CN115440629A - Semiconductor chip packaging chip mounter - Google Patents
Semiconductor chip packaging chip mounter Download PDFInfo
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- CN115440629A CN115440629A CN202211078820.3A CN202211078820A CN115440629A CN 115440629 A CN115440629 A CN 115440629A CN 202211078820 A CN202211078820 A CN 202211078820A CN 115440629 A CN115440629 A CN 115440629A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0236—Fixing laser chips on mounts using an adhesive
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a semiconductor chip packaging chip mounter, wherein the semiconductor chip packaging chip mounter comprises a rack, two jig storage modules and a transfer module; the machine frame is provided with a chip loading station, a correcting station and a chip mounting station, wherein the chip loading station is used for placing a semiconductor chip, the correcting station is used for adjusting the position and the angle of the semiconductor chip, and the chip mounting station is used for mounting the semiconductor chip; the two jig storage modules are arranged on the rack at intervals, the jig storage modules are used for storing jigs, and one jig is used for placing a plurality of tube seats; the transfer module is arranged on the rack and positioned between the two jig storage modules, the transfer module is used for moving the jig positioned on the jig storage modules to a chip mounting station, and the chip mounting station is used for mounting the semiconductor chip on the tube seat; the technical scheme of the invention can increase the efficiency of the semiconductor chip packaging chip mounter for completing the mounting process.
Description
Technical Field
The invention relates to the technical field of semiconductor chip mounting, in particular to a semiconductor chip packaging chip mounter.
Background
At present, due to the development and progress of science and technology, the assembly of the laser diode can be carried out through automatic equipment, a jig bearing a tube seat needs to be moved to a glue dispensing module for dispensing, then the jig is moved to a chip mounting station for mounting the chip on the tube seat on the jig, and the jig is output to complete a mounting process after the chip is mounted. However, the loading and unloading efficiency of the jig of the semiconductor chip packaging chip mounter on the market is low at present, so that the efficiency of the whole mounting process of the semiconductor chip packaging chip mounter is reduced.
Disclosure of Invention
The invention mainly aims to provide a semiconductor chip packaging chip mounter, and aims to increase the efficiency of the semiconductor chip packaging chip mounter for completing a mounting process.
In order to achieve the above object, the present invention provides a semiconductor chip packaging chip mounter, including:
the semiconductor chip mounting device comprises a rack, a chip loading station, a correcting station and a chip mounting station, wherein the chip loading station is used for placing a semiconductor chip, the correcting station is used for adjusting the position and the angle of the semiconductor chip, and the chip mounting station is used for mounting the semiconductor chip;
the jig storage modules are arranged on the rack at intervals and used for storing jigs, and one jig is used for placing a plurality of tube seats;
the transfer module is arranged on the rack and positioned between the two jig storage modules, the transfer module is used for moving the jig positioned on the jig storage modules to the chip mounting station, and the chip mounting station is used for mounting a semiconductor chip on the tube seat; and
the moving process of the transfer module comprises the following steps: move and carry the module will the tool removes to being located the left end from chip subsides dress station when tool storage module will be located the right-hand member the tool of tool storage module removes chip subsides dress station, and move and carry the module will the tool removes to being located the right-hand member from chip subsides dress station when tool storage module, will be located the left end tool in the tool storage module removes chip subsides dress station.
Optionally, the transfer module includes:
the track body comprises a first side plate and a second side plate which are oppositely arranged, the first side plate is installed on the load platform, the second side plate is detachably connected to the first side plate, a through groove is formed between the first side plate and the second side plate and used for a jig to move, and a plurality of tube seats used for placing chips are distributed on the jig;
the driving assembly is arranged on the transfer platform and is arranged at intervals with the track body; and
the fixture comprises a first cylinder and a fixing piece, wherein the first cylinder is connected to a driving assembly in a driving mode, a push rod of the first cylinder is connected with the fixing piece, the fixing piece is arranged above the through groove and used for being connected with a jig entering the through groove, and the driving assembly is used for driving the fixing piece to move in the length direction of the through groove.
Optionally, the semiconductor chip package mounter further includes:
the chip loading module is arranged at a chip loading station;
the correction module is arranged at the correction station, the chip loading module is used for placing the semiconductor chip to the correction module, and the correction module is used for correcting the position and the angle of the semiconductor chip;
the welding head module is arranged at the chip mounting station and used for mounting the semiconductor chip positioned on the correction module on the tube seat;
the two dispensing modules are arranged on the rack at intervals and used for dispensing the plurality of tube seats on the jig; and
the vacuum assembly is arranged on the rack, is respectively connected with the chip feeding module, the correcting module and the welding head module, and is used for providing a vacuum air source;
the dispensing module can detect all tube seats on the jig, when the transferring module moves the jig to the position below the dispensing module, the dispensing module performs dispensing operation once when detecting one tube seat, and when dispensing operation is completed on all the tube seats on the jig, the transferring module moves the jig to the chip mounting station.
Optionally, the correction module includes a correction platform, a first motor, a rotation shaft, a first moving assembly and a first visual assembly, the correction platform is mounted on the first moving assembly, the first moving assembly is mounted on the frame, the moving assembly is used for controlling the movement of the correction platform in the horizontal direction, the first motor is mounted on the correction platform, the rotation shaft is rotatably mounted on the correction platform and is in driving connection with the first motor, the upper end of the rotation shaft is used for placing the semiconductor chip, and the first visual assembly is mounted on the frame and is located above the rotation shaft.
Optionally, the correction module further includes an air receiving tube, one end of the air receiving tube is sleeved on the lower end of the rotating shaft, a first adsorption hole is formed in the end of the rotating shaft, the first adsorption hole penetrates through the rotating shaft, the air receiving tube is communicated with the first adsorption hole, the other end of the air receiving tube is connected with the vacuum assembly, and the first adsorption hole is used for adsorbing the semiconductor chip;
the first vision subassembly acquires the positional information of rotation axis, one has been placed to the upper end of rotation axis semiconductor chip, will through first removal subassembly revise the platform and move to first vision subassembly below to make the rotation axis with the axis collineation of first vision subassembly, so that semiconductor chip, first vision subassembly reacquires the angle of semiconductor chip on the rotation axis, through first motor control the rotation axis rotates certain angle, so that semiconductor chip's the angle of putting is unanimous with the angle of predetermineeing.
Optionally, the bonding tool module includes first base, flat motor, second removal subassembly, adsorption head and second vision subassembly, first base install in chip pastes the dress station, the second remove the subassembly install in first base, flat motor install in the second removes the subassembly, the second subassembly is used for control flat motor removes at horizontal direction and direction of height, the adsorption head install in flat motor's active cell, the adsorption head is equipped with the second and adsorbs the hole, the second adsorb the hole with vacuum component intercommunication, the second adsorbs the hole and is used for adsorbing semiconductor chip, second vision subassembly install in the frame, and is located the top of chip subsides dress station, the second vision subassembly is used for detecting whether semiconductor chip is normally pasted the dress in the tube socket.
Optionally, the welding head module further comprises a reverse detection assembly, the reverse detection assembly comprises a detection lens and a second base, the second base is mounted on the frame, the detection lens is mounted on the second base, and the detection lens is arranged towards the upper side;
after the semiconductor chip is corrected in position and angle through the correction module, the second moving assembly controls the flat motor to move to the position above the semiconductor chip, the flat motor extends out of the push rod, the semiconductor chip is sucked through the adsorption head, the semiconductor chip is translated to the position above the detection lens through the second moving assembly, and the detection lens is used for detecting whether the correction module corrects the semiconductor chip to a preset angle or not;
if the correction is successful, the semiconductor chip is moved to the position above the tube seat after the dispensing is finished through the second moving assembly for mounting;
if the correction fails, the semiconductor chip is moved to the position above the correction module through the second moving assembly, the flat motor replaces the semiconductor chip to the correction module to perform correction again until the detection lens detects that the semiconductor chip is corrected to a preset angle, and then the semiconductor chip is attached to the tube seat after the glue dispensing is completed.
Optionally, tool storage module includes magazine frame, a plurality of magazine, material loading subassembly and unloading subassembly, and is a plurality of the tool is followed the even interval of direction of height of magazine is placed in the magazine, a plurality of the magazine install in the magazine frame, and a plurality of the magazine is followed the direction of height of magazine frame distributes in proper order, material loading subassembly install in the magazine frame, and be used for with tool in the magazine removes to move and carry the module, the unloading subassembly is used for will being located the outside output of magazine in the magazine frame.
Optionally, the feeding assembly includes a screw rod, a nut seat, a second air cylinder and a second motor, the magazine rack is provided with a feeding portion, the screw rod is rotatably mounted on the magazine rack and extends along a length direction of the magazine rack, the second motor is mounted on the magazine rack and is in drive connection with the screw rod, the nut seat is rotatably sleeved on the screw rod, the nut seat is provided with a convex plate, the magazine is provided with a clamping groove, the convex plate extends into the clamping groove to fix the nut seat and the magazine, the second air cylinder is mounted on the magazine rack, and a push rod of the second air cylinder abuts against a jig in the magazine;
the nut seat is inserted and connected with the material box of the feeding portion through the convex plate, the tool at the lowest position in the material box is pushed out to the transfer module through the second cylinder, the tube seats on the tools are all pasted and installed with the semiconductor chips and then are moved back to the material box through the transfer module, when the material box recovers one at a time, the second motor drives the material box to move downwards for a preset distance until the tube seats on all the tools in the material box are all pasted and installed with the semiconductor chips, and the second motor moves the material box to the discharging assembly and then outputs the material box outwards.
Optionally, the blanking assembly comprises a bearing plate, a third motor and a drive plate, the drive plate is movably mounted on the bearing plate, the third motor is mounted on the bearing plate and used for driving the drive plate to move along the length direction of the bearing plate, the drive plate is provided with a plurality of insertion parts, the insertion parts are uniformly distributed at intervals along the length direction of the drive plate, and the insertion parts are used for placing the magazine;
after the semiconductor chips are attached to the tube seats of all the jigs in the material box, the material box is moved to the insertion part by the second motor, and when one material box is placed on one insertion part, the third motor drives the driving plate to move for a preset distance so as to move one insertion part with the material box placed to the lower part of the feeding part.
According to the technical scheme, the two jig storage modules are respectively arranged at the two ends of the transfer module and used for feeding the jigs to the transfer module and recovering the jigs from the transfer module, in the embodiment with one jig storage module, the transfer module moves the jigs in the jig storage modules to the chip mounting station and then moves the jigs back to the jig storage module from the chip mounting station, and in the process that the jigs return to the jig storage modules, the transfer module cannot feed the other jig to the chip mounting station at the same time, so that the jigs cannot be fed in the time that the jigs return to the jig storage module. Set up like this, carry out material loading and unloading to the tool in turn from the both ends that move the year module, so can increase the tool and move the efficiency that the module flows in moving the year, reduce the extravagant condition of material loading and unloading time in the course of working to increase the efficiency that semiconductor chip package chip mounter accomplished the dress process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor chip package chip mounter according to an embodiment of the present invention;
fig. 2 is a schematic structural view of the horn module of fig. 1;
fig. 3 is a schematic structural view of the jig storage module in fig. 1;
fig. 4 is a schematic structural view of another angle of the jig storage module shown in fig. 1.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise explicitly stated or limited, the terms "connected", "fixed", and the like are to be understood broadly, for example, "fixed" may be fixedly connected, may be detachably connected, or may be integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a semiconductor chip packaging chip mounter.
In an embodiment of the present invention, as shown in fig. 1 to 4, the semiconductor chip packaging chip mounter includes a frame, two jig storage modules 10, and a transfer module 11; the machine frame is provided with a semiconductor chip feeding station, a correcting station and a semiconductor chip mounting station, wherein the semiconductor chip feeding station is used for placing a semiconductor chip, the correcting station is used for adjusting the position and the angle of the semiconductor chip, and the semiconductor chip mounting station is used for mounting the semiconductor chip; the two jig material storage modules 10 are arranged on the rack at intervals, the jig material storage modules 10 are used for storing jigs, and one jig is used for placing a plurality of tube seats;
the transferring module 11 is arranged on the rack and positioned between the two jig storage modules 10, the transferring module 11 is used for moving the jig positioned in the jig storage modules 10 to a semiconductor chip mounting station, and the semiconductor chip mounting station is used for mounting the semiconductor chip on the tube seat; the moving process of the transferring module 11 includes: move and carry module 11 and remove the tool from semiconductor chip and paste the dress station to the tool storage module 10 that is located the left end while, remove the tool that is located the tool storage module 10 of right-hand member to semiconductor chip and paste dress station to and move and carry module 11 and remove the tool from semiconductor chip and paste dress station to the tool storage module 10 that is located the right-hand member while, remove the tool that is located the tool storage module 10 of left end to semiconductor chip and paste dress station.
According to the technical scheme, the two jig storage modules 10 are respectively arranged at the two ends of the transfer module 11, the two jig storage modules 10 are used for feeding jigs to the transfer module 11 and recovering jigs from the transfer module 11, in the embodiment of the jig storage module 10, the transfer module 11 moves the jigs in the jig storage modules 10 to the semiconductor chip mounting station and then moves the jigs back to the jig storage module 10 from the semiconductor chip mounting station, and in the process that the jigs return to the jig storage modules 10, the transfer module 11 cannot simultaneously feed another jig to the semiconductor chip mounting station, so that the jigs cannot be fed in the time when the jigs return to the jig storage modules 10. Set up like this, carry out material loading and unloading to the tool in turn from moving the both ends that carry module 11, so can increase the tool and move the efficiency that moves in moving module 11, reduce the extravagant condition of material loading and unloading time in the course of working to increase the efficiency that semiconductor chip encapsulation chip mounter accomplished and paste the dress process.
In one embodiment, the transferring module 11 includes a transferring platform, a rail body, a driving assembly, a first cylinder and a fixing member; the track body comprises a first side plate and a second side plate which are oppositely arranged, the first side plate is arranged on the transfer platform, the second side plate is detachably connected to the first side plate, a through groove is formed between the first side plate and the second side plate and used for the jig to move, and a plurality of tube seats used for placing semiconductor chips are distributed on the jig; the driving assembly is arranged on the transfer platform and is arranged at intervals with the track body; the first air cylinder is connected to the driving assembly in a driving mode, a push rod of the first air cylinder is connected with the fixing piece, the fixing piece is arranged above the through groove and used for being connected with a jig entering the through groove, and the driving assembly is used for driving the fixing piece to move along the length direction of the through groove.
Specifically, a driving assembly is installed on one side of the track body and is connected to a first air cylinder in a driving mode, a push rod of the first air cylinder is connected with a fixing piece, the fixing piece is arranged above the jig, the first air cylinder can control the fixing piece to move up and down, so that the fixing piece is pressed on the jig, and the fixing piece can be connected with the jig; when the jig enters the through groove, the first air cylinder drives the fixing piece to be tightly pressed on the jig, and then the driving assembly drives the first air cylinder to move in the length direction of the through groove, namely the driving assembly drives the jig to move in the through groove through the fixing piece. Set up first curb plate and first curb plate like this and can play limiting displacement, prevent that the tool from to the side skew at the in-process that removes, the mounting is connected with the tool for the tool follows the mounting and removes, so can increase the mobility stability of tool, make the tool when removing through the inslot, can not produce the circumstances such as skid, the displacement distance of tool is controlled through the distance that the control mounting removed, be convenient for the tool accurate positioning and remove corresponding position. In some other embodiments, the first side plate is provided with an avoiding groove, the fixing member is disposed on a side of the fixture, and the first cylinder can push the fixing member to extend into the avoiding groove, so that the fixing member fixes the fixture.
In an embodiment, the semiconductor chip packaging mounter further includes a semiconductor chip loading module 13, a correction module 14, a bonding head module 12, a two-point glue module 15 and a vacuum assembly; the semiconductor chip loading module 13 is mounted on the semiconductor chip loading station; the correction module 14 is arranged at the correction station, the semiconductor chip feeding module 13 is used for placing a semiconductor chip to the correction module 14, and the correction module 14 is used for correcting the position and the angle of the semiconductor chip; the welding head module 12 is arranged at a semiconductor chip mounting station, and the welding head module 12 is used for mounting the semiconductor chip positioned on the correction module 14 on a tube seat; the two glue dispensing modules 15 are arranged on the frame at intervals, and the glue dispensing modules 15 are used for dispensing glue for a plurality of tube seats on the jig; the vacuum assembly is arranged on the frame, is respectively connected with the semiconductor chip feeding module 13, the correcting module 14 and the welding head module 12, and is used for providing a vacuum air source; the dispensing module 15 can detect all tube seats on the jig, when the transferring module 11 moves the jig to the position below the dispensing module 15, the dispensing module 15 performs a dispensing operation once when detecting one tube seat, and after the dispensing operation is completed on all the tube seats on the jig, the transferring module 11 moves the jig to the semiconductor chip mounting station.
Specifically, the dispensing modules 15 located on both sides dispense the tube sockets on the jig after detecting that the jig is input, the jig flows to the semiconductor chip mounting station after dispensing, and the semiconductor chip moves from the semiconductor chip loading module 13 to the correction module 14 to correct the position and angle, so that the position and angle of the semiconductor chip on the correction module 14 are matched with the tube sockets located on the jig, and the bonding head module 12 mounts the semiconductor chip on the tube sockets. The feeding efficiency of the jig with the glue dispensed can be increased by the arrangement, so that the mounting beat is more compact, and the efficiency of mounting the semiconductor chip by the semiconductor chip packaging and mounting machine can be improved.
In one embodiment, the correction module 14 includes a correction platform, a first motor, a rotation shaft, a first moving component and a first vision component 141, the correction platform is mounted on the first moving component, the first moving component is mounted on the frame, the moving component is used for controlling the movement of the correction platform in the horizontal direction, the first motor is mounted on the correction platform, the rotation shaft is rotatably mounted on the correction platform and is in driving connection with the first motor, the upper end of the rotation shaft is used for placing a semiconductor chip, and the first vision component 141 is mounted on the frame and is located above the rotation shaft.
Specifically, the position of the correction platform is adjusted by the first moving assembly, so that the upper end surface of the rotating shaft is arranged opposite to the first vision assembly 141, the semiconductor chip on the end surface of the rotating shaft is positioned and photographed by the first vision assembly 141, and the angle of the semiconductor chip to be adjusted is obtained by comparing the shape of the frame of the tube seat and the shape of the semiconductor chip; if adjustment is required, the first motor is started to rotate the rotating shaft so that the semiconductor chip is rotated to a proper position and then is mounted in the next step. In this embodiment, the correction module 14 further includes a first synchronous wheel, a second synchronous wheel and a first synchronous belt, the first synchronous wheel is sleeved on the rotating shaft of the first motor, the second synchronous wheel is sleeved on the rotating shaft, the first synchronous wheel is connected with the second synchronous wheel through a first synchronous belt, and the first motor drives the first synchronous wheel to drive the rotating shaft to rotate. The semiconductor chip can be just placed into the tube seat, so that the situation that the semiconductor chip is not placed into the tube seat frame can be reduced, and the mounting precision of the semiconductor chip mounted on the semiconductor chip packaging and mounting machine is increased. In other embodiments, the correction module 14 further includes a first bevel gear and a second bevel gear engaged with each other, the first bevel gear is sleeved on the rotating shaft of the first motor, and the second bevel gear is sleeved on the rotating shaft.
In an embodiment, the correction module 14 further includes an air tube, one end of the air tube is sleeved on the lower end of the rotating shaft, the end of the rotating shaft is provided with a first adsorption hole, the first adsorption hole penetrates through the rotating shaft, the air tube is communicated with the first adsorption hole, the other end of the air tube is connected with the vacuum module, and the first adsorption hole is used for adsorbing the semiconductor chip; the first vision component 141 acquires position information of the rotating shaft, a semiconductor chip is placed at the upper end of the rotating shaft, the correction platform is moved to the lower side of the first vision component 141 through the first moving component, so that the rotating shaft and the axis of the first vision component 141 are collinear, the semiconductor chip is made, the first vision component 141 acquires the angle of the semiconductor chip on the rotating shaft again, and the rotating shaft is controlled by the first motor to rotate for a certain angle, so that the placing angle of the semiconductor chip is consistent with the preset angle.
Specifically, the tip of rotation axis is equipped with a plurality of first adsorption holes, and a plurality of first adsorption holes are along the even interval distribution of circumference of rotation axis, and the lower pot head of rotation axis is equipped with the trachea, and the trachea communicates with a plurality of first adsorption holes, when semiconductor chip material loading module 13 feeds semiconductor chip to the rotation axis on, adsorbs semiconductor chip through first adsorption hole. The arrangement can increase the stability of the semiconductor chip placed on the rotating shaft, and the semiconductor chip can not deviate when the angle of the semiconductor chip is corrected. In other embodiments, the first suction holes are circumferentially arranged at the end of the rotating shaft.
In an embodiment, the bonding head module 12 includes a first base 121, a flat motor 122, a second moving assembly 123, an adsorption head 124 and a second vision assembly 125, the first base 121 is installed at the semiconductor chip mounting station, the second moving assembly 123 is installed at the first base 121, the flat motor 122 is installed at the second moving assembly 123, the second assembly is used for controlling the flat motor 122 to move in the horizontal direction and the height direction, the adsorption head 124 is installed at a mover of the flat motor 122, the adsorption head 124 is provided with a second adsorption hole, the second adsorption hole is communicated with the vacuum assembly, the second adsorption hole is used for adsorbing the semiconductor chip, the second vision assembly 125 is installed at the rack and located above the semiconductor chip mounting station, and the second vision assembly 125 is used for detecting whether the semiconductor chip is normally mounted on the socket.
Specifically, the flat motor 122 has a simple structure, and the mover of the flat motor 122 has good movement stability. In this embodiment, the second vision assembly 125 is used to obtain the information of the socket, so that the correction module 14 can adjust the position and angle of the semiconductor chip. Set up like this and can guarantee that flat motor 122 drive adsorbs head 124 and remove the stability when adsorbing semiconductor chip higher, with semiconductor chip's position or angle change when avoiding adsorbing the semiconductor chip by adsorption head 124. In other embodiments, the bonding tool module 12 includes a third cylinder, the third cylinder is mounted on the first base 121, and the suction head 124 is mounted on the push rod of the third cylinder.
In one embodiment, the bonding head module 12 further includes a reverse detection assembly, the reverse detection assembly includes a detection lens 126 and a second base 127, the second base 127 is mounted on the frame, the detection lens 126 is mounted on the second base 127, and the detection lens 126 is disposed toward the upper side; after the semiconductor chip is corrected in position and angle by the correction module, the second moving assembly 123 controls the flat motor 122 to move above the semiconductor chip, the flat motor 122 controls the adsorption head 124 to adsorb the semiconductor chip, the semiconductor chip is translated to a position above the detection lens 126 by the second moving assembly 123, and the detection lens 126 is used for detecting whether the correction module corrects the semiconductor chip to a preset angle or not;
if the correction is successful, the semiconductor chip is moved to the position above the tube seat after the dispensing is finished through the second moving assembly 123 for mounting;
if the correction fails, the semiconductor chip is moved to the position above the correction module by the second moving assembly 123, the flat motor 122 returns the semiconductor chip to the correction module for correction again until the detection lens 126 detects that the semiconductor chip is corrected to a preset angle, and then the semiconductor chip is mounted on the glued tube seat.
Particularly, the position and the angle of the semiconductor chip before loading can be matched with the tube seat, the mounting efficiency of the semiconductor chip is guaranteed, and meanwhile the yield of the product can be improved. In other embodiments, the detection lens 126 is mounted on the first base 121, and the detection lens 126 is disposed toward the direction in which the suction head 124 is disposed.
In an embodiment, the jig storage module 10 includes a magazine rack 101, a plurality of magazines 102, a feeding assembly 103 and a discharging assembly 104, the plurality of jigs are uniformly placed on the magazine 102 along a height direction of the magazine 102 at intervals, the plurality of magazines 102 are mounted on the magazine rack 101, the plurality of magazines 102 are sequentially distributed along the height direction of the magazine rack 101, the feeding assembly 103 is mounted on the magazine rack 101 and is used for moving the jigs in the magazine 102 to the transfer module 11, and the discharging assembly 104 is used for outputting the magazine 102 located in the magazine rack 101.
Particularly, the arrangement can ensure that one magazine 102 can be used for placing a plurality of jigs, and the mode of placing a plurality of magazines 102 in the height direction of the magazine rack 101 can reduce the occupied area of the semiconductor chip packaging chip mounter compared with the mode of placing a plurality of magazines 102 in the width direction or the length direction of the magazine rack 101. In other embodiments, a plurality of cartridges 102 are distributed in sequence along the width of the cartridge magazine 101.
In one embodiment, the feeding assembly 103 includes a lead screw 1031, a nut seat 1032, a second air cylinder 1033 and a second motor 1035, the magazine frame 101 has a feeding portion, the lead screw 1031 is rotatably mounted on the magazine frame 101 and extends along a length direction of the magazine frame 101, the second motor 1035 is mounted on the magazine frame 101 and is in driving connection with the lead screw, the nut seat 1032 is rotatably sleeved on the lead screw 1031, a convex plate 1036 is disposed on the nut seat 1032, the magazine 102 has a clamping groove, the convex plate 1036 extends into the clamping groove to fix the nut seat 1032 with the magazine 102, the second air cylinder 1033 is mounted on the magazine frame 101, and a push rod of the second air cylinder 1033 abuts against a fixture in the magazine 102; the nut seat 1032 is inserted into the magazine 102 located in the feeding portion through the convex plate 1036, the lowermost jig in the magazine 102 is pushed out to the transfer module 11 through the second cylinder 1033, the tube seats on the jigs are all attached with the semiconductor chips and then are moved back into the magazine 102 through the transfer module 11, when one jig is recovered by the magazine 102, the second motor 1035 drives the magazine 102 to move downwards for a preset distance until the tube seats on all jigs in the magazine 102 are attached with the semiconductor chips, and the magazine 102 is moved to the discharging assembly 104 by the second motor 1035 and then is output outwards from the magazine 102.
Specifically, in this embodiment, two sides of the magazine 102 are disposed in communication, the second cylinder 1033 extends from the left side of the magazine 102 to push out the jig, the transfer module 11 pushes the jig from the right side of the magazine 102, the feeding assembly 103 further includes a fourth cylinder 1034, the fourth cylinder 1034 is mounted on the magazine rack 101 and located above the feeding portion for compressing the magazine 102 outputting the jig, when the jig is output from the magazine 102 of the feeding portion, the fourth cylinder 1034 is compressed on the magazine 102 of the feeding portion, when the jig flows back into the magazine 102, the push rod of the fourth cylinder 1034 is retracted, and at this time, the second motor 1035 drives the magazine 102 to move downward, so that the push rod of the second cylinder 1033 aligns to the next jig to be pushed out. By the arrangement, all jigs in the unified material box 102 can be stably pushed out, the motion accuracy of the lead screw is high, namely, the second motor 1035 can finely control the motion of the material box 102 in the length direction of the lead screw, and the situation that the material box 102 is moved too far to cause a certain jig not to be pushed out is prevented. In other embodiments, the feeding assembly 103 includes a first linear motor and a second cylinder 1033, the first linear motor is mounted on the magazine rack 101 and extends along the height of the magazine rack 101, a mover of the first linear motor can move in the height direction of the magazine rack 101, and a clamping plate is disposed on the mover of the first linear motor and used for clamping the magazine 102 located in the feeding portion.
In an embodiment, the blanking assembly 104 includes a bearing plate 1041, a third motor 1042 and a driving plate 1043, the driving plate 1043 is movably mounted on the bearing plate 1041, the third motor 1042 is used for driving the driving plate 1043 to move along a length direction of the bearing plate 1041, a plurality of insertion portions are arranged on the driving plate 1043, the plurality of insertion portions are uniformly distributed at intervals along the length direction of the driving plate 1043, and the insertion portions are used for placing the magazine 102; after the semiconductor chips are mounted on the tube seats of all the jigs in the magazine 102, the second motor 1035 moves the magazine 102 to the insertion portion, and when a magazine 102 is placed on one insertion portion, the third motor 1042 drives the driving plate 1043 to move a predetermined distance so as to move one insertion portion on which the magazine 102 is placed to a position below the loading portion.
Specifically, when the tube sockets of all the jigs in the magazine 102 are mounted with semiconductor chips, the push rod of the fourth cylinder 1034 is retracted, the second motor 1035 drives the magazine 102 to move downward, when the magazine 102 enters an insertion portion, the second motor 1035 returns to the loading portion, and when one magazine 102 falls to one insertion portion, the third motor 1042 controls the driving plate 1043 to move forward by a certain distance so as to move the next insertion portion to a position below the magazine 102 of the loading portion, the blanking assembly 104 further comprises a third synchronizing wheel, a fourth synchronizing wheel and a second synchronizing belt, the driving plate 1043 is mounted on the second synchronizing belt, the second synchronizing belt is used for connecting the third synchronizing wheel and the fourth synchronizing wheel, the fourth synchronizing wheel is rotatably mounted on the bearing plate 1041, the third synchronizing wheel is sleeved on the rotating shaft of the third motor 1042, and the third motor 1042 is used for driving the third synchronizing wheel to rotate so as to drive the second synchronizing belt to move, thereby achieving the purpose of controlling the movement of 1043. The distance of the movement of the driving plate 1043 can be accurately controlled by the arrangement, so that the feeding of the material box 102 to the inserting part is ensured. In other embodiments, the blanking assembly 104 includes a second linear motor, the second linear motor is installed below the bearing plate 1041, and a rotor of the second linear motor is connected to the driving plate 1043 for driving the driving plate 1043 to move along the length direction of the bearing plate 1041.
Further, in this embodiment, the semiconductor chip packaging chip mounter further includes an ejector pin module 16 and a swing arm module 17, the ejector pin module 16 is mounted on the chassis and is configured to eject the semiconductor chip on the chip loading module 13, and the swing arm module 17 is mounted on the chassis and is configured to transfer the semiconductor chip ejected by the ejector pin module 16 to the correction module 14.
The above description is only an alternative embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, which are within the spirit of the present invention, are included in the scope of the present invention.
Claims (10)
1. A semiconductor chip packaging chip mounter is characterized by comprising:
the semiconductor chip mounting device comprises a rack, a chip mounting mechanism and a chip removing mechanism, wherein the rack is provided with a chip loading station, a correcting station and a chip mounting station, the chip loading station is used for placing a semiconductor chip, the correcting station is used for adjusting the position and the angle of the semiconductor chip, and the chip mounting station is used for mounting the semiconductor chip;
the jig storage modules are arranged on the rack at intervals and used for storing jigs, and one jig is used for placing a plurality of tube seats;
the transfer module is arranged on the rack and positioned between the two jig storage modules, the transfer module is used for moving the jig positioned on the jig storage modules to the chip mounting station, and the chip mounting station is used for mounting the semiconductor chip on the tube seat; and
the moving process of the transfer module comprises the following steps: move and carry the module will the tool removes to being located the left end from chip subsides dress station when tool storage module will be located the right-hand member the tool of tool storage module removes chip subsides dress station, and move and carry the module will the tool removes to being located the right-hand member from chip subsides dress station when tool storage module, will be located the left end tool in the tool storage module removes chip subsides dress station.
2. The semiconductor chip package placement machine according to claim 1, wherein the transfer module includes:
the track body comprises a first side plate and a second side plate which are oppositely arranged, the first side plate is installed on the load platform, the second side plate is detachably connected to the first side plate, a through groove is formed between the first side plate and the second side plate and used for a jig to move, and a plurality of tube seats used for placing chips are distributed on the jig;
the driving assembly is arranged on the transfer platform and is arranged at intervals with the track body; and
the fixture comprises a first cylinder and a fixing piece, wherein the first cylinder is connected to a driving assembly in a driving mode, a push rod of the first cylinder is connected with the fixing piece, the fixing piece is arranged above the through groove and used for being connected with a fixture which enters the through groove, and the driving assembly is used for driving the fixing piece to move along the length direction of the through groove.
3. The semiconductor chip package placement machine of claim 1, wherein the semiconductor chip package placement machine further comprises:
the chip loading module is arranged at a chip loading station;
the correction module is arranged at the correction station, the chip loading module is used for placing the semiconductor chip to the correction module, and the correction module is used for correcting the position and the angle of the semiconductor chip;
the welding head module is arranged at the chip mounting station and used for mounting the semiconductor chip positioned on the correction module on the tube seat;
the two dispensing modules are arranged on the rack at intervals and used for dispensing the plurality of tube seats on the jig; and
the vacuum assembly is arranged on the rack, is respectively connected with the chip feeding module, the correcting module and the welding head module, and is used for providing a vacuum air source;
the dispensing module can detect all tube seats on the jig, when the transferring module moves the jig to the position below the dispensing module, the dispensing module performs dispensing operation once when detecting one tube seat, and when dispensing operation is completed on all the tube seats on the jig, the transferring module moves the jig to the chip mounting station.
4. The semiconductor chip packaging and placement machine according to claim 3, wherein the correction module includes a correction platform, a first motor, a rotation shaft, a first moving component, and a first vision component, the correction platform is mounted on the first moving component, the first moving component is mounted on the frame, the moving component is configured to control movement of the correction platform in a horizontal direction, the first motor is mounted on the correction platform, the rotation shaft is rotatably mounted on the correction platform and is in driving connection with the first motor, an upper end portion of the rotation shaft is configured to receive the semiconductor chip, and the first vision component is mounted on the frame and is located above the rotation shaft.
5. The semiconductor chip packaging and mounting machine according to claim 4, wherein the correction module further includes a gas tube, one end of the gas tube is sleeved on a lower end of the rotating shaft, a first suction hole is formed at an end of the rotating shaft, the first suction hole penetrates through the rotating shaft, the gas tube is communicated with the first suction hole, the other end of the gas tube is connected to the vacuum module, and the first suction hole is used for sucking the semiconductor chip;
the first vision subassembly acquires the positional information of rotation axis, one has been placed to the upper end of rotation axis semiconductor chip, will through first removal subassembly revise the platform and move to first vision subassembly below to make the rotation axis with the axis collineation of first vision subassembly, so that semiconductor chip, first vision subassembly reacquires the angle of semiconductor chip on the rotation axis, through first motor control the rotation axis rotates certain angle, so that semiconductor chip's the angle of putting is unanimous with the angle of predetermineeing.
6. The semiconductor chip packaging and mounting machine according to claim 3, wherein the bonding tool module includes a first base, a flat motor, a second moving component, an adsorption head, and a second vision component, the first base is mounted on the chip mounting station, the second moving component is mounted on the first base, the flat motor is mounted on the second moving component, the second component is used for controlling the flat motor to move in a horizontal direction and a height direction, the adsorption head is mounted on a mover of the flat motor, the adsorption head is provided with a second adsorption hole, the second adsorption hole is communicated with the vacuum component, the second adsorption hole is used for adsorbing the semiconductor chip, the second vision component is mounted on the frame and located above the chip mounting station, and the second vision component is used for detecting whether the semiconductor chip is normally mounted on the tube seat.
7. The semiconductor chip packaging and chip mounter according to claim 6, wherein said bonding head module further comprises a reverse direction detection assembly, said reverse direction detection assembly comprising a detection lens and a second base, said second base being mounted to a chassis, said detection lens being mounted to said second base, and said detection lens being disposed facing upward;
after the semiconductor chip is corrected in position and angle through the correction module, the second moving assembly controls the flat motor to move to the position above the semiconductor chip, the flat motor extends out of the push rod, the semiconductor chip is sucked through the adsorption head, the semiconductor chip is translated to the position above the detection lens through the second moving assembly, and the detection lens is used for detecting whether the correction module corrects the semiconductor chip to a preset angle or not;
if the correction is successful, the semiconductor chip is moved to the position above the tube seat after the dispensing is finished through the second moving assembly for mounting;
if the correction fails, the semiconductor chip is moved to the position above the correction module through the second moving assembly, the flat motor puts the semiconductor chip back to the correction module for correction again until the detection lens detects that the semiconductor chip is corrected to a preset angle, and then the semiconductor chip is attached to the tube seat after the glue dispensing is finished.
8. The semiconductor chip packaging and chip mounting machine according to any one of claims 1 to 7, wherein the jig storage module includes a magazine rack, a plurality of magazines, a feeding assembly and a discharging assembly, the plurality of jigs are disposed on the magazines at regular intervals along a height direction of the magazines, the plurality of magazines are mounted on the magazine rack, the plurality of magazines are sequentially distributed along the height direction of the magazine rack, the feeding assembly is mounted on the magazine rack and is configured to move the jigs in the magazines to the transfer module, and the discharging assembly is configured to output the magazines located in the magazine rack outward.
9. The semiconductor chip packaging and chip mounting machine according to claim 8, wherein the feeding assembly includes a feeding screw, a nut seat, a second cylinder and a second motor, the magazine holder has a feeding portion, the feeding screw is rotatably mounted on the magazine holder and extends along a length direction of the magazine holder, the second motor is mounted on the magazine holder and is drivingly connected to the feeding screw, the nut seat is rotatably sleeved on the feeding screw, a protruding plate is disposed on the nut seat, the magazine has a locking groove, the protruding plate extends into the locking groove to fix the nut seat and the magazine, the second cylinder is mounted on the magazine holder, and a pushing rod of the second cylinder abuts against a jig in the magazine;
the nut seat is inserted and connected with the material box of the feeding portion through the convex plate, the tool at the lowest position in the material box is pushed out to the transfer module through the second cylinder, the tube seats on the tools are all pasted and installed with the semiconductor chips and then are moved back to the material box through the transfer module, when the material box recovers one at a time, the second motor drives the material box to move downwards for a preset distance until the tube seats on all the tools in the material box are all pasted and installed with the semiconductor chips, and the second motor moves the material box to the discharging assembly and then outputs the material box outwards.
10. The semiconductor chip package placement machine according to claim 9, wherein the feeding assembly includes a carrier plate, a third motor, and a driving plate, the driving plate is movably mounted on the carrier plate, the third motor is mounted on the carrier plate, and the third motor is configured to drive the driving plate to move along a length direction of the carrier plate, the driving plate is provided with a plurality of insertion portions, the plurality of insertion portions are uniformly spaced along the length direction of the driving plate, and the insertion portions are configured to receive the magazine;
after the semiconductor chips are attached to the tube seats of all the jigs in the material box, the material box is moved to the insertion part by the second motor, and when one material box is placed on one insertion part, the third motor drives the driving plate to move for a preset distance so as to move one insertion part with the material box placed to the lower part of the feeding part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211078820.3A CN115440629A (en) | 2022-09-05 | 2022-09-05 | Semiconductor chip packaging chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211078820.3A CN115440629A (en) | 2022-09-05 | 2022-09-05 | Semiconductor chip packaging chip mounter |
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| Publication Number | Publication Date |
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| CN115440629A true CN115440629A (en) | 2022-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211078820.3A Pending CN115440629A (en) | 2022-09-05 | 2022-09-05 | Semiconductor chip packaging chip mounter |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116209170A (en) * | 2023-04-27 | 2023-06-02 | 西安峰盛智能电子有限公司 | Semiconductor chip mounter and using method thereof |
| CN116209170B (en) * | 2023-04-27 | 2024-06-07 | 碳芯微电子科技(深圳)有限公司 | Semiconductor chip mounter and using method thereof |
-
2022
- 2022-09-05 CN CN202211078820.3A patent/CN115440629A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116209170A (en) * | 2023-04-27 | 2023-06-02 | 西安峰盛智能电子有限公司 | Semiconductor chip mounter and using method thereof |
| CN116209170B (en) * | 2023-04-27 | 2024-06-07 | 碳芯微电子科技(深圳)有限公司 | Semiconductor chip mounter and using method thereof |
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