CN115485093A

CN115485093A - Machining system

Info

Publication number: CN115485093A
Application number: CN202080100204.6A
Authority: CN
Inventors: 江上茂树
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2022-12-16
Also published as: WO2021220477A1; JPWO2021220477A1; EP4144473A4; US20230166359A1; EP4144473A1

Abstract

The processing system of the present invention comprises: a holding device that rotatably holds an object; a rotating device for rotating the holding device; a beam irradiation device that irradiates an object with an energy beam; an object measuring device that measures an object; and a control device which controls at least one of the beam irradiation device and the rotation device based on information on the object measured by the object measurement device and information on a rotation axis of the rotation device, and processes the object by irradiating the energy beam from the beam irradiation device to the object held by the holding device.

Description

Machining system

Technical Field

The present invention relates to the technical field of a processing system for processing an object with an energy beam.

Background

Patent document 1 describes a processing system for processing an object by irradiating the object with laser light. In such a processing system, it is required to appropriately process an object.

Documents of the prior art

Patent document

Patent document 1: specification of U.S. patent application No. 4,427,872

Disclosure of Invention

According to a first embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; and a control device that controls at least one of the beam irradiation device and the rotation device based on information on the object measured by the object measurement device and information on a rotation axis of the rotation device, and processes the object by irradiating an energy beam from the beam irradiation device to the object held by the holding device.

According to a second embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device for rotating the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; and a control device that controls at least one of the beam irradiation device and the rotation device based on the deviation of the object from the rotation axis of the rotation device measured by the object measurement device, and processes the object by irradiating an energy beam from the beam irradiation device to the object held by the holding device.

According to a third embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; and a control device that controls at least one of the beam irradiation device and the rotation device based on information on the object measured by the object measurement device and information on at least one of a position and a posture of the rotation device, and processes the object by irradiating the object held by the holding device with an energy beam from the beam irradiation device.

According to a fourth embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; a beam measuring device that measures the energy beam from the beam irradiation device; and a control device that controls the beam irradiation device based on information on the energy beam measured by the beam measurement device, and processes the object by irradiating the energy beam from the beam irradiation device to the object held by the holding device.

According to a fifth embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a beam measuring device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measurement device; and a control device that controls at least the moving device, the control device moving at least one of the beam irradiation device and the beam measurement device to be in a position where the beam measurement device can measure the energy beam from the beam irradiation device, and moving at least one of the beam irradiation device and the beam measurement device to be in a position where at least a part of the beam measurement device can be measured by the object measurement device.

According to a sixth embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a beam measuring device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measuring device; an acquisition device that acquires information relating to at least one of a position of the beam irradiation device and a position of the beam measurement device; and a control device that controls at least the moving device, the control device moving at least one of the beam irradiation device and the beam measurement device to an irradiatable position where the beam irradiation device can irradiate at least a part of the beam measurement device with the energy beam, acquiring irradiation position information on at least one of a position of the beam irradiation device and a position of the beam measurement device that have been moved to the irradiatable position using the acquisition device, and controlling at least one of the position of the beam irradiation device and the position of the beam measurement device based on the irradiation position information.

According to a seventh embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a beam measuring device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measurement device; an acquisition device that acquires information relating to at least one of a position of the beam irradiation device and a position of the beam measurement device; and a control device that controls at least the moving device, moves at least one of the beam irradiation device and the beam measurement device to a measurable position where the object measurement device can measure at least a part of the beam measurement device, acquires measurement position information relating to at least one of the position of the beam irradiation device and the position of the beam measurement device that have moved to the measurable position using the acquisition device, and controls at least one of the position of the beam irradiation device and the position of the beam measurement device based on the measurement position information.

According to an eighth embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures a three-dimensional shape of a surface of the object; and a control device that controls at least one of the beam irradiation device and the rotating device based on a measurement result of the object measurement device, and processes the object by irradiating an energy beam from the beam irradiation device to the object held by the holding device.

According to a ninth embodiment, there is provided a processing system comprising: a holding device that holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; and a control device that controls the beam irradiation device based on a measurement result of the object measurement device on the object, wherein the beam irradiation device changes an irradiation position of the energy beam on the surface of the object along the surface of the object while the beam irradiation device irradiates the energy beam on the object, and the control device controls the beam irradiation device based on a measurement result of the object including a machining trace by the energy beam.

According to a tenth embodiment, there is provided a processing system comprising: a holding device that holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object by the object measurement device; and a moving device that moves the rotating device, the object measuring device measuring the object each time the moving device moves the rotating device in one direction, the control device controlling at least one of the beam irradiation device and the moving device based on a measurement result of the object by the object measuring device during an irradiation period in which the beam irradiation device irradiates the object with the energy beam.

According to an eleventh embodiment, there is provided a processing system comprising: a holding device that holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; and a control device that controls at least one of the beam irradiation device and the rotating device based on a measurement result of the object by the object measurement device, the object measurement device measuring the object each time the rotating device rotates the object by a predetermined rotation angle, the control device controlling the beam irradiation device based on the measurement result of the object by the object measurement device.

According to a twelfth embodiment, there is provided a processing system comprising: a holding device that holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object by the object measurement device on the object; and a beam measuring device provided in the rotating device and measuring the energy beam from the beam irradiating device.

According to a thirteenth embodiment, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotating device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a changing device that changes an irradiation position of the energy beam irradiated onto the object; and a control device that controls at least one of the rotating device and the changing device, wherein the control device controls the rotating device and the changing device based on information on the object measured by the object measuring device to rotate the holding device and change the irradiation position, and the object is processed by irradiating the object held by the holding device with an energy beam from the beam irradiation device.

Drawings

Fig. 1 is a perspective view schematically showing the appearance of a processing system according to the present embodiment.

Fig. 2 is a system configuration diagram showing a system configuration of the machining system according to the present embodiment.

Fig. 3 (a) to 3 (c) are cross-sectional views each showing a case where a workpiece is subjected to removal processing.

Fig. 4 is a sectional view showing the structure of the irradiation optical system.

Fig. 5 is a sectional view showing the structure of the rotating device.

Fig. 6 is a plan view showing the structure of the measuring apparatus.

Fig. 7 is a sectional view showing the structure of the measuring apparatus.

Fig. 8 is a flowchart showing a flow of the machining operation.

Fig. 9 is a perspective view showing a workpiece during machining.

Fig. 10 is a cross-sectional view showing the processing light irradiated to the workpiece.

Fig. 11 is a cross-sectional view showing another example of the processing light irradiated to the workpiece.

Fig. 12 is a perspective view showing another example of the processing light applied to the workpiece.

Fig. 13 is a cross-sectional view showing an example of a beam dump.

Fig. 14 is a flowchart showing the flow of the first axis information generating operation.

Fig. 15 is a plan view showing a height image of a test workpiece as an example of a measurement result of the test workpiece.

Fig. 16 is a plan view showing a test workpiece.

Fig. 17 (a) is a plan view showing an ideal test workpiece in which the direction in which the rotation axis extends is parallel to (or coincides with) the movement direction of the stage, fig. 17 (b) is a plan view showing a height image corresponding to the measurement result of the test workpiece shown in fig. 17 (a), fig. 17 (c) is a plan view showing a test workpiece in which the direction in which the rotation axis extends is not parallel to (or does not coincide with) the movement direction of the stage, and fig. 17 (d) is a plan view showing a height image corresponding to the measurement result of the test workpiece shown in fig. 17 (c).

Fig. 18 is a flowchart showing another example of the first axis information generating operation.

Fig. 19 (a) is a plan view showing a height image corresponding to a measurement result of an ideal test workpiece in which the direction in which the rotation axis extends is parallel to (or coincides with) the movement direction of the stage, and fig. 19 (b) is a plan view showing a height image corresponding to a measurement result of a test workpiece in which the direction in which the rotation axis extends is not parallel to (or does not coincide with) the movement direction of the stage.

Fig. 20 is a flowchart showing the flow of the second axis information generating operation.

Fig. 21 (a) is a plan view showing an ideal test workpiece in which the direction in which the rotation axis extends and the scanning direction of the machining light are parallel to (or coincide with) each other, fig. 21 (b) is a plan view showing a height image corresponding to the measurement result of the test workpiece shown in fig. 21 (a), fig. 21 (c) is a plan view showing a test workpiece in which the direction in which the rotation axis extends and the scanning direction of the machining light are not parallel to (or do not coincide with) each other, and fig. 21 (d) is a plan view showing a height image corresponding to the measurement result of the test workpiece shown in fig. 21 (c).

Fig. 22 (a) and 22 (b) are plan views each showing a workpiece in which a chucking error has occurred.

Fig. 23 is a flowchart showing the flow of the third axis information generating operation (particularly, the operation of generating the eccentricity error information).

Fig. 24 is a cross-sectional view showing an ideal rotation of the workpiece with the center axis aligned with the rotation axis.

Fig. 25 is a graph showing the relationship between the position of the end point of the workpiece shown in fig. 24 in the Z-axis direction and the rotation angle of the workpiece.

Fig. 26 is a cross-sectional view showing a case where the workpiece rotates with the center axis parallel to the rotation axis but not coincident with the rotation axis.

Fig. 27 is a graph showing the relationship between the position of the end point of the workpiece shown in fig. 26 in the Z-axis direction and the rotation angle of the workpiece.

Fig. 28 is a cross-sectional view showing a case where the workpiece whose center axis is parallel to but does not coincide with the rotation axis rotates.

Fig. 29 is a graph showing the relationship between the position of the end point of the workpiece shown in fig. 28 in the Z-axis direction and the rotation angle of the workpiece.

Fig. 30 is a cross-sectional view showing an example of the irradiation position of the processing light EL controlled based on the eccentricity error information.

Fig. 31 is a flowchart showing the flow of the third axis information generating operation (especially, the operation of generating the yaw angle error information).

Fig. 32 is a plan view showing a workpiece in which an off-angle error has occurred.

Fig. 33 (a) is a sectional view showing a case where the machining head irradiates the machining light to the measuring device, fig. 33 (b) is a plan view showing a case where the machining head irradiates the machining light to the measuring device, and fig. 33 (c) is a graph showing a result of receiving the machining light by the light receiving element included in the measuring device.

FIG. 34 is a sectional view showing a processing light.

Fig. 35 (a) is a cross-sectional view showing the machining light applied to the workpiece from a direction twisted with respect to the rotation axis, and fig. 35 (b) is a cross-sectional view showing the machining light whose aperture angle is controlled.

Fig. 36 is a sectional view showing a measuring apparatus for measuring the processing light.

Fig. 37 is a sectional view showing a measuring apparatus for measuring the processing light.

Fig. 38 is a sectional view showing a measuring apparatus for measuring the processing light.

Fig. 39 is a sectional view showing a measuring apparatus for measuring the processing light.

Fig. 40 (a) is a cross-sectional view showing an example of a relative baseline, a processing baseline, and a measurement baseline, and fig. 40 (b) is a plan view showing an example of a relative baseline, a processing baseline, and a measurement baseline.

Fig. 41 is a perspective view schematically showing the appearance of the machining system according to the first modification.

Fig. 42 is a perspective view schematically showing the appearance of a machining system according to a second modification.

Fig. 43 is a system configuration diagram showing a system configuration of a machining system according to a second modification.

Fig. 44 is a sectional view showing a configuration of an irradiation optical system according to a second modification.

Fig. 45 is a perspective view schematically showing an external appearance of a machining system according to a third modification.

Detailed Description

Hereinafter, embodiments of the machining system will be described with reference to the drawings. Hereinafter, embodiments of the machining system and the measuring means will be described using a machining system SYS that machines a workpiece W with machining light EL as a specific example of an energy beam. However, the present invention is not limited to the embodiments described below.

In the following description, positional relationships of various components constituting the machining system SYS are described using an XYZ orthogonal coordinate system defined by X, Y, and Z axes orthogonal to each other. In the following description, for convenience of explanation, the X-axis direction and the Y-axis direction are respectively assumed to be a horizontal direction (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is assumed to be a vertical direction (i.e., a direction orthogonal to the horizontal plane, and substantially an up-down direction). The rotational directions (in other words, the tilt directions) around the X axis, the Y axis, and the Z axis are referred to as the θ X direction, the θ Y direction, and the θ Z direction, respectively. Here, the Z-axis direction may be a gravitational direction. Further, the XY plane may be set to the horizontal direction.

(1) Structure of machining system SYS

First, the configuration of the machining system SYS according to the present embodiment will be described with reference to fig. 1 and 2. Fig. 1 is a perspective view schematically showing an external appearance of a machining system SYS according to the present embodiment. Fig. 2 is a system configuration diagram showing a system configuration of a machining system SYS according to the present embodiment.

As shown in fig. 1 and 2, machining system SYS includes machining device 1, measurement device 2, stage device 3, and control device 4. Machining device 1, measurement device 2, and stage device 3 are housed in a housing 5. However, machining device 1, measuring device 2, and stage device 3 may not be housed in housing 5. That is, machining system SYS may not include housing 5 that houses machining device 1, measuring device 2, and stage device 3. In fig. 1, the measuring device 2 is provided closer to the rotating device 35 than the machining device 1 in the X-axis direction, but may be disposed in the opposite manner.

The machining apparatus 1 can machine the workpiece W under the control of the control apparatus 4. The workpiece W is an object to be machined by the machining apparatus 1. The workpiece W may be, for example, a metal, an alloy (e.g., duralumin), a semiconductor (e.g., silicon), a resin, a composite material such as Carbon Fiber Reinforced Plastic (CFRP), a glass, a ceramic, or an object including any other material.

The machining device 1 may perform a removal process of removing a part of the workpiece W by irradiating the workpiece W with the machining light EL. The removing process may also include at least one of a surface process, a cylinder process, a hole forming process, a smoothing process, a cutting process, and an engraving process (in other words, an imprint process) for forming an arbitrary character or an arbitrary pattern (in other words, engraving).

Here, an example of the removal process using the processing light EL will be described with reference to each of fig. 3 (a) to 3 (c). Fig. 3 (a) to 3 (c) are cross-sectional views each showing a case where the workpiece W is subjected to the removal processing. As shown in fig. 3 (a), the machining device 1 irradiates the machining light EL to a target irradiation area EA set (in other words, formed) on the surface of the workpiece W. When the processing light EL is irradiated to the target irradiation area EA, the energy of the processing light EL is transmitted to the target irradiation area EA and a portion close to the target irradiation area EA in the workpiece W. When heat is transferred by the energy of the processing light EL, the material constituting the target irradiation area EA and a portion close to the target irradiation area EA in the workpiece W is melted by the heat by the energy of the processing light EL. The molten material is scattered as droplets. Alternatively, the melted material is evaporated by heat due to the energy of the processing light EL. As a result, the target irradiation area EA and a portion close to the target irradiation area EA in the workpiece W are removed. That is, as shown in fig. 3 (b), a concave portion (in other words, a groove portion) is formed on the surface of the workpiece W. In this case, the machining device 1 machines the workpiece W by the principle of so-called hot working. Further, the machining apparatus 1 moves the target irradiation area EA on the surface of the workpiece W using a galvanometer mirror 1214 to be described later. That is, the machining device 1 scans the surface of the workpiece W with the machining light EL. As a result, as shown in fig. 3 c, the surface of the workpiece W is at least partially removed along the scanning locus of the processing light EL (i.e., the movement locus of the target irradiation area EA). Therefore, the machining device 1 can appropriately remove a portion of the workpiece W to be subjected to the removal machining by scanning the machining light EL on the surface of the workpiece W along a desired scanning trajectory corresponding to the region to be subjected to the removal machining.

On the other hand, the machining device 1 can machine the workpiece W by the principle of non-thermal machining (for example, ablation machining) according to the characteristics of the machining light EL. That is, the machining device 1 may perform non-thermal machining (e.g., ablation machining) on the workpiece W. For example, when pulsed light having an emission time of picosecond or less (or nanosecond or femtosecond or less in some cases) is used as the processing light EL, materials constituting the target irradiation area EA and a portion close to the target irradiation area EA in the workpiece W are instantaneously evaporated and scattered. In addition, when pulsed light having an emission time of picoseconds or less (or nanoseconds or femtoseconds or less in some cases) is used as the processing light EL, the material constituting the target irradiation region EA and the portion close to the target irradiation region EA in the workpiece W may sublimate without passing through a molten state. Therefore, the concave portion (in other words, the groove portion) can be formed on the surface of the workpiece W while suppressing the influence of heat due to the energy of the processing light EL on the workpiece W as much as possible.

In the case of performing the removal processing, the processing apparatus 1 may form a rib (riblet) structure on the workpiece W. The rib structure may also be a structure capable of reducing the resistance of the surface of the workpiece W to fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). The rib structure may also include a structure capable of reducing noise generated when the fluid moves relative to the surface of the workpiece W. The rib structure may also include, for example, a structure in which a plurality of grooves extending along a first direction (e.g., Y-axis direction) along the surface of the workpiece W are arranged along a second direction (e.g., X-axis direction) along the surface of the workpiece W and intersecting the first direction.

In the case of performing the removal processing, the processing apparatus 1 may form an arbitrary structure having an arbitrary shape on the surface of the workpiece W. As an example of the arbitrary structure, a structure in which a vortex is generated in the flow of the fluid on the surface of the workpiece W can be cited. As another example of the arbitrary structure, a structure for imparting hydrophobicity to the surface of the workpiece W may be cited. As another example of the arbitrary structure, a micro-nano-scale fine textured structure (typically, a textured structure) formed regularly or irregularly is exemplified. Such micro-texture structure may also include at least one of a shark skin structure and a dimple (dimple) structure having a function of reducing resistance caused by fluid (gas and/or liquid). The fine texture structure may also include a lotus leaf surface structure having at least one of a lyophobic function and a self-cleaning function, for example, having a lotus leaf effect. The fine texture structure may include at least one of a fine projection structure having a liquid transport function (see U.S. patent publication No. 2017/0044002), an uneven structure having a lyophilic function, an uneven structure having an antifouling function, a moth-eye (moth-eye) structure having at least one of a reflectance reduction function and a lyophobic function, an uneven structure in which only light of a specific wavelength is strengthened by interference to form a structural color, a pillar array (pilar array) structure having an adhesive function by van der Waals' force, an uneven structure having an aerodynamic noise reduction function, a honeycomb structure having a droplet trapping function, an uneven structure having improved adhesiveness to a layer formed on a surface, and the like.

In fig. 1 and 2 again, the machining apparatus 1 includes a machining light source 11, a machining head 12, a head drive system 13, and a position measuring device 14 in order to machine the workpiece W.

The processing light source 11 emits at least one of infrared light, visible light, ultraviolet light, and extreme ultraviolet light as the processing light EL, for example. However, other types of light may be used as the processing light EL. The processing light EL may also contain pulsed light (i.e., a plurality of pulsed beams). The processing light EL may be a laser. In this case, the processing light source 11 may include a Laser light source (e.g., a semiconductor Laser such as a Laser Diode (LD)). The laser light source may also comprise a fiber laser, CO ₂ At least one of a laser, a Yttrium Aluminum Garnet (YAG) laser, and an excimer laser. However, the processing light EL may not be a laser. The machining Light source 11 may include any Light source (for example, at least one of a Light Emitting Diode (LED) and a discharge lamp).

The machining head 12 irradiates the machining light EL from the machining light source 11 to the workpiece W. The machining head 12 may therefore also be referred to as a beam irradiation device. In the example shown in fig. 1, a stage 32 on which a workpiece W can be placed is disposed below the processing head 12. Therefore, the machining head 12 emits the machining light EL downward from the machining head 12, and the machining light EL is irradiated to the workpiece W. In order to irradiate the processing light EL to the workpiece W, the processing head 12 includes an irradiation optical system 121. The irradiation optical system 121 will be described below with reference to fig. 4. Fig. 4 is a cross-sectional view schematically showing the structure of the irradiation optical system 121.

As shown in fig. 4, the irradiation optical system 121 includes, for example, a condensing position changing optical system 1210, an aperture angle changing optical system 1211, an ellipticity changing optical system 1212, a light rotating optical system 1213, a galvanometer mirror 1214, and an f θ lens 1215. However, the irradiation optical system 121 may not include at least one of the light collection position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the light rotating optical system 1213.

The condensed position changing optical system 1210 is an optical member that can change the condensed position of the processing light EL (i.e., the condensed position of the processing light EL) along the traveling direction of the processing light EL. The light-collecting position changing optical system 1210 may include a plurality of lenses arranged along the traveling direction of the processing light EL, for example. In this case, the condensing position of the processing light EL may be changed by moving at least one of the lenses in the optical axis direction.

The aperture angle changing optical system 1211 is an optical member that can change the aperture angle of the processing light EL emitted from the processing head 12. The "aperture angle of the processing light EL" in this embodiment may also refer to an angle formed by the outermost light ray of the processing light EL. Alternatively, the "aperture angle of the processing light EL" in the present embodiment may also refer to an angle formed by the outermost light ray of the processing light EL and the principal light ray of the processing light EL. In this case, the aperture angle changing optical system 1211 can be substantially regarded as changing the numerical aperture of the irradiation optical system 121. In addition, the aperture angle changing optical system 1211 can also be referred to as an aperture angle changing device.

The ellipticity changing optical system 1212 is an optical member that can change the ellipticity of the processing light EL emitted from the processing head 12. Specifically, the ellipticity changing optical system 1212 changes the ellipticity of the point of the processing light EL in the plane intersecting the irradiation axis EX along the traveling direction of the processing light EL. For example, the ellipticity changing optical system 1212 may include an optical member (for example, at least one of a toric lens (toric lens) and a cylindrical lens (cylindronic lens)) having different refractive powers in two orthogonal directions, and the ellipticity is changed by rotating the optical member around the optical axis or around an axis parallel to the optical axis. For example, the ellipticity ratio changing optical system 1212 may include a plurality of optical members, and the ellipticity ratio may be changed by changing the intervals between the plurality of optical members in the optical axis direction. Here, at least one of the plurality of optical members may also be an optical member having an asymmetric optical power with respect to the optical axis. The irradiation axis EX is typically an axis extending along the principal ray of the processing light EL. The principal ray of the processing light EL may be a line connecting the light quantity centroid on a first cross section intersecting the traveling direction of the processing light EL and the light quantity centroid on a second cross section different from the first cross section on a plane intersecting the traveling direction. In the example shown in fig. 4, the irradiation axis EX is parallel to the optical axis AX of the f θ lens 1215, but the irradiation axis EX may be inclined with respect to the optical axis AX of the f θ lens 1215. In the example shown in fig. 4, the irradiation axis EX is parallel to the Z axis, but the irradiation axis EX may be inclined with respect to the Z axis.

The change of the ellipticity may be regarded as substantially equivalent to a change of at least one of the aperture angle of the processing light EL in the first plane including the irradiation axis EX and the aperture angle of the processing light EL in the second plane including the irradiation axis EX and intersecting the first plane. Accordingly, the ellipticity-changing optical system 1212 may also be referred to as an aperture angle-changing optical system or aperture angle-changing device. In this case, the aperture angle changing optical system 1211 may function as at least a part of the ellipticity changing optical system 1212.

The optical rotation system 1213 is an optical member that can rotate the point of the processing light EL about the optical axis AX (particularly about the irradiation axis EX) in a plane intersecting the irradiation axis EX. In the present embodiment, the light rotation optical system 1213 rotates the direction of the maximum value among the diameters of the points of the processing light EL (i.e., the cross section of the processing light EL) on the entrance pupil plane of the f θ lens 1215 about the optical axis AX (particularly about the irradiation axis EX). That is, the light rotation optical system 1213 rotates the point of the processing light EL on the entrance pupil plane of the f θ lens 1215 (i.e., the cross section of the processing light EL) in the direction in which the diameter is maximized around the optical axis AX (particularly around the irradiation axis EX). At this time, the light rotation optical system 1213 may be considered to rotate the direction of the major axis or the direction of the minor axis of the point of the processing light EL on the entrance pupil plane of the f θ lens 1215 about the optical axis AX (particularly about the irradiation axis EX). For example, the light rotating optical system 1213 may also include an optical member that can rotate around the optical axis, and the point of the processing light EL is rotated by rotating the optical member around the optical axis. Such an optical component may also be referred to as a beam rotator. Accordingly, the optical rotation optical system 1213 may also be referred to as a beam rotation member. The ellipticity changing optical system 1212 and the optical rotating optical system 1213 may also be used in combination.

The processing light EL having passed through the light-collecting position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the light rotating optical system 1213 is incident on the galvanometer mirror 1214. The galvanometer mirror 1214 changes the emission direction of the processing light EL from the galvanometer mirror 1214 by deflecting the processing light EL (that is, changing the emission angle of the processing light EL). Accordingly, the galvanometer mirror 1214 may also be referred to as a beam deflecting device. Fig. 4 shows an example in which the emission direction of the processing light EL from the galvanometer mirror 1214 is changed in the YZ plane. The galvanometer mirror 1214 may change the irradiation position of the processing light EL with respect to the processing head 12 (for example, the irradiation position of the processing light EL on the surface of the workpiece W) by changing the emission direction of the processing light EL from the galvanometer mirror 1214. That is, the galvanometer mirror 1214 may change (that is, move) the irradiation position of the processing light EL by deflecting the processing light EL. Therefore, the galvanometer mirror 1214 may be referred to as a beam irradiation position changing device. Fig. 4 shows an example in which the irradiation position of the processing light EL is changed in the Y-axis direction. The galvanometer mirror 1214 may change the traveling direction of the processing light EL from the processing head 12 (i.e., the direction in which the irradiation axis EX extends) by changing the emission direction of the processing light EL from the galvanometer mirror 1214. That is, the galvanometer mirror 1214 may change at least one of the irradiation position and the traveling direction of the processing light EL. Therefore, the galvanometer mirror 1214 may be referred to as a beam irradiation state changing device capable of changing an irradiation state of the processing light EL including at least one of an irradiation position and a traveling direction.

The galvanometer mirror 1214 includes, for example, an X scanning mirror 1214X and a Y scanning mirror 1214Y. The X scanning mirror 1214X and the Y scanning mirror 1214Y are each an inclination angle variable mirror whose angle with respect to the optical path of the processing light EL incident on each mirror is variable. The X scanning mirror 1214X reflects the processing light EL toward the Y scanning mirror 1214Y. The X-scan mirror 1214X can oscillate or rotate about a rotational axis along the Y-axis. The machining light EL scans the surface of the workpiece W in the X-axis direction by the oscillation or rotation of the X-scanning mirror 1214X. By the oscillation or rotation of the X-scanning mirror 1214X, the target irradiation area EA is moved in the X-axis direction on the surface of the workpiece W. The Y scan mirror 1214Y reflects the processing light EL toward the f θ lens 1215. The Y scan mirror 1214Y can oscillate or rotate about a rotation axis along the X axis. The machining light EL scans the surface of the workpiece W in the Y-axis direction by the oscillation or rotation of the Y scanning mirror 1214Y. By the oscillation or rotation of the Y scan mirror 1214Y, the target irradiation area EA is moved in the Y axis direction on the surface of the workpiece W.

The machining light EL can scan the machining emission area PSA with respect to the machining head 12 by the galvanometer mirror 1214. That is, the target irradiation area EA can be moved within the processing emission area PSA with respect to the processing head 12 by the galvanometer mirror 1214. The machining shot region PSA indicates a region (in other words, a range) in which machining is performed by the machining device 1 with the positional relationship between the machining head 12 and the workpiece W fixed (i.e., without change). Typically, the machining emission region PSA is set to coincide with a maximum range that can be scanned by the machining light EL deflected by the galvanometer mirror 1214 in a state in which the positional relationship between the machining head 12 and the workpiece W is fixed, or to be a region narrower than the range. When the machining emission region PSA is smaller than a portion of the workpiece W to be machined, the following steps are repeated: an operation of scanning a machining emission region PSA set in a certain portion of the workpiece W with the machining light EL to machine the certain portion of the workpiece W, and an operation of changing the relative positional relationship between the machining head 12 and the workpiece W to change the position of the machining emission region PSA on the workpiece W.

The irradiation optical system 121 may include any optical member that can deflect the processing light EL (that is, can change at least one of the emission direction and the irradiation position of the processing light EL) in addition to the galvanometer mirror 1214 or instead of the galvanometer mirror 1214. As an example of such an optical member, a polygon mirror having a plurality of reflection surfaces with different angles is cited. The polygon mirror is rotatable while the processing light EL is irradiated onto a reflection surface to change an incident angle of the processing light EL with respect to the reflection surface and switch the reflection surface onto which the processing light EL is irradiated among the plurality of reflection surfaces. Further, the irradiation optical system 121 may also include a return light reduction optical system having a polarizing optical member.

The f θ lens 1215 is an optical system for emitting the processing light EL from the galvanometer mirror 1214 toward the workpiece W. In particular, the f θ lens 1215 is an optical element that can condense the processing light EL from the galvanometer mirror 1214 to a condensing surface intersecting the optical axis AX of the f θ lens 1215. Therefore, the f θ lens 1215 may also be referred to as a condensing optical system. The light-converging surface of the f θ lens 1215 may be set on the light-emitting side of the f θ lens 1215, for example. The condensing surface of the f θ lens 1215 may be set to the surface of the workpiece W, for example. At this time, the f θ lens 1215 may condense the processing light EL from the galvanometer mirror 1214 to the surface of the workpiece W.

In fig. 1 and 2 again, the head driving system 13 moves the processing head 12, and even the irradiation optical system 121, in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θ X direction, the θ Y direction, and the θ Z direction under the control of the control device 4. Therefore, the head driving system 13 may also be referred to as a moving device. Fig. 1 shows an example in which the head drive system 13 moves the processing head 12 in the Z-axis direction. At this time, the head driving system 13 may also include a Z slider member 131 extending in the Z axis direction, for example. The Z slider member 131 is disposed on a support frame 6, and the support frame 6 is disposed on a platen 31 described later via an anti-vibration device. The support frame 6 may also comprise, for example: a pair of leg members 61 arranged on the platen 31 via an anti-vibration device and extending in the Z-axis direction; and a beam member 62 that is disposed on the pair of leg members 61 so as to connect the upper end portions of the pair of leg members 61 and extends in the X-axis direction. The Z slider member 131 is disposed on the beam member 62 via a support member 63 extending in the Z-axis direction, for example. The processing head 12 is connected to the Z slider member 131 movably along the Z slider member 131.

When the machining head 12 moves, the positional relationship between the machining head 12 and a stage 32 described later changes. Further, when the machining head 12 moves, the positional relationship between the machining head 12 and a rotation device 35, which will be described later, disposed on the stage 32 changes. Further, when the machining head 12 moves, the positional relationship between the machining head 12 and the workpiece W held by the rotation device 35 changes. Therefore, moving the machining head 12 may be considered equivalent to changing the positional relationship between the machining head 12 and each of the stage 32, the rotating device 35, and the workpiece W. Further, when the processing head 12 moves, the irradiation position of the processing light EL on the surface of the workpiece W moves relative to the surface of the workpiece W. That is, the irradiation position of the processing light EL on the surface of the workpiece W varies on the surface of the workpiece W. Therefore, moving the machining head 12 can be considered equivalent to changing the irradiation position of the machining light EL on the surface of the workpiece W.

The position measuring device 14 may measure (in other words, may detect) the position of the processing head 12. That is, the position measuring device 14 is a device that can acquire information relating to the position of the processing head 12. The position measuring device 14 may include at least one of an encoder and a laser interferometer, for example.

The measuring device 2 can measure the workpiece W under the control of the control device 4. The measuring device 2 may be referred to as an object measuring device or a workpiece measuring device because it measures an object, i.e., the workpiece W. For measuring the workpiece W, the measuring device 2 comprises a measuring head 21, a head drive system 22 and a position measuring device 23.

The measuring head 21 can measure the workpiece W under the control of the control device 4. In the present embodiment, the measuring head 21 three-dimensionally measures the surface of the workpiece W. That is, the measuring head 21 measures the three-dimensional shape of the surface of the workpiece W. Therefore, the measuring head 21 may also include a three-dimensional measuring device 211 that can measure the three-dimensional shape of the surface of the workpiece W. The workpiece measurement information related to the measurement result of the measurement head 21 on the workpiece W (i.e., the measurement result of the workpiece W by the three-dimensional measurement device 211) is output from the measurement head 21 to the control device 4. The control device 4 controls the operation of the machining system SYS based on the workpiece measurement information. Specifically, control device 4 controls machining system SYS (e.g., at least one of machining device 1, measuring device 2, and stage device 3) based on the workpiece measurement information so that machining system SYS can appropriately machine workpiece W. In addition, the measuring apparatus 2, the measuring head 21, or the three-dimensional shape measuring apparatus 211 may also be referred to as an object information acquiring apparatus or a workpiece information acquiring apparatus because it acquires workpiece measurement information relating to the three-dimensional shape of the surface of the workpiece W.

The three-dimensional measuring device 211 can also measure the workpiece W without contact. For example, the three-dimensional measuring device 211 may also optically measure the workpiece W. That is, the three-dimensional measuring device 211 may measure the workpiece W using an arbitrary measuring beam such as a measuring beam. For example, the three-dimensional measurement device 211 may also measure the workpiece W using a light sectioning method, which is a method of projecting slit light onto the surface of the workpiece W and measuring the shape of the projected slit light. For example, the three-dimensional measurement device 211 may measure the workpiece W by a white interference method that measures an interference pattern of white light that has passed through the workpiece W and white light that has not passed through the workpiece W. For example, the three-dimensional measurement device 211 may measure the workpiece W using at least one of a pattern projection method of projecting a light pattern onto the surface of the workpiece W and measuring the shape of the projected pattern, a time of flight (time of flight) method of projecting light onto the surface of the workpiece W at a plurality of positions on the workpiece W and measuring the distance to the workpiece W from the time until the projected light returns, a moire (moire) method, an auto-collimation (auto-collimation) method, a stereo method, an astigmatism method, a critical angle method, a knife edge (knife-edge) method, an interferometry method, and a confocal method. For example, the three-dimensional measurement device 211 may also measure the workpiece W by photographing the workpiece W illuminated by the illumination light. In either case, the three-dimensional measurement device 211 may include: a light source that emits measurement light ML (for example, slit light, white light, or illumination light); and a light receiver that receives light from the workpiece W to which the measurement light ML is irradiated (for example, reflected light of the measurement light). In addition, the three-dimensional measuring instrument 211 may contact the measurement workpiece W.

The measuring head 21 measures the workpiece W in units of the measuring emission area MSA. The measurement emission area MSA indicates an area (in other words, a range) where measurement by the measurement head 21 is performed in a state where the positional relationship between the measurement head 21 and the workpiece W is fixed (i.e., not changed). Typically, the measurement emission area MSA is set to an area that coincides with or is narrower than the maximum range over which the measurement head 21 can irradiate the measurement light ML in a state where the positional relationship between the measurement head 21 and the workpiece W is fixed (i.e., without modification). In addition, the measurement emission area MSA may also be referred to as a measurable range, measurable area of the measuring head 21.

In the example shown in fig. 1, the measuring head 21 is aligned with respect to the machining head 12 so that the measurement axis MX of the measuring head 21 does not coincide with the irradiation axis EX along the traveling direction of the machining light EL. In the example shown in fig. 1, the measurement axis MX is parallel to the irradiation axis EX. The measurement axis MX may be, for example, an axis extending along the optical axis of an optical system included in the measurement head 21. The measuring axis MX may also be, for example, an axis extending along the chief ray of the measuring light ML from the measuring head 21. As described in the first modification described later, the measurement axis MX and the irradiation axis EX may not be parallel to each other.

The head driving system 22 moves the measuring head 21 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ox-direction, the oy-direction, and the oz-direction under the control of the control device 4. Accordingly, the head drive system 22 may also be referred to as a translation device. Fig. 1 shows an example in which the head drive system 22 moves the measurement head 21 in the Z-axis direction. At this time, the head drive system 22 may also include a Z slider member 221 extending in the Z axis direction, for example. The Z slider member 221 may be disposed on the beam member 62 via a support member 64 extending in the Z-axis direction. The measuring head 21 is connected to the Z slider member 221 in a manner movable along the Z slider member 221.

When the measurement head 21 moves, the positional relationship between the measurement head 21 and each of the stage 32, the rotating device 35, and the workpiece W changes. Therefore, moving the measurement head 21 may be considered equivalent to changing the positional relationship between the measurement head 21 and each of the stage 32, the rotating device 35, and the workpiece W.

The position measuring device 23 may measure (in other words, may detect) the position of the measuring head 21. That is, the position measuring device 23 is a device that can acquire information relating to the position of the measuring head 21. The position measuring device 23 may include at least one of an encoder and a laser interferometer, for example.

Stage device 3 includes a platen 31, a stage 32, a stage drive system 33, a position measurement device 34, a rotation device 35, and a measurement device 36.

The platen 31 is disposed on a bottom surface of the housing 5 (or on a support surface such as a floor surface on which the housing 5 is placed). A stage 32 is disposed on the platen 31. An anti-vibration device, not shown, for reducing transmission of vibration of the platen 31 to the stage 32 may be provided between the platen 31 and a support surface such as a bottom surface of the frame 5 or a floor surface on which the frame 5 is placed. Further, the above-described support frame 6 may be disposed on the platen 31.

The stage 32 is a mounting device on which the workpiece W can be mounted. The stage 32 may be capable of holding the workpiece W mounted on the stage 32. Alternatively, the stage 32 may not be able to hold the workpiece W mounted on the stage 32. At this time, the workpiece W may be placed on the stage 32 without a clamp (clamp-less).

In the present embodiment, the rotating device 35 is disposed on the stage 32. As described in detail later, the rotating device 35 is a device that rotates the chuck 353, and the chuck 353 is a holding device that rotatably holds the workpiece W. Therefore, in the present embodiment, the workpiece W may be mounted on the stage 32 or may be held by the rotating device 35 via the chuck 353. The machining head 12 may irradiate the machining light EL to the workpiece W mounted on the stage 32, or may irradiate the machining light EL to the workpiece W held by the rotation device 35. The measuring head 21 may measure the workpiece W mounted on the stage 32 or may measure the workpiece W held by the rotating device 35. Hereinafter, unless otherwise specified, the workpiece W is held by the rotating device 35. Further, since the rotating device 35 rotates the chuck 353 holding the workpiece W, the rotating device 35 can also be regarded as a device rotating the workpiece W.

Stage drive system 33 moves stage 32 under the control of control device 4. Therefore, stage drive system 33 may also be referred to as a mobile device. When the stage 32 moves, the rotation device 35 disposed on the stage 32 also moves together with the stage 32. When the stage 32 moves, the workpiece W placed on the stage 32 or held by the rotating device 35 on the stage 32 also moves together with the stage 32. Stage drive system 33 moves stage 32 along at least one of the X-axis, Y-axis, Z-axis, θ X-direction, θ Y-direction, and θ Z-direction, for example. In the example shown in fig. 1, stage drive system 33 moves stage 32 along each of the X-axis and Y-axis. That is, in the example shown in fig. 1, stage drive system 33 moves stage 32 in a direction along an XY plane that intersects with the respective traveling directions of processing light EL and measurement light ML. In this case, stage drive system 33 may include, for example: an X-slide member 331 (two X-slide members 331 arranged parallel to each other in the example shown in fig. 1) extending in the X-axis direction, and a Y-slide member 332 (one Y-slide member 332 in the example shown in fig. 1) extending in the Y-axis direction. The two X-slide members 331 are arranged on the platen 31 so as to be aligned in the Y-axis direction. The Y-slide member 332 is connected to the two X-slide members 331 so as to be movable along the two X-slide members 331. Stage 32 is connected to Y slide member 332 so as to be movable along Y slide member 332. In the example of fig. 1, a plurality of X slide members 331 are provided, but one X slide member may be provided. Further, the stage 32 may be supported on the platen 31 in a floating manner by an air bearing.

When the stage 32 moves, the positional relationship among the stage 32, the rotating device 35, and the workpiece W, the processing head 12, and the measurement head 21 changes. Therefore, moving the stage 32 may be considered equivalent to changing the positional relationship among the stage 32, the rotating device 35, and the workpiece W, the machining head 12, and the measurement head 21. When stage 32 moves, the irradiation position of processing light EL on the surface of workpiece W moves relative to the surface of workpiece W. That is, the irradiation position of the processing light EL on the surface of the workpiece W varies on the surface of the workpiece W. Therefore, moving the stage 32 can be regarded as equivalent to changing the irradiation position of the processing light EL on the surface of the workpiece W.

Position measurement device 34 may measure (in other words, may detect) the position of stage 32. That is, position measurement device 34 is a device capable of acquiring information relating to the position of stage 32. The position measuring device 34 may include at least one of an encoder and a laser interferometer, for example. Since position measurement device 34 can acquire information relating to the position of stage 32, position measurement device 34 may also be referred to as a stage position information acquisition device.

As described above, the rotating device 35 is a device for rotating the chuck 353, and the chuck 353 is a holding device for rotatably holding the workpiece W. Here, the structure of the rotating device 35 will be described with reference to fig. 5. Fig. 5 is a sectional view showing the structure of the rotating device 35.

As shown in fig. 5, the rotating device 35 includes a support frame 351 and a rotating motor 352. The support frame 351 is disposed on the stage 32. The rotation motor 352 is supported by the support frame 351. The rotation motor 352 operates to rotate the rotation shaft 3521. The rotation shaft 3521 may also be a member extending in a direction intersecting the direction of gravity (in the example shown in fig. 5, the X-axis direction). That is, in the example shown in fig. 5, the rotation motor 352 rotates the rotation shaft 3521 extending in the X-axis direction around the rotation shaft 3522 extending in the X-axis direction. The rotation shaft 3522 is an axis passing through the rotation center of the rotation shaft 3521 and extending along the rotation shaft 3521. However, the rotation shaft 3521 may extend in a direction different from the X-axis direction. The rotary motor 352 may rotate the rotary shaft 3521 extending in a direction different from the X-axis direction around the rotary shaft 3522 extending in a direction different from the X-axis direction. The rotation shaft 3521 may be provided so that an angle of the rotation shaft 3522 with respect to the X axis (for example, an angle in the XZ plane and an angle in the XY plane) can be changed. That is, the rotation shaft 3521 may be movable in at least one of the θ z direction and the θ y direction. Although not shown in fig. 5, the rotation device 35 includes a rotor encoder for detecting the rotation angle of the rotation motor 352 or the rotation angle of the rotation shaft 3521, and outputs the output to the control device 4. The rotor encoder may be referred to as a rotation detection device capable of detecting a rotation angle of a rotation device.

A chuck 353 is coupled to the rotation shaft 3521. The chuck 353 is a holding device that can hold the workpiece W. In the example shown in fig. 5, the chuck 353 sandwiches the workpiece W in contact with the holding surface 3531 of the chuck 353 using a plurality of claws 3532 included in the chuck 353, thereby holding the workpiece W. In particular, in the example shown in fig. 5, the rotary shaft 3521 extends in the X-axis direction, and therefore the chuck 353 sandwiches the workpiece W in contact with the holding surface 3531 along the YZ plane intersecting the X-axis using the plurality of claws 3532 extending in the X-axis direction, thereby holding the workpiece W. However, the method of holding the workpiece W by the chuck 353 is not limited to the method shown in fig. 5.

The rotation motor 352 rotates the rotation shaft 3521, thereby rotating the chuck 353 coupled to the rotation shaft 3521 around the rotation shaft 3522. As a result, the workpiece W held by the chuck 353 also rotates about the rotation shaft 3522. Therefore, it can be said that the rotating device 35 functions as a headstock capable of rotating the workpiece W held by the chuck 353. In the example shown in fig. 5, the rotating device 35 rotates the workpiece W about the X axis.

In fig. 1 and 2 again, the measuring device 36 is a device capable of measuring the processing light EL from the processing head 12. Thus, the measurement device 36 may also be referred to as a beam measurement device. Furthermore, at least a part of the measuring device 36 can be measured by the measuring head 21. At this time, at least a part of the measuring device 36 may be regarded as functioning as a mark (or logo) that can be measured by the measuring head 21. The processed light measurement information on the measurement result of the processing light EL by the measuring device 36 and the marker measurement information on the measurement result of the measuring head 21 by the measuring device 36 are output from the measuring head 21 to the control device 4, respectively. The control device 4 controls the operation of the machining system SYS based on at least one of the machining light measurement information and the marker measurement information. Specifically, control device 4 controls machining system SYS (for example, at least one of machining device 1, measuring device 2, and stage device 3) based on at least one of the machining light measurement information and the marker measurement information so that machining system SYS can appropriately machine workpiece W.

Here, the structure of the measuring device 36 will be described with reference to fig. 6 to 7. Fig. 6 is a plan view showing the structure of the measuring device 36. Fig. 7 is a sectional view showing the structure of the measuring device 36. FIG. 7 is a sectional view taken along line VI-VI' of FIG. 6.

As shown in fig. 6 and 7 (and also in fig. 5), the measuring device 36 is disposed (i.e., provided) on the rotating device 35. In the example shown in fig. 5 to 7, the measuring device 36 is arranged on the support frame 351 of the rotating device 35. The measuring device 36 may be disposed on the upper surface 3511 of the support frame 351 (i.e., the surface facing the machining head 12 and the measuring head 21) so that the measuring device 36 measures the machining light EL and the measuring head 21 measures at least a part of the measuring device 36. However, the measuring device 36 may be disposed on a surface of the support frame 351 different from the upper surface. The measuring device 36 may be disposed on a different member from the support frame 351. For example, measurement device 36 may also be disposed on stage 32. At least a portion of the measuring device 36 may also be removable from the support frame 351. Alternatively, the measuring device 36 may be integrated with the support frame 351. Also, a plurality of measuring devices 36 may be disposed on the support frame 351. In addition, the measuring device 36 may be disposed on the chuck 353. A plurality of measuring devices 36 may be disposed on the chuck 353.

As shown in fig. 6 and 7, the measuring device 36 includes a beam passage member 361 and a light receiving element 362. The beam passage member 361 is a plate-like member along the XY plane. The beam passage member 361 in the XY plane is rectangular in shape, but may be any other arbitrary shape (e.g., circular or elliptical). The beam passage member 361 has a flat plate shape, but may have a curved shape. The dimension of one side of the beam passing member 361 is, for example, several mm to ten-several mm, but may be other dimensions. The light receiving element 362 includes a light receiving surface 3621 extending along the XY plane. The light receiving surface 3621 in the XY plane has a rectangular shape, but may have any other shape (for example, a circular shape or an elliptical shape). The dimension of one side of the light receiving surface 3621 may be the same as the dimension of one side of the beam passage member 361, may be smaller than the dimension of one side of the beam passage member 361, or may be larger than the dimension of one side of the beam passage member 361.

The beam passage member 361 and the light receiving element 362 are disposed inside a recess 3512 (i.e., a concave portion) formed in the support frame 351. That is, the beam passage member 361 and the light receiving element 362 are disposed in a recess 3512 recessed from the upper surface 3511 of the support frame 351 toward the-Z side. However, at least one of the beam passage member 361 and the light receiving element 362 may be disposed at a position different from the recess 3512.

In the recess 3512, the beam passage member 361 is disposed above the light receiving element 362. That is, the beam passage member 361 is disposed at a position closer to the processing head 12 and the measuring head 21 than the light receiving element 362. At this time, as shown in fig. 7, the surface of the beam passage member 361 (specifically, the surface facing the processing head 12 and the measuring head 21, and the surface on the + Z side) may be located below the upper surface 3511. As a result, the measuring device 36 does not protrude from the surface of the support frame 351, and therefore, the workpiece W or the like is less likely to erroneously contact the measuring device 36 (particularly, the beam passage member 361). As a result, the workpiece W or the like comes into contact with the beam passage member 361, and the beam passage member 361 is less likely to be damaged and/or contaminated. However, the surface of the beam passage member 361 may be located at the same height as the upper surface 3511, or may be located above the upper surface 3511.

The beam passage member 361 includes a glass substrate 3611 and an attenuating film 3612, and the attenuating film 3612 is formed on at least a part of a surface of the glass substrate 3611. The attenuation film 3612 is a member that can attenuate the processing light EL incident on the attenuation film 3612. Note that the "attenuation of the processing light EL by the attenuation film 3612" in the present embodiment includes not only a case where the intensity of the processing light EL passing through the attenuation film 3612 is smaller than the intensity of the processing light EL incident on the attenuation film 3612, but also a case where the processing light EL incident on the attenuation film 3612 is shielded (i.e., shielded). Therefore, when the processing light EL enters the attenuation film 3612, the processing light EL attenuated by the attenuation film 3612 enters the light receiving element 362 via the attenuation film 3612, or the processing light EL is blocked by the attenuation film 3612 and thus the processing light EL does not enter the light receiving element 362. The attenuation film 3612 may be formed of a chromium film or a chromium oxide film.

At least one opening 363 is formed in the damping film 3612. In the example shown in fig. 6 to 7, a plurality of openings 363 are formed in the attenuation film 3612. The opening 363 is a through-hole penetrating the attenuation film 3612 in the Z-axis direction. Therefore, when the processing light EL is incident on the opening 363 formed in the attenuation film 3612, the processing light EL passes through the beam passage member 361 via the opening 363. That is, the processing light EL is incident on the light receiving element 362 via the opening 363 without being attenuated or blocked by the attenuation film 3612.

In this way, the portion of the glass substrate 3611 where the attenuation film 3612 is formed (i.e., the portion where the opening 363 is not formed) functions as an attenuation region 364 that attenuates the processing light EL. On the other hand, a portion of the glass substrate 3611 where the attenuation film 3612 is not formed (i.e., a portion where the opening 363 is formed) functions as a passage region 365 through which the processing light EL passes. At this time, the processing light EL passing through the region 365 is not attenuated by the region 365. However, the processing light EL passing through the region 365 may also pass through the region 365. That is, the passing region 365 may not be a region through which all (i.e., 100%) of the processing light EL incident on the passing region 365 passes, but may be a region through which a part of the processing light EL incident on the passing region 365 passes. However, the attenuation ratio of the pass region 365 to the processing light EL is smaller than the attenuation ratio of the attenuation region 364 to the processing light EL. Typically, the attenuation region 364 is disposed adjacent to the pass-through region 365. That is, the pass-through region 365 is disposed in the attenuation region 364.

Since the measuring device 36 is disposed on the support frame 3511 (i.e., on the rotating device 35), the positional relationship of each of the attenuation region 364 and the passing region 365 with respect to the rotating device 35 is fixed. That is, the positional relationship between the attenuation region 364 and the passing region 365 and the rotation device 35 is a predetermined relationship known to the control device 4.

The passing region 365 formed by the opening 363 may also be formed as a mark (i.e., a pattern) 366 having a prescribed shape in a plane (typically, XY plane) along the surface of the attenuation film 3612. The marking 366 can function as a marking that can be measured by the measuring head 21.

For example, as shown in fig. 6, a mark 366 having a slit shape (the mark 366 may be referred to as a slit mark) may be formed on the beam passage member 361. The mark 366 having a slit shape is a mark formed by the passing region 365 having a single linear (e.g., slit-like) shape in a plane along the surface of the attenuation film 3612. In the example shown in fig. 6, the beam passage member 361 is formed with a plurality of marks 366 having different angles with respect to the X axis and the Y axis. However, the beam passage member 361 may be formed with a mark 366 having another shape. For example, the beam passage member 361 is formed with a mark 366 (the mark 366 may be referred to as a fine mark) formed by a plurality of linear passage regions 365 extending in one direction and aligned in another direction intersecting the one direction. For example, the beam passage member 361 is a mark 366 formed by a passage region 365 having a rectangular shape in a plane along the surface of the attenuation film 3612 (the mark 366 may also be referred to as a rectangular mark). For example, a mark 366 (the mark 366 may be referred to as a cross mark) may be formed on the beam passage member 361, and the mark 366 may be formed by a plurality of linear passage regions 365 extending in the first direction and aligned in the second direction intersecting the first direction, and a plurality of linear passage regions 365 extending in the third direction intersecting the first direction and aligned in the fourth direction intersecting the third direction. For example, the beam passage member 361 may be formed with a mark (the mark 366 may be referred to as a search mark) formed by two first linear passage regions 365 and a second linear passage region 365, the two first linear passage regions 365 extending in the fifth direction and spaced apart in the sixth direction orthogonal to the fifth direction, and the second linear passage region 365 extending in the seventh direction inclined with respect to the fifth direction (i.e., obliquely intersecting with the fifth direction).

The light receiving element 362 is a light receiving portion that can receive (e.g., detect) the processing light EL incident on the light receiving element 362 via the pass-through region 365 (i.e., the opening 363) using the light receiving surface 3621. The light receiving element 362 is a light receiving portion that can receive the processing light EL that has passed through the passage region 365 (i.e., the opening 363) by using the light receiving surface 3621. As an example of the light receiving unit, a photoelectric converter that photoelectrically converts the received processing light EL can be given.

When the beam passage member 361 has the plurality of passage regions 365, the light receiving element 362 may receive the processing light EL incident on the light receiving element 362 through each of the plurality of passage regions 365 on the light receiving surface 3621. The light-receiving surface 3621 may be formed by one photoelectric conversion surface of the photoelectric conversion element. For example, the light receiving element 362 may receive the processing light EL incident on the light receiving element 362 via the first passing region 365 by using a first portion of the light receiving surface 3621. For example, the light receiving element 362 may receive the processing light EL incident on the light receiving element 362 via the second passage region 365 by using the second portion of the light receiving surface 3621. As described above, in the present embodiment, the measuring device 36 may not include the plurality of light receiving elements 362 corresponding to the plurality of passing regions 365. The measuring device 36 may include a light receiving element 362 common to the plurality of passing regions 365. However, the measuring device 36 may include a plurality of light receiving elements 362 corresponding to the plurality of passing regions 365.

When the light receiving element 362 receives the processing light EL through the pass region 365, the focus position of the processing light EL may be set at the pass region 365 of the beam passing member 361 or its vicinity. On the other hand, in the case where the workpiece W is machined by the machining light EL, the focal position of the machining light EL may be set on the surface of the workpiece W or in the vicinity thereof. Therefore, the control device 4 may set the focus position of the processing light EL to an appropriate position by controlling the focus changing optical system 1210.

Considering the case where the workpiece W is processed by irradiation of the processing light EL, at least a part of the measuring device 36 may be processed (substantially damaged) by the irradiation of the processing light EL. Therefore, the intensity of the processing light EL (for example, the amount of energy per unit area in a plane intersecting the traveling direction of the processing light EL) may be controlled so that the intensity of the processing light EL (for example, the amount of energy per unit area on the light receiving surface 3621 of the light receiving element 362) irradiated to the measuring device 36 is smaller than the intensity of the processing light EL (for example, the amount of energy per unit area on the surface of the workpiece W) irradiated to the workpiece W for processing the workpiece W. For example, the control device 4 may control the processing light source 11 to reduce the intensity of the processing light EL. For example, the control device 4 may reduce the intensity of the processing light EL by controlling a light extinction member (not shown) disposed on the emission side of the processing light source 11.

The light reception result of the light receiving element 362 includes information on the state of the processing light EL incident on the light receiving element 362. For example, the light reception result of the light receiving element 362 includes information on the intensity of the processing light EL incident on the light receiving element 362 (specifically, the intensity in the plane intersecting the XY plane). More specifically, the light reception result of the light receiving element 362 includes information on the intensity distribution of the processing light EL within the plane along the XY plane. The result of light reception by the light receiving element 362 is output to the control device 4 as the processed light measurement information. In addition, as described above, in the case where the measurement head 21 measures the marker 366, the measurement result of the measurement head 21 on the marker 366 is output to the control device 4 as the marker measurement information.

Again in fig. 1 and 2, the control device 4 controls the operation of the machining system SYS. For example, control device 4 may set the processing conditions for workpiece W and control at least one of processing device 1, measuring device 2, and stage device 3 to process workpiece W in accordance with the set processing conditions.

The control device 4 controls the operation of the machining system SYS. The control device 4 may include, for example, an arithmetic device and a storage device. The computing device may include at least one of a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU), for example. The storage device may also include a memory, for example. The control device 4 functions as a device for controlling the operation of the machining system SYS by executing the computer program by the arithmetic device. The computer program is a computer program for causing the arithmetic device to perform (i.e., execute) an operation to be described later to be performed by the control device 4. That is, the computer program is a computer program for causing the control device 4 to function so as to cause the machining system SYS to perform an operation described later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 4, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) incorporated in the control device 4 or externally provided to the control device 4. Alternatively, the arithmetic device may download a computer program to be executed from a device external to the control device 4 via a network interface.

The control device 4 may not be provided inside the processing system SYS. For example, the control device 4 may be provided as a server or the like outside the machining system SYS. In this case, the control device 4 and the processing system SYS may be connected by a wired and/or wireless network (or a data bus and/or a communication line). For example, a network using a Serial Bus type interface represented by at least one of Institute of Electrical and Electronics Engineers (IEEE) 1394, RS-232x, RS-422, RS-423, RS-485, and Universal Serial Bus (USB) may be used as the wired network. As a wired network, a network using an interface of a parallel bus system may be used. As a wired network, a network using an interface conforming to ethernet (registered trademark) typified by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As a wireless network, a network using radio waves may be used. An example of a Network using radio waves is a Network conforming to ieee802.1x (for example, at least one of a Local Area Network (LAN) and Bluetooth (registered trademark)). As a wireless network, a network using infrared rays may be used. As a wireless network, a network using optical communication may be used. In this case, the control device 4 and the machining system SYS may be configured to be capable of transmitting and receiving various information via a network. The control device 4 may be configured to transmit information such as commands and control parameters to the machining system SYS via a network. The processing system SYS may also include a receiving device that receives information such as commands or control parameters from the control device 4 via the network. The machining system SYS may include a transmission device that transmits information such as a command and a control parameter to the control device 4 via the network (i.e., an output device that outputs information to the control device 4). Alternatively, a first control device that performs a part of the processes performed by the control device 4 may be provided inside the machining system SYS, while a second control device that performs another part of the processes performed by the control device 4 may be provided outside the machining system SYS.

As a recording medium for recording the computer program executed by the control device 4, at least one of a semiconductor Memory such as a Compact Disc Read Only Memory (CD-ROM), a Compact Disc-Recordable (CD-R), a Compact Disc-Rewritable (CD-RW), a floppy disk, a Magneto-Optical disk (MO), a Digital Versatile Disc Read Only Memory (DVD-ROM), a Random Access Digital Versatile Disc (DVD-RAM), a Digital Versatile Disc Recordable (DVD-Recordable), a DVD + R, a Rewritable Digital Versatile Disc (DVD-Recordable), a DVD + R, a semiconductor Memory such as a DVD-Recordable (DVD-Recordable), a Blu-ray Disc (RW), and other Recordable (USB-Recordable) media, and a Blu-ray Disc may be used. The recording medium may include a machine that can record a computer program (for example, a general-purpose machine or a dedicated machine that is installed with a computer program in a state that the computer program can be executed in at least one form of software, firmware, or the like). Further, each process or function included in the computer program may be realized by a logical processing block realized in the control device 4 by the control device 4 (that is, a computer) executing the computer program, may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 4, or may be realized by a form in which the logical processing block and a local hardware module realizing a part of elements of the hardware are mixed.

(2) Operation of the machining System SYS

Next, the operation of the machining system SYS will be described. As described above, the machining system SYS performs the machining operation for machining at least a part of the surface of the workpiece W using the machining light EL. Further, the machining system SYS performs an axis information generating operation for generating rotation axis information on the rotation axis 3522 of the rotating device 35 using the measuring device 2 before the machining operation is performed (or after the machining operation is completed or during the machining operation). Further, the machining system SYS performs a light state information generating operation for generating light state information relating to the state of the machining light EL using the measuring device 36 before the machining operation is performed (or after the machining operation is completed or during the machining operation). Further, the machining system SYS performs an origin information operation for generating origin information on the machining origin PO of the machining apparatus 1 and the measurement origin MO of the measurement apparatus 2 using the measurement apparatus 36 before the machining operation is performed (or after the machining operation is completed or during the machining operation). Therefore, the machining operation, the axis information generating operation, the optical state information generating operation, and the origin information generating operation will be described in order below.

For convenience of explanation, the machining operation, the axis information generating operation, the optical state information generating operation, and the origin information generating operation performed when the workpiece W having a cylindrical shape held by the chuck 353 is machined will be described below. However, the machining operation, the axis information generating operation, the optical state information generating operation, and the origin information generating operation may be performed on a workpiece W having a shape different from the cylindrical shape. The machining operation, the optical state information generating operation, and the origin information generating operation may be performed on the workpiece W that is not held by the chuck 353 (that is, is mounted on the stage 32).

(2-1) working operation

First, a machining operation for machining at least a part of the surface of the workpiece W using the machining light EL will be described with reference to fig. 8. Fig. 8 is a flowchart showing a flow of the machining operation.

As shown in fig. 8, first, the measuring head 21 measures the workpiece W held by the chuck 353 (step S11). At this time, the measuring head 21 can also measure the workpiece W being rotated by the rotating device 35. That is, the measuring head 21 may measure the workpiece W at least partially while the rotating device 35 is rotating the workpiece W. Alternatively, the measuring head 21 can also measure a stationary workpiece W. In the case where the measuring head 21 measures a stationary workpiece W, the rotating device 35 may rotate the workpiece W by a predetermined angle so that a new measurement target portion of the surface of the workpiece W, which has not been measured by the measuring head 21, is included in the measurement radiation region MSA each time the measuring head 21 measures a measurement target portion of the surface of the workpiece W in which the measurement radiation region MSA is set. That is, the machining system SYS can alternately perform the measurement of the workpiece W by the measuring head 21 and the rotation of the workpiece W by the rotating device 35. Specifically, the measuring head 21 measures the first measurement target portion on the surface of the workpiece W in a state where the measurement transmission region MSA is set in the first measurement target portion on the surface of the workpiece W. Subsequently, the rotating device 35 rotates the workpiece W by a prescribed angle under the control of the control device 4 to set the measurement transmission region MSA for a second measurement target portion of the surface of the workpiece W different from the first measurement target portion. Subsequently, the measuring head 21 measures the second measurement target portion of the surface of the workpiece W in a state where the second measurement target portion of the surface of the workpiece W is set with the measurement emission area MSA. The same operation is repeated below. As a result, the measuring head 21 can sequentially measure a plurality of measurement target portions obtained by subdividing (sectioning or sectioning) the surface of the workpiece W. At this time, the portion to be measured in which the measurement radiation area MSA is set after the rotation of the workpiece W by the rotation device 35 may partially overlap the portion to be measured in which the measurement radiation area MSA is set before the rotation of the workpiece W by the rotation device 35. That is, a predetermined measurement target portion to be measured by the measurement head 21 after the rotation device 35 rotates the workpiece W may partially overlap with a measurement target portion that has been measured by the measurement head 21 before the rotation device 35 rotates the workpiece W. However, the measurement target portion in which the measurement radiation area MSA is set after the rotation of the workpiece W by the rotation device 35 may not overlap with the measurement target portion in which the measurement radiation area MSA is set before the rotation of the workpiece W by the rotation device 35. That is, the predetermined measurement target portion to be measured by the measurement head 21 after the rotation device 35 rotates the workpiece W may not overlap with the measurement target portion that has been measured by the measurement head 21 before the rotation device 35 rotates the workpiece W.

In the case where measuring head 21 measures a stationary workpiece W, stage 32 may move workpiece W by a predetermined movement amount so that a new measurement target portion of the surface of workpiece W that has not been measured by measuring head 21 is included in measurement radiation area MSA each time measuring head 21 measures a measurement target portion of the surface of workpiece W in which measurement radiation area MSA is set. The moving direction of the workpiece W at this time may be a direction parallel to the rotation shaft 3522 of the rotation device 35. The moving direction of the workpiece W may be a direction intersecting the rotary shaft 3522. In this way, machining system SYS can alternately perform measurement of workpiece W by measuring head 21 and movement of workpiece W by stage 32.

Subsequently, the control device 4 sets the machining conditions of the workpiece W based on the workpiece measurement information on the measurement result of the measurement head 21 on the workpiece W in step S11 (step S12). The processing conditions may include, for example, conditions related to processing the light EL. The condition relating to the processing light EL may include, for example, a condition relating to at least one of the intensity of the processing light EL, the irradiation timing of the processing light EL, and the irradiation time of the processing light EL. The processing conditions may include, for example, conditions related to movement of the processing head 12. The condition relating to the movement of the machining head 21 may include, for example, a condition relating to at least one of a movement speed of the machining head 12, a movement timing of the machining head 12, and a movement amount of the machining head 12. The processing conditions may include, for example, conditions related to movement of stage 32. The condition related to the movement of stage 32 may include, for example, a condition related to at least one of a movement speed of stage 32, a movement timing of stage 32, and a movement amount of stage 32. The machining conditions may include, for example, conditions related to rotation of the workpiece W by the rotating device 35. The condition relating to the rotation of the workpiece W may include, for example, a condition relating to at least one of the rotation speed of the workpiece W, the rotation timing of the workpiece W, and the rotation amount (i.e., the rotation angle) of the workpiece W.

Subsequently, the machining system SYS machines the workpiece W in accordance with the machining conditions set in step S12 (step S13). That is, the machining head 12 moves while irradiating the machining light EL to the workpiece W in accordance with the machining condition set in step S12. The stage 32 moves in accordance with the processing conditions set in step S12. The rotating device 35 rotates the workpiece W in accordance with the processing conditions set in step S12.

The machining head 12 may irradiate the workpiece W rotated by the rotating device 35 with the machining light EL to machine the workpiece W. That is, the processing head 12 may process the workpiece W by irradiating the processing light EL to the workpiece W at least in part of the period in which the rotating device 35 is rotating the workpiece W. Alternatively, the processing head 12 may process the workpiece W by irradiating the stationary workpiece W with the processing light EL. When the processing head 12 irradiates the processing light EL on the stationary workpiece W, the rotating device 35 may rotate the workpiece W by a predetermined angle so that a new processing target portion, which is not yet processed by the processing head 12, of the surface of the workpiece W is included in the processing emission region PSA every time the processing head 12 processes a processing target portion included in the processing emission region PSA of the surface of the workpiece W. That is, the machining system SYS may alternately perform the machining of the workpiece W by the machining head 12 (i.e., the irradiation of the workpiece W with the machining light EL emitted from the machining head 12) and the rotation of the workpiece W by the rotation device 35. Specifically, the machining head 12 irradiates the first machining target portion on the front surface of the workpiece W with the machining light EL in a state where the machining emission region PSA is set in the first machining target portion, thereby machining the first machining target portion. Subsequently, the rotating device 35 rotates the workpiece W by a predetermined angle under the control of the control device 4 to set a machining shot region PSA for a second machining target portion of the surface of the workpiece W, which is different from the first machining target portion. Subsequently, the machining head 12 irradiates the second machining target portion on the front surface of the workpiece W with the machining light EL in a state where the machining emission region PSA is set in the second machining target portion, thereby machining the second machining target portion. The same operation is repeated below. As a result, the machining head 12 can sequentially machine a plurality of machining target portions obtained by subdividing (sectioning ) the surface of the workpiece W. At this time, the controller 4 may set the machining radiation region PSA for a second target portion of the surface of the workpiece W, which is different from the first target portion, by moving the workpiece W by a predetermined movement amount. The moving direction of the workpiece W at this time is typically a direction along the rotation axis 3522 of the rotating device 35, but may be a direction intersecting the rotation axis 3522.

In either case, the machining system SYS rotates the workpiece W by the rotating device 35 (more specifically, rotates the chuck 353 holding the workpiece W by the rotating device 35) in order to machine the surface of the workpiece W by the machining light EL. In this case, the machining system SYS may be considered to machine the surface of the workpiece W with the machining light EL. When the machining light EL is a laser beam, the machining system SYS may be considered to perform laser lathe machining on the surface of the workpiece W using the machining light EL.

By rotating the workpiece W by the rotating device 35, the machining head 12 can machine a band-shaped area Wb developed in the circumferential direction on the surface of the workpiece W as shown in fig. 9 which is a perspective view showing the workpiece W being machined. At this time, the machining system SYS may repeat the operation of machining the strip-shaped region Wb while relatively moving the workpiece W and the machining light EL. That is, the machining system SYS may machine the surface of the workpiece W with the machining light EL while relatively moving the workpiece W and the machining light EL. The machining system SYS may machine the strip-shaped region Wb of the surface of the workpiece W with the machining light EL while moving the irradiation position of the machining light EL on the surface of the workpiece W relative to the surface of the workpiece W. Specifically, as shown in fig. 9, the machining system SYS may machine the strip-shaped region Wb of the surface of the workpiece W with the machining light EL while moving the irradiation position of the machining light EL on the surface of the workpiece W parallel to the rotation axis 3522. That is, the processing system SYS may alternately perform: an operation of machining the band-shaped region Wb on the surface of the workpiece W with the machining light EL by rotating the workpiece W using the rotating device 35; and an operation of moving the irradiation position of the processing light EL on the surface of the workpiece W parallel to the rotation axis 3522 in a state where the rotation of the workpiece W by the rotating device 35 is stopped. As a result, the machining system SYS can machine the entire workpiece W (or a portion of the surface of the workpiece W to be machined by the machining light EL). The operation of moving the irradiation position of the processing light EL in parallel with the rotation axis 3522 includes not only the operation of moving the irradiation position of the processing light EL in parallel with the rotation axis 3522 as characters but also the operation of moving the irradiation position of the processing light EL in a direction which is not strictly parallel with the rotation axis 3522 but is not obstructed even if it is substantially parallel.

As described above, the processing head 12 irradiates the processing light EL traveling in the Z-axis direction to the workpiece W. That is, the processing head 12 irradiates the workpiece W with the processing light EL with the irradiation axis EX being parallel to the Z axis. At this time, as shown in fig. 10, which is a cross-sectional view showing the processing light EL irradiated to the workpiece W, the processing head 12 may irradiate the processing light EL to the workpiece W from a direction intersecting the rotation axis 3522 of the rotation device 35 (i.e., the central axis CS of the workpiece W). That is, the machining head 12 may irradiate the workpiece W with the machining light EL having the irradiation axis EX intersecting the rotation axis 3522. At this time, since the processing head 12 is disposed above the workpiece W, the processing head 12 may irradiate the processing light EL on the upper surface of the workpiece W (i.e., the surface facing the processing head 12 side). That is, the machining head 12 may irradiate a certain portion of the surface of the workpiece W with the machining light EL from a direction along the normal NL to the certain portion.

Alternatively, as shown in fig. 11, which is a cross-sectional view showing another example of the processing light EL irradiated to the workpiece W, the processing head 12 may irradiate the processing light EL to the workpiece W from a direction twisted with respect to the rotation axis 3522 of the rotation device 35 (i.e., the central axis CS of the workpiece W). That is, the machining head 12 may irradiate the workpiece W with the machining light EL having the irradiation axis EX twisted with respect to the rotation axis 3522. In addition, the twisting direction with respect to the rotation shaft 3522 may also be referred to as a direction along an axis at a twisted position with the rotation shaft 3522. In this case, typically, the processing head 12 irradiates a certain portion of the surface of the workpiece W with the processing light EL from a direction intersecting the normal NL to the certain portion. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with the processing light EL traveling along the irradiation axis EX having an angle greater than 0 degree with respect to the normal NL to the portion. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with the processing light EL traveling along the irradiation axis EX having an angle greater than 30 degrees with respect to the normal NL to the portion. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with the processing light EL traveling along the irradiation axis EX having an angle greater than 60 degrees with respect to the normal NL to the portion. For example, the machining head 12 may irradiate a certain portion of the surface of the workpiece W with the machining light EL traveling along the irradiation axis EX having an angle greater than 70 degrees with respect to the normal NL to the certain portion. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with the processing light EL traveling along the irradiation axis EX having an angle greater than 80 degrees with respect to the normal NL to the portion. For example, the machining head 12 may irradiate a certain portion of the surface of the workpiece W with the machining light EL traveling along the irradiation axis EX at an angle of 90 degrees to the normal NL to the certain portion. Fig. 11 shows an example in which the processing head 12 irradiates a certain portion of the surface of the workpiece W with the processing light EL traveling along the irradiation axis EX at an angle of 90 degrees to the normal NL to the certain portion.

When the processing light EL is irradiated to the workpiece W from a direction twisted with respect to the rotation axis 3522, the processing system SYS may change the irradiation position of the processing light EL in a direction intersecting with the rotation axis 3522. Since the workpiece W has a cylindrical shape, a direction intersecting the rotation axis 3522 (i.e., a direction intersecting the central axis CS of the workpiece W) corresponds to a radial direction of the workpiece W. Therefore, the processing system SYS may change the irradiation position of the processing light EL along the radial direction of the workpiece W. When the workpiece W is irradiated with the processing light EL from the direction intersecting the rotation axis 3522, the processing system SYS may change the irradiation position of the processing light EL along the direction intersecting the rotation axis 3522.

For example, as shown in fig. 11, the processing system SYS may change the irradiation position of the processing light EL along the Y-axis direction intersecting the rotation axis 3522 and the irradiation axis EX (in this case, the irradiation position may be referred to as a light converging position, and the same applies hereinafter). In this case, the machining system SYS may change the irradiation position of the machining light EL along the Y-axis direction so that the irradiation position of the machining light EL approaches the rotation shaft 3522. For example, the processing system SYS may change the irradiation position of the processing light EL along the Y-axis direction so that the irradiation position of the processing light EL in the second period after the first period is closer to the rotation axis 3522 than the irradiation position of the processing light EL in the first period. In the example shown in fig. 11, the machining system SYS may change the irradiation position of the machining light EL along the Y-axis direction so that the irradiation position of the machining light EL is shifted to the + Y side.

For example, as shown in fig. 11, the processing system SYS may change the irradiation position of the processing light EL along the Z-axis direction intersecting the rotation axis 3522 and along the irradiation axis EX. At this time, the defocus amount of machining light EL irradiated to the surface of workpiece W changes with the change in the irradiation position. As a result, the integrated flux (flux) of the processing light EL irradiated to the surface of the workpiece W changes with the change in the irradiation position. For example, the machining system SYS may change the irradiation position of the machining light EL so as to irradiate the machining light EL having a relatively high fluence onto the surface of the workpiece W at the timing when the machining of the workpiece W is started. Typically, since the integrated flux is highest when the condensed position of the processing light EL is located on the surface of the workpiece W, the processing system SYS may change the irradiation position of the processing light EL so that the condensed position of the processing light EL is located on the surface of the workpiece W. As a result, the amount of machining of the workpiece W by one shot of the machining light EL is relatively increased. Therefore, the machining system SYS can perform rough machining of the workpiece W relatively quickly. On the other hand, at the timing of finishing the workpiece W, the machining system SYS may change the irradiation position of the machining light EL so as to irradiate the machining light EL having a relatively low integrated flux onto the surface of the workpiece W in order to finely adjust the machining amount of the workpiece W by relatively reducing the machining amount of the workpiece W by one irradiation of the machining light EL. Typically, the machining system SYS may change the irradiation position of the machining light EL such that the condensed position of the machining light EL is separated from the surface of the workpiece W (that is, the defocused machining light EL is irradiated onto the surface of the workpiece W). Alternatively, the machining system SYS may reduce the intensity of the machining light EL to irradiate the surface of the workpiece W with the machining light EL having a relatively low integral flux.

Fig. 10 and 11 described above show an example in which the processing head 12 irradiates the processing light EL onto the surface of the workpiece W (for example, the side surface of the workpiece W on a cylindrical shape) intersecting a plane parallel to the holding plane 3531 (a plane along the YZ plane, see fig. 5) of the chuck 353 with which the workpiece W is brought into contact when the chuck 353 holds the workpiece W. That is, fig. 10 and 11 show an example in which the machining head 12 irradiates the machining light EL on the surface of the workpiece W extending along the rotation axis 3522. On the other hand, as shown in fig. 12, which is a perspective view showing another example of the processing light EL irradiated to the workpiece W, the processing head 12 may irradiate the processing light EL to the surface Ws of the workpiece W intersecting the rotation shaft 3522. Here, the processing light EL may be irradiated to the surface Ws of the workpiece W from a direction orthogonal to the direction of the rotation shaft 3522 (X direction). The machining light EL may be irradiated onto the surface Ws of the workpiece W from a direction not orthogonal to but intersecting the direction (X direction) of the rotation shaft 3522. The machining light EL may be irradiated to the surface Ws of the workpiece W from a direction at a twisted position with respect to the direction of the rotation shaft 3522. The machining light EL may be applied to the surface Ws of the workpiece W from the direction of the rotation axis 3522.

When the workpiece W is irradiated with the processing light EL, there is a possibility that light generated by irradiation of the processing light EL is emitted from the workpiece W. The light generated by irradiation of the processing light EL may include at least one of reflected light of the processing light EL from the workpiece W, scattered light of the processing light EL from the workpiece W, and passing light of the processing light EL through the workpiece W. Alternatively, at least a part of the processing light EL traveling toward the workpiece W may travel directly over the workpiece W without being irradiated to the workpiece W. At this time, stage device 3 may include a beam dump 37, and beam dump 37 may terminate the light generated by irradiation of processing light EL and the portion of light not irradiated to workpiece W in processing light EL (hereinafter, both are collectively referred to as "excess light"). An example of the beam dump 37 is shown in fig. 13. As shown in fig. 13, the beam dump 37 is disposed (i.e., provided) on the opposite side of the processing head 12 with respect to the irradiation position of the processing light EL on the surface of the workpiece W. In the example shown in fig. 13, the beam dump 37 has a portion arranged on the-Z side than the irradiation position of the processing light EL on the surface of the workpiece W. The beam dump 37 includes an irradiation surface 371 to which the excessive light is irradiated. Therefore, the irradiation surface 371 is disposed on the optical path of the excessive light. The irradiation surface 371 can absorb the excessive light and scatter the excessive light. In this case, in order to reduce the possibility that the excessive light irradiated to the irradiation surface 371 returns to the processing head 12, the irradiation surface 371 may be arranged to be inclined with respect to the irradiation axis EX of the processing light EL. For example, the irradiation surface 371 may be disposed such that the angle formed by the irradiation surface 371 and the irradiation axis EX is acute. Moreover, the irradiation surface 371 may not be a plane. For example, the irradiation surface 371 may be a curved surface including at least one of a convex surface and a concave surface. The irradiation surface 371 of the beam dump 37 may be set at a position away from the position where the processing light EL is condensed. The beam dump 37 may be attached to the stage 32, or may be attached to a member (for example, at least one of the platen 31 and the frame 5) different from the stage 32.

In fig. 8 again, the surface of workpiece W processed by processing light EL is measured by measuring head 21 (step S14). In this case, the measurement of the workpiece W by the measuring head 21 may be performed in parallel with the processing of the workpiece W by the processing head 12. Specifically, the measuring head 21 may measure the second portion of the surface of the workpiece W that has been processed by the processing light EL at least in part of the period in which the processing head 12 irradiates the first portion of the surface of the workpiece W with the processing light EL. Alternatively, the measurement of the workpiece W by the measurement head 21 may be performed in a state where the machining of the workpiece W by the machining head 12 is stopped.

Subsequently, the control device 4 determines whether the machining amount of the workpiece W is appropriate based on the workpiece measurement information on the measurement result of the measurement head 21 on the workpiece W in step S14 (step S15). That is, the control device 4 determines whether or not the machining amount of the workpiece W based on the machining condition set in step S12 is a predetermined or assumed appropriate amount.

If the determination result in step S15 is that the machining amount of the workpiece W is not appropriate (no in step S15), the control device 4 resets the machining conditions based on the workpiece measurement information on the measurement result of the measuring head 21 on the workpiece W in step S14 so that the machining amount of the workpiece W becomes appropriate (step S16). On the other hand, if the determination result in step S15 is that the machining amount of the workpiece W is determined to be appropriate (yes in step S15), the control device 4 may not reset the machining conditions. Subsequently, the machining system SYS repeats the operations from step S13 to step S16 until the machining of the workpiece W is completed (step S17).

As described above, in the present embodiment, the machining system SYS measures the workpiece W before machining in advance in step S11, machines the workpiece W based on the result of the measurement in advance of the workpiece W in step S13, measures the workpiece W after machining in step S14, and resets the machining condition based on the result of the measurement in after machining of the workpiece W in step S16. Therefore, the machining system SYS can appropriately machine the workpiece W. In particular, since the machining system SYS includes both the machining head 12 and the measuring head 21, the operations from step S11 to step S17 can be performed without detaching the workpiece W from the chuck 353.

(2-2) Axis information generating operation

Next, an axis information generating operation for generating rotation axis information on the rotation axis 3522 of the rotation device 35 using the measuring device 2 will be described. In the present embodiment, the machining system SYS may perform at least one of the first axis information generating operation to the third axis information generating operation. The first axis information generating operation is an operation for generating, as the rotation axis information, assembly error information relating to a deviation between the direction in which the rotation axis 3522 extends and the movement direction of the stage 32. In the following description, the deviation between the direction in which the rotation shaft 3522 extends and the movement direction of the stage 32 is referred to as "assembly error" (i.e., assembly error of the rotation device 35 with respect to the stage 32) ". The second axis information generating operation is an operation for generating, as the rotation axis information, scanning error information relating to a direction in which the rotation axis 3522 extends and a deviation of a moving direction of the irradiation position of the machining light EL on the surface of the workpiece W by the galvanometer mirror 1214 (that is, a scanning direction of the machining light EL). In the following description, the direction in which the rotation axis 3522 extends and the deviation of the scanning direction of the galvanometer mirror 1214 with respect to the processing light EL are referred to as "scanning error". The third axis information generating operation is an operation for generating clamping error information relating to the deviation of the rotation axis 3522 and the workpiece W held by the chuck 353 as rotation axis information. In the following description, the deviation between the rotary shaft 3522 and the workpiece W held by the chuck 353 is referred to as "chucking error". The first to third axis information generating operations are described in order below.

The rotation axis information may be regarded as information related to at least one of the position and the posture of the rotation axis 3522 (or even at least one of the position and the posture of the rotation device 35). For example, the assembly error information may be regarded as information related to at least one of the position and the posture of the rotation shaft 3522 (or even at least one of the position and the posture of the rotation device 35) with respect to the movement direction of the stage 32. For example, the scanning error information may be regarded as information relating to at least one of the position and the posture of the rotation axis 3522 (or even at least one of the position and the posture of the rotation device 35) with respect to the operation direction of the processing light EL. For example, the chucking error information may be regarded as information relating to at least one of the position and the posture of the rotary shaft 3522 (or even at least one of the position and the posture of the rotary device 35) with respect to the workpiece W. At this time, it can be considered that the control device 4 controls at least one of the machining device 1 (for example, the machining head 12) and the stage device 3 (for example, the rotation device 35) based on information on at least one of the position and the posture of the rotation shaft 3522 (or even at least one of the position and the posture of the rotation device 35) in order to machine the workpiece W.

(2-2-1) first axis information generating action (Assembly error)

First, a first axis information generating operation for generating assembly error information relating to an assembly error, which is a deviation between the direction in which rotation axis 3522 extends and the movement direction of stage 32, will be described. It is desirable that the direction in which the rotation axis 3522 extends be parallel to (or coincide with) the direction of movement of the stage 32. For example, in the present embodiment, since rotation axis 3522 is an axis extending along the X-axis direction, the direction in which rotation axis 3522 extends is parallel to (or coincides with) the X-axis in the stage coordinate system used to control the position of stage 32. However, in practice, the direction in which rotation shaft 3522 extends may become non-parallel (or not parallel) to the movement direction of stage 32 due to the assembly accuracy when placing rotation device 35 on stage 32 or the assembly accuracy when mounting chuck 353 to rotation shaft 352. Further, the direction in which the rotation axis 3522 extends may become non-parallel (or non-uniform) with the movement direction of the stage 32 due to the movement accuracy of the stage 32. Therefore, machining system SYS performs the first axis information generating operation to generate assembly error information relating to such a deviation between the direction in which rotation axis 3522 extends and the movement direction of stage 32 (i.e., assembly error). The first axis information generating operation will be described below with reference to fig. 14. Fig. 14 is a flowchart showing the flow of the first axis information generating operation.

As shown in fig. 14, a workpiece for test (hereinafter, referred to as a "test workpiece Wt") for performing the first axis information generating operation is held by the chuck 353 (step S21). At this time, the test workpiece Wt is held by the chuck 353 such that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. In addition, as the test workpiece Wt, a workpiece whose roundness and straightness are known can be used.

The test workpiece Wt is, for example, a workpiece having a shape that enables the center axis CSt of the test workpiece Wt to be calculated from the measurement result of the test workpiece Wt by the measuring apparatus 2. As an example of such a test workpiece Wt, a test workpiece Wt having a cylindrical shape can be cited. Fig. 15 shows a height image of the test workpiece Wt, which is an example of a measurement result of the measuring device 2 with respect to the test workpiece Wt having a cylindrical shape. In the height images of fig. 15 and fig. 17 (b), 17 (d), 19, 21 (b), and 21 (d) described later, the shades represent height information, the lighter parts represent the higher (+ Z axis side) of the parts, and the lighter parts represent the lower (+ Z axis side) of the parts. As shown in fig. 15, the height image of the test workpiece Wt is an image in which the test workpiece Wt is reflected so that a portion along the center axis CSt is higher than other portions other than the portion along the center axis CSt. Since the test workpiece Wt has an ideal cylindrical shape, the control device 4 can calculate the central axis CSt of the test workpiece Wt from the measurement result of the measurement device 2 on the test workpiece Wt. The calculated central axis CSt can be used as the rotation axis 3522. This is because, as described above, the test workpiece Wt is held by the chuck 353 so that the center axis CSt of the test workpiece Wt coincides with the rotation axis 3522. When the workpiece W to be processed can be used as the test workpiece Wt, the workpiece W may be held by the chuck 353 in place of the test workpiece Wt in step S21.

Subsequently, the machining system SYS repeats the operation of measuring a part of the test workpiece Wt using the measuring device 2 (step S22) and the operation of moving the stage 32 (step S24) until the operation of measuring a part of the test workpiece Wt is performed a required number of times. Specifically, for example, as shown in fig. 16 which is a plan view showing the test workpiece Wt, the measuring apparatus 2 sets the measurement emission region MSA in the first measurement target portion Wt11 on the surface of the test workpiece Wt, and measures the first measurement target portion Wt 11. Subsequently, the machining system SYS moves the stage 32 in one direction. For example, machining system SYS moves stage 32 in a direction parallel to the direction in which rotation shaft 3522 should originally extend. For example, when rotation axis 3522 is intended to extend along the X-axis direction, machining system SYS moves stage 32 along the X-axis direction of the stage coordinate system. With the movement of the stage 32, the measurement emission area MSA moves on the surface of the test workpiece Wt. At this time, the machining system SYS moves the stage 32 to set the measurement transmission area MSA for the second measurement target portion Wt12 adjacent to the first measurement target portion Wt11 on the surface of the test workpiece Wt. Subsequently, the measuring apparatus 2 measures the second measurement target portion Wt 12. Thereafter, the same operation is repeated until the operation of measuring a part of the test workpiece Wt is performed a required number of times (step S23).

Subsequently, the control device 4 generates assembly error information based on the measurement result of the test workpiece Wt in step S22 (step S25). Here, the operation of generating the assembly error information will be described with reference to fig. 17 (a) to 17 (d).

Fig. 17 (a) shows an ideal test workpiece Wt in which the direction in which rotation axis 3522 extends (i.e., the direction in which central axis CSt extends) is parallel to (or coincides with) the moving direction of stage 32. The height image corresponding to the measurement result of the test workpiece Wt is shown in fig. 17 (b). The height image corresponds to an image generated by connecting a plurality of images corresponding to a plurality of measurements of the test workpiece Wt along the moving direction of the measurement emission area MSA. As shown in fig. 17 (b), the control device 4 can calculate the rotation axis 3522 (center axis CSt) based on the test workpiece Wt reflected in the height image. That is, the control device 4 can acquire information about the rotation shaft 3522. Further, since the measurement transmission area MSA moves along with the movement of the stage 32, the height image of the test workpiece Wt is an image extending along the movement direction of the stage 32. Therefore, the control device 4 can calculate the movement direction of the stage 32 based on the height image itself. Specifically, the control device 4 may calculate a direction (for example, a longitudinal direction of the height image) in which a plurality of images corresponding to a plurality of measurement results of the test workpiece Wt are connected as the movement direction of the stage 32. In the example shown in fig. 17 (b), since the direction in which the rotation axis 3522 extends is parallel to (or coincides with) the movement direction of the stage 32, the direction in which the rotation axis 3522 extends, which is calculated by the control device 4, is parallel to (or coincides with) the movement direction of the stage 32, which is calculated by the control device 4.

On the other hand, fig. 17 (c) shows the test workpiece Wt in which the direction in which the rotation axis 3522 extends (i.e., the direction in which the central axis CSt extends) is not parallel to (or does not coincide with) the movement direction of the stage 32. The height image corresponding to the measurement result of the test workpiece Wt is shown in fig. 17 (d). As shown in fig. 17 (d), at this time, the direction in which the rotation axis 3522 calculated by the controller 4 extends is not parallel to (or does not coincide with) the movement direction of the stage 32 calculated by the controller 4.

Therefore, the controller 4 can calculate the relationship (particularly, the deviation) between the direction in which the rotation shaft 3522 extends and the movement direction of the stage 32. As a result, control device 4 can generate assembly error information relating to the deviation between the direction in which rotation axis 3522 extends and the movement direction of stage 32.

In the example of fig. 17, the control device 4 calculates the rotation axis 3522 (center axis CSt) using the height image corresponding to the measurement result of the test workpiece Wt. However, the control device 4 may calculate the rotation axis 3522 (the center axis CSt) using the profile of the test workpiece Wt in addition to or instead of this. At this time, the controller 4 may calculate the center line of the two sides extending in the X-axis direction in the profile of the test workpiece Wt as the rotation axis 3522 (the center axis CSt). At this time, as described later, the machining system SYS may repeat an operation of measuring a part of the test workpiece Wt and an operation of moving the stage 32 in another direction (for example, Y-axis direction) intersecting the direction in which the rotation axis 3522 originally extends.

The assembly error information also includes information relating to an assembly error of the chuck 353 with respect to the rotation axis 352. In this case, the machining system SYS may perform the flow of fig. 14 by rotating the rotating device 35 by a predetermined angle (for example, 60 degrees) after performing the flow of fig. 14. The controller 4 may calculate the deviation of the central axis CSt due to the assembly error by repeating such a flow a predetermined number of times (for example, six times, in this case, the flow of fig. 14 is performed every time the rotation angle of the rotation shaft 352 becomes 0 degrees, 60 degrees, 120 degrees, 180 degrees, 240 degrees, or 300 degrees), and averaging the results of the flow of fig. 14 performed the predetermined number of times. In addition, by repeating the operation of rotating the test workpiece Wt and measuring the test workpiece Wt a plurality of times in this manner, the influence of the deflection of the test workpiece Wt due to its own weight can be distinguished from the assembly error.

The generated assembly error information may be referred to by the control device 4 for performing the machining operation. That is, the assembly error information may be referred to by the control device 4 during a processing period in which the workpiece W is processed by irradiating the processing light EL to the workpiece W. Specifically, the control device 4 may control the machining system SYS based on the assembly error information so that the workpiece W can be machined in the same manner as in the case where the deviation between the direction in which the rotation shaft 3522 extends and the movement direction of the stage 32 does not occur even when the deviation between the direction in which the rotation shaft 3522 extends and the movement direction of the stage 32 occurs. For example, the control device 4 may control at least one of the processing head 12 (particularly, the galvanometer mirror 1214) and the stage 32 based on the assembly error information so that the irradiation position of the processing light EL can be moved on the surface of the workpiece W, even when a deviation occurs between the direction in which the rotation axis 3522 extends and the movement direction of the stage 32, as in the case where a deviation does not occur between the direction in which the rotation axis 3522 extends and the movement direction of the stage 32. Typically, the control device 4 may control at least one of the processing head 12 (in particular, the galvanometer mirror 1214) and the stage 32 so that the irradiation position of the processing light EL on the surface of the workpiece W moves in the direction in which the rotation axis 3522 extends, based on the assembly error information. As a result, the machining system SYS can machine the workpiece W with higher accuracy than in the case where the assembly error information is not used. In addition, in order for the control device 4 to refer to the assembly error information during the machining period in which the workpiece W is machined by irradiating the machining light EL to the workpiece W, the first axis information generating operation may be performed prior to the machining operation.

In addition to or instead of the control device 4 controlling at least one of the processing head 12 (particularly the galvanometer mirror 1214) and the stage 32 based on the assembly error information, the rotation device 35 may be reassembled to the stage 32 based on the assembly error information. Typically, the rotation device 35 may be reassembled to the stage 32 such that the direction in which the rotation axis 3522 extends and the moving direction of the stage 32 become parallel (or coincide). At this time, since the direction in which the rotation shaft 3522 extends and the movement direction of the stage 32 are not deviated, the machining system SYS can machine the workpiece W with higher accuracy.

In the above description, in order to generate the assembly error information, the machining system SYS repeats an operation of measuring a part of the test workpiece Wt and an operation of moving the stage 32 in a direction (in the above-described example, the X-axis direction) parallel to the direction in which the rotation axis 3522 should originally extend. However, the machining system SYS may repeat the operation of measuring a part of the test workpiece Wt and the operation of moving the stage 32 in another direction (for example, the Y-axis direction) intersecting the direction in which the rotation axis 3522 originally extends. At this time, the control device 4 can also generate assembly error information relating to the deviation between the direction in which the rotation axis 3522 extends and the movement direction of the stage 32.

In the above description, the test workpiece Wt is held by the chuck 353 so that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. However, in reality, the chuck 353 may not be able to hold the test workpiece Wt such that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522 at all times. Therefore, the chuck 353 may hold the test workpiece Wt again each time the first axis information generating operation shown in fig. 14 is finished. That is, each time the first axis information generating operation shown in fig. 14 is completed, the test workpiece Wt may be detached from the chuck 353, and then the test workpiece Wt may be held again by the chuck 353. After the chuck 353 holds the test workpiece Wt again, the machining system SYS may perform the first axis information generating operation shown in fig. 14 again. As a result, a plurality of assembly errors are calculated by the first axis information generating operation performed a plurality of times. The control device 4 may generate the assembly error information based on the plurality of assembly errors calculated in this manner. For example, the control device 4 may generate assembly error information regarding an average value of a plurality of assembly errors. As a result, the influence of the misalignment between the center axis CSt of the test workpiece Wt and the rotation axis 3522 is reduced.

The deviation between the direction in which the rotation axis 3522 extends and the movement direction of the stage 32 can be considered equivalent to the deviation between the rotation axis 3522 and the traveling surface of the stage 32. Therefore, the assembly error may also be referred to as a stage walking error. In this way, if it is considered that the assembly error may be equivalent to the stage travel error, machining system SYS may generate assembly error information (that is, stage travel error information relating to the stage travel error) by performing the operation shown in fig. 18 in addition to or instead of the operation shown in fig. 14.

Specifically, as shown in fig. 18, the test workpiece Wt is held by the chuck 353 (step S31). When the workpiece W to be processed can be used as the test workpiece Wt, the workpiece W may be held by the chuck 353 in place of the test workpiece Wt in step S31.

Subsequently, the machining system SYS machines portions of the surface of the test workpiece Wt. Specifically, first, the machining system SYS sets a machining shot region PSA for a first machining target portion of the surface of the test workpiece Wt, and machines at least a part of the first machining target portion (step S32). Subsequently, the machining system SYS moves the stage 32 in one direction. For example, machining system SYS moves stage 32 in a direction parallel to the direction in which rotation shaft 3522 should originally extend (step S33). For example, when rotation axis 3522 is intended to extend along the X-axis direction, machining system SYS moves stage 32 along the X-axis direction of the stage coordinate system. The machining emission area PSA moves on the surface of the test workpiece Wt with the movement of the stage 32. At this time, the machining system SYS moves the stage 32 to set the machining shot area PSA to a second machining target portion different from the first machining target portion on the surface of the test workpiece Wt. Subsequently, the machining system SYS machines at least a part of the second machining target portion (step S34). At this time, the irradiation position of the processing light EL in the processing emission region PSA when processing at least a part of the second processing target portion is the same as the irradiation position of the processing light EL in the processing emission region PSA when processing at least a part of the first processing target portion. Therefore, the machining trace of the second machining-target portion is located at a position separated from the machining trace of the first machining-target portion by the movement amount of the stage 32 in step S33 along the movement direction of the stage 32 in step S33. In addition, fig. 18 shows an example in which two portions of the surface of the test workpiece Wt are machined, but three or more portions of the surface of the test workpiece Wt may be machined.

Subsequently, the measuring device 2 measures the surface of the test workpiece Wt (in particular, the portion machined in steps S32 and S34, the machining trace) (step S35).

Subsequently, the control device 4 generates assembly error information based on the measurement result of the test workpiece Wt in step S35 (step S36). Here, the operation of generating the assembly error information will be described with reference to fig. 19 (a) to 19 (b).

Fig. 19 (a) shows a height image corresponding to the measurement result of the ideal test workpiece Wt in which the direction in which the rotation axis 3522 extends is parallel to (or coincides with) the movement direction of the stage 32. As shown in fig. 19 (a), the control device 4 can calculate the rotation axis 3522 based on the test workpiece Wt reflected in the height image. Further, as described above, the plurality of machining traces are spaced apart along the moving direction of the stage 32. Therefore, the control device 4 can calculate the movement direction of the stage 32 based on the relative positional relationship of the plurality of machining traces reflected in the height image. Specifically, the controller 4 may calculate a direction along a line connecting a plurality of machining traces as the moving direction of the stage 32. In the example shown in fig. 19 (a), since the direction in which the rotation axis 3522 extends is parallel to (or coincides with) the movement direction of the stage 32, the direction in which the rotation axis 3522 extends, which is calculated by the control device 4, is parallel to (or coincides with) the movement direction of the stage 32, which is calculated by the control device 4.

On the other hand, fig. 19 (b) shows a height image corresponding to the measurement result of the test workpiece Wt in which the direction in which the rotation axis 3522 extends is not parallel to (or does not coincide with) the movement direction of the stage 32. As shown in fig. 19 (b), at this time, the direction in which the rotation axis 3522 calculated by the controller 4 extends is not parallel to (or does not coincide with) the movement direction of the stage 32 calculated by the controller 4.

Therefore, the controller 4 can calculate the relationship (particularly, the deviation) between the direction in which the rotation axis 3522 extends and the movement direction of the stage 32. As a result, the control device 4 can generate assembly error information relating to the deviation between the direction in which the rotation axis 3522 extends and the movement direction of the stage 32.

(2-2-2) second axis information generating action (scanning error)

Next, a second axis information generating operation for generating scanning error information concerning a scanning error, which is a deviation of the direction in which the rotation axis 3522 extends and the scanning direction of the machining light EL by the galvanometer mirror 1214 will be described. It is desirable that the direction in which the rotation axis 3522 extends be parallel to (or coincide with) the scanning direction of the processing light EL. For example, in the present embodiment, since the rotation axis 3522 is an axis extending along the X-axis direction, the direction in which the rotation axis 3522 extends is parallel to (or coincides with) the scanning direction of the processing light EL by the X-scanning mirror 1214X included in the galvanometer mirror 1214. However, in practice, the direction in which the rotation axis 3522 extends may become non-parallel (or not uniform) to the scanning direction of the galvanometer mirror 1214 for the processing light EL due to the assembly accuracy when the rotation device 35 is disposed on the stage 32 or the assembly accuracy when the chuck 353 is attached to the rotation axis 352. Further, there is a possibility that the direction in which the rotation axis 3522 extends becomes non-parallel (or non-uniform) to the scanning direction of the processing light EL due to an assembly error or scanning accuracy of the galvanometer mirror 1214. Therefore, the machining system SYS performs the second axis information generating operation to generate the scanning error information regarding the deviation (i.e., the scanning error) between the direction in which the rotation axis 3522 extends and the scanning direction of the machining light EL. In addition, when the direction in which the rotation axis 3522 extends is parallel to the scanning direction of the galvanometer mirror 1214 with respect to the processing light EL, the second axis information generating operation may be omitted. The second axis information generating operation will be described below with reference to fig. 20. Fig. 20 is a flowchart showing the flow of the second axis information generating operation.

As shown in fig. 20, the test workpiece Wt for performing the second axis information generating operation is held by the chuck 353 (step S41). At this time, the test workpiece Wt is held by the chuck 353 such that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. The test workpiece Wt for performing the second axis information generating operation may be the same as the test workpiece Wt for performing the first axis information generating operation. When the workpiece W to be processed can be used as the test workpiece Wt, the workpiece W may be held by the chuck 353 instead of the test workpiece Wt in step S41.

Subsequently, the machining system SYS deflects the machining light EL by using the galvanometer mirror 1214, thereby forming a linear groove GV (see fig. 21 a and the like) in the surface of the test workpiece Wt (step S42). Specifically, for example, the machining system SYS controls the galvanometer mirror 1214 so that the irradiation position of the machining light EL is moved on the surface of the test workpiece Wt in one direction parallel to the direction in which the rotary shaft 3522 should originally extend, thereby forming the linear groove GV extending in one direction on the surface of the test workpiece Wt. For example, when the rotary shaft 3522 originally extends in the X-axis direction, the machining system SYS controls the X-scan mirror 1214X to form a linear groove GV extending in the X-axis direction in the surface of the test workpiece Wt. While the test workpiece Wt is irradiated with the processing light EL to form the groove GV, the processing head 12 and the stage 32 are not moved.

Subsequently, the measuring device 2 measures the surface of the test workpiece Wt (in particular, the portion where the linear groove GV is formed in step S42, the machining trace) (step S43).

Subsequently, the control device 4 generates scanning error information based on the measurement result of the test workpiece Wt in step S42 (step S44). Here, the operation of generating the scanning error information will be described with reference to fig. 21 (a) to 21 (d).

Fig. 21 (a) shows an ideal test workpiece Wt in which the direction in which the rotary shaft 3522 extends (i.e., the direction in which the central axis CSt extends) and the scanning direction of the processing light EL are parallel (or coincide). The height image corresponding to the measurement result of the test workpiece Wt is shown in fig. 21 (b). As shown in fig. 21 (b), the control device 4 can calculate the rotation axis 3522 (center axis CSt) based on the test workpiece Wt reflected in the height image. Further, the control device 4 can calculate the scanning direction of the processing light EL based on the direction in which the groove GV reflected in the height image extends. This is because the groove GV extends along the scanning direction of the processing light EL, and thus the direction in which the groove GV extends is the same as the scanning direction of the processing light EL. In the example shown in fig. 21 (b), the direction in which the rotation axis 3522 extends is parallel to (or coincides with) the scanning direction of the processing light EL, and therefore the direction in which the rotation axis 3522 extends calculated by the control device 4 is parallel to (or coincides with) the scanning direction of the processing light EL calculated by the control device 4.

On the other hand, fig. 21 (c) shows the test workpiece Wt in which the direction in which the rotation axis 3522 extends is not parallel (or does not coincide) with the scanning direction of the processing light EL. The height image corresponding to the measurement result of the test workpiece Wt is shown in fig. 21 (d). As shown in fig. 21 d, at this time, the direction in which the rotary shaft 3522 calculated by the control device 4 extends is not parallel to (or does not coincide with) the scanning direction of the processing light EL calculated by the control device 4.

Therefore, the controller 4 can calculate the relationship (particularly, the deviation) between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL. As a result, the control device 4 can generate scanning error information relating to the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL.

In the example of fig. 21, the control device 4 calculates the rotation axis 3522 (the center axis CSt) using the height image corresponding to the measurement result of the test workpiece Wt. However, the control device 4 may calculate the rotation axis 3522 (the center axis CSt) using the profile of the test workpiece Wt in addition to or instead of this. At this time, the controller 4 may calculate the center line of the two sides extending in the X-axis direction in the profile of the test workpiece Wt as the rotation axis 3522 (the center axis CSt). At this time, as described later, the machining system SYS may repeat an operation of measuring a part of the test workpiece Wt and an operation of moving the stage 32 in another direction (for example, Y-axis direction) intersecting the direction in which the rotation axis 3522 originally extends.

The machining system SYS may perform the flow of fig. 20 by rotating the rotating device 35 by a predetermined angle (for example, 60 degrees) after performing the flow of fig. 20. The control device 4 may calculate the scanning error information by repeating such a flow a predetermined number of times (for example, six times, in which the flow of fig. 20 is performed every time the rotation angle of the rotation axis 352 becomes 0 degrees, 60 degrees, 120 degrees, 180 degrees, 240 degrees, or 300 degrees), and averaging the results of the flow of fig. 20 performed the predetermined number of times.

The machining system SYS may perform the flow of fig. 20 after performing the flow of fig. 20 described above, by detaching the test workpiece Wt from the chuck 353 and holding the test workpiece Wt again by the chuck 353.

The generated scanning error information may be referred to by the control device 4 for performing the above-described machining operation. That is, the scanning error information may be referred to by the control device 4 during a processing period in which the processing light EL is irradiated to the workpiece W to process the workpiece W. Specifically, the control device 4 may control the machining system SYS based on the scanning error information so that the workpiece W can be machined in the same manner as in the case where the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the machining light EL does not occur even when the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the machining light EL occurs. For example, the control device 4 may control at least one of the processing head 12 (particularly, the galvanometer mirror 1214) and the stage 32 based on the scanning error information so that the irradiation position of the processing light EL can be moved on the surface of the workpiece W, even when a deviation occurs between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL, as in the case where a deviation does not occur between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL. Typically, the control device 4 may control at least one of the processing head 12 (particularly, the galvanometer mirror 1214) and the stage 32 so that the irradiation position of the processing light EL on the surface of the workpiece W moves in the direction in which the rotation axis 3522 extends, based on the scanning error information. Further, when the stage 32 does not move during machining, the control device 4 may control the machining head 12 (in particular, the galvanometer mirror 1214). As a result, the machining system SYS can machine the workpiece W with higher accuracy than in the case where the scanning error information is not used. In addition, the second axis information generating operation may be performed only for the machining operation in order for the control device 4 to refer to the scanning error information during the machining period in which the workpiece W is machined by irradiating the machining light EL to the workpiece W.

In the above description, in order to generate the scanning error information, the machining system SYS controls the galvanometer mirror 1214 so that the irradiation position of the machining light EL is moved in a direction parallel to the direction in which the rotation axis 3522 should originally extend. However, the machining system SYS may control the galvanometer mirror 1214 so that the irradiation position of the machining light EL is moved in another direction intersecting the direction in which the rotation shaft 3522 originally extends. For example, the machining system SYS may control the Y-scan mirror 1214Y to form a linear groove GV extending in the Y-axis direction in the surface of the test workpiece Wt. At this time, the control device 4 can also generate scanning error information relating to a deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL.

In the above description, the test workpiece Wt is held by the chuck 353 so that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. However, in reality, as described above, the chuck 353 may not be able to hold the test workpiece Wt such that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522 at all times. Therefore, the chuck 353 may hold the test workpiece Wt again each time the second axis information generating operation shown in fig. 20 is finished. That is, each time the second axis information generating operation shown in fig. 20 is completed, the test workpiece Wt may be detached from the chuck 353, and then the test workpiece Wt may be held again by the chuck 353. After the chuck 353 holds the test workpiece Wt again, the machining system SYS may perform the second axis information generating operation shown in fig. 20 again. As a result, a plurality of scanning errors are calculated by the second axis information generating operation performed a plurality of times. The control device 4 may generate the scanning error information based on the plurality of scanning errors calculated in this manner. For example, the control device 4 may generate scanning error information regarding an average value of a plurality of scanning errors. As a result, the influence of the misalignment between the center axis CSt of the test workpiece Wt and the rotation axis 3522 is reduced.

(2-2-3) third axis information generating action (clamping error)

Next, a third axis information generating operation for generating chucking error information concerning a chucking error, which is a deviation of the workpiece W held by the rotary shaft 3522 and the chuck 353, will be described. The chuck 353 desirably holds the workpiece W such that the rotation axis 3522 coincides with the central axis CS of the workpiece W. However, due to the accuracy of mounting the workpiece W to the chuck 353, etc., the chuck 353 may not be able to hold the workpiece W such that the rotation axis 3522 coincides with the central axis CS. For example, as shown in fig. 22 (a), which is a plan view showing the workpiece W in which the chucking error has occurred, the chuck 353 may hold the workpiece W in a state in which the chucking error occurs in which the rotation axis 3522 is parallel to the central axis CS but does not coincide with the central axis CS. For example, as shown in fig. 22 (b), which is a plan view showing the workpiece W in which the chucking error has occurred, the chuck 353 may hold the workpiece W in a state in which the chucking error in which the rotation axis 3522 is not parallel to the central axis CS has occurred. For convenience of description, a chucking error in which the rotation shaft 3522 is parallel to the central axis CS but does not coincide with the central axis CS is referred to as an "eccentricity error". The eccentricity error can also be regarded as an error relating to the positional relationship of the rotary shaft 3522 and the central shaft CS. The chucking error in which the rotation axis 3522 is not parallel to the central axis CS is referred to as a "deflection error". The declination error can also be considered as an error related to the angular relationship of the rotational axis 3522 and the central axis CS. Therefore, the machining system SYS may generate the eccentricity error information regarding the eccentricity error as the chucking error information by performing the third axis information generating operation. The machining system SYS may generate the deflection angle error information regarding the deflection angle error as the chucking error information by performing the third axis information generating operation. Hereinafter, an operation for generating the eccentricity error information and an operation for generating the deflection angle error information will be described in order.

(2-2-3-1) action of generating eccentricity error information

First, an operation for generating the eccentricity error information will be described with reference to fig. 23. Fig. 23 is a flowchart showing a flow of an operation for generating eccentricity error information.

As shown in fig. 23, the workpiece W is held by the chuck 353 (step S51). Subsequently, the machining system SYS repeats the operation of measuring at least a part of the workpiece W by using the measuring device 2 (step S52) and the operation of rotating the workpiece W by a predetermined angle by using the rotating device 35 (step S54) until the workpiece W is rotated by a required angle larger than the predetermined angle. For example, the desired angle may also be at least 360 degrees, for example. That is, the machining system SYS repeats the operation of measuring at least a part of the workpiece W by using the measuring device 2 (step S52) and the operation of rotating the workpiece W by using the rotating device 35 (step S54) until the workpiece W rotates at least one turn. Here, the required angle may be 360 degrees or more, or less than 360 degrees. In addition, the machining head 12 may not be moved during the period from step S52 to step S54.

Subsequently, the control device 4 generates eccentricity error information based on the measurement result of the workpiece W in step S52 (step S55). Here, the operation of generating the eccentricity error information will be described with reference to fig. 24 to 29.

Fig. 24 is a cross-sectional view showing an ideal rotation of the workpiece W with the central axis CS aligned with the rotation axis 3522. As shown in fig. 24, when the central axis CS coincides with the rotary shaft 3522, even if the workpiece W is rotated by the rotating device 35, the position of an end point (end portion) of the surface of the workpiece W, which is located at an end in the direction intersecting the rotary shaft 3522, in one direction does not change. For convenience of description, an end point PZ of the surface of the workpiece W at an end in the Z-axis direction intersecting the rotation axis 3522 is used as an end point. At this time, as shown in fig. 25 which is a graph showing the relationship between the position of the end point PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W shown in fig. 24, even if the workpiece W is rotated by the rotating device 35, the position (i.e., the height) of the end point PZ in the Z-axis direction does not change. That is, the position (i.e., height) of the end point PZ in the Z-axis direction is a fixed value regardless of the rotation angle θ.

On the other hand, fig. 26 is a cross-sectional view showing a case where the workpiece W whose central axis CS is parallel to but does not coincide with the rotation axis 3522 rotates. As shown in fig. 26, when the central axis CS does not coincide with the rotation axis 3522, when the workpiece W is rotated by the rotating device 35, the position in one direction of an end point of the surface of the workpiece W that constitutes an end portion in one direction intersecting the rotation axis 3522 fluctuates in accordance with the rotation of the workpiece W. Specifically, as shown in fig. 27, which is a graph showing the relationship between the position of the end point PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W shown in fig. 26, when the workpiece W is rotated by the rotating device 35, the position (i.e., the height) of the end point PZ in the Z-axis direction varies sinusoidally in accordance with the rotation of the workpiece W. That is, the position of the end point PZ in the Z-axis direction has a value that varies in a sine wave shape according to the rotation angle θ. At this time, the larger the amount of the eccentricity error corresponding to the distance between the central axis CS and the rotation axis 3522, the larger the amount of variation in the position of the end point PZ in the Z-axis direction (i.e., the difference between the maximum value and the minimum value of the position of the end point PZ in the Z-axis direction) becomes.

Fig. 28 is a cross-sectional view showing a state in which the workpiece W whose central axis CS is parallel to but does not coincide with the rotation axis 3522 is rotated, as in fig. 26. However, the example shown in fig. 28 differs from the example shown in fig. 26 in which the end point PZ is separated from the rotary shaft 3522 only in the Z-axis direction in a situation where the rotation angle θ is zero degrees in that the end point PZ is separated from the rotary shaft 3522 not only in the Z-axis direction but also in the Y-axis direction intersecting the Z-axis direction in a situation where the rotation angle θ is zero degrees. At this time, as shown in fig. 29, which is a graph showing the relationship between the position of the end point PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W shown in fig. 28, when the workpiece W is rotated by the rotating device 35, the position (i.e., the height) of the end point PZ in the Z-axis direction varies sinusoidally in accordance with the rotation of the workpiece W. However, the variation in the position of the endpoint PZ in the Z-axis direction shown in fig. 29 is different in phase from the variation in the position of the endpoint PZ in the Z-axis direction shown in fig. 29.

Therefore, the controller 4 can calculate the eccentricity error by calculating the relationship between the position of the end point PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W based on the measurement result of the measuring device 2 on the workpiece W. Specifically, the control device 4 can calculate the variation in the position of the end point PZ in the Z-axis direction based on the relationship between the position of the end point PZ in the Z-axis direction and the rotation angle θ, and can calculate the distance between the central axis CS and the rotation axis 3522 (i.e., the eccentricity error) from the variation. Further, the control device 4 can calculate the phase of the fluctuation of the position of the end point PZ in the Z-axis direction based on the relationship between the position of the end point PZ in the Z-axis direction and the rotation angle θ, and can calculate the state of the workpiece W (specifically, information on the direction in which the central axis CS of the workpiece W is located with respect to the rotation axis 3522) according to the rotation angle θ of the workpiece W from the phase. That is, the controller 4 can generate eccentricity error information relating to an eccentricity error that is a deviation between the central axis CS of the workpiece W and the rotation axis 3522.

The controller 4 may determine the rotation axis 3522 from the contour of the workpiece W and determine the eccentricity error from the determined displacement of the rotation axis 3522.

The generated eccentricity error information may be referred to by the control device 4 for performing the machining operation. That is, the eccentricity error information may be referred to by the control device 4 during a processing period in which the workpiece W is processed by irradiating the processing light EL to the workpiece W. Specifically, the control device 4 may control the machining system SYS based on the eccentricity error information so that the workpiece W can be machined in the same manner as in the case where no eccentricity error occurs even when the eccentricity error occurs. For example, the control device 4 may control the irradiation position of the processing light EL based on the eccentricity error information so that the processing light EL is irradiated to the surface of the workpiece W even when the eccentricity error occurs, as in the case where the eccentricity error does not occur. In addition, in order for the control device 4 to refer to the eccentricity error information during the processing period in which the processing light EL is irradiated to the workpiece W to process the workpiece W, the operation of generating the eccentricity error information may be performed prior to the processing operation.

Fig. 30 shows an example of the irradiation position of the processing light EL controlled based on the eccentricity error information. Fig. 30 shows an example in which the processing light EL is irradiated from the direction twisted with respect to the rotary shaft 3522 to the end point of the workpiece W (specifically, the end point PY located at the end in the Y-axis direction intersecting the rotary shaft 3522). As shown in fig. 30, when the eccentricity error occurs, the position of the end point PY in the Y axis direction fluctuates in accordance with the rotation of the workpiece W. At this time, the control device 4 may control the irradiation position (in this case, the light converging position) of the processing light EL along the Y-axis direction to irradiate the processing light EL to the end point PY. For example, the control device 7 may control the irradiation position of the processing light EL (in this case, the condensing position) in the Y-axis direction by controlling the galvanometer mirror 1214. As a result, the machining system SYS can machine the workpiece W with higher accuracy than the case where the eccentricity error information is not used.

(2-2-3-2) action of generating deflection angle error information

Next, an operation for generating the yaw angle error information will be described with reference to fig. 31. Fig. 31 is a flowchart showing a flow of an operation for generating the yaw angle error information.

As shown in fig. 31, the machining system SYS performs the operations of step S51 to step S54, which are also performed in the operation of generating the eccentricity error information. However, the machining system SYS performs the operations of steps S51 to S54 at a plurality of different positions (for example, two positions) of the workpiece W. Specifically, as shown in fig. 32 which is a plan view showing the workpiece W in which the deflection error has occurred, the machining system SYS repeats the operation of measuring the first measurement target portion W21 of the workpiece W by using the measuring device 2 (step S52) and the operation of rotating the workpiece W by a predetermined angle by using the rotating device 35 (step S54) until the workpiece W is rotated by a desired angle (step S53). That is, the machining system SYS performs the operations of step S51 to step S54 at the first position P1 of the workpiece W at which the first measurement target portion W21 is located. Subsequently, the machining system SYS moves the stage 32 along the rotation axis 3522. At this time, the machining system SYS moves the stage 32 so that the measuring device 2 can measure the second measurement target portion W22 of the workpiece W (step S62). Since the stage 32 moves along the rotation axis 3522, the position of the second measurement target part W22 in the direction along the rotation axis 3522 is different from the position of the first measurement target part W21 in the direction along the rotation axis 3522. Subsequently, the machining system SYS repeats the operation of measuring the second measurement target portion W22 of the workpiece W by using the measuring device 2 (step S52) and the operation of rotating the workpiece W by a predetermined angle by using the rotating device 35 (step S54) until the workpiece W is rotated by a desired angle (step S53). That is, the machining system SYS performs the operations of step S51 to step S54 at the second position P2 of the workpiece W at which the second measurement target portion W22 is located. The above operations are repeated until it is determined that the operations of steps S51 to S54 need not be performed at the other position of the workpiece W (step S61).

Subsequently, the control device 4 generates the declination error information based on the measurement result of the workpiece W in step S52 (step S63). Specifically, the controller 4 calculates an eccentricity error at each of a plurality of different positions along the rotation axis 3522 based on the measurement result of the workpiece W in step S52. For example, as shown in fig. 32, the control device 4 calculates an eccentricity error between the first position P1 and the second position P2. Subsequently, the controller 4 calculates an offset angle error (for example, an angle formed by the central axis CS and the rotation axis 3522) based on the plurality of calculated eccentricity errors. That is, the controller 4 can generate the misalignment error information relating to the misalignment between the central axis CS of the workpiece W and the rotation axis 3522.

The generated deflection angle error information may be referred to by the control device 4 for performing the machining operation. The control method using the yaw angle error information may be the same as the control method using the eccentricity error information, and thus, a detailed description thereof will be omitted. As a result, the machining system SYS can machine the workpiece W with higher accuracy than in the case where the deflection angle error information is not used. In addition, in order for the control device 4 to refer to the deflection angle error information during the processing period in which the processing light EL is irradiated to the workpiece W to process the workpiece W, the operation of generating the deflection angle error information may be performed prior to the processing operation.

Further, the assembly error information (particularly, the assembly error when the chuck 353 is attached to the rotation shaft 352) may be generated by the same operation as the third axis information generating operation.

(2-3) optical State information Generation action

Next, a light state information generating operation for generating light state information on the state of the processing light EL using the measuring device 36 will be described. In the present embodiment, the optical state information may include, for example, intensity distribution information relating to an intensity distribution in an angular direction with respect to the irradiation axis EX of the processing light EL. The light state information may include traveling direction information relating to the traveling direction of the processing light EL, for example. The optical state information may include, for example, passing position information relating to a position at which the processing light EL passes through a plane intersecting the traveling direction of the processing light EL. Therefore, the operation of generating the intensity distribution information, the operation of generating the traveling direction information, and the operation of generating the passing position information will be described in order below.

(2-3-1) action of generating intensity distribution information

First, an operation of generating intensity distribution information on an intensity distribution in an angular direction with respect to the irradiation axis EX of the processing light EL will be described.

In order to generate the intensity distribution information, the processing system SYS measures the intensity distribution of the processing light EL using the measuring device 36. Hereinafter, an operation of measuring the intensity distribution of the processing light EL by using the measuring device 36 will be described with reference to fig. 33 (a) to 33 (c). Fig. 33 (a) is a cross-sectional view showing a case where the machining head 12 irradiates the machining light EL to the measuring device 36, fig. 33 (b) is a plan view showing a case where the machining head 12 irradiates the machining light EL to the measuring device 36, and fig. 33 (c) is a graph showing a result of receiving the machining light EL by the light receiving element 362 included in the measuring device 36.

As shown in fig. 33 (a) and 33 (b), the control device 4 controls the stage drive system 33 to move the stage 32 to a position where the machining head 12 can irradiate the machining light EL to the mark 366 constituting the passage area 365 through which the machining light EL can pass (that is, to move the rotation device 35 on which the measurement device 36 is disposed). That is, the control device 4 moves the stage 32 so that the mark 366 is located within the process emission area PSA. In this case, the control device 4 may move the machining head 12 in addition to or instead of the stage 32. Subsequently, the control device 4 causes the processing head 12 to irradiate the processing light EL to the mark 366.

At this time, as shown in fig. 33 (a) and 33 (b), the machining head 12 deflects the machining light EL by using the galvanometer mirror 1214 under the control of the control device 4, thereby scanning the machining light EL on at least a part of the surface of the measuring device 36 (specifically, a surface including a portion where the mark 366 is formed). In particular, the machining head 12 scans the machining light EL over at least a part of the surface of the measuring device 36 such that the machining light EL (more specifically, the target irradiation area EA of the machining light EL) crosses the passage area 365 constituting the mark 366 in a plane along the XY plane. Further, at least a part of the surface of measuring apparatus 36 may be scanned with processing light EL by moving stage 32 under the control of control apparatus 4.

As a result, the machining light EL is irradiated to the mark 366 at a certain timing during a period in which the machining light EL scans at least a part of the surface of the measuring device 36. That is, at some time during the period in which the machining light EL scans at least a part of the surface of the measuring device 36, the machining light EL is received by the light receiving element 362. As a result, as shown in fig. 33 (c), the control device 4 acquires, as the machining light measurement information corresponding to the light reception result of the machining light EL, a light reception signal indicating that the intensity of the machining light EL in a period in which at least a part of the machining light EL is irradiated to the passage area 365 is greater than the intensity of the machining light EL in a period in which the machining light EL is not irradiated to the passage area 365 constituting the marker 366. That is, the control device 4 can acquire information on the intensity distribution of the processing light EL as the processing light measurement information. At this time, it can also be said that the measuring device 36 measures the intensity distribution of the processing light EL. In addition, the time (light receiving timing) as the horizontal axis of fig. 33 c can be read as the relative position along the scanning direction (Y-axis direction) of the processing light EL and the measuring device 36.

The machining system SYS repeats the operation of measuring the machining light EL while changing the relative positional relationship between the measuring device 36 and the machining head 12 in the direction along the irradiation axis EX along the traveling direction of the machining light EL. Specifically, the control device 4 moves at least one of the machining head 12 and the stage 32 so that the position of the measurement device 36 with respect to the machining head 12 becomes the first position. Subsequently, the measuring device 36 measures the processing light EL. Subsequently, the control device 4 moves at least one of the processing head 12 and the stage 32 so that the position of the measuring device 36 with respect to the processing head 12 becomes a second position different from the first position in the direction along the irradiation axis EX. Typically, the controller 4 moves at least one of the processing head 12 and the stage 32 along the irradiation axis EX (in the example shown in fig. 33 a, along the Z-axis direction). Subsequently, the measuring device 36 measures the processing light EL. That is, the measuring device 36 measures the processing light EL at a first position in the direction along the irradiation axis EX (i.e., the direction in which the processing light EL travels), and measures the processing light EL at a second position different from the first position in the direction along the irradiation axis EX (i.e., the direction in which the processing light EL travels). Here, the change of the distance between the measurement device 36 and the condensed position of the processing light EL in the direction along the irradiation axis EX may be performed by the condensed position changing optical system 1210.

Subsequently, the control device 4 generates intensity distribution information on the intensity distribution of the processing light EL based on the processing light measurement information. Specifically, the machining light measurement information indicates the intensity distribution of the machining light EL on the surface of the beam passage member 361. Here, the operation of measuring the machining light EL is repeated while changing the relative positional relationship between the measuring device 36 and the machining head 12 in the direction along the irradiation axis EX. Therefore, as shown in fig. 34, which is a cross-sectional view showing the processing light EL, the processing light measurement information shows the intensity distribution of the processing light EL on the plurality of planes PN intersecting the irradiation axis EX and having different positions in the direction along the irradiation axis EX. The control device 4 may synthesize the intensity distributions of the machining light EL on the plurality of planes PN at different positions in the direction along the irradiation axis EX and generate the intensity distribution information on the intensity distribution in the angular direction with respect to the irradiation axis EX of the machining light EL from the synthesized three-dimensional intensity distribution. Alternatively, the control device 4 may estimate (in other words, complement) the intensity distribution PN of the processing light EL between a plurality of surfaces based on the intensity distributions of the processing light EL on the plurality of surfaces at different positions in the direction along the irradiation axis EX to generate the intensity distribution information about the intensity distribution in the angular direction with respect to the irradiation axis EX of the processing light EL.

Alternatively, when the machining system SYS measures the machining light EL, the relative positional relationship between the measuring device 36 and the machining head 12 may not be changed in the direction along the irradiation axis EX. Specifically, the control device 4 may control the relative positional relationship between the condensed position of the processing light EL and the measuring device 36 so that the condensed position of the processing light EL is separated from the passage region 365 constituting the marker 366 in the direction along the irradiation axis EX. That is, the control device 4 may control the relative positional relationship between the condensed position of the processing light EL and the measuring device 36 so that the measuring device 36 measures the processing light EL at a position different from the condensed position of the processing light EL in the direction along the irradiation axis EX. In other words, the control device 4 may also control the relative positional relationship of the condensed position of the processing light EL and the measuring device 36 to irradiate the defocused processing light EL to the mark 366.

Subsequently, the control device 4 generates intensity distribution information on the intensity distribution of the processing light EL based on the processing light measurement information. Specifically, as described above, the processed light measurement information indicates the intensity distribution of the processed light EL on the light receiving surface 3621 of the light receiving element 362. Further, the distance (so-called defocus amount) between the measurement device 36 and the condensed position of the processing light EL in the direction along the irradiation axis EX is information known to the control device 4. This is because the control device 4 controls the relative positional relationship between the condensed position of the processing light EL and the measuring device 36 so that the condensed position of the processing light EL is separated from the passage region 365 constituting the mark 366 in the direction along the irradiation axis EX. As a result, the control device 4 can estimate (in other words, supplement) the intensity distribution of the processing light EL on a plurality of surfaces having different positions in the direction along the irradiation axis EX based on the intensity distribution of the processing light EL and the defocus amount indicated by the processing light measurement information. That is, the control device 4 can generate intensity distribution information on the intensity distribution in the angular direction with respect to the irradiation axis EX of the processing light EL.

The generated intensity distribution information may be referred to by the control device 4 for performing the machining operation. That is, the intensity distribution information may be referred to by the control device 4 during a processing period in which the workpiece W is processed by irradiating the processing light EL to the workpiece W. In addition, in order for the control device 4 to refer to the intensity distribution information during the processing period in which the processing light EL is irradiated to the workpiece W to process the workpiece W, the generation operation of the intensity distribution information may be performed prior to the processing operation.

For example, the control device 4 may also control at least one of the irradiation position of the processing light EL and the traveling direction of the processing light EL based on the intensity distribution information to irradiate the processing light EL to a desired position of the workpiece W. At this time, the control device 4 may control at least one of the irradiation position of the processing light EL and the traveling direction of the processing light EL by controlling the galvanometer mirror 1214.

For example, the control device 4 may calculate the aperture angle of the processing light EL based on the intensity distribution information, and control the aperture angle of the processing light EL based on the calculated aperture angle so that the aperture angle of the processing light EL becomes a desired angle. At this time, the control device 4 may control the aperture angle of the processing light EL by controlling the aperture angle changing optical system 1211. Such control of the aperture angle may be performed, for example, when the workpiece W is irradiated with the processing light EL from a direction twisted with respect to the rotation axis 3522. For example, as shown in fig. 35 (a), which is a cross-sectional view showing the machining light EL irradiated to the workpiece W from a direction twisted with respect to the rotation axis 3522, when the aperture angle of the machining light EL is large, the machining light EL may be irradiated not only to a portion of the surface of the workpiece W to which the machining light EL should be irradiated but also to a portion of the surface of the workpiece W to which the machining light EL should not be irradiated. That is, the processing light EL may be accidentally irradiated to a portion of the surface of the workpiece W to which the processing light EL should not be irradiated. Therefore, as shown in fig. 35 (b), which is a cross-sectional view showing the processing light EL with the controlled aperture angle, the control device 4 can also reduce the aperture angle of the processing light EL. As a result, the possibility that the processing light EL is irradiated to a portion of the surface of the workpiece W to which the processing light EL should not be irradiated is reduced.

The controller 4 may perform the operation of changing the aperture angle of the processing light EL by the aperture angle changing optical system 1211 and then perform the operation of generating the intensity distribution information. The control device 4 may control the aperture angle of the processing light EL based on the intensity distribution information obtained in the generating operation.

The machining head 12 may irradiate the machining light EL to the mark 366 having a plurality of slit shapes different in the longitudinal direction under the control of the control device 4. For example, the machining head 12 may irradiate the machining light EL to a plurality of marks 366 whose longitudinal directions intersect (typically, intersect orthogonally) under the control of the control device 4. At this time, the control device 4 can calculate the ellipticity of the processing light EL based on the processing light measurement information. The control device 4 may control the ellipticity of the processing light EL based on the calculated ellipticity such that the ellipticity of the processing light EL becomes a desired ellipticity. At this time, the control device 4 may control the ellipticity of the processing light EL by controlling the ellipticity changing optical system 1212. Further, the control device 4 may rotate the processing light EL around the optical axis AX (particularly around the irradiation axis EX) based on the calculated ellipticity such that the direction in which the maximum value among the diameters of the points of the processing light EL on the entrance pupil plane of the f θ lens 1215 is taken becomes a desired direction. At this time, the controller 4 may control the optical rotation system 1213 to rotate the processing light EL about the optical axis AX (particularly about the irradiation axis EX). The controller 4 may perform the operation of generating the intensity distribution information after performing the operation of changing the ellipticity of the machining light by the optical rotation system 1213. The control device 4 may control the ellipticity of the processing light EL based on the intensity distribution information obtained in the generating operation.

(2-3-2) action of generating traveling direction information

Next, an operation of generating traveling direction information relating to the traveling direction of the processing light EL (i.e., the direction in which the irradiation axis EX extends) will be described. To generate the traveling direction information, the machining system SYS measures the machining light EL using the measuring device 36.

Specifically, as shown in fig. 36, which is a sectional view showing a measuring device 36 that measures the processing light EL, the control device 4 moves the stage 32 (that is, moves the rotating device 35 on which the measuring device 36 is disposed) so that the measuring device 36 can measure the processing light EL (that is, so that the light receiving element 362 can receive the processing light EL) while the processing light EL is emitted from the processing head 12. In this case, the machining head 12 may deflect the machining light EL without using the galvanometer mirror 1214. Control device 4 acquires information on the position of stage 32 (i.e., the position of measuring device 36) when measuring processing light EL by measuring device 36 from position measuring device 34.

Subsequently, the control device 4 moves the stage 32 in the direction along the irradiation axis EX (i.e., the Z-axis direction) assuming that the traveling direction of the processing light EL as the measurement object is the direction along the Z-axis (i.e., the irradiation axis EX is along the Z-axis). That is, the control device 4 moves the measuring device 36 in a direction along the irradiation axis EX (i.e., the Z-axis direction). In addition, the control device 4 may move the machining head 12 in the Z-axis direction instead of or in addition to moving the stage 32 in the Z-axis direction. As a result, the measuring device 36 measures the processing light EL again from a position different from the position where the processing light EL was measured last in the direction along the irradiation axis EX (i.e., the Z-axis direction). That is, the measuring device 36 measures the processing light EL at a first position in the direction along the irradiation axis EX (i.e., the Z-axis direction), and measures the processing light EL at a second position different from the first position in the direction along the irradiation axis EX (i.e., the Z-axis direction). At this time, when the traveling direction of the processing light EL to be measured is actually the direction along the Z axis, the measuring device 36 can measure the processing light EL even if the measuring device 36 moves in the direction along the irradiation axis EX (i.e., the Z axis direction). On the other hand, as shown in fig. 37 which is a sectional view showing the measuring device 36 which measures the processing light EL, when the traveling direction of the processing light EL to be measured is not actually along the Z-axis direction (that is, the traveling direction of the processing light EL is inclined with respect to the Z-axis), the measuring device 36 may not measure the processing light EL only by moving the measuring device 36 in the direction along the irradiation axis EX (that is, the Z-axis direction). Therefore, as shown in fig. 38, which is a cross-sectional view showing measurement device 36 that measures processing light EL, control device 4 may move stage 32 in a direction (for example, at least one of the X-axis direction and the Y-axis direction) intersecting irradiation axis EX in addition to the direction along irradiation axis EX (i.e., the Z-axis direction) so that measurement device 36 can measure processing light EL (i.e., so that light receiving element 362 can receive processing light EL). Control device 4 acquires information on the position of stage 32 (i.e., the position of measuring device 36) when measuring processing light EL by measuring device 36 from position measuring device 34.

Subsequently, the control device 4 generates traveling direction information on the traveling direction of the processing light EL based on the information on the position of the measuring device 36 when the measuring device 36 measures the processing light EL. Specifically, the control device 4 generates the traveling direction information based on information on the position of the measuring device 36 (hereinafter referred to as "first measurement position") when the measuring device 36 measures the processing light EL before the measuring device 36 is moved in the direction along the irradiation axis EX (i.e., the Z-axis direction) and information on the position of the measuring device 36 (hereinafter referred to as "second measurement position") when the measuring device 36 measures the processing light EL after the measuring device 36 is moved in the direction along the irradiation axis EX (i.e., the Z-axis direction). For example, the control device 4 may generate the traveling direction information based on the first measurement position and the second measurement position in the direction intersecting the irradiation axis EX (for example, at least one of the X-axis direction and the Y-axis direction). Specifically, when the first measurement position and the second measurement position are at the same position in the direction intersecting the irradiation axis EX (for example, at least one of the X-axis direction and the Y-axis direction), the traveling direction of the processing light EL can be estimated to be the direction along the Z-axis. On the other hand, when the first measurement position and the second measurement position are at different positions in a direction intersecting the irradiation axis EX (for example, at least one of the X-axis direction and the Y-axis direction), the traveling direction of the processing light EL can be estimated to be a direction inclined with respect to the Z-axis. At this time, the inclination amount of the traveling direction of the processing light EL with respect to the Z axis can be calculated from the distance between the first measurement position and the second measurement position in the direction intersecting the irradiation axis EX (for example, at least one of the X axis direction and the Y axis direction), and the distance between the first measurement position and the second measurement position in the direction along the irradiation axis EX (that is, the Z axis direction). In this way, the control device 4 generates the traveling direction information.

The generated traveling direction information may be referred to by the control device 4 for performing the machining operation. That is, the traveling direction information may be referred to by the control device 4 during a processing period in which the workpiece W is processed by irradiating the processing light EL to the workpiece W. For example, the control device 4 may control at least one of the irradiation position of the processing light EL and the traveling direction of the processing light EL based on the traveling direction information so as to irradiate the desired position of the workpiece W with the processing light EL. At this time, the control device 4 may control at least one of the irradiation position of the processing light EL and the traveling direction of the processing light EL by controlling the galvanometer mirror 1214. In addition, in order to control the irradiation position of the processing light EL and the traveling direction of the processing light EL, a device disclosed in U.S. patent application publication No. 2018/0169788 may be used as the galvanometer mirror 1214. In addition, in order for the control device 4 to refer to the traveling direction information during the processing period in which the processing light EL is irradiated to the workpiece W to process the workpiece W, the operation of generating the traveling direction information may be performed prior to the processing operation.

(2-3-3) action of generating passing position information

Next, an operation of generating passage position information regarding a position at which the processing light EL passes within a plane intersecting the traveling direction of the processing light EL will be described. In order to generate the passing position information, the machining system SYS measures the machining light EL using the measuring device 36.

Specifically, as shown in fig. 39, which is a cross-sectional view showing the measuring device 36 for measuring the machining light EL, the control device 4 controls the machining head 12 so that the irradiation position of the machining head 12 with the machining light EL is set to a plurality of positions. At this time, the control device 4 may change the irradiation position of the machining head 12 with the machining light EL by deflecting the machining light EL using the galvanometer mirror 1214, for example. For example, the control device 4 may control the machining head 12 so that the irradiation position of the machining light EL with respect to the machining head 12 is set to the first irradiation position IP #1. While the irradiation position of the machining head 12 with the machining light EL is at the first irradiation position IP #1, the measuring device 36 measures the machining light EL. Control device 4 acquires information on the position of stage 32 (i.e., the position of measuring device 36) when measuring device 36 measures processing light EL irradiated to first irradiation position IP #1, from position measuring device 34. Subsequently, the control device 4 may also control the processing head 12 to set the irradiation position of the processing light EL to the processing head 12 to the second irradiation position IP #2. The second irradiation position IP #2 is different from the first irradiation position IP #1, for example, in a direction along a plane (for example, a plane along the XY plane) intersecting with the traveling direction of the processing light EL. While the irradiation position of the machining head 12 with the machining light EL is at the second irradiation position IP #2, the measuring device 36 measures the machining light EL. Control device 4 acquires information on the position of stage 32 (i.e., the position of measuring device 36) when measuring device 36 measures processing light EL irradiated to second irradiation position IP #2, from position measuring device 34.

The measuring device 36 may also measure the processing light EL irradiated to a plurality of irradiation positions via a plurality of markers 366. For example, the measuring device 36 may also measure the processing light EL irradiated to the first irradiation position IP #1 via the first mark 366 (e.g., mark 366#1 in fig. 39). For example, the measuring device 36 may also measure the processing light EL irradiated to the second irradiation position IP #2 via the second mark 366 (e.g., mark 366#2 in fig. 39). In this case, the measuring device 36 may not move in a plane (for example, a plane along the XY plane) intersecting the traveling direction of the processing light EL during the period of measuring the processing light EL irradiated to the plurality of irradiation positions. However, the measuring device 36 may move in a plane (for example, a plane along the XY plane) intersecting the traveling direction of the processing light EL at least a part of the period during which the processing light EL irradiated to the plurality of irradiation positions is measured.

Alternatively, the measuring device 36 may measure the processing light EL irradiated to a plurality of irradiation positions via a single mark 366. For example, control device 4 may also move stage 32 (i.e., measurement device 36) to the first stage position so that mark 366 is located at first irradiation position IP #1. While the marker 366 is located at the first irradiation position IP #1, the measuring device 366 measures the processing light EL irradiated to the first irradiation position IP #1 via the marker 366. Subsequently, the control device 4 may also move the stage 32 (i.e., the measurement device 36) to a second stage position different from the first stage position so that the mark 366 is located at the second irradiation position IP #2. While the marker 366 is located at the second irradiation position IP #2, the measuring device 366 measures the processing light EL irradiated to the second irradiation position IP #2 via the marker 366.

Subsequently, the control device 4 generates passing position information regarding a position at which the processing light EL passes within a plane intersecting the traveling direction of the processing light EL, based on information regarding the position of the measuring device 36 when the processing light EL is measured by the measuring device 36. The generated passing position information may be referred to by the control device 4 for performing the machining operation. That is, the pass-position information may be referred to by the control device 4 during a machining period in which the workpiece W is machined by irradiating the machining light EL to the workpiece W. For example, the control device 4 may control at least one of the irradiation position of the processing light EL and the traveling direction of the processing light EL based on the passing position information so as to irradiate the desired position of the workpiece W with the processing light EL. At this time, the control device 4 may control at least one of the irradiation position of the processing light EL and the traveling direction of the processing light EL by controlling the galvanometer mirror 1214. In addition, in order for the control device 4 to refer to the passing position information during the processing period in which the processing light EL is irradiated to the workpiece W to process the workpiece W, the operation of generating the passing position information may be performed prior to the processing operation.

When the plurality of markers 366 are used to measure the processing light EL irradiated to the plurality of irradiation positions, the positional relationship between the plurality of markers 366 and the rotation axis 3522 may be in a predetermined relationship. That is, the relative positional relationship between the plurality of markers 366 and the rotary shaft 3522 may be known information to the control device 4. At this time, the control device 4 can determine the relationship between the rotation axis 3522 and the irradiation position of the processing light EL based on the passing position information and the information on the relative positional relationship between the plurality of markers 366 and the rotation axis 3522. As a result, the controller 4 can irradiate the processing light EL to a desired position of the workpiece W rotating around the rotation shaft 3522.

As described above, in the case where a single mark 366 is used for measuring the processing light EL irradiated to a plurality of irradiation positions, the stage 32 moves. At this time, the moving surface of stage 32 (i.e., the surface of stage 32 that intersects the traveling direction of processing light EL) and rotation axis 3522 may have a predetermined relationship. That is, the relative positional relationship between the moving surface of the stage 32 and the rotation axis 3522 may be known information to the control device 4. At this time, the controller 4 can determine the relationship between the rotation axis 3522 and the irradiation position of the processing light EL based on the passing position information and the information on the relative positional relationship between the moving surface of the stage 32 and the rotation axis 3522. As a result, the controller 4 can irradiate the processing light EL to a desired position of the workpiece W rotating around the rotation shaft 3522.

(2-4) origin information generating operation

Next, an origin information operation for generating origin information about the machining origin PO of the machining device 1 and the measurement origin MO of the measurement device 2 using the measurement device 36 will be described. The origin information may also contain information relating to the distance between the machining origin PO and the measurement origin MO. The origin information may include information relating to a distance between a device origin AO (for example, an origin of a stage coordinate system used to control the position of stage 32) of machining system SYS and a machining origin PO. The origin information may also contain information relating to the distance between the device origin AO and the measurement origin MO. The machining origin PO corresponds to the position of the stage 32 when the center of the machining emission area PSA coincides with a reference position (e.g., center) of the stage 32 and the condensed position of the machining light EL coincides with the surface of the stage 32. The measurement origin MO corresponds to the position of the stage 32 when the center of the measurement emission area MSA coincides with a reference position (e.g., center) of the stage 32 and the condensed position of the measurement light ML coincides with the surface of the stage 32.

In the following description, the distance between the machining origin PO and the measurement origin MO is referred to as "relative baseline BLrlt", the distance between the device origin AO and the machining origin PO is referred to as "machining baseline BLprc", and the distance between the device origin AO and the measurement origin MO is referred to as "measurement baseline BLmsr". An example of the relative baseline BLrlt, the processed baseline BLprc, and the measured baseline BLmsr is shown in fig. 40 (a) and 40 (b). As shown in fig. 40 (a) and 40 (b), the relative baseline BLrlt may include at least one of a component Δ Xrlt corresponding to the distance between the processing origin PO and the measurement origin PO in the X-axis direction, a component Δ Yrlt corresponding to the distance between the processing origin PO and the measurement origin PO in the Y-axis direction, and a component Δ Zrlt corresponding to the distance between the processing origin PO and the measurement origin PO in the Z-axis direction. The machining baseline BLprc may include at least one of a component Δ Xprc corresponding to a distance between the device origin AO and the machining origin PO in the X-axis direction, a component Δ Yprc corresponding to a distance between the device origin AO and the machining origin PO in the Y-axis direction, and a component Δ Zprc corresponding to a distance between the device origin AO and the machining origin PO in the Z-axis direction. The measurement baseline BLmsr may also include at least one of a component Δ Xmsr corresponding to a distance between the device origin AO and the measurement origin MO in the X-axis direction, a component Δ Ymsr corresponding to a distance between the device origin AO and the measurement origin MO in the Y-axis direction, and a component Δ Zmsr corresponding to a distance between the device origin AO and the measurement origin MO in the Z-axis direction.

The control device 4 may also set a device origin AO for generating origin information. However, when the origin information does not include information related to the device origin AO, the control device 4 may not set the device origin AO. In order to set the apparatus origin AO, the control apparatus 4 controls the measurement head 21 to measure a reference mark formed on the rotation apparatus 35 (or other member such as the stage 32) in order to define the apparatus origin AO. In the present embodiment, the device origin AO is set at a position having a predetermined positional relationship with respect to the reference mark. At this time, the control device 4 acquires information on the position of the stage 32 when the measuring head 21 measures the reference mark from the position measuring device 34. Subsequently, the control device 4 may set a position having a predetermined positional relationship with the acquired position of the stage 32 as the device origin AO.

Subsequently, the controller 4 calculates the respective positions of the machining origin PO and the measurement origin MO.

In order to calculate the position of the measurement origin MO, the control device 4 obtains the measurement result of the measurement head 21 for the marker 366. Specifically, the control device 4 controls the stage drive system 33 to move the stage 32 in each of the X-axis direction and the Y-axis direction so that the reference (for example, a mark 366) of the measurement device 36 is positioned at the center of the measurement emission area MSA (that is, the measurement device 36 is moved). Further, the control device 4 moves the stage 32 in the Z-axis direction so that the condensing position of the measurement light ML coincides with the surface of the rotating device 35 (specifically, the surface of the measurement device 36 disposed on the rotating device 35). At this time, the control device 4 may move the measuring head 21 by controlling the head driving system 22, or may not move the measuring head 21. Subsequently, the measuring head 21 measures the mark 366. Further, the control device 4 acquires the position of the stage 32 (i.e., the position of the measurement device 36) at the time point when the measurement head 21 measures the mark 366 from the position measurement device 34. Here, the acquired position of the stage 32 corresponds to the position of the measurement origin MO. Therefore, control device 4 can calculate the distance between the position of stage 32 and apparatus origin AO at the time point when measurement head 21 measures mark 366, and can calculate measurement baseline BLmsr based on the calculated distance. The control device 4 can calculate the distance between the position of the stage 32 at the time when the measurement head 21 measures the mark 366 and the machining origin PO whose position is calculated by a method described later, and can calculate the relative base line BLrlt based on the calculated distance.

After calculating at least one of the relative base line BLrlt and the measurement base line BLmsr, the control device 4 may move at least one of the stage 32 and the measurement head 21 based on at least one of the relative base line BLrlt and the measurement base line BLmsr while the measurement head 21 is measuring the workpiece W or the like. That is, the controller 4 may control the position of at least one of the stage 32 and the measuring head 21 based on at least one of the relative base line BLrlt and the measurement base line BLmsr while the measuring head 21 is measuring the workpiece W or the like. As a result, the measurement transmission area MSA can be set at an appropriate position in the stage coordinate system with reference to the apparatus origin AO. That is, the machining system SYSa can appropriately machine the workpiece W based on the appropriate measurement result of the workpiece W by the measurement device 2.

Then, in order to calculate the position of the machining origin PO, the control device 4 acquires the measurement result (i.e., machining light measurement information) of the machining light EL that has passed through the passage region 365 constituting the marker 366 by the measurement device 36. Specifically, the control device 4 controls the stage drive system 33 to move the stage 32 in each of the X-axis direction and the Y-axis direction so that the reference (for example, a mark 366) of the measurement device 36 is positioned at the center of the machining emission area PSA (that is, the measurement device 36 is moved). Further, the control device 4 moves the stage 32 in the Z-axis direction so that the condensed position of the processing light EL coincides with the surface of the rotating device 35 (specifically, the surface of the measuring device 36 disposed on the rotating device 35). At this time, the control device 4 may move the machining head 12 by controlling the head driving system 13, or may not move the machining head 12. Subsequently, the processing head 12 irradiates the mark 366 with the processing light EL. As a result, the light receiving element 362 receives the processing light EL via the pass region 365 constituting the mark 366. Control device 4 acquires the position of stage 32 (i.e., the position of measuring device 36) at the time when light-receiving element 362 receives processing light EL from position measuring device 34. The position of the stage 32 acquired here corresponds to the position of the machining origin PO. Therefore, control device 4 can calculate the distance between the position of stage 32 and apparatus origin AO at the time point when light-receiving element 362 receives processing light EL via mark 366, and can calculate processing baseline BLprc based on the calculated distance. The control device 4 can calculate the distance between the position of the stage 32 at the time when the light receiving element 362 receives the processing light EL via the mark 366 and the measurement origin MO whose position is calculated by the above-described method, and can calculate the relative base line BLrlt based on the calculated distance.

After calculating at least one of the relative baseline BLrlt and the machining baseline BLprc, the control device 4 may move at least one of the stage 32 and the machining head 12 based on at least one of the relative baseline BLrlt and the machining baseline BLprc while the machining head 12 is machining the workpiece W or the like. That is, the controller 4 may control the position of at least one of the stage 32 and the processing head 12 based on at least one of the relative baseline BLrlt and the processing baseline BLprc while the processing head 12 is processing the workpiece W or the like. As a result, the machining transmission area PSA can be set at an appropriate position in the stage coordinate system with reference to the apparatus origin AO. That is, the machining system SYSa can appropriately machine the workpiece W.

(3) Technical effect of processing system SYS

The machining system SYS described above can appropriately machine the workpiece W using the machining light EL. Further, the machining system SYS can appropriately measure the workpiece W using the measurement light ML.

In particular, the machining system SYS can generate the rotation axis information using the measurement light ML and machine the workpiece W based on the rotation axis information. Therefore, the machining system SYS can appropriately machine the workpiece W held so as to rotate, as compared with a case where the workpiece W is machined without using the rotation axis information.

Further, the machining system SYS can generate the optical state information using the measuring device 36 and machine the workpiece W based on the optical state information. Therefore, the processing system SYS can appropriately process the workpiece W using the processing light EL, as compared with a case where the workpiece W is processed without using the light state information.

Further, the machining system SYS can generate the above-described origin information using the measuring device 36, and machine the workpiece W based on the origin information. Therefore, the processing system SYS can appropriately process the workpiece W using the processing light EL, as compared with a case where the workpiece W is processed without using the origin information.

(4) Modification example

Next, a modified example of the machining system SYS will be described.

(4-1) first modification

First, a machining system SYS according to a first modification (hereinafter, the machining system SYS according to the first modification is referred to as a "machining system SYSa") will be described with reference to fig. 41. Fig. 41 is a perspective view schematically showing an external appearance of a machining system SYSa according to a first modification.

As shown in fig. 41, the machining system SYSa of the first modification differs from the machining system SYS in which the measurement axis MX is parallel to the irradiation axis EX in that the measurement axis MX of the measuring head 21 intersects the irradiation axis EX along the traveling direction of the machining light EL. In the example shown in fig. 41, the irradiation axis EX is parallel to the Z axis, but the irradiation axis EX may be inclined with respect to the Z axis. Further, in the example shown in fig. 41, the measurement axis MX is inclined with respect to the Z axis, but the measurement axis EX may be parallel to the Z axis. Other features of the processing system SYSa may be the same as those of the processing system SYS.

(4-2) second modification

Next, a machining system SYS according to a second modification (hereinafter, the machining system SYS according to the second modification will be referred to as "machining system SYSb") will be described with reference to fig. 42. Fig. 42 is a perspective view schematically showing an appearance of a machining system SYSb according to a second modification.

As shown in fig. 42, the machining system SYSb of the second modification differs from the machining system SYS in which the measurement axis MX does not coincide with the irradiation axis EX in that the measurement axis MX of the measurement head 21 coincides with the irradiation axis EX along the traveling direction of the machining light EL. In this case, as shown in fig. 43, which is a system configuration diagram illustrating a system configuration of a machining system SYSb according to a second modification, the machining system SYSb is different from the machining system SYS in that a machining device 1b is included instead of the machining device 1. Further, the machining system SYSb differs from the machining system SYS in that the measuring device 2 may not be included. Other features of the processing system SYSb may also be the same as the processing system SYS. The machining device 1b is different from the machining device 1 in that a machining head 12b is included instead of the machining head 12. Other features of the processing device 1b may be the same as those of the processing device 1. The processing head 12b is different from the processing head 12 in that an irradiation optical system 121b is included instead of the irradiation optical system 121. Further, the processing head 12b is different from the processing head 12 in that a three-dimensional measuring device 211 is included. Other features of the machining head 12b may also be the same as the machining head 12.

The structure of the illumination optical system 121b is shown in fig. 44. As shown in fig. 44, the illumination optical system 121b includes a synthesizing optical system 1216b, as compared with the illumination optical system 121. Other features of the illumination optical system 121b may also be the same as the illumination optical system 121. The combining optical system 1216c combines the processing light EL having passed through the light-collecting position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the optical rotation optical system 1213 with the measuring light ML from the three-dimensional measuring device 211. For example, to combine the process light EL with the measurement light ML, the combining optical system 1216b may also include a polarization beam splitter. Either one of the processing light EL and the measurement light ML incident to the polarization beam splitter may also be reflected by the polarization separation plane of the polarization beam splitter. The other of the processing light EL and the measurement light ML incident on the polarization beam splitter may also pass through the polarization separation plane of the polarization beam splitter. As a result, the polarization beam splitter emits the processing light EL and the measurement light ML, which are incident on the polarization beam splitter from different directions, in the same direction (specifically, toward the galvanometer mirror 1214). Therefore, the irradiation axis EX of the processing light EL coincides with the measurement axis MX of the measurement light ML. Here, the irradiation axis EX of the processing light EL and the measurement axis MX of the measurement light ML may not coincide with each other (that is, may be in a relationship parallel to each other and slightly laterally offset). Further, the synthesis and separation of the processing light EL and the measurement light ML may also be performed using a dichroic mirror instead of the polarization beam splitter. In this case, the processing light EL and the measurement light ML may have different wavelengths.

In addition, the processing system SYSb may also include the measuring device 2.

(4-3) third modification

Next, a machining system SYS according to a third modification (hereinafter, the machining system SYS according to the third modification is referred to as a "machining system SYSc") will be described with reference to fig. 45. Fig. 45 is a perspective view schematically showing an appearance of a machining system SYSc according to a third modification.

As shown in fig. 45, a machining system SYSc according to the third modification is different from the machining system SYS in which the rotation shaft 3521 extends in a direction intersecting the direction of gravitational force, in that the rotation shaft 3521 extends in the direction of gravitational force. The machining system SYSc is different from the machining system SYS in which the rotation shaft 3522 extends in a direction intersecting the direction of gravity in that the rotation shaft 3522 extends in the direction of gravity. Other features of the processing system SYSa may be the same as those of the processing system SYS.

(4-4) other modifications

In the above description, the machining system SYS machines the workpiece W by irradiating the workpiece W with the machining light EL. However, the machining system SYS may machine the workpiece W by irradiating the workpiece W with an arbitrary energy beam. In this case, the processing system SYS may include a beam source capable of irradiating an arbitrary energy beam in addition to or instead of the processing light source 11. As an example of the arbitrary energy beam, at least one of a charged particle beam and an electromagnetic wave can be cited. As an example of the charged particle beam, at least one of an electron beam and a focused ion beam can be cited.

The elements of the above embodiments can be combined as appropriate. Some of the elements of the embodiments described above may not be used. The requirements of the embodiments described above can be appropriately replaced with the requirements of the other embodiments. Further, all publications and U.S. patent publications relating to devices and the like cited in the above-described embodiments are incorporated by reference to the extent allowed by law as a part of the present disclosure.

The present invention can be modified as appropriate within a scope not departing from the spirit or scope of the present invention that can be read from the claims and the entire specification, and a processing system accompanied by the modification is also included in the technical idea of the present invention.

Description of the symbols

1: processing device

11: machining head

2: measuring device

3: carrying platform device

32: carrying platform

35: rotating device

3521: rotating shaft

3522: rotating shaft

36: measuring device

361: beam passing member

362: light receiving element

363: opening of the container

364: attenuation region

365: passing area

366: marking

EL: working light

ML: measuring light

W: workpiece

SYS: machining system

Claims

1. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device for rotating the holding device;

a beam irradiation device that irradiates the object held by the holding device with an energy beam;

an object measuring device that measures the object; and

a control device that controls at least one of the beam irradiation device and the rotation device based on information on the object measured by the object measurement device and information on a rotation axis of the rotation device,

processing the object by irradiating an energy beam from the beam irradiation device to the object held by the holding device.

2. The processing system of claim 1, wherein

The control device controls at least one of the beam irradiation device and the rotation device based on a deviation of the rotation axis from the object.

3. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object; and

a control device that controls at least one of the beam irradiation device and the rotation device based on the deviation of the object from the rotation axis of the rotation device measured by the object measurement device,

4. A processing system according to any of claims 1 to 3, wherein

The control device controls at least one of the beam irradiation device and the rotation device based on an angular relationship between the rotation axis and a central axis of the object.

5. A processing system according to any of claims 1 to 4, wherein

The control device controls at least one of the beam irradiation device and the rotation device based on a positional relationship between the rotation axis and a central axis of the object.

6. A processing system according to any of claims 1 to 5, wherein

The control device controls an irradiation position at which the beam irradiation device irradiates the energy beam, based on a deviation of the rotation axis from the object.

7. The processing system of claim 6, wherein

The control device changes an irradiation position at which the beam irradiation device irradiates the energy beam to a direction intersecting the rotation axis based on a deviation of the rotation axis from the object.

8. A processing system according to claim 6 or 7, wherein

The beam irradiation device includes a beam irradiation position changing device that changes the irradiation position of the energy beam with respect to the beam irradiation device.

9. A processing system according to any of claims 1 to 8, wherein

The beam irradiation device irradiates the energy beam from a direction intersecting with a normal line at an irradiation position on a surface of the object.

10. The processing system of claim 9, wherein

An angle formed by an irradiation axis along a traveling direction of the energy beam irradiated to the irradiation position and the normal line is 60 degrees or more.

11. A processing system according to claim 9 or 10, wherein

The irradiation position of the energy beam can be changed in a direction intersecting the rotation axis.

12. A processing system according to any of claims 1 to 11, wherein

With respect to the irradiation position of the energy beam in a first period in which the energy beam is irradiated to the object by the beam irradiation device, the irradiation position in a second period after the first period is close to the rotation axis.

13. The processing system according to any one of claims 1 to 12, comprising:

and a beam collector provided on the opposite side of the irradiation position from the beam irradiation device, and irradiated with the energy beam.

14. The processing system of claim 13, wherein

The beam dump includes an illumination face to which the energy beam is illuminated,

the irradiation surface is inclined with respect to an irradiation axis along a traveling direction of the energy beam.

15. The processing system of claim 14, wherein

The angle formed by the irradiation surface and the irradiation axis is an acute angle.

16. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object; and

a control device that controls at least one of the beam irradiation device and the rotation device based on information on the object measured by the object measurement device and information on at least one of a position and an orientation of the rotation device,

17. The processing system of claim 16, wherein

The object measurement device obtains information of at least one of a position and a posture of the rotating device.

18. The processing system of claim 17, further comprising:

and a beam measuring device provided in the rotating device, for measuring the energy beam from the beam irradiating device.

19. The processing system of claim 18, wherein

The object measurement device measures at least one of a position and an attitude of the beam measurement device.

20. The processing system of any of claims 1 to 19, further comprising:

a beam measuring device that measures the energy beam from the beam irradiation device.

21. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device that rotates the holding device;

a beam measuring device that measures the energy beam from the beam irradiation device; and

a control device that controls the beam irradiation device based on information related to the energy beam measured by the beam measuring device,

22. A processing system according to claim 20 or 21, wherein

The beam measuring device measures an intensity distribution in an angular direction with respect to an irradiation axis along a direction in which the energy beam travels.

23. The processing system of claim 22, wherein

The control device controls the irradiation position of the energy beam based on the measurement result of the beam measuring device.

24. A processing system according to claim 22 or 23, wherein

The control means controls the direction in which the energy beam travels based on the measurement result of the beam measurement means.

25. A processing system according to claim 23 or 24, wherein

The beam irradiation device includes a beam irradiation state changing device that changes at least one of the irradiation position of the energy beam with respect to the beam irradiation device and a traveling direction of the energy beam from the beam irradiation device.

26. A processing system according to any of claims 22 to 25, wherein

The beam irradiation device includes an aperture angle changing device that changes an aperture angle of the energy beam,

the control device controls the aperture angle based on the measurement result of the beam measuring device.

27. The processing system of claim 23, wherein

When the aperture angle changing device is set to a first aperture angle changing device, the beam irradiation device includes a second aperture angle changing device that changes at least one of a first aperture angle of the energy beam on a first plane including an irradiation axis along a traveling direction of the energy beam and a second aperture angle of the energy beam on a second plane including the irradiation axis and intersecting the first plane,

the control device controls at least one of the first aperture angle and the second aperture angle based on a measurement result of the beam measurement device.

28. A processing system according to any of claims 20 to 27, wherein

The beam irradiation apparatus includes: a condensing optical system that condenses the energy beam; and a beam rotating member that changes a direction in which a maximum value among diameters of beam profiles on an entrance pupil of the condensing optical system is taken, around an optical axis of the condensing optical system.

29. A processing system according to any one of claims 20 to 28, wherein

The beam measuring device measures the energy beam at a first position in a direction in which the energy beam travels, and measures the energy beam at a second position different from the first position in the direction of travel.

30. A processing system according to any of claims 20 to 29, wherein

The beam measuring device measures the energy beam at a first position in a direction in which the energy beam travels,

in the direction of travel, the first position is different from a spot position at which the energy beam is condensed.

31. A processing system according to any of claims 20 to 30, wherein

The beam measuring device measures a direction in which the energy beam travels.

32. The processing system of claim 31, wherein

The beam measuring device measures the energy beam at a first position in a direction in which the energy beam travels, measures the energy beam at a second position different from the first position in the direction of travel,

measuring a direction traveled by the energy beam based on the first and second locations in a direction that intersects the direction traveled by the energy beam.

33. A processing system according to claim 31 or 32, wherein

Controlling an irradiation position of the energy beam based on a direction in which the energy beam travels measured by the beam measuring device.

34. A processing system according to any one of claims 31 to 33, wherein

Controlling a direction in which the energy beam travels based on the direction in which the energy beam travels measured by the beam measuring device.

35. A processing system according to any of claims 20 to 34, wherein

The beam measuring device measures a position at which the energy beam passes within a plane that intersects a direction in which the energy beam travels.

36. A processing system according to any of claims 20 to 35, wherein

The beam measuring device measures the energy beam when an irradiation position of the energy beam with respect to the beam irradiation device is set to a first position, and measures the energy beam when the irradiation position of the energy beam with respect to the beam irradiation device is set to a second position different from the first position.

37. The processing system of claim 36, wherein

The beam measuring device includes: a first beam passing portion provided in an attenuation region that attenuates the energy beam; and a second beam passing portion provided in the attenuation region and different from the first beam passing portion,

the positional relationship between the first beam passage portion and the second beam passage portion is in a predetermined relationship with the rotation axis.

38. The processing system of claim 37, wherein

The beam measuring device receives the energy beam having passed through the first beam passing portion while setting an irradiation position of the energy beam to the first position,

the beam measuring device receives the energy beam having passed through the second beam passing portion while setting the irradiation position of the energy beam to the second position.

39. A processing system according to claim 36 or 37, wherein

The rotating device is provided on a moving stage that is movable along a plane intersecting with a traveling direction of the energy beam.

40. A tooling system according to claim 36, wherein

The beam measuring device includes a beam passing portion provided in an attenuation region that attenuates the energy beam,

the relationship between the rotation axis of the rotation device and the intersecting surface on which the movable stage moves is defined.

41. A tooling system according to claim 40, wherein

The beam measuring device receives the energy beam that has passed through the beam passing portion when the moving stage is at a first stage position,

the beam measuring device receives the energy beam that has passed through the beam passing portion when the moving stage is at a second stage position different from the first stage position.

42. A processing system according to any of claims 20 to 41, wherein

the beam passage portion and the rotating device are in a predetermined positional relationship.

43. A processing system according to any one of claims 1 to 42, wherein

An irradiation axis along a direction in which the energy beam from the beam irradiation device travels does not coincide with a measurement axis of the object measurement device.

44. The processing system of claim 43, wherein

The illumination axis is parallel to the measurement axis.

45. The processing system of claim 43, wherein

The illumination axis intersects the measurement axis.

46. A processing system according to any one of claims 1 to 42, wherein

An irradiation axis along a direction in which the energy beam from the beam irradiation device travels coincides with a measurement axis of the object measurement device.

47. A processing system according to any one of claims 1 to 46, wherein

The object measuring device performs three-dimensional measurement on the surface of the object.

48. A processing system according to any one of claims 1 to 47, wherein

The control device controls the rotating device so as to rotate the object after the object is measured by the object measuring device,

the object measuring device measures the object rotated by the rotating device.

49. The processing system of claim 48, wherein

The measurement range on the object rotated by the rotating means partially overlaps with the measurement range on the object before rotation by the rotating means.

50. A processing system according to any one of claims 1 to 47, wherein

The object measuring device measures the object being rotated by the rotating device.

51. The processing system of any of claims 1 to 50, further comprising:

a moving device that moves at least one of the beam irradiation device and the beam measuring device,

the control device moves at least one of the beam irradiation device and the beam measurement device so that the beam measurement device can measure the energy beam from the beam irradiation device, and

moving at least one of the beam irradiation device and the beam measurement device to enable measurement of at least a portion of the beam measurement device by the object measurement device.

52. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object;

a beam measuring device that measures the energy beam from the beam irradiation device;

a moving device that moves at least one of the beam irradiation device and the beam measurement device; and

a control device that controls at least the moving device,

the control device moves at least one of the beam irradiation device and the beam measurement device so as to be in a position where the beam measurement device can measure the energy beam from the beam irradiation device, and

moving at least one of the beam irradiation device and the beam measurement device to be in a position where at least a portion of the beam measurement device can be measured by the object measurement device.

53. A tooling system according to claim 51 or 52, wherein

The control device controls the moving device based on first information relating to a position of at least one of the beam irradiation device and the beam measurement device when the beam measurement device measures the energy beam from the beam irradiation device, and second information relating to a position of at least one of the beam irradiation device and the beam measurement device when at least a part of the beam measurement device is measured by the object measurement device.

54. The processing system of any of claims 1 to 53, further comprising:

a moving device that moves at least one of a position of the beam irradiation device and a position of the beam measuring device; and

an acquisition device that acquires information relating to at least one of a position of the beam irradiation device and a position of the beam measurement device,

the control device moves at least one of the beam irradiation device and the beam measuring device to an irradiatable position where the beam irradiation device can irradiate the energy beam on at least a part of the beam measuring device,

using the acquisition means to acquire irradiation position information on at least one of the position of the beam irradiation means and the position of the beam measurement means that have been moved to the irradiatable position, and

controlling at least one of a position of the beam irradiation device and a position of the beam measurement device based on the irradiation position information.

55. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object;

a moving device that moves at least one of the beam irradiation device and the beam measuring device;

an acquisition device that acquires information relating to at least one of a position of the beam irradiation device and a position of the beam measurement device; and

a control device that controls at least the moving device,

the control device moves at least one of the beam irradiation device and the beam measurement device to an irradiatable position where the beam irradiation device can irradiate at least a part of the beam measurement device with the energy beam,

56. The processing system of any of claims 1 to 55, further comprising:

the control device moves at least one of the beam irradiation device and the beam measuring device to a measurable position where the object measuring device can measure at least a portion of the beam measuring device,

using the acquisition means to acquire measurement position information relating to at least one of the position of the beam irradiation means and the position of the beam measurement means that have been moved to the measurable position, and

controlling at least one of a position of the beam irradiation device and a position of the beam measuring device based on the measurement position information.

57. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object;

a moving device that moves at least one of the beam irradiation device and the beam measurement device;

a control device that controls at least the moving device,

controlling at least one of a position of the beam irradiation device and a position of the beam measurement device based on the measurement position information.

58. A processing system according to any one of claims 1 to 57, wherein

The beam irradiation device irradiates the energy beam to the object measured by the object measurement device,

the object measuring device measures the object irradiated with the energy beam.

59. A processing system according to any one of claims 1 to 58, wherein

The beam irradiation means irradiates the energy beam to the object being rotated by the rotating means.

60. A processing system according to any one of claims 1 to 58, wherein

The rotating means rotates the object irradiated with the energy beam by the beam irradiating means,

the beam irradiation device irradiates the energy beam to the object rotated by the rotation device.

61. A processing system according to any one of claims 1 to 60, wherein

The beam irradiation device irradiates the energy beam from a direction intersecting with a rotation axis of the rotation device.

62. A processing system according to any one of claims 1 to 60, wherein

The beam irradiation device irradiates the energy beam from a direction twisted with respect to a rotation axis of the rotation device.

63. A processing system according to claim 61 or 62, wherein

An irradiation position at which the energy beam from the beam irradiation device is irradiated to the object is variable along a direction parallel to the rotation axis.

64. A processing system according to any one of claims 1 to 63, wherein

The holding means comprises a holding surface which is in contact with the object when holding the object,

the beam irradiation device irradiates the energy beam to a surface of the object intersecting a plane parallel to the holding plane.

65. The processing system of any one of claims 1 to 64, wherein

The beam irradiation means irradiates the energy beam to a surface of the object intersecting with a rotation axis of the rotation means.

66. The processing system of any of claims 1 to 65, further comprising:

a moving device that moves at least one of the beam irradiation device and the rotating device.

67. The processing system of any one of claims 1 to 64, wherein

68. The processing system of any one of claims 1 to 67, wherein

The rotation axis of the rotating means extends in a direction crossing the direction of gravity.

69. The processing system of any one of claims 1 to 67, wherein

The rotation axis of the rotation device extends in the direction of gravity.

70. The processing system of any one of claims 1 to 69, wherein

And performing laser lathing on the surface of the object using a laser beam as the energy beam while rotating the holding device by the rotating device.

71. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures a three-dimensional shape of a surface of the object; and

a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object measurement device,

72. The processing system of claim 71, wherein

The holding device is rotated by the rotating device, and the surface of the object is laser-lathed by the laser beam as the energy beam.

73. A processing system according to claim 71 or 72, wherein

The control device controls at least one of the beam irradiation device and the rotation device based on a deviation of the object from a rotation axis of the rotation device obtained from a measurement result of the object measurement device.

74. The processing system of claim 71, wherein

The surface of the object can be processed by the energy beam while relatively moving the object and the energy beam in a state where the rotation of the rotating device is stopped.

75. The processing system of claim 74, wherein

The relative movement is performed in parallel with the rotation axis of the rotating means.

76. A processing system, comprising:

a holding device that holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object; and

a control device that controls the beam irradiation device based on a measurement result of the object by the object measurement device,

the beam irradiation device changes an irradiation position of the energy beam on the surface of the object along the surface of the object while the beam irradiation device irradiates the energy beam on the object,

the control device controls the beam irradiation device based on a measurement result of the object including a processing trace produced by the energy beam.

77. The processing system of claim 76, wherein

The beam irradiation device changes the irradiation position on the surface of the first object in a first period in which the beam irradiation device irradiates the first object with the energy beam for processing the first object,

the control device controls the beam irradiation device based on a measurement result of the first object including a machining trace caused by the energy beam in a second period in which the beam irradiation device irradiates the energy beam to a second object as the object to machine the second object.

78. The processing system of claim 77, wherein

The control device generates direction information on a relationship between a direction in which the machining trace extends and a direction in which a rotation axis of the rotation device extends, based on a measurement result of the first object, and controls the beam irradiation device based on the direction information in the second period.

79. A processing system according to claim 77 or 78, wherein

The control device controls the beam irradiation device in the second period so that an irradiation position of the energy beam on the surface of the second object is moved along a direction in which the rotation axis extends.

80. The processing system of any one of claims 77 to 79, wherein

The beam irradiation device changes the irradiation position by using a beam deflection device capable of deflecting the energy beam,

the control device controls the beam deflecting device in the second period so that an irradiation position of the energy beam on the surface of the second object is moved along a direction in which the rotation axis extends.

81. The processing system of any one of claims 77 to 80, further comprising:

a moving device for moving the rotating device,

in the first period, the beam irradiation device processes a first region of the first object, the moving device moves the rotating device after the first region is processed, and the beam irradiation device processes a second region of the first object after the rotating device is moved,

the control device controls at least one of the beam irradiation device and the moving device based on a measurement result of the first object including a processing trace of each of the first region and the second region by the energy beam in the second period.

82. The processing system of claim 81, wherein

The control device generates positional relationship information relating to a relative positional relationship between a machining trace of the first region and a machining trace of the second region based on a measurement result of the first object, and controls at least one of the beam irradiation device and the moving device based on the positional relationship information during the second period.

83. A tooling system according to claim 81 or 82, wherein

The positional relationship information includes information relating to a direction along a line connecting the machining trace of the first region and the machining trace of the second region.

84. The processing system of claim 83, wherein

The control device controls at least one of the beam irradiation device and the moving device in the second period to move an irradiation position of the energy beam on the surface of the second object along a direction in which the rotation axis extends.

85. A processing system, comprising:

a holding device that holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object;

a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object by the object measurement device; and

a moving device for moving the rotating device,

the object measuring device measures the object each time the moving device moves the rotating device in a direction,

the control device controls at least one of the beam irradiation device and the moving device based on a measurement result of the object by the object measurement device during irradiation of the energy beam to the object by the beam irradiation device.

86. The processing system of claim 85, wherein

The control device generates direction information relating to a relationship between the one direction and a direction in which a rotation axis of the rotation device extends, based on a measurement result of the object, and controls at least one of the beam irradiation device and the moving device based on the direction information during the irradiation period.

87. The processing system of claim 85 or 86, wherein

The control device controls at least one of the beam irradiation device and the moving device during the irradiation period to move an irradiation position of the energy beam on the surface of the object along a direction in which the rotation axis extends.

88. The processing system of any one of claims 85 to 87, wherein

The object measuring device measures the first object as the object each time the moving device moves the rotating device in the one direction while the holding device holds the first object as the object,

the control device controls at least one of the beam irradiation device and the moving device based on a measurement result of the first object by the object measurement device in the irradiation period in which the beam irradiation device irradiates a second object as the object with the energy beam.

89. The processing system of claim 88, wherein

The control device generates, based on a measurement result of the first object, direction information relating to a relationship between the one direction and a direction in which a rotation axis of the rotation device extends, and controls at least one of the beam irradiation device and the moving device based on the direction information during the irradiation period.

90. The processing system of claim 88 or 89, wherein

The control device controls at least one of the beam irradiation device and the moving device during the irradiation period to move an irradiation position of the energy beam on the surface of the second object along a direction in which the rotation axis extends.

91. A processing system, comprising:

a holding device that holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object; and

a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object by the object measurement device,

the object measuring device measures the object every time the rotating device rotates the object by a prescribed rotation angle,

the control device controls the beam irradiation device based on a measurement result of the object by the object measurement device.

92. The processing system of claim 91, wherein

The object measuring device measures an end portion of the object located at an end in a first intersecting direction intersecting a rotation axis of the rotating device each time the rotating device rotates the object by the predetermined rotation angle,

the control device generates position information relating to a position of the end portion based on a measurement result of the object, and controls the beam irradiation device based on the position information.

93. The processing system of claim 91 or 92, wherein

The object measuring device measures the end portion at a first position on the object and at a second position on the object different from the first position in a direction along the rotation axis, each time the rotating device rotates the object by the predetermined rotation angle.

94. The processing system of claim 92 or 93, wherein

The position information contains information relating to a relationship between a position of the end portion in the first intersecting direction and a rotation angle of the object about the rotation axis.

95. The processing system of any one of claims 92 to 94, wherein

The position information includes information relating to a phase of a position of the end portion in the first intersecting direction with respect to an amount of change in the rotation angle.

96. The processing system of any one of claims 92 to 95, wherein

The control device controls the beam irradiation device to change the irradiation position of the energy beam along a second intersecting direction intersecting the rotation axis.

97. A processing system, comprising:

a holding device that holds an object;

a rotating device that rotates the holding device;

an object measuring device that measures the object;

and a beam measuring device provided in the rotating device and measuring the energy beam from the beam irradiation device.

98. The processing system of claim 97, wherein

The beam measuring device includes: a beam passing member having an attenuation region that attenuates the energy beam and a passing region that passes the energy beam; and a detection unit that detects the energy beam that has passed through the passage region.

99. The processing system of claim 97 or 98, further comprising:

a moving device for moving the rotating device,

the control device controls the position of the rotating device based on information on the position of the rotating device when the beam measuring device detects the energy beam and information on the position of the rotating device when the object measuring device measures at least a part of the beam measuring device.

100. A processing system, comprising:

a holding device that rotatably holds an object;

a rotating device for rotating the holding device;

an object measuring device that measures the object;

a changing device that changes an irradiation position of the energy beam irradiated onto the object; and

a control device that controls at least one of the rotating device and the changing device,

the control means controls the rotating means and the changing means to rotate the holding means and change the irradiation position based on information on the object measured by the object measuring means,

101. The processing system of claim 100, wherein

The beam irradiation device has the changing device.

102. The processing system of claim 101, wherein

The changing device changes the irradiation position with respect to the beam irradiation device.

103. The processing system of any of claims 100 to 102, wherein

In the processing of the object by the processing device, the holding device is rotated and the irradiation position is moved.

104. The processing system of any of claims 100 to 103, wherein

The rotating means rotates the holding means about a rotation axis,

the object is processed while the irradiation position is moved in a direction parallel to the rotation axis and in a direction intersecting the rotation axis by the changing device.