CN115440122A - Measuring instrument for teaching semiconductor wafer - Google Patents
Measuring instrument for teaching semiconductor wafer Download PDFInfo
- Publication number
- CN115440122A CN115440122A CN202210399471.9A CN202210399471A CN115440122A CN 115440122 A CN115440122 A CN 115440122A CN 202210399471 A CN202210399471 A CN 202210399471A CN 115440122 A CN115440122 A CN 115440122A
- Authority
- CN
- China
- Prior art keywords
- semiconductor wafer
- measuring
- laser sensor
- teaching
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B25/00—Models for purposes not provided for in G09B23/00, e.g. full-sized devices for demonstration purposes
- G09B25/02—Models for purposes not provided for in G09B23/00, e.g. full-sized devices for demonstration purposes of industrial processes; of machinery
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Educational Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Theoretical Computer Science (AREA)
- Business, Economics & Management (AREA)
- Educational Administration (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present invention relates to a measuring instrument for teaching a semiconductor wafer, which is used for teaching again when a test is performed before a normal manufacturing process such as a case where a damage, a failure, an error, or the like occurs in an arm for picking up a wafer in a loading table for performing a work in a state where a semiconductor wafer box is mounted, or preventive maintenance (a work operation for stopping a device before an abrupt failure and performing inspection and repair in advance) is required in a semiconductor production line.
Description
Technical Field
The present invention relates to a measuring instrument for Teaching a semiconductor Wafer, and more particularly, to a measuring instrument for Teaching a semiconductor Wafer, which can easily and accurately confirm an operation relationship between an operation Arm and a Wafer at the time of Teaching, accurately and conveniently measure and calibrate the position of the operation Arm, and can easily confirm whether the operation Arm and the Wafer are positioned at an accurate clamping position and whether the Wafer can be accurately inserted into and mounted or extracted by the operation Arm, when a test before a normal manufacturing process operation such as a Preventive Maintenance (productive Maintenance, a work action of stopping a device before an occurrence of an unexpected trouble and performing an inspection and repair) is required or when a test before a normal manufacturing process operation such as a Preventive Maintenance (Preventive Maintenance) is performed on a loading table which performs a work in a state of mounting a semiconductor Wafer box body.
In other words, the present invention relates to a measuring instrument for teaching a semiconductor wafer, which is used for setting a handling arm by confirming, checking and calibrating in advance whether or not a wafer can be accurately gripped by the handling arm from a semiconductor wafer cassette (hereinafter, simply referred to as "cassette") and picked up and mounted in a semiconductor production line when a process is stopped due to damage, malfunction, error, or the like of the handling arm and equipment needs to be set for re-operation.
Background
In general, in a semiconductor manufacturing process, when a device such as a robot arm for inserting and mounting or extracting a semiconductor wafer into or from a cassette (i.e., a Front Opening Unified Pod, also referred to as a "FOUP") for housing and mounting a plurality of wafers is damaged, broken, or has an error, teaching is performed by using the cassette in order to check in advance whether or not the robot arm can correctly extract or insert the mounted wafer from or into the cassette after stopping an operation of the manufacturing process and replacing or repairing the device.
In FIG. 1 of Korean patent laid-open publication No. 10-0293906, the case is referred to as a "resin sheet container".
However, when the cassette itself is used for supplying and transferring after housing and mounting semiconductor wafers in a semiconductor manufacturing line, and the cassette is used for teaching, it is difficult to clearly confirm whether or not the operation arm accurately holds the wafers and normally performs insertion mounting or extraction during teaching work, or it is difficult to clearly confirm whether or not the operation relationship between the operation arm and the wafers is accurate, which is inconvenient and deteriorates workability.
That is, it is difficult and inconvenient to precisely measure and calibrate the height, straightness, level, center, inclination, position, and the like of the operation arm, and therefore, it is necessary to re-teach the operation after the installation of the equipment.
Documents of the prior art
Patent literature
Patent document 0001: korean granted patent publication No. 10-0293906 (published 11 month and 22 days 2001)
Disclosure of Invention
Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a measuring apparatus for teaching a semiconductor wafer, which can confirm an operation relationship between an arm and a wafer easily and accurately at the time of teaching when a teaching task is performed to reset a manufacturing apparatus such as an arm, measure and calibrate the position of the arm accurately and easily, and can confirm whether the arm and the wafer are located at an accurate clamping position accurately and easily by an automatic detection sensor, and can insert and mount or extract the wafer accurately by the arm.
As an embodiment for achieving the above object of the present invention, a measuring instrument for teaching a semiconductor wafer of the present invention includes: a support shaft vertically disposed on both sides of the support plate, and having a plurality of support grooves (slots) formed in upper and lower portions thereof for inserting and mounting semiconductor wafers; stop piece shafts vertically arranged at two rear side parts of the bracket shaft and used for fixing the semiconductor wafer at a correct position; and a frame top plate fixedly installed at upper ends of the holder shaft and the stopper shaft, wherein a holder groove of the holder shaft is formed by a holder shoulder having an inclined portion formed at an entrance, support shoulders for mounting the semiconductor wafer are formed on the holder shoulder to protrude to both sides, a support shoulder is formed on the stopper shaft for mounting the semiconductor wafer on the same horizontal line as the support shoulder, a position measuring device is installed at a front side of the holder shaft, a guide rail is fixedly installed at both sides of the position measuring device, a measurement fixing block having a stopper is inserted into the guide rail to be guided by a rail block, a measurement plate having position scales is installed at the measurement fixing block to be rotatable by a hinge shaft, magnets having different polarities are fixedly installed at the stopper and the measurement plate, a scale indication tip portion is fixedly installed at a tip end of the measurement fixing block 10, a scale plate is arranged at a front of the scale indication tip portions at both sides, a horizontal measurement grade meter for measuring a horizontal state is installed at a front of the support plate, a teaching pin for fixing the support plate at a predetermined position, a handle for moving the support plate, and the like.
A control box with a built-in central processing unit is fixedly arranged between the support shafts at two sides, the central processing unit is provided with a program for executing a detection function and a measurement function, a touch display panel is arranged on the rear surface of the control box, the control box can be checked by displaying a measurement value and operated by touch, a first laser sensor, a second laser sensor, a third laser sensor and a fourth laser sensor are respectively arranged at two sides of the lower part of the support shafts at two sides, the first laser sensor and the second laser sensor are used for measuring the left and right deviation of a semiconductor wafer, the third laser sensor and the fourth laser sensor are used for measuring the left and right inclination of the semiconductor wafer, and a fifth laser sensor, a sixth laser sensor, a seventh laser sensor and an eighth laser sensor are arranged at two sides of a frame top plate arranged at the upper part of the support shafts at two sides, the fifth and sixth laser sensors are configured to measure lateral deviation of the semiconductor wafer, the seventh and eighth laser sensors are configured to measure lateral tilt of the semiconductor wafer, the ninth and tenth laser sensors are disposed at lower rear center portions of the holder shafts on both sides, the ninth laser sensor is configured to measure depth of the semiconductor wafer, the tenth laser sensor is configured to measure pitch of the semiconductor wafer, the eleventh and twelfth laser sensors are disposed at center portions of the frame top plate disposed at upper side portions of the holder shafts on both sides, the eleventh laser sensor is configured to measure depth of the semiconductor wafer, and the twelfth laser sensor is configured to measure pitch of the semiconductor wafer.
As another embodiment to achieve the above object of the present invention, a measurement method for semiconductor wafer teaching of the present invention includes: a first step of turning ON (ON) by operating a power switch of the measuring instrument; a second step, starting the measuring instrument by operating the power switch, starting a Window (Window) and automatically starting a measuring program; a third step of executing automatic initialization work along with the work of the measurement program; a fourth step of performing an automatic initialization operation along with the operation according to the measurement program, thereby completing the initialization; a fifth step of starting loading detection of the semiconductor wafer when the semiconductor wafer starts to enter the rack groove in the step of completing the initialization, measuring a left-right deviation of the semiconductor wafer by the first laser sensor and the second laser sensor on the lower side and the fifth laser sensor and the sixth laser sensor on the upper side, failing to load the semiconductor wafer and returning to the step of initializing again if the deviation range is exceeded, and starting loading of the semiconductor wafer to measure the left-right deviation if the deviation range is not exceeded; a sixth step of measuring a lateral deviation of the semiconductor wafer by using the third and fourth laser sensors on the lower side and the seventh and eighth laser sensors on the upper side if the lateral deviation does not exceed the deviation range, and starting entry of the semiconductor wafer if the lateral deviation does not exceed the deviation range; a seventh step of measuring a left-right entry deviation and a left-right inclination of the semiconductor wafer by the first laser sensor and the second laser sensor on the lower side, the fifth laser sensor and the sixth laser sensor on the upper side, the third laser sensor and the fourth laser sensor on the lower side, and the seventh laser sensor and the eighth laser sensor on the upper side, after entering through the sixth step in which the semiconductor wafer starts to enter, and measuring a height, and if the measured value does not exceed a deviation range, performing a complete entry; and an eighth step of, if the semiconductor wafer has completely entered, performing depth measurement by a ninth laser sensor on the lower side of the rear portion and an eleventh laser sensor on the upper side portion, performing front-rear tilt measurement of the semiconductor wafer by a tenth laser sensor on the lower side and a third laser sensor and a fourth laser sensor, performing front-rear tilt measurement of the semiconductor wafer by a twelfth laser sensor on the upper side and a seventh laser sensor and an eighth laser sensor, and if the measurement values do not exceed the deviation range, ending the measurement.
The present invention as described above can confirm by outputting the measured values of the lateral deviation and the lateral inclination, the depth, the front-back inclination, and the height of the semiconductor wafer measured by the laser sensor on the touch display panel, and can confirm the measured values of the straightness, the flatness, the lateral deviation, the entry height, and the like of the semiconductor wafer, thereby completing the test by all measurements and calibrations.
That is, when a teaching operation is performed to reset a manufacturing facility such as a manipulator, the following operational relationship between the manipulator and a wafer can be easily and accurately confirmed during the teaching, and not only can precise measurements of the straightness, level, height, lateral eccentricity, inclination, position, and the like of the manipulator and the wafer be accurately and easily performed, but also calibration can be easily performed by such measurements, and whether the manipulator and the wafer are located at an accurate clamping position and whether the wafer can be accurately inserted into and mounted or extracted by the manipulator or the like can be easily and accurately confirmed.
Furthermore, all the measured information may be stored in a central processing unit in the control box, and may be transmitted to an external terminal such as a Personal Computer (PC) or a smart phone based on wired or wireless communication through an interface for management and storage.
Drawings
Fig. 1 is a perspective view showing the structure of a "measuring instrument for teaching a semiconductor wafer" according to the present invention.
FIG. 2 is an overall front view of the "metrology tool for semiconductor wafer teaching" of the present invention.
FIG. 3 is a top view of the "metrology tool for semiconductor wafer teaching" in accordance with the present invention.
Fig. 4 is a plan view of the "measuring instrument for teaching a semiconductor wafer" according to the present invention, which is inserted into a holder groove with a wafer loaded on a hand, and measures the positions of the hand and the wafer.
Fig. 5 is an overall side view of the "measuring instrument for teaching a semiconductor wafer" according to the present invention, which is a side view of the arm mounted in a holder groove in an inserted state with a wafer loaded thereon to measure the positions of the arm and the wafer.
FIG. 6 is an overall rear view of the "metrology tool for semiconductor wafer teaching" of the present invention.
Fig. 7 is an enlarged perspective view of the position measuring device partially cut out in the "measuring instrument for teaching semiconductor wafers" of the present invention.
Fig. 8 is a partially cut-away enlarged view showing a state where a wafer is inserted into a holder groove mounted on a holder shaft and a stopper groove of a stopper shaft in the "measuring instrument for teaching a semiconductor wafer" of the present invention.
Fig. 9 is a schematic view of a state where a semiconductor wafer is inserted into an entrance of a holder groove and a left-right deviation of the wafer is measured by a laser sensor in the "measuring instrument for teaching a semiconductor wafer" of the present invention as seen from a plane.
Fig. 10 is a schematic view of a state where a semiconductor wafer is inserted into an entrance of a holder groove and a lateral deviation of the wafer is measured by a laser sensor in the "measuring instrument for teaching a semiconductor wafer" of the present invention as seen from the side.
Fig. 11 is a plan view of a state where the semiconductor wafer is inserted into the holder groove and the lateral deviation and the lateral inclination of the wafer are measured by the laser sensor in the "measuring instrument for teaching a semiconductor wafer" according to the present invention.
Fig. 12 is a schematic side view of a state where a semiconductor wafer is inserted into a holder groove and a lateral deviation and a lateral inclination of the wafer are measured by a laser sensor in the "measuring instrument for teaching a semiconductor wafer" according to the present invention.
Fig. 13 is a schematic view of a state where the semiconductor wafer is completely entered into the holder groove and the depth and the back-and-forth inclination of the wafer are measured by the laser sensor in the "measuring instrument for teaching semiconductor wafer" of the present invention as seen from a plane.
Fig. 14 is a schematic view of a state where the semiconductor wafer is completely entered into the holder groove and the depth and the back-and-forth inclination of the wafer are measured by the laser sensor in the "measuring instrument for teaching semiconductor wafer" of the present invention, as seen from the side.
Fig. 15 is a flowchart showing a measurement method for semiconductor wafer teaching performed using the "measuring instrument for semiconductor wafer teaching" of the present invention.
Detailed Description
Hereinafter, detailed description will be given based on drawings shown as preferred embodiments.
In describing the present invention, terms in the present specification are defined in consideration of functions, forms, and the like of the present invention, and should not be construed as limiting technical components of the present invention.
Since various modifications and various embodiments of the present invention are possible, an example (aspect) (or an embodiment) will be described in detail herein. However, the present invention is not limited to the specific embodiments disclosed, and it should be understood that the present invention encompasses all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention.
Also, the sizes or thicknesses of the structural elements in the respective drawings may be exaggerated (or thicker) or reduced (or thinner) for the convenience of understanding and the like, or the structural elements in the drawings may be simplified, but should not be construed to limit the scope of the present invention thereby.
The terms used in the present specification are only used for describing specific examples (embodiments) (or examples) and do not limit the present invention.
General terms defined in commonly used dictionaries should be interpreted as having the same meaning as a context of the related art and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Hereinafter, a detailed description will be given based on the drawings shown as preferred embodiments of the present invention.
As an example for achieving the object of the present invention, the following description is first made with reference to fig. 1 to 8.
The invention comprises the following steps: a holder shaft 3 vertically provided on both sides of the support plate 1, and having a plurality of holder grooves 2 formed in an upper portion and a lower portion thereof for inserting and mounting the semiconductor wafer W; stopper shafts 4 erected on both rear side portions of the holder shaft 3 for fixing the semiconductor wafer W at a correct position; and a frame top plate 7 fixedly installed on the upper end portions of the holder shaft 3 and the stopper shaft 4.
The holder groove 2 of the holder shaft 3 is formed by a shelf shoulder 2a, the shelf shoulder 2a is formed with an inclined portion 2b at an entrance, a support shoulder 2c for mounting the semiconductor wafer W is formed on the shelf shoulder 2a to protrude to both sides, and a support shoulder 4b is formed on the stopper shaft 4 to mount the semiconductor wafer W on the same horizontal line as the support shoulder 2c (see fig. 8).
A position measuring device P is provided on the front side of the holder shaft 3, a guide rail 8 is fixed to both sides of the position measuring device P, and a fixed measuring block 10 having a stopper 9 is inserted into the guide rail 8 so as to be guided by a rail block 11 (see fig. 2 and 7).
A measuring plate 13 marked with position scales 12 is arranged on the fixed measuring block 10 in a mode of rotating through a hinge shaft 14, magnets 15 and 15a with different polarities are respectively fixedly arranged on the stop piece 9 and the measuring plate 13, and a scale indicating tip 16 is fixedly arranged at the tail end of the fixed measuring block 10.
A scale plate 17 is disposed in front of the scale indication tip 16 on both sides, a horizontal measurement grade measuring instrument 18 for measuring a horizontal state is disposed in front of the support plate 1, a hole block 20 for fixing the support plate 1 to a stud (not shown) at a predetermined position of the support plate 1 during teaching is disposed, and handles 21 for carrying, moving during teaching, and the like are disposed on both sides of the support plate 1.
A control box C having a central processing unit is fixedly installed between the support shafts 3 at both sides, the central processing unit is configured with a program for performing a detection function and a measurement function, and a touch display panel 22 is configured on the rear surface of the control box C, and can be viewed by displaying a measurement value and operated by touch.
A first laser sensor 23 and a second laser sensor 23a, and a third laser sensor 24 and a fourth laser sensor 24a are disposed on both sides of the lower portion of the holder shaft 3 on both sides, respectively, the first laser sensor 23 and the second laser sensor 23a are used to measure lateral deviation of the semiconductor wafer W, and the third laser sensor 24 and the fourth laser sensor 24a are used to measure lateral inclination of the semiconductor wafer W.
Fifth and sixth laser sensors 25 and 25a and seventh and eighth laser sensors 26 and 26a are disposed on both sides of the frame top plate 7 disposed on the upper side of the holder shaft 3 on both sides, the fifth and sixth laser sensors 25 and 25a measuring lateral deviation of the semiconductor wafer, and the seventh and eighth laser sensors 26 and 26a measuring lateral inclination of the semiconductor wafer.
A ninth laser sensor 27 and a tenth laser sensor 28 are disposed at a lower rear center portion of the holder shaft 3 on both sides, the ninth laser sensor 27 is for measuring a depth of the semiconductor wafer, the tenth laser sensor 28 is for measuring a front-rear tilt of the semiconductor wafer, an eleventh laser sensor 29 and a twelfth laser sensor 30 are disposed at a center portion of the frame top plate 7 disposed at an upper side portion of the holder shaft 3 on both sides, the eleventh laser sensor 29 is for measuring a depth of the semiconductor wafer, and the twelfth laser sensor 30 is for measuring a front-rear tilt of the semiconductor wafer W.
In the present invention as described above, the semiconductor wafer cassette is first mounted on the reference plate of the loading table on which work is performed, and the hole block 20 disposed on the bottom surface of the support plate 1 is provided to the pins provided on the reference plate.
In this case, the surveying instrument according to the present invention is positioned on the loading platform, and the robot provided with the operation arm R is also moved to a position to be taught.
In this case, teaching positions (for example, XYZ spatial coordinates) of the robot are stored, and teaching data is stored by performing insertion mounting or extraction testing of a wafer in the measuring apparatus of the present invention.
Then, when the test is completed, the measurement instrument for teaching of the present invention is separated from the reference plate of the loading table.
Next, a method of performing an insertion mounting or extraction test of a wafer using a laser sensor and a Window (Window) and a measurement program provided in the above-described measurement instrument for teaching of the present invention will be described.
The wafer W is mounted on an operation arm R connected to the robot, and then inserted into a holder groove 2 formed inside the holder shafts 3 on both sides (see fig. 5, 9, and 10).
The wafer W may be inserted and entered into the lower side portion and the upper side portion at the same time, or may be selectively inserted and entered into only the lower side or the upper side, respectively.
As described above, when the wafer W is inserted into the holder groove 2 by the operation arm R, the edge (edge) of the wafer W is inserted into the entrance of the holder groove 2, and in this case, the lateral deviation of the semiconductor wafer W is measured by the first and second laser sensors 23 and 23a on the lower side and the fifth and sixth laser sensors 25 and 25a on the upper side.
That is, when the edge of the wafer W is inserted into the entrance of the holder groove 2 and positioned, the first laser sensor 23 and the second laser sensor 23a on the lower side and the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side are irradiated with laser light and detected, and if the measured value exceeds the range of the lateral variation of the semiconductor wafer, the semiconductor wafer cannot be loaded, and if the measured value does not exceed the range of the lateral variation, the wafer W is loaded.
For example, if the lateral deviation of the semiconductor wafer is larger than ± 0.5mm, the semiconductor wafer is re-entered by adjusting the teaching, and if the lateral deviation of the semiconductor wafer is smaller than ± 0.5mm, the entry is performed without teaching.
The measured lateral deviation value of the semiconductor wafer can be confirmed by outputting it to the touch display panel C disposed at the rear.
As shown in fig. 11 and 12, when the semiconductor wafer is advanced, the first laser sensor 23 and the second laser sensor 23a on the lower side measure the lateral deviation of the semiconductor wafer, and the third laser sensor 24 and the fourth laser sensor 24a measure the height, thereby measuring the lateral roll inclination (i.e., the height of the left side or the right side of the semiconductor wafer).
Then, the lateral deviation of the semiconductor wafer is measured by the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side, and the lateral roll inclination is measured by the seventh laser sensor 26 and the eighth laser sensor 26 a.
As described above, the right-left deviation, the straightness, and the flatness of the inserted and entered semiconductor wafer are measured.
As described above, if the measured values of the lateral deviation, the straightness, and the flatness of the semiconductor wafer do not exceed the deviation range, the process continues, and if the measured values exceed the deviation range, the semiconductor wafer mounted on the handling arm R connected to the robot is taught and reinserted into the robot for measurement.
As shown in fig. 13 and 14, the semiconductor wafer W which does not exceed the deviation range is completely advanced, and if the semiconductor wafer W is completely advanced, the depth of the semiconductor wafer W is measured by the ninth laser sensor 27 at the rear lower side portion of the support plate 1 to measure whether the semiconductor wafer W is completely advanced, and the front-rear inclination of the semiconductor wafer (that is, the height of the front side or the rear side of the semiconductor wafer) is measured by the tenth laser sensor 28 and the third and fourth laser sensors 24 and 24 a.
Then, the depth of the semiconductor wafer W is measured by the eleventh laser sensor 29 disposed at the rear of the frame top plate 7 provided at the upper side portion of the holder shaft 3 on both sides, and whether or not the semiconductor wafer W has completely entered is measured, and the front-rear inclination of the semiconductor wafer is measured by the twelfth laser sensor 30 and the seventh and eighth laser sensors 26 and 26 a.
As described above, the measurement values of the lateral deviation, the lateral inclination, the depth, the front-back inclination, and the height of the semiconductor wafer can be confirmed by outputting the measurement values obtained by measuring the lateral deviation, the lateral inclination, the depth, the front-back inclination, and the height of the semiconductor wafer on the touch display panel 22, and the measurement values of the straightness, the flatness, the lateral deviation, the entry height, and the like of the semiconductor wafer can be confirmed, so that the test is completed by all the measurements and the calibration, and if it is determined that the operation arm is normally operated during the process operation, the teaching by the teaching measurement instrument of the present invention is completed.
All the measured measurement information may be stored in a central processing unit in the control box C, or may be transmitted to an external terminal such as a personal computer or a smart phone through an interface, which is based on wired or wireless communication, for management and storage.
As described above, according to the present invention, when a teaching task is performed to reset a manufacturing apparatus such as a manipulator, the following operational relationship between the manipulator and a wafer can be easily and accurately confirmed during teaching, and the position measurement and calibration of the manipulator can be accurately and easily performed.
On the other hand, in the present invention, the user can directly confirm the state of the semiconductor wafer by the naked eye, or can perform teaching while confirming the horizontal state, the left-right eccentricity, and the inclination, which will be described below.
As described above, the semiconductor wafer cassette is mounted on the reference plate of the loading table on which work is performed, and the hole block 20 disposed on the bottom surface of the support plate 1 is provided on the pins provided on the reference plate.
Next, the wafer W is mounted on the handling arm R connected to the robot, and then the holder grooves 2 formed inside the holder shafts 3 on both sides are formed (see fig. 1 to 8).
The wafer W may be inserted into both the lower side portion and the upper side portion, or may be selectively inserted into only the lower side portion or the upper side portion, respectively.
As described above, when the wafer W is inserted into the holder groove 2 by the operation arm R, the edge of the wafer W is inserted into the holder groove 2 and is mounted on the support shoulder 2c of the shelf shoulder 2a, and the rear edge portion of the wafer W is mounted on the support shoulder 4b of the stopper shaft 4, and when the wafer W enters the correct position, the wafer W is locked in the stopper groove 4a of the stopper shaft 4 formed on both sides and stops further entry.
As described above, if the insertion mounting of the wafer W is completed, in this case, the precision measurement of the level, height, right-left eccentricity, inclination, position, and the like of the wafer W is performed, and the portion where the error occurs stores test data after the recalibration until the normal operation is confirmed.
The height of the wafer when the wafer enters can be measured by the scale marks 5a marked on the scale 5, and if the states of the wafer mounted on the support shoulders 2c of the holder shafts 3 and the support shoulders 4b of the stopper shafts 4 on both sides are confirmed, the horizontal state, the left-right eccentricity, and the inclination can be confirmed, and all the measurements can be easily confirmed by naked eyes.
Even when the wafer W is picked up by the handling arm R in a state where the wafer W is inserted and mounted, the operator can easily check the operation relationship, that is, whether or not the wafer W is accurately loaded into the handling arm R and picked up, through the transparent window 6.
When the operation arm R enters, the first position measuring device P disposed in front of the holder shaft 3 moves the fixed measuring blocks 10 on both sides inward along the guide rail 8 in a state where the operation arm R is suspended, causes the measuring plates 13 on both sides to be closely attached to both side corners of the operation arm R, and then causes the scale indicating tips 16 on both sides to be located at the scale marks 17 to accurately measure and confirm the center at the time of entry or extraction of the operation arm R, thereby measuring the left and right decentering state.
Further, a first position measuring device P is disposed in front of the holder shaft 3 to measure straightness when the operation arm is taken in and out, and levelness and inclination can be measured by the scale marks 12 of the measuring plates 13 on both sides.
A leveling grade measuring instrument 18 disposed at a front side of the support plate 1 for measuring a left-side leveling state and a right-side leveling state measures a left-side leveling state and a right-side leveling state of a loading table on which wafers are placed.
The inclined surface 2b formed at the lower front side of the shelf shoulder 2a serves to prevent collision in advance when the arm for loading the wafer enters, and the protrusion of the support shoulders 2c, 4b minimizes the contact area of the wafer to prevent high-precision measurement in a horizontal state and damage to the wafer.
As described above, if the test is completed by all the measurements and calibrations and it is discriminated that the operation arm is normally operated when the process is operated, the teaching is completed by the measuring instrument for teaching of the present invention.
Next, a measurement method for teaching a semiconductor wafer using a measurement instrument according to another embodiment of the present invention will be described with reference to fig. 15.
The measurement method for teaching a semiconductor wafer using a measurement instrument includes: a first step S1 of turning ON (ON) by operating a power switch (not shown) of the surveying instrument; a second step S2, starting the window and the measuring program to automatically start working along with starting the measuring instrument by operating the power switch; a third step S3, executing automatic initialization work along with the work of the measuring program; a fourth step S4 of performing an automatic initialization operation along with the operation according to the measurement program, thereby completing the initialization; a fifth step S5 of, in the step of completing the initialization, starting the loading detection of the semiconductor wafer when the semiconductor wafer W starts to enter the rack groove 2, measuring the lateral deviation of the semiconductor wafer W by the first and second laser sensors 23 and 23a on the lower side and the fifth and sixth laser sensors 25 and 25a on the upper side, and if the deviation exceeds the deviation range, failing to load the semiconductor wafer and returning to the step of the initialization, and if the deviation does not exceed the deviation range, starting the loading of the semiconductor wafer W and measuring the lateral deviation.
The semiconductor wafer W may be inserted into the holder groove 2 into the lower side portion and the upper side portion at the same time, or may be selectively inserted into only the lower side portion or the upper side portion.
Accordingly, when the semiconductor wafer W is inserted into the holder groove 2 and enters the lower side portion and the upper side portion at the same time, the lateral deviation of the semiconductor wafer W is measured by the first laser sensor 23 and the second laser sensor 23a on the lower side portion and the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side portion, the lateral deviation is measured by the first laser sensor 23 and the second laser sensor 23a when the semiconductor wafer W enters only the holder groove 2 on the lower side portion, and the lateral deviation of the semiconductor wafer W is measured by the fifth laser sensor 25 and the sixth laser sensor 25a when the semiconductor wafer W enters only the holder groove 2 on the upper side portion.
The present invention further includes a sixth step S6 of measuring the lateral deviation of the semiconductor wafer by using the third and fourth laser sensors 24 and 24a on the lower side and the seventh and eighth laser sensors 26 and 26a on the upper side to measure the lateral tilt of the semiconductor wafer (i.e., the height of the left side or the height of the right side of the semiconductor wafer) if the lateral deviation does not exceed the deviation range, and starting the entry of the semiconductor wafer if the lateral deviation does not exceed the deviation range.
If the semiconductor wafer W is inserted into the holder groove 2 and entered into the lower side portion and the upper side portion at the same time in the fifth step S5, the lateral tilt of the semiconductor wafer W in the sixth step S6 is also measured by the third laser sensor 24 and the fourth laser sensor 24a on the lower side portion and the seventh laser sensor 26 and the eighth laser sensor 26a on the upper side portion, the lateral tilt is measured by the third laser sensor 24 and the fourth laser sensor 24a when the semiconductor wafer W is entered into only the holder groove 2 on the lower side portion, and the lateral tilt of the semiconductor wafer W is measured by the seventh laser sensor 26 and the eighth laser sensor 26a when the semiconductor wafer W is entered into only the holder groove 2 on the upper side portion.
The present invention further includes a seventh step S7 of measuring a lateral movement deviation and a lateral inclination of the semiconductor wafer W in the upper and lower portions by the first and second laser sensors 23 and 23a on the lower side, the fifth and sixth laser sensors 25 and 25a on the upper side, the third and fourth laser sensors 24 and 24a on the lower side, and the seventh and eighth laser sensors 26 and 26a on the upper side, respectively, after the semiconductor wafer W starts to move in through the sixth step S6, and performing a complete movement if the measured values do not exceed the deviation range.
The present invention further includes an eighth step S8 of, if the above-mentioned semiconductor wafer W is completely entered, performing depth measurement by the ninth laser sensor 27 on the lower side of the rear portion and the eleventh laser sensor 29 on the upper side, and performing measurement of the front-back tilt (i.e., the height of the front side or the height of the rear side of the semiconductor wafer) of the semiconductor wafer W by the tenth laser sensor 28 on the lower side and the third and fourth laser sensors 24 and 24a, and performing measurement of the front-back tilt of the semiconductor wafer W by the twelfth laser sensor 30 on the upper side and the seventh and eighth laser sensors 26 and 26a, and ending the measurement if the measured values do not exceed the deviation range.
As described above, since the lateral deviation and the lateral inclination, the depth, the front-back inclination, and the height of the semiconductor wafer can be measured, the measured values of the semiconductor wafer such as the straightness, the flatness, the lateral deviation, and the entry height into the teaching gauge can be checked.
Thus, the test is completed by all the measurements and calibrations, and if it is discriminated that the operation arm is normally operated during the process operation, the teaching by the teaching measurement instrument of the present invention is completed.
As described above, when a teaching task is performed to reset a manufacturing facility such as a manipulator based on measurement information obtained by the measurement method of the present invention, the following operational relationship between the manipulator and a wafer can be easily and accurately confirmed during teaching, and the position measurement and calibration of the manipulator can be accurately and easily performed.
Claims (5)
1. A metrology instrument for teaching semiconductor wafers, comprising:
a support shaft vertically disposed on both sides of the support plate, and having a plurality of support grooves formed in upper and lower portions thereof for inserting and mounting semiconductor wafers;
stop piece shafts vertically arranged at two rear side parts of the bracket shaft and used for fixing the semiconductor wafer at a correct position;
a frame top plate fixedly arranged at the upper end parts of the bracket shaft and the stop piece shaft;
a control box fixedly arranged between the bracket shafts at two sides and internally provided with a central processing unit which is configured with programs for executing detection functions and measurement functions;
a touch display panel which is arranged on the rear surface of the control box and can be viewed by displaying a measured value and operated by touch;
first and second laser sensors, which are respectively disposed at both sides of a lower portion of the support shaft at both sides, and are used to measure a lateral deviation of a semiconductor wafer, and third and fourth laser sensors, which are used to measure a lateral inclination of the semiconductor wafer; and
and a ninth laser sensor and a tenth laser sensor, which are arranged at the central part of the lower rear side of the support shaft on both sides, wherein the ninth laser sensor is used for measuring the depth of the semiconductor wafer, and the tenth laser sensor is used for measuring the front-back inclination of the semiconductor wafer.
2. The metrology instrument for teaching semiconductor wafers as claimed in claim 1, further comprising:
fifth and sixth laser sensors for measuring lateral deviation of the semiconductor wafer, and seventh and eighth laser sensors for measuring lateral inclination of the semiconductor wafer, which are disposed at both sides of a frame top plate provided at an upper side portion of the both side holder shafts;
and an eleventh laser sensor and a twelfth laser sensor, which are disposed at a rear center portion of the frame top plate provided at upper side portions of the holder shafts on both sides, the eleventh laser sensor measuring a depth of the semiconductor wafer, and the twelfth laser sensor measuring a front-rear tilt of the semiconductor wafer.
3. The measuring instrument for teaching semiconductor wafers as set forth in claim 1, wherein the holder groove of the holder shaft is formed by a shelf shoulder formed with an inclined portion at an entrance, a support shoulder formed to protrude to both sides on the shelf shoulder for mounting the semiconductor wafer, a stopper groove formed on the stopper shaft, and a support shoulder formed on the stopper groove for mounting the semiconductor wafer on the same horizontal line as the support shoulder.
4. The metrology instrument for semiconductor wafer teaching of claim 1,
a first position measuring device is arranged at the front side of the bracket shaft, guide rails are fixedly arranged at two sides of the first position measuring device, a measuring fixed block with a stop piece is inserted into the guide rails in a guiding mode through a rail block,
the measuring fixed block is provided with a measuring plate marked with position scales in a mode of rotating through a hinge shaft, the stop piece and the measuring plate are respectively fixedly provided with magnets with different polarities, the tail end of the measuring fixed block is fixedly provided with scale indicating tip parts, and the front parts of the scale indicating tip parts at two sides are provided with scale plates.
5. The metrology instrument for semiconductor wafer teaching of claim 1,
a horizontal measuring grade meter is arranged in front of the supporting plate and is used for measuring the left and right horizontal states,
a hole block for fixing the support plate to a stud during teaching is provided at a predetermined position of the support plate, and handles for moving during transportation or teaching are provided on both sides of the support plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210071929A KR102342264B1 (en) | 2021-06-03 | 2021-06-03 | Measuring instrument for calibration of semiconductor wafers |
| KR10-2021-0071929 | 2021-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115440122A true CN115440122A (en) | 2022-12-06 |
Family
ID=79164041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210399471.9A Pending CN115440122A (en) | 2021-06-03 | 2022-04-15 | Measuring instrument for teaching semiconductor wafer |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102342264B1 (en) |
| CN (1) | CN115440122A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114334757B (en) * | 2022-03-15 | 2022-05-24 | 广东高景太阳能科技有限公司 | Slide glass jig and carrying device for silicon wafer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100293906B1 (en) | 1992-11-17 | 2001-11-22 | 가끼자끼다께요시 | Resin Thin Plate Storage Container |
| US7095763B2 (en) * | 2001-12-17 | 2006-08-22 | Cyberoptics Semiconductor, Inc. | Semiconductor wafer carrier mapping sensor |
| KR20070105618A (en) * | 2006-04-27 | 2007-10-31 | 삼성전자주식회사 | Mapping apparatus of semiconductor device manufacturing equipment and mapping method thereof |
| KR101356774B1 (en) * | 2012-03-12 | 2014-01-27 | 최성훈 | Calibration device |
| KR101467551B1 (en) * | 2014-08-20 | 2014-12-02 | 정병철 | Teaching Jig for Swmiconductor Wafer |
-
2021
- 2021-06-03 KR KR1020210071929A patent/KR102342264B1/en active IP Right Grant
-
2022
- 2022-04-15 CN CN202210399471.9A patent/CN115440122A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR102342264B1 (en) | 2021-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101467551B1 (en) | Teaching Jig for Swmiconductor Wafer | |
| TWI512875B (en) | System and method for adjusting the position and orientation of a feed arm associated with a wafer handling robot | |
| US9111978B2 (en) | Substrate carrier measuring jig, collision preventing jig, and collision preventing method using the collision preventing jig | |
| EP0716905A2 (en) | Method and apparatus for automated docking of a test head to a device handler | |
| US8215890B2 (en) | Semiconductor wafer robot alignment system and method | |
| CN115440122A (en) | Measuring instrument for teaching semiconductor wafer | |
| JP5464468B2 (en) | Substrate inspection device and inspection jig | |
| US20170314905A1 (en) | Apparatus for the Computer Assisted Setup of a Machine Tool Table | |
| US20070214673A1 (en) | Tool-measuring apparatus for measuring a tool in a tool holder, and a tool holder | |
| CN115440608A (en) | Measurement method for semiconductor wafer teaching using a measuring instrument | |
| US20070260420A1 (en) | Automated calibration system | |
| CN112304272B (en) | Measuring apparatus and method for measuring flatness and height of battery module | |
| US20070260406A1 (en) | Automated location system | |
| CN115128522A (en) | Packaging structure, detection equipment and packaging precision control method of Hall probe | |
| CN219123192U (en) | Thimble height calibration jig and separating mechanism | |
| CN219466196U (en) | Calibration tool | |
| CN215952486U (en) | Measuring device and arrangement | |
| CN110442082B (en) | Method for improving precision of automatic boxing system | |
| CN218114235U (en) | Manipulator debugging module and load port debugging unit | |
| KR102579189B1 (en) | Secondary battery pouch sealing part automatic thickness measuring assembly and pouch sealing part automatic thickness measuring method thereby | |
| US11268797B2 (en) | Gauge inspection jig and gauge inspector | |
| KR100668754B1 (en) | Semiconductor wafer cassette indexer adjustment jig and adjustment method thereof | |
| KR100683117B1 (en) | Method for measuring tilt difference of platen in ion implant system and apparatus for the same | |
| KR100319685B1 (en) | Wafer probing apparatus and method | |
| KR100868628B1 (en) | Tool for aligning robot of semiconductor fabricating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |