CN115507685A - 'positive meniscus' capillary core for high heat flux density loop heat pipe - Google Patents
'positive meniscus' capillary core for high heat flux density loop heat pipe Download PDFInfo
- Publication number
- CN115507685A CN115507685A CN202211069267.7A CN202211069267A CN115507685A CN 115507685 A CN115507685 A CN 115507685A CN 202211069267 A CN202211069267 A CN 202211069267A CN 115507685 A CN115507685 A CN 115507685A
- Authority
- CN
- China
- Prior art keywords
- capillary core
- layer
- chamfer
- wick
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005499 meniscus Effects 0.000 title claims abstract description 25
- 230000004907 flux Effects 0.000 title claims description 19
- 239000011148 porous material Substances 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 230000035699 permeability Effects 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 abstract description 10
- 238000001704 evaporation Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 7
- 230000008859 change Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a positive meniscus capillary core for a high heat flow density loop heat pipe, which comprises an inner layer capillary core, a pipe shell and an outer layer capillary core; an outer-layer capillary core is sintered inside the tube shell, and the inner-layer capillary core and the outer-layer capillary core are in interference fit and are arranged inside the tube shell; the inner-layer capillary core comprises a capillary core main body, an inner-layer steam channel and a liquid main channel; a first chamfer is arranged on one side of the capillary core main body; the outer layer capillary core comprises internal threads and an outer layer steam channel; a second chamfer is processed on one side of the outer capillary core; the slope of the second chamfer is the same as that of the first chamfer; the outer capillary wick and the capillary wick main body are made of porous materials. The invention has simple structure and small process difficulty, solves the problem of contradiction between the evaporation area and the steam discharge channel area under the working condition of high heat flow density, and obviously improves the heat transfer capacity of the loop heat pipe with high heat flow density.
Description
Technical Field
The invention relates to the technical field of radiators with high heat and high heat flow density, in particular to a 'positive meniscus' capillary core for a loop heat pipe with high heat flow density.
Background
The loop heat pipe has the advantages of large heat transmission quantity, long heat transmission distance, unidirectional heat transmission, flexible layout, high reliability, long service life, excellent anti-gravity capability and the like. The heat flux density of high-power heat flux density devices such as CPU, GPU, IGBT, LED, T/R components and the like can reach hundreds of watts per square centimeter, and the loop heat pipe is required to have high heat flux density heat transfer capacity.
High heat flux loop heat pipes need to solve two conflicting core problems:
(1) The evaporation area is increased, and the heat load per unit area on the surface of the capillary core is reduced;
(2) The area of a steam discharge channel is increased, and the loss of the flow resistance of the discharged steam is reduced.
Traditional loop heat pipes use an "inverted meniscus" design, i.e. the direction of applied heat flow is opposite to the capillary wick meniscus. In the design, the evaporation of the working medium occurs on the surface of the capillary core which is in interference fit contact with the tube shell of the evaporator, and a steam discharge channel must be established at the matching boundary of the tube shell and the capillary core, and the prior art mainly has two technical schemes:
(1) The vapor vent channel is built on a capillary wick or tube shell, and the design adopts an isotropic capillary wick and simply decomposes the capillary wick surface area into an evaporation area and a vapor vent area. When the device runs, only the interference fit part of the capillary core and the tube shell participates in phase change heat exchange, and the part of the capillary core which is not contacted is an exhaust channel; the design structure is simple, the process difficulty is small, and the method is only suitable for the heat flux density not higher than 10W/cm 2 Application scenario of (1).
(2) The steam discharge passage is established on the capillary core and in the internal thread of the tube shellThe double-aperture porous material (small aperture is used for phase change, and large aperture is used for steam exhaust) is filled, the outer layer of the design adopts a double-aperture capillary core, the inner layer adopts an isotropic capillary core, the surface area of the capillary core is expanded, and all the surface areas of the capillary core participate in phase change and steam exhaust; when in operation, the small aperture on the surface of the capillary core is used for phase change, and the large aperture is used for steam exhaust; the design is suitable for the heat flow density not higher than 100W/cm 2 The application scenario of (1) but the dual-aperture capillary core needs to be sintered, so the design structure is complex and the process difficulty is high.
Therefore, the scheme with simple structure and small process difficulty is urgently needed to solve the problem of the contradiction between the evaporation area and the steam discharge channel area under the working condition of high heat flow density so as to obviously improve the heat transfer capacity of the loop heat pipe with high heat flow density.
Disclosure of Invention
In order to solve the technical problem, the invention discloses a 'positive meniscus' capillary core for a loop heat pipe with high heat flux density, and the technical scheme of the invention is implemented as follows:
a 'positive meniscus' capillary core for a loop heat pipe with high heat flux density comprises an inner layer capillary core, a pipe shell and an outer layer capillary core;
the outer-layer capillary core is sintered inside the tube shell, and the inner-layer capillary core and the outer-layer capillary core are in interference fit and are arranged inside the tube shell;
the inner-layer capillary core comprises a capillary core main body, an inner-layer steam channel and a liquid main channel;
a first chamfer is arranged on one side of the capillary core main body;
the inner layer steam channel is arranged on the outer surface of the capillary core main body and is positioned on one side provided with the first chamfer; the liquid main channel is arranged in the center of the inner-layer capillary core and is positioned on the other side with the first chamfer angle;
the outer layer capillary core comprises internal threads and an outer layer steam channel;
a second chamfer is processed on one side of the outer-layer capillary core;
the second chamfer has the same slope as the first chamfer;
the internal thread is arranged on the inner side of the outer layer capillary core; the outer layer steam channel is arranged on one side of the outer layer capillary core, which is provided with a second chamfer;
the length and width of the outer steam channel are the same as the length and width of the inner steam channel;
the outer layer capillary core and the capillary core main body are made of porous materials.
Preferably, the porous material is nickel.
Preferably, the pore diameter of the inner layer capillary core is 1-5 μm, the porosity is 60% -80%, and the permeability is 10 -13 -10 -12 m 2 The equivalent thermal conductivity is 0.1-5W/(mK).
Preferably, the pore diameter of the outer capillary core is 0.1-2 μm, the porosity is 50% -70%, and the permeability is 10 -14 -10 - 13 m 2 Equivalent thermal conductivity coefficient>50W/(m·K)。
Preferably, the thickness of the outer capillary wick is 0.95-1.05mm.
Preferably, the inner surface of the outer capillary wick is etched, and the etching amount is less than 0.01mm.
Compared with the prior art, the invention has the following beneficial effects:
the equivalent heat conductivity coefficient of the capillary core at the outer layer is high, and the internal thread structures are evaporation surfaces and steam exhaust channels and are suitable for the heat flux density of hundreds of watts per square centimeter;
only two identical capillary cores need to be sintered, the structure is simple, and the process difficulty is small.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only one embodiment of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
FIG. 1 is a cross-sectional view of a "positive meniscus" wick for a high heat flux density loop heat pipe;
fig. 2 is a schematic structural diagram of an inner-layer capillary wick;
fig. 3 is a schematic structural diagram of the sintered outer-layer capillary wick of the tube shell;
fig. 4 is a structural sectional view of the sintered outer-layer capillary core of the tube shell;
fig. 5 is a partial schematic view of a "positive meniscus" capillary wick evaporation surface;
FIG. 6 is a schematic diagram of capillary drive and surface evaporation.
In the above drawings, the reference numerals denote:
1. inner capillary wick
1-1 capillary core body
1-2, inner steam channel
1-3, liquid trunk
1-4, first chamfer
2. Pipe shell
3. Outer capillary core
3-1, internal thread
3-2, outer steam channel
3-3, second chamfer
4. Porous medium skeleton
5. Liquid working medium
6. Steam working medium
7. Meniscus of liquid
8. External heat source
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
Example 1
In a specific embodiment, as shown in fig. 1, 2, 3, and 4, a "positive meniscus" wick for a high heat flux density loop heat pipe includes an inner wick 1, a tube housing 2, and an outer wick 3.
The outer-layer capillary core 3 is sintered inside the tube shell 2, and the inner-layer capillary core 1 and the outer-layer capillary core 3 are in interference fit and are arranged inside the tube shell 2;
the inner-layer capillary core 1 comprises a capillary core main body 1-1, an inner-layer steam channel 1-2 and a liquid main channel 1-3;
a first chamfer 1-4 is processed on one side of the capillary core main body 1-1;
the inner layer steam channel 1-2 is arranged on the outer surface of the capillary wick main body 1-1, the length of the inner layer steam channel 1-2 is smaller than that of the inner layer capillary wick 1, and the inner layer steam channel 1-2 is arranged on one side of the capillary wick main body 1-1, on which a first chamfer 1-4 is machined;
the liquid main channel 1-3 is arranged in the center of the inner-layer capillary core 1, the depth of the liquid main channel 1-3 is smaller than the length of the inner-layer capillary core 1, and the liquid main channel 1-3 is arranged on the other side of the capillary core main body 1-1, wherein a first chamfer 1-4 is machined on the other side;
the outer-layer capillary core 3 comprises internal threads 3-1 and an outer-layer steam channel 3-2;
a second chamfer 3-3 is processed at one side of the outer capillary core 3, and the slope of the second chamfer 3-3 is consistent with the slope of the first chamfer 1-4 of the inner capillary core 1;
an internal thread 3-1 is processed on the inner side of the outer layer capillary core 3;
an outer steam channel 3-2 is formed in one side of the second chamfer 3-3 of the outer capillary core 3, and the length and the width of the outer steam channel 3-2 are equal to the length of the inner steam channel 1-2; the outer-layer capillary core 3 is made of a porous material and has the characteristics of small average pore diameter, high porosity, high permeability and high equivalent thermal conductivity, and the equivalent thermal conductivity is more than 50W/(m.K); sintering an outer layer capillary core 3 with the thickness of about 1mm in the tube shell 2, trimming an inner circle through a lathe to adjust the roundness and the straightness of the inner circle, the thickness of the porous layer and a 3-1 structure of the internal thread of the porous layer, etching the inner surface by adopting a chemical etching mode after machining, and opening a hole on the surface plug hole generated by machining;
the inner-layer capillary core 1 is made of a porous material, the pore diameter, the porosity and the permeability of the inner-layer capillary core 1 are all larger than those of the outer-layer capillary core 3, and the equivalent heat conductivity coefficient of the inner-layer capillary core 1 is low and is less than 5W/(m.K); after the inner capillary core 1 is sintered and formed, the outer circle is trimmed through a lathe to adjust the roundness, straightness and size of the outer circle, and interference assembly is facilitated. The outer surface does not need to be etched after machining.
And the inner-layer capillary core 1 and the outer-layer capillary core 3 are assembled into a whole in an interference manner by adopting a method of expansion with heat and contraction with cold, and the inner-layer steam channel 1-2 and the outer-layer steam channel 3-2 are in the same direction.
By adopting the technical scheme of the embodiment, as shown in fig. 5 and 6, the outer capillary wick 3 is a sintered porous material, and the porous material is formed by dividing a solid porous medium framework 4 into a large number of densely grouped tiny gaps. Capillary force generated between the tiny gaps sucks the liquid working medium 5 into the outer-layer capillary core 3, the liquid working medium 5 soaks the outer-layer capillary core 3, the liquid working medium 5 forms a concave meniscus 7 under the action of surface tension, heat of an external heat source 8 is directly transferred to the outer-layer capillary core 3 through the tube shell 2, at the moment, the direction of the applied heat of the external heat source 8 is the same as the direction of the meniscus 7 formed by the liquid working medium 5 between the porous medium frameworks 4, and a positive meniscus is formed. At the moment, the surface areas of the internal threads 3-1 of the outer-layer capillary core 3 are evaporation surfaces, the heating areas are greatly increased compared with the traditional 'reversed meniscus' design, and after the liquid working medium 5 is heated and evaporated, the steam working medium 6 enters the threaded channel between the internal threads 3-1 of the outer-layer capillary core 3 and the outer surface of the inner-layer capillary core 1 and then flows into the outer-layer steam channel 3-2 of the outer-layer capillary core 3 and the inner-layer steam channel 1-2 of the inner-layer capillary core 1.
The present embodiment adopts the technical scheme of "positive meniscus", that is, the direction of the heat of the applied external heat source 8 is the same as the direction of the meniscus 7 formed by the working medium between the multimedia frameworks 4. Compared with the prior art, only two identical capillary cores need to be sintered, the structure is simple, the process difficulty is small, the equivalent heat conductivity coefficient of the outer-layer capillary core is high, the internal thread 3-1 structure is an evaporation surface and an exhaust channel, and the method is suitable for the heat flux density of hundreds of watts per square centimeter.
In a preferred embodiment, the inner capillary wick 1 and the outer capillary wick 3 are both sintered nickel porous materials.
In a preferred embodiment, the pore diameter of the inner capillary wick 1 is 1-5 μm, the porosity is 60% -80%, and the permeability is 10 -13 -10 -12 m 2 Equivalent thermal conductivity coefficient of 0.1-5W/(m.K), pore diameter of the outer layer capillary core 3 of 0.1-2 μm, porosity of 50% -70%, and permeability of 10% -14 -10 -13 m 2 Equivalent thermal conductivity coefficient>50W/(m·K)。
In a preferred embodiment, the thickness of the outer capillary wick 3 is 0.95-1.05mm. More preferably, the thickness is 1mm.
In a preferred embodiment, the inner surface of the outer capillary wick 3 is etched, and the etching amount is less than 0.01mm.
The invention overcomes the defects of the prior art, provides the 'positive meniscus' capillary core for the high heat flow density loop heat pipe, can realize the heat flow density of hundreds of watts per square centimeter, has simple structure and small process difficulty, and obviously improves the high heat flow density heat transfer capacity of the loop heat pipe.
It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A 'positive meniscus' capillary core for a loop heat pipe with high heat flux density is characterized by comprising an inner layer capillary core, a pipe shell and an outer layer capillary core;
the outer-layer capillary core is sintered inside the tube shell, and the inner-layer capillary core and the outer-layer capillary core are in interference fit and are arranged inside the tube shell;
the inner-layer capillary core comprises a capillary core main body, an inner-layer steam channel and a liquid main channel;
a first chamfer is arranged on one side of the capillary core main body;
the inner layer steam channel is arranged on the outer surface of the capillary core main body and is positioned on one side provided with the first chamfer; the liquid main channel is arranged in the center of the inner-layer capillary core and is positioned on the other side with the first chamfer angle;
the outer layer capillary core comprises internal threads and an outer layer steam channel;
a second chamfer is processed on one side of the outer-layer capillary core;
the slope of the second chamfer is the same as that of the first chamfer;
the internal thread is arranged on the inner side of the outer layer capillary core; the outer layer steam channel is arranged on one side of the outer layer capillary core, which is provided with a second chamfer;
the length and width of the outer steam channel are the same as the length and width of the inner steam channel;
the outer layer capillary core and the capillary core main body are made of porous materials.
2. A "positive meniscus" wick for a high heat flux density loop heat pipe, as claimed in claim 1, wherein said porous material is nickel.
3. A 'positive meniscus' wick for a high heat flux density loop heat pipe, as claimed in claim 2, wherein the inner wick has a pore size of 1-5 μm, a porosity of 60% -80%, and a permeability of 10% -13 -10 -12 m 2 And the equivalent thermal conductivity is 0.1-5W/(mK).
4. A "positive meniscus" wick for a high heat flux density loop heat pipe, as in claim 3, whereinCharacterized in that the pore diameter of the outer layer capillary core 3 is 0.1-2 μm, the porosity is 50% -70%, and the permeability is 10 -14 -10 -13 m 2 Equivalent thermal conductivity coefficient>50W/(m·K)。
5. A "positive meniscus" wick for a high heat flux density loop heat pipe, according to claim 4, wherein the thickness of the outer wick is 0.95-1.05mm.
6. A 'positive meniscus' wick for a high heat flux density loop heat pipe, as in claim 5, wherein the inner surface of the outer wick is etched by an amount <0.01mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211069267.7A CN115507685A (en) | 2022-09-02 | 2022-09-02 | 'positive meniscus' capillary core for high heat flux density loop heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211069267.7A CN115507685A (en) | 2022-09-02 | 2022-09-02 | 'positive meniscus' capillary core for high heat flux density loop heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115507685A true CN115507685A (en) | 2022-12-23 |
Family
ID=84501657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211069267.7A Pending CN115507685A (en) | 2022-09-02 | 2022-09-02 | 'positive meniscus' capillary core for high heat flux density loop heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115507685A (en) |
-
2022
- 2022-09-02 CN CN202211069267.7A patent/CN115507685A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4195392B2 (en) | Capillary evaporator | |
| US7013958B2 (en) | Sintered grooved wick with particle web | |
| JP5196631B2 (en) | Multilayer wick for loop heat pipe, loop heat pipe, and method of manufacturing multilayer wick | |
| US10976112B2 (en) | Heat pipe | |
| CN114025562B (en) | Soaking plate with gradient liquid suction core structure and preparation method thereof | |
| JP2011007365A (en) | Aluminum fiber porous sintered molding and method of manufacturing the same | |
| CN113465430B (en) | Ultrathin thermal diode based on gas-liquid coplanar structure and preparation method thereof | |
| CN207881538U (en) | Flat heat pipe | |
| CN212013418U (en) | High heat flux density temperature-uniforming plate | |
| CN108507384A (en) | A kind of two-dimensional gradient hole composite wick and preparation method thereof | |
| CN109099740B (en) | Truss type vapor-liquid phase change heat transfer device and assembly welding method thereof | |
| CN215261346U (en) | Temperature equalizing plate | |
| CN112964105B (en) | Dull and stereotyped capillary pump package spare based on ceramic core | |
| CN115507685A (en) | 'positive meniscus' capillary core for high heat flux density loop heat pipe | |
| CN111486733A (en) | Core-shell integrated flat heat pipe based on flow channel controllable design and forming method | |
| CN113624047B (en) | Condenser with embedded radial micro-channel and loop heat pipe | |
| CN111197942B (en) | Integrated bionic wick for loop heat pipe, preparation method and application | |
| TWM413109U (en) | Improved structure of loop-configured heat pipe | |
| CN114710923B (en) | Evaporator based on high-permeability Gao Maoxi-force multi-scale capillary core | |
| CN215832541U (en) | Ultrathin thermal diode based on gas-liquid coplanar structure | |
| CN214173063U (en) | 0.1-0.4mm ultrathin VC with optimized partition structure and function | |
| CN114894016A (en) | Metal wire array liquid absorption core one-way heat pipe and manufacturing method thereof | |
| CN110351993B (en) | Phase-change liquid cooling heat dissipation system | |
| CN118031696A (en) | Composite capillary core structure heat pipe with heat insulation micro-channel or micro-channel | |
| CN116447902A (en) | High-power heat transfer heat pipe with antigravity capability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240115 Address after: Room 102, Building 9, No. 1288 Zhongchun Road, Minhang District, Shanghai, 2011 Applicant after: Shanghai geentropy Aerospace Technology Co.,Ltd. Address before: No. 304, Guangxing Road, Kenli District, Dongying City, Shandong Province, 257503 Applicant before: Shandong geentropy Thermal Energy Technology Co.,Ltd. |