CN115485864A - 微发光元件、微发光二极管及其转印方法 - Google Patents
微发光元件、微发光二极管及其转印方法 Download PDFInfo
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- CN115485864A CN115485864A CN202180001719.5A CN202180001719A CN115485864A CN 115485864 A CN115485864 A CN 115485864A CN 202180001719 A CN202180001719 A CN 202180001719A CN 115485864 A CN115485864 A CN 115485864A
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- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
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Abstract
本发明公开微发光元件，微发光二极管及其转印方法，其中微发光元件包括：若干个微发光二极管，微发光二极管包括：半导体外延叠层，所述半导体外延叠层包含第一类型半导体层、第二类型半导体层和两者之间的有源层；第一台面，由半导体外延叠层凹陷露出的第一类型半导体层构成，第二台面，由第二类型半导体层构成；绝缘介质层，位于所述半导体外延叠层的第一台面和第二台面上；基架，位于所述微发光二极管下方，支撑所述微发光二极管；桥臂，用于连接微发光二极管和基架，所述微发光二极管搭接在两侧桥臂之间；其特征在于：所述桥臂的厚度小于所述第一台面上的绝缘介质层的厚度。本发明通过桥臂厚度和形状的设计，可提升微发光二极管的转移良率。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/083621 WO2022204879A1 (zh) | 2021-03-29 | 2021-03-29 | 微发光元件、微发光二极管及其转印方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115485864A true CN115485864A (zh) | 2022-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180001719.5A Pending CN115485864A (zh) | 2021-03-29 | 2021-03-29 | 微发光元件、微发光二极管及其转印方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20230155071A1 (zh) |
| CN (1) | CN115485864A (zh) |
| WO (1) | WO2022204879A1 (zh) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9761754B2 (en) * | 2014-06-18 | 2017-09-12 | X-Celeprint Limited | Systems and methods for preparing GaN and related materials for micro assembly |
| US9640715B2 (en) * | 2015-05-15 | 2017-05-02 | X-Celeprint Limited | Printable inorganic semiconductor structures |
| TWI618266B (zh) * | 2016-09-07 | 2018-03-11 | 友達光電股份有限公司 | 微型發光二極體單元之中介結構及其製造方法、微型發光二極體單元及其製造方法與微型發光二極體裝置 |
| DE102017106730A1 (de) * | 2017-03-29 | 2018-10-04 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Bauteils und Bauteil für ein elektronisches Bauelement |
| CN107785502B (zh) * | 2017-10-23 | 2019-05-14 | 京东方科技集团股份有限公司 | 一种oled显示面板及其封装方法 |
| CN109103315B (zh) * | 2018-07-28 | 2020-09-11 | 厦门三安光电有限公司 | 发光组件、微发光二极管及其显示装置 |
| CN111933627A (zh) * | 2020-09-14 | 2020-11-13 | 厦门乾照半导体科技有限公司 | 可测试及微转移的微元件及其制作、测试和转移方法、显示装置 |
-
2021
- 2021-03-29 WO PCT/CN2021/083621 patent/WO2022204879A1/zh active Application Filing
- 2021-03-29 CN CN202180001719.5A patent/CN115485864A/zh active Pending
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2023
- 2023-01-19 US US18/156,623 patent/US20230155071A1/en active Pending
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| Publication number | Publication date |
|---|---|
| US20230155071A1 (en) | 2023-05-18 |
| WO2022204879A1 (zh) | 2022-10-06 |
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