CN115449319A - Glue for PCB drilling and preparation method and application thereof - Google Patents
Glue for PCB drilling and preparation method and application thereof Download PDFInfo
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- CN115449319A CN115449319A CN202211286660.1A CN202211286660A CN115449319A CN 115449319 A CN115449319 A CN 115449319A CN 202211286660 A CN202211286660 A CN 202211286660A CN 115449319 A CN115449319 A CN 115449319A
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- 238000005553 drilling Methods 0.000 title claims abstract description 109
- 238000002360 preparation method Methods 0.000 title claims abstract description 28
- 239000003292 glue Substances 0.000 title claims description 43
- 239000000839 emulsion Substances 0.000 claims abstract description 65
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 38
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 38
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 37
- 239000011248 coating agent Substances 0.000 claims abstract description 36
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 35
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000007787 solid Substances 0.000 claims abstract description 23
- 238000002156 mixing Methods 0.000 claims description 46
- 239000002562 thickening agent Substances 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 23
- 239000000945 filler Substances 0.000 claims description 19
- 239000000080 wetting agent Substances 0.000 claims description 18
- 239000002518 antifoaming agent Substances 0.000 claims description 16
- 238000004026 adhesive bonding Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 11
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- 239000013530 defoamer Substances 0.000 claims description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 5
- -1 polyethylene Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 239000002480 mineral oil Substances 0.000 claims description 2
- 235000010446 mineral oil Nutrition 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 14
- 239000011347 resin Substances 0.000 abstract description 14
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- 238000005406 washing Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 21
- 229910052782 aluminium Inorganic materials 0.000 description 21
- 238000001035 drying Methods 0.000 description 19
- 239000003795 chemical substances by application Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000004090 dissolution Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 125000003636 chemical group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003009 polyurethane dispersion Polymers 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention provides a coating for PCB drilling and a preparation method and application thereof, wherein the coating for PCB drilling comprises 20-70 parts by weight of aqueous polyacrylate emulsion, 5-25 parts by weight of polyvinyl alcohol and 20-60 parts by weight of ethylene-vinyl acetate copolymer emulsion; the three aqueous resins are selected to be matched and coordinated within a specific dosage range, so that the obtained coating for PCB drilling has the advantages of environmental protection, is very friendly to the environment, constructors and terminal users, has the characteristic of high solid content, needs shorter curing time at a specific temperature, improves the production efficiency, and forms a coating film with higher substrate adhesive force and excellent water washing performance after curing, and is particularly suitable for PCB drilling.
Description
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to a glue for PCB drilling, and a preparation method and application thereof.
Background
PCBs, i.e., printed circuit boards, are one of the important components in the electronic industry, and are almost found in every kind of electronic devices, electronic components in the electronic devices are mounted on PCBs with different sizes, and the main function of the PCBs is to connect various electronic components to form a predetermined circuit, thereby playing a role of relay transmission.
The PCB drilling is to drill a required through hole on the copper-clad plate so as to provide the function of fixing the device by electrical connection. The common drilling types in the PCB comprise a via hole, a blind hole and a buried hole, wherein the via hole mainly plays a role in circuit interconnection and conduction, the blind hole is used for connecting an outermost layer circuit in the PCB with an adjacent inner layer through a plating hole, and the buried hole is used for connecting any circuit layer in the PCB but is not conducted to the outer layer and is not extended to the surface of the circuit board. The PCB cover plate plays a role in protecting the copper foil surface of the copper-clad plate in the PCB drilling process, improving the drilling precision, improving the hole wall quality, reducing the abrasion of a drill point and inhibiting the upper burr.
At present, the materials commonly adopted by the PCB cover plate comprise an aluminum sheet, a coating aluminum sheet, a phenolic resin plate, a single-side coarsening phenolic resin plate and the like, and the existing common cover plate can not meet the drilling requirement of high-end electronic products, so that the drilling glue is generated, and the drilling glue is used for solving the problems of poor drilling precision, long baking time and poor adhesion with the aluminum plate when the aluminum-based cover plate is singly used for PCB drilling. CN105694689A discloses a glued aluminum cover plate for PCB and its preparation method, wherein, said glued aluminum cover plate is prepared by adding certain solid filler into the original glue solution, stirring uniformly, and then coating on the aluminum sheet. CN110281308A discloses a coated aluminum-based cover plate for PCB drilling and a preparation method thereof, wherein the coated aluminum-based cover plate for PCB drilling comprises an aluminum foil and a water-soluble composite molecular resin layer arranged on the upper surface of the aluminum foil, and the water-soluble composite molecular resin layer comprises water-soluble hot-melt resin, water-soluble bonding resin and an auxiliary agent; in the invention, the water-soluble composite polymer resin layer has moderate toughness and can play a role in guiding a drill point in the falling process, thereby improving the drilling precision; meanwhile, the hot-melt resin in the water-soluble composite polymer resin layer can play roles of lubricating a drill bit and cooling the drill bit during drilling, so that the roughness of the hole wall is effectively improved, wire winding is reduced, the temperature of the drill bit is reduced, and the service life of the drill bit is prolonged; in addition, the water-soluble composite polymer resin layer has good water solubility, is easy to process after drilling and is not easy to attach to a PCB, so that the drilling quality is improved.
However, the glue for drilling holes on aluminum-based cover plates provided in the prior art including the above invention generally has the problems of low solid content, high curing temperature and long curing time, which leads to low production efficiency, low adhesion to a base material after curing to form a film, and poor water washing resistance, and is not suitable for large-scale industrial production.
Therefore, the development of the adhesive for PCB drilling, which has high solid content, is easy to dry, and has higher adhesive force and excellent washing performance after curing, is a technical problem which needs to be solved urgently in the field.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide the glue for PCB drilling and the preparation method and the application thereof, and the obtained glue for PCB drilling has the characteristics of high solid content and easy drying by selecting three resins of water-based polyacrylate emulsion, polyvinyl alcohol and ethylene-vinyl acetate copolymer emulsion for coordination and collocation, thereby being beneficial to improving the production efficiency and saving energy, and having higher base material adhesive force and excellent washing performance after curing.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a coating for PCB drilling, which comprises the following components in parts by weight:
20 to 70 portions of water-based polyacrylate emulsion
5 to 25 portions of polyvinyl alcohol
20 to 60 portions of ethylene-vinyl acetate copolymer emulsion.
Wherein the aqueous polyacrylate emulsion may be 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, or the like.
The polyvinyl alcohol may be 7 parts by weight, 9 parts by weight, 11 parts by weight, 13 parts by weight, 15 parts by weight, 17 parts by weight, 19 parts by weight, 21 parts by weight, 23 parts by weight, 25 parts by weight, or the like.
The ethylene-vinyl acetate copolymer emulsion may be 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, or the like.
The coating for PCB drilling provided by the invention comprises the combination of the water-based polyacrylate emulsion, the polyvinyl alcohol and the ethylene-vinyl acetate copolymer emulsion in a specific part, and the three resins are matched, so that the performance characteristics of the three resins can be kept, the three resins can generate a synergistic effect, and the obtained coating for PCB drilling has excellent comprehensive performance. Particularly, the three aqueous resins are adopted for collocation, so that the coating for PCB drilling is more green and environment-friendly, the coating is very friendly to the environment, constructors and users, the obtained coating for PCB drilling can also have higher solid content, the drying time required at the same baking temperature is shorter, the production efficiency is improved, the carbon emission is reduced, meanwhile, the adhesion force to a base material after the coating for PCB drilling is solidified is higher, the coating also has excellent washing performance, and the coating is particularly suitable for PCB drilling.
Preferably, the viscosity of the paste for PCB drilling is 10000 to 20000cps, such as 11000cps, 12000cps, 13000cps, 14000cps, 15000cps, 16000cps, 17000cps, 18000cps or 19000cps, and more preferably 14000 to 18000cps.
Preferably, the solids content of the PCB drilling paste is 62-72%, such as 63%, 64%, 65%, 66%, 67%, 68%, 69%, 70%, 71%, or the like.
Preferably, the content of the aqueous polyacrylate emulsion in the coating for PCB drilling is 30-60 parts by weight.
Preferably, the aqueous polyacrylate emulsion has a solids content of 45 to 60%, such as 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, or 59%, and the like.
Preferably, the preparation monomer of the aqueous polyacrylate emulsion comprises any one of methyl acrylate, butyl acrylate, acrylic acid, isooctyl acrylate, styrene or vinyl acetate or the combination of at least two of the methyl acrylate, the butyl acrylate, the acrylic acid, the isooctyl acrylate and the styrene.
In the present invention, the aqueous polyacrylate emulsion is an aqueous polyacrylate emulsion obtained by emulsion polymerization of monomers such as methyl acrylate, butyl acrylate, acrylic acid, isooctyl acrylate, styrene or vinyl acetate, and is preferably one or a combination of at least two of Archsol 8223, adwel 1319 and Adwel 1516.
Preferably, the content of the polyvinyl alcohol in the paste for PCB drilling is 10 to 25 parts by weight, such as 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, 20 parts by weight, 22 parts by weight, 24 parts by weight, or the like.
In the present invention, the polyvinyl alcohol is a white flake, white flocculent or powdery solid.
Preferably, the polyvinyl alcohol comprises any one of PVA0588, PVA1788 or PVA2488 or a combination of at least two thereof.
Preferably, the mass ratio of the polyvinyl alcohol to the polyacrylate emulsion is 1 (2-5), such as 1.
As a preferred technical scheme of the invention, the mass ratio of the polyvinyl alcohol to the water-based polyacrylate emulsion is limited to 1 (2-5), so that the comprehensive performance of the obtained gluing for PCB drilling is more excellent; on the one hand, if the addition amount of polyvinyl alcohol therein is less than the above ratio range, the washing performance of the obtained paste for drilling of PCB after film formation will be deteriorated, and on the other hand, if the addition amount of polyvinyl alcohol therein exceeds the above specific ratio range, the adhesion of the obtained paste for drilling of PCB after film formation will be deteriorated.
Preferably, the content of the ethylene-vinyl acetate copolymer emulsion in the glue for PCB drilling is 25 to 55 parts by weight, such as 27 parts by weight, 29 parts by weight, 31 parts by weight, 33 parts by weight, 35 parts by weight, 37 parts by weight, 39 parts by weight, 41 parts by weight, 43 parts by weight, 45 parts by weight, 47 parts by weight, 49 parts by weight, 51 parts by weight, 53 parts by weight, or the like.
Preferably, the ethylene-vinyl acetate copolymer emulsion has a solids content of 50 to 60%, such as 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, or 59%, and the like.
In the present invention, the ethylene-vinyl acetate copolymer emulsion is a polymer emulsion obtained by copolymerizing a vinyl acetate monomer and an ethylene monomer as basic raw materials with other auxiliary materials by an emulsion polymerization method, and preferably the ethylene-vinyl acetate copolymer emulsion includes any one or a combination of at least two of DA102, EP645, and EP 708.
Preferably, the mass ratio of the polyvinyl alcohol to the ethylene-vinyl acetate copolymer emulsion is 1 (2 to 5.5), such as 1.
As a preferred technical scheme of the invention, the mass ratio of the polyvinyl alcohol to the ethylene-vinyl acetate copolymer emulsion is limited to 1 (2-5.5), so that the finally obtained glue for PCB drilling has more excellent comprehensive performance, and on one hand, if the dosage of the added polyvinyl alcohol is lower than the specific ratio range, the washing performance of the glue for PCB drilling after film formation is poor; on the other hand, if the polyvinyl alcohol is added in an amount exceeding the above-specified ratio range, it may result in poor adhesion after the paste for PCB drilling is formed into a film.
Preferably, the paste for PCB drilling further includes any one or a combination of at least two of a filler, a wetting agent, an antifoaming agent, or a thickener.
As a preferred technical scheme of the invention, any one or a combination of at least two of a filler, a wetting agent, a defoaming agent or a thickening agent is added into the preparation raw material of the glue for drilling the PCB, wherein the defoaming agent can effectively inhibit the generation of foam in the construction and preparation processes, and the wetting agent can effectively inhibit the static and dynamic surface tension of the product, so that the product has good wettability.
Preferably, the content of the filler in the paste for drilling PCB is 1 to 10 parts by weight, for example, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, or 9 parts by weight, and the like, and more preferably 2 to 7 parts by weight.
Preferably, the filler comprises nanosilica.
Preferably, the nanosilica comprises any one of, or a combination of at least two of, fumed silica, wet silica or sol-gel silica.
Preferably, the nanosilica includes any one of a200, a300 or R202 or a combination of at least two thereof.
Preferably, the defoaming agent in the coating for drilling holes in the PCB is contained in an amount of 0.01 to 0.2 parts by weight, for example, 0.02 part by weight, 0.04 part by weight, 0.06 part by weight, 0.08 part by weight, 0.1 part by weight, 0.12 part by weight, 0.14 part by weight, 0.16 part by weight, or 0.18 part by weight, and the like, and more preferably 0.02 to 0.08 part by weight.
Preferably, the defoamer comprises a silicone based defoamer and/or a mineral oil based defoamer.
Preferably, the defoamer comprises any one of, or a combination of at least two of, BYK024, BYK028, or basf 2410.
Preferably, the content of the wetting agent in the paste for drilling PCB is 0.1 to 1 part by weight, for example, 0.2 part by weight, 0.3 part by weight, 0.4 part by weight, 0.5 part by weight, 0.6 part by weight, 0.7 part by weight, 0.8 part by weight, or 0.9 part by weight, and the like, and more preferably 0.2 to 0.6 part by weight.
Preferably, the wetting agent comprises any one of OT75, digan 245 or digan 500, or a combination of at least two of tussit.
Preferably, the thickener is contained in the paste for PCB drilling in an amount of 0.05 to 1 part by weight, for example, 0.07 part by weight, 0.09 part by weight, 0.1 part by weight, 0.2 part by weight, 0.3 part by weight, 0.4 part by weight, 0.5 part by weight, 0.6 part by weight, 0.7 part by weight, 0.8 part by weight, or 0.9 part by weight, and the like, and more preferably 0.2 to 0.8 part by weight.
Preferably, the thickener comprises a hydrophobically associative polyurethane thickener.
Preferably, the thickener comprises any one of U604, U601, U300 or U902 or a combination of at least two thereof.
In a second aspect, the present invention provides a method for preparing the paste for PCB drilling according to the first aspect, the method comprising: mixing an aqueous polyacrylate emulsion, polyvinyl alcohol, an ethylene-vinyl acetate copolymer emulsion, an optional filler, an optional wetting agent, an optional defoaming agent and an optional thickening agent to obtain the glue for PCB drilling.
Preferably, the preparation method specifically comprises the following steps: mixing the water-based polyacrylate emulsion and polyvinyl alcohol, adding ethylene-vinyl acetate copolymer for mixing, adding an optional defoaming agent and an optional wetting agent for mixing, adding an optional filling agent for mixing, and finally adding an optional thickening agent for mixing to obtain the glue for drilling the PCB.
Preferably, the mixing time of mixing the aqueous polyacrylate emulsion and the polyethylene, adding the ethylene-vinyl acetate copolymer for mixing, and adding the optional defoamer and the wetting agent for mixing is independently 10-30 min, such as 12min, 14min, 16min, 18min, 20min, 22min, 24min, 26min or 28min, and the like, and independently preferably 15-25 min.
Preferably, the mixing of the aqueous polyacrylate emulsion and the polyethylene, the adding of the ethylene-vinyl acetate copolymer for mixing, and the adding of the optional defoamer and the wetting agent for mixing are all performed under stirring.
Preferably, the rotation speeds of the stirring are each independently 100 to 600rpm, for example, 150rpm, 200rpm, 250rpm, 300rpm, 350rpm, 400rpm, 450rpm, 500rpm, 550rpm, or the like, and further each independently preferably 200 to 400rpm.
Preferably, the mixing time for adding the optional filler for mixing is 40-120 min, such as 50min, 60min, 70min, 80min, 90min, 100min or 110min, and more preferably 60-80 min.
Preferably, the optional filler is further added and mixed under stirring, more preferably under stirring at a rotation speed of 200 to 1000rpm (e.g., 300rpm, 400rpm, 500rpm, 600rpm, 700rpm, 800rpm, 900rpm, or the like), and still more preferably at a rotation speed of 400 to 600 rpm.
Preferably, the mixing time for mixing by adding the optional thickener at the end is 30-80 min, such as 40min, 50min, 60min or 70min, and more preferably 40-60 min;
preferably, the final addition of the optional thickener for mixing is performed under stirring conditions, more preferably under stirring conditions at a rotation speed of 200 to 1000rpm (e.g., 300rpm, 400rpm, 500rpm, 600rpm, 700rpm, 800rpm, 900rpm, or the like), and even more preferably under stirring conditions at a rotation speed of 400 to 600 rpm.
Preferably, a filtration step is further included after the final addition of the optional thickener for mixing.
Preferably, the mesh number of the filter screen used for the filtration is 50 to 300 meshes, for example, 70 meshes, 90 meshes, 110 meshes, 130 meshes, 150 meshes, 170 meshes, 190 meshes, 210 meshes, 230 meshes, 250 meshes, 270 meshes, 290 meshes, and the like, and more preferably 100 to 200 meshes.
As a preferable technical scheme of the invention, the preparation method comprises the following steps: mixing the water-based polyacrylate emulsion and polyvinyl alcohol for 10-30 min under the condition that the rotating speed is 100-600 rpm, adding the ethylene-vinyl acetate copolymer for mixing for 10-30 min under the condition that the rotating speed is 100-600 rpm, adding the optional defoaming agent and the optional wetting agent for mixing for 10-30 min under the condition that the rotating speed is 100-600 rpm, adding the optional filling agent for mixing for 40-120 min under the stirring condition that the rotating speed is 200-1000 rpm, and finally adding the optional thickening agent for mixing for 30-80 min under the stirring condition that the rotating speed is 200-1000 rpm to obtain the glue for drilling the PCB.
In a third aspect, the present invention provides a use of the paste for PCB drilling according to the first aspect in a printed wiring board.
Compared with the prior art, the invention has the following beneficial effects:
(1) The water-based polyacrylate emulsion, the polyvinyl alcohol and the ethylene-vinyl acetate copolymer emulsion introduced into the glue for PCB drilling provided by the invention are water-based resins, so that the obtained glue for PCB drilling is more green and environment-friendly, and is very friendly to the environment, constructors and users.
(2) According to the invention, the water-based polyacrylate emulsion, the polyvinyl alcohol and the ethylene-vinyl acetate copolymer emulsion in specific parts are matched, so that the obtained glue for PCB drilling has higher solid content, the drying time at a certain temperature is shorter, and the production efficiency is further improved; the final viscosity of the obtained glue for drilling the PCB is 16000cps, the solid content is 64.3-66.7%, the drying time at 60 ℃ is only 72-86s, the drying time at 80 ℃ is only 61-70s, and the drying time at 100 ℃ is only 45-52 s by further limiting the mass ratio of the three resins; the coating formed by the coating and curing for PCB drilling has better adhesion to a base material, reaches 0-1 grade, has excellent washing resistance, and has water solubility of 0-1 grade.
Detailed Description
The technical solution of the present invention is further described below by way of specific embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
The raw material sources related to the specific mode part of the invention comprise manufacturer and brand information as follows:
(1) Aqueous polyacrylate emulsion: archsol 8223 and Adwel 1516 of Wanhua chemical group, inc. respectively have solid contents of 45 percent and 60 percent;
(2) Polyvinyl alcohol: PVA1788 from Shanghai Aladdin Biotechnology Ltd;
(3) Ethylene-vinyl acetate copolymer emulsion: DA102 produced in large chemical industry with solid content of 56%;
(4) Thickening agent: u604 of Vanhua chemical group, inc.;
(5) Wetting agent: digao 245;
(6) Defoaming agent: BYK-024 of Pico chemical;
(7) Filling agent: win Chuangdegusai China, inc. A200;
(8) Thickening agent: u604 of Vanhua chemical group, inc.;
(9) Aqueous polyurethane dispersion: adwel 1645 from Vanhua chemical group, inc.
Example 1
The glue for drilling the PCB comprises the following components in parts by weight:
the preparation method of the glue for drilling the PCB provided by the embodiment comprises the following steps: mixing the water-based polyacrylate emulsion and polyethylene pure under the stirring condition of the rotating speed of 300rpm for 20min, adding the ethylene-vinyl acetate copolymer to mix under the stirring condition of the rotating speed of 350rpm for 20min, adding the defoaming agent and the wetting agent to continue mixing under the stirring condition of the rotating speed of 350rpm for 20min, adding the filler to mix under the stirring condition of the rotating speed of 500rpm for 70min, mixing for 45min, finally adding the thickening agent to mix under the stirring condition of the rotating speed of 500rpm, wherein the viscosity is 16000cps, and filtering by adopting a 100-mesh filter screen to obtain the glue for drilling the PCB.
Example 2
The glue for drilling the PCB comprises the following components in parts by weight:
the preparation method of the adhesive for PCB drilling provided in this example is the same as that of example 1.
Example 3
The glue for drilling the PCB comprises the following components in parts by weight:
the preparation method of the adhesive for PCB drilling provided in this example is the same as that of example 1.
Example 4
The glue for drilling the PCB comprises the following components in parts by weight:
the preparation method of the paste for PCB drilling provided in this example is the same as that of example 1.
Example 5
The gluing for PCB drilling is different from the gluing in the embodiment 1 in that the addition amount of the water-based polyacrylate emulsion is 25 parts by weight, the addition amount of the polyvinyl alcohol is 25 parts by weight, and other components, the use amounts and the preparation method are the same as those in the embodiment 1.
Example 6
The gluing agent for PCB drilling is different from the gluing agent in the embodiment 1 in that the addition amount of the water-based polyacrylate emulsion is 42 parts by weight, the addition amount of the polyvinyl alcohol is 8 parts by weight, and other components, the use amounts and the preparation method are the same as those in the embodiment 1.
Example 7
The gluing agent for PCB drilling is different from the gluing agent in the embodiment 1 in that the addition amount of polyvinyl alcohol is 8 parts by weight, the addition amount of ethylene-vinyl acetate copolymer emulsion is 52 parts by weight, and other components, the use amount and the preparation method are the same as those in the embodiment 1.
Example 8
The gluing agent for PCB drilling is different from the gluing agent in the embodiment 1 in that the addition amount of polyvinyl alcohol is 25 parts by weight, the addition amount of ethylene-vinyl acetate copolymer emulsion is 35 parts by weight, and other components, the use amount and the preparation method are the same as those in the embodiment 1.
Comparative example 1
The gluing agent for PCB drilling is different from the gluing agent in the embodiment 1 in that no ethylene-vinyl acetate copolymer emulsion DA102 is added, the addition amount of the aqueous polyacrylate emulsion Adwel 1516 is 80 parts by weight, the addition amount of the polyvinyl alcohol PVA1788 is 20 parts by weight, and other components, the use amounts and the preparation method are the same as those in the embodiment 1.
Comparative example 2
A glue for PCB drilling is disclosed, which is different from the glue in the embodiment 1 only in that no ethylene-vinyl acetate copolymer emulsion DA102 is added, 50 parts by weight of deionized water is added, and other components, using amounts and preparation methods are the same as the glue in the embodiment 1.
Comparative example 3
The gluing agent for PCB drilling is only different from the gluing agent in the embodiment 1 in that polyvinyl alcohol PVA1788 is not added, the addition amount of the ethylene-vinyl acetate copolymer emulsion DA102 is 55.5 parts by weight, the addition amount of the aqueous polyacrylate emulsion Adwel 1516 is 45.5 parts by weight, and other components, the using amount and the preparation method are the same as those in the embodiment 1.
Comparative example 4
A glue for PCB drilling is disclosed, which is different from the glue in the embodiment 1 only in that polyvinyl alcohol PVA1788 is not added, 10 parts by weight of deionized water is added, and other components, the using amount and the preparation method are the same as the glue in the embodiment 1.
Comparative example 5
A glue for PCB drilling is different from the glue in the embodiment 1 only in that an aqueous polyurethane dispersion 1645 is used for replacing an aqueous polyacrylate emulsion Adwel 1516, and other components, the using amount and the preparation method are the same as the glue in the embodiment 1.
And (3) performance testing:
(1) Viscosity: the test is carried out by referring to GB/T2794-2013 determination of adhesive viscosity and a single-cylinder rotation viscometer method;
(2) Solid content: referring to a solid content testing method of WHPU/T011-571, a drying oven is heated to 150 ℃ at first, and the temperature is kept constant; weighing 1-1.5 g of glue sample in an aluminum plate, wherein the weight of the aluminum plate is A 1 The weight of the rubber sample is A 2 Placing in a 150 deg.C oven for 30min, taking out the aluminum plate, and weighing A 3 (ii) a The solid content of the gum sample is (A) 3 -A 1 )/A 2 X is 100%; according to the above method, a sampleTesting for three times, and taking the average value as the solid content;
(3) Drying time: coating a 100-micrometer wire rod for PCB drilling on an aluminum plate (10 multiplied by 10cm, cleaned by ethanol before use) to prepare three parallel test pieces, placing the test pieces in a 60-DEG C oven, starting timing, observing the drying condition of the aluminum plate, and stopping timing after the aluminum plate is dried; recording the drying time as t 1 (ii) a The temperature of the oven is increased to 80 ℃, the operation is repeated, and the drying time t is recorded 2 (ii) a The oven temperature is raised to 100 ℃, the above operations are repeated, and the drying time t is recorded 3 。
(4) Pencil hardness: coating the coating for drilling the PCB on an aluminum plate (10 multiplied by 10cm, cleaned by ethanol before use) by using bars of 100 micrometers and 150 micrometers respectively, making three parallel test pieces respectively, placing the test pieces in an oven at 80 ℃ for drying to form a coating, and placing the test pieces at room temperature for 24 hours for testing;
the testing steps comprise: the pencil and the test piece are scratched forcibly at an angle of 45 degrees without breaking the lead core, the pencil is scratched to the front of a tester at a constant speed of about l cm, the scratching speed is 1cm/s, after the pencil is scratched once, the tip of the lead core is ground again, and the test is repeatedly carried out for 5 times by using the pencil with the same hardness mark;
evaluation criteria: when the coating film is observed to be damaged and evaluated, when only 2 or less tests among 5 tests show that the base material or the primer coating film is visible, the same test is carried out by using a pencil with a hardness mark one bit larger, and when the coating film is damaged more than 2 times (every 5 tests are carried out), the hardness mark of the pencil at the previous time can be read as the pencil hardness.
(3) Adhesion force: coating the coating for drilling the PCB on an aluminum plate (10 multiplied by 10cm, cleaned by ethanol before use) by using bars of 100 micrometers and 150 micrometers respectively, making three parallel test pieces respectively, placing the test pieces in an oven at 80 ℃ for drying to form a coating, and placing the test pieces at room temperature for 24 hours for testing;
the testing steps comprise: scribing 10 × 10 grids with size of 1mm on the coating film by using a grid scribing device, sticking the grids on the grid scribing area by using a 3M special transparent adhesive tape, rapidly pulling at 180 degrees, and observing whether the PCB is provided with the falling-off glue or not; the falling-off condition is classified into 0-5 grade, the non-falling-off phenomenon is the optimal grade 0, the falling-off exists, the ratio of the falling-off area is 1 grade when the ratio is less than 10%, the falling-off area is 2 grade when the ratio is not less than 10% and less than 30%, the falling-off area is 3 grade when the ratio is not less than 30% and less than 50%, the falling-off area is 4 grade when the ratio is not less than 50% and less than 70%, and the falling-off area is 5 grade when the ratio is not less than 70%.
(4) Water solubility: coating the glue for PCB drilling on an aluminum plate (10 multiplied by 10cm, cleaned by ethanol before use) by using 100-micron and 150-micron wire bars respectively, making three parallel test pieces respectively, placing the test pieces in an oven at 80 ℃ for drying to form a coating film, and placing the test pieces at room temperature for 24 hours for testing;
the testing steps comprise: and immersing the test piece in water for 30min, taking out and airing, and observing the condition of the board surface. The water soluble condition is divided into 0-5 grade, 0 grade is dissolution weight higher than 90%,1 grade is dissolution weight higher than 80% and not higher than 90%,2 grade is dissolution weight higher than 60% and not higher than 80%,3 grade is dissolution weight higher than 30% and not higher than 60%,4 grade is dissolution weight higher than 10% and not higher than 30%, and 5 grade is dissolution weight not higher than 10%.
The pastes for PCB drilling provided in examples 1 to 8 and comparative examples 1 to 5 were tested according to the above test methods, and the test results are shown in table 1:
TABLE 1
As can be seen from the data in table 1: the gluing for PCB drilling provided by the invention has excellent comprehensive performance, higher solid content and shorter drying time, and a coating film formed by curing has proper hardness and excellent washing performance, and meanwhile, the adhesion to a base material is higher.
Specifically, by further defining the mass ratio of the three resins, it can be seen from the data of examples 1 to 4 that: the prepared glue for drilling the PCB has the viscosity of 16000cps, the solid content of 64.3-66.7%, the drying time at 60 ℃ of only 72-86s, the drying time at 80 ℃ of only 61-70s, the drying time at 100 ℃ of only 45-52 s, the pencil hardness of HB-B, the adhesive force of 0-1 grade and the water solubility of 0-1 grade.
Comparing the data of example 1 and comparative examples 1 to 2, it can be seen that the paste for drilling PCB prepared without adding the ethylene-vinyl acetate copolymer emulsion has too high hardness after forming a film, and has poor adhesion to the substrate.
Comparing the data of example 1 and comparative examples 3 to 4, it can be seen that the paste for drilling PCB, which was not added with polyvinyl alcohol, had poor water solubility after forming a film.
Further comparing the data of example 1 and comparative example 5, it can be seen that the glue for drilling PCB prepared by using the aqueous polyurethane dispersion to replace the aqueous polyacrylate emulsion is too soft after forming a film, and the adhesive force with the substrate is poor, so that the use requirement is difficult to meet.
Finally, the data of example 1 and examples 5-8 are compared, and it can be seen that the mass ratio of the aqueous polyacrylate emulsion to the polyvinyl alcohol is not within the ratio range defined by the present invention, and the mass ratio of the polyvinyl alcohol to the ethylene-vinyl acetate copolymer emulsion is not within the ratio range defined by the present invention, all of which affect the performance of the obtained adhesive coating for PCB drilling.
The applicant states that the invention is described by the above embodiments to describe a paste for PCB drilling and its preparation method and application, but the invention is not limited to the above embodiments, i.e. it does not mean that the invention must be implemented by the above embodiments. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of the raw materials of the product of the present invention, and the addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The glue for PCB drilling is characterized by comprising the following components in parts by weight:
20 to 70 portions of water-based polyacrylate emulsion
5 to 25 portions of polyvinyl alcohol
20 to 60 portions of ethylene-vinyl acetate copolymer emulsion.
2. The paste for PCB drilling according to claim 1, wherein the viscosity of the paste for PCB drilling is 10000-20000 cps, preferably 14000-18000 cps;
preferably, the solid content of the gumming for PCB drilling is 62-72%.
3. The paste for PCB drilling according to claim 1 or 2, wherein the content of the aqueous polyacrylate emulsion in the paste for PCB drilling is 30-60 parts by weight;
preferably, the solid content of the aqueous polyacrylate emulsion is 45-60%;
preferably, the raw materials for preparing the aqueous polyacrylate emulsion comprise any one of methyl acrylate, butyl acrylate, acrylic acid, isooctyl acrylate, styrene or vinyl acetate or the combination of at least two of the methyl acrylate, the butyl acrylate, the acrylic acid, the isooctyl acrylate and the styrene.
4. The paste for PCB drilling according to any one of claims 1 to 3, wherein the content of polyvinyl alcohol in the paste for PCB drilling is 10 to 25 parts by weight;
preferably, the mass ratio of the polyvinyl alcohol to the aqueous polyacrylate emulsion is 1 (2-5).
5. The paste for PCB drilling according to any one of claims 1 to 4, wherein the content of the ethylene-vinyl acetate copolymer emulsion in the paste for PCB drilling is 25 to 55 parts by weight;
preferably, the solid content of the ethylene-vinyl acetate copolymer emulsion is 50-60%;
preferably, the mass ratio of the polyvinyl alcohol to the ethylene-vinyl acetate copolymer emulsion is 1 (2-5.5).
6. The paste for PCB drilling according to any one of claims 1 to 5, further comprising any one or a combination of at least two of a filler, a wetting agent, an antifoaming agent, or a thickener;
preferably, the content of the filler in the coating for drilling the PCB is 1 to 10 parts by weight, and more preferably 2 to 7 parts by weight;
preferably, the filler comprises nanosilica;
preferably, the nanosilica comprises any one of, or a combination of at least two of, fumed silica, wet-process silica or sol-gel silica;
preferably, the defoaming agent in the coating for drilling the PCB is contained in 0.01-0.2 part by weight, and more preferably 0.02-0.08 part by weight;
preferably, the antifoaming agent comprises a silicone-based antifoaming agent and/or a mineral oil-based antifoaming agent;
preferably, the content of the wetting agent in the gluing for PCB drilling is 0.1-1 part by weight, and more preferably 0.2-0.6 part by weight;
preferably, the content of the thickener in the coating for drilling the PCB is 0.05 to 1 part by weight, and more preferably 0.2 to 0.8 part by weight;
preferably, the thickener comprises a hydrophobically associative polyurethane thickener.
7. A method for preparing a paste for PCB drilling as claimed in any one of claims 1 to 6, wherein the method comprises: mixing aqueous polyacrylate emulsion, polyvinyl alcohol, ethylene-vinyl acetate copolymer emulsion, optional filler, optional wetting agent, optional defoaming agent and optional thickening agent to obtain the glue for drilling PCB.
8. The preparation method according to claim 7, wherein the preparation method specifically comprises the steps of: mixing the water-based polyacrylate emulsion and polyvinyl alcohol, adding ethylene-vinyl acetate copolymer for mixing, adding an optional defoaming agent and an optional wetting agent for mixing, adding an optional filling agent for mixing, and finally adding an optional thickening agent for mixing to obtain the glue for drilling the PCB.
9. The method according to claim 8, wherein the mixing time for mixing the aqueous polyacrylate emulsion and the polyethylene, adding the ethylene-vinyl acetate copolymer for mixing and adding the optional defoamer and wetting agent for mixing is independently 10-30 min, preferably 15-25 min;
preferably, the mixing of the aqueous polyacrylate emulsion and the polyethylene, the addition of the ethylene-vinyl acetate copolymer for mixing, and the addition of the optional defoamer and the wetting agent for mixing are carried out under stirring conditions;
preferably, the rotation speeds of the stirring are respectively and independently 100-600 rpm, more preferably 200-400 rpm;
preferably, the mixing time for adding the optional filling agent for mixing is 40-120 min, and further preferably 60-80 min;
preferably, the optional filler is added and mixed under the condition of stirring, more preferably under the condition of stirring at the rotating speed of 200-1000 rpm, and even more preferably under the condition of stirring at the rotating speed of 400-600 rpm;
preferably, the mixing time for mixing by adding the optional thickening agent at the end is 30-80 min, and further preferably 40-60 min;
preferably, the final addition of the optional thickener for mixing is performed under stirring conditions, more preferably under stirring conditions at a rotation speed of 200 to 1000rpm, and even more preferably under stirring conditions at a rotation speed of 400 to 600 rpm;
preferably, the step of filtering is further included after the final addition of the optional thickener for mixing;
preferably, the mesh number of the filter screen used for the filtration is 50 to 300 meshes, and more preferably 100 to 200 meshes.
10. Use of a paste for drilling a PCB according to any of claims 1 to 6 in a printed wiring board.
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| JPH0269587A (en) * | 1988-09-05 | 1990-03-08 | Konishi Kk | Water-base adhesive for polyolefin |
| JP2004043766A (en) * | 2002-05-14 | 2004-02-12 | Konishi Co Ltd | Aqueous adhesive and application method using it |
| CN102977818A (en) * | 2012-11-29 | 2013-03-20 | 南通高盟新材料有限公司 | Water-based aluminium foil adhesive for cigarette packing and preparation method thereof |
| CN106318280A (en) * | 2015-07-01 | 2017-01-11 | 刘夕平 | Multicomponent adhesive |
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