CN115484752A - Module pin welding equipment - Google Patents

Abstract

The invention provides a module pin welding device which comprises a supporting table, a workbench, a preheater, a material taking and placing device, a pressing device and a cleaner, wherein the working table is arranged on the workbench; the workbench comprises a supporting shaft, a working disc and a fixing part; the workbench rotates the fixed part to a first station, a second station, a third station and a fourth station through a support shaft respectively, and the first station is a position where the working disc rotates to the working range of the preheater; the second station is a position where the working disc rotates to the working range of the cleaner, a position where the taking and placing device places the substrate into the working range of the fixing part, and a position where the taking and placing device takes the module out of the working range; the third station is a position where the working disc rotates to a position where the pick-and-place device puts the pins into the working range of the fixing part; and the fourth station is a position in a working range in which the working disc rotates to the stitching device to weld and stitch the substrate and the pins. The module pin welding equipment is simple in structure and easy to assemble and produce.

Description

Module pin welding equipment

Technical Field

The invention relates to the technical field of welding equipment, in particular to module pin welding equipment.

Background

A module generally includes a substrate and pins soldered to the substrate. At present, a Power device Module in a Module, namely a Modular Intelligent Power System (MIPS), is a Power driving product combining Power electronics and integrated circuit technologies, and the process of welding pins has a great influence on assembly and production of the Module.

The pins are soldered in a module assembly production of the related art using a Surface Mount Technology (SMT) process. However, the SMT process has high requirements for the precision and high temperature resistance of the substrate carrier, which leads to an increase in the price of the substrate carrier and a reduction in the service life of the carrier, and the production of the module by the automatic production line requires a large number of substrate carriers, which greatly increases the production cost of the module.

Therefore, a new device is needed to solve the above technical problems.

Disclosure of Invention

Aiming at the defects of the related technologies, the invention provides the module pin welding equipment which is simple in structure and easy to assemble and produce.

In order to solve the technical problem, an embodiment of the invention provides a module pin welding device, which comprises a supporting table, a workbench arranged on the supporting table, and a preheater, a material taking and placing device, a pressing device and a cleaner which are fixed on the supporting table and are arranged at intervals; the workbench comprises a support shaft, a working disc and a fixing part, wherein the support shaft is arranged on the support platform and is in shaft rotating connection with the support platform, the working disc is fixed at one end of the support shaft, which is far away from the support platform, and the fixing part is arranged at one side of the working disc, which is far away from the support platform;

the workbench is used for rotating the fixed part to a first station, a second station, a third station and a fourth station through the supporting shaft, and the first station is a position where the working disc rotates to the working range of the preheater; the second station is a position of the working disc which is rotated to a position within the working range of the cleaner, the second station is also a position of the working disc which is rotated to a position of the pick-and-place device which puts the external base plate to be welded into the working range of the fixing part, and the second station is also a position of the working disc which is rotated to a position within the working range of the pick-and-place device which takes out the fixed base plate and the external pin to be welded in the fixing part through a module which is processed by welding; the third station is a position where the working disc rotates to a position where the taking and placing device places the pins into the working range of the fixing part; the fourth station is a position in a working range that the working disc rotates to the stitching device to weld and stitch the substrate and the pins;

the preheater is used for heating the fixed part in the first station to a preset temperature;

the taking and placing device is used for fixing the substrate to the fixing part in the second station, fixing the pins to the fixing part in the third station and taking out the module fixed in the fixing part in the second station;

the stitching device is used for stitching the substrate and the pins in the fixing part in the fourth station by welding;

the cleaner is used for cleaning the module in the fixing part in the second station.

Preferably, the working disc is discoid, the fixed part includes a plurality of, and a plurality of the fixed part sets up in the same position of working disc along its radial and be symmetrical evenly distributed.

Preferably, the fixing part comprises a substrate fixing position for fixing the substrate to be welded and matching the substrate in shape and a pin fixing position for fixing the pin to be welded and matching the pin in shape, and the substrate fixing position and the pin fixing position correspond to each other in one-to-one correspondence.

Preferably, the preheater and the support shaft are arranged at intervals and positioned between the working disc and the support table, and the substrate fixing position is provided with a support groove penetrating through the substrate fixing position; after the substrate to be welded is fixed to the substrate fixing position, one side, facing the supporting table, of the substrate is exposed out of the working disc through the supporting groove; the preheater is abutted to one side of the substrate, which faces the support table, and heats the substrate to a preset temperature.

Preferably, the preheater comprises an air cylinder fixed on the support table, a base extending from one end of the air cylinder far away from the support table, a heating rod mounted on the base, and a heating platform extending from one end of the base far away from the support table;

the cylinder is used for moving the base away from or close to the support table so as to enable the heating platform to abut against the substrate or be away from the substrate;

the heating platform is connected with the heating rod so that heat generated by heating of the heating rod is transferred to the heating platform.

Preferably, the material taking and placing device comprises a first body fixed on the support platform, a first mechanical arm fixed on the first body and sliding along a first direction, a second mechanical arm fixed on the first mechanical arm and sliding along a second direction, a third mechanical arm fixed on the second mechanical arm and sliding along a third direction, and a finger cylinder fixed on the third mechanical arm and rotationally connected with the third mechanical arm; the first direction, the second direction and the third direction are mutually vertical pairwise;

the finger cylinder comprises cylinder fingers for clamping the substrate, and the finger cylinder is used for controlling the opening or closing of the cylinder fingers through pneumatic control so as to fix the substrate and the pins on the fixing part or take out the module.

Preferably, the first mechanical arm includes a first guide rail fixed to the first body and extending along the first direction, a first lead screw mounted on the first guide rail and slidably connected to the first guide rail, and a first motor extending from the first lead screw and driving the first lead screw to slide;

the second mechanical arm comprises a second guide rail which is fixed on the first mechanical arm and extends along the second direction, a second lead screw which is arranged on the second guide rail and is in sliding connection with the second guide rail, and a second motor which is extended by the second lead screw and drives the second lead screw to slide;

the third mechanical arm comprises a third guide rail which is fixed on the second mechanical arm and extends along the third direction, a third screw rod which is arranged on the third guide rail and is in sliding connection with the third guide rail, and a third motor which is extended by the third screw rod and drives the third screw rod to slide;

the finger cylinder further comprises a cylinder motor which extends from the cylinder finger and drives the cylinder finger to rotate around the third mechanical arm forming shaft;

the taking and placing device further comprises a vision positioning camera fixed on the finger cylinder, and the vision positioning camera is used for positioning the substrate and the pins or the modules fixed in the fixing part in the second station so as to place the substrate and the pins or take out the modules.

Preferably, the stitching device comprises a second body fixed to the support table, a fourth mechanical arm fixed to the second body and sliding in the first direction, a fifth mechanical arm fixed to the fourth mechanical arm and sliding in the third direction, and a pressing claw fixed to the fifth mechanical arm;

the fourth mechanical arm comprises a fourth guide rail, a fourth lead screw and a fourth motor, the fourth guide rail is fixed to the second body and extends along the first direction, the fourth lead screw is installed on the fourth guide rail and is in sliding connection with the fourth guide rail, and the fourth motor extends from the fourth lead screw and drives the fourth lead screw to slide;

the fifth mechanical arm comprises a fifth guide rail, a fifth screw rod and a fifth motor, wherein the fifth guide rail is fixed on the fourth mechanical arm and extends along the third direction, the fifth screw rod is installed on the fifth guide rail and is in sliding connection with the fifth guide rail, and the fifth motor extends from the fifth screw rod and drives the fifth screw rod to slide.

Preferably, the cleaner comprises a third body fixed on the support table, and an air suction device and an air blowing device which are formed by extending one side of the third body far away from the support table, the air suction device and the air blowing device are opposite to each other and spaced from each other to form an accommodating space, and the module fixed by the fixing part in the second station is accommodated in the accommodating space.

Preferably, the number of the fixing portions is four, the four fixing portions are respectively located at the first station, the second station, the third station and the fourth station, and an angle between two adjacent fixing portions on the working disc is 90 degrees;

when the working disc rotates clockwise, one of the fixing parts sequentially passes through the second station, the first station, the third station and the fourth station and then rotates to the second station.

Compared with the prior art, the module pin welding equipment is provided with the support table, and the workbench, the preheater, the material taking and placing device, the pressing device and the cleaner are arranged on the support table; the workbench comprises a support shaft, a working disc and a fixing part, and the fixing part is respectively rotated to the first station, the second station, the third station and the fourth station through the support shaft. First station, second station, third station and fourth station are by corresponding the pre-heater in the workstation respectively, get the work station of putting glassware, pressfitting ware and cleaner, specifically do: the first station is a position from the rotation of the working disc to the working range of the preheater; the second station is the position of the working disc rotating to the working range of the cleaner, and the second station is also the position of the working disc rotating to the working range of the material taking and placing device; and the fourth station is a position in a working range in which the working disc rotates to the stitching device to weld and stitch the substrate and the pins. The structure is simple, a large number of better substrate carriers are avoided, the lead wires are easy to weld on the substrate, and the assembly and production are easy.

Drawings

The present invention is described in detail below with reference to the attached drawings. The foregoing and other aspects of the invention will become more apparent and more readily appreciated from the following detailed description, taken in conjunction with the accompanying drawings. In the drawings:

FIG. 1 is a schematic perspective view of a module pin soldering apparatus according to the present invention;

FIG. 2 is a schematic perspective view of a workbench of the module pin welding device of the present invention assembled with a module;

FIG. 3 is an enlarged view of portion A of FIG. 2;

FIG. 4 is an enlarged view of portion B of FIG. 2;

FIG. 5 is a schematic perspective view of a preheater of the module pin welding apparatus according to the present invention;

FIG. 6 is a schematic perspective view of a part of the pick-and-place device of the module pin welding device of the present invention;

fig. 7 is a schematic perspective view of a part of a pressing device of the module pin welding device according to the present invention;

fig. 8 is a schematic perspective view of a cleaner of the module pin soldering apparatus according to the present invention.

Detailed Description

The following detailed description of embodiments of the invention refers to the accompanying drawings.

The embodiments/examples described herein are specific embodiments of the invention, are intended to be illustrative of the concepts of the invention, are exemplary and explanatory, and should not be construed as limiting the embodiments of the invention and the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification of the present application, and these technical solutions include those which make any obvious replacement or modification of the embodiments described herein, and all of which are within the scope of the present invention.

The invention provides a module pin soldering apparatus 100. The module pin soldering apparatus 100 is used to solder an external substrate 200 and pins 300 to form a module 400. In this embodiment, the module 400 is a power device module.

Referring to fig. 1, fig. 1 is a schematic perspective view of a module pin soldering apparatus 100 according to the present invention.

Specifically, the module pin welding equipment 100 comprises a supporting table 1, a workbench 2 arranged on the supporting table 1, a preheater 3, a material taking and placing device 4, a pressing device 5 and a cleaner 6 which are fixed on the supporting table 1 and are arranged at intervals.

The supporting table 1 is used for supporting. In this embodiment, the supporting platform 1 is a table top fixed on the ground.

Referring to fig. 2, fig. 2 is a schematic perspective view illustrating an assembled structure of a table 2 and a module 400 of the module pin soldering apparatus 100 according to the present invention.

Specifically, the worktable 2 includes a support shaft 21 mounted on the support table 1 and forming a shaft-rotating connection with the support table 1, a worktable 22 fixed at one end of the support shaft 21 away from the support table 1, and a fixing portion 23 disposed at one side of the worktable 22 away from the support table 1.

The workbench 2 is used for rotating the fixing part 23 to a first station S1, a second station S2, a third station S3 and a fourth station S4 through the supporting shaft 21, and the first station S1 is a position where the working disc 22 rotates to the preheater 3 within the working range.

The second station S2 is a position where the working disc 22 rotates to a working range of the cleaner 6, the second station S2 is a position where the working disc 22 rotates to a working range where the pick-and-place device 4 places the external substrate 200 to be welded into the fixing portion 23, and the second station S2 is a position where the working disc 22 rotates to a working range where the pick-and-place device 4 takes out the module 400, which is fixed in the fixing portion 23 and is completed by the substrate 200 and the external pin 300 to be welded through the welding process, of the fixing portion 23. The third station S3 is a position where the working tray 22 rotates to a position where the pick-and-place device 4 places the pins 300 into the working range of the fixing portion 23. The fourth station S4 is a position where the working disc 22 rotates to a working range where the bonding tool 5 performs bonding on the substrate 200 and the leads 300. The first station S1, the second station S2, the third station S3 and the fourth station S4 respectively correspond to the working stations of the preheater 3, the taking and placing device 4, the pressing device 5 and the cleaner 6 in the workbench 2, and the structure is simple and easy to assemble and produce the module 400.

The working disc 22 is disc-shaped, the fixing portions 23 include a plurality of fixing portions 23, and the plurality of fixing portions 23 are arranged at the same radial position of the working disc 22 and are symmetrically and uniformly distributed. In this embodiment, the fixing portions 23 include four fixing portions 23, the four fixing portions 23 are respectively located at the first station S1, the second station S2, the third station S3, and the fourth station S4, and an angle between two adjacent fixing portions 23 on the working plate 22 is 90 °.

When the working disc 22 rotates clockwise, one of the fixing portions 23 sequentially passes through the second station S2, the first station S1, the third station S3, and the fourth station S4 and then rotates to the second station S2. The construction of the work tray 22 makes it easy to handle when assembling the module 400 and makes it possible to make full use of the mutual arrangement of the work table 2, the preheater 3, the picker 4, the presser 5 and the cleaner 6, which is simple and makes the assembly of the module 400 efficient.

Referring to fig. 3 and 4, fig. 3 is an enlarged view of a portion a of fig. 2; fig. 4 is an enlarged view of a portion B of fig. 2. Specifically, fig. 3 is a schematic perspective view of the fixing portion 23. Fig. 4 is an assembled perspective view of the fixing portion 23 and the module 400.

Specifically, the fixing portion 23 includes a substrate fixing position 231 for fixing the substrate 200 to be soldered and matching the shape of the substrate 200, and a pin fixing position 232 for fixing the pin 300 to be soldered and matching the shape of the pin 300.

The substrate fixing positions 231 correspond to the pin fixing positions 232 one to one. The structure of the fixing portion 23 can avoid the need of a large number of substrate carriers in the related art, so that the module pin soldering apparatus 100 of the invention has a simple structure and is easy to apply.

In this embodiment, the substrate fixing station 231 has a supporting slot 2310 penetrating through it. The support groove 2310 is used for heating the substrate 200. The substrate fixing station 231 is sunk from the surface of the work tray 22 by the same height as the thickness of the substrate 200. The center of the supporting groove 2310 is a hollow structure, and hollow lugs are arranged at two short edges of the supporting groove, and the hollow lugs are used for facilitating the loading and unloading of the substrate 200.

The pin fixing locations 232 are higher than the reference plane of the circular work plate 22 and function to support the pins 300. The four corners of the pin fixing position 232 are provided with positioning columns for positioning the pins 300, and the short sides of the pin fixing position 232 are also provided with sunken lugs for conveniently mounting the pins 300.

The substrate fixing position 231 and the pin fixing position 232 have simple structures, and when the module 400 is assembled and produced, a template carrier in the related art can be avoided, so that the production efficiency can be improved, and the cost can be saved.

In this embodiment, after the substrate 200 to be welded is fixed to the substrate fixing portion 231, one side of the substrate 200 facing the supporting table 1 is exposed out of the working plate 22 through the supporting groove 2310. The pre-heater 3 heats the substrate 200 to a predetermined temperature by abutting on a side of the substrate 200 facing the support table 1. This structure makes the structure of the inventive module pin soldering apparatus 100 simple.

The preheater 3 is used for heating the fixing portion 23 in the first station S1 to a preset temperature. The preheater 3 is arranged at an interval from the supporting shaft 21 and is positioned between the working disc 22 and the supporting table 1.

Referring to fig. 5, fig. 5 is a schematic perspective view of a preheater 3 of the module pin soldering apparatus 100 according to the present invention.

Specifically, the preheater 3 includes a cylinder 31 fixed to the support table 1, a base 32 extending from one end of the cylinder 31 away from the support table 1, a heating rod 33 mounted on the base 32, and a heating platform 34 extending from one end of the base 32 away from the support table 1.

The cylinder 31 is used for moving the pedestal 32 away from or close to the support table 1, so as to enable the heating platform 34 to abut against the substrate 200 or be away from the substrate 200.

The heating platform 34 is connected to the heating rod 33 such that heat generated by heating the heating rod 33 is transferred to the heating platform 34.

When the circular working disc 22 drives the substrate 200 in the fixing portion 23 to rotate to the preheating position, i.e. the first station S1, the cylinder 31 drives the base 32 to rise, the heating platform 34 contacts the back surface of the substrate 200, and then the heating rod 33 is energized to preheat the substrate 200. The structure of the preheater 3 makes the structure of the inventive module pin welding apparatus 100 simple.

The pick-and-place device 4 is used for fixing the substrate 200 to the fixing portion 23 in the second station S2. The taking and placing device 4 is further configured to fix the pin 300 to the fixing portion 23 in the third station S3. The picking and placing device 4 is further configured to pick the module 400 fixed in the fixing portion 23 in the second station S2.

Referring to fig. 6, fig. 6 is a schematic perspective view of a part of a pick-and-place device 4 of the module pin soldering apparatus 100 according to the present invention.

Specifically, the material taking and placing device 4 comprises a first body 41 fixed on the supporting table 1, a visual positioning camera 42, a first mechanical arm 43 fixed on the first body 41 and sliding along a first direction X, a second mechanical arm 44 fixed on the first mechanical arm 43 and sliding along a second direction Y, a third mechanical arm 45 fixed on the second mechanical arm 44 and sliding along a third direction Z, and a finger cylinder 46 fixed on the third mechanical arm 45 and rotatably connected with the third mechanical arm 45.

The first direction X, the second direction Y and the third direction Z are perpendicular to each other two by two.

The visual positioning camera 42 is fixed to the finger cylinder 46. The visual positioning camera 42 is configured to position the substrate 200 and the pins 300 or the module 400 fixed in the fixing portion 23 in the second station S2, so as to place the substrate 200 and the pins 300 or take out the module 400.

The first robot arm 43 includes a first rail 431 fixed to the first body 41 and extending in the first direction X, a first lead screw 432 mounted to the first rail 431 and slidably connected to the first rail 431, and a first motor 433 extending from the first lead screw 432 and driving the first lead screw 432 to slide.

The second robot arm 44 includes a second guide rail 441 fixed to the first robot arm 43 and extending in the second direction Y, a second lead screw 442 attached to the second guide rail 441 and slidably coupled to the second guide rail 441, and a second motor 443 extended from the second lead screw 442 and driving the second lead screw 442 to slide.

The third robot 45 includes a third rail 451 fixed to the second robot 44 and extending in the third direction Z, a third lead screw 452 attached to the third rail 451 and slidably connected to the third rail 451, and a third motor 453 extending from the third lead screw 452 and driving the third lead screw 452 to slide.

The finger cylinder 46 includes a cylinder finger 461 for clamping the substrate 200, and a cylinder motor 462 extending from the cylinder finger 461 and driving the cylinder finger 461 to rotate around the third mechanical arm 45.

The finger cylinder 46 is used for pneumatically controlling the cylinder fingers 461 to open or close, so as to fix the substrate 200 and the pins 300 to the fixing portion 23 or take out the module 400.

The bonding device 5 is used for bonding the substrate 200 and the leads 300 in the fixing portion 23 in the fourth station S4 by soldering.

Referring to fig. 7, fig. 7 is a schematic perspective view of a part of a stitching device 5 of the module pin soldering apparatus 100 according to the present invention;

specifically, the stitching device 5 includes a second body 51 fixed to the support table 1, a fourth mechanical arm 52 fixed to the second body 51 and sliding along the first direction X, a fifth mechanical arm 53 fixed to the fourth mechanical arm 52 and sliding along the third direction Z, and a pressing claw 54 fixed to the fifth mechanical arm 53.

The fourth mechanical arm 52 includes a fourth guide rail 521 fixed to the second body 51 and extending in the first direction X, a fourth screw 522 attached to the fourth guide rail 521 and slidably connected to the fourth guide rail 521, and a fourth motor 523 extending from the fourth screw 522 and driving the fourth screw 522 to slide.

The fifth mechanical arm 53 includes a fifth guide rail 531 fixed to the fourth mechanical arm 52 and extending in the third direction Z, a fifth lead screw 532 mounted on the fifth guide rail 531 and slidably connected to the fifth guide rail 531, and a fifth motor 533 extended from the fifth lead screw 532 and driving the fifth lead screw 532 to slide.

When the pressing device 5 works, the pressing claw 54 is pressed down to the proper position, then the heating rod on the pressing claw 54 at the pressing position is electrified to enable the temperature at the pressing position to be instantly increased to 300 ℃, so that the soldering tin on the welding point on the substrate 200 is melted, the pin is welded on the substrate 200, then the heating rod on the pressing claw 54 is powered off, the temperature at the heating position is reduced to be lower than the melting point of the soldering tin, and then the pressing claw 54 is lifted.

The cleaner 6 is used for cleaning the module 400 in the fixing portion 23 in the second station S2.

Referring to fig. 8, fig. 8 is a schematic perspective view of a cleaner 6 of the module pin soldering apparatus 100 according to the present invention.

Specifically, the cleaner 6 includes a third body 61 fixed to the support platform 1, and an air suction device 62 and an air blowing device 63 respectively formed by extending one side of the third body 61 away from the support platform 1, the air suction device 62 and the air blowing device 63 are opposite to each other and spaced from each other to form an accommodating space 60, and the module 400 fixed by the fixing portion 23 in the second station S2 is accommodated in the accommodating space 60.

The suction device 62 has a suction hole controlled by a solenoid valve inside to suck the solid residue on the module 400 away.

The blowing device 63 uses the solenoid valve inside to control the air holes to blow out compressed air with the pressure of 0.5MPa to separate the solid residue on the pressed module 400 from the module 400.

It should be supported that the preheater 3, the material taking and placing device 4, the stitching device 5, and the cleaning device 6 in this embodiment may also adopt other common devices in this field, and although the structures of other preheaters, material taking and placing devices, stitching devices, and cleaning devices in this field are not simple in structure of the preheater 3, the material taking and placing device 4, the stitching device 5, and the cleaning device 6 in this embodiment, the functions of the assembly module 400 may also be implemented, and the specific device model may be selected according to actual needs, which is not described in detail herein.

Compared with the prior art, the module pin welding equipment 100 is characterized in that the supporting table 1 is arranged, and the workbench 2, the preheater 3, the material taking and placing device 4, the pressing device 5 and the cleaner 6 are arranged on the supporting table 1; the workbench comprises a supporting shaft, a working disc and a fixing part, and the fixing part is respectively rotated to a first station S1, a second station S2, a third station S3 and a fourth station S4 through the supporting shaft. The first station S1, the second station S2, the third station S3 and the fourth station S4 are respectively corresponding to the working stations of the preheater 3, the taking and placing device 4, the pressing device 5 and the cleaner 6 in the workbench 2, and specifically are as follows: s1, the working disc 22 rotates to a position within the working range of the preheater 3; the second station S2 is a position where the working disc 22 rotates to a position within the working range of the cleaner 6, and the second station S2 is a position where the working disc 22 rotates to a position within the working range of the material taking and placing device 4; the third station S3 is a position where the working tray 22 rotates to the position where the pick-and-place device 4 places the pins 300 in the working range of the fixing portion 23. The fourth station S4 is a position where the working tray 22 rotates to a working range where the bonding tool 5 performs soldering bonding on the substrate 200 and the leads 300. The structure is simple, a large number of better substrate carriers are avoided, the lead wires are easy to weld on the substrate, and the assembly and production are easy.

The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.

Claims (10)

1. The module pin welding equipment is characterized by comprising a supporting table, a workbench arranged on the supporting table, a preheater, a material taking and placing device, a pressing device and a cleaner, wherein the preheater, the material taking and placing device, the pressing device and the cleaner are fixed on the supporting table and are arranged at intervals; the workbench comprises a support shaft, a working disc and a fixing part, wherein the support shaft is arranged on the support platform and is in shaft rotating connection with the support platform, the working disc is fixed at one end of the support shaft, which is far away from the support platform, and the fixing part is arranged at one side of the working disc, which is far away from the support platform;

the workbench is used for rotating the fixing part to a first station, a second station, a third station and a fourth station through the supporting shaft, and the first station is a position where the working disc rotates to the working range of the preheater; the second station is a position of the working disc which is rotated to a position within the working range of the cleaner, the second station is also a position of the working disc which is rotated to a position of the pick-and-place device which puts the external base plate to be welded into the working range of the fixing part, and the second station is also a position of the working disc which is rotated to a position within the working range of the pick-and-place device which takes out the fixed base plate and the external pin to be welded in the fixing part through a module which is processed by welding; the third station is a position where the working disc rotates to a position where the taking and placing device places the pins into the working range of the fixing part; the fourth station is a position in a working range that the working disc rotates to the stitching device to weld and stitch the substrate and the pins;

the preheater is used for heating the fixed part in the first station to a preset temperature;

the taking and placing device is used for fixing the substrate to the fixing part in the second station, fixing the pins to the fixing part in the third station and taking out the module fixed in the fixing part in the second station;

the stitching device is used for stitching the substrate and the pins in the fixing part in the fourth station by welding;

the cleaner is used for cleaning the module in the fixing part in the second station.

2. The apparatus according to claim 1, wherein the work plate has a disk shape, and the plurality of fixing portions are disposed at the same position along a radial direction of the work plate and symmetrically and uniformly distributed.

3. The modular pin soldering apparatus according to claim 2, wherein the fixing part includes a substrate fixing position for fixing the substrate to be soldered and matching the substrate shape and a pin fixing position for fixing the pin to be soldered and matching the pin shape, the substrate fixing position and the pin fixing position corresponding one to one.

4. The modular pin soldering apparatus according to claim 3, wherein the pre-heater is spaced from the support shaft and positioned between the work plate and the support table, and the substrate holding station has a support slot extending therethrough; after the substrate to be welded is fixed to the substrate fixing position, one side, facing the supporting table, of the substrate is exposed out of the working disc through the supporting groove; the preheater is abutted to one side of the substrate, which faces the support table, and heats the substrate to a preset temperature.

5. The modular pin welding apparatus of claim 4, wherein the pre-heater comprises a cylinder fixed to the support table, a base extending from an end of the cylinder away from the support table, a heater bar mounted to the base, and a heating platform extending from an end of the base away from the support table;

the cylinder is used for moving the base away from or close to the support table so as to enable the heating platform to abut against the substrate or be away from the substrate;

the heating platform is connected with the heating rod so that heat generated by heating of the heating rod is transferred to the heating platform.

6. The modular pin soldering apparatus according to claim 1, wherein the pick-and-place device comprises a first body fixed to the support platform, a first robot arm fixed to the first body and sliding in a first direction, a second robot arm fixed to the first robot arm and sliding in a second direction, a third robot arm fixed to the second robot arm and sliding in a third direction, and a finger cylinder fixed to the third robot arm and forming a rotational connection with the third robot arm; the first direction, the second direction and the third direction are mutually perpendicular in pairs;

the finger cylinder comprises a cylinder finger for clamping the substrate, and the finger cylinder is used for controlling the opening or closing of the cylinder finger through pneumatic control so as to fix the substrate and the pins on the fixing part or take the module out.

7. The modular pin soldering apparatus according to claim 6,

the first mechanical arm comprises a first guide rail fixed on the first body and extending along the first direction, a first screw rod arranged on the first guide rail and in sliding connection with the first guide rail, and a first motor extending from the first screw rod and driving the first screw rod to slide;

the second mechanical arm comprises a second guide rail which is fixed on the first mechanical arm and extends along the second direction, a second lead screw which is arranged on the second guide rail and is in sliding connection with the second guide rail, and a second motor which is extended by the second lead screw and drives the second lead screw to slide;

the third mechanical arm comprises a third guide rail which is fixed on the second mechanical arm and extends along the third direction, a third screw rod which is arranged on the third guide rail and is in sliding connection with the third guide rail, and a third motor which is extended by the third screw rod and drives the third screw rod to slide;

the finger cylinder further comprises a cylinder motor which extends from the cylinder finger and drives the cylinder finger to rotate around the third mechanical arm forming shaft;

the taking and placing device further comprises a vision positioning camera fixed on the finger cylinder, and the vision positioning camera is used for positioning the substrate and the pins or the modules fixed in the fixing part in the second station so as to place the substrate and the pins or take out the modules.

8. The modular pin soldering apparatus according to claim 6,

the pressing device comprises a second body fixed on the supporting table, a fourth mechanical arm fixed on the second body and sliding along the first direction, a fifth mechanical arm fixed on the fourth mechanical arm and sliding along the third direction, and a pressing claw fixed on the fifth mechanical arm;

the fourth mechanical arm comprises a fourth guide rail, a fourth lead screw and a fourth motor, the fourth guide rail is fixed to the second body and extends along the first direction, the fourth lead screw is installed on the fourth guide rail and is in sliding connection with the fourth guide rail, and the fourth motor extends from the fourth lead screw and drives the fourth lead screw to slide;

the fifth mechanical arm comprises a fifth guide rail which is fixed on the fourth mechanical arm and extends along the third direction, a fifth lead screw which is arranged on the fifth guide rail and is in sliding connection with the fifth guide rail, and a fifth motor which is extended by the fifth lead screw and drives the fifth lead screw to slide.

9. The modular pin soldering apparatus according to claim 1,

the cleaner comprises a third body fixed on the supporting table, and an air suction device and an air blowing device which are formed by extending one side, far away from the supporting table, of the third body respectively, wherein the air suction device and the air blowing device are opposite to each other and are spaced from each other to form an accommodating space, and the module fixed by the fixing part in the second station is accommodated in the accommodating space.

10. The modular pin soldering apparatus according to claim 2,

the four fixing parts are respectively positioned on the first station, the second station, the third station and the fourth station, and the angle between every two adjacent fixing parts on the working disc is 90 degrees;

when the working disc rotates clockwise, one of the fixing parts sequentially passes through the second station, the first station, the third station and the fourth station and then rotates to the second station.

Images