CN212086590U

CN212086590U - Bonding locate mode multilayer circuit board

Info

Publication number: CN212086590U
Application number: CN202020641605.XU
Authority: CN
Inventors: 张毅; 但家铨
Original assignee: Zhuhai Benqiang Technology Co ltd
Current assignee: Zhuhai Benqiang Technology Co ltd
Priority date: 2020-04-25
Filing date: 2020-04-25
Publication date: 2020-12-04
Anticipated expiration: 2030-04-25

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a bonded positioning type multilayer circuit board, which comprises a plurality of circuit boards which are arranged in parallel, wherein a vertical fixed plate is vertically arranged on the outer wall of one side of each circuit board, a plurality of clamping plates are tightly welded on one side of the vertical fixed plate from top to bottom, one side of each circuit board is clamped between two adjacent clamping plates, four corners at the top of each circuit board are provided with bonding mechanisms, an inserting rod is tightly welded on the outer wall of one side of each circuit board, and a clamping mechanism is embedded in the outer wall of one side; the bonding mechanism comprises a fixing groove tightly welded with the surface of the circuit board, a clamping block is inserted into the top of the fixing groove, and a clamping groove is tightly welded on the bottom surface of the circuit board close to the adjacent clamping block. The utility model discloses a design can reduce the space of the inside circuit board of equipment and occupy, conveniently fixes a position every circuit board, can not cause the skew, and can pull down every circuit board alone when needs are dismantled and are installed, conveniently maintains the operation.

Description

Bonding locate mode multilayer circuit board

Technical Field

The utility model relates to an electronic equipment technical field, specifically speaking relates to a bonding locate mode multilayer circuit board.

Background

The circuit board can be called printed wiring board or printed circuit board, often uses in electronic equipment, and current circuit board generally places for the individual layer installation, and it is great to cause the inside occupation space of equipment, and when using a plurality of circuit boards, inconvenient fixes a position every circuit board, also comparatively troublesome when needs are dismantled and are installed, the later stage maintenance of being not convenient for.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a bonding locate mode multilayer circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the purpose, the utility model provides a bonded positioning type multilayer circuit board, which comprises a plurality of circuit boards which are arranged in parallel, wherein a vertical fixing plate is vertically arranged on the outer wall of one side of each circuit board, a plurality of clamping plates are tightly welded on one side of each vertical fixing plate from top to bottom, one side of each circuit board is clamped between two adjacent clamping plates, bonding mechanisms are arranged at four corners of the top of each circuit board, an inserting rod is tightly welded on the outer wall of one side of each circuit board, and a clamping mechanism is embedded in the outer wall of one side of each circuit board, which is far; the bonding mechanism comprises a fixing groove tightly welded with the surface of the circuit board, a clamping block is inserted into the top of the fixing groove, a clamping groove is tightly welded on the bottom surface of the circuit board close to the adjacent clamping block, and the clamping block is clamped and matched with the clamping groove; the clamping mechanism comprises a fixed pipe, a button is inserted into the top of the fixed pipe, a positioning hole is formed in the outer wall of one side of the button, a bottom plate is welded to the bottom of the fixed pipe closely, a reset spring is welded to the position, located inside the fixed pipe, of the top of the bottom plate closely, a jack is formed in the outer wall of one side of the fixed pipe, one end of an inserting rod is in insertion fit with the jack of the outer wall of one side of the adjacent bonded positioning type multilayer circuit board, and the end of the inserting rod is in clamping fit with the positioning.

Preferably, the surface of the clamping plate is tightly bonded with a bulge, a groove is formed in the surface of the circuit board close to the bulge, and the bulge is in clamping fit with the groove.

Preferably, a plurality of buffer springs are tightly welded at the bottom of the clamping block.

Preferably, the bottom of the positioning hole is of an arc surface structure.

Preferably, the clamping plates are arranged in parallel at equal intervals from top to bottom.

Preferably, the top of the latch protrudes out of the opening of the top of the fixing groove.

Preferably, the button is of a cylindrical structure and has a length greater than that of the fixing tube.

Compared with the prior art, the beneficial effects of the utility model are that:

this bonding locate mode multilayer circuit board can reduce the space occupation of the inside circuit board of equipment, and conveniently fixes a position every circuit board, can not cause the skew, and can pull down every circuit board alone when needs are dismantled and are installed, conveniently maintains the operation.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic side view of the circuit board of the present invention;

fig. 3 is an explosion structure diagram of the middle clamping mechanism of the present invention.

In the figure: 1. a circuit board; 11. a groove; 12. inserting a rod; 2. a vertical fixing plate; 21. a splint; 22. a protrusion; 3. a bonding mechanism; 31. fixing grooves; 32. a clamping block; 33. a buffer spring; 4. a card slot; 5. a clamping mechanism; 51. a fixed tube; 511. a jack; 52. a button; 521. positioning holes; 53. a base plate; 531. a return spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

The utility model provides a bonded locate mode multilayer circuit board, as shown in fig. 1-fig. 3, circuit board 1 including a plurality of parallel arrangement, the vertical fixed plate 2 that is provided with of one side outer wall of circuit board 1, one side top-down of vertical fixed plate 2 has a plurality of splint 21 of closely welding, and one side card of circuit board 1 is between two adjacent splint 21, guarantees circuit board 1 top-down parallel arrangement, and bonding mechanism 3 is installed to four corners at the top of circuit board 1, and the joint is avoided causing the skew between two circuit boards 1 about guaranteeing. The outer wall of one side of the circuit board 1 is tightly welded with an inserting rod 12, and the outer wall of one side of the circuit board 1, which is far away from the inserting rod 12, is embedded with a clamping mechanism 5, so that the left and right adjacent bonding positioning type multilayer circuit boards can be fixed conveniently; the bonding mechanism 3 comprises a fixing groove 31 tightly welded with the surface of the circuit board 1, a clamping block 32 is inserted into the top of the fixing groove 31, a clamping groove 4 is tightly welded on the bottom surface of the circuit board 1 close to the adjacent clamping block 32, and the clamping block 32 is clamped and matched with the clamping groove 4; the clamping mechanism 5 comprises a fixed pipe 51, a button 52 is inserted into the top of the fixed pipe 51, a positioning hole 521 is formed in the outer wall of one side of the button 52, a bottom plate 53 is tightly welded at the bottom of the fixed pipe 51, a return spring 531 is tightly welded in the position, located inside the fixed pipe 51, of the top of the bottom plate 53, an insertion hole 511 is formed in the outer wall of one side of the fixed pipe 51, one end of the insertion rod 12 is inserted into and matched with the insertion hole 511 in the outer wall of one side of the adjacent bonded positioning type multilayer circuit board, the end of the insertion rod is clamped and matched with. The positioning hole 521 and the insertion hole 511 are aligned, one end of the inserted link 12 is inserted into the positioning hole 521 and the insertion hole 511 in sequence, and the bottom of the positioning hole 521 presses the end of the inserted link 12 upwards by the upward force of the return spring 531, so that the inserted link 12 is prevented from falling off.

Specifically, the surface of splint 21 closely bonds and has arch 22, and the surface of circuit board 1 is close to arch 22 department and has seted up recess 11, and arch 22 and the cooperation of recess 11 joint guarantee that one side card of circuit board 1 is difficult for sliding between splint 21.

In addition, a plurality of buffer springs 33 are tightly welded at the bottom of the fixture block 32, so that a certain buffer space is ensured between the bottom of the fixture block and the bottom of the clamping groove 4, and abrasion caused by too tight clamping is avoided.

Furthermore, the bottom of the positioning hole 521 is of an arc-shaped structure, and is attached to the outer wall of the inserted link 12, so that the inserted link 12 can be conveniently clamped in.

Further, the clamping plates 21 are arranged in parallel at equal intervals from top to bottom, so that the circuit boards 1 can be arranged in parallel at equal intervals.

Further, the tops of the locking blocks 32 protrude out of the top openings of the fixing grooves 31, so that the locking blocks are conveniently clamped with the upper locking grooves 4.

Further, the button 52 has a cylindrical structure and a length greater than that of the fixing tube 51, so that the button 52 can be pressed downward.

When the bonding positioning type multilayer circuit board is used, the circuit boards 1 are firstly arranged from top to bottom, one side of each circuit board is clamped between the adjacent clamping plates 21, the vertical parallel arrangement of the circuit boards 1 is ensured through the vertical fixing plate 2, the clamping block 32 on each circuit board 1 is clamped with the adjacent clamping groove 4, so that the circuit boards are further prevented from being deviated, the left and right adjacent bonding positioning type multilayer circuit boards are attached, the button 52 is pressed, the inserting rod 12 is inserted into the inserting hole 511, one end of the inserting rod is clamped with the positioning hole 521, the button 52 is loosened, the positioning hole 521 is clamped with one end of the inserting rod 12 under the action of the reset spring 531, and the circuit boards 1 are ensured to be fixedly installed.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a bonding locate mode multilayer circuit board, includes a plurality of parallel arrangement's circuit board (1), its characterized in that: a vertical fixing plate (2) is vertically arranged on the outer wall of one side of the circuit board (1), a plurality of clamping plates (21) are tightly welded on one side of the vertical fixing plate (2) from top to bottom, one side of the circuit board (1) is clamped between two adjacent clamping plates (21), four corners of the top of the circuit board (1) are provided with bonding mechanisms (3), an inserting rod (12) is tightly welded on the outer wall of one side of the circuit board (1), and a clamping mechanism (5) is embedded on the outer wall of one side, far away from the inserting rod (12), of the circuit board (1); the bonding mechanism (3) comprises a fixing groove (31) tightly welded with the surface of the circuit board (1), a clamping block (32) is inserted into the top of the fixing groove (31), a clamping groove (4) is tightly welded on the bottom surface of the circuit board (1) close to the adjacent clamping block (32), and the clamping block (32) is clamped and matched with the clamping groove (4); clamping mechanism (5) are including fixed pipe (51), it has button (52) to peg graft at the top of fixed pipe (51), locating hole (521) have been seted up to one side outer wall of button (52), the bottom of fixed pipe (51) has closely welded bottom plate (53), the inside that the top of bottom plate (53) is located fixed pipe (51) closely welds reset spring (531), jack (511) have been seted up to one side outer wall of fixed pipe (51), the one end of inserted bar (12) and jack (511) the grafting cooperation of adjacent bonding locate mode multilayer circuit board one side outer wall and end department and locating hole (521) joint cooperation.

2. The bond-positioned multilayer circuit board of claim 1, wherein: the surface of splint (21) closely bonds and has arch (22), recess (11) have been seted up near arch (22) department on the surface of circuit board (1), arch (22) and recess (11) joint cooperation.

3. The bond-positioned multilayer circuit board of claim 1, wherein: and a plurality of buffer springs (33) are tightly welded at the bottoms of the clamping blocks (32).

4. The bond-positioned multilayer circuit board of claim 1, wherein: the bottom of the positioning hole (521) is of an arc surface structure.

5. The bond-positioned multilayer circuit board of claim 1, wherein: the clamping plates (21) are arranged in parallel at equal intervals from top to bottom.

6. The bond-positioned multilayer circuit board of claim 1, wherein: the top of the clamping block (32) protrudes out of the opening of the top of the fixing groove (31).

7. The bond-positioned multilayer circuit board of claim 1, wherein: the button (52) is of a cylindrical structure and has a length greater than that of the fixing tube (51).