CN106311584A - Active matching thickness mould pressing electropneumatic coupling ultrasonic transducer - Google Patents
Active matching thickness mould pressing electropneumatic coupling ultrasonic transducer Download PDFInfo
- Publication number
- CN106311584A CN106311584A CN201610843021.9A CN201610843021A CN106311584A CN 106311584 A CN106311584 A CN 106311584A CN 201610843021 A CN201610843021 A CN 201610843021A CN 106311584 A CN106311584 A CN 106311584A
- Authority
- CN
- China
- Prior art keywords
- matching layer
- matching
- joint
- transducer
- piezoelectric patches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 title claims abstract description 26
- 238000010168 coupling process Methods 0.000 title claims abstract description 26
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 26
- 239000002033 PVDF binder Substances 0.000 claims abstract description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims abstract description 5
- 239000010409 thin film Substances 0.000 claims abstract description 5
- 230000010287 polarization Effects 0.000 claims abstract description 4
- 239000002131 composite material Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000006261 foam material Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 15
- 230000035945 sensitivity Effects 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 238000005187 foaming Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004965 Silica aerogel Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention provides an active matching thickness mould pressing electropneumatic coupling ultrasonic transducer. The active matching thickness mould pressing electropneumatic coupling ultrasonic transducer comprises a piezoelectric plate (1), a first matching layer (2), a second matching layer (3), a transducer shell (4), a first joint (5) and a second joint (6); the piezoelectric plate (1), the first matching layer (2) and the second matching layer (3) are sequentially arranged in the transducer shell (4) in the emission direction of ultrasonic signals, the first matching layer (2) is of a round sheet structure made of microhole foaming materials, the second matching layer (3) is of a round sheet structure made of a polarization multi-hole PVDF thin film, the second matching layer (3) is communicated with the second joint (6) through a wire, and the diameter of the first matching layer (2) and the diameter of the second matching layer (3) are the same with that of the piezoelectric plate (1). According to the transducer, an active matching layer material is introduced, transmission sound waves can be actively amplified, and the sensitivity can be improved.
Description
Technical field
The present invention relates to ultrasonic non-destructive inspection techniques field, the thickness mode piezoelectricity sky coupling being specifically related to a kind of active matching surpasses
Sonic transducer.
Background technology
Thickness mode piezoelectricity sky coupling ultrasonic transducer is the core component of a kind of important Noncontact ultrasonic NDT technology, has
It is widely applied prospect.The acoustic impedance that its core technology difficult point is mainly reflected in piezoelectric patches and air does not mates, and causes changing
Energy device radiating acoustic energy efficiency is low, and receiving voltage sensitivity is low.Traditional solution usually uses microcellular foam material, silicon gas
The low acoustic impedance material such as gel are as matching layer.The conventional Air Coupling ultrasonic transducer matching layer material the most reported
Including the porous material such as microcellular foam material, silica aerogel.Utilize low-impedance porous material, make bilayer or multi-layer Matched
Layer, it is thus achieved that preferable matching effect (list of references: T E G.Acoustic impedance
matching of piezoelectric transducers to the air[J].IEEE transactions on
ultrasonics,ferroelectrics,and frequency control,2004,51(5):624-633.).The method
Only by increasing the absorbance raising transducer sensitivity of acoustic wave energy, although achieve good effect by the method, but enter
The space that one step promotes is the most limited.
Summary of the invention
It is an object of the invention to, there is sensitivity for above-mentioned existing thickness mode piezoelectricity sky coupling ultrasonic transducer low
Technical problem, it is provided that the thickness mode piezoelectricity sky coupling ultrasonic transducer of a kind of active matching, it is built by the way of active matching
The theoretical model of vertical active matching, introducing active device, as matching layer material, is retaining traditional enhancing acoustic wave transmission effect
On the basis of, transmitted acoustic pulse is carried out " active " and amplifies, improve the sensitivity of Air Coupling ultrasonic transducer further.
For achieving the above object, the thickness mode piezoelectricity sky coupling ultrasonic transducer of a kind of active matching that the present invention provides, bag
Include: piezoelectric patches, the first matching layer, the second matching layer, transducer enclosure, the first joint and the second joint；Described piezoelectric patches,
One matching layer, the second matching layer are launched direction along ultrasonic signal and are arranged in order in transducer enclosure, and described piezoelectric patches passes through
The wire that the electrode that its both sides are arranged is drawn connects the first joint, and the first described joint and the second joint are both secured to transducing
Device casing ends, and external ultrasonic power；The first described matching layer uses the round sheet knot that microcellular foam material is made
Structure, the second described matching layer uses the circular sheet-like structures that the porous PVDF thin film of polarization is made, and this second matching layer passes through
Wire connects the second joint, and the diameter of described first matching layer and the second matching layer is identical with piezoelectric patches.
As the further improvement of technique scheme, described piezoelectric patches uses 1-3 type composite to make, described
1-3 type composite is filled by evenly distributed piezo column and epoxy resin and is constituted, and the thickness of this piezoelectric patches takes ultrasonic signal
/ 2nd wavelength that mid frequency is corresponding, its a diameter of 30mm.
As the further improvement of technique scheme, the thickness of described first matching layer and the second matching layer all takes ultrasonic
The quarter-wave that ripple signal center frequency is corresponding.
As the further improvement of technique scheme, described microcellular foam material is hollow glass micropearl powder and ring
Epoxy resin composite material.
The advantage of the thickness mode piezoelectricity sky coupling ultrasonic transducer of a kind of active matching of the present invention is:
The thickness mode piezoelectricity sky coupling ultrasonic transducer that the present invention proposes, on the basis of traditional acoustic impedance match, introduces
" active " matching layer material, design additional incentive module carries out " active " and amplifies transmitted acoustic pulse, thus realization has highly sensitive
The piezoelectricity sky coupling transducer of degree performance, this transducer can be widely applied to sensitive to couplant, can not directly contact, require quickly
In the non-contact ultrasonic field of non destructive testings such as scanning, its high sensitivity performance more can be at non contact thickness gaging or measure highly attenuating
Material aspect has clear superiority.
Accompanying drawing explanation
Fig. 1 is the thickness mode piezoelectricity sky coupling ultrasonic transducer structures schematic diagram of a kind of active matching of the present invention.
Fig. 2 is the piezoelectric plate structure side view using 1-3 type composite to make in the present invention.
Fig. 3 is the piezoelectric plate structure top view using 1-3 type composite to make in the present invention.
Reference
1, piezoelectric patches the 2, first matching layer the 3, second matching layer
4, transducer enclosure the 5, first joint the 6, second joint
7, piezo column 8, epoxy resin
Detailed description of the invention
Change the thickness mode piezoelectricity sky coupling of a kind of active matching of the present invention is ultrasonic with embodiment below in conjunction with the accompanying drawings
Can be described in detail by device.
As it is shown in figure 1, the thickness mode piezoelectricity sky coupling ultrasonic transducer of a kind of active matching of present invention offer, including: pressure
Electricity sheet the 1, first matching layer the 2, second matching layer 3, transducer enclosure the 4, first joint 5 and the second joint 6；Described piezoelectric patches 1,
First matching layer the 2, second matching layer 3 is launched direction along ultrasonic signal and is arranged in order in transducer enclosure 4, described piezoelectric patches
1 and second matching layer 3 be respectively communicated with the first joint 5 and the second joint 6, institute by the wire that the electrode that its both sides are arranged is drawn
The first joint 5 stated and the second joint 6 are both secured to transducer enclosure 4 end, and external ultrasonic power；Described first
Joining layer 2 is to have the circular sheet-like structures that the microcellular foam material of low acoustic impedance is made, it is preferred to use hollow glass micropearl powder
And epoxy resin composite material, the second described matching layer 3 is active matching layer, uses the porous PVDF thin film polarized to make
Circular sheet-like structures, described first matching layer 2 is identical with piezoelectric patches 1 with the diameter of the second matching layer 3, rationally selects its diameter
D, makes thickness vibration mode and other vibration modes distinguish on ultrasonic signal mid frequency.
Piezoelectricity sky coupling ultrasonic transducer, as the core component of a kind of non-contact detection technology, has important and widely
Application prospect, but the acoustic impedance of itself piezoelectric patches and air seriously loses, have impact on detection sensitivity.Only by low acoustic impedance material
The method that material carries out mating to some extent solves acoustic wave transmission problem, on this basis, uses the side that " active " mates
Formula, does matching layer with the low sound-resistance material with piezoelectricity, and design additional incentive module carries out " active " and amplifies transmitted acoustic pulse,
Thus realize the piezoelectricity sky coupling transducer with high sensitivity performance.
The core concept of active matching is: using the special material with piezoelectricity to make matching layer, its acoustic impedance is both full
The requirement of foot impedance matching, it is possible to realize the effect of traditional " anti-reflection " sound wave, utilize its piezoelectricity simultaneously, is accessing voltage source
After encouraging, using the teaching of the invention it is possible to provide a part of stackable acoustic energy, it is achieved acoustic wave energy is compensated the effect of amplification, thus greatly
The big sensitivity improving thickness mode piezoelectricity sky coupling ultrasonic transducer.
The method using electromechanical analogy carries out the operating process of active matching:
Initially set up the equivalent-circuit model of piezoelectric patches the 1, first matching layer the 2, second matching layer 3, wherein piezoelectric patches 1 and
Two matching layers 3 use Mason's equivalent-circuit model to model, and the first matching layer 2 uses acoustic transmission line model to model.When piezoelectric patches 1
Plus signal source, two ends Vs, when the second matching layer 3 two ends are not added with driving source Vex, the similar tradition of the effect that the second matching layer 3 plays
Join the function of layer, be now calculated output acoustic pressure P of transducer face1=H1(Vs)；When piezoelectric patches 1 two ends are not added with signal source
Vs, when the second matching layer 3 two ends add driving source Vex, the similar backing of effect that piezoelectric patches 1 plays with the first matching layer 2, now count
Calculate output acoustic pressure P obtaining transducer face2=H2(Vex), actual output acoustic pressure P of transducer face is considered as P1And P2
Superposition.By arbitrarily signal generating device, shape, frequency and the phase place of appropriate design driving source Vex, driving source Vex is made to export
Acoustic pressure P of the converted generation of the signal of telecommunication2Can be with acoustic pressure P1In-phase stacking, thus play and propose highly sensitive effect.
Use the analysis method of electromechanical analogy, set up ordinary matches layer and the Mason of active excitation matching layer transducer respectively
The delay of additional incentive source, phase place, frequency etc., by optimizing the electricity input element of design adjunct circuit, are joined by equivalent circuit
Number is controlled, it is ensured that additional incentive source is at the upper acoustic signals produced of piezoelectricity matching layer (the second matching layer 3) and transducer
The acoustic signals that own wafer (piezoelectric patches 1) produces the most superimposed, makes total outfan and mechanics end be entered as direct ratio, thus reaches
To while completing conventional acoustic impedance match, total output sound wave is overlapped the purpose of " amplification ", it is achieved transducer spoke
Penetrate being substantially improved of acoustic wave energy.
The example of active matching Air Coupling ultrasonic piezoelectric transducer that a mid frequency be 700kHz be given below:
The piezoelectric patches of described Air Coupling ultrasonic piezoelectric transducer is that 1-3 type composite is made, and its thickness is 2mm, directly
Footpath is 30mm.Piezoelectric patches thickness takes 1/2nd wavelength that ultrasonic signal mid frequency is corresponding, according to formula hp=C/2frMeter
Calculate, wherein, hpRepresenting the thickness of piezoelectric patches, C represents the longitudinal wave velocity of piezoelectric patches, frRepresent the mid frequency of ultrasonic signal.
The suppression to radial mode considered by the needs that select of piezoelectric patches diameter, it shall be guaranteed that radial mode and thickness vibration
Pattern does not interferes with each other, and shows as on frequency spectrum-6dB the bandwidth range near the two fundamental frequency mid frequency and mid frequency and does not has
There is the part of coincidence.
As shown in Figure 2,3,1-3 type composite piezoelectric patches is filled structure by evenly distributed piezo column 7 and epoxy resin 8
Become.Piezoelectric phase connects at thickness direction, and epoxy resin all connects in three directions of x, y, z.Analysis side by W A Smith
Method, changes the volume fraction of piezoelectric ceramics post, can adjust density and the velocity of sound of 1-3 type composite.
First matching layer is hollow glass micropearl/epoxy resin composite material, and its thickness is 1mm.First matching layer thickness
Take the quarter-wave that ultrasonic signal mid frequency is corresponding, according to formula h1=C/4frCalculate, wherein, h1Represent first
Joining the thickness of layer, C represents the longitudinal wave velocity of piezoelectric patches, frRepresent the mid frequency of ultrasonic signal.
The most preferably acoustic resistance of the first matching layer is 0.3MRayl, according to formulaCalculate, wherein, Z1Represent
The acoustic resistance of the first matching layer, ZpRepresent the acoustic resistance of piezoelectric patches, ZaRepresent the acoustic resistance of air.And in a practical situation, due to the fullest
The material of this most preferably acoustic resistance condition of foot is not necessarily present, and can suitably relax scope to 0.3-1MRayl.
Second matching layer is the porous PVDF thin film of polarization, and as active matching layer, its thickness is 100 μm.This active
The thickness joining layer takes the quarter-wave that ultrasonic signal mid frequency is corresponding, equally according to formula h2=C/4frCalculate, its
In, h2Representing the thickness of the second matching layer, C represents the longitudinal wave velocity of piezoelectric patches, frRepresent the mid frequency of ultrasonic signal.
The most preferably acoustic resistance of the second matching layer is 0.01MRayl, according to formulaCalculate, wherein, Z2Represent
The acoustic resistance of the second matching layer, ZpRepresent the acoustic resistance of piezoelectric patches, ZaRepresent the acoustic resistance of air.And in a practical situation, due to the fullest
The material of this most preferably acoustic resistance condition of foot is not necessarily present, and can suitably relax scope to 0.01MRayl-0.1MRayl.
The material of described transducer enclosure does not limits, and can be metal or plastic material, preferably stainless steel casing, and outward appearance is good,
And easily realize altogether.
First joint 5 and the second joint 6 can connect the most general Q9 or SMB type connector respectively, and the two can be total to
Ground, inner core connects piezoelectric patches and the positive pole of active matching layer respectively.
Piezoelectric patches two ends copper-plating electrode also draws wire, connects the first joint 5, and external frequency is that the train of pulse of 700kHz is made
For signal source Vs.Active matching layer two ends copper-plating electrode also draws wire, connects the second joint 6, and external use arbitrary signal is sent out
Raw device coordinates the driving source Vex that linear operational amplifier generates.
When transducer is operated under ordinary matches pattern, the first external mid frequency of joint 5 be 700kHz train of pulse or
Person's spike is transmitted in air after double-deck matching layer as signal source Vs, the ultrasound wave that now piezoelectric patches 1 produces, spirit
Sensitivity is significantly larger than the situation directly being radiated ultrasound wave by piezoelectric patches 1 in air.
When transducer is operated under active matching pattern, the first external mid frequency of joint 5 be 700kHz train of pulse or
Person's spike is as signal source Vs, and the second joint 6 external use arbitrarily signal generating device coordinates linear operational amplifier to generate
Driving source Vex, shape, frequency and the phase place of appropriate design driving source Vex, make the transmission ultrasonic wave that piezoelectric patches 1 produces to active
After matching layer, it is possible to act on, with driving source Vex, the ultrasound wave in-phase stacking produced on active matching layer, thus often obtain ratio
Higher sensitivity effect under rule match pattern.
It should be noted last that, above example is only in order to illustrate technical scheme and unrestricted.Although ginseng
According to embodiment, the present invention is described in detail, it will be understood by those within the art that, the technical side to the present invention
Case is modified or equivalent, and without departure from the spirit and scope of technical solution of the present invention, it all should be contained in the present invention
Right in the middle of.
Claims (4)
1. the thickness mode piezoelectricity sky coupling ultrasonic transducer of an active matching, it is characterised in that including: piezoelectric patches (1), first
Join layer (2), the second matching layer (3), transducer enclosure (4), the first joint (5) and the second joint (6)；Described piezoelectric patches (1),
First matching layer (2), the second matching layer (3) are launched direction along ultrasonic signal and are arranged in order in transducer enclosure (4), described
Piezoelectric patches (1) connects the first joint (5) by the wire that the electrode that its both sides are arranged is drawn, described the first joint (5) and
Second joint (6) is both secured to transducer enclosure (4) end, and external ultrasonic power；Described the first matching layer (2) uses
The circular sheet-like structures that microcellular foam material is made, described the second matching layer (3) uses the porous PVDF thin film of polarization to make
Circular sheet-like structures, this second matching layer (3) connects the second joint (6), described first matching layer (2) and second by wire
The diameter of matching layer (3) is identical with piezoelectric patches (1).
The thickness mode piezoelectricity sky coupling ultrasonic transducer of active matching the most according to claim 1, it is characterised in that described
Piezoelectric patches (1) uses 1-3 type composite to make, and described 1-3 type composite is by evenly distributed piezo column (7) and epoxy
Resin (8) is filled and is constituted, and the thickness of this piezoelectric patches (1) takes 1/2nd wavelength that ultrasonic signal mid frequency is corresponding, and it is straight
Footpath is 30mm.
The thickness mode piezoelectricity sky coupling ultrasonic transducer of active matching the most according to claim 2, it is characterised in that described
One matching layer (2) all takes, with the thickness of the second matching layer (3), the quarter-wave that ultrasonic signal mid frequency is corresponding.
The thickness mode piezoelectricity sky coupling ultrasonic transducer of active matching the most according to claim 1, it is characterised in that described
Microcellular foam material is hollow glass micropearl powder and epoxy resin composite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610843021.9A CN106311584B (en) | 2016-09-22 | 2016-09-22 | A kind of thickness mode piezoelectricity sky coupling ultrasonic transducer of active matching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610843021.9A CN106311584B (en) | 2016-09-22 | 2016-09-22 | A kind of thickness mode piezoelectricity sky coupling ultrasonic transducer of active matching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106311584A true CN106311584A (en) | 2017-01-11 |
| CN106311584B CN106311584B (en) | 2018-05-22 |
Family
ID=57820531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610843021.9A Expired - Fee Related CN106311584B (en) | 2016-09-22 | 2016-09-22 | A kind of thickness mode piezoelectricity sky coupling ultrasonic transducer of active matching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106311584B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108106716A (en) * | 2018-02-05 | 2018-06-01 | 大连理工大学 | A kind of Frequency Adjustable high sensitivity hydrophone |
| CN108543689A (en) * | 2018-04-17 | 2018-09-18 | 陕西师范大学 | Broadband air-media ultrasonic energy converter with phonon crystal matching and radiation recombination structure |
| CN109499828A (en) * | 2018-12-26 | 2019-03-22 | 中国科学院声学研究所 | A kind of sky coupling formula piezoelectric ultrasonic transducer and its equivalent-circuit model |
| CN109596183A (en) * | 2018-12-26 | 2019-04-09 | 无锡市宇超电子有限公司 | A kind of flow transducer |
| CN110483950A (en) * | 2019-08-22 | 2019-11-22 | 重庆医科大学 | A kind of modified epoxy and the preparation method and application thereof |
| CN111473839A (en) * | 2020-04-22 | 2020-07-31 | 中电科技集团重庆声光电有限公司 | Ultrasonic transducer and nested structure thereof |
| CN114308600A (en) * | 2021-12-16 | 2022-04-12 | 国网山东省电力公司烟台供电公司 | Air coupling ultrasonic transducer for non-contact detection of insulation defects of switch cabinet |
| CN116813334A (en) * | 2023-02-27 | 2023-09-29 | 广东华中科技大学工业技术研究院 | Porous lead-free piezoelectric ceramic element, air-coupled porous lead-free ultrasonic transducer and preparation method thereof |
| CN117019608A (en) * | 2023-10-08 | 2023-11-10 | 中北大学 | High-performance air-coupled ultrasonic point focusing transducer and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5866499A (en) * | 1981-10-16 | 1983-04-20 | Olympus Optical Co Ltd | Ultrasonic oscillator |
| CN2755899Y (en) * | 2004-09-30 | 2006-02-01 | 中国科学院声学研究所 | Musicial vibration transmitting transverter in water |
| CN100348834C (en) * | 2004-10-21 | 2007-11-14 | 山东科技大学 | Ultrasonic well logging instrument |
| CN101311747A (en) * | 2007-05-23 | 2008-11-26 | 中国科学院声学研究所 | Wide-band transducer for synthesis aperture |
-
2016
- 2016-09-22 CN CN201610843021.9A patent/CN106311584B/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108106716A (en) * | 2018-02-05 | 2018-06-01 | 大连理工大学 | A kind of Frequency Adjustable high sensitivity hydrophone |
| CN108543689A (en) * | 2018-04-17 | 2018-09-18 | 陕西师范大学 | Broadband air-media ultrasonic energy converter with phonon crystal matching and radiation recombination structure |
| CN108543689B (en) * | 2018-04-17 | 2020-04-17 | 陕西师范大学 | Broadband air-dielectric ultrasonic transducer with phononic crystal matching and radiation composite structure |
| CN109499828B (en) * | 2018-12-26 | 2024-01-30 | 中国科学院声学研究所 | Air-coupled piezoelectric ultrasonic transducer and equivalent circuit model thereof |
| CN109499828A (en) * | 2018-12-26 | 2019-03-22 | 中国科学院声学研究所 | A kind of sky coupling formula piezoelectric ultrasonic transducer and its equivalent-circuit model |
| CN109596183A (en) * | 2018-12-26 | 2019-04-09 | 无锡市宇超电子有限公司 | A kind of flow transducer |
| CN109596183B (en) * | 2018-12-26 | 2024-04-05 | 无锡市宇超电子有限公司 | Flow transducer |
| CN110483950A (en) * | 2019-08-22 | 2019-11-22 | 重庆医科大学 | A kind of modified epoxy and the preparation method and application thereof |
| CN110483950B (en) * | 2019-08-22 | 2022-02-15 | 重庆医科大学 | Modified epoxy resin and preparation method and application thereof |
| CN111473839A (en) * | 2020-04-22 | 2020-07-31 | 中电科技集团重庆声光电有限公司 | Ultrasonic transducer and nested structure thereof |
| CN111473839B (en) * | 2020-04-22 | 2022-02-22 | 中电科技集团重庆声光电有限公司 | Ultrasonic transducer and nested structure thereof |
| CN114308600A (en) * | 2021-12-16 | 2022-04-12 | 国网山东省电力公司烟台供电公司 | Air coupling ultrasonic transducer for non-contact detection of insulation defects of switch cabinet |
| CN116813334A (en) * | 2023-02-27 | 2023-09-29 | 广东华中科技大学工业技术研究院 | Porous lead-free piezoelectric ceramic element, air-coupled porous lead-free ultrasonic transducer and preparation method thereof |
| CN117019608A (en) * | 2023-10-08 | 2023-11-10 | 中北大学 | High-performance air-coupled ultrasonic point focusing transducer and preparation method thereof |
| CN117019608B (en) * | 2023-10-08 | 2024-01-05 | 中北大学 | High-performance air-coupled ultrasonic point focusing transducer and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106311584B (en) | 2018-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106311584A (en) | Active matching thickness mould pressing electropneumatic coupling ultrasonic transducer | |
| Savoia et al. | A CMUT probe for medical ultrasonography: From microfabrication to system integration | |
| CN103841499B (en) | One kind application is prestressed to stack piezoelectric circular transducer | |
| US20070035204A1 (en) | Dual frequency band ultrasound transducer arrays | |
| CN111403593B (en) | Sensitive element for manufacturing high-frequency broadband high-sensitivity underwater acoustic transducer and preparation method thereof | |
| CN104090032B (en) | Empty coupling sensor based on the type piezo-electricity composite material of gas base 13 | |
| CN110560348B (en) | MEMS piezoelectric ultrasonic transducer with hole array Helmholtz resonant cavity | |
| CN106475296B (en) | A kind of thickness mode piezoelectricity sky coupling energy converter based on double matching layer structures | |
| CN201063346Y (en) | Sensing vibration diaphragm for dual polarization partitioning electrode | |
| Zhang et al. | Fabrication and characterization of a wideband low-frequency CMUT array for air-coupled imaging | |
| CN101106835A (en) | Array type sound frequency directional ultrasonic speaker | |
| Hernandez et al. | Low-cost, wideband ultrasonic transmitter and receiver for array signal processing applications | |
| CN110560349B (en) | Receiving ultrasonic transducer based on Helmholtz resonant cavity and capable of reducing air damping | |
| CN110560351B (en) | Frequency-adjustable sound wave receiving device based on Helmholtz resonant cavity | |
| CN110681560B (en) | MEMS ultrasonic positioning sensor with Helmholtz resonant cavity | |
| JP6032512B1 (en) | Laminate, ultrasonic transducer and ultrasonic flowmeter | |
| CN206696242U (en) | A kind of stretchable ultrasound transducer array | |
| Abdalla et al. | Numerical simulation of crosstalk effects in PMUT arrays | |
| Ozgurluk et al. | Radiation impedance of collapsed capacitive micromachined ultrasonic transducers | |
| Wang et al. | Development of backing piezoelectric micromachined ultrasonic transducer (B-PMUT) 2D array | |
| Diab et al. | Broadband vibrational energy harvesting with a spherical piezoelectric transducer devoted to underwater wireless sensor networks | |
| CN203061411U (en) | Novel ultrasonic sensor | |
| JP6162451B2 (en) | Ultrasonic sensor | |
| AU2021100869A4 (en) | A Type of Sensitive Element Used for Manufacturing a High-sensitivity Underwater Acoustic Transducer and its Preparation Method | |
| Xu et al. | Coupled piezoelectric micromachined ultrasonic transducers array with high ultrasonic emission performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 Termination date: 20190922 |