CN115483085A - Device for improving air exhaust uniformity of integrated circuit equipment - Google Patents
Device for improving air exhaust uniformity of integrated circuit equipment Download PDFInfo
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- CN115483085A CN115483085A CN202211267038.6A CN202211267038A CN115483085A CN 115483085 A CN115483085 A CN 115483085A CN 202211267038 A CN202211267038 A CN 202211267038A CN 115483085 A CN115483085 A CN 115483085A
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- cavity
- flange
- dynamic seal
- seal assembly
- mounting frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor manufacturing, and discloses a device for improving air extraction uniformity of integrated circuit equipment, which comprises an air extraction part, a lifting part, a cavity and a mounting rack, wherein an air extraction hole is formed in the center of the bottom of the cavity, the air extraction part is arranged in the center of the lower surface of the cavity and is communicated with the cavity through the air extraction hole, the lifting part is arranged on one side of the lower surface of the cavity and is fixedly connected with the mounting rack to drive the mounting rack to lift, the mounting rack is arranged in the cavity, and the mounting rack is used for receiving and placing wafers in the lifting process. The invention can realize uniform air extraction without influencing the lifting and placing of the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a device for improving air suction uniformity of integrated circuit equipment.
Background
For the device for improving pumping uniformity of the integrated circuit equipment in the prior art, the central position of the vacuum chamber is a platform for placing a wafer and a wafer lifting device, and the molecular pump is placed at one side of the vacuum chamber, so that the position of the vacuum pumping port is offset relative to the central platform, which causes uneven distribution of process gas in the vacuum chamber, the concentration at the side close to the pumping port of the molecular pump is often higher, and the concentration at the side far away from the pumping port of the molecular pump is often lower, thereby causing poor process uniformity. Therefore, how to realize symmetrical and uniform gas distribution concentration in the vacuum chamber without influencing the lifting and placing of the wafer becomes a problem to be solved urgently.
Disclosure of Invention
The invention aims to provide a device for improving the air suction uniformity of integrated circuit equipment, so that the device for improving the air suction uniformity of the integrated circuit equipment can realize uniform air suction without influencing the lifting and the placing of a wafer.
The object of the present invention is achieved by the following technical means. According to the device for improving the air extraction uniformity of the integrated circuit equipment, which is provided by the invention, the device comprises an air extraction part, a lifting part, a cavity and a mounting rack, wherein an air extraction hole is formed in the center of the bottom of the cavity, the air extraction part is arranged in the center of the lower surface of the cavity and is communicated with the cavity through the air extraction hole, the lifting part is arranged on one side of the lower surface of the cavity and is fixedly connected with the mounting rack so as to drive the mounting rack to lift, the mounting rack is arranged in the cavity, and the mounting rack is used for receiving and placing wafers in the lifting process.
In some embodiments, the mounting frame includes a plurality of support columns, which are vertically arranged uniformly in a circumferential direction of the mounting frame.
In some embodiments, the apparatus for improving pumping uniformity of an integrated circuit device further comprises a stage, the stage being disposed in the center of the interior of the chamber, the stage being located above the mounting frame.
In some embodiments, the carrier has a plurality of second through holes, and the support posts pass through the second through holes.
In some embodiments, the lifting portion includes a driving assembly and a dynamic seal assembly, the driving assembly is configured to drive the dynamic seal assembly to perform a lifting motion, and the dynamic seal assembly is fixedly connected to the mounting frame.
In some embodiments, the dynamic seal assembly includes a plurality of bearings, a central shaft, a first flange and a second flange, the first flange is disposed on the top of the central shaft, a plurality of bearings are embedded in the second flange, the central shaft passes through the plurality of bearings, and the first flange is fixedly connected with the mounting bracket.
In some embodiments, the dynamic seal assembly further comprises a flexible seal tube nested over the central shaft between the first flange and the second flange.
In some embodiments, a top end of the flexible sealing tube abuts a lower surface of the first flange and a bottom end of the flexible sealing tube abuts a top end of the second flange.
In some embodiments, the dynamic seal assembly further comprises a flexible seal tube housing disposed outside of the flexible seal tube.
In some embodiments, the driving assembly includes a servo motor and a ball screw for converting a rotary motion of a rotary shaft of the servo motor into a linear motion, and the central shaft is fixedly connected to a slider on the ball screw.
The beneficial effects of the invention at least comprise:
1. according to the invention, the air exhaust part is arranged at the center of the lower surface of the cavity and is communicated with the cavity, so that the vacuum exhaust hole is arranged at the center of the bottom of the cavity, the uneven air exhaust caused by the offset of the vacuum exhaust port is avoided, the lifting part is arranged at one side of the lower surface of the cavity and is fixedly connected with the mounting frame to drive the mounting frame to lift, the mounting frame is used for receiving and placing wafers in the lifting process, and the lifting and placing of the wafers cannot be influenced on the premise of realizing the uniform air exhaust.
2. The central shaft is arranged and penetrates through the bearings, so that the central shaft is guided in the lifting process, and the position deviation of the central shaft is avoided.
3. The corrugated pipe is sleeved outside the central shaft, so that dynamic sealing in the lifting process of the dynamic sealing assembly is realized.
4. The corrugated pipe cover is arranged outside the corrugated pipe in a covering mode and goes up and down along with the corrugated pipe, and the corrugated pipe cover is made of polyether-ether-ketone materials, so that metal pollution to the cavity by metal materials of the corrugated pipe can be prevented.
5. The shutter is positioned right below the air suction hole of the cavity and right above the air suction part, the composite vacuum gauge and the film gauge vacuum gauge are arranged in the cavity and are in communication connection with the driving mechanism, and the driving mechanism is used for controlling the opening of the shutter in real time according to detection data, so that the air suction speed of the air suction part is adjusted, the concentration in the cavity is uniform and balanced, and meanwhile, the waste of process gas is avoided.
6. The structures including the mounting frame and the supporting legs below the carrying platform are symmetrical about the center of the air suction hole formed in the center of the bottom of the cavity, so that the whole track of the process gas sucked by the air suction part is concentric and uniformly symmetrical, and the uniformity of the concentration of the gas in the cavity is improved.
7. The adjusting range of the opening degree of the louver is 0-90 degrees, and the adjusting range of the air extraction rate can be improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 illustrates a perspective view of an apparatus for improving pumping uniformity for an integrated circuit device according to one embodiment of the present invention;
FIG. 2 is a schematic plan view of a dynamic seal assembly according to one embodiment of the present invention;
FIG. 3 shows a perspective view of a bellows shield according to an embodiment of the present invention;
FIG. 4 is another schematic diagram of an apparatus for improving pumping uniformity for an integrated circuit device according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means of the present invention, the following detailed description of the embodiments of the device for improving pumping uniformity of an integrated circuit device according to the present invention is provided with reference to the accompanying drawings and preferred embodiments.
The use of words such as "including," having, "and the like in connection with the present invention is an open-ended word that refers to and is used interchangeably with" including, but not limited to.
The terms "first" and "second" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more than two of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1, the rf coil 6 is located at the top of the apparatus for improving pumping uniformity of an integrated circuit device according to the present invention, and is used for generating plasma during a process, the rf coil 6 has an upper cover plate 7 made of quartz, and a process gas inlet is located at the center of the upper cover plate 7. The chamber 3 is configured as a cylinder, in some other embodiments, the chamber 3 may be configured as a prism or other shape, and a wafer transfer port (not shown) is formed at one side of the chamber 3, through which an external robot (not shown) may transfer a wafer into the chamber.
The device for improving the air extraction uniformity of the integrated circuit equipment comprises an air extraction part 1, a lifting part 2, a cavity 3 and a mounting rack 4, wherein the air extraction part 1 is arranged at the center of the lower surface of the cavity 3, an air extraction hole is formed in the center of the bottom of the cavity 3, the air extraction part 1 is communicated with the inner space of the cavity 3 through the air extraction hole so as to extract the process gas in the cavity 3, and the air extraction part 3 is preferably a molecular pump. The lift portion 2 is arranged on the side portion of the lower surface of the cavity 3, the mounting frame 4 is arranged inside the cavity 3, a first through hole is formed in the bottom of the cavity 3, the lift portion 2 penetrates through the first through hole and is fixedly connected with the mounting frame 4 inside the cavity 3 to drive the mounting frame 4 to do lifting motion, the mounting frame 4 is used for receiving and taking a wafer from an external mechanical arm when the lift portion ascends to a first position, and the lift portion is further used for placing the received wafer on the carrying platform 5 when the lift portion descends to a second position. According to the invention, the air exhaust part 1 is arranged at the center of the lower surface of the cavity 3 and is communicated with the cavity 3, so that the vacuum exhaust hole is arranged at the center of the bottom of the cavity 3, and the uneven air exhaust caused by the offset of the vacuum exhaust hole is avoided. On the other hand, the lifting part 2 is arranged on one side of the lower surface of the cavity 3 and is fixedly connected with the mounting frame 4 to drive the mounting frame 4 to lift, and the mounting frame 4 is used for receiving and placing wafers in the lifting process, so that the lifting and the placing of the wafers are not influenced on the premise of realizing uniform air suction.
As shown in fig. 1, the mounting frame 4 includes a plurality of supporting columns 41, in a preferred embodiment, the plurality of supporting columns 41 have the same shape and length, the mounting frame 4 is preferably configured as a frame in a ring structure, the plurality of supporting columns 41 are vertically arranged uniformly along the circumferential direction of the mounting frame 4, and the supporting columns 41 are used for receiving and placing wafers during the lifting and lowering of the mounting frame 4. The device for improving the air extraction uniformity of the integrated circuit equipment further comprises a carrying platform 5, wherein the carrying platform 5 is arranged in the center of the inner part of the cavity 3, and the upper surface of the carrying platform 5 is used for placing a wafer. The carrier 5 is configured as a cylinder, and a plurality of second through holes are opened along the circumferential direction of the carrier 5, and the support columns 41 pass through the second through holes. The stage 5 is fixed to the center of the inside of the chamber 3 by a plurality of support legs 51 and is located above the mounting frame 4, and the ring structure formed by the mounting frame 4 encloses the plurality of support legs 51 inside the ring structure. When the mounting frame 4 is raised to the first position, the plurality of supporting columns 41 can take the wafer from the external robot arm, and when the mounting frame 4 is lowered to the second position, the top ends of the plurality of supporting columns 41 are lowered to a position flush with the upper surface of the stage 5, so that the wafer is placed on the upper surface of the stage 5.
As shown in fig. 1 and fig. 2, the lifting portion 2 includes a driving assembly 21 and a dynamic seal assembly 22, the driving assembly 21 is used for driving the dynamic seal assembly 22 to perform lifting movement, and the dynamic seal assembly 22 passes through the first through hole at the bottom of the cavity 3 and is fixedly connected with the mounting frame 4. Specifically, the drive assembly 21 includes a servo motor and a ball screw for converting a rotational motion of a rotary shaft of the servo motor into a linear motion. The dynamic seal assembly 22 includes a plurality of bearings 221, a central shaft 222, a first flange 223 and a second flange 224, the first flange 223 is disposed on the top of the central shaft 222, the central shaft 222 and the first flange 223 are integrally formed, and the first flange 223 is fixedly connected with the mounting frame 4. In particular, the fixed connection between the first flange 223 and the mounting frame 4 may be achieved by means of screws or snaps. The second flange 224 has embedded within it a plurality of bearings 221. In a preferred embodiment, the plurality of bearings 221 are of the same shape and size. The plurality of bearings 221 are centered on the same straight line in the axial direction, and the central shaft 222 passes through the plurality of bearings 221 for guiding the central shaft 222 during the lifting process to prevent the central shaft 222 from being positionally deviated. A second flange 224 is disposed about a portion of the central shaft 222. The dynamic seal assembly 22 further includes a bellows 225, the bellows 225 is disposed on the central shaft 222 between the first flange 223 and the second flange 224, a top end of the bellows 225 abuts against a lower surface of the first flange 223, a bottom end of the bellows 225 abuts against a top end of the second flange 224 for dynamically sealing the first through hole during the lifting and lowering of the dynamic seal assembly 22, and it is understood that other flexible sealing pipes may be used instead of the bellows 225. The slider on the ball screw may be fixedly connected to the central shaft 222 to drive the central shaft 222 to move up and down.
As shown in fig. 3, in some other embodiments, the dynamic seal assembly 22 further includes a bellows cover 226, the bellows cover 226 is disposed outside the bellows 225 and is lifted and lowered together with the bellows 225, and in a preferred embodiment, the bellows cover 226 is made of peek material, so as to prevent metal contamination of the metal material of the bellows 225 to the inside of the chamber 3.
In a preferred embodiment, as shown in fig. 4, the apparatus for improving the uniformity of pumping air for an integrated circuit device according to the present invention further comprises a louver 8, wherein the louver 8 is disposed between the cavity 3 and the pumping section 1 for adjusting the pumping rate of the pumping section 1. Specifically, the louver 8 is disposed right below the air exhaust hole in the center of the bottom of the cavity 3, and the louver 8 is located right above the air exhaust portion 1. A driving mechanism (not shown) is connected to the louver 8 for controlling the opening of the louver 8, thereby adjusting the air-extracting rate of the air-extracting portion 1. The adjustment range of the opening degree of the louver 8 is 0 ° (i.e., fully closed) to 90 ° (i.e., fully open), enabling the adjustment range of the air pumping rate to be increased. The inside of cavity 3 is provided with compound vacuometer (not shown in the figure) and film gauge vacuometer (not shown in the figure), compound vacuometer is used for measuring the high-low vacuum in the cavity 3, film gauge vacuometer is used for measuring the technology vacuum in the cavity 3, compound vacuometer and film gauge vacuometer all with actuating mechanism communication connection, be used for feeding back the actuating mechanism with the detection data, actuating mechanism is according to the aperture of detection data real time control shutter 8, thereby the speed of bleeding is adjusted, make the even balance of concentration in the cavity 3, avoid process gas extravagant simultaneously.
In some embodiments, the structures below the carrier 5, including the mounting frame 4 and the support legs 51, are symmetrical with respect to the center of the pumping hole formed in the bottom center of the chamber 3, so that the whole track of the process gas pumped by the pumping part 1 is concentric and symmetrical, and the uniformity of the gas concentration in the chamber 3 is improved.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to practice the present invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the invention. Thus, the present invention is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a device that is used for integrated circuit equipment to improve homogeneity of bleeding, a serial communication port, including portion, lift portion, cavity and the mounting bracket of bleeding, the aspirating hole has been seted up to the central authorities of the bottom of cavity, the portion of bleeding set up in the central authorities of the lower surface of cavity pass through the aspirating hole with the cavity intercommunication, lift portion set up in one side of the lower surface of cavity, and with mounting bracket fixed connection is in order to drive the mounting bracket goes up and down, the mounting bracket set up in the inside of cavity, the mounting bracket is used for connecing at the lift in-process and gets and place the wafer.
2. The apparatus of claim 1, wherein the mounting frame comprises a plurality of support posts, and the plurality of support posts are vertically arranged uniformly along the periphery of the mounting frame.
3. The apparatus of claim 2, further comprising a stage, wherein the stage is disposed in the center of the interior of the cavity, and the stage is located above the mounting frame.
4. The apparatus according to claim 3, wherein the carrier has a plurality of second through holes, and the support posts pass through the second through holes.
5. The apparatus according to any of claims 1 to 4, wherein the lifting portion comprises a driving assembly and a dynamic seal assembly, the driving assembly is used for driving the dynamic seal assembly to perform a lifting motion, and the dynamic seal assembly is fixedly connected to the mounting frame.
6. The apparatus according to claim 5, wherein the dynamic seal assembly comprises a plurality of bearings, a central shaft, a first flange, and a second flange, the first flange is disposed on top of the central shaft, the plurality of bearings are embedded inside the second flange, the central shaft passes through the plurality of bearings, and the first flange is fixedly connected to the mounting bracket.
7. The apparatus of claim 6, wherein the dynamic seal assembly further comprises a flexible sealing tube that is nested over the central axis between the first flange and the second flange.
8. The apparatus of claim 7, wherein a top end of the flexible sealing tube abuts a lower surface of the first flange and a bottom end of the flexible sealing tube abuts a top end of the second flange.
9. The apparatus according to claim 8, wherein the dynamic seal assembly further comprises a flexible sealing tube cover, and the flexible sealing tube cover is disposed outside the flexible sealing tube.
10. The apparatus of claim 6, wherein the driving assembly comprises a servo motor and a ball screw for converting the rotation of the rotation shaft of the servo motor into linear motion, and the central shaft is fixedly connected to a slide block of the ball screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211267038.6A CN115483085A (en) | 2022-10-17 | 2022-10-17 | Device for improving air exhaust uniformity of integrated circuit equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211267038.6A CN115483085A (en) | 2022-10-17 | 2022-10-17 | Device for improving air exhaust uniformity of integrated circuit equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115483085A true CN115483085A (en) | 2022-12-16 |
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ID=84395470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211267038.6A Pending CN115483085A (en) | 2022-10-17 | 2022-10-17 | Device for improving air exhaust uniformity of integrated circuit equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115483085A (en) |
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2022
- 2022-10-17 CN CN202211267038.6A patent/CN115483085A/en active Pending
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