CN115474128A - High-sensitivity underwater acoustic transducer - Google Patents
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- H—ELECTRICITY
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- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/44—Special adaptations for subaqueous use, e.g. for hydrophone
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- H—ELECTRICITY
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- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
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Abstract
The application provides a high-sensitivity underwater acoustic transducer, which comprises a piezoelectric device, a first electrode lead, a second electrode lead and a shell, wherein the piezoelectric device is fixed in the shell in a waterproof and sound-transmitting manner and comprises a first piezoelectric module, a second piezoelectric module and a conductive flat plate; the first piezoelectric module includes a first array with a first substrate; the second piezoelectric module includes a second array with a second substrate; the electric polarities of the first substrate and the second substrate are the same, and the end faces of the first array and the end faces of the second array are oppositely and fixedly connected to two sides of the conductive flat plate; one end of the first electrode lead is connected with the conductive flat plate, and one end of the second electrode lead is connected with the first substrate and the second substrate; the other end of the first electrode lead and the other end of the second electrode lead are led to the outside of the case in a watertight manner. The application provides a high sensitivity acoustic transducer adopts the piezoelectric device that the subtend was piled up, can promote piezoelectric device's sensitivity comprehensively, is favorable to the discernment to the very weak underwater acoustic signal.
Description
Technical Field
The application belongs to the technical field of underwater acoustic measuring equipment, and particularly provides a high-sensitivity underwater acoustic transducer.
Background
The underwater acoustic transducer mutually converts an underwater acoustic signal and an electric signal through a piezoelectric effect, is key equipment in the field of underwater acoustic signal processing, and has important significance for enhancing the communication effect of underwater equipment and improving the detection capability of ocean resources.
The key to improve the performance of the underwater acoustic transducer is to improve the performance of the piezoelectric device (also referred to as a piezoelectric vibrator, a sensitive element) used in the underwater acoustic transducer, for example, current research on improving the performance of the medium-high frequency receiving underwater acoustic transducer (hydrophone) mainly focuses on improving the receiving sensitivity of the transducer, that is, by improving the electromechanical conversion efficiency of the transducer, the receiving sensitivity is improved, so as to enhance the capability of the transducer for receiving weak signals and increase the detection range.
The prior art improves the receiving sensitivity of the transducer mainly by improving the electromechanical conversion efficiency of the transducer. For example, the currently common type 1-3 piezoelectric composite material changes the vibration mode of the material by converting the thickness vibration of a whole piezoelectric material into the longitudinal stretching vibration of a plurality of piezoelectric pillars, thereby improving the performance. By cutting single-phase piezoelectric material into piezoelectric pillar array, the thickness of the whole piezoelectric material vibrates (electromechanical coupling coefficient k) t About 0.5) will be converted into longitudinal length stretching vibration (electromechanical coupling coefficient k) of the piezoelectric pillar array 33 About 0.7), the equivalent thickness electromechanical coupling coefficient of the 1-3 type piezoelectric composite material is improved by about 20 percent compared with the thickness electromechanical coupling coefficient of a pure piezoelectric material by changing the vibration mode of the material.
However, the above prior art solutions for increasing the sensitivity of the transducer still have much room for improvement: on one hand, different influences on the electromechanical coupling coefficient caused by different shapes, sizes and arrangement modes of the piezoelectric pillars need to be deeply researched and an optimal parameter combination needs to be selected, and on the other hand, on the basis of optimizing the piezoelectric pillar array, the overall structure of the piezoelectric device needs to be further improved, so that the effective electromechanical coupling coefficient can be sufficiently improved, a synergistic effect is generated with the optimized piezoelectric pillar parameters, and the performance of the piezoelectric device is further improved.
Disclosure of Invention
In order to solve the above-mentioned problems in the prior art, an object of the present invention is to provide a high-sensitivity underwater acoustic transducer, which has higher sensitivity in a high frequency band than the conventional underwater acoustic transducer by optimizing the structure of a piezoelectric device thereof.
The technical scheme is as follows:
a high-sensitivity underwater acoustic transducer comprises a piezoelectric device, a first electrode lead, a second electrode lead and a shell, wherein the piezoelectric device is fixed inside the shell in a waterproof and sound-transmitting manner;
the piezoelectric device comprises a first piezoelectric module, a second piezoelectric module and a conductive flat plate;
the first piezoelectric module comprises a first array with a first substrate, the first array comprising a plurality of first piezoelectric posts having a first height, the second piezoelectric module comprises a second array with a second substrate, the second array comprising a plurality of second piezoelectric posts having a second height;
the electric polarities of the first substrate and the second substrate are the same, and the end faces of the first array and the end faces of the second array are oppositely and fixedly connected to two sides of the conductive flat plate;
one end of the first electrode lead is connected with the conductive flat plate, one end of the second electrode lead is connected with the first substrate and the second substrate, and the other end of the first electrode lead and the other end of the second electrode lead are led to the outside of the shell in a waterproof mode.
Preferably, each first piezoelectric column has a square cross section with a first side length, and a ratio of the first height to the first side length is greater than or equal to 5; the cross section of each second piezoelectric column is a square with a second side length, and the ratio of the second height to the second side length is greater than or equal to 5.
Preferably, the ratio of the array period of the first array to the first side length is 1.3-1.5; the ratio of the array period of the second array to the second side length is 1.3-1.5.
Preferably, the first height is equal to the second height and the first array and the second array are mirror symmetric with respect to the conductive plate; the thickness of the first substrate is the same as that of the second substrate, and the first substrate and the second substrate are in mirror symmetry relative to the conductive flat plate.
Optionally, the piezoelectric materials used by the first piezoelectric module and the second piezoelectric module are piezoelectric ceramics and/or piezoelectric crystals.
The conductive flat plate is made of a metal plate with Young modulus more than or equal to 9 multiplied by 10^10Pa and thickness of 0.18 mm-0.3 mm.
Preferably, the gaps of the first piezoelectric columns are filled with air, and the gaps of the second piezoelectric columns are filled with air.
Preferably, the piezoelectric device is encapsulated by a waterproof sealing layer.
Preferably, the housing comprises a shell and a metal cover; the shell is made of waterproof and sound-transmitting materials and is detachably connected with the metal cover in a sealing mode.
The high-sensitivity underwater acoustic transducer provided by the application has at least the following beneficial effects:
firstly, the piezoelectric device used by the high-sensitivity underwater acoustic transducer has a novel opposite stacked structure, the structure can accommodate two piezoelectric modules which are connected in parallel in the same section size as a single piezoelectric module, and the current value of an electric signal obtained by converting an acoustic signal can be amplified in multiple times by utilizing the stacked structure of the piezoelectric modules under the condition of keeping the section size of the piezoelectric device unchanged, so that the sensitivity of the piezoelectric device is effectively improved, and the identification of an extremely weak underwater acoustic signal is facilitated;
secondly, by adopting a piezoelectric device structure which is oppositely stacked and amplifies current in parallel, the effective electromechanical coupling coefficient can be further improved relative to a single piezoelectric module or a plurality of piezoelectric module structures which are connected in series;
in addition, the piezoelectric device used by the high-sensitivity underwater acoustic transducer integrally prolongs the longitudinal length of the piezoelectric column under the condition that the transverse size of the piezoelectric column is not changed, and the piezoelectric column in a single piezoelectric module is not required to be designed to be too thin, so that the anti-cracking or breaking capability of the piezoelectric device is ensured on the basis of improving the longitudinal telescopic performance of the piezoelectric column, and the overall performance of the piezoelectric device is further improved.
Drawings
FIG. 1 is an exploded view of a high sensitivity underwater acoustic transducer according to an embodiment of the present application;
FIG. 2a is a front view of a piezoelectric device according to an embodiment of the present application;
FIG. 2b is a side view of a piezoelectric device according to an embodiment of the present application;
fig. 2c is an exploded view of a piezoelectric device according to an embodiment of the present application;
FIG. 3a is a front view of a first piezoelectric module according to an embodiment of the present application;
FIG. 3b is a top view of a first piezoelectric module according to an embodiment of the present application;
FIG. 3c is a side view of a first piezoelectric module according to an embodiment of the present application;
FIGS. 4a to 4e are respectively a piezoelectric cylinder composed of a pure piezoelectric material, a 1-3 type piezoelectric composite material, a 1-3-2 type piezoelectric composite material, a 2-1-2 type piezoelectric sensitive material, and a piezoelectric sensitive material of an opposite stacked structure;
fig. 5 is a longitudinal vibration characteristic of a piezoelectric cylinder in a piezoelectric device structure according to an embodiment of the present application;
fig. 6 is a schematic diagram of main steps of manufacturing a piezoelectric device according to an embodiment of the present application;
FIG. 7a is a graph showing the results of the in-air admittance test of an underwater acoustic transducer and an underwater acoustic transducer fabricated using a type 2-1-2 piezoelectric sensing material according to an embodiment of the present application;
FIG. 7b is a graph showing the underwater admittance test results of the underwater acoustic transducer according to the embodiment of the present application and the underwater acoustic transducer fabricated using the type 2-1-2 piezoelectric sensing material;
fig. 8 is a test result of the receiving sensitivity of the underwater acoustic transducer and the underwater acoustic transducer manufactured by using the piezoelectric sensitive material of type 2-1-2 according to the embodiment of the present application.
Reference numerals in the figures
100: first piezoelectric module, 110: first piezoelectric column, 120: first substrate, 200: second piezoelectric module, 210: second piezoelectric column, 220: second substrate, 300: conductive flat plate, 400: sealing layer, 500: a housing, 600: metal cover, 700: first electrode lead, 800: a second electrode lead.
Detailed Description
Hereinafter, the present application will be further described based on preferred embodiments with reference to the drawings.
In addition, various components on the drawings are enlarged or reduced for convenience of understanding, but this is not intended to limit the scope of the present application.
Singular references also include plural references and vice versa.
In the description of the embodiments of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually arranged when the products of the embodiments of the present application are used, the description is only for convenience and simplicity, but the indication or suggestion that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus, the application cannot be construed as being limited. Moreover, the terms first, second, etc. may be used in the description to distinguish between different elements, but these should not be limited by the order of manufacture or by importance to be understood as indicating or implying any particular importance, and their names may differ from their names in the detailed description of the application and the claims.
The terminology used in the description is for the purpose of describing the embodiments of the application and is not intended to be limiting of the application. It is also to be understood that, unless otherwise expressly stated or limited, the terms "disposed," "connected," and "connected" are intended to be open-ended, i.e., may be fixedly connected, detachably connected, or integrally connected; they may be mechanically coupled, directly coupled, indirectly coupled through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present application will be specifically understood by those skilled in the art.
The present application provides a high-sensitivity underwater acoustic transducer, fig. 1 shows an exploded view of a structure of the underwater acoustic transducer in some embodiments, and fig. 2a to 2c respectively show a front view, a side view and an exploded view of a piezoelectric device used in the underwater acoustic transducer, as shown in fig. 1 and 2, the underwater acoustic transducer includes a piezoelectric device, a first electrode lead 700, a second electrode lead 800 and a housing.
Further, in some embodiments, the housing comprises a casing 500 and a metal cover 600, wherein the casing 500 is preferably made of a waterproof and sound-transparent material, such as polyurethane, and the piezoelectric device is fixed in the casing 500 and the metal cover 600 is hermetically connected to the casing 500, so as to implement a waterproof and sound-transparent sealing process for the piezoelectric device. The manufacturing process of the underwater acoustic transducer is well known to those skilled in the art, and will not be described herein.
Further, in some embodiments, as shown in fig. 2a to 2c, the piezoelectric device used in the underwater acoustic transducer includes a first piezoelectric module 100, a second piezoelectric module 200 and a conductive plate 300.
Wherein the first piezoelectric module 100 comprises a first array with a first substrate 120, the first array comprising a plurality of first piezoelectric pillars 110 having a first height; similarly, the second piezoelectric module 200 includes a second array with a second substrate 220, the second array including a plurality of second piezoelectric columns 210 having a second height.
Fig. 3a to 3c respectively show a front view, a top view and a side view of the structure of the first piezoelectric module 100, and as shown in fig. 2a and 2c, the first array of the first piezoelectric module 100 includes a plurality of first piezoelectric pillars 110 periodically arranged on the first substrate 120 along the X, Y direction, wherein each of the first piezoelectric pillars 110 has the same height h 1 (i.e., the end faces of the first array are in the same plane), the first substrate 120 has a thickness of h' 1 。
The second piezoelectric module 200 has a similar structure to the first piezoelectric module 100, and accordingly, each of the second piezoelectric columns 210 has the same height h 2 Thickness of the second substrate 220 is h' 2 。
The piezoelectric material used in the first piezoelectric module 100 and the second piezoelectric module 200 is piezoelectric ceramic or piezoelectric crystal, and in the embodiment of the present application, the first piezoelectric module 100 may be formed by polarizing a thickness of (h) 1 +h′ 1 ) The piezoelectric ceramic piece or the piezoelectric crystal piece is divided into h 1 Vertically cutting for cutting depth; similarly, the second piezoelectric module 200 may be formed by polarizing a film having a thickness (h) 2 +h′ 2 ) The piezoelectric ceramic sheet or the piezoelectric crystal sheet is divided into two parts 2 Vertically cutting for cutting depth; when the first piezoelectric module 100 and the second piezoelectric module 200 are diced, the cutting direction is set so that the first base 120 of the first piezoelectric module 100 and the second base 220 of the second piezoelectric module 200 obtained by dicing have the same electrical polarity.
In the embodiments provided in fig. 1 to 3, the cross-sectional shapes of the first substrate 120 and the second substrate 220 are square, and in other alternative embodiments, a person skilled in the art may also modify the cross-sectional shapes of the first substrate 120 and the second substrate 220 according to design requirements, for example, the cross-sectional shapes are rectangular, circular, rectangular ring, circular ring, or the like.
Further, in the embodiment of the present application, the first piezoelectric module 100 and the second piezoelectric module 200 are fixedly connected by the conductive flat plate 300, and the specific connection manner is as follows: the end face of the first array is opposite to the end face of the second array, and is fixedly connected to two side faces of the conductive flat plate 300 by means of conductive adhesive or the like. In the first piezoelectric module 100, the conductive plate 300, and the second piezoelectric module 200, which are fixedly connected to each other, the first substrate 120 and the second substrate 220 have the same electrical polarity, and the end surface of the first array, the end surface of the second array, and the conductive plate 300 have the same electrical polarity.
Further, one end of the first electrode lead 700 is connected to the conductive plate 300, one end of the second electrode lead 800 is connected to the first substrate 120 and the second substrate 220, and the other end of the first electrode lead 700 and the other end of the second electrode lead 800 are led to the outside of the case in a waterproof manner. Specifically, in some embodiments, the first electrode lead is connected to the conductive plate 300 inside the underwater acoustic transducer, the second electrode lead 800 may be led out of two connectors connected in parallel inside the underwater acoustic transducer to be connected to the first substrate 120 and the second substrate 220, respectively, and then the first electrode lead 700 and the second electrode lead 800 are led out to the outside of the underwater acoustic transducer through the metal cover 600, and the penetrating portion is subjected to waterproof sealing treatment.
In this embodiment, the first piezoelectric module 100, the second piezoelectric module 200 and the conductive flat plate 300 connecting the two piezoelectric modules, which are oppositely arranged in the same electrical polarity mirror image, form a novel opposite stacked piezoelectric device structure, which contains two piezoelectric modules connected in parallel in the same cross-sectional dimension as the single piezoelectric module, and the stacked structure of the piezoelectric modules is utilized, so that the current value of the electrical signal obtained by converting the acoustic signal can be amplified in multiples under the condition of keeping the cross-sectional dimension of the piezoelectric device unchanged, thereby effectively improving the sensitivity of the piezoelectric device, and being more beneficial to identifying the very weak underwater acoustic signal.
In addition, the piezoelectric device structure which is stacked oppositely and amplifies current in parallel can further improve the effective electromechanical coupling coefficient compared with a single piezoelectric module or a plurality of piezoelectric module structures which are connected in series. The mechanism for improving the effective electromechanical coupling coefficient is described in detail below.
When the performance of the transducer is measured or evaluated, the comprehensive performance of the piezoelectric material can be described by representing the strength of the piezoelectric effect and the reverse piezoelectric effect energy conversion performance of the piezoelectric material through the electromechanical coupling coefficient, and the electromechanical conversion performance of the material can be visually described by introducing the effective electromechanical coupling coefficient.
Effective electromechanical coupling coefficient k eff The piezoelectric device is a parameter which is most commonly used for measuring the conversion performance of a sensitive element at resonance, and generally, the piezoelectric device with a high effective electromechanical coupling coefficient value has higher receiving sensitivity. The value of the effective electromechanical coupling coefficient is not only related to the vibration mode, but also related to the material and the dimensional parameters thereof, and represents the ratio of the stored energy to the total stored energy of the lossless and unloaded material at resonance, and the calculation formula is shown as the following formula:
in the above formula, f re Resonant frequency, f, of piezoelectric structure at-re Is its anti-resonant frequency.
Based on the analogy principle of electromechanical equivalence, the vibration velocity in an acoustic system can be equivalent to the current in a circuit. Therefore, the larger the current, the larger the vibration velocity at the resonance frequency, that is, the higher the effective electromechanical coupling coefficient for the same sound pressure, the higher the receiving sensitivity.
The piezoelectric device of the opposite stacking structure and the parallel current amplification adopted by the high-sensitivity underwater acoustic transducer in the embodiment of the application can amplify the current of the electric signal in a multiplying power mode in the process of sound-electricity conversion, and can improve the vibration speed of the piezoelectric material at the resonant frequency under the condition that other conditions are unchanged, and further enables the piezoelectric componentK at resonant frequency eff The value is effectively improved, so that the sound-electricity conversion performance of the piezoelectric device at the resonant frequency is further improved on the basis of increasing the current to improve the overall sensitivity of the piezoelectric device, and the optimization of the comprehensive performance index of the underwater acoustic transducer is realized.
In order to verify the effect of the opposite stacking structure of the piezoelectric device on improving the effective electromechanical coupling coefficient, effective electromechanical coupling coefficients corresponding to different piezoelectric cylinder structures are respectively calculated. Fig. 4a to 4e respectively show a piezoelectric device composed of pure piezoelectric material, 1-3 type piezoelectric composite material, 1-3-2 type piezoelectric composite material, 2-1-2 type piezoelectric sensitive material and the piezoelectric sensitive material of the present application in an opposite stacked structure, in order to keep the variables consistent, the transverse dimension of the piezoelectric device in fig. 4a, the transverse dimension of the whole structure of the piezoelectric device in fig. 4b and 4c are consistent with the transverse dimension of the substrate of the piezoelectric device in fig. 4d and 4e, and the transverse dimension of the piezoelectric column wrapped by the flexible material in fig. 4b and 4c is consistent with the transverse dimension of the piezoelectric column in fig. 4d and 4 e. In the five device structures, metal plates of the same size and thickness were covered, and in order to obtain effective electromechanical coupling coefficients, the structures were simulated, and the effective electromechanical coupling coefficients were calculated and listed in table 1.
Table 1 comparison of the performances of piezoelectric devices of different structures
| Piezoelectric device structure | Resonant frequency | Antiresonance frequency | k eff |
| Pure piezoelectric material | 156kHz | 166kHz | 0.34 |
| 1-3 type piezoelectric composite material | 222kHz | 282kHz | 0.62 |
| 1-3-2 type piezoelectric composite material | 168kHz | 224kHz | 0.60 |
| 2-1-2 type piezoelectric sensitive material | 158kHz | 212kHz | 0.67 |
| Oppositely stacked piezoelectric sensitive materials | 120kHz | 168.5KHz | 0.70 |
As can be seen from table 1, under the same other conditions, the effective electromechanical coupling coefficient of the piezoelectric device structure provided in the embodiment of the present application is the highest, and the comprehensive performance of the piezoelectric device can be significantly improved as a whole by combining the effect of the piezoelectric device structure on improving the weak signal identification capability generated by amplifying the current.
Further, as shown in fig. 3a to 3c, in some preferred embodiments of the present application, each first piezoelectric column 110 has a cross-section with a first side length l 1 And h is a square of 1 /l 1 Is more than or equal to 5. Similarly, in some preferred embodiments, each second piezoelectric column 210 is transverseThe face has a second side length of 2 And h is 2 /l 2 ≥5。
Research shows that by reasonably designing the size parameters of the piezoelectric cylinder, the ratio of the longitudinal length to the cross section size of the piezoelectric cylinder is increased as much as possible (i.e., the overall structure of the piezoelectric cylinder is designed to be a slender shape as much as possible), and the electromechanical coupling coefficient of the longitudinal stretching vibration mode of the piezoelectric cylinder can be effectively improved, so that the receiving sensitivity is improved.
Fig. 5 shows a finite element analysis of the longitudinal vibration characteristic of a specific piezoelectric cylinder in an oppositely stacked piezoelectric device structure adopted by the high-sensitivity underwater acoustic transducer of the present application, as shown in fig. 5, the piezoelectric device structure integrally extends the longitudinal length of the piezoelectric cylinder under the condition that the transverse size of the piezoelectric cylinder is not changed, and the piezoelectric cylinder in a single piezoelectric module does not need to be designed to be too thin, so that the anti-crack or anti-fracture capability of the piezoelectric cylinder is ensured on the basis of improving the longitudinal expansion and contraction performance of the piezoelectric cylinder, and the overall performance of the piezoelectric device is further improved.
Further, as shown in fig. 3a, in the above preferred embodiment, the array period of each first piezoelectric column 110 in the first array is w 1 And 1.3. Ltoreq. W 1 /l 1 Less than or equal to 1.5. Similarly, in some preferred embodiments, the array period of each second piezoelectric column 210 in the second array is w 2 And 1.3. Ltoreq. W 2 /l 2 ≤1.5。
Further, in some preferred embodiments of the present application, the dimensional parameters of the first piezoelectric module 100 are identical to the dimensional relationships of the second piezoelectric module 200, namely: h is 1 Is equal to h 2 And is andthe first array and the second array are mirror symmetric with respect to the conductive plate 300; and h' 1 Is h' 2 And the first substrate 120 and the second substrate 220 are mirror-symmetrical with respect to the conductive plate 300.
By disposing the conductive plate 300 between the end faces of the first array and the second array, and disposing the first substrate 120 and the second substrate 220, a stress amplification effect can be achieved to further improve the receiving sensitivity of the transducer. The material of the conductive flat plate 300 may be gold, silver, copper, or other metal having good conductivity, and generally, by reducing the thickness of the conductive flat plate 300, the influence on the longitudinal expansion and contraction vibration of the piezoelectric column due to its mass can be reduced, but the thinner the thickness is not, the better it is because: when the conductive flat plate 300 is too thin, due to insufficient rigidity of the whole conductive flat plate, different regions of the conductive flat plate may deform differently with longitudinal extension and contraction of different conductive columns, thereby affecting the uniformity of array vibration, and therefore, in some preferred embodiments of the present application, the conductive flat plate 300 is made of metal (e.g. brass) with Young's modulus of 9 × 10^10Pa or more and thickness of 0.18mm to 0.3mm, thereby ensuring that the conductive flat plate 300 has a desirable balance between mass and rigidity.
As shown in fig. 2 and 3, in the embodiment of the present application, air is filled between the gaps of each first piezoelectric column 110 and each second piezoelectric column 210. Generally, people are used to prepare 1-3 type and 1-3-2 type piezoelectric composite materials by a cutting-filling method, polymers filled between piezoelectric columns are generally epoxy resin or silicon rubber, and the prepared piezoelectric composite materials enable the piezoelectric materials to be converted from the integral thickness vibration mode to the longitudinal stretching vibration mode of the piezoelectric small column array, so that the electromechanical coupling coefficient is improved. But due to the addition of the polymer, the loss is increased, and the electromechanical coupling coefficient is reduced. In the application, the air is used for replacing polymers to fill gaps of the piezoelectric columns, so that the longitudinal vibration behavior of the piezoelectric columns can be fully highlighted, the thickness vibration of the piezoelectric materials can be reflected to the longitudinal vibration behavior of an array formed by the piezoelectric columns to a greater extent, and the electromechanical coupling coefficient can be improved to the maximum extent.
Preferably, in some embodiments, as shown in fig. 1, the exterior of the piezoelectric device further has a waterproof sealing layer 400, and the piezoelectric device is encapsulated by the sealing layer 400, so that the piezoelectric device can be further protected to prolong the service life of the piezoelectric device. Specifically, the sealing layer 400 may be made of a waterproof and sound-transmitting material such as polyurethane by sealing the piezoelectric device with glue.
The present application further provides a method for manufacturing the piezoelectric device, and specifically, the method includes the following steps:
(1) Determining piezoelectric device parameters satisfying electromechanical coupling performance criteria, the piezoelectric device parameters including cross-sectional dimensions of the first and second piezoelectric pillars, the first and second heights, and periods of the first and second arrays;
(2) Cutting the sheet piezoelectric material according to the parameters of the piezoelectric device to form a first piezoelectric module and a second piezoelectric module;
(3) And fixing the end surfaces of the first array and the second array to two surfaces of the conductive flat plate in an opposite mode.
Fig. 6 schematically provides an implementation flow of the above piezoelectric device manufacturing, and as shown in fig. 6, after determining the piezoelectric device parameters meeting the electromechanical coupling performance index, the sheet-shaped piezoelectric material may be cut according to the piezoelectric device parameters to form the first piezoelectric module 100 and the second piezoelectric module 200, and then the end surfaces of the first array and the second array are fixed to two surfaces of the conductive flat plate 300 in an opposite manner.
Further, after the fabrication of the piezoelectric device is completed, as shown in fig. 6, the piezoelectric device may be integrally encapsulated by a sealing layer 400 to improve its waterproof sealing performance.
Example 1
1) Concrete structure
The present embodiment provides a high-sensitivity underwater acoustic transducer, which includes various components as shown in fig. 1. Specifically, the specific structural parameters of the piezoelectric device employed in the underwater acoustic transducer are listed in table 2 below.
TABLE 2 structural parameters of piezoelectric devices
2) Performance testing and comparison
According to a standard test procedure, the underwater acoustic transducer of the present embodiment and the underwater acoustic transducer manufactured by using the 2-1-2 type piezoelectric sensitive material shown in fig. 4d are respectively subjected to an underwater admittance test and an underwater performance test, wherein the underwater performance test includes an underwater admittance test and a receiving sensitivity test.
Fig. 7a shows the results of the in-air admittance test for two underwater acoustic transducers, and fig. 7b shows the results of the underwater admittance test for two underwater acoustic transducers. Fig. 8 shows the reception sensitivity test results of two kinds of underwater acoustic transducers. Wherein the solid line is the test result of the underwater acoustic transducer of the embodiment, and the dotted line is the test result of the underwater acoustic transducer manufactured by using the type 2-1-2 piezoelectric sensitive material.
Referring to fig. 7b and 8, the resonant frequencies of the underwater acoustic transducer and the underwater acoustic transducer made of the 2-1-2 type piezoelectric sensitive material are respectively about 118kHz and 228kHz, the receiving sensitivities are respectively-166 dB and-180 dB, the frequencies of the two are both in the high frequency range, and the receiving sensitivity (-166 dB) of the underwater acoustic transducer of the present embodiment is better than that of the underwater acoustic transducer using the 2-1-2 type piezoelectric sensitive material alone (-180 dB), and is further better than that of various curved surface, cylindrical surface and planar surface underwater acoustic transducers (the receiving sensitivity is less than-200 dB).
While the present invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof as defined in the appended claims.
Claims (9)
1. A high-sensitivity underwater acoustic transducer comprises a piezoelectric device, a first electrode lead, a second electrode lead and a shell, wherein the piezoelectric device is fixed inside the shell in a waterproof and sound-transmitting manner, and is characterized in that:
the piezoelectric device comprises a first piezoelectric module, a second piezoelectric module and a conductive flat plate;
the first piezoelectric module comprises a first array with a first substrate, the first array comprising a plurality of first piezoelectric posts having a first height, the second piezoelectric module comprises a second array with a second substrate, the second array comprising a plurality of second piezoelectric posts having a second height;
the electric polarities of the first substrate and the second substrate are the same, and the end faces of the first array and the end faces of the second array are oppositely and fixedly connected to two sides of the conductive flat plate;
one end of the first electrode lead is connected with the conductive flat plate, one end of the second electrode lead is connected with the first substrate and the second substrate, and the other end of the first electrode lead and the other end of the second electrode lead are led to the outside of the shell in a waterproof mode.
2. The high sensitivity underwater acoustic transducer according to claim 1, characterized in that:
the cross section of each first piezoelectric column is a square with a first side length, and the ratio of the first height to the first side length is greater than or equal to 5;
the cross section of each second piezoelectric column is a square with a second side length, and the ratio of the second height to the second side length is greater than or equal to 5.
3. The high sensitivity underwater acoustic transducer according to claim 2, wherein:
the ratio of the array period of the first array to the first side length is 1.3-1.5;
the ratio of the array period of the second array to the second side length is 1.3-1.5.
4. The high sensitivity underwater acoustic transducer according to claim 1, characterized in that:
the first height is equal to the second height and the first array and the second array are mirror symmetric with respect to the conductive plate;
the thickness of the first substrate is the same as that of the second substrate, and the first substrate and the second substrate are in mirror symmetry relative to the conductive flat plate.
5. The high sensitivity underwater acoustic transducer according to claim 1, characterized in that:
the piezoelectric materials adopted by the first piezoelectric module and the second piezoelectric module are piezoelectric ceramics and/or piezoelectric crystals.
6. The high sensitivity underwater acoustic transducer according to claim 1, characterized in that:
the conductive flat plate is made of a metal plate with Young modulus more than or equal to 9 multiplied by 10^10Pa and thickness of 0.18 mm-0.3 mm.
7. The high sensitivity underwater acoustic transducer according to claim 1, characterized in that:
the gaps of the first piezoelectric columns are filled with air, and the gaps of the second piezoelectric columns are filled with air.
8. The high sensitivity underwater acoustic transducer according to claim 1, wherein:
the piezoelectric device is encapsulated by a waterproof sealing layer.
9. The high sensitivity underwater acoustic transducer according to claim 1, characterized in that:
the shell comprises a shell body and a metal cover;
the shell is made of waterproof and sound-transmitting materials and is detachably connected with the metal cover in a sealing mode.
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