CN114071346B - Bimetallic plate clamping piezoelectric small column array structure sensitive element and preparation process thereof - Google Patents
Bimetallic plate clamping piezoelectric small column array structure sensitive element and preparation process thereof Download PDFInfo
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- CN114071346B CN114071346B CN202111352808.2A CN202111352808A CN114071346B CN 114071346 B CN114071346 B CN 114071346B CN 202111352808 A CN202111352808 A CN 202111352808A CN 114071346 B CN114071346 B CN 114071346B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/44—Special adaptations for subaqueous use, e.g. for hydrophone
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
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Abstract
The invention discloses a sensitive element with a bimetallic plate clamping piezoelectric small column array structure and a preparation process thereof, wherein the sensitive element comprises a piezoelectric small column array, the piezoelectric small column array comprises a plurality of piezoelectric small columns, a first metal plate and a second metal plate are respectively arranged at two ends of each piezoelectric small column, and the thickness of the second metal plate is greater than that of the first metal plate; the preparation process comprises the following steps of 1, cutting the upper surface of a piezoelectric material sheet along the direction X, Y to form a piezoelectric small column array with a substrate; step 2, adhering a second metal plate to the upper surface of the piezoelectric pillar array, then overturning the piezoelectric material sheet, cutting the lower surface of the piezoelectric material sheet along the direction X, Y to form a completely penetrated piezoelectric pillar array, and adhering a first metal plate to the lower surface of the piezoelectric pillar array; the invention relates to a sensitive element with a bimetallic plate clamping piezoelectric small column array structure and a preparation process thereof.
Description
Technical Field
The invention relates to the technical field of underwater acoustic transducers, in particular to a sensitive element with a bimetallic plate clamping piezoelectric small column array structure and a preparation process thereof.
Background
The following research on medium-high frequency underwater acoustic transducers has mainly focused on two aspects:
1. expanding the working bandwidth of the transducer; the bandwidth is expanded, so that fidelity processing of the underwater acoustic signal can be realized, and target information can be acquired more accurately; meanwhile, the target position can be accurate, and the resolution of the array is improved.
2. The sensitivity of the transducer is improved, namely, the transmission voltage response and the receiving sensitivity are improved by improving the electromechanical conversion efficiency of the transducer; the response of the transmitting voltage is improved, so that the transducer can emit stronger sound pressure under the condition of the same driving voltage, and more radiation sound energy is generated; the receiving sensitivity is improved, so that the capacity of the transducer for receiving weak signals can be improved, and the detection range can be enlarged.
The sensitivity of the transducer is improved by improving the electromechanical conversion efficiency of the transducer, so that the transmitting voltage response and the receiving sensitivity of the transducer are improved. The electromechanical conversion efficiency of the transducer is proportional to the square of the electromechanical coupling coefficient, so that the electromechanical conversion efficiency is improved, namely the electromechanical coupling coefficient is improved. How to improve the electromechanical coupling coefficient is the key content of the current transducer research and is also a difficult part. For piezoelectric materials, the electromechanical coupling coefficient k33 of the longitudinal stretching vibration mode is generally larger than the electromechanical coupling coefficient kt of the thickness vibration mode. Therefore, if the thickness vibration mode of the piezoelectric material can be converted into the longitudinal stretching vibration mode, the electromechanical coupling coefficient of the piezoelectric material can be improved. The most popular piezoelectric composite structural material at present, the 1-3 type piezoelectric composite material, is to change the vibration mode of the material by converting the thickness vibration of the whole piezoelectric material into the longitudinal stretching vibration of a plurality of piezoelectric pillars, thereby improving the performance. By cutting a single-phase piezoelectric material into a piezoelectric pillar array, the thickness vibration (the electromechanical coupling coefficient kt is about 0.5) of a whole piezoelectric material is converted into longitudinal length stretching vibration (the electromechanical coupling coefficient k33 is about 0.7) of the piezoelectric pillar array, and by changing the vibration mode of the material, the equivalent thickness electromechanical coupling coefficient of the 1-3 type piezoelectric composite material is improved by about 20% compared with the thickness electromechanical coupling coefficient of a pure piezoelectric material. The 1-3 type piezoelectric composite material has the advantages that the electromechanical coupling coefficient is improved by changing the vibration mode, and the polymer is added among the piezoelectric small column arrays, so that the material loss can be increased, the Q value is reduced, the bandwidth is expanded, and the cut small column array structure can be reinforced. However, the addition of polymer between the piezoelectric pillar arrays also brings about the following disadvantages:
(a) energy loss is increased, and the electromechanical coupling coefficient is reduced;
(b) the transverse coupling among the piezoelectric small columns is increased, so that the simplification of a vibration mode is not facilitated, and the effective electromechanical coupling coefficient is reduced;
(c) the addition of the lossy polymer causes the device to be easily heated, and particularly under the condition that the transducer continuously works, the sensitive element is deformed due to the heating, so that the performance of the transducer is greatly changed and even damaged.
Disclosure of Invention
The invention aims to provide a sensitive element capable of improving electromechanical coupling coefficient and sensitivity of a transducer.
In order to achieve the purpose, the invention provides a sensitive element with a bimetallic plate clamping piezoelectric small column array structure, which comprises a piezoelectric small column array, wherein the piezoelectric small column array comprises a plurality of piezoelectric small columns, a first metal plate and a second metal plate which are different in thickness are respectively arranged at two ends of each piezoelectric small column, and the thickness of the second metal plate is larger than that of the first metal plate; the side parts of the first metal plate and the second metal plate are also provided with a sealing shell so as to seal the piezoelectric small column array; a sound absorption layer is attached to one surface, opposite to the piezoelectric small column, of the second metal plate, a metal rear cover plate is arranged on one surface, opposite to the second metal plate, of the sound absorption layer, a lead penetrates through the metal rear cover plate, a positive electrode lead inside the lead is connected with the second metal plate, and a negative electrode lead inside the lead is connected with the first metal plate; the outer sides of the sealing shell, the first metal plate, the second metal plate, the sound absorption layer and the metal rear cover plate are jointly attached with a waterproof sound-transmitting layer.
Preferably, the cross-sectional shapes of the piezoelectric pillar array, the first metal plate, and the second metal plate are any one of a square, a rectangle, and a circle.
Preferably, the sound absorbing layer is a rigid foam.
Preferably, the waterproof sound-transmitting layer is formed by sealing and curing polyurethane glue.
A process for preparing a sensitive element with a bimetallic plate clamping piezoelectric small column array structure comprises the following steps of (1) cutting the upper surface of a piezoelectric material sheet along the direction of X, Y to form a piezoelectric small column array with a substrate; step 2, adhering a second metal plate to the upper surface of the piezoelectric pillar array, then overturning the piezoelectric material sheet, cutting the lower surface of the piezoelectric material sheet along the direction X, Y to form a completely penetrated piezoelectric pillar array, and adhering a first metal plate to the lower surface of the piezoelectric pillar array; step 3, sleeving a sealing shell on the side part of the piezoelectric small column array to seal the piezoelectric small column array; step 4, attaching rigid foam as a sound absorption layer to one surface, opposite to the piezoelectric pillar array, of the second metal plate, attaching a metal rear cover plate to one surface, opposite to the second metal plate, of the rigid foam, penetrating a lead in the middle of the metal rear cover plate, and leading out a positive electrode lead and a negative electrode lead inside the lead from a position between the rigid foam and the metal rear cover plate, wherein the positive electrode lead is connected with the second metal plate, and the negative electrode lead is connected with the first metal plate; and 5, coating polyurethane on the outer sides of the sealed shell, the first metal plate, the second metal plate, the sound absorption layer and the metal rear cover plate to be sealed and cured into a waterproof sound-transmitting layer.
Therefore, the sensitive element with the structure of the piezoelectric small column array clamped by the bimetallic plate and the preparation process thereof have the advantages that air is used for replacing polymers to fill gaps of the piezoelectric small columns, so that the longitudinal vibration behavior of the piezoelectric small columns can be fully highlighted, the thickness vibration of the piezoelectric material can be reflected to the longitudinal vibration behavior of the piezoelectric small columns to a greater extent, and the electromechanical coupling coefficient is improved; the stress of the piezoelectric small column is amplified through the first metal plate with the thin cover, so that the receiving sensitivity of the transducer is improved; the second metal plate with the thick cover realizes the function of the back mass block, and the sensitivity of the transducer is further improved; meanwhile, the thick second metal plate can be used as a base, and the piezoelectric pillars are prevented from being dispersed.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
FIG. 1 is a schematic structural diagram of a piezoelectric array of a sensing element with a bimetallic strip clamped piezoelectric pillar array structure according to the present invention;
FIG. 2 is a schematic diagram of a package of a bimetallic plate clamped piezoelectric pillar array structure sensor according to the present invention;
FIG. 3 is a schematic structural diagram of a sensing element with a bimetallic plate clamping piezoelectric pillar array structure according to the present invention;
FIG. 4 is a schematic structural diagram of a rear metal cover plate of a sensor with a bimetallic plate clamping piezoelectric pillar array structure according to the present invention;
FIG. 5 is a graph of conductance of an array structure of piezoelectric pillars sandwiched by a first metal plate and a second metal plate;
fig. 6 is a graph showing the vibration displacement at resonance of the piezoelectric pillar array structure sandwiched by the first metal plate and the second metal plate, in which (a) the graph shows a case where the vibration phase angle θ is 0 ° and (b) the graph shows a case where the vibration phase angle θ is 180 °;
FIG. 7 is a graph of transmit voltage response and receive sensitivity for an "epoxy-added PZT pillar array structure" transducer, where (a) is the transmit voltage response and (b) is the receive sensitivity;
fig. 8 is a transmission voltage response, reception sensitivity, transmission sound source level, and directivity pattern of the transducer of the piezoelectric pillar array structure sandwiched by the first metal plate and the second metal plate, in which (a) the pattern is the transmission voltage response, (b) the pattern is the reception sensitivity, (c) the transmission sound source level, and (d) the directivity pattern.
Reference numerals
1. An array of piezoelectric pillars; 2. a first metal plate; 3. a second metal plate; 4. sealing the housing; 5. a sound absorbing layer; 6. a metal back cover plate; 7. a wire; 8. a positive electrode lead; 9. a negative electrode lead; 10. a waterproof sound-transmitting layer; 11. a piezoelectric pillar.
Detailed Description
The technical solution of the present invention is further illustrated by the accompanying drawings and examples.
Unless defined otherwise, technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Examples
As shown in the figure, the sensitive element with the structure that the bimetallic plate clamps the piezoelectric small column array structure comprises a piezoelectric small column array 1, wherein the piezoelectric small column array 1 comprises a plurality of piezoelectric small columns 11, a first metal plate 2 and a second metal plate 3 which are different in thickness are respectively arranged at two ends of each piezoelectric small column 11, and the thickness of the second metal plate 3 is larger than that of the first metal plate 2; the side parts of the first metal plate 2 and the second metal plate 3 are also provided with a sealing shell 4 to seal the piezoelectric pillar array 1; a sound absorption layer 5 is attached to one surface, opposite to the piezoelectric pillar 11, of the second metal plate 3, a metal rear cover plate 6 is arranged on one surface, opposite to the second metal plate 3, of the sound absorption layer 5, a lead 7 penetrates through the metal rear cover plate 6, a positive electrode lead 8 inside the lead 7 is connected with the second metal plate 3, and a negative electrode lead 9 inside the lead 7 is connected with the first metal plate 2; the outer sides of the sealed shell 4, the first metal plate 2, the second metal plate 3, the sound absorption layer 5 and the metal rear cover plate 6 are jointly attached with a waterproof sound-transmitting layer 10.
Fig. 1 is a schematic structural view of a "piezoelectric pillar array 1", which includes a piezoelectric pillar array 1 formed by vertically cutting piezoelectric ceramics, filling gaps between piezoelectric pillars 11 with air instead of polymer, and attaching first and second metal plates 2 and 3 with different thicknesses to upper and lower surfaces of the piezoelectric pillars 11, and is characterized in that:
(1) generally, people are used to prepare 1-3 type and 1-3-2 type piezoelectric composite materials by a cutting-filling method, polymers filled between piezoelectric pillars 11 are generally epoxy resin or silicon rubber, and the prepared piezoelectric composite materials enable the piezoelectric materials to be converted from the integral thickness vibration mode to the longitudinal stretching vibration mode of the piezoelectric pillar array 1, so that the electromechanical coupling coefficient is improved. But due to the addition of the polymer, the loss is increased, and the electromechanical coupling coefficient is reduced. According to the piezoelectric pillar array 1 structure without adding the polymer, air is used for replacing the polymer to fill the gaps of the piezoelectric pillars 11, so that the longitudinal vibration behavior of the piezoelectric pillars 11 can be fully highlighted, the thickness vibration of the piezoelectric material can be reflected as the longitudinal vibration behavior of the piezoelectric pillar array 1 to a greater extent, and the electromechanical coupling coefficient can be improved to the maximum extent. In the invention, the piezoelectric small column 11 clamped by the first metal plate 2 and the second metal plate 3 is an improvement on the basis of a composite material, namely, a polymer part of the piezoelectric composite material is removed, and metal plates with different thicknesses are attached to the upper surface and the lower surface of the piezoelectric small column, so that the d33 vibration mode of the piezoelectric small column array 1 is embodied, and a high coupling coefficient of several points is obtained.
(2) The first metal plate 2 is a thin metal plate, and can transmit sound pressure from a sound field to each of the piezoelectric pillars 11, increase stress in the piezoelectric pillars 11, and perform a stress amplification function, as shown in fig. 3, where a ratio of the stress generated on the piezoelectric pillars 11 to the sound pressure in the sound field is
w and w 1 The widths of the array unit and the piezoelectric pillars 11, respectively. The stress on the piezoelectric pillars 11 is greater than the sound pressure in the sound field, i.e. the metal cover plate plays a role in amplifying the stress. This stress amplification increases the polarization electric field of the piezoelectric pillars 11, thereby increasing the output induced voltage, and thus, for the receiving transducer, the receiving sensitivity can be improved by the stress amplification. The second metal plate 3 with a thicker thickness can play a role of a back mass block, and the metal plate with a larger mass blocks the sensitive element from radiating sound energy backwards, so that the sensitivity of the transducer is further improved. In addition, the first metal plate 2 and the second metal plate 3 can also play a role of frame support, and the dispersion among the piezoelectric small columns 11 is prevented.
Preferably, the first metal plate 2 and the second metal plate 3 sandwich the piezoelectric pillar array 1 in a plan view, and the structural shape includes, but is not limited to, a square shape in fig. 1, and may be a rectangle, a circle, or the like.
In the present embodiment, the cross-sectional shape of the piezoelectric pillar array 1, the first metal plate 2, and the second metal plate 3 is any one of a square, a rectangle, and a circle.
In the present embodiment, the sound-absorbing layer 5 is a rigid foam.
In this embodiment, the waterproof sound-transmitting layer 10 is formed by sealing and curing polyurethane.
A preparation process of a sensitive element with a bimetallic plate clamping piezoelectric small column array structure comprises the following steps of 1, cutting the upper surface of a piezoelectric material sheet along the direction X, Y to form a piezoelectric small column array 1 with a substrate; step 2, adhering a second metal plate 3 to the upper surface of the piezoelectric pillar array 1, then overturning the piezoelectric material sheet, cutting the lower surface of the piezoelectric material sheet along the direction X, Y to form a completely penetrated piezoelectric pillar array 1, and adhering a first metal plate 2 to the lower surface of the piezoelectric pillar array 1; step 3, sleeving a sealing shell on the side part of the piezoelectric small column array 1 to seal the piezoelectric small column array 1; step 4, attaching rigid foam as a sound absorption layer 5 to one surface of the second metal plate 3 opposite to the piezoelectric pillar array 1, attaching a metal rear cover plate 6 to one surface of the rigid foam opposite to the second metal plate 3, penetrating a lead 7 in the middle of the metal rear cover plate 6, and leading out a positive electrode lead 8 and a negative electrode lead 9 inside the lead 7 from between the rigid foam and the metal rear cover plate 6, wherein the positive electrode lead 8 is connected with the second metal plate 3, and the negative electrode lead 9 is connected with the first metal plate 2; and 5, coating polyurethane on the outer sides of the sealed shell 4, the first metal plate 2, the second metal plate 3, the sound absorption layer 5 and the metal rear cover plate 6 to seal and cure the polyurethane into a waterproof sound-transmitting layer 10.
The structure that the first metal plate 2 and the second metal plate 3 are clamped with the piezoelectric small column array 1 is used for preparing a packaging structure of the transducer, as shown in figure 2, electrode leads are led out of a motor on the upper surface and the lower surface of the sensitive element, then the electrode leads are bonded with rigid foam and a metal rear cover plate 6, the whole body is sealed by polyurethane glue, and a waterproof sound-transmitting layer 10 is formed by curing the rigid foam and the metal rear cover plate, so that the transducer is manufactured. The transducer is placed in a silencing water pool, and full-performance test is carried out according to relevant standards, including the transmitting voltage response, the receiving sensitivity, the frequency bandwidth, the directivity and the like of the transducer.
The following are feasibility analyses and experimental tests:
(1) by the stress amplification effect, the receiving sensitivity of the transducer can be improved. As shown in FIG. 3, the sound pressure from the sound field, i.e. the pressure on the upper surface of the sensing element, is p, and the longitudinal stress on the piezoelectric pillar 11 is T 3 The metal plate is very thin (the thickness of the metal plate is much smaller than the wavelength of the sound wave in the metal plate), the sound pressure p acts on the piezoelectric small column 11 through the metal plate, and the stress borne by the piezoelectric small column 11 can be approximated as:
in the formula, w and w 1 The widths of the array elements and the piezoelectric pillars 11, respectively.
The stress acting on the piezoelectric pillar 11 is larger than the sound pressure in an external sound field, the electric field on the piezoelectric pillar 11 is increased through the piezoelectric effect, the voltage between the upper and lower polar plates is increased, and therefore the receiving sensitivity of the energy conversion material is improved.
Using the g-type piezoelectric equation:
in the formula, E 3 Is the electric field intensity along the length direction of the piezoelectric pillar 11, g 33 Is a function of the piezoelectric (stiffness) constant,
dielectric isolation under constant stress, D 3 Is the electric displacement along the length direction of the piezoelectric pillar 11. In the case of considering only the stress, E 3 ＝-g 33 T 3 The voltage thus generated on the piezoelectric pillars 11 is:
V＝-g 33 T 3 h 1
in the formula h 1 Is the height of the pillar, h is the height of the piezoelectric material (piezoelectric pillar 11), the receiving sensitivity of the transducer is improved
And (4) doubling.
Therefore, the structure can improve the receiving sensitivity of the transducer through the metal plate.
(2) Transducer performance testing and comparison
In this embodiment, a PZT-5A piezoelectric ceramic material is cut to obtain the piezoelectric pillar array 1 structure, and a metal plate and the cut piezoelectric pillar array 1 are bonded together by using a conductive adhesive to obtain the PZT pillar array structure having upper and lower surfaces with copper cover plates of different thicknesses. An impedance analyzer and a laser vibration meter are respectively adopted to test the PZT pillar array structure element with the copper cover plate, and the test results are shown in figures 5 and 7. As can be seen in the conductance curve of fig. 5, the resonant frequency is 158 kHz; as can be seen from the vibration displacement diagram of fig. 6 (θ in the diagram indicates the phase angle of vibration), the entire copper cover plate vibrates up and down in step at the time of resonance.
The invention manufactures the transducer of 'PZT pillar array structure added with epoxy resin + metal plates with different thicknesses at the upper part and the lower part' under the condition of the same size. They were tested for transmission voltage response and reception sensitivity in a silencing water tank, respectively, and fig. 7 shows the transmission voltage response (fig. a) and reception sensitivity (fig. b) of the transducer of "PZT pillar array structure with added epoxy resin", and fig. 8 shows the transmission voltage response (fig. a) and reception sensitivity (fig. b) of the transducer of "PZT pillar array structure without added polymer".
In FIG. 7, the transducer of the PZT pillar array structure with the added epoxy resin has a transmitting voltage response of 157dB and a receiving sensitivity of-195 dB. In FIG. 8, the transducer "PZT pillar array structure without added polymer" transmitted voltage response reaches 163dB, and increases 6 dB; the receiving sensitivity reaches-180 dB and is increased by 15 dB. It can be seen that the transducer with the structure of the piezoelectric pillar array 1 sandwiched by the first metal plate 2 and the second metal plate 3 has better performance than the transducer with the structure of the piezoelectric pillar array 1 added with epoxy resin.
Therefore, the sensitive element with the structure that the bimetallic plate clamps the piezoelectric small column array structure and the preparation process thereof have the advantages that the air is used for replacing polymers to fill gaps of the piezoelectric small columns, the longitudinal vibration behavior of the piezoelectric small columns can be fully highlighted, the thickness vibration of the piezoelectric material can be reflected as the longitudinal vibration behavior of the piezoelectric small columns to a greater extent, and the electromechanical coupling coefficient is improved; the stress of the piezoelectric small column is amplified through the first metal plate with the thin cover, so that the receiving sensitivity of the transducer is improved; the second metal plate with the thick cover realizes the function of the back mass block, and the sensitivity of the transducer is further improved; meanwhile, the thick second metal plate can be used as a base, so that the piezoelectric pillars are prevented from being dispersed; compared with a single metal plate (the other side of which is a non-cut ceramic substrate, the effective electromechanical coupling coefficient of the substrate thickness vibration is kt equal to 0.5, and the electromechanical coupling coefficient of the piezoelectric pillar length stretching vibration is k33 equal to 0.7), the electromechanical coupling coefficient is improved, and the thick metal plate is used as a weight, so that the emission voltage response of the sensitive element can be increased.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the invention without departing from the spirit and scope of the invention.
Claims (5)
1. The sensitive element with the structure that the double metal plates clamp the piezoelectric small column array is characterized by comprising the piezoelectric small column array, wherein the piezoelectric small column array comprises a plurality of piezoelectric small columns, a first metal plate and a second metal plate which are different in thickness are arranged at two ends of each piezoelectric small column respectively, and the thickness of the second metal plate is larger than that of the first metal plate; the side parts of the first metal plate and the second metal plate are also provided with a sealing shell so as to seal the piezoelectric small column array; a sound absorption layer is attached to one surface, opposite to the piezoelectric pillar, of the second metal plate, a metal rear cover plate is arranged on one surface, opposite to the second metal plate, of the sound absorption layer, a lead penetrates through the metal rear cover plate, a positive electrode lead inside the lead is connected with the second metal plate, and a negative electrode lead inside the lead is connected with the first metal plate; the outer sides of the sealing shell, the first metal plate, the second metal plate, the sound absorption layer and the metal rear cover plate are jointly attached with a waterproof sound-transmitting layer.
2. The bimetal plate-sandwiched piezoelectric pillar array structure sensor as claimed in claim 1, wherein the cross-sectional shapes of the piezoelectric pillar array, the first metal plate and the second metal plate are any one of a square, a rectangle and a circle.
3. The sensitive element of claim 1, wherein the sound absorption layer is rigid foam.
4. The sensitive element of claim 1, wherein the waterproof sound-transmitting layer is formed by sealing and curing polyurethane.
5. A preparation process of a sensitive element with a bimetallic plate clamping piezoelectric small column array structure is characterized by comprising the following steps:
step 1, cutting the upper surface of a piezoelectric material sheet along the direction X, Y to form a piezoelectric small column array with a substrate;
step 2, adhering a second metal plate to the upper surface of the piezoelectric pillar array, then overturning the piezoelectric material sheet, cutting the lower surface of the piezoelectric material sheet along the direction X, Y to form a completely penetrated piezoelectric pillar array, adhering a first metal plate to the lower surface of the piezoelectric pillar array, wherein the thickness of the second metal plate is larger than that of the first metal plate;
step 3, sleeving a sealing shell on the side part of the piezoelectric small column array to seal the piezoelectric small column array;
step 4, attaching rigid foam as a sound absorption layer to one surface, opposite to the piezoelectric pillar array, of the second metal plate, attaching a metal rear cover plate to one surface, opposite to the second metal plate, of the rigid foam, penetrating a lead in the middle of the metal rear cover plate, and leading out a positive electrode lead and a negative electrode lead inside the lead from a position between the rigid foam and the metal rear cover plate, wherein the positive electrode lead is connected with the second metal plate, and the negative electrode lead is connected with the first metal plate;
and 5, coating polyurethane on the outer sides of the sealed shell, the first metal plate, the second metal plate, the sound absorption layer and the metal rear cover plate to seal and solidify into a waterproof sound transmission layer.
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| JP2000324599A (en) * | 1999-05-12 | 2000-11-24 | Ueda Japan Radio Co Ltd | Composite piezoelectric body and prismatic piezoelectric ceramic sintered compact |
| CN1941447A (en) * | 2005-09-26 | 2007-04-04 | 北京信息工程学院 | High-frequency air ultrasonic energy exchanger |
| CN102662166A (en) * | 2012-05-23 | 2012-09-12 | 北京信息科技大学 | Multimode broadband circular array transducer |
| CN203787081U (en) * | 2014-04-15 | 2014-08-20 | 国家海洋技术中心 | Underwater acoustic transducer |
| CN109569999A (en) * | 2017-09-29 | 2019-04-05 | 奥林巴斯科技美国公司 | Use aeroge as the ultrasonic transducer of packing material |
| CN113161475A (en) * | 2021-03-30 | 2021-07-23 | 广东奥迪威传感科技股份有限公司 | Micro array piezoelectric sensor |
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