CN115513106A - 一种晶圆检测治具 - Google Patents

一种晶圆检测治具 Download PDF

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CN115513106A
CN115513106A CN202211288099.0A CN202211288099A CN115513106A CN 115513106 A CN115513106 A CN 115513106A CN 202211288099 A CN202211288099 A CN 202211288099A CN 115513106 A CN115513106 A CN 115513106A
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叶顺闵
林伯璋
蔡孟霖
许邦泓
方刚
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Chuzhou Yushun Enterprise Management Consulting Partnership LP
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    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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Abstract

本发明属于半导体制造辅助装置技术领域,具体涉及一种晶圆检测治具,包括依次设置的晶圆取出装置、晶舟承载装置、晶圆承载装置以及晶圆放入装置,所述晶圆取出装置与晶圆放入装置包括相对设置的手动滑台机构,所述手动滑台机构上装配有多个推送板,所述晶舟承载装置包括可拆卸连接在一起的升降机构和升降板,所述晶圆承载装置包括可拆卸连接在一起的底座和安装座,所述安装座上装配有多个活动面板,本发明能够自动将晶圆从晶舟中拿出或将晶圆放入晶舟中,解决了由于操作人员的经验不足或者注意力不集中而导致晶圆破片的问题。

Description

一种晶圆检测治具
技术领域
本发明属于半导体制造辅助装置技术领域,具体涉及一种晶圆检测治具。
背景技术
为了满足电子器件微型化、多功能化和智能化的需求,在封装整体厚度不变甚至需要降低的趋势下,叠层芯片的厚度就不可避免的要求更薄,随之而来的也要求晶圆厚度越来越薄,当晶圆薄化到50μm以下的时候,晶圆就变得非常薄、易碎、受力易抖动,当前在晶圆的检验以及传递的过程中,人员手工操作是无法做到完全用机器去替代的,在晶圆从晶舟中拿取或放入晶舟的过程中,往往由于操作人员的经验不足或者注意力不集中而导致晶圆破片的现象屡有发生,造成生产成本的增加以及客户索赔事件的增多。
本发明采用高精度装置辅助人员对晶圆进行操作,能够有效避免操作人员手工直接与晶圆接触,大大降低晶圆的破片率,同时,能够明显地提高工作效率。
发明内容
针对现有技术中存在的上述不足之处,本发明提供了一种晶圆检测治具,用以解决上述现有的问题。
为了解决上述技术问题,本发明采用了如下技术方案:
一种晶圆检测治具,包括依次设置的晶圆取出装置、晶舟承载装置、晶圆承载装置以及晶圆放入装置,所述晶圆取出装置与晶圆放入装置包括相对设置的手动滑台机构,所述手动滑台机构上装配有多个推送板,所述晶舟承载装置包括可拆卸连接在一起的升降机构和升降板,所述晶圆承载装置包括可拆卸连接在一起的底座和安装座,所述安装座上装配有多个活动面板。
进一步,所述手动滑台机构包括凹形滑槽,滑杆、滑杆座、矩形滑台、连接块、固定销以及直线轴承,所述滑杆座安装在凹形滑槽的两端,所述滑杆安装在位于凹形滑槽两端的两滑杆座之间,所述直线轴承套接在滑杆上,所述矩形滑台的底部通过连接块与直线轴承固定连接,所述固定销由螺纹锁紧段、定位段和螺纹安装段构成,所述矩形滑台上开设有与螺纹安装段配合的螺纹孔,所述推送板的一端为加厚端,另一端为弧形端,所述推送板与固定销螺栓连接。
进一步,所述安装座包括顶板、底板以及支撑板,所述支撑板上固定连接有多个层级结构的托板。
进一步,所述晶圆承载装置还包括两端为螺纹结构的定位柱,所述安装座与底座通过螺栓固定连接,所述定位柱贯穿安装座,且与底座螺纹连接,所述活动面板的一端形成有耳板,所述活动面板与定位柱转动连接。
进一步,所述升降机构为剪刀式手动升降平台,所述升降板的上表面固定设置有多个晶舟定位孔。
进一步,所述活动面板的上端向下延伸形成有横向凹槽。
本发明与现有技术相比,具有如下有益效果:
本发明结构简单,能够快速的投入到实际生产当中,结构上充分考虑了晶舟的开孔设计,在晶圆取放的过程中,解放操作人员的双手,无需操作人员手动将晶圆从晶舟中拿出或将晶圆放入晶舟中,解决了由于操作人员经验不足或者注意力不集中而导致晶圆破片的问题。
附图说明
图1为本发明一种晶圆检测治具实施例的结构示意图;
图2为本发明一种晶圆检测治具实施例中手动滑台机构的结构示意图;
图3为本发明一种晶圆检测治具实施例中安装座的结构示意图;
图4为本发明一种晶圆检测治具实施例中活动面板的结构示意图;
图5为本发明一种晶圆检测治具实施例中连接块与直线轴承的结构示意图;
图6为本发明晶舟内晶圆取出过程示意图;
图7为本发明晶舟放入晶圆过程示意图;
图8为本发明晶舟结构示意图;
说明书附图中的附图标记包括:
晶圆取出装置1、晶舟承载装置2、晶圆承载装置3、晶圆放入装置4、凹形滑槽5、滑杆6、滑杆座7、矩形滑台8、螺纹孔81、连接块9、直线轴承10、推送板11、推送板加厚端111、推送板弧形端112、固定销12、螺纹安装段121、定位段122、螺纹锁紧段123、晶圆13、晶舟隔层14、升降机构21、升降板22、晶舟定位孔221、底座31、安装座32、活动面板33、耳板331。
具体实施方式
为了使本领域的技术人员可以更好地理解本发明,下面结合附图和实施例对本发明技术方案进一步说明。
其中,附图仅用于示例性说明,表示的仅是示意图,而非实物图,不能理解为对本专利的限制;为了更好地说明本发明的实施例,附图某些部件会有省略、放大或缩小,并不代表实际产品的尺寸;对本领域技术人员来说,附图中某些公知结构及其说明可能省略是可以理解的。
实施例:
如图1-图8所示,本发明的一种晶圆检测治具,包括依次设置的晶圆取出装置1、晶舟承载装置2、晶圆承载装置3以及晶圆放入装置4,晶圆取出装置1与晶圆放入装置4包括相对设置的手动滑台机构,手动滑台机构上装配有多个推送板11,晶舟承载装置2包括可拆卸连接在一起的升降机构21和升降板22,晶圆承载装置3包括可拆卸连接在一起的底座31和安装座32,安装座32上装配有多个活动面板33,手动滑台机构包括凹形滑槽5,滑杆6、滑杆座7、矩形滑台8、连接块9、固定销12以及直线轴承10,滑杆座7安装在凹形滑槽5的两端,滑杆6安装在位于凹形滑槽5两端的两滑杆座7之间,直线轴承10套接在滑杆6上,矩形滑台8的底部通过连接块9与直线轴承10固定连接,固定销12由螺纹锁紧段123、定位段122和螺纹安装段121构成,矩形滑台8上开设有与螺纹安装段121配合的螺纹孔81,推送板11的一端为加厚端,另一端为弧形端,推送板11与固定销12螺栓连接,安装座32包括顶板、底板以及支撑板,支撑板上固定连接有多个层级结构的托板,晶圆承载装置3还包括两端为螺纹结构的定位柱,安装座32与底座31通过螺栓固定连接,定位柱贯穿安装座32,且与底座31螺纹连接,活动面板33的一端形成有耳板331,活动面板33与定位柱转动连接,升降机构21为剪刀式手动升降平台,升降板22的上表面固定设置有多个晶舟定位孔221,活动面板33的上端向下延伸形成有横向凹槽。
具体工作原理及效果如下:晶圆取出装置1上的推送板11向右移动,在此过程中,推送板11逐渐靠近晶舟,直到推送板11上的弧形端与晶圆13的外壁接触,晶圆13在推送板11的带动下,逐渐移动到活动面板33上,完成晶圆13取出操作;一般地,取出晶圆13之前,调整剪刀式手动升降平台的高度,使得活动面板33的上表面的高度要低于晶舟中的晶圆13高度;在晶圆13放入晶舟的过程中,晶圆放入装置4上的推送板11向左移动,推送板11逐渐靠近活动面板33,直到推送板11伸入到活动面板33的凹槽内,推送板11上的弧形端与晶圆13的外壁接触,晶圆13在推送板11的带动下,逐渐移动到晶舟隔层14上,一般地,放入晶圆13之前,需要调整剪刀式手动升降平台的高度,使得活动面板33顶部高于晶舟隔层14高度。上述两次调整剪刀式手动升降平台的高度,是为了防止晶圆13在被推送的过程中被阻挡导致破片,晶舟内的隔层与活动面板33在工作过程中,很难保证等高,而且晶圆13在研磨后厚度只有几十微米,在这种情况下,晶舟内的隔层与活动面板33稍有高度上的差别,都有可能导致晶圆13破片。
本发明结构简单,能够快速的投入到实际生产当中,结构上充分考虑了晶舟的开孔设计,在晶圆取放的过程中,解放操作人员的双手,无需操作人员手动将晶圆从晶舟中拿出或将晶圆放入晶舟中,解决了由于操作人员经验不足或者注意力不集中而导致晶圆破片的问题。
以上的仅是本发明的实施例,方案中公知的具体结构及特性等常识在此未作过多描述,所属领域普通技术人员知晓申请日或者优先权日之前发明所属技术领域所有的普通技术知识,能够获知该领域中所有的现有技术,并且具有应用该日期之前常规实验手段的能力,所属领域普通技术人员可以在本申请给出的启示下,结合自身能力完善并实施本方案,一些典型的公知结构或者公知方法不应当成为所属领域普通技术人员实施本申请的障碍。应当指出,对于本领域的技术人员来说,在不脱离本发明结构的前提下,还可以作出若干变形和改进,这些也应该视为本发明的保护范围,这些都不会影响本发明实施的效果和专利的实用性。
本发明实施例的附图中相同或相似的标号对应相同或相似的部件;在本发明的描述中,需要理解的是,若出现术语“上”、“下”、“左”、“右”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此附图中描述位置关系的用语仅用于示例性说明,不能理解为对本专利的限制,对于本领域的普通技术人员而言,可以根据具体情况理解上述术语的具体含义。
在本发明的描述中,除非另有明确的规定和限定,若出现术语“连接”等指示部件之间的连接关系,该术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个部件内部的连通或两个部件的相互作用关系。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。

Claims (6)

1.一种晶圆检测治具,其特征在于:包括依次设置的晶圆取出装置、晶舟承载装置、晶圆承载装置以及晶圆放入装置,所述晶圆取出装置与晶圆放入装置包括相对设置的手动滑台机构,所述手动滑台机构上装配有多个推送板,所述晶舟承载装置包括可拆卸连接在一起的升降机构和升降板,所述晶圆承载装置包括可拆卸连接在一起的底座和安装座,所述安装座上装配有多个活动面板。
2.如权利要求1所述的一种晶圆检测治具,其特征在于:所述手动滑台机构包括凹形滑槽,滑杆、滑杆座、矩形滑台、连接块、固定销以及直线轴承,所述滑杆座安装在凹形滑槽的两端,所述滑杆安装在位于凹形滑槽两端的两滑杆座之间,所述直线轴承套接在滑杆上,所述矩形滑台的底部通过连接块与直线轴承固定连接,所述固定销由螺纹锁紧段、定位段和螺纹安装段构成,所述矩形滑台上开设有与螺纹安装段配合的螺纹孔,所述推送板的一端为加厚端,另一端为弧形端,所述推送板与固定销螺栓连接。
3.如权利要求2所述的一种晶圆检测治具,其特征在于:所述安装座包括顶板、底板以及支撑板,所述支撑板上固定连接有多个层级结构的托板。
4.如权利要求3所述的一种晶圆检测治具,其特征在于:所述晶圆承载装置还包括两端为螺纹结构的定位柱,所述安装座与底座通过螺栓固定连接,所述定位柱贯穿安装座,且与底座螺纹连接,所述活动面板的一端形成有耳板,所述活动面板与定位柱转动连接。
5.如权利要求1所述的一种晶圆检测治具,其特征在于:所述升降机构为剪刀式手动升降平台,所述升降板的上表面固定设置有多个晶舟定位孔。
6.如权利要求1所述的一种晶圆检测治具,其特征在于:所述活动面板的上端向下延伸形成有横向凹槽。
CN202211288099.0A 2022-10-20 2022-10-20 一种晶圆检测治具 Pending CN115513106A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240557A (en) * 1992-06-01 1993-08-31 Texas Instruments Incorporated Semiconductor wafer stacking apparatus and method
CN1175790A (zh) * 1996-09-05 1998-03-11 三星电子株式会社 半导体晶片的热处理装置
CN217387111U (zh) * 2022-03-24 2022-09-06 扬州大学 一种用于短距离传输晶圆表面检测的装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240557A (en) * 1992-06-01 1993-08-31 Texas Instruments Incorporated Semiconductor wafer stacking apparatus and method
CN1175790A (zh) * 1996-09-05 1998-03-11 三星电子株式会社 半导体晶片的热处理装置
CN217387111U (zh) * 2022-03-24 2022-09-06 扬州大学 一种用于短距离传输晶圆表面检测的装置

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