CN115460850A - Stacked multilayer circuit board - Google Patents
Stacked multilayer circuit board Download PDFInfo
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- CN115460850A CN115460850A CN202211214749.7A CN202211214749A CN115460850A CN 115460850 A CN115460850 A CN 115460850A CN 202211214749 A CN202211214749 A CN 202211214749A CN 115460850 A CN115460850 A CN 115460850A
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- rod
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- 238000005192 partition Methods 0.000 claims abstract description 75
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 38
- 238000001125 extrusion Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 abstract description 26
- 230000037431 insertion Effects 0.000 abstract description 26
- 238000003860 storage Methods 0.000 abstract description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/06—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
- F16F15/067—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only wound springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention discloses a stacked multilayer circuit board, which relates to the technical field of circuit boards and comprises a bottom plate, wherein an electric board stacking device is arranged on the bottom plate, the electric board stacking device comprises a partition plate, pressure balls are embedded in the partition plate and penetrate through the partition plate, an insertion rod is arranged on the partition plate in a penetrating and sliding mode, and an elastic element is arranged between the outer wall of the insertion rod and the outer wall of the bottom of the partition plate. This heap multilayer circuit board, with circuit board disect insertion division board, the circuit board alright through the arcwall face of division board upper pressure ball upwards extrude the division board and produce the slip, the triangle fixture block alright through the triangle inclined plane of self push into the inserted bar by the chucking hole, after the inserted bar drove the triangle fixture block and passed the chucking hole, the triangle fixture block passed through the triangle perpendicular and blocked in the chucking hole outside, finally makes the different thickness that the division board can be fit for the circuit board or the component of co-altitude piles up the storage operation.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a stacked multilayer circuit board.
Background
The circuit board refers to a circuit board on which various circuit elements are collectively soldered. Because the existing circuit elements are various, the height of the elements on the front surface of the circuit board is different, and the back surface of the circuit board is a welding surface, so that the circuit board is smooth. The circuit board can start various circuit elements welded by the circuit board under the action of the current to achieve multiple functions by interacting with the current, and the application is wide.
In the prior art, after the circuit board is produced, a stacked storage mode is usually used for convenient storage, but because the circuit board has different thicknesses according to different current frequencies and different heights of various elements on the circuit board, gaps between the circuit boards are different in the process of stacking the circuit boards, mutual impact damage is easily caused, and the stacked storage function of the circuit boards is influenced.
Disclosure of Invention
Technical problem to be solved
In view of the deficiencies of the prior art, the present invention provides a stacked multilayer circuit board, which solves the problems set forth in the background art.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a stacked multilayer circuit board comprising a base plate having an electrical board stacking apparatus disposed thereon, the electrical board stacking apparatus comprising:
the pressure ball is embedded in the partition plate, the pressure ball penetrates through the partition plate, the partition plate is provided with an inserted bar in a penetrating and sliding mode, an elastic element is arranged between the outer wall of the inserted bar and the outer wall of the bottom of the partition plate, a spring is arranged between the push plate and the inserted bar in a penetrating mode in the activity of the outer wall of the inserted bar, a clamping plate is fixedly installed on the bottom plate, clamping holes are formed in the clamping plate, and a triangular clamping block is arranged on the inserted bar in a penetrating and sliding mode.
Preferably, the diameter of the clamping hole is the same as the diameter of the inserted rod, the number of the triangular clamping blocks is two, an elastic element is arranged between one ends, close to the inside of the inserted rod, of the triangular clamping blocks, and the triangular inclined surfaces of the triangular clamping blocks are arranged towards the direction of the clamping hole.
Preferably, division board outer wall slidable mounting is on the support outer wall, support outer wall fixed mounting is at the bottom plate top, be provided with pressure loss reduction device on the division board, pressure loss reduction device includes the expansion plate, the expansion plate is rotatable to be installed in the division board bottom.
Preferably, the bottom of the expansion plate is fixedly provided with an ejector rod, the top of the ejector rod is set to be triangular, the partition plate is provided with a through groove, the ejector rod penetrates through the through groove and is slidably mounted on the partition plate, and the outer diameter of the through groove is the same as that of the ejector rod.
Preferably, an arc limiting plate is fixedly mounted on the inner wall of the top of the partition plate, an arc pushing plate is slidably mounted on the outer wall of the arc limiting plate, and an elastic element is arranged between the outer wall of the top of the arc pushing plate and the inner wall of the top of the partition plate.
Preferably, the arc shape of the arc push plate is a quarter of a circle, an auxiliary pressing device is arranged on the partition plate and comprises an extrusion plate, and the extrusion plate is slidably mounted on the inner wall of the partition plate.
Preferably, the extrusion plate is fixedly installed on the inserted link, a cylindrical rod is arranged inside the pressure ball, and an elastic element is arranged between the outer wall of the cylindrical rod and the inner wall of the pressure ball.
Preferably, the top of the cylindrical rod is an arc-shaped surface, a pressing rod is rotatably mounted at the bottom of the cylindrical rod, the pressing rod penetrates through and is slidably mounted at the bottom of the pressure ball, and the outer wall of the bottom of the pressing rod is fixedly provided with the pressing ball.
(III) advantageous effects
The invention provides a stacked multilayer circuit board. The method has the following beneficial effects:
(1) This heap multilayer circuit board, with the circuit board disect insertion division board, the circuit board alright through the arcwall face of division board upper pressure ball with the division board upwards extrude and produce the slip, be about to insert completely when finishing when the circuit board, the circuit board can promote push pedal and inserted bar and slide to the cardboard direction, the triangle fixture block alright through self triangle inclined plane inside the inserted bar is pushed into by the chucking hole, after the inserted bar drives the triangle fixture block and passes the chucking hole, the triangle fixture block is blocked in the chucking hole outside through the triangle perpendicular of self, finally make the different thickness that the division board can be fit for the circuit board or the not component of co-altitude pile up the storage operation.
(2) This heap multilayer circuit board, through being provided with pressure loss reduction device, when the circuit board inserts the division board, the ejector pin alright promote the production with the arc push pedal through the triangle inclined plane of self and slide, thereby the arc push pedal alright compression elastic element produces elasticity, and the elasticity here can offset the decurrent pressure of division board to the circuit board and alleviate to make the downward pressure that the multilayer heap produced on the division board of circuit board obtain reducing, alleviateed pressure loss.
(3) This heap multilayer circuit board through being provided with dead lever and ball, when the ejector pin was upwards promoted by the expansion plate, ejector pin contact ball outside back, the ball can produce the looks mutual friction through the ejector pin outer wall and slide, and the ball just can produce the friction vibration with the through-hole on the ejector pin to drive the ejector pin and produce the vibration, the setting of through-hole can improve the ventilation capacity when the circuit board piles up the storage.
(4) This heap multilayer circuit board through being provided with supplementary pressure setting device, when the circuit board is about to the complete time of inserting, the push pedal drives the inserted bar and slides to the cardboard direction, the slip of stripper plate alright promote the cylinder pole lapse through the arcwall face of self, the cylinder pole is promoted the lapse and is driven the pressure and decide the pole lapse through the arcwall face of self, the pressure is decided the pole alright drive and is pressed the ball and carry out supplementary operation of pressing the fixed support to the circuit board.
(5) This heap multilayer circuit board, the arc of pressure is decided the pole slides and can be driven and press and decide the ball and slide towards pressure ball center direction, make the pressure is decided the ball and can form on the circuit board and remove gliding lower grabbing power to the pressure ball center, after the circuit board inserts completely, the cylinder pole can be extruded by the stripper plate always, make the cylinder pole can drive the pressure and decide the pole and press and decide the ball and continuously push down in the circuit board top, thereby improve the holding power to circuit board and pressure ball outside contact segment, thereby improve the stability after the circuit board inserts completely.
Drawings
FIG. 1 is a schematic view of the overall front view external structure of the present invention;
FIG. 2 is a schematic diagram of the left-view external partial structure of the pressure ball of the present invention;
FIG. 3 is a front view of the internal partial structure of the partition plate of the present invention;
FIG. 4 is a left side view of the inner part of the insert rod of the present invention;
FIG. 5 is a rear view of a partial internal structure of the divider plate of the present invention;
FIG. 6 is a front view of the outer structure of the lift pin of the present invention.
In the figure: 1. a base plate; 21. a partition plate; 22. a pressure ball; 23. inserting a rod; 24. pushing the plate; 25. clamping a plate; 26. a clamping hole; 27. a triangular clamping block; 3. a support; 41. a retractable plate; 42. a top rod; 43. a through groove; 44. an arc-shaped push plate; 45. an arc limiting plate; 51. a through hole; 52. fixing the rod; 53. a ball; 61. a pressing plate; 62. a cylindrical rod; 63. pressing a fixed rod; 64. and (5) pressing the ball.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-6, the present invention provides a technical solution: a stack type multilayer circuit board includes a base plate 1, an electric plate stacking device provided on the base plate 1, the electric plate stacking device including:
a partition plate 21, a pressure ball 22 is fixedly mounted on the partition plate 21, the upper half of the pressure ball 22 is distributed on the outer wall of the top of the partition plate 21, the lower half of the pressure ball 22 is distributed on the outer wall of the bottom of the partition plate 21, the arc-shaped surface of the pressure ball 22 can reduce the contact area with a circuit board, thereby reducing the pressure loss of the pressure ball 22 to the circuit board, an insertion rod 23 is penetratingly and slidably mounted on the partition plate 21, an elastic element is arranged between the outer wall of the insertion rod 23 and the outer wall of the bottom of the partition plate 21, the elastic element uses a metal elastic sheet, a metal spring rod and other elements with elastic functions, so that the insertion rod 23 has elastic force, the self-resetting function can be realized, a spring is arranged between the insertion rod 23 and the push plate 24 in a movable way, the length of the lower half of the push plate 24 is greater than the height of the partition plate 21, and the circuit board can directly push the push plate 24 to move, the outer wall of the top of the bottom plate 1 is fixedly provided with a clamping plate 25, the clamping plate 25 is provided with clamping holes 26, the diameter of each clamping hole 26 is the same as that of the corresponding insertion rod 23, the interval between every two clamping holes 26 is extremely small, even if the insertion rod 23 is not inserted into the corresponding clamping hole 26, the insertion rod 23 can be abutted against the clamping plate 25 and positioned between the two clamping holes 26 by a spring between the insertion rod 23 and the push plate 24, when the subsequent insertion rod 23 moves a little, the insertion rod 23 can be rapidly inserted into the clamping hole 26 close to the insertion rod 23, so that great influence on the fixation of a circuit board can not be generated, the insertion rod 23 is provided with triangular clamping blocks 27 in a penetrating and sliding manner, the number of the triangular clamping blocks 27 is two, an elastic element is arranged between one ends of the two triangular clamping blocks 27 close to the inside of the insertion rod 23, and the elastic element is a metal elastic sheet, a metal spring rod and other elements with elastic function, so that the two triangular clamping blocks 27 have elastic force, the automatic reset function is realized, the triangular inclined planes of the two triangular clamping blocks 27 are arranged towards the clamping hole 26, so that the triangular clamping blocks 27 can be extruded by the clamping hole 26 to move towards the inside of the inserting rod 23 conveniently, the outer wall of the partition plate 21 is slidably arranged on the outer wall of the bracket 3, and the outer wall of the bracket 3 is fixedly arranged on the outer wall of the top of the bottom plate 1;
specifically, the electric plate stacking device in the embodiment includes a partition plate 21, the partition plate 21 is further provided with an insertion rod 23, a push plate 24 and two triangular fixture blocks 27 arranged on the insertion rod 23, and the partition plate 21 is further provided with a clamping plate 25 and a clamping hole 26;
example 2
As shown in fig. 1, 5 and 6, in the present embodiment, in addition to embodiment 1, partition plate 21 is further provided with a pressure loss reducing device, and the pressure loss reducing device includes:
the top of each expansion plate 41 is rotatably mounted on the outer wall of the bottom of the partition plate 21, the number of the expansion plates 41 is two, the two expansion plates 41 are bilaterally and symmetrically distributed about the partition plate 21, the bottoms of the two expansion plates 41 are rotatably mounted with each other, ejector rods 42 are fixedly mounted at the bottoms of the expansion plates 41, the tops of the ejector rods 42 are set to be triangular, the triangular inclined surfaces of the ejector rods 42 facilitate the insertion of the ejector rods 42 into the partition plate 21, through grooves 43 are formed in the partition plate 21, the outer diameter of each through groove 43 is the same as that of each ejector rod 42, the ejector rods 42 directly penetrate through the through grooves 43, arc limiting plates 45 are fixedly mounted on the inner walls of the tops of the partition plates 21, arc push plates 44 are slidably mounted on the outer walls of the arc limiting plates 45, the arcs 44 are in the shape of a quarter circle, the bottoms of the arc push plates 44 are arranged near the tops of the ejector rods 42, the ejector rods 42 penetrate through the through grooves 43 and are slidably mounted on the partition plate 21, elastic elements are arranged between the outer walls of the tops of the arcs 44 and the inner walls of the partitions 21, the tops of the partitions 21, the elastic elements such as metal elastic pieces and metal spring rods are used for enabling the arc push plates 44 to have elastic force acting on the sliding, and further enable the partition plates to generate pressure of the partition plate 21 to change;
the top of the fixing rod 52 is fixedly arranged on the inner wall of the top of the partition plate 21, the bottom of the fixing rod 52 is fixedly provided with a round ball 53, the outer part of the round ball 53 is arranged on a path, upwards, of the ejector rod 42, so that the round ball 53 can be in sliding contact with the outer wall of the ejector rod 42, the top of the fixing rod 52 is arranged far away from the outer part of the through groove 43, the fixing rod 52 is inclined and fixed, the inclined and fixed shape of the fixing rod 52 facilitates the round ball 53 to be in contact with the outer wall of the ejector rod 42, the ejector rod 42 is provided with a through hole 51, and the outer diameter of the round ball 53 is smaller than that of the through hole 51, so that the outer wall of the round ball 53 and the outer wall of the through hole 51 can generate friction vibration, and the sliding smoothness rate of the ejector rod 42 is improved;
specifically, the pressure loss reducing device in this embodiment includes a telescopic plate 41 and a fixing rod 52, the telescopic plate 41 is further provided with a top rod 42, the top rod 42 is further provided with an arc push plate 44, an arc limiting plate 45 and a through groove 43 arranged on the partition plate 21;
example 3
As shown in fig. 1, 2, 3 and 4, in this embodiment, in addition to embodiment 2, an auxiliary pressing device is further provided in partition plate 21, and the auxiliary pressing device includes:
the pressing plate 61 is slidably mounted on the inner wall of the partition plate 21, one end, away from the pressure ball 22, of the pressing plate 61 is fixedly mounted on the outer wall of the insertion rod 23, one end, close to the pressure ball 22, of the pressing plate 61 is set to be an arc-shaped surface, the cylindrical rod 62 is arranged at the center in the pressure ball 22, an elastic element is arranged between the outer wall of the cylindrical rod 62 and the inner wall of the pressure ball 22, the elastic element uses elements with elastic functions such as metal elastic sheets and metal spring rods, the cylindrical rod 62 can be kept at the center of the pressure ball 22 through elastic force and can slide up and down, the top of the cylindrical rod 62 is set to be an arc-shaped surface, the cylindrical rod 62 can be pushed by the arc-shaped surface of the pressing plate 61 to move through the arc-shaped surface, the top of the cylindrical rod 62 is arranged outside one end, close to the arc-shaped surface of the pressing plate 61, the bottom of the cylindrical rod 62 is rotatably mounted at the top of the pressing and fixing rod 63, the pressing and fixing rod 63 is fixedly mounted at the bottom of the pressing rod 63, the pressing and fixing rod 63 penetrates through and is slidably mounted at the bottom of the pressure ball 22, so that the pressing rod 63 can generate an arc-shaped sliding force when the bottom of the pressure ball 22 slides, and the pressing force of the pressing and the pressing ball 22 can be reduced;
specifically, the auxiliary pressing device in this embodiment includes a pressing plate 61, a cylindrical rod 62 is further disposed outside the pressing plate 61, a pressing rod 63 is further disposed at the bottom of the cylindrical rod 62, and a pressing ball 64 is disposed at the bottom of the pressing rod 63.
Based on the above embodiment, the working process of the present invention is that, according to the thickness of the circuit board itself or the highest height component on the circuit board, the circuit board can be directly inserted into the partition plate 21, and the circuit board can extrude the partition plate 21 upwards to slide through the arc-shaped surface of the pressure ball 22 on the partition plate 21, so that the partition plate 21 can slide upwards along the bracket 3, and the partition plate 21 can be opened according to the thickness of the circuit board itself or the height of the component on the circuit board, so as to facilitate stacking of the circuit board, when the circuit board is about to be completely inserted, the circuit board can push the push plate 24 to slide towards the direction of the snap plate 25, the push plate 24 can drive the insertion rod 23 to move towards the direction of the snap plate 25, the insertion rod 23 can drive the triangular clamping block 27 to move to the outside of the clamping hole 26, and the insertion rod 23 continues to move, so that the triangular clamping block 27 can push the inside of the insertion rod 23 through the triangular inclined surface of the self, and after the insertion rod 23 drives the triangular clamping block 27 to pass through the clamping hole 26, the clamping hole 27, the triangular block 27 can return to the initial position due to the self elastic force, and the circuit board can be completely inserted into the partition plate 21, and the vertical surface of the circuit board 21, so that the circuit board can be finally operate at different heights to store components with different heights;
by arranging the pressure loss reducing device, when the circuit board is inserted into the partition plate 21, the circuit board can push the two expansion plates 41 upwards to move in the direction close to the partition plate 21 through the bottoms of the two expansion plates 41, so that the expansion plates 41 drive the ejector rods 42 to be inserted into the partition plate 21 under the pushing of the circuit board 21, the ejector rods 42 move upwards through the through grooves 43, the ejector rods 42 can push the arc push plates 44 to slide through the triangular inclined surfaces of the ejector rods 42, the arc push plates 44 can slide upwards in an arc shape along the arc limiting plates 45, the arc push plates 44 can compress elastic elements between the ejector rods and the partition plate 21 to generate elastic force, the tops of the arc push plates 44 can provide upward elastic force for the partition plate 21, and the elastic force can offset and reduce the downward pressure of the partition plate 21 on the circuit board, the downward pressure generated by the multiple layers of stacked circuit boards on the partition plates 21 is reduced, the pressure loss borne by the circuit boards below each layer of partition plates 21 is further reduced, the long-term storage capacity of the circuit boards is improved, and the pressure loss is reduced, by arranging the fixing rods 52 and the round balls 53, when the ejector rods 42 are pushed upwards by the telescopic plates 41, the ejector rods 42 are gradually close to the outer parts of the round balls 53, after the ejector rods 42 contact the outer parts of the round balls 53, the round balls 53 can generate mutual friction sliding through the outer walls of the ejector rods 42, the round balls 53 can slide downwards relative to the ejector rods 42, the round balls 53 can generate friction vibration with the through holes 51 on the ejector rods 42, so that the ejector rods 42 are driven to generate vibration, the round balls 53 can perform friction vibration on the through holes 51, and the arrangement of the through holes 51 can improve the ventilation capacity of the stacked circuit boards during storage;
through being provided with supplementary pressure and decide device, when the circuit board is about to insert completely, the circuit board can drive inserted bar 23 through push pedal 24 and slide to cardboard 25 direction, inserted bar 23 alright drive stripper plate 61 slide to cardboard 25 direction inside division board 21, the slip of stripper plate 61 alright promote the cylinder pole 62 through self arcwall face and slide downwards, cylinder pole 62 is promoted to slide downwards through self arcwall face and drives pressure and decide pole 63 and slide downwards, it produces the arc slip to press the pole 63 to be promoted downwards by cylinder pole 62, gliding pressure and decide pole 63 alright drive the top of pressure and decide ball 64 and follow the removal, the arc slip of pressure and decide pole 63 can drive pressure and decide ball 64 and slide towards pressure ball 22 central direction, make pressure and decide ball 64 can form on the circuit board and move gliding lower grabbing power to pressure ball 22 central movement, after the circuit board inserts completely, cylinder pole 62 can be extruded by stripper plate 61 always, make pressure and decide pole 63 and pressure and press and decide ball 64 and keep pressing and pressing the top of circuit board, thereby improve the circuit board and press ball 22 external contact part and support the stability after inserting completely.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A stacked multilayer circuit board comprising a base plate, characterized in that: be provided with the electroplax on the bottom plate and pile up the device, the electroplax piles up the device and includes:
the pressure ball is embedded in the partition plate, the pressure ball penetrates through the partition plate, the partition plate is provided with an inserted bar in a penetrating and sliding mode, an elastic element is arranged between the outer wall of the inserted bar and the outer wall of the bottom of the partition plate, a spring is arranged between the push plate and the inserted bar in a penetrating mode in the activity of the outer wall of the inserted bar, a clamping plate is fixedly installed on the bottom plate, clamping holes are formed in the clamping plate, and a triangular clamping block is arranged on the inserted bar in a penetrating and sliding mode.
2. A stacked multilayer circuit board according to claim 1, wherein: the diameter of the clamping hole is the same as that of the inserted bar, the number of the triangular clamping blocks is two, an elastic element is arranged between one ends, close to the inner part of the inserted bar, of the triangular clamping blocks, and the triangular inclined surfaces of the triangular clamping blocks are arranged towards the direction of the clamping hole.
3. The stacked multilayer circuit board of claim 2, wherein: the pressure reducing device comprises a support, a partition plate and a pressure reducing device, wherein the partition plate is arranged on the support, the partition plate is arranged on the bottom plate, the partition plate is arranged on the support, the pressure reducing device is arranged on the partition plate, the partition plate is arranged on the bottom plate in a sliding mode, and the pressure reducing device comprises a telescopic plate which can be rotatably arranged on the bottom of the partition plate.
4. A stacked multilayer circuit board according to claim 3, wherein: the telescopic plate is characterized in that a top rod is fixedly mounted at the bottom of the telescopic plate, the top of the top rod is set to be triangular, a through groove is formed in the partition plate, the top rod penetrates through the through groove and is slidably mounted on the partition plate, and the outer diameter of the through groove is the same as that of the top rod.
5. The stacked multilayer circuit board of claim 4, wherein: the partition plate is characterized in that an arc-shaped limiting plate is fixedly mounted on the inner wall of the top of the partition plate, an arc-shaped push plate is slidably mounted on the outer wall of the arc-shaped limiting plate, and an elastic element is arranged between the outer wall of the top of the arc-shaped push plate and the inner wall of the top of the partition plate.
6. The stacked multilayer circuit board of claim 5, wherein: the arc-shaped of the arc-shaped push plate is a quarter of a circle, the partition plate is provided with an auxiliary pressing device, the auxiliary pressing device comprises an extrusion plate, and the extrusion plate is slidably mounted on the inner wall of the partition plate.
7. A stacked multilayer circuit board according to claim 6, wherein: the extrusion plate is fixedly arranged on the inserted rod, a cylindrical rod is arranged in the pressure ball, and an elastic element is arranged between the outer wall of the cylindrical rod and the inner wall of the pressure ball.
8. The stacked multilayer circuit board of claim 7, wherein: the top of the cylindrical rod is designed to be an arc-shaped surface, the bottom of the cylindrical rod is rotatably provided with a pressing rod, the pressing rod penetrates through and is slidably arranged at the bottom of the pressure ball, and the outer wall of the bottom of the pressing rod is fixedly provided with the pressing ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211214749.7A CN115460850A (en) | 2022-09-30 | 2022-09-30 | Stacked multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211214749.7A CN115460850A (en) | 2022-09-30 | 2022-09-30 | Stacked multilayer circuit board |
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| Publication Number | Publication Date |
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| CN115460850A true CN115460850A (en) | 2022-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211214749.7A Pending CN115460850A (en) | 2022-09-30 | 2022-09-30 | Stacked multilayer circuit board |
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| CN212086590U (en) * | 2020-04-25 | 2020-12-04 | 珠海市奔强科技有限公司 | Bonding locate mode multilayer circuit board |
| CN113957992A (en) * | 2021-11-09 | 2022-01-21 | 深圳市凯丰建筑设计有限公司 | Heat insulation system and heat insulation method of building |
| CN114551649A (en) * | 2022-02-26 | 2022-05-27 | 安徽英发德盛科技有限公司 | Stacking heat dissipation structure for PERC double-sided battery |
| CN217444921U (en) * | 2022-03-18 | 2022-09-16 | 宁波天安电气科技有限公司 | Novel low pressure drawer unit division board |
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2022
- 2022-09-30 CN CN202211214749.7A patent/CN115460850A/en active Pending
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| FR2576422A1 (en) * | 1985-01-22 | 1986-07-25 | Feinmetall Gmbh | CONTROL ADAPTER, ESPECIALLY FOR ELECTRONIC OR ELECTRICAL CIRCUITS AND PARTICULARLY PRINTED OR SIMILAR CIRCUITS |
| EP0256164A2 (en) * | 1986-07-18 | 1988-02-24 | Stucki Kunststoffwerk und Werkzeugbau GmbH. | Device for conveying printed circuit boards |
| CN208433901U (en) * | 2018-06-25 | 2019-01-25 | 山东宇田电子科技有限公司 | A kind of frequency converter with silencing apparatus |
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| CN211686263U (en) * | 2019-12-29 | 2020-10-16 | 深圳市长实精密技术有限公司 | Circuit board stacking device |
| CN212086590U (en) * | 2020-04-25 | 2020-12-04 | 珠海市奔强科技有限公司 | Bonding locate mode multilayer circuit board |
| CN111846555A (en) * | 2020-07-14 | 2020-10-30 | 安徽万有新材料有限公司 | Folding type multifunctional food packaging container |
| CN113957992A (en) * | 2021-11-09 | 2022-01-21 | 深圳市凯丰建筑设计有限公司 | Heat insulation system and heat insulation method of building |
| CN114551649A (en) * | 2022-02-26 | 2022-05-27 | 安徽英发德盛科技有限公司 | Stacking heat dissipation structure for PERC double-sided battery |
| CN217444921U (en) * | 2022-03-18 | 2022-09-16 | 宁波天安电气科技有限公司 | Novel low pressure drawer unit division board |
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