046008A (en) | Special epoxy elastic adhesive for high-mechanical-property steel bar sleeve | |
| CN108384497B (en) | Low-viscosity concrete crack repairing perfusion adhesive and preparation method thereof | |
| CN109705312A (en) | One kind is based on difunctional POSS high-temperature-resistant epoxy resin and its preparation and application | |
| Dodiuk et al. | Room temperature curing epoxy adhesives for elevated temperature service | |
| WO2023174891A1 (en) | Epoxy resin adhesive | |
| CN115124959A (en) | Epoxy resin bar-planting adhesive | |
| JP3661358B2 (en) | Liquid epoxy resin composition and method for repairing and reinforcing concrete structures | |
| KR20200027716A (en) | Adhesive composition for automobility | |
| US3297622A (en) | Binder composition of epoxy, water glass, and diene rubber | |
| CN111777954A (en) | Epoxy glue and application thereof | |
| CN111269532A (en) | Toughened single-component epoxy resin and preparation method thereof | |
| CN117865510B (en) | Glass fiber reinforced material for wind power blade and preparation method thereof | |
| CN115820084B (en) | High-strength anti-corrosion pipeline reinforcing composite material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |