CN115449228B - High-temperature-resistant, high-humidity-resistant and photo-aging-resistant photoelectric packaging material as well as preparation method and application thereof - Google Patents
High-temperature-resistant, high-humidity-resistant and photo-aging-resistant photoelectric packaging material as well as preparation method and application thereof Download PDFInfo
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- CN115449228B CN115449228B CN202211188094.0A CN202211188094A CN115449228B CN 115449228 B CN115449228 B CN 115449228B CN 202211188094 A CN202211188094 A CN 202211188094A CN 115449228 B CN115449228 B CN 115449228B
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- 239000005022 packaging material Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 206010051246 Photodermatosis Diseases 0.000 title claims abstract description 9
- 230000008845 photoaging Effects 0.000 title claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 125000002723 alicyclic group Chemical group 0.000 claims description 10
- 239000012752 auxiliary agent Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- 239000007822 coupling agent Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 239000011231 conductive filler Substances 0.000 claims description 3
- 230000005693 optoelectronics Effects 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 230000003712 anti-aging effect Effects 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000011324 bead Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 229910052570 clay Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000012467 final product Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 150000002902 organometallic compounds Chemical group 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000005350 fused silica glass Substances 0.000 claims 1
- 150000001282 organosilanes Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 230000007774 longterm Effects 0.000 abstract description 2
- 230000009477 glass transition Effects 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 238000001723 curing Methods 0.000 description 10
- 230000008859 change Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000013523 DOWSIL™ Substances 0.000 description 6
- 229920013731 Dowsil Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- -1 hexahydrophthalic anhydride glycidyl ester Chemical class 0.000 description 3
- 238000010907 mechanical stirring Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 2
- OEOIWYCWCDBOPA-UHFFFAOYSA-N 6-methyl-heptanoic acid Chemical class CC(C)CCCCC(O)=O OEOIWYCWCDBOPA-UHFFFAOYSA-N 0.000 description 2
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- JDJCWTMAUWZTOM-UHFFFAOYSA-N 2,2-bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)hexanedioic acid Chemical compound C1CC2OC2CC1CC(C(O)=O)(CCCC(=O)O)CC1CC2OC2CC1 JDJCWTMAUWZTOM-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- GNEPOXWQWFSSOU-UHFFFAOYSA-N dichloro-methyl-phenylsilane Chemical compound C[Si](Cl)(Cl)C1=CC=CC=C1 GNEPOXWQWFSSOU-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- FRRCAVMHRGDBRZ-UHFFFAOYSA-N ethyl acetate;3-oxobutanoic acid Chemical class CCOC(C)=O.CC(=O)CC(O)=O FRRCAVMHRGDBRZ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- NPEWZDADCAZMNF-UHFFFAOYSA-N gold iron Chemical compound [Fe].[Au] NPEWZDADCAZMNF-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/10—Block or graft copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/10—Block or graft copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The application discloses a high-temperature, high-humidity and photo-aging resistant photoelectric packaging material, and a preparation method and application thereof, wherein the preparation method comprises the following steps: mixing epoxy resin with organosilicon oligomer, adding catalyst, stuffing, assistant, etc. and heating to react to obtain the photoelectronic encapsulating material. The photoelectric packaging material has excellent adhesion, high glass transition temperature, damp and heat resistance, high transparency and long-term photo-thermal stability after being cured.
Description
Technical Field
The application belongs to the technical field of packaging materials, and particularly relates to a high-temperature and high-humidity resistant photo-aging resistant photoelectric packaging material, and a preparation method and application thereof.
Background
With the rapid development of semiconductor technology, portable communication and computing devices are widely used, and photoelectric technologies represented by lasers, radars, LEDs and various sensing devices are rapidly developed. The photoelectric packaging material, especially the packaging material of outdoor high-power device, needs to meet the requirements of high temperature resistance, high humidity, UV aging, cold and hot impact, mechanical vibration, salt fog conditions and other reliability. Meanwhile, no matter in different fields such as packaging materials, component bonding materials, surface protective coatings and the like, new requirements are put forward on transparent materials which are cured at a high speed and conveniently.
At present, the high-temperature-resistant high-performance transparent material mainly comprises organosilicon materials and epoxy resin, but the organosilicon materials have obvious disadvantages in the fields of mechanical strength, air tightness and the like. In general, high rigidity epoxy resin, organosilicon modified or organosilicon epoxy resin is adopted, and anhydride or cation is used as curing agent to obtain the high transparent photoelectric packaging material. However, the epoxy resin cured by anhydride has the defects of high volatility, low curing speed, hydrolysis intolerance, poor reliability and the like, while the cationic curing epoxy material has the defects of poor damp-heat resistance, corrosiveness to metals and the like, and generally has the defects of high brittleness, weak bonding force, poor toughness, high internal stress, poor reliability and the like.
Document (Journal of Applied Polymer Science,2007,104,3954-3959) discloses that a main chain alkyl silicone, a side chain of which is alicyclic epoxy, is added with an aluminum complex and silanol as a catalyst to obtain a semi-rigid silicone epoxy resin, but the strength and reliability need to be further improved. The patent (JP 2018104576-A) discloses epoxy-terminated silicones which are cured by anhydrides with good reliability but are not resistant to high temperature hydrolysis. Patent (CN 107286588-a) discloses epoxy-silicone modifications, cured at high temperature using methyl phenyl dichlorosilane, but the product has chloride ions, which are difficult to adapt to corrosion requirements.
The literature (J Mater Sci: mater Electron (2017) 28:14522-14535) discloses a silicone resin modified epoxy system, which can greatly improve the adhesion and reliability of packaging materials, but still has the defect of poor long-term water resistance caused by taking anhydride as a curing agent. Patent (CN 113999492-a) (CN 113214780-a) discloses that the silicone modified alicyclic, aromatic epoxy mixture, anhydride cure as LED encapsulation material, but is difficult to withstand high temperature and humid heat. Patent (WO 2021200405-A1) discloses a phenol-oxygen resin modified epoxy-anhydride system as an encapsulating tape having excellent heat resistance but insufficient transparency.
The literature (Journal of Applied Polymer Science,1984, 29, 269-278) discloses that aromatic epoxy resins use aluminum complexes and silanol as curing agents, and the resulting materials have good resistance to humid heat aging but insufficient weather resistance. Patent (JP 2022042418-A) discloses a packaging material of a combination of cationically curable epoxy, oxetane and radically polymerizable unsaturated compounds, which has the advantage of being fast and efficient, but which has drawbacks in heat resistance and weatherability.
Patent (CN 104761872-a) discloses vinyl silicone oil and hydrogen-containing silicone oil modified epoxy resins cured by platinum-based catalysts to prepare optoelectronic packaging materials, but the mechanical properties are insufficient.
In addition, the photo-curing epoxy resin and the organic silicon material have no change of inherent defects of the material, and the residual photoinitiator and decomposition products tend to deteriorate the ageing resistance, so that the technical requirements of the current device packaging technology are difficult to meet.
Disclosure of Invention
The object of the present application is to overcome the above-mentioned drawbacks of the prior art and to provide laser and optoelectronic device and chip packaging, bonding and surface protecting materials and methods of manufacture.
The technical scheme adopted by the application is as follows: the preparation method of the high-temperature, high-humidity and photo-aging resistant photoelectric packaging material comprises the following steps: mixing epoxy resin and organic silicon oligomer, adding catalyst, heating and reacting to obtain the final product, wherein the organic silicon oligomer isWherein R is 1 Is methyl or phenyl, R 2 Is methyl or phenyl, R3 is +.>Any one or more of the following.
As a preferable mode of the technical scheme, a filler, a coupling agent and an auxiliary agent are also added.
Preferably, the epoxy resin is one or more of aliphatic, alicyclic and silicone epoxy resins. Epoxy resins include, but are not limited to, bis (3, 4-epoxycyclohexylmethyl) adipic acid, hydrogenated bisphenol a glycidyl ether, hexahydrophthalic anhydride glycidyl ester, phthalic anhydride glycidyl ester, trimellitic glycidyl ester, triglycidyl isocyanate, bisphenol a glycidyl ether, o-cresol epoxy, silicone epoxy.
Preferably, the catalyst is a metal organic compound, including an organic compound of tin, zinc, aluminum or titanium, an organic metal salt or an organic metal complex. Such as tin, zinc, aluminum or titanium, butanol compounds, isooctanoates, naphthenates, acetylacetonates, acetoacetate-ethyl-acetate complexes, acetoacetate-long-chain alkyl ester complexes, and the like.
Preferably, the filler is non-conductive filler, and comprises any one or more of talcum powder, calcium carbonate powder, quartz powder, molten silicon micropowder, glass beads, graphite, alumina, clay, mica, titanium dioxide and boron nitride. Non-conductive fillers are added to adjust the rheology of the uncured adhesive and to fine tune the thermal expansion modulus and coefficient of the cured adhesive, and the fillers can be of any size and shape.
As a preferable aspect of the above technical solution, the coupling agent is one or more of organosiloxane, organoaluminum, organotitanium and organochromium.
As the optimization of the technical scheme, the auxiliary agent comprises a leveling agent, a rheological auxiliary agent, a defoaming agent, a matte agent, an anti-aging agent and a colorant. Other components in the paint such as wetting agent, antioxidant, ultraviolet absorber, adhesion promoter, etc. can also be added according to the use requirement.
As the optimization of the technical scheme, the weight percentages of the epoxy resin, the organic silicon oligomer, the catalyst and the auxiliary agent are 20-80:20-80:0.01-1:0.1-20, the balance being filler, wherein the temperature of the heating reaction is 50-150 ℃ and the reaction time is 0.5-5 hours.
The photoelectric packaging material resistant to high temperature, high humidity and photo-aging is prepared by the preparation method.
The photoelectric packaging material with high temperature, high humidity and photo aging resistance is used as an adhesive, a coating or a packaging material.
The beneficial effects of the application are as follows: the photoelectric packaging material combines the excellent mechanical property of epoxy resin, and the high heat resistance of organic silicon resin adopts metal organic complex and organic silicon resin to be compounded and simultaneously used as a curing agent and a coupling agent, wherein: the catalyst curing agent of the epoxy resin is formed by the interaction of the two; meanwhile, the metal organic complex can form good chelation with the base material, and the organic silicon resin and the coupling agent can form chemical bonding with the base material, so that the cured material combines various advantages of the epoxy resin and the organic silicon material in aspects of heat resistance, moisture resistance, weather resistance and the like, and simultaneously avoids respective disadvantages and defects. The photoelectric packaging material has the advantages of long service life, quick solidification, heat resistance, moisture resistance, UV resistance, strong adhesive force, high transparency, small internal stress, good toughness, hydrophobicity and the like.
Detailed Description
The following description of the present application will be made clearly and fully, and it is apparent that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The raw materials used in the following examples are as follows.
Organosiloxane resins (DOWSIL 2405: dow chemical)
Silicone resin (DOWSIL RSN-0220: dow chemical)
Silicone resin (DOWSIL RSN-0255: dow chemical)
Cycloaliphatic epoxy resin (ERL-4221: olin trade name, epoxy equivalent 128-140)
Alicyclic epoxy resin (TTA 28: jiangsu Taitel, epoxy equivalent 70-100)
Alicyclic epoxy resin (TTA 800: jiangsu Taitel, epoxy equivalent 100-110)
Alicyclic epoxy resin (TTA 27: jiangsu Taitel, epoxy equivalent 70-90)
Bisphenol A type epoxy resin (DER 332: olin trade name, epoxy equivalent 172-176)
Bisphenol F type epoxy resin (YDF-8170C, new Japanese iron gold chemical Co., ltd., epoxy equivalent 159)
Phenolic epoxy resin (DEN 438: olin trade name, epoxy equivalent 183-193)
3-glycidoxypropyl trimethoxysilane (GLYMO, desoxase trade name)
Diisopropyl di (acetylacetonate) titanate (TYZOR AA75, duPont trade name)
Cationic curing agent (SI-100L, japanese Sanxin chemical)
The various measurements in examples and comparative examples were carried out by the following methods
(1) Heat resistance
The uncured material was coated on quartz glass to a dry film thickness of 1mm and cured by heating. The cured product was aged at 200℃for 200 hours, and the appearance of the aged cured product was visually observed, and the heat resistance was evaluated on the basis of the following criteria.
(color Change)
A: no change is made
B: slightly change
C: yellowing occurs
(2) Light resistance
Irradiating the prepared transparent material with point light source below 350nm with illuminance of 5000mW/cm 2 The appearance of the cured product after ultraviolet irradiation was visually observed for 200 hours, and the light resistance was evaluated on the basis of the following criteria.
(color Change)
A: no change is made
B: slightly change
C: yellowing occurs
(3) Resistance to stripping after moisture absorption and reflow soldering
The prepared material was packaged into an LED, and left to stand in a constant temperature and humidity cabinet at 85 ℃/85% humidity for 12 hours and 36 hours, and a reflow soldering process was performed 3 times with a reflow soldering apparatus at a maximum temperature of 260 ℃/10 seconds. And observing the interfacial peeling of the LED bracket after reflow soldering by using an ultrasonic detector. The same observation was performed for each 20 samples, and the peel resistance was evaluated using the following criteria.
AA no peeling after standing for 36 hours
A, no peeling after 12 hours, and peeling after 36 hours
B: after 12 hours, 20 packages with 1-5 packages are peeled off from the resin
C: after being placed for 12 hours, more than 6 packages are peeled off from the resin
(4) Thermal shock resistance
The prepared material is used for packaging an optical device, the temperature is quickly increased from-65 ℃ to 150 ℃ and the temperature is quickly reduced from 150 ℃ to-65 ℃, the temperature is 1 cycle, and 1000 cycles of cold and hot impact are implemented. After the experiment was completed, the interface peeling of the semiconductor device after reflow was observed by ultrasonic scanning. The same observation was performed for each 20 samples, and the thermal shock resistance was evaluated using the following criteria.
A: no peeling
B:20 packages 1-5 are peeled off from resin
C:20 packages with more than 6 packages are peeled off from the resin
(5) Leakage after high pressure steam test
The prepared material is packaged into an optical device, and the optical device is placed in a high-pressure steaming box with the humidity of 121 ℃ and 100% for 12 hours, 36 hours and 96 hours, and a 20V/20mA reverse voltage is applied to test whether electric leakage exists. The same observation was performed for each 20 samples, and the following standard evaluation was performed.
AA no leakage after 96 hours of standing
A, no electric leakage after being placed for 36 hours, and electric leakage after being placed for 96 hours
B: after 12 hours, 20 of the insulating materials have 1 to 5 electric leakage
Preparation of organosilicon-epoxy prepolymer I: into a 10L reaction kettle with mechanical stirring, 2kg of alicyclic epoxy resin (ERL-4221), 4kg of organic siloxane resin (DOWSIL 2405) and heating and stirring at 150 ℃ and reacting for 2 hours under the pressure of 90kPa, and cooling to room temperature to obtain a viscous colorless transparent modified substance.
Preparation of organosilicon-epoxy prepolymer II: adding 3kg of alicyclic epoxy resin (TTA 28) and 5kg of organic silicon resin (DOWSIL RSN-0220) into a 10L reaction kettle with mechanical stirring, heating and stirring at 120 ℃, and completely and uniformly melting under the pressure of 90 kPa; 10g of zinc triacetylacetonate was added thereto and reacted for 1 hour, and cooled to room temperature to obtain a viscous colorless transparent modified product.
Preparation of organosilicon-epoxy prepolymer III: adding 3kg of alicyclic epoxy resin (TTA 800) and 4kg of organic silicon resin (DOWSIL RSN-0220) into a 10L reaction kettle with mechanical stirring, heating and stirring at 120 ℃, and completely and uniformly melting under the pressure of 90 kPa; 10g of tin isooctanoate was added thereto and the mixture was reacted for 1 hour, and the mixture was cooled to room temperature to obtain a viscous colorless transparent modified product.
As shown in the following table, firstly, each component and epoxy resin are mixed and stirred uniformly under reduced pressure, then, filler and auxiliary agent are added, and then, the mixture is stirred uniformly at high speed; at a temperature lower than 40 ℃, adding the catalyst and stirring uniformly. Curing conditions: 120 ℃/60min,200 ℃/180min.
As can be seen from the above table, the photoelectric packaging material prepared by the preparation method provided by the application has the obvious advantages of light resistance, heat resistance, moisture resistance and the like. Combines the excellent mechanical properties of epoxy resins with the high heat resistance of silicone resins. The metal organic complex and the organic silicon resin are compounded and simultaneously serve as a curing agent and a coupling agent, so that the cured material combines various advantages of the epoxy resin and the organic silicon material in various aspects of heat resistance, moisture resistance, weather resistance and the like, and meanwhile, the respective disadvantages and defects are avoided.
It should be noted that technical features of the reaction kettle and the like related to the patent application of the present application should be regarded as the prior art, and specific structures, working principles, and control modes and spatial arrangement modes possibly related to the technical features should be selected conventionally in the art, and should not be regarded as the application point of the patent of the present application, and the patent of the present application is not further specifically developed and detailed.
While the preferred embodiments of the present application have been described in detail, it should be appreciated that numerous modifications and variations may be made in accordance with the principles of the present application by those skilled in the art without undue burden, and thus, all technical solutions which may be obtained by logic analysis, reasoning or limited experimentation based on the principles of the present application as defined by the claims are within the scope of protection as defined by the present application.
Claims (3)
1. The preparation method of the high-temperature-resistant high-humidity-resistant photo-aging photoelectric packaging material is characterized by comprising the following steps of: mixing epoxy resin and organic silicon oligomer, adding catalyst, heating and reacting to obtain the final product, wherein the organic silicon oligomer isWherein R is 1 Is methyl or phenyl, n is the number of cycles, R 2 Is methyl or phenyl, R 3 Is->Any one or more of the following;
a filler, a coupling agent and an auxiliary agent are also added;
the epoxy resin is one or more of aliphatic, alicyclic and organic silicon epoxy resins;
the catalyst is a metal organic compound and comprises organic compounds of tin, zinc, aluminum or titanium;
the filler is non-conductive filler and comprises any one or more of talcum powder, calcium carbonate powder, quartz powder, fused silica micropowder, glass beads, graphite, alumina, clay, mica, titanium dioxide and boron nitride;
the coupling agent is one or more of organosilane, organic aluminum, organic titanium and organic chromium;
the auxiliary agent comprises a leveling agent, a rheological auxiliary agent, a defoaming agent, a matte agent, an anti-aging agent and a colorant;
the weight percentage of the epoxy resin, the organic silicon oligomer, the catalyst and the auxiliary agent is 20-80 percent, wherein the weight percentage is 0.01-1 percent: 0.1-20%, and the balance filler, wherein the sum of the weight percentages of the raw materials is 100%, the temperature of the heating reaction is 50-150 ℃, and the reaction time is 0.5-5 hours.
2. An optoelectronic packaging material resistant to high temperature, high humidity and photo-aging, characterized in that it is prepared by the preparation method as claimed in claim 1.
3. Use of a photovoltaic packaging material resistant to high temperatures, high humidity and photo-ageing according to claim 2, as an adhesive or coating.
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