CN115488409A - Method for processing patterns of anti-sticking board - Google Patents

Abstract

The invention provides a method for processing patterns of an attachment-proof plate, which comprises the steps of fixing the attachment-proof plate to be processed, and then carrying out rough planing and fine planing on the attachment-proof plate to be processed in sequence to obtain the patterns of the attachment-proof plate, wherein the planing precision can be controlled to be IT 9-IT 8, the surface roughness of the attachment-proof plate after planing is 0.4-1.6 mu m, the straightness can reach 0.02mm/m, the attachment-proof plate with a large size can be processed, the equipment cost is saved, the processing time of a single attachment-proof plate is saved, the damage to a cutter is reduced, the adsorption area of the attachment-proof plate is increased, and the service life of the attachment-proof plate is prolonged.

Description

Method for processing patterns of anti-sticking board

Technical Field

The invention relates to the technical field of vacuum sputtering, in particular to a processing method of a plate-attachment prevention pattern.

Background

Physical Vapor Deposition (PVD) is a typical thin film processing method, and the prepared thin film has the advantages of high hardness, low friction coefficient, good wear resistance, chemical stability and the like, and has been widely used in the industrial field in recent years. Taking LCD as an example, the main component of the LCD is a liquid crystal panel, and the production process of the liquid crystal panel mainly includes several processes of array, panel forming and module assembling. Many of the above processes are used in thin film processes. As one kind of physical vapor deposition, vacuum sputtering is a process in which electrons collide with argon atoms in the process of accelerating to fly to a substrate under the action of an electric field, so that a large amount of argon ions and electrons are ionized, and the electrons fly to the substrate. The argon ions accelerate to bombard the target under the action of the electric field, a large amount of target atoms are sputtered, neutral target atoms (or molecules) are deposited on the substrate to form a film, and the purpose of coating the surface of the substrate is finally achieved. The secondary electrons are influenced by the magnetic force of the magnetic field Loran in the process of accelerating to fly to the substrate and are restrained in a plasma area close to the target surface, the plasma density in the area is very high, the secondary electrons do circular motion around the target surface under the action of the magnetic field, the motion path of the electrons is very long, a large number of argon ions are ionized by continuous collision with argon atoms in the motion process to bombard the target material, the energy of the electrons is gradually reduced after multiple collisions, the restraint of magnetic lines of force is eliminated, the electrons are far away from the target material and are finally deposited on the substrate, or a small number of the electrons are deposited on the inner wall of a vacuum chamber.

During vacuum sputtering, in order to ensure the accuracy and efficiency of film coating, a shielding plate is usually disposed in the vacuum chamber of the sputtering machine to prevent target atoms from being ejected and accumulated on the vacuum chamber wall and the non-sputtering target area. The basic constituent material of the anti-sticking plate is a metal material, and two parameters of the flatness and the parallelism of the anti-sticking plate are directly related to the deposition capability of the anti-sticking plate, so that the cleanliness and the film forming rate of the target in the sputtering process are influenced. Wherein, the flatness refers to the deviation of the height of the macro-concave-convex of the substrate from the ideal plane, and the parallelism refers to the degree of parallelism of two planes or two straight lines, namely, the maximum allowable error value of the parallelism of one plane (side) relative to the other straight line (side).

The anti-sticking plate is mainly applied to a target material of an LCD and used for adsorbing some sputtered metal particles in a vacuum sputtering process. In the sputtering process, the adsorption capacity of the metal particles is weaker and weaker as the adsorption capacity of the metal particles on the shielding plate is gradually increased. If the adsorption area is increased, the service life of the anti-landing plate can be prolonged. In order to increase the adsorption area of the attachment preventing plate, an uneven surface pattern is formed on the attachment preventing plate, as shown in fig. 1, a certain uneven surface pattern comprises a plurality of bosses, grooves are formed among the bosses, and the grooves are arranged on the surface of the attachment preventing plate in a grid shape. In order to further increase the adsorption area, the size of the attachment prevention plate is gradually increased and is often more than 1000mm, on one hand, the large-size attachment prevention plate is difficult to process in a general processing center, on the other hand, the large-size attachment prevention plate has more surface patterns to be processed, the processing time for processing the surface patterns is often very long, in the process of processing the surface patterns of the attachment prevention plate, the general processing center often needs to process the general surface patterns through multiple strokes, the processing process time is very long, and the damage rate to a cutter is also very high.

For example, CN102107347a discloses a method for processing a protection plate, comprising: providing a sticking-proof plate blank; cutting the attachment-preventing plate blank; providing a 4000 ton press machine and an auxiliary disc, and applying pressure of 10-20 MPa for the anti-sticking plate blank for 1-2 minutes by using the 4000 ton press machine through the auxiliary disc to release stress after the tool processes the anti-sticking plate blank in each step; the cutting process adopts a milling cutter, and the steps of rough milling of two planes, finish milling of appearance, finish milling of planes, hole milling and pattern processing of large planes and side surfaces at two ends, pattern processing of long sides, step processing of small planes, reverse pattern processing of inclined planes of large planes and the like are sequentially carried out.

A planer is a linear motion machine that uses a planer tool to plane a surface, a groove, or a formed surface of a workpiece, and achieves the purpose of planing the surface of the workpiece by linear reciprocating motion generated between the tool and the workpiece. The planer can plane horizontal planes, vertical planes, inclined planes, curved surfaces, step surfaces, dovetail-shaped workpieces, T-shaped grooves, V-shaped grooves, holes, gears, racks and the like, has higher efficiency than that of a common machine tool in the aspect of processing time efficiency, greatly saves the processing time, and has less damage to the cutter.

In view of the above, it is necessary to develop a method for processing patterns of an attachment prevention plate, wherein the patterns of the attachment prevention plate are processed by a planing process.

Disclosure of Invention

In view of the problems in the prior art, the invention provides a method for processing patterns of an anti-adhesion plate, which comprises the steps of fixing the anti-adhesion plate to be processed, and then carrying out rough planing and fine planing on the anti-adhesion plate to be processed in sequence to obtain the patterns of the anti-adhesion plate, wherein the planing precision can be controlled to be IT 9-IT 8, the surface roughness of the anti-adhesion plate after planing is 0.4-1.6 mu m, the straightness can reach 0.02mm/m, the anti-adhesion plate with a large size can be processed, the equipment cost is saved, the processing time of a single anti-adhesion plate is saved, the damage to a cutter is reduced, the adsorption area of the anti-adhesion plate is increased, and the service life of the anti-adhesion plate is prolonged.

In order to achieve the purpose, the invention adopts the following technical scheme:

the invention aims to provide a method for processing patterns of a defending plate, which is characterized by comprising the following steps:

and fixing the anti-sticking board to be processed, and performing rough planing and fine planing on the anti-sticking board to be processed in sequence to obtain anti-sticking pattern.

The method for processing the patterns of the anti-attachment plate comprises the steps of fixing the anti-attachment plate to be processed, and then sequentially carrying out rough planing and fine planing on the anti-attachment plate to be processed to obtain the patterns of the anti-attachment plate, wherein the planing precision can be controlled to be IT 9-IT 8, the surface roughness of the anti-attachment plate after planing is 0.4-1.6 mu m, and the straightness can reach 0.02mm/m, and the large-size anti-attachment plate can be processed, so that the equipment cost is saved, the processing time of a single anti-attachment plate is saved, the damage to a cutter is reduced, the adsorption area of the anti-attachment plate is increased, and the service life of the anti-attachment plate is prolonged.

As the preferable technical scheme of the invention, the machining method adopts a double housing planer for machining.

It is worth to be noted that, since the planer relies on the ram to drive the planer tool to make horizontal linear reciprocating motion, the tool post can rotate at an angle in the vertical plane and can be manually fed, and the worktable drives the workpiece to make intermittent transverse or vertical feeding motion, which is commonly used for processing planes, grooves, dovetail surfaces, and the like. Therefore, for the machining of the attachment preventing plate, the finished product size needs to be machined to a target level, for example, before the planing machining, the machining comprises the steps of roughly milling two planes, finely milling the appearance, finely milling the plane, milling a large plane and milling holes on two end side surfaces of the attachment preventing plate in sequence, and then planing the large plane to obtain a target surface pattern, preferably an AET pattern, through the linear motion of a planer.

As a preferable technical solution of the present invention, the rough planing uses a wide-blade fine planing tool.

In a preferred embodiment of the present invention, the wide-edge thin planer tool is made of cemented carbide.

Preferably, the cemented carbide has a type of YG6 or YG8.

In a preferred embodiment of the present invention, the rake angle of the wide-edge fine planing tool is-10 to-15 degrees, for example, -10 degrees, -11 degrees, -12 degrees, -13 degrees, -14 degrees or-15 degrees, but the rake angle is not limited to the values listed, and other values not listed in the range of the values are also applicable.

Preferably, the wide edge fine planing tool has a mounting clearance angle of 3 to 15 degrees, for example, 3 degrees, 4 degrees, 5 degrees, 6 degrees, 7 degrees, 8 degrees, 9 degrees, 10 degrees, 11 degrees, 12 degrees, 13 degrees, 14 degrees, or 15 degrees, but is not limited to the recited values, and other values not recited within the range of values are also applicable.

In a preferred embodiment of the present invention, the rough surface is formed to have a surface depth of 0.2 to 0.5mm, for example, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, or 0.5mm, but the surface depth is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.

Preferably, the rough planing has a planing speed of 50 to 70m/min, such as 50m/min, 53m/min, 55m/min, 57m/min, 60m/min, 63m/min, 65m/min, 68m/min or 70m/min, but is not limited to the cited values, and other values not cited within this range of values are equally applicable.

As the preferable technical scheme of the invention, the fine planing adopts a bevel planer tool.

Preferably, the bevel planer tool is made of high-speed steel, and the high-speed steel is tool steel with high hardness, high wear resistance and high heat resistance, also called high-speed tool steel or high-speed steel, commonly called white steel.

In a preferred embodiment of the present invention, the depth of the finish gouging is 0.2 to 0.5mm, for example, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, or 0.5mm, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.

Preferably, the rough planing has a planing speed of 5 to 15m/min, such as 5m/min, 6m/min, 7m/min, 8m/min, 9m/min, 10m/min, 11m/min, 13m/min or 15m/min, but is not limited to the cited values, and other values not cited within this range of values are equally applicable.

As a preferable embodiment of the present invention, the rate of the difference between the rough planing and the finish planing is controlled to be 5% or less.

It should be noted that the static difference rate, also called the rotation speed change rate, refers to the ratio of the rotation speed drop generated when the load changes from the ideal idling to the rated value when the motor runs at a certain rotation speed to the ideal idling rotation speed. In practice, the minimum idling speed is the standard, and the static error rate is effective, which is also called relative stability, and is used to indicate the degree of change of the motor rotating speed when the load changes, and the static error rate is related to the mechanical characteristic hardness, and the smaller the value, the better the motor stability is.

As a preferred technical solution of the present invention, the processing method includes the following steps:

fixing the anti-sticking plate to be processed on a double housing planer, and sequentially carrying out rough planing and fine planing on the anti-sticking plate to be processed to obtain anti-sticking plate patterns;

the rough planing adopts a wide-edge thin planing tool, the wide-edge thin planing tool is made of hard alloy, the type of the hard alloy is YG6 or YG8, the installation front angle of the wide-edge thin planing tool is-10 to-15 degrees, and the installation rear angle is 3 to 15 degrees; the planing depth of the coarse planing is 0.2-0.5 mm, and the planing speed is 50-70 m/min; the fine planing adopts an inclined plane planer tool, the inclined plane planer tool is made of high-speed steel, the planing depth of the fine planing is 0.2-0.5 mm, and the planing speed is 5-15 m/min; and controlling the static difference rate of the rough planing and the fine planing to be below 5 percent.

Compared with the prior art, the invention at least has the following beneficial effects:

the method for processing the patterns of the anti-attachment plate comprises the steps of fixing the anti-attachment plate to be processed, and then sequentially carrying out rough planing and fine planing on the anti-attachment plate to be processed to obtain the patterns of the anti-attachment plate, wherein the planing precision can be controlled to be IT 9-IT 8, the surface roughness of the anti-attachment plate after planing is 0.4-1.6 mu m, and the straightness can reach 0.02mm/m, and the large-size anti-attachment plate can be processed, so that the equipment cost is saved, the processing time of a single anti-attachment plate is saved, the damage to a cutter is reduced, the adsorption area of the anti-attachment plate is increased, and the service life of the anti-attachment plate is prolonged.

Drawings

FIG. 1 shows a conventional patterned scuff plate.

Detailed Description

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:

example 1

The embodiment provides a processing method of patterns of a defending plate, which comprises the following steps:

fixing a to-be-processed attachment prevention plate on a double housing planer, and sequentially performing rough planing and fine planing on the to-be-processed attachment prevention plate to obtain attachment prevention plate patterns, specifically AET patterns;

the rough planing adopts a wide-edge thin planing tool, the wide-edge thin planing tool is made of hard alloy, the type of the hard alloy is YG6, the installation front angle of the wide-edge thin planing tool is-12 degrees, and the installation rear angle of the wide-edge thin planing tool is 10 degrees; the planing depth of the rough planing is 0.3mm, and the planing speed is 60m/min; the fine planing adopts an inclined plane planer tool, the inclined plane planer tool is made of high-speed steel, the planing depth of the fine planing is 0.3mm, and the planing speed is 10m/min; and controlling the static difference rate of the rough planing and the fine planing to be below 5 percent.

Example 2

The embodiment provides a processing method of patterns of a defending plate, which comprises the following steps:

fixing a to-be-processed attachment prevention plate on a double housing planer, and sequentially performing rough planing and fine planing on the to-be-processed attachment prevention plate to obtain attachment prevention plate patterns, specifically AET patterns;

the rough planing adopts a wide-edge thin planer tool, the wide-edge thin planer tool is made of hard alloy, the type of the hard alloy is YG6, the front installation angle of the wide-edge thin planer tool is-10 degrees, and the rear installation angle of the wide-edge thin planer tool is 15 degrees; the planing depth of the rough planing is 0.2mm, and the planing speed is 50m/min; the fine planing adopts an inclined plane planer tool, the inclined plane planer tool is made of high-speed steel, the planing depth of the fine planing is 0.2mm, and the planing speed is 5m/min; and controlling the static difference rate of the rough planing and the fine planing to be below 5%.

Example 3

The embodiment provides a processing method of patterns of a defending plate, which comprises the following steps:

fixing a to-be-processed attachment prevention plate on a double housing planer, and sequentially performing rough planing and fine planing on the to-be-processed attachment prevention plate to obtain attachment prevention plate patterns, specifically AET patterns;

the rough planing adopts a wide-edge thin planing tool, the wide-edge thin planing tool is made of hard alloy, the type of the hard alloy is YG8, the installation front angle of the wide-edge thin planing tool is-15 degrees, and the installation rear angle of the wide-edge thin planing tool is 3 degrees; the planing depth of the rough planing is 0.5mm, and the planing speed is 70m/min; the fine planing adopts an inclined plane planer tool, the inclined plane planer tool is made of high-speed steel, the planing depth of the fine planing is 0.5mm, and the planing speed is 15m/min; and controlling the static difference rate of the rough planing and the fine planing to be below 5%.

By adopting the processing method of the patterns of the anti-sticking board, AET patterns meeting the quality requirements can be obtained.

In summary, according to the method for processing the patterns of the attachment-preventing board, after the attachment-preventing board to be processed is fixed, the attachment-preventing board to be processed is subjected to rough planing and fine planing in sequence, so that the patterns of the attachment-preventing board are obtained through processing, not only can the planing precision be controlled to be IT 9-IT 8, the surface roughness of the attachment-preventing board after planing is controlled to be 0.4-1.6 μm, and the straightness can reach 0.02mm/m, but also the attachment-preventing board with a large size can be processed, so that the equipment cost is saved, the processing time of a single attachment-preventing board is saved, the damage to a cutter is reduced, the adsorption area of the attachment-preventing board is increased, and the service life of the attachment-preventing board is prolonged.

The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.

The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are all within the protection scope of the present invention.

It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.

In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims (10)

1. The processing method of the patterns of the anti-sticking board is characterized by comprising the following steps:

fixing the anti-sticking plate to be processed, and performing rough planing and fine planing on the anti-sticking plate to be processed in sequence to obtain anti-sticking plate patterns.

2. The method of claim 1, wherein the method of machining uses a planer.

3. A method of machining as claimed in claim 1 or 2, wherein the rough planing is performed using a wide-edged fine planing tool.

4. The machining method according to claim 3, wherein the wide-edge fine planer tool is made of cemented carbide;

preferably, the type of the cemented carbide is YG6 or YG8.

5. The machining method according to claim 3 or 4, wherein the rake angle of installation of the wide-edge fine planing tool is-10 to-15 degrees;

preferably, the installation relief angle of the wide-edge fine planing tool is 3-15 degrees.

6. The processing method as set forth in any one of claims 1 to 5, wherein the rough planing has a planing depth of 0.2 to 0.5mm;

preferably, the planing speed of the rough planing is 50-70 m/min.

7. The machining method according to any one of claims 1 to 6, wherein the finish planing uses a bevel planer tool;

preferably, the bevel planer tool is made of high-speed steel.

8. The processing method as set forth in any one of claims 1 to 7, wherein the fine planing has a planing depth of 0.2 to 0.5mm;

preferably, the planing speed of the rough planing is 5-15 m/min.

9. The machining method according to any one of claims 1 to 8, wherein a rate of a static difference between the rough planing and the fine planing is controlled to be 5% or less.

10. The process according to any one of claims 1 to 9, characterized in that it comprises the following:

fixing the anti-sticking plate to be processed on a double housing planer, and sequentially carrying out rough planing and fine planing on the anti-sticking plate to be processed to obtain anti-sticking plate patterns;

the rough planing adopts a wide-edge thin planing tool, the wide-edge thin planing tool is made of hard alloy, the type of the hard alloy is YG6 or YG8, the installation front angle of the wide-edge thin planing tool is-10 to-15 degrees, and the installation rear angle is 3 to 15 degrees; the planing depth of the coarse planing is 0.2-0.5 mm, and the planing speed is 50-70 m/min; the fine planing adopts an inclined plane planer tool, the inclined plane planer tool is made of high-speed steel, the planing depth of the fine planing is 0.2-0.5 mm, and the planing speed is 5-15 m/min; and controlling the static difference rate of the rough planing and the fine planing to be below 5 percent.

Images