CN115521432A - 一种无溶剂湿固化硅枝超支化聚氨酯及其制备方法 - Google Patents
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Abstract
本发明公开了一种无溶剂湿固化硅枝超支化聚氨酯的制备方法,包括以下步骤:将聚丁二醇与聚二甲基硅氧烷搅拌反应30min后,加入异佛尔酮二异氰酸酯及催化剂连续搅拌反应2h,再加入1,4丁二醇在连续搅拌反应1h,最后加入三羟甲基丙烷连续搅拌反应1h,得到无溶剂湿固化硅枝超支化聚氨酯。本发明还公开了一种无溶剂湿固化硅枝超支化聚氨酯。本发明通过有机硅树脂引入硅枝,提高了聚氨酯的耐热性能,提高了此类聚氨酯的使用温度上限,有助于扩展聚氨酯的应用领域;通过合成工艺、配方的调控,在超支化聚氨酯链末端保留‑NCO功能基团,使其具有湿固化功能,同时有利于提高粘附性能。
Description
技术领域
本发明属于聚氨酯技术领域,具体涉及一种无溶剂湿固化硅枝超支化聚氨酯及其制备方法。
背景技术
聚氨酯树脂是目前世界上使用量最大的几种树脂之一,具有优异的综合性能。聚氨酯涂层材料是聚氨酯的一类主要应用,这种涂层材料成膜后具备优异的耐磨性,耐油性,耐低温性,同时它的成膜光滑平整,对基材起到了很好的保护作用。一般而言,聚氨酯涂层材料的性能较为单一,难以满足人们的需求,将聚氨酯涂层材料进行适当的改性,它的多样性、可调性大大拓展了涂层的应用范围。目前,聚氨酯涂层材料大多为溶剂型,存在污染环境、影响身体健康等问题;另外,聚氨酯涂层材料还存在耐热性能不高、粘附性能较差等问题,使其应用受限。
发明内容
针对现有技术的以上缺陷或改进需求,本发明旨在制备一种无溶剂超支化聚氨酯,使其兼具无溶剂聚氨酯良好的环保性能和超支化聚氨酯易成膜的优点。
为实现上述目的,按照本发明一个方面,提供一种无溶剂湿固化硅枝超支化聚氨酯的制备方法,包括以下步骤:
将聚丁二醇与聚二甲基硅氧烷搅拌反应30min后,加入异佛尔酮二异氰酸酯及催化剂,连续搅拌反应2h,再加入1,4丁二醇连续搅拌反应1h,最后加入三羟甲基丙烷连续搅拌反应1h,得到无溶剂湿固化硅枝超支化聚氨酯,反应方程式如下:
进一步的,所述聚丁二醇与聚二甲基硅氧烷的质量比为40:21。
进一步的,所述聚丁二醇与聚二甲基硅氧烷反应的温度为40℃。
进一步的,所述催化剂为二月桂酸二丁基锡。
进一步的,所述异佛尔酮二异氰酸酯、1,4丁二醇、三羟甲基丙烷的反应温度均为78℃。
进一步的,所述加入异佛尔酮二异氰酸酯、1,4丁二醇、三羟甲基丙烷后的反应均在氮气氛围下进行。
按照本发明另一个方面,提供一种无溶剂湿固化硅枝超支化聚氨酯,通过如上所述无溶剂湿固化硅枝超支化聚氨酯的制备方法制备而成。
与现有技术相比,本发明能够取得下列有益效果:
1、本发明通过有机硅树脂引入硅枝,大大提高了聚氨酯的耐热性能,提高了此类聚氨酯的使用温度上限,有助于扩展聚氨酯的应用领域。
2、本发明通过合成工艺、配方的调控,在超支化聚氨酯链末端保留-NCO功能基团,使其具有湿固化功能,同时有利于提高粘附性能。
3、本发明制备的无溶剂超支化聚氨酯,环保无害。
4、本发明采用A2+B3的合成方法,操作简单,成本低廉。
附图说明
图1为本发明实施例R值1.6的无溶剂湿固化硅枝超支化聚氨酯的红外光谱图;
图2为本发明实施例无溶剂湿固化硅枝超支化聚氨酯(HPU)的热失重曲线图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,下面结合实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本发明,并不用于限定本发明。
本发明提供一种无溶剂湿固化硅枝超支化聚氨酯的制备方法,包括以下步骤:
将质量比为40:21的聚丁二醇与聚二甲基硅氧烷在40℃下搅拌反应30min后,加入异佛尔酮二异氰酸酯及催化剂二月桂酸二丁基锡,在78℃氮气氛围下连续搅拌反应2h,再加入1,4丁二醇在78℃氮气氛围下连续搅拌反应1h,最后加入三羟甲基丙烷在78℃氮气氛围下连续搅拌反应1h,得到无溶剂湿固化硅枝超支化聚氨酯。
本发明还提供一种根据如上所述制备方法制备而成的无溶剂湿固化硅枝超支化聚氨酯。
实施例1
在安装有冷凝管和氮气导管的四口瓶中加入8g聚丁二醇(PTMG)、4.2g聚二甲基硅氧烷(PDMS),用聚四氟乙烯棒在40℃下搅拌30min;接下来加入异佛尔酮二异氰酸酯(IPDI)以及0.1mL的催化剂二月桂酸二丁基锡(DBTDL),在78℃氮气氛围下连续搅拌反应2h;然后加入0.1g的1,4丁二醇(BDO),在78℃氮气氛围下连续搅拌反应1h;最后加入0.44g的三羟甲基丙烷(TMP),在78℃氮气氛围下连续搅拌反应2h,得到以-NCO封端的无溶剂湿固化硅枝超支化聚氨酯(HPU)。
本发明通过加入不同含量的异佛尔酮二异氰酸酯(IPDI),调整无溶剂湿固化硅枝超支化聚氨酯(HPU)中异氰酸根与羟基的摩尔比R值的大小,进而调整HPU中软硬段的比例,从而调节HPU的物理化学性质。本实施例中R值的范围为1.0~1.8。
不同R值无溶剂湿固化硅枝超支化聚氨酯(HPU)失重10%、50%和80%时的温度见表1:
表1不同R值超支化聚氨酯失重10%、50%和80%时的温度
在表1中可以看到,失重10%,50%和80%时,HPU对应的热失重温度会随着R值的增大而下降,这是因为HPU软段的热稳定性比硬段的热稳定性要强,所以当HPU中IPDI的用量增大时,氨基甲酸酯键的增多会导致热稳定性能变差。
不同R值无溶剂湿固化硅枝超支化聚氨酯涂层(HPU)的干燥时间和铅笔硬度见表2:
表2不同R值超支化聚氨酯涂层的干燥时间和铅笔硬度
图1为R值1.6的无溶剂湿固化硅枝超支化聚氨酯(HPU1.6)的红外光谱图。从图1中可以看出,在2948cm-1和2859cm-1处的两个相邻峰分别是-CH2和-CH的伸缩振动峰对应了PTMG结构;在1108cm-1和808cm-1的峰是Si-O-Si不对称和对称两类伸缩振动峰对应了PDM S结构;在1259cm-1和1367cm-1处分别是C-O和C-CH3的伸缩振动峰对应了TMP结构;在1560cm-1,3330cm-1和2266cm-1处分别是-NH弯曲振动峰、-NH伸缩振动峰以及-NCO的特征峰,这三个峰对应了IPDI结构;最后在1713cm-1出现的氨基甲酸酯峰,证实了无溶剂湿固化硅枝超支化聚氨酯(HPU)的成功合成。
图2为无溶剂湿固化硅枝超支化聚氨酯(HPU)的热失重曲线图。从图2中可以看出,不同R值无溶剂湿固化硅枝超支化聚氨酯(HPU)的热分解过程基本一致,热分解的过程主要分为三个阶段:第一个阶段在220℃以下,这是由于样品中残留的未反应的小分子单体挥发所造成的结果;第二个阶段在220℃到350℃之间,这主要是HPU硬段中聚氨基甲酸酯键的受热分解;第三个阶段在350℃以上,这主要是HPU软段中大分子链段PTMG和PDMS的受热分解。
以上所述实施例仅表达了本发明的实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。
Claims (7)
2.根据权利要求1所述的无溶剂湿固化硅枝超支化聚氨酯的制备方法,其特征在于:所述聚丁二醇与聚二甲基硅氧烷的质量比为40:21。
3.根据权利要求1所述的无溶剂湿固化硅枝超支化聚氨酯的制备方法,其特征在于:所述聚丁二醇与聚二甲基硅氧烷反应的温度为40℃。
4.根据权利要求1所述的无溶剂湿固化硅枝超支化聚氨酯的制备方法,其特征在于:所述催化剂为二月桂酸二丁基锡。
5.根据权利要求1所述的无溶剂湿固化硅枝超支化聚氨酯的制备方法,其特征在于:所述异佛尔酮二异氰酸酯、1,4丁二醇、三羟甲基丙烷的反应温度均为78℃。
6.根据权利要求1所述的无溶剂湿固化硅枝超支化聚氨酯的制备方法,其特征在于:所述加入异佛尔酮二异氰酸酯、1,4丁二醇、三羟甲基丙烷后的反应均在氮气氛围下进行。
7.一种无溶剂湿固化硅枝超支化聚氨酯,其特征在于:根据权利要求1-6任一项所述无溶剂湿固化硅枝超支化聚氨酯的制备方法制备而成。
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KR20110014950A (ko) * | 2009-08-06 | 2011-02-14 | 주식회사 한산스틸플러스 | 변성 실리콘-우레탄 수지, 그로부터 제조된 코팅 조성물 및 이의 코팅 기재 |
CN105694702A (zh) * | 2016-03-15 | 2016-06-22 | 中科院广州化学有限公司南雄材料生产基地 | 一种单组份湿固化有机硅改性聚氨酯防水涂料及制备方法 |
CN114149737A (zh) * | 2021-12-21 | 2022-03-08 | 奎克化学(中国)有限公司 | 一种聚氨酯涂料及其用途 |
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KR20110014950A (ko) * | 2009-08-06 | 2011-02-14 | 주식회사 한산스틸플러스 | 변성 실리콘-우레탄 수지, 그로부터 제조된 코팅 조성물 및 이의 코팅 기재 |
CN105694702A (zh) * | 2016-03-15 | 2016-06-22 | 中科院广州化学有限公司南雄材料生产基地 | 一种单组份湿固化有机硅改性聚氨酯防水涂料及制备方法 |
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