CN115499562A

CN115499562A - Photosensitive assembly, preparation method thereof and camera module

Info

Publication number: CN115499562A
Application number: CN202110679801.5A
Authority: CN
Inventors: 丁亮; 易峰亮; 俞杰; 陆锡松; 鲍迹
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2022-12-20

Abstract

The photosensitive assembly is provided with a second metal bonding layer at a chip electric connection end of a photosensitive chip, the second metal bonding layer is formed at the chip electric connection end through a plating process, the bonding strength between the photosensitive chip and the chip electric connection end is relatively high, the anti-interference performance is relatively strong, the photosensitive chip is suitable for being moved in the assembling process of the photosensitive chip and a circuit board so as to keep the relative position relation between the photosensitive chip and the circuit board by continuously moving the photosensitive chip, and the assembling precision is improved so as to realize the electric conduction between the photosensitive chip and the circuit board.

Description

Photosensitive assembly, preparation method thereof and camera module

Technical Field

The application relates to the field of camera modules, in particular to a photosensitive assembly, a preparation method of the photosensitive assembly and a camera module.

Background

In recent years, camera modules have been widely used in many fields such as medical treatment, security, and industrial production. The camera module comprises a circuit board, a photosensitive chip, a bracket, a lens base, an optical filter, an optical lens and other components, wherein at least part of the components are required to be assembled together according to a specific position relationship to form a stable combined structure and realize electric conduction.

In the camera module, the photosensitive chip is used for receiving imaging light and generating an image reaction to image a subject, and is one of important components of the camera module. The assembly precision between sensitization chip and the circuit board will influence its relative position relation and electric conduction, and then influences the imaging quality of the module of making a video recording.

In the conventional assembly scheme, the circuit board and the photosensitive chip are assembled together mainly by the ball mounting technology. Specifically, the sensitization chip is provided with a plurality of electric connection ends, the circuit board also is provided with a plurality of corresponding electric connection ends, plant the electric conductor that softens respectively through a plurality of electric connection ends at sensitization chip and a plurality of corresponding electric connection ends of circuit board, and place sensitization chip in the circuit board and paste the sensitization chip that will plant the electric conductor on the circuit board upside down, plant the electric conductor of sensitization chip and plant the electric conductor phase of circuit board and fuse mutually, make a plurality of electric connection ends of sensitization chip and a plurality of corresponding electric connection ends of circuit board aim at and realize the electricity and connect, in order to realize the electric conduction between sensitization chip and the circuit board. However, the technical solution of assembling the circuit board and the photosensitive chip by the ball-mounting technique has many defects in practical application.

Therefore, a novel assembly scheme is required to improve the assembly precision between the photosensitive chip and the circuit board, so as to realize the electrical conduction between the photosensitive chip and the circuit board.

Disclosure of Invention

An advantage of the present application lies in providing a photosensitive component and preparation method, the module of making a video recording thereof, wherein, the chip electricity connecting end of the photosensitive chip in the photosensitive component is provided with second metal bonding layer, just second metal bonding layer establishes the technology through plating and forms in the chip electricity connecting end, and the bonding strength between the chip electricity connecting end is higher relatively, and interference immunity is stronger relatively for the photosensitive chip is suitable for in its and circuit board assembly's in-process to be moved in order to realize keeping its and circuit board relative position relation through removing the photosensitive chip continuously, and then improves the assembly precision in order to realize the photosensitive chip with electric conduction between the circuit board.

Another advantage of the present application is to provide a photosensitive assembly, a manufacturing method thereof, and a camera module, wherein the second metal bonding layer is flat and has a relatively small thickness, which is beneficial to thinning of the camera module.

Still another advantage of the present application is to provide a photosensitive assembly, a manufacturing method thereof, and a camera module, wherein the second metal bonding layer with a relatively thin thickness makes a gap between the photosensitive chip and the circuit board smaller, which is beneficial to structural stability between the photosensitive chip and the circuit board.

Still another advantage of the present application is to provide a photosensitive assembly, a manufacturing method thereof, and a camera module, wherein in a manufacturing process of the photosensitive assembly, the photosensitive chip is kept in a clamped state, so that a positional relationship of the photosensitive chip relative to the circuit board is kept fixed to improve assembly accuracy.

Still another advantage of the present application is to provide a photosensitive assembly, a manufacturing method thereof, and a camera module, wherein a manufacturing process of the photosensitive assembly is relatively simple, and a manufacturing cost is relatively reduced.

Other advantages and features of the present application will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

To achieve at least one of the above advantages, according to one aspect of the present application, there is provided a photosensitive assembly including:

the circuit board comprises a circuit board main body, a circuit board electric connection end formed on the circuit board main body and a first metal bonding layer paved on the circuit board electric connection end, wherein the circuit board main body is provided with an upper surface and a lower surface which are opposite, a through groove penetratingly formed between the upper surface and the lower surface, and part of the circuit board electric connection end is formed on the lower surface of the circuit board main body and is positioned around the through groove; and

the photosensitive chip comprises a photosensitive area, a non-photosensitive area positioned around the photosensitive area, a chip electric connection end formed on the non-photosensitive area, and a second metal bonding layer plated on the chip electric connection end;

the photosensitive chip is combined on the lower surface of the circuit board main body in a mode that the second metal bonding layers of the photosensitive chip are respectively in eutectic with the first metal bonding layers of the circuit board, and the photosensitive chip is electrically connected to the circuit board in such a mode that the photosensitive area of the photosensitive chip corresponds to the through groove.

According to the application, the photosensitive assembly further comprises at least one electronic component electrically connected to the electric connection end of the circuit board.

In the photosensitive assembly according to the application, at least one electronic component is located on the lower surface of the circuit board main body.

According to the photosensitive assembly of the application, the photosensitive assembly further comprises a first packaging body, wherein the first packaging body is formed on the lower surface of the circuit board main body and is used for packaging at least one part of the at least one electronic component.

In the photosensitive assembly according to the present application, the first package body is integrally formed on the lower surface of the circuit board main body through a molding process, and at least a portion of the at least one electronic component is encapsulated in the first package body.

In the photosensitive assembly according to the present application, the first package body further encapsulates at least a portion of the photosensitive chip.

In the photosensitive assembly according to the present application, a lower surface of the first package body is lower than a lower surface of the photosensitive chip.

According to the photosensitive assembly of this application, further include being kept the light filter component on the sensitization route of the sensitization chip.

In the photosensitive module according to the present application, the filter element is mounted on the upper surface of the flat circuit board main body and corresponds to the photosensitive chip, in such a manner that the filter element is held on the photosensitive path of the photosensitive chip.

In a photosensitive assembly according to the present application, the filter element covers the through groove.

According to the photosensitive assembly of the application, further include forming in the second packaging body of the upper surface of circuit board main part, wherein, the light filtering component is installed on the second packaging body and corresponds to the sensitization chip, through this way, the light filtering component is kept on the sensitization route of sensitization chip.

In the photosensitive assembly according to the present application, the second package body is integrally formed on the upper surface of the circuit board main body through a molding process.

In the photosensitive assembly according to the application, the first metal bonding layer is laid on the tin layer of the electric connection end of the circuit board, and the second metal bonding layer is electroplated on the copper layer of the electric connection end of the chip.

According to another aspect of the present application, there is provided a camera module, comprising: the photosensitive member as described above; and

an optical lens held by the photosensitive member.

According to still another aspect of the present application, there is provided a method of manufacturing a photosensitive member, including:

providing a circuit board, wherein the circuit board comprises a circuit board main body and a circuit board electric connecting end formed on the circuit board main body, the circuit board main body is provided with an upper surface and a lower surface which are opposite, a through groove is penetratively formed between the upper surface and the lower surface, and part of the circuit board electric connecting end is formed on the lower surface of the circuit board main body and is positioned at the periphery of the through groove;

laying a first metal bonding layer on the electric connection end of the circuit board;

providing a photosensitive chip and forming a second metal bonding layer on the chip electric connection end of the photosensitive chip through a plating process, wherein the second metal bonding layers are respectively fixed on the chip electric connection ends;

aligning the photosensitive chip and the circuit board so that the chip electrical connection ends of the photosensitive chip are respectively aligned with the circuit board electrical connection ends of the circuit board; and

and heating to ensure that the second metal bonding layers are respectively eutectic with the first metal bonding layers of the circuit board so that the photosensitive chip is bonded and electrically connected to the lower surface of the circuit board main body, wherein the photosensitive area of the photosensitive chip corresponds to the through groove.

In a method of manufacturing a photosensitive assembly according to the present application, aligning the photosensitive chip with the circuit board includes: clamping the photosensitive chip by a shooting device; and adjusting the relative position relationship between the photosensitive chip and the circuit board so that the photosensitive chip is aligned to the circuit board.

In the manufacturing method of the photosensitive assembly according to the application, in the process of heating to enable the second metal bonding layers to be respectively in eutectic with the first metal bonding layers of the circuit board, the photosensitive chip is kept in a clamped state through the shooting device, so that the position relation of the photosensitive chip relative to the circuit board is kept fixed.

Further objects and advantages of the present application will become apparent from a reading of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

FIG. 1 illustrates a schematic diagram of a camera module according to an embodiment of the application

FIG. 2 illustrates a schematic view of a photosensitive assembly according to an embodiment of the present application.

FIG. 3 illustrates a partially enlarged schematic view of a photosensitive assembly according to an embodiment of the present application.

FIG. 4 illustrates a schematic diagram of a wiring board of a photosensitive assembly according to an embodiment of the application.

FIG. 5 illustrates a schematic diagram of a photosensitive chip of a photosensitive assembly according to an embodiment of the application.

Fig. 6 illustrates a schematic diagram of a variant implementation of a camera module according to an embodiment of the application.

Fig. 7 illustrates a schematic diagram of another variant implementation of a camera module according to an embodiment of the application.

Fig. 8 illustrates a flowchart of a process of manufacturing a photosensitive assembly according to an embodiment of the present application.

Fig. 9 illustrates a schematic view of a screen.

Fig. 10 illustrates a schematic of applying a metal material on a screen.

Fig. 11 is a schematic view illustrating the laying of a first metallic bonding layer on the wiring board electrical connection terminals of the wiring board.

Fig. 12 is a schematic diagram illustrating a process of aligning the photosensitive chip and the circuit board and heating to eutectic the second metal bonding layer with the first metal bonding layer of the circuit board, respectively.

Fig. 13 illustrates a schematic block diagram of a process of manufacturing a photosensitive member according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, in the conventional assembly scheme, the circuit board and the photosensitive chip are assembled together mainly by the ball-mounting technique. Specifically, the photosensitive chip is provided with a plurality of electric connection ends, the circuit board is also provided with a plurality of corresponding electric connection ends, softened electric conductors are respectively implanted into the plurality of electric connection ends of the photosensitive chip and the plurality of corresponding electric connection ends of the circuit board, the photosensitive chip is placed on the circuit board so as to inversely paste the photosensitive chip implanted with the electric conductors on the circuit board, the electric conductors implanted into the photosensitive chip and the electric conductors implanted into the circuit board are fused, so that the plurality of electric connection ends of the photosensitive chip and the plurality of corresponding electric connection ends of the circuit board are aligned and electrically connected, and the electric conduction between the photosensitive chip and the circuit board is realized. However, the technical solution of assembling the circuit board and the photosensitive chip by the ball-mounting technique has many defects in practical application.

Firstly, in the process of inversely sticking the photosensitive chip implanted with the electric conductor on the circuit board, the relative position between the photosensitive chip and the circuit board is difficult to keep by continuously moving the photosensitive chip, the photosensitive chip needs to be inversely stuck on the circuit board as fast as possible, and a plurality of electric connection ends of the photosensitive chip are ensured to be aligned with a plurality of electric connection ends of the circuit board, so that the requirement on the assembly process is high. The main reasons are as follows: in the process of moving the photosensitive chip to attach the photosensitive chip implanted with the conductor to the circuit board, the softened conductor implanted in the photosensitive chip is easily dropped and displaced under the influence of gravity and shaking oscillation. And the falling and displacement of the conductor will affect the assembly precision and structural stability between the photosensitive chip and the circuit board.

Secondly, the electric conductor planted in the photosensitive chip and/or the electric conductor planted in the circuit board are generally spherical and have fluidity due to soft texture, in the process of reversely pasting the photosensitive chip planted with the electric conductor on the circuit board, the electric conductor planted in the photosensitive chip and the electric conductor planted in the circuit board are mutually contacted and extruded to easily shift, even deviate from the electric connection end of the photosensitive chip and/or the electric connection end of the circuit board, so that the assembly precision between the photosensitive chip and the circuit board is reduced, the relative position relation between the photosensitive chip and the circuit board, the electric conduction and the photosensitive performance of the photosensitive chip are influenced, and the imaging quality of the camera module is further influenced.

Moreover, the spherical electric conductor has a specific height, so that a hollow structure is formed between the photosensitive chip and the circuit board, which is not beneficial to thinning the camera module. Meanwhile, the hollow structure between the photosensitive chip and the circuit board will affect the structural stability between the photosensitive chip and the circuit board, and when the photosensitive chip and/or the circuit board are acted by external force, the connection structure between the photosensitive chip and the circuit board (for example, the conductor planted in the photosensitive chip and/or the conductor planted in the circuit board) is easily damaged.

Through analysis, the following results are found: in the conventional assembly scheme of the photosensitive chip and the circuit board, the main reason for the low assembly precision between the photosensitive chip and the circuit board is that: since the photosensitive chip with the conductor implanted therein is not suitable for being moved, it is difficult to ensure the relative positional relationship with the circuit board by continuously moving the photosensitive chip. The photosensitive chip is not suitable for being moved, and the specific expression is as follows: in the process of moving the photosensitive chip, the conductor implanted in the photosensitive chip is easy to fall off or shift.

Accordingly, the assembly precision of the photosensitive chip and the circuit board can be improved by changing the combination mode of the photosensitive chip and the circuit board. Specifically, the structure and the preparation mode of the photosensitive chip can be adjusted so that the photosensitive chip is suitable for being moved, and the relative position relation between the photosensitive chip implanted with the conductor and the circuit board is ensured by moving the sensing chip in the process of inversely attaching the photosensitive chip to the circuit board.

Based on this, the present application provides a photosensitive assembly, which includes: the circuit board comprises a circuit board main body, a circuit board electric connection end formed on the circuit board main body and a first metal bonding layer paved on the circuit board electric connection end, wherein the circuit board main body is provided with an upper surface and a lower surface which are opposite, a through groove penetratingly formed between the upper surface and the lower surface, and part of the circuit board electric connection end is formed on the lower surface of the circuit board main body and is positioned around the through groove; the photosensitive chip comprises a photosensitive area, a non-photosensitive area positioned around the photosensitive area, a chip electric connection end formed in the non-photosensitive area, and a second metal bonding layer plated on the chip electric connection end; the photosensitive chip is combined on the lower surface of the circuit board main body in a mode that the second metal bonding layers of the photosensitive chip are respectively in eutectic with the first metal bonding layers of the circuit board, and the photosensitive chip is electrically connected to the circuit board in such a mode that the photosensitive area of the photosensitive chip corresponds to the through groove.

Based on this, the present application further provides a method for manufacturing a photosensitive assembly, which includes: the photosensitive member as described above; and an optical lens held by the photosensitive member.

Based on this, this application provides a module of making a video recording again, and it includes: providing a circuit board, wherein the circuit board comprises a circuit board main body and a circuit board electric connecting end formed on the circuit board main body, the circuit board main body is provided with an upper surface and a lower surface which are opposite, and a through groove penetratingly formed between the upper surface and the lower surface, and part of the circuit board electric connecting end is formed on the lower surface of the circuit board main body and is positioned at the periphery of the through groove; laying a first metal bonding layer on the electric connection end of the circuit board; providing a photosensitive chip and forming a second metal bonding layer on the chip electric connection end of the photosensitive chip through a plating process, wherein the second metal bonding layers are respectively fixed on the chip electric connection ends; aligning the photosensitive chip and the circuit board so that the chip electrical connection ends of the photosensitive chip are respectively aligned with the circuit board electrical connection ends of the circuit board; and heating to enable the second metal bonding layers to be in eutectic with the first metal bonding layers of the circuit board respectively so that the photosensitive chip is bonded and electrically connected to the lower surface of the circuit board main body, wherein the photosensitive area of the photosensitive chip corresponds to the through groove.

Having described the basic principles of the present application, various non-limiting embodiments of the present application will now be described with reference to the accompanying drawings.

Exemplary photosensitive Assembly

As shown in fig. 1 to 5, a photosensitive assembly 100 according to an embodiment of the present application is illustrated, which includes: a wiring board 10 laid with a first metal bonding layer 13 and a photosensitive chip 20 laid with a second metal bonding layer 24, wherein the wiring board 10 forms a mounting substrate of the photosensitive chip 20. In this embodiment, the wiring Board 10 may be implemented as a Printed Circuit Board (PCB), a reinforced Flexible Circuit Board (PFC), or a rigid-flex Board.

Specifically, as shown in fig. 1 to 5, in this embodiment, the wiring board 10 includes a wiring board main body 11, a plurality of wiring board electrical connection terminals 12 formed on the wiring board main body 11, and the first metallic bonding layer 13 laid on the plurality of wiring board electrical connection terminals 12. The wiring board main body 11 has an upper surface 111 and a lower surface 112 opposed to each other, and a through groove 101 penetratingly formed between the upper surface 111 and the lower surface 112, and a part of the wiring board electrical connection terminal 12 is formed at the lower surface 112 of the wiring board main body 11 around the through groove 101.

Sensitization chip 20 includes sensitization region 21, is located non-sensitization region 22 around sensitization region 21, form in a plurality of chip electricity connecting end 23 of non-sensitization region 22, and plate and locate a plurality of chip electricity connecting end 23 second metal bonding layer 24, wherein, plate and locate a plurality of chip electricity connecting end 23 second metal bonding layer 24 respectively with lay in lead to groove 101 circuit board electricity connecting end 12 around form eutectic structure 90 after first metal bonding layer 13 is heated, make sensitization chip 20 be combined in the lower surface 112 of circuit board main part 11. That is, the photosensitive chip 20 is bonded to the lower surface 112 of the wiring board main body 11 in such a manner that the second metal bonding layers 24 thereof are eutectic with the first metal bonding layers 13 of the wiring board 10, respectively. In this way, the photosensitive chip 20 is electrically connected to the circuit board 10 and the photosensitive area 21 of the photosensitive chip 20 corresponds to the through slot 101 to receive the imaging light.

It should be noted that the photosensitive region 21 of the photosensitive chip 20 completely covers the through slot 101, so that the imaging light passing through the through slot 101 is received by the photosensitive region 21 of the photosensitive chip 20 as much as possible. Preferably, the size and shape of the through groove 101 are the same as those of the photosensitive area 21 of the photosensitive chip 20, that is, the outline of the through groove 101 is the same as that of the photosensitive area 21 of the photosensitive chip 20. Of course, the outline of the through groove 101 may also be different from the outline of the photosensitive area 21 of the photosensitive chip 20, for example, the through groove 101 has a shape different from the shape of the photosensitive area 21 of the photosensitive chip 20, or the through groove 101 has a shape the same as the shape of the photosensitive area 21, but the size of the through groove 101 is smaller than the size of the photosensitive area 21, which is not limited in this application.

In a specific example of the present application, the first metallic bonding layer 13 is formed of tin, and the second metallic bonding layer 24 is formed of copper. Correspondingly, the first metal bonding layer 13 is a tin layer laid on the electrical connection end 12 of the circuit board, and the second metal bonding layer 24 is a copper layer electroplated on the electrical connection end 23 of the chip. Accordingly, the tin layer and the copper layer form a tin-copper eutectic structure after being heated, so that the photosensitive chip 20 and the circuit board 10 are combined through the tin-copper eutectic structure. It should be understood that the first metal bonding layer 13 and the second metal bonding layer 24 may also be formed of other metal materials, such as silver layer and cadmium layer, respectively, and the application is not limited thereto.

In the embodiment of the present application, the second metal bonding layer 24 is formed on the chip electrical connection terminal 23 through a plating process, and has relatively high bonding strength with the chip electrical connection terminal 23 and relatively strong interference resistance, so that the photosensitive chip 20 is suitable to be moved during the process of assembling the photosensitive chip 20 with the circuit board 10 to maintain the relative position relationship between the photosensitive chip 20 and the circuit board 10 by continuously moving the photosensitive chip 20, and further, the assembling precision is improved to achieve electrical conduction between the photosensitive chip 20 and the circuit board 10. Specifically, the assembly process of the photosensitive chip 20 and the wiring board 10 will be explained in detail in the subsequent exemplary photosensitive assembly manufacturing method.

It is worth mentioning that, in this application embodiment, second metal bonding layer 24 is the flat form, and thickness is thinner relatively, makes photosensitive chip 20 with space between the circuit board 10 is less, is favorable to photosensitive chip 20 with structural stability between the circuit board 10 can control simultaneously photosensitive component 100 is in the ascending space of thickness direction, is favorable to installing photosensitive component 100's the slimming of the module of making a video recording.

It should be noted that, in order to further improve the structural stability between the photosensitive chip 20 and the circuit board 10, an adhesive may be disposed between the photosensitive chip 20 and the circuit board 10 to seal the electrically exposed portion of the photosensitive chip 20, and at the same time, the bonding strength between the photosensitive chip 20 and the circuit board 10 is enhanced by the adhesive.

As shown in fig. 1 and 2, in the embodiment of the present application, the photosensitive assembly 100 further includes at least one electronic component 30 (e.g., a capacitor, an inductor) electrically connected to a portion of the electrical connection terminal 12 of the circuit board. In a specific example of the present application, the at least one electronic component 30 is located on the lower surface 112 of the circuit board main body 11. In other specific examples of the present application, the at least one electronic component 30 may be formed at other positions of the photosensitive assembly 100, for example, the upper surface 111 of the circuit board main body 11, and the side surface of the circuit board main body 11, which is not limited by the present application.

Further, in the embodiment of this application, the photosensitive assembly 100 further includes a first package body 40 for packaging at least part of the components of the photosensitive assembly 100. The first package body 40 is formed on the lower surface 112 of the circuit board main body 11, and encapsulates at least a portion of the at least one electronic component 30 located on the lower surface 112 of the circuit board main body 11 therein, so as to protect the electronic component 30, and prevent the entire circuit system of the photosensitive assembly 100 from being affected due to the structure of the electronic component 30 being damaged, thereby affecting the function of the photosensitive assembly 100.

Specifically, in one specific example of the present application, the first package body 40 is integrally formed on the lower surface 112 of the circuit board main body 11 through a molding process, and at least a portion of the at least one electronic component 30 is encapsulated in the first package body 40 during the molding process. In other examples of the present application, the first package body 40 may also be connected to the lower surface 112 of the circuit board body 11 by other processes, for example, the first package body 40 is attached to the lower surface 112 of the circuit board body 11 separately, and the first package body 40 has a receiving slot for packaging at least a portion of the at least one electronic component 30 located on the lower surface 112 of the circuit board body 11 therein, which is not limited by the present application.

Preferably, the lower surface of the first package body 40 is lower than the lower surface of the photosensitive chip 20 to protect the photosensitive chip 20. Further, in a specific example of the present application, the first package 40 further covers at least a portion of the photosensitive chip 20 to further protect the photosensitive chip 20, so as to avoid that the structure of the photosensitive chip 20 is damaged or contaminated to affect the imaging quality of the photosensitive assembly 100.

In another specific example of the present application, the first package body 40 has a first slot, wherein the size of the first slot is larger than the size of the photosensitive chip 20 to accommodate the whole photosensitive chip 20 and does not cover the photosensitive chip 20.

In the embodiment of the present application, the photosensitive assembly 100 further includes a filter element 70 held on the photosensitive path of the photosensitive chip 20. In a specific example of the present application, the filter element 70 is mounted on the upper surface 111 of the wiring board body 11 and corresponds to the photosensitive chip 20, in such a manner that the filter element 70 is held on a photosensitive path of the photosensitive chip 20. The imaging light passes through the through groove 101 and reaches the photosensitive chip 20 after being filtered by the filter element 70. Preferably, the filter element 70 covers the through slot 101, that is, the size of the filter element 70 is greater than or equal to the size of the through slot 101, so that light passing through the through slot 101 and reaching the photosensitive chip 20 is filtered by the filter element 70, thereby ensuring the imaging quality of the photosensitive assembly 100.

More specifically, when the size of the filter element 70 is larger than the size of the through-groove 101, the filter element 70 may attach the filter element 70 to the upper surface 111 of the wiring board body 11 by an adhesive provided at a peripheral region of the filter element 70.

In this specific example, the second package body 50 is integrally formed on the upper surface 111 of the circuit board main body 11 through a molding process. In other examples of the present application, the first package body 40 may also be connected to the upper surface 111 of the circuit board body 11 by other processes, for example, the second package body 50 is attached to the upper surface 111 of the circuit board body 11, which is not limited in this application.

In another specific example of the present application, the photosensitive assembly 100 further includes a second package body 50 formed on the upper surface 111 of the circuit board main body 11, wherein the second package body 50 has a second slot, and the filter element 70 is mounted in the second slot of the second package body 50 and corresponds to the photosensitive chip 20, in such a way that the filter element 70 is maintained on the photosensitive path of the photosensitive chip 20.

Optionally, the second package body 50 may cover at least a portion of the filter element 70, or may not cover the filter element 70. It should be understood that the filter element 70 may also be mounted at other positions of the second package 50, for example, on the upper surface of the second package 50, which is not limited by the present application.

In still another specific example of the present application, the upper surface 111 of the wiring board body 11 is recessed downward to form a stepped structure, and the filter element 70 is mounted to the stepped structure of the wiring board 10 and corresponds to the photosensitive chip 20, in such a manner that the filter element 70 is held on a photosensitive path of the photosensitive chip 20. Meanwhile, the filter element 70 mounted on the step structure is lower than the upper surface 111 of the circuit board body 11, so that the filter element 70 can be protected and does not occupy the height of the photosensitive assembly 100.

It should be understood that the filter element 70 may be held on the photosensitive path of the photosensitive chip 20 by other means, for example, the filter element 70 is embedded in the through groove 101 of the circuit board 10, which is not limited by the present application.

In a modified example of the photosensitive assembly 100 according to an embodiment of the present application, a bonding manner between the photosensitive chip 20 and the wiring board 10 is adjusted as compared with the example illustrated in fig. 1 to 5.

Specifically, in the photosensitive assembly 100 shown in fig. 1 and 2, the photosensitive chip 20 is bonded to the lower surface 112 of the wiring board main body 11. In contrast, in this modified embodiment, the photosensitive chip 20 is embedded in the groove 102 of the wiring board 10.

Specifically, in this modified embodiment, the wiring board 10 includes a wiring board main body 11, a plurality of wiring board electrical connection terminals 12 formed on the wiring board main body 11, and the first metallic bonding layer 13 laid on the plurality of wiring board electrical connection terminals 12. The wiring board main body 11 has an upper surface 111 and a lower surface 112 opposed to each other, and a slot body 102 formed between the upper surface 111 and the lower surface 112. Part of the side wall of the housing 102 is recessed inward and forms an insertion opening 103 of the housing 102, and part of the electrical connection terminal 12 of the circuit board is formed on the surface of the insertion opening 103.

Sensitization chip 20 includes photosensitive zone 21, is located non-photosensitive zone 22 around the photosensitive zone 21, form in a plurality of chip electricity connecting end 23 of non-photosensitive zone 22, and plate and locate a plurality of chip electricity connecting end 23 second metal bonding layer 24, wherein, sensitization chip 20 is embedded in the embedding mouth 103 of cell body 102, and plate and locate a plurality of chip electricity connecting end 23 second metal bonding layer 24 respectively with lay in inlay the circuit board electricity connecting end 12 of mouth 103 first metal bonding layer 13 is corresponding, so that sensitization chip 20 with circuit board 10 realizes the electric conductance, and imbeds inlay the mouth 103 sensitization chip 20's photosensitive zone 21 corresponds to cell body 102 to receive the formation of image light.

Preferably, the height dimension of the embedding opening 103 is equal to the thickness dimension of the photosensitive chip 20, so that the photosensitive chip 20 is tightly embedded in the embedding opening 103 and the second metallic bonding layer 24 and the first metallic bonding layer 13 are in tight contact. Of course, the height of the embedding opening 103 can be slightly larger than the thickness of the photosensitive chip 20.

It should be noted that the slot body 102 may be implemented as a through slot penetrating through the upper surface 111 and the lower surface 112 of the circuit board main body 11, and may also be implemented as a non-through slot, that is, the slot body 102 does not penetrate through the upper surface 111 and the lower surface 112 of the circuit board main body 11, which is not limited in this application.

In another variant of the photosensitive assembly 100 according to the embodiment of the present application, the bonding manner between the photosensitive chip 20 and the circuit board 10 is adjusted compared to the examples illustrated in fig. 1 to 5.

Specifically, in the photosensitive assembly 100 shown in fig. 1 and 2, the photosensitive chip 20 is bonded to the lower surface 112 of the wiring board main body 11. In contrast, in this modified embodiment, the photosensitive chip 20 is provided on the bottom wall of the housing 102 of the wiring board 10.

Specifically, in this modified embodiment, the wiring board 10 includes a wiring board main body 11, a plurality of wiring board electrical connection terminals 12 formed on the wiring board main body 11, and the first metal bonding layer 13 laid on the plurality of wiring board electrical connection terminals 12. The circuit board main body 11 has an upper surface 111 and a lower surface 112 opposite to each other, and a part of the lower surface 112 of the circuit board main body 11 is recessed and forms a tank 102 between the upper surface 111 and the lower surface 112 of the circuit board main body 11, wherein a recessed surface with respect to the upper surface 111 of the circuit board main body 11 forms a bottom wall of the tank 102. That is, the slot body 102 is a non-penetrating slot, that is, the slot body 102 does not penetrate through the upper surface 111 and the lower surface 112 of the circuit board main body 11. A part of the board electrical connection terminal 12 is formed in the bottom wall of the tank body 102.

Sensitization chip 20 includes sensitization region 21, is located non-sensitization region 22 around sensitization region 21, form in a plurality of chips electricity link 23 of non-sensitization region 22, and plate locate a plurality of chips electricity link 23 second metal bonding layer 24, wherein, sensitization chip 20 with its second metal bonding layer 24 respectively with the mode of the first metal bonding layer 13 eutectic of circuit board 10 is combined in the diapire of the cell body 102 of circuit board 10, through such mode, sensitization chip 20 electricity connect in the circuit board 10 just sensitization region 21 of sensitization chip 20 corresponds to the cell body 102 to receive formation of image light. Meanwhile, the bottom wall of the tank 102 protects the bottom surface of the photosensitive chip 20.

In summary, based on the photosensitive assembly 100 of the embodiment of the present application, the second metal bonding layer 24 of the photosensitive chip 20 in the photosensitive assembly 100 is formed on the chip electrical connection end 23 through a plating process, the bonding strength between the second metal bonding layer and the chip electrical connection end 23 is relatively high, and the anti-interference performance is relatively high, so that the photosensitive chip 20 is suitable to be moved in the process of assembling the photosensitive chip 20 with the circuit board 10, so as to keep the relative position relationship between the photosensitive chip 20 and the circuit board 10 by continuously moving the photosensitive chip 20, and further improve the assembling accuracy to achieve electrical conduction between the photosensitive chip 20 and the circuit board 10. And the second metal bonding layer 24 is flat and relatively thin, so that the gap between the photosensitive chip 20 and the circuit board 10 is small, and the structural stability between the photosensitive chip 20 and the circuit board 10 and the thinning of the camera module provided with the photosensitive assembly 100 are facilitated.

Exemplary camera module

As shown in fig. 1, a camera module according to an embodiment of the present application is illustrated, which includes: the photosensitive member 100 as described above, and the optical lens 200 held by the photosensitive member 100. Specifically, in the embodiment of the present application, the photosensitive assembly 100 includes a circuit board 10, a photosensitive chip 20 electrically connected to the circuit board 10, a filter element 70 held on a photosensitive path of the photosensitive chip 20, and a second package 50 formed on an upper surface of the circuit board 10, wherein the filter element 70 is mounted on the circuit board 10 and corresponds to the photosensitive chip 20, and in this way, the filter element 70 is held on the photosensitive path of the photosensitive chip 20. The specific structure and function of each component of the photosensitive assembly 100, and the relationship between the components have been described in detail in the above description of the photosensitive assembly 100 with reference to fig. 1 to 5, and therefore, a repetitive description thereof will be omitted.

The optical lens 200 is mounted to the second package 50 and corresponds to the photo sensor chip 20, in such a way that the optical lens 200 is held on an optical path of the photo sensor assembly 100. That is, in this embodiment, the second package body 50 forms a mount carrier of the optical lens 200.

In the embodiment of the present application, the optical lens 200 includes a lens barrel 210 and at least one optical lens 220 installed in the lens barrel 210. It should be understood by those skilled in the art that the resolution of the optical lens 200 is proportional to the number of the optical lenses 220 within a certain range, i.e., the higher the resolution, the greater the number of the optical lenses 220. In a specific example of the present application, the number of the optical lenses 220 is greater than 2, that is, the optical lens 200 includes a plurality of the optical lenses 220, wherein the plurality of the optical lenses 220 are stacked in the lens barrel 210 along a height direction of the lens barrel 210.

In a specific implementation, the optical lens 200 may be implemented as an all-in-one lens or a split lens, wherein when the optical lens 200 is implemented as an all-in-one lens, the optical lens 200 includes a lens barrel 210, and all the optical lenses 220 are installed in the lens barrel 210; when the optical lens 200 is implemented as a split lens, the optical lens 200 is assembled by at least two lens units.

In other examples of the present application, the lens barrel 210 may not be disposed in the optical lens 200, that is, the optical lens 200 only includes at least one optical lens 220, and the at least one optical lens 220 is mounted in the second package 50, that is, the second package 50 forms a carrying structure of the at least one optical lens 220, which is not limited in the present application.

In this application example, the second package 50 is formed on the upper surface of the circuit board 10, and the lens barrel 210 is installed above the second package 50, wherein the height of the second package 50 is higher than the thickness of the filter element 70 installed on the circuit board 10, so that the lens barrel 210 installed above the second package 50 is spaced apart from the filter element 70 installed on the circuit board 10, and the lens barrel 210 and the second package 50 form an avoiding structure to avoid the contact between the lens barrel 210 and the filter element 70, thereby avoiding the damage or the shielding of the surface of the filter element 70 to affect the filtering performance of the filter element 70.

It should be noted that the bottom optical lens 220 of the optical lens 200, i.e. the optical lens 220 closest to the circuit board 10, needs to keep a predetermined distance from the circuit board 10 to ensure that the camera module has a predetermined optical back focus and to avoid the interference between the bottom optical lens 220 and the filter element 70. Specifically, the distance between the bottommost optical lens 220 and the circuit board 10 can be controlled by controlling the height of the second package 50 and the position of the bottommost optical lens 220 in the lens barrel 210.

Fig. 6 illustrates a schematic diagram of a variant implementation of the camera module according to an embodiment of the application. In this variant embodiment, compared to the example illustrated in fig. 1, the photosensitive assembly 100 does not include the second package 50, and the optical lens 200 is mounted on the circuit board 10 and corresponds to the photosensitive chip 20, in such a way that the optical lens 200 is held on the optical path of the photosensitive assembly 100.

Specifically, in this modified embodiment, the lens barrel 210 is mounted on the upper surface of the wiring board 10. In order to avoid the influence on the filtering performance of the filter element 70 caused by the contact between the lens barrel 210 and the filter element 70 mounted on the circuit board 10, as shown in fig. 6, the side wall of the bottom of the lens barrel 210 is recessed inward to form an avoiding structure, so that a part of the lens barrel 210 is suspended above the filter element 70.

Fig. 7 illustrates a schematic diagram of another variant implementation of the camera module according to an embodiment of the present application. In this modified example, compared to the example illustrated in fig. 1, the second package 50 is formed on the upper surface of the wiring board 10, and the filter element 70 is mounted on the second package 50 and corresponds to the photosensitive chip 20, in such a way that the filter element 70 is held on the photosensitive path of the photosensitive chip 20. Specifically, the second package 50 has a mounting groove, and the filter element 70 is mounted in the mounting groove of the second package 50, and the notch size of the mounting groove is greater than or equal to the size of the filter element 70 to accommodate the filter element 70.

In summary, the image capturing module according to the embodiment of the present application is clarified, wherein the structure of the photosensitive assembly 100 is compact, which is beneficial to the thinning of the image capturing module.

Method of making an exemplary photosensitive assembly

As shown in fig. 8, a method of manufacturing a photosensitive assembly according to an embodiment of the present application is illustrated, which includes: s110, providing a circuit board, wherein the circuit board comprises a circuit board main body and a circuit board electric connecting end formed on the circuit board main body, the circuit board main body is provided with an upper surface and a lower surface which are opposite, a through groove is penetratingly formed between the upper surface and the lower surface, and part of the circuit board electric connecting end is formed on the lower surface of the circuit board main body and is positioned around the through groove; s120, paving a first metal bonding layer on the electric connection end of the circuit board; s130, providing a photosensitive chip and forming a second metal bonding layer on the chip electric connection end of the photosensitive chip through a plating process, wherein the second metal bonding layers are respectively fixed on the chip electric connection ends; s140, aligning the photosensitive chip and the circuit board so that the chip electric connection ends of the photosensitive chip are respectively aligned with the circuit board electric connection ends of the circuit board; and S150, heating to enable the second metal bonding layers to be in eutectic with the first metal bonding layers of the circuit board respectively so that the photosensitive chip is bonded and electrically connected to the lower surface of the circuit board main body, wherein the photosensitive area of the photosensitive chip corresponds to the through groove.

In step S110, a circuit board 10 is provided. Specifically, first, a circuit board 10 main body is provided, wherein the circuit board main body 11 has an upper surface 111 and a lower surface 112 opposite to each other, and a through groove 101 penetratingly formed between the upper surface 111 and the lower surface 112; next, a plurality of circuit board electrical connection terminals 12 are formed on the lower surface 112 of the circuit board main body 11, wherein a part of the circuit board electrical connection terminals 12 are formed on the lower surface 112 of the circuit board main body 11 and located around the through groove 101.

In step S120, a first metallic bonding layer 13 is laid on the board electrical connection terminals 12 of the board 10. In a specific example, the first metallic bonding layer 13 is laid on the wiring board electrical connection terminals 12 of the wiring board 10 by a screen printing process. The specific process of laying the first metallic bonding layer 13 by the screen printing process is as follows: applying a metal material 600 (for example, solder paste) on a screen 700 having a plurality of micro-porous structures 701, wherein the plurality of micro-porous structures 701 are arranged in a predetermined manner to form a micro-porous array, as shown in fig. 9 and 10, pushing the metal material 600 by a scraper 800 and making the metal material 600 pass through the plurality of micro-porous structures 701, the metal material 600 falls from the plurality of micro-porous structures 701 and adheres to the circuit board 10 under the screen 700, wherein the plurality of micro-porous structures 701 on the screen 700 correspond to the plurality of circuit board electrical connection terminals 12 of the circuit board 10, so that the metal material 600 falls to the plurality of circuit board electrical connection terminals 12 to form the first metal bonding layer 13 laid on the circuit board electrical connection terminals 12, as shown in fig. 11. It should be understood that the first metallic bonding layer 13 can be laid on the board electrical connection terminals 12 of the board 10 in other ways, which are not intended to limit the present application.

In the present embodiment, the first metal bonding layer 13 is formed of tin, that is, the first metal bonding layer 13 is a tin layer laid on the electrical connection terminal 12 of the circuit board. It should be understood that the first metal bonding layer 13 may also be formed of other metal materials, for example, a silver layer, a cadmium layer, and the application is not limited thereto.

In step S130, a photosensitive chip 20 is provided and a second metal bonding layer 24 is formed on the chip electrical connection terminal 23 of the photosensitive chip 20 through a plating process. Specifically, the photosensitive chip 20 includes a photosensitive region 21, a non-photosensitive region 22 located around the photosensitive region 21, and a plurality of chip electrical connection terminals 23 formed in the non-photosensitive region 22. In the embodiment of the present application, the second metallic bonding layer 24 is formed of copper, and the second metallic bonding layer 24 is a copper layer plated on the chip electrical connection terminal 23. It should be understood that the second metallic bonding layer 24 may be formed of other metallic materials, such as silver layer, cadmium layer, for example, and not limited by the present application.

In the embodiment of the present application, a copper layer is formed on the chip electrical connection terminals 23 of the photosensitive chip 20 by a plating process (e.g., electroplating, wet plating). Compared with forming a ball-planting type conductive layer by a ball-planting technology, forming the conductive layer (the second metal bonding layer 24) by a plating process is relatively simple, and the structure of the second metal bonding layer 24 formed by the plating process is relatively stable, which is mainly represented by: the bonding strength between the second metal bonding layer 24 and the chip electrical connection end 23 is relatively high, and the interference resistance is relatively strong.

Specifically, the conductive layer formed by the ball-attachment technique is easily detached and displaced by the influence of gravity and shaking oscillation during the movement of the photosensitive chip 20. The bonding strength between the second metal bonding layer 24 and the chip electrical connection end 23 formed by the plating process is relatively high, and the second metal bonding layer 24 is not easy to fall off and shift in the moving process of the photosensitive chip 20; the second metal bonding layer 24 formed by the plating process is flat as a whole, so that the second metal bonding layer 24 is not easily affected by shaking and oscillation to fall off and be displaced during the movement of the photosensitive chip 20.

In step S140, the photosensitive chip 20 and the wiring board 10 are aligned. Specifically, first, the photosensitive chip 20 is held by the pickup device 900; next, the relative positional relationship between the photosensitive chip 20 and the circuit board 10 is adjusted so that the photosensitive chip 20 is aligned with the circuit board 10, as shown in fig. 12. That is, step S140 includes: holding the photosensitive chip 20 by the pickup device 900; and adjusting the relative position relationship between the photosensitive chip 20 and the circuit board 10, so that the photosensitive chip 20 is aligned to the circuit board 10.

It is worth mentioning that, in the process of aligning the photosensitive chip 20 and the circuit board 10, the photosensitive chip 20 is kept in a clamped state, and the second metal bonding layer 24 is not easily detached and displaced by the influence of gravity or shaking oscillation, so that the photosensitive chip 20 is suitable for being clamped and moved in the process of assembling with the circuit board 10 to realize that the relative position relationship between the photosensitive chip 20 and the circuit board 10 is kept by continuously moving the photosensitive chip 20, thereby improving the assembling precision to realize the electrical conduction between the photosensitive chip 20 and the circuit board 10.

In step S150, heating is performed so that the second metal bonding layers 24 are eutectic with the first metal bonding layers 13 of the wiring board 10, respectively. Specifically, in the process of heating so that the second metal bonding layers 24 are respectively eutectic with the first metal bonding layers 13 of the circuit board 10, the photosensitive chip 20 is held in a sandwiched state by the pickup device 900 so that the positional relationship of the photosensitive chip 20 with respect to the circuit board 10 is kept fixed to avoid the first metal bonding layers 13 and the second metal bonding layers 24 from being displaced by relative sliding in a softened state, in such a manner that the assembly accuracy between the photosensitive chip 20 and the circuit board 10 is ensured, as shown in fig. 12.

In summary, the manufacturing method of the photosensitive assembly according to the embodiment of the present application is illustrated, wherein, in the manufacturing process of the photosensitive assembly 100, the photosensitive chip 20 is maintained in the clamped state, so that the position relationship of the photosensitive chip 20 relative to the circuit board 10 is maintained to be fixed, so as to improve the assembling accuracy. Moreover, the preparation process of the photosensitive assembly 100 is relatively simple, and the production cost is relatively reduced.

Hereinafter, a method for manufacturing the photosensitive member according to an embodiment of the present application is described as a specific example.

Step 1: providing a circuit board 10, wherein the circuit board 10 comprises a circuit board 10 main body and a circuit board electrical connection end 12 formed on the circuit board main body 11, the circuit board main body 11 has an upper surface 111 and a lower surface 112 opposite to each other, and a through groove 101 penetratingly formed between the upper surface 111 and the lower surface 112, and part of the circuit board electrical connection end 12 is formed on the lower surface 112 of the circuit board main body 11 and located around the through groove 101.

In this specific example, further, the wiring board 10 needs to be baked. Specifically, the circuit board 10 which is flattened and compacted is baked within a preset time and at a preset temperature to remove moisture in the circuit board 10, so that the moisture contained in the circuit board 10 is prevented from expanding (or contracting) under the temperature change in the subsequent production process, and the overall flatness of the circuit board 10 is not affected.

And 2, step: and laying a first metal bonding layer 13 on the circuit board electric connection end 12 of the circuit board 10, wherein the first metal bonding layer 13 is a tin layer. Specifically, the wiring board 10 is subjected to a preliminary tinning process by a screen printing process. The specific process of pre-tinning comprises the following steps: applying a solder paste on a screen 700 having a plurality of micro-porous structures 701, wherein the plurality of micro-porous structures 701 are arranged in a predetermined manner to form an array of micro-pores, as shown in fig. 9 and 10; pushing solder paste by a scraper 800 and making the solder paste pass through the micro-porous structures 701, the solder paste falling from the micro-porous structures 701 and adhering to the circuit board 10 below the screen 700, wherein the micro-porous structures 701 on the screen 700 correspond to the circuit board electrical connection terminals 12 of the circuit board 10, so that the solder paste falls to the circuit board electrical connection terminals 12 to form the first metal bonding layer 13 laid on the circuit board electrical connection terminals 12, as shown in fig. 11.

Specifically, as shown in fig. 9, the wire net 700 includes a plate structure 710 (e.g., a steel plate) having a micro-porous structure 701 and a fixing frame 720 disposed around the plate structure 710. The fixing frame 720 is used for fixing the plate structure 710 under a predetermined tension (i.e., applying an outward pulling force to the plate structure 710 when fixing the plate structure 710), so that the plate structure 710 is tightened under tension to maintain flatness. A plurality of micro-porous structures 701 are disposed on a partial region of the plate structure 710, wherein the micro-porous structures 701 are through holes. The micro-pore structure 701 can be processed by laser lattice, etching and other processes. In the processing process of the micro-pore structure 701, firstly, an initial pore structure is formed, and then, the initial pore structure is processed and polished to form the micro-pore structure 701, so that the roughness of the surface of the micro-pore structure 701 is reduced, and the phenomenon of tin dipping, tin hanging and tin paste blocking is avoided.

The size and arrangement of the micro-porous structure 701 are determined according to the size and arrangement of the electrical connection terminals 12 of the circuit board. In the process of laying the first metallic bonding layer 13 on the circuit board electrical connection terminals 12 of the circuit board 10, the circuit board 10 is placed under the screen mesh 700, a preset gap may exist between the circuit board 10 and the screen mesh 700, the height of the preset gap is 0mm to 2mm, and the plurality of micro-porous structures 701 correspond to the plurality of circuit board electrical connection terminals 12 of the circuit board 10. The metal material 600 (e.g., solder paste) applied on the screen 700 having the micro-porous structures 701 should be as uniform as possible and have a length longer than the length or width of the micro-porous array, so that the solder paste can pass through all the micro-porous structures 701 during the process of pushing the solder paste through the micro-porous structures 701 by the scraper 800, and further, all the circuit board electrical connection terminals 12 of the circuit board 10 disposed below the screen 700 are laid with the first metal bonding layer 13.

The doctor blade 800 comprises a doctor body 810 and a replaceable doctor head 820, and the doctor blade 800 is suspended above the screen 700 by its doctor body 810 and is movable in the thickness direction as well as in the length and width directions of the screen 700. The scraper head 820 is made of flexible materials and is in a shape of a tapered long strip or a sheet, the scraper head 820 and the screen mesh 700 are in contact and then deform, meanwhile, the solder paste is pushed to move, and under the influence of pressing and gravity of the scraper head 820, the solder paste can smoothly cover the circuit board 10 through the micropore structures 701, and the plurality of circuit board electric connection ends 12 are connected with the circuit board.

Further, at least one electronic component 30 can be electrically connected to a portion of the electrical connection terminal 12 of the circuit board. That is, in this specific example, the photosensitive assembly 100 includes at least one electronic component 30 (e.g., inductor, capacitor), and accordingly, after the first metal bonding layer 13 is laid, the at least one electronic component 30 is attached to a tin layer of a portion of the electrical connection terminals 12 of the circuit board by a chip mounter and reflowed to electrically connect the electronic component 30 and the circuit board 10. Specifically, the reflow soldering process is as follows: the circuit board 10 attached with the at least one electronic component 30 moves in a heating channel with different temperature areas of the heating device in a rail transportation mode, so that the circuit board 10 attached with the at least one electronic component 30 passes through the different temperature areas of the heating device along with rail transportation to heat, cool and solidify the circuit board 10 of the at least one electronic component 30, and further the electronic component 30 is fixed with the circuit board 10 through the tin layer and electrically connected with the circuit board 10.

Further, the circuit board 10 may be inspected by Automated Optical Inspection (AOI) to ensure its quality. Specifically, the quality of the wiring board 10 is examined by observing the appearance and the pre-tinning effect (e.g., whether or not there is a tin deficiency, and a tin blocking).

A first package 40 and a second package 50 may be formed on the lower surface 112 of the wiring board main body 11 and the upper surface 111 of the wiring board main body 11, respectively. Specifically, the first package 40 is integrally formed on the lower surface 112 of the circuit board main body 11 by a molding process, and at least a portion of the at least one electronic component 30 is encapsulated in the first package 40; the second package body 50 is integrally formed on the upper surface 111 of the circuit board main body 11 through a molding process. More specifically, the first package body 40 is integrally formed on the lower surface 112 of the circuit board main body 11 by a molding process of Molding On Board (MOB), and reserves a bonding position for the photosensitive chip 20 and makes a portion of the circuit board 10 formed on the lower surface 112 of the circuit board main body 11 and located around the through slot 101 in an exposed state; the second package body 50 is integrally formed on the upper surface 111 of the circuit board main body 11 by a molding process of die on chip (MOC). The first package body 40 and the second package body 50 have respective predetermined heights and respective predetermined shapes. The first package 40 and the second package 50 each have a slot and correspond to the photosensitive area 21 of the photosensitive chip 20 under the circuit board 10, so that the slots of the first package 40 and the second package 50 are maintained on the photosensitive path of the photosensitive chip 20.

The flexible circuit board 10 may be attached to the surface of the circuit board 10 to form a rigid-flexible circuit board 10. Specifically, first, the flexible wiring board 10 having a predetermined shape is formed by cutting, and then, the flexible wiring board 10 is attached to the wiring board 10.

And step 3: providing a photosensitive chip 20 and forming a second metal bonding layer 24 on the chip electrical connection end 23 of the photosensitive chip 20 by a plating process, wherein the second metal bonding layers 24 are respectively fixed on the chip electrical connection ends 23. Specifically, the photosensitive chip 20 is subjected to a copper plating process under the protection of a molding solution to form a copper layer on the chip electrical connection terminals 23 of the photosensitive chip 20. In contrast, the copper plating process is relatively simple and the subsequent process is convenient, and the reliability of the photosensitive chip 20 after copper plating is higher than that of the ball-mounted photosensitive chip 20. The structure produced by the copper plating process is relatively low on the photosensitive chip 20 and has relatively strong external interference resistance. The position and shape of the ball-planting-type conductor of the photosensitive chip 20 are changed due to anti-vibration or movement, or even the ball-planting-type conductor falls off, so that the ball-planting-type conductor (e.g., solder ball) cannot be disposed at the chip electrical connection terminal 23 of the photosensitive chip 20, thereby affecting subsequent assembly and function realization of the photosensitive chip 20.

And 4, step 4: the photosensitive chip 20 and the wiring board 10 are aligned so that the chip electrical connection terminals 23 of the photosensitive chip 20 are aligned with the wiring board electrical connection terminals 12 of the wiring board 10, respectively. Specifically, the photosensitive chip 20 is clamped by the shooting device 900, so that the relative position relationship between the photosensitive chip 20 and the circuit board 10 can be adjusted in real time in a clamped state of the photosensitive chip 20, so that the photosensitive chip 20 is aligned with the circuit board 10.

And 5: heating to make the second metal bonding layers 24 and the first metal bonding layers 13 of the circuit board 10 eutectic respectively, so that the photosensitive chip 20 is bonded and electrically connected to the lower surface 112 of the circuit board main body 11, wherein the photosensitive area 21 of the photosensitive chip 20 corresponds to the through groove 101. Specifically, while the photosensitive chip 20 is aligned with the circuit board 10, in a state where the photosensitive chip 20 is clamped by the pickup device 900, the pickup device 900 provides a high temperature to make the tin layer and the copper layer form a eutectic structure 90, that is, make the second metal bonding layers 24 respectively perform eutectic with the first metal bonding layers 13 of the circuit board 10. After the tin layer and the copper layer are cooled, the photosensitive chip 20 is fixed to the circuit board 10 and electrically connected to the circuit board 10. In this specific example, the heating time is 30 seconds, and the heating temperature is 170 °.

Further, in order to improve the structural stability of the photosensitive chip 20 and the circuit board 10, an adhesive may be disposed on an electrically exposed portion of the photosensitive chip 20 to seal the electrically exposed portion of the photosensitive chip 20, and at the same time, the bonding strength between the photosensitive chip 20 and the circuit board 10 is enhanced by the adhesive.

Still further, a filter element 70 may be disposed above the wiring board 10, wherein the filter element 70 covers the through-groove 101.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is provided for purposes of illustration and understanding only, and is not intended to limit the application to the details which are set forth in order to provide a thorough understanding of the present application.

Claims

1. A photosensitive assembly, comprising:

2. The photosensitive assembly of claim 1 further comprising at least one electronic component electrically connected to a portion of the electrical connection end of the circuit board.

3. The photosensitive assembly of claim 2, wherein the at least one electronic component is located on a lower surface of the circuit board body.

4. The photosensitive assembly according to claim 3, further comprising a first package body formed on a lower surface of the circuit board body and encapsulating at least a portion of the at least one electronic component therein.

5. The photosensitive assembly according to claim 4, wherein the first package body is integrally formed on the lower surface of the circuit board main body through a molding process, and at least a portion of the at least one electronic component is encapsulated in the first package body.

6. The photosensitive assembly of claim 5, wherein the first package further encapsulates at least a portion of the photosensitive chip.

7. The photosensitive assembly of claim 4, wherein a lower surface of the first package is lower than a lower surface of the photosensitive chip.

8. The photosensitive assembly of claim 8 further comprising a filter element held in the photosensitive path of the photosensitive chip.

9. The photosensitive assembly of claim 8, wherein the filter element is mounted on an upper surface of the circuit board body and corresponds to the photosensitive chip in such a manner that the filter element is held on a photosensitive path of the photosensitive chip.

10. The photosensitive assembly of claim 9, wherein the filter element covers the through-slots.

11. The photosensitive assembly according to claim 8, further comprising a second package formed on an upper surface of the circuit board body, wherein the filter element is mounted to the second package and corresponds to the photosensitive chip in such a manner that the filter element is held on a photosensitive path of the photosensitive chip.

12. The photosensitive assembly of claim 11, wherein the second package body is integrally formed on the upper surface of the circuit board main body through a molding process.

13. The photosensitive assembly of claim 1, wherein the first metallic bonding layer is a tin layer laid on the electrical connection end of the circuit board, and the second metallic bonding layer is a copper layer plated on the electrical connection end of the chip.

14. The utility model provides a module of making a video recording which characterized in that includes:

a photosensitive assembly as claimed in any one of claims 1 to 13; and

an optical lens held by the photosensitive member.

15. A method for manufacturing a photosensitive assembly, comprising:

heating to enable the second metal bonding layers to be in eutectic crystal with the first metal bonding layers of the circuit board respectively, so that the photosensitive chip is bonded on and electrically connected to the lower surface of the circuit board main body, wherein the photosensitive area of the photosensitive chip corresponds to the through groove.

16. The method of manufacturing a photosensitive assembly according to claim 15, wherein aligning the photosensitive chip with the wiring board comprises:

clamping the photosensitive chip by a shooting device; and

and adjusting the relative position relationship between the photosensitive chip and the circuit board so that the photosensitive chip is aligned to the circuit board.

17. The manufacturing method of a photosensitive assembly according to claim 16, wherein in heating to cause the second metallic bonding layers to eutectic with the first metallic bonding layers of the circuit board, respectively, the photosensitive chip is held in a sandwiched state by the pickup device so that a positional relationship of the photosensitive chip with respect to the circuit board is kept fixed.