CN105039916A - Machining method for molding operation - Google Patents

Abstract

The invention provides a machining method for molding operation. The machining method includes a plane leveling machining process for a sputtering face and a back face of a target blank and a side face machining process for each side face of the target blank, so that the thickness of the target blank reaches the preset thickness, and the plane size of the sputtering face and the back face of the target blank reach the preset plane size. The plane leveling machining process for the sputtering face and the back face of the target blank includes a primary plane leveling process and secondary plane leveling process which are performed on the sputtering face and the back face of the target blank in the first direction and a finish machining plane leveling process performed on the sputtering face. By the adoption of the machining method for molding operation, according to the structure of the target blank before the leveling process in all the steps, under the condition that the flatness of the sputtering face and the back face of the machined target blank is guaranteed, the vibration amount and the deformation amount of the target blank are reduced, and the quality and the machining efficiency of the machined target blank are guaranteed.

Description

A kind of machining process of forming process operation

Technical field

The present invention relates to the machining process of a kind of forming process operation, belong to field of mechanical technique.

Background technology

At preparation of target materials in target blank mechanical processing process, need according to the edge of predetermined size to target blank, precision work is carried out to improve parallelism and the planeness of target in surface, and makes target can mate the dimensional requirement of magnetron sputtering equipment.But in Tool in Cutting target process, after target is subject to external load effect, the internal stress of target inside from the inner release gradually of target, and can cause the distortion of product thus, makes planeness produce deviation; And after cutter contacts with target blank, cutter produces torsion when the surface working of workpiece, and these torsion can cause Workpiece vibration, thus target is made to produce the suface processing quality of influence of crust deformation workpiece.

Summary of the invention

The invention provides the machining process of a kind of forming process operation, the above defect can be overcome.

For solving above technical problem, the invention provides following technical scheme: a kind of machining process of target, comprise the plane leveling complete processing to target blank sputter face and the back side, and for the side complete processing of each side of target blank, thus making the thickness of described target blank reach pre-determined thickness, the planar dimension at described target blank sputter face and the back side reaches predetermined plane size; Wherein, the planarizing process technique at target blank sputter face and the back side is comprised: the secondary flat levelling process that the sputter face of target blank and the back side are carried out along first direction and two secondary flat levelling process, and for the precision-machined surface levelling process of sputter face, by along the multistep levelling process of first direction to described sputter face or the back side, alleviate stress that target inside produces and the vibration that mechanical workout produces for target.

In a described secondary flat levelling process, two secondary flat levelling process and precision-machined surface levelling process, the cutter of employing is respectively that diameter is 200 ~ 250mm, diameter is 200 ~ 250mm and diameter is the dise knife of 400 ~ 450mm; The rotating speed of main shaft is respectively 600 ~ 800n/s, 800 ~ 1000n/s and 300 ~ 450n/s; The amount of feed of cutter in sputter face or the back side is 800 ~ 1000mm/min, 600 ~ 800mm/min and 200 ~ 300mm/min; Back engagement of the cutting edge is in a first direction respectively 0.8 ~ 1.2mm, 0.2 ~ 0.4mm and 0.08 ~ 0.15mm.

The machining process of this forming process operation that the present invention relates to, in mechanical processing technique, the tool dimension adopted, the speed of mainshaft and the depth of cut are selected directly to affect the otch planarization of target blank, the magnitude of vibrations of target blank and deformation extent, and target machining efficiency.According to the target blank structure before each step planarizing process technique, thus adopt different complete processings, with while the sputter face guaranteeing the target blank processed and back side plane degree, reduce the vibratory magnitude of target, and deformation quantity, thus guarantee the quality after target blank mechanical workout, and working (machining) efficiency.

Embodiment

A kind of machining process of target, comprise the plane leveling complete processing to target blank sputter face and the back side, and for the side complete processing of each side of target blank, thus making the thickness of described target blank reach pre-determined thickness, the planar dimension at described target blank sputter face and the back side reaches predetermined plane size; Wherein, the planarizing process technique at target blank sputter face and the back side is comprised: the secondary flat levelling process that the sputter face of target blank and the back side are carried out along first direction and two secondary flat levelling process, and for the precision-machined surface levelling process of sputter face, by along the multistep levelling process of first direction to described sputter face or the back side, alleviate stress that target inside produces and the vibration that mechanical workout produces for target.

In a described secondary flat levelling process, two secondary flat levelling process and precision-machined surface levelling process, the cutter of employing is respectively that diameter is 200 ~ 250mm, diameter is 200 ~ 250mm and diameter is the dise knife of 400 ~ 450mm; The rotating speed of main shaft is respectively 600 ~ 800n/s, 800 ~ 1000n/s and 300 ~ 450n/s; The amount of feed of cutter in sputter face or the back side is 800 ~ 1000mm/min, 600 ~ 800mm/min and 200 ~ 300mm/min; Back engagement of the cutting edge is in a first direction respectively 0.8 ~ 1.2mm, 0.2 ~ 0.4mm and 0.08 ~ 0.15mm.

The machining process of this forming process operation that the present invention relates to, in mechanical processing technique, the tool dimension adopted, the speed of mainshaft and the depth of cut are selected directly to affect the otch planarization of target blank, the magnitude of vibrations of target blank and deformation extent, and target machining efficiency.According to the target blank structure before each step planarizing process technique, thus adopt different complete processings, with while the sputter face guaranteeing the target blank processed and back side plane degree, reduce the vibratory magnitude of target, and deformation quantity, thus guarantee the quality after target blank mechanical workout, and working (machining) efficiency.

Embodiment of the present invention does not form the restriction to the application's scope; within every spirit in the present invention's design and principle, any amendment that one of skill in the art can make, equivalent to replace and improvement etc. all should be included within protection scope of the present invention.

Claims (1)

1. the machining process of a forming process operation, it is characterized in that: comprise the plane leveling complete processing to stock sputter face and the back side, and for the side complete processing of each side of stock, thus making the thickness of described stock reach pre-determined thickness, the planar dimension at described stock sputter face and the back side reaches predetermined plane size; Wherein, the planarizing process technique at stock sputter face and the back side is comprised: the secondary flat levelling process that the sputter face of stock and the back side are carried out along first direction and two secondary flat levelling process, and for the precision-machined surface levelling process of sputter face, by along the multistep levelling process of first direction to described sputter face or the back side, alleviate stress that stock inside produces and the vibration that mechanical workout produces for stock;

In a described secondary flat levelling process, two secondary flat levelling process and precision-machined surface levelling process, the cutter of employing is respectively that diameter is 200 ~ 250mm, diameter is 200 ~ 250mm and diameter is the dise knife of 400 ~ 450mm; The rotating speed of main shaft is respectively 600 ~ 800n/s, 800 ~ 1000n/s and 300 ~ 450n/s; The amount of feed of cutter in sputter face or the back side is 800 ~ 1000mm/min, 600 ~ 800mm/min and 200 ~ 300mm/min; Back engagement of the cutting edge is in a first direction respectively 0.8 ~ 1.2mm, 0.2 ~ 0.4mm and 0.08 ~ 0.15mm.