CN115478238A - Photovoltaic solder strip processing is with scribbling tin device - Google Patents

Photovoltaic solder strip processing is with scribbling tin device Download PDF

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Publication number
CN115478238A
CN115478238A CN202211048725.9A CN202211048725A CN115478238A CN 115478238 A CN115478238 A CN 115478238A CN 202211048725 A CN202211048725 A CN 202211048725A CN 115478238 A CN115478238 A CN 115478238A
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CN
China
Prior art keywords
tin
coating
frame
solder strip
processing
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Pending
Application number
CN202211048725.9A
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Chinese (zh)
Inventor
何建忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Tian Yang Steel Tube Co ltd
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Shanghai Tian Yang Steel Tube Co ltd
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Publication date
Application filed by Shanghai Tian Yang Steel Tube Co ltd filed Critical Shanghai Tian Yang Steel Tube Co ltd
Priority to CN202211048725.9A priority Critical patent/CN115478238A/en
Publication of CN115478238A publication Critical patent/CN115478238A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08Tin or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003Apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • C23C2/40Plates; Strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • H01L31/188Apparatus specially adapted for automatic interconnection of solar cells in a module
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating With Molten Metal (AREA)

Abstract

The invention relates to a tin coating device for processing a photovoltaic solder strip, and belongs to the technical field of photovoltaic processing. The tin-coating dustproof frame comprises a base and a tin-coating dustproof frame arranged on the upper surface of the base, wherein material transfer structures are respectively arranged on two sides of the base, the tin-coating dustproof frame is divided into a left tin-coating frame and a right cooling frame by an intermediate partition plate, the tin-coating structure comprises a tin-coating supporting frame and a tin melting crucible arranged in the tin-coating supporting frame, and a plurality of heating resistance wires are arranged between the tin melting crucible and the tin-coating supporting frame. The invention has the advantages that: the solder strip to be tin-coated is operated through the feeding device and the receiving device, molten tin cream is coated on the upper side and the lower side of the solder strip through the tin-coating structures arranged up and down, the tin cream on the solder strip is uniformly scraped through the scraper blade, and meanwhile, the surface of the solder strip is cleaned through the cleaning structures so as to reduce dust on the surface of the solder strip.

Description

Photovoltaic solder strip processing is with scribbling tin device
Technical Field
The invention relates to a tin coating device for processing a photovoltaic solder strip, and belongs to the technical field of photovoltaic processing.
Background
At present, most photovoltaic welding strips used for solar modules adopt a copper strip for hot coating tin, and the process used by the existing photovoltaic welding strips is to form a coating layer of 30 mu m on the surface of the copper strip by utilizing the copper strip to rapidly pass through a molten tin material, so that the welding strips have welding capacity and are traditional hot dip coating. The photovoltaic solder strip is scribbling the tin in-process, need even scribble the two sides of copper strips with tin, and current tin coating device is because structural problem, and one shot operation can only scribble the one side of copper strips with the tin material, and the another side of copper strips is scribbled tin and then need repeat foretell method, can not scribble the both sides of solder strip simultaneously to lead to scribbling tin efficiency lower, to above-mentioned problem, need a photovoltaic solder strip processing of novel structure to scribble tin device in the trade, can realize once only two-sided tin coating, in order to improve the efficiency of scribbling tin.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the utility model provides a photovoltaic solder strip processing is with scribbling tin device to solve the problem that faces in the trade.
In order to solve the technical problems, the invention is realized by the following technical scheme: the utility model provides a photovoltaic solder strip processing is with scribbling tin device, includes the base and install in the dustproof frame of scribbling tin of base upper surface, the both sides of base still are provided with material transfer structure respectively, the inside of scribbling the dustproof frame of tin is provided with intermediate bottom, intermediate bottom will scribble the dustproof frame of tin and separate for left side scribble tin frame and right side cooling frame, be provided with a set of structure the same and from top to bottom arrangement scribble tin structure in the frame of scribbling tin in the left side, scribble tin structure including scribbling the tin carriage, install in scribble the tin crucible in the tin carriage, melt the tin crucible with scribble and be provided with a plurality of heating resistor silk between the tin carriage.
Preferably, the top of the tin-coated supporting frame is provided with a cover plate, the cover plate is provided with a cylinder support, the cylinder support is provided with a tin-removing cylinder, a cylinder shaft of the tin-removing cylinder extends into the tin melting crucible, and a cylinder shaft of the tin-removing cylinder is provided with a tin-removing plate.
Preferably, a groove is formed in the side edge of the tin discharging plate, and a sealing ring is arranged in the groove.
Preferably, the bottoms of the tin-coating supporting frame and the tin melting crucible are respectively provided with a discharge port, and the discharge ports are overlapped with each other.
Preferably, a flow guide structure is arranged in the discharge port and comprises a flow guide frame with a hollow inner part, a plurality of stop blocks are further arranged on two sides of the inner part of the flow guide frame, a scraper is arranged on the outer side of the flow guide frame in the length direction, and a plug is further arranged between the stop blocks.
Preferably, the left side and the right side of the tin-coated dustproof frame are respectively provided with a plurality of cleaning structures, each cleaning structure comprises a cleaning rod, a cleaning circular plate is arranged on each cleaning rod, and cleaning fluff is arranged on each cleaning circular plate.
Preferably, a plurality of cooling air pipes are arranged in the right cooling frame, and a temperature detector is further arranged in the right cooling frame.
Preferably, a middle groove is formed in the middle of the middle partition plate.
Preferably, the base is formed by connecting a plurality of cross beams and upright posts.
Compared with the prior art, the invention has the advantages that: the welding strip to be coated with tin is operated through the feeding device and the receiving device, molten tin paste is coated on the upper side and the lower side of the welding strip through the tin coating structures arranged up and down, the tin paste on the welding strip is uniformly scraped through the scraper blade, and meanwhile, the surface of the welding strip is cleaned through the cleaning structures so as to reduce dust on the surface of the welding strip.
Description of the drawings:
the invention is further described below with reference to the accompanying drawings.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of a tin-coated structure.
Fig. 3 is a hierarchical view of a tin-coated structure.
Fig. 4 is a schematic view of a flow directing structure.
Fig. 5 is another structural schematic diagram of the flow guide structure.
Fig. 6 is a schematic view of a cleaning structure.
Fig. 7 is a schematic structural view of the feeding device.
Fig. 8 is an exploded view of the feeding device.
Fig. 9 is a schematic structural view of the material receiving device.
In the figure: a base 1; a cross member 101; a column 102; a tin-coated dustproof frame 2; a feeding device 3; a feeding support frame 301; a horizontal cross bar 302; a bearing 303; an inner barrel 304; a solder tape roll 305; a stop nut 306; a material receiving device 4; a receiving motor 401; a left tin-coated frame 5; a right cooling frame 6; a cooling air duct 601; a temperature detector 602; a tin-coated structure 7; a tin-coated support frame 701; a tin melting crucible 702; a heating resistance wire 703; a cover plate 704; a cylinder support 705, a tin exhaust cylinder 706; a tin-stripping plate 707; a groove 708; a seal ring 709; a discharge port 710; a flow guide structure 8; a flow guide frame 801; a stopper 802; a squeegee 803; a plug 804; a cleaning structure 9; a cleaning bar 901; cleaning the circular plate 902; cleaning the fluff 903; a middle partition plate 10; a middle groove 1001.
The specific implementation mode is as follows:
the invention is described in detail below with reference to the following figures and embodiments:
the tin coating device for processing the photovoltaic solder strip comprises a base 1 and a tin coating dustproof frame 2 installed on the upper surface of the base 1, wherein a feeding device 3 and a receiving device 4 are respectively arranged on two sides of the base 1, a middle partition plate 10 is arranged inside the tin coating dustproof frame 2, the tin coating dustproof frame 2 is divided into a left tin coating frame 5 and a right cooling frame 6 by the middle partition plate 10, a group of tin coating structures 7 which are identical in structure and are arranged up and down are arranged in the left tin coating frame 5, each tin coating structure 7 comprises a tin coating supporting frame 701 and a tin melting crucible 702 installed in the tin coating supporting frame 701, and a plurality of heating resistance wires 703 are arranged between the tin melting crucible 702 and the tin coating supporting frame 701.
As shown in fig. 2 and fig. 3, a cover plate 704 is disposed on the top of the tin-coated supporting frame 701, a cylinder support 705 is disposed on the cover plate 704, a tin-discharging cylinder 706 is disposed at the bottom of the cylinder support 705, a cylinder shaft of the tin-discharging cylinder 706 extends into the tin-melting crucible 702, and a tin-discharging plate 707 is disposed on a cylinder shaft of the tin-discharging cylinder 706.
A groove 708 is formed on the side of the tin-removing plate 707, and a sealing ring 709 is arranged in the groove 708, so that when the tin-removing plate 707 is pushed by the tin-removing cylinder 706 to move up and down, molten tin can be completely pushed to a set place.
As shown in fig. 4 and 5, a flow guide structure 8 is arranged in the discharge port 710, the flow guide structure 8 includes a flow guide frame 801 with a hollow interior, a plurality of stoppers 802 are further arranged on two sides of the interior of the flow guide frame 801, gaps are arranged between the stoppers 802, the purpose of arranging the stoppers 802 is to make the width of the gaps between the stoppers 802 the same as the width of a solder strip to be tin-coated, so as to prevent molten tin from leaking out or being not coated on the solder strip due to too large or too small gaps, a scraper 803 is arranged on the outer side of the flow guide frame 801 in the length direction, a plug 804 is further arranged between the stoppers 802, the plug 804 is used for blocking the gaps between the stoppers 802, so as to prevent the molten tin from leaking out, and when the tin coating is needed, the plug 804 is pulled out.
As shown in fig. 6, a plurality of cleaning structures 9 are respectively disposed on the left and right sides of the tin-coated dustproof frame 2, the cleaning structures 9 include cleaning rods 901, cleaning circular plates 902 are disposed on the cleaning rods 901, and cleaning bristles 903 are disposed on the cleaning circular plates 901.
A plurality of cooling air pipes 601 are arranged in the right cooling frame 6, the solder strip coated with tin is blown by the cooling air pipes 601 to be cooled so that solder paste on the solder strip can be solidified as soon as possible, a temperature detector 602 is further arranged in the right cooling frame 6, and the temperature in the right cooling frame 6 is detected by the temperature detector 602 so that a user can accurately grasp the temperature in the right cooling frame 6.
A middle groove 1001 is formed in the middle of the middle partition 10 to allow a solder strip to pass through, and the base 1 is formed by connecting a plurality of cross beams 101 and columns 102, so that the stability of the base 1 is improved.
As shown in fig. 7 to 9, the feeding device 3 includes a feeding support frame 301, a horizontal cross rod 302 horizontally disposed is disposed on a side of the feeding support frame 301, a plurality of bearings 303 are sleeved on the horizontal cross rod 301, an inner cylinder 304 is sleeved on the bearing 301, a welding strip coil 305 is sleeved on the inner cylinder 301, a material blocking nut 306 is further disposed on an end portion of the horizontal cross rod 301, and a material receiving motor 401 is further disposed on the material receiving device 4.
During the use, material feeding unit 3 and material collecting device 4's structure is similar, material collecting device 4 is provided with a material collecting motor 401 more than material feeding unit 3, will wait to scribble the tin weld the area book 305 and place material feeding unit 3 on, weld the area book and pass between the tin structure 7, and pass the middle recess 1001 of intermediate bottom plate 10, set up the one end of welding tape book 305 on material collecting device 4, drive the empty welding tape book 305 rotation on the material collecting device 4 through material collecting motor 401, thereby drive the transmission of welding tape book.
When tin is coated, a tin block to be molten is placed in the tin melting crucible 702, the tin block is heated through the heating resistance wire 703 and is melted into molten tin or tin paste, the plug 804 is pulled out of the flow guide frame 801, so that the molten tin flows out of the flow guide frame 801 and flows onto a welding strip to be coated with tin, the welding strip is scraped flatly through the scraper 803 in the moving process, the thickness of the tin paste on the welding strip reaches the set size, when the welding strip coated with the tin paste runs into the right cooling frame 6, the cooling air pipes 601 in the right cooling frame 6 are used for cooling the welding strip coated with the tin paste, and the tin paste on the welding strip can be solidified as soon as possible.
In the actual tin coating process, if the bottom of the welding strip needs to be coated with tin, the tin coating structure 7 arranged at the bottom of the welding strip is started, the tin discharging cylinder 706 is started, the cylinder shaft of the tin discharging cylinder 706 pushes the tin discharging plate 707 to ascend, the tin discharging plate 707 pushes molten tin to the discharge port 710 to coat the tin on the welding strip above the discharge port 710, and therefore the front side and the back side of the welding strip can be coated with tin through the plurality of tin coating structures 7.
It is to be emphasized that: the above embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention in any way, and all simple modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.

Claims (10)

1. The utility model provides a photovoltaic solder strip processing is with scribbling tin device which characterized in that: the tin-coating dustproof frame comprises a base (1) and a tin-coating dustproof frame (2) arranged on the upper surface of the base (1), wherein a feeding device (3) and a material receiving device (4) are respectively arranged on two sides of the base (1), an intermediate partition plate (10) is arranged inside the tin-coating dustproof frame (2), the tin-coating dustproof frame (2) is divided into a left tin-coating frame (5) and a right cooling frame (6) by the intermediate partition plate (10), a set of tin-coating structures (7) which are identical in structure and are arranged up and down are arranged in the left tin-coating frame (5), each tin-coating structure (7) comprises a tin-coating supporting frame (701) and a tin melting crucible (702) arranged in the tin-coating supporting frame (701), and a plurality of heating resistance wires (703) are arranged between the tin-coating crucible (702) and the tin-coating supporting frame (701).
2. The tin coating device for processing the photovoltaic solder strip as recited in claim 1, wherein: the tin coating support frame is characterized in that a cover plate (704) is arranged at the top of the tin coating support frame (701), a cylinder support (705) is arranged on the cover plate (704), a tin discharging cylinder (706) is arranged on the cylinder support (705), a cylinder shaft of the tin discharging cylinder (706) extends into the tin melting crucible (702), and a tin discharging plate (707) is arranged on the cylinder shaft of the tin discharging cylinder (706).
3. The photovoltaic solder strip processing is with scribbling tin device of claim 2 characterized in that: a groove (708) is formed in the side edge of the tin removing plate (707), and a sealing ring (709) is arranged in the groove (708).
4. The photovoltaic solder strip processing is with scribbling tin device of claim 1 characterized in that: the tin-coated supporting frame (701) and the bottom of the tin melting crucible (702) are respectively provided with a discharge hole (710), and the discharge holes (710) are mutually overlapped.
5. The tin coating device for processing the photovoltaic solder strip as recited in claim 4, wherein: be provided with water conservancy diversion structure (8) in discharge gate (710), water conservancy diversion structure (8) are including inside hollow water conservancy diversion frame (801), the both sides of the inside of water conservancy diversion frame (801) still are provided with a plurality of dogs (802), the ascending outside of water conservancy diversion frame (801) length direction is provided with scraper blade (803), still be provided with end cap (804) between dog (802).
6. The photovoltaic solder strip processing is with scribbling tin device of claim 1 characterized in that: the left side and the right side of the tin-coated dustproof frame (2) are respectively provided with a plurality of cleaning structures (9), each cleaning structure (9) comprises a cleaning rod (901), a cleaning circular plate (902) is arranged on each cleaning rod (901), and cleaning fluff (903) is arranged on each cleaning circular plate (901).
7. The tin coating device for processing the photovoltaic solder strip as recited in claim 1, wherein: a plurality of cooling air pipes (601) are arranged in the right cooling frame (6), and a temperature detector (602) is further arranged in the right cooling frame (6).
8. The tin coating device for processing the photovoltaic solder strip as recited in claim 1, wherein: the middle of the middle clapboard (10) is provided with a middle groove (1001).
9. The photovoltaic solder strip processing is with scribbling tin device of claim 1 characterized in that: the base (1) is formed by mutually connecting a plurality of cross beams (101) and upright columns (102).
10. The tin coating device for processing the photovoltaic solder strip as recited in claim 1, wherein: material feeding unit (3) are including pay-off support frame (301), the side of pay-off support frame (301) sets up horizontal pole (302) that the level was placed, horizontal pole (301) have been gone up and have been cup jointed a plurality of bearings (303), inner tube (304) have been cup jointed on bearing (301), inner tube (301) have been gone up and have been cup jointed and have been welded the book of coils (305), the tip of horizontal pole (301) still sets up and keeps off material nut (306), still be provided with on material collecting device (4) and receive material motor (401).
CN202211048725.9A 2022-08-29 2022-08-29 Photovoltaic solder strip processing is with scribbling tin device Pending CN115478238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211048725.9A CN115478238A (en) 2022-08-29 2022-08-29 Photovoltaic solder strip processing is with scribbling tin device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211048725.9A CN115478238A (en) 2022-08-29 2022-08-29 Photovoltaic solder strip processing is with scribbling tin device

Publications (1)

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CN115478238A true CN115478238A (en) 2022-12-16

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58213863A (en) * 1982-06-08 1983-12-12 Nippon Kokan Kk <Nkk> Continuous type galvanizing installation for both single and double surfaces
US5314758A (en) * 1992-03-27 1994-05-24 The Louis Berkman Company Hot dip terne coated roofing material
EP1284164A1 (en) * 2001-08-14 2003-02-19 Inductotherm Coating Equipment S.A. Process and apparatus for coating with a melted product
WO2008145112A1 (en) * 2007-05-31 2008-12-04 Solarwatt Ag Layer thickness measuring instrument, and method for measuring a layer thickness in tinned metal strips used as electrical connectors
CN203007375U (en) * 2012-11-19 2013-06-19 西安正昌电子有限责任公司 Photovoltaic welding strip tin-plating machine
CN204434708U (en) * 2015-01-21 2015-07-01 江苏威腾铜业有限公司 Photovoltaic welding belt is coated with tin device
CN205420520U (en) * 2016-03-02 2016-08-03 陕西光德电子材料有限公司 Photovoltaic solder strip processing is with scribbling tin device
CN207619500U (en) * 2017-11-10 2018-07-17 常州九天新能源科技有限公司 A kind of two-sided tin machine
CN111396641A (en) * 2020-03-23 2020-07-10 上海天阳钢管有限公司 Steel-aluminum composite pipe and manufacturing method thereof
CN216073986U (en) * 2021-06-24 2022-03-18 江阴市晨达新能源科技有限公司 Tin melting furnace of photovoltaic solder strip tin coating machine

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58213863A (en) * 1982-06-08 1983-12-12 Nippon Kokan Kk <Nkk> Continuous type galvanizing installation for both single and double surfaces
US5314758A (en) * 1992-03-27 1994-05-24 The Louis Berkman Company Hot dip terne coated roofing material
EP1284164A1 (en) * 2001-08-14 2003-02-19 Inductotherm Coating Equipment S.A. Process and apparatus for coating with a melted product
WO2008145112A1 (en) * 2007-05-31 2008-12-04 Solarwatt Ag Layer thickness measuring instrument, and method for measuring a layer thickness in tinned metal strips used as electrical connectors
CN203007375U (en) * 2012-11-19 2013-06-19 西安正昌电子有限责任公司 Photovoltaic welding strip tin-plating machine
CN204434708U (en) * 2015-01-21 2015-07-01 江苏威腾铜业有限公司 Photovoltaic welding belt is coated with tin device
CN205420520U (en) * 2016-03-02 2016-08-03 陕西光德电子材料有限公司 Photovoltaic solder strip processing is with scribbling tin device
CN207619500U (en) * 2017-11-10 2018-07-17 常州九天新能源科技有限公司 A kind of two-sided tin machine
CN111396641A (en) * 2020-03-23 2020-07-10 上海天阳钢管有限公司 Steel-aluminum composite pipe and manufacturing method thereof
CN216073986U (en) * 2021-06-24 2022-03-18 江阴市晨达新能源科技有限公司 Tin melting furnace of photovoltaic solder strip tin coating machine

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