CN115435299A - Edge protection method of LED module - Google Patents

Edge protection method of LED module Download PDF

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Publication number
CN115435299A
CN115435299A CN202211052351.8A CN202211052351A CN115435299A CN 115435299 A CN115435299 A CN 115435299A CN 202211052351 A CN202211052351 A CN 202211052351A CN 115435299 A CN115435299 A CN 115435299A
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Prior art keywords
led module
acrylic resin
modified acrylic
edge
silane
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Pending
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CN202211052351.8A
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Chinese (zh)
Inventor
李漫铁
梁劲豪
余亮
屠孟龙
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Ledman Optoelectronic Co Ltd
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Ledman Optoelectronic Co Ltd
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Priority to CN202211052351.8A priority Critical patent/CN115435299A/en
Publication of CN115435299A publication Critical patent/CN115435299A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides an edge protection method of an LED module, which comprises the following steps: and coating silane modified acrylic resin or silane modified acrylic resin containing nano particles on the periphery of the LED module, and curing to form a protective adhesive layer to protect the edge of the LED module. According to the LED module, the silane modified acrylic resin or the silane modified acrylic resin containing nano particles is coated on the peripheral edge of the LED module, so that on one hand, the height difference between the frame body and the unit plate can be filled and leveled, and the stress is more uniform, on the other hand, the silane modified acrylic resin or the silane modified acrylic resin containing nano particles is used as a protective adhesive, and meanwhile, the mechanical strength of the acrylic resin and the flexibility of organic silicon are considered, so that the impact resistance of the edge of the module is greatly improved, and the probability of edge lamp death caused by module collision is reduced.

Description

Edge protection method of LED module
Technical Field
The invention belongs to the technical field of LED modules, and relates to an edge protection method of an LED module.
Background
The LED module generally fixes corresponding LED chips on a Printed Circuit Board (PCB) unit board, and then encapsulates the LED chips with an encapsulant. The sealant material is mainly epoxy resin, which has high hardness but high brittleness. And then combining the packaged unit plates and the frame body to form the LED module, wherein the unit plates in the module slightly protrude out of the frame body of the module, and no additional protective measures are taken at the edge of the LED module.
In the transportation, installation and maintenance process of LED module, the module atress is easily concentrated on the cell board, leads to the epoxy fracture to arouse dead lamp, influence demonstration.
CN210401951U discloses a PCB board protective layer, backlight unit and liquid crystal display device, wherein, PCB board protective layer laminating is in PCB board surface, be provided with LED drive module on the PCB board, LED drive module includes inductance component, PCB board protective layer includes: aluminum foil used as a base material; and the polyester film is attached to the aluminum foil, wherein an opening is formed in the aluminum foil, and the opening corresponds to the LED driving module. That is, the utility model discloses a protect the PCB board, it does not protect the edge of LED module.
CN211260480U discloses an LED lamp and PCB module, which comprises a PCB (10), an LED lamp (20) connected to the PCB (10), and an LED protective cover (30), wherein the LED protective cover (30) covers the periphery of the LED lamp (20); be equipped with a plurality of interval distribution's locating hole (11) on PCB board (10), be equipped with a plurality of elasticity pothook (40) on LED safety cover (30), it is a plurality of elasticity pothook (40) one-to-one passes a plurality of locating hole (11) and with PCB board (10) butt. That is, the utility model discloses a protect the LED lamp through the LED safety cover, it does not protect the edge of LED module.
Therefore, it is desirable in the art to develop an edge protection method for an LED module to reduce damage to the module due to collision.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide an edge protection method of an LED module, which can reduce the damage of the module caused by collision and is simple and convenient and low in cost.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an edge protection method for an LED module, including the steps of:
and coating silane modified acrylic resin or silane modified acrylic resin containing nano particles on the periphery of the LED module, and curing to form a protective adhesive layer to protect the edge of the LED module.
In the LED module, the PCB unit board slightly protrudes out of the frame body of the module, the silane modified acrylic resin is coated on the peripheral edge of the LED module, on one hand, the height difference between the frame body and the unit board can be filled and leveled, so that the stress is more uniform, on the other hand, the silane modified acrylic resin or the silane modified acrylic resin containing nano particles is used as protective glue, the mechanical strength of the acrylic resin and the flexibility of organic silicon are considered, the impact resistance of the edge of the module are greatly improved, the probability of lamp death at the edge caused by module collision is reduced, in addition, after the nano particles are added into the silane modified acrylic resin, the wear resistance of the protective glue can be improved, in addition, when the silane modified acrylic resin containing the nano particles is selected as the protective glue, the edge of the protective glue is in an arc lens shape, the light emitting angle of the side edge of an LED can be improved, the light emitting amount at the front side face of the edge is increased, and the side light emitting is reduced.
According to the preferable technical scheme, the LED module comprises a frame body, and a printed circuit board layer, an LED chip layer and a sealing material layer which are sequentially stacked, wherein the frame body is located below the printed circuit board layer, and the frame body is bonded with the printed circuit board layer through glue. Wherein, the material of the sealing compound material layer is epoxy resin. The LED module is a conventional LED module.
In a preferred embodiment of the present invention, the silane-modified acrylic resin is KRN8333.
In a preferred embodiment of the present invention, the nanoparticles have a particle size of 8 to 20nm, for example, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm or 20nm, but the particle size is not limited to the above-mentioned values, and other values not listed in the above-mentioned value range are also applicable.
Preferably, the nanoparticles comprise ZnO and/or TiO 2 。
In a preferred embodiment of the present invention, the content of the nanoparticles is 1 to 4%, for example, 1%, 2%, 3%, or 4% based on 100% by mass of the nanoparticle-containing silane-modified acrylic resin.
It should be noted that the method for preparing the nanoparticle-containing silane-modified acrylic resin is not particularly limited, and for example, the nanoparticles and the silane-modified acrylic resin may be directly mixed to obtain the nanoparticle-containing silane-modified acrylic resin, wherein both the nanoparticles and the silane-modified acrylic resin may be commercially available.
Preferably, the silane modified acrylic resin containing the nano particles is ZnO-20 produced by Nanjing Ai Purui.
In a preferred embodiment of the present invention, the curing temperature is normal temperature, and the curing time is 12-16h, for example, 12h, 13h, 14h, 15h, or 16h.
In a preferred embodiment of the present invention, the thickness of the protective adhesive layer is less than 20 μm, for example, 19 μm, 18 μm, 17 μm, 16 μm, 15 μm, 14 μm, 13 μm, 12 μm, 11 μm, 10 μm, 9 μm, 8 μm, 7 μm, 6 μm, or 5 μm, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
On the premise of ensuring the shock resistance, the thickness of the formed protective adhesive layer can be controlled to be below 20 mu m and is smaller than 100 mu m of the reserved gap for module installation, and the installation is not obviously influenced.
As a preferable technical scheme of the invention, the thickness of the protective adhesive layer is 5-15 μm.
As a preferred technical scheme of the invention, after the silane modified acrylic resin or the silane modified acrylic resin containing the nano particles is coated on the periphery of the LED module, the method further comprises the following steps:
and coating silane modified acrylic resin or silane modified acrylic resin containing nano particles on the upper surfaces of the four corners of the LED module.
In a preferred embodiment of the present invention, the four corners of the LED module are chamfered before the silane-modified acrylic resin containing nanoparticles is applied to the upper surfaces of the four corners of the LED module.
It should be noted that the length of the right-angle side of the four corners to be coated is not particularly limited, and the specific length can be determined according to actual requirements.
As described above, the LED module includes a frame body, and a printed circuit board layer, an LED chip layer, and a sealant layer sequentially stacked on the frame body, where the upper surface refers to a surface contacting with the sealant layer.
Because the silane modified acrylic resin is completely transparent after being cured and has a refractive index close to that of the epoxy resin, the silane modified acrylic resin can be further coated on the upper surfaces of the four corners of the LED module, so that more excellent shock resistance can be obtained, and after the nano particles are added into the silane modified acrylic resin, the refractive index of the obtained protective adhesive is increased from original about 1.4 to 1.5-1.53, which is equivalent to that of the epoxy resin, so that the silane modified acrylic resin containing the nano particles can be further coated on the upper surfaces of the four corners of the LED module.
In a preferred embodiment of the invention, the coating has a thickness of less than 20 μm, for example 19 μm, 18 μm, 17 μm, 16 μm, 15 μm, 14 μm, 13 μm, 12 μm, 11 μm, 10 μm, 9 μm, 8 μm, 7 μm, 6 μm or 5 μm, but is not limited to the values listed and other values not listed within this range are equally applicable.
Preferably, the thickness of the coating is 5-15 μm.
Compared with the prior art, the invention has the following beneficial effects:
in the LED module, the PCB unit board slightly protrudes out of the frame body of the module, the silane modified acrylic resin is coated on the peripheral edge of the LED module, on one hand, the height difference between the frame body and the unit board can be filled and leveled, so that the stress is more uniform, on the other hand, the silane modified acrylic resin or the silane modified acrylic resin containing nano particles is used as protective glue, the mechanical strength of the acrylic resin and the flexibility of organic silicon are considered, the impact resistance of the edge of the module is greatly improved, the probability of lamp death at the edge caused by collision of the module is reduced, in addition, after the nano particles are added into the silane modified acrylic resin, the wear resistance of the protective glue can be improved, in addition, when the silane modified acrylic resin containing the nano particles is selected as the protective glue, the edge of the protective glue is in the shape of an arc lens, the light emitting angle of the side edge of the LED can be improved, the light emitting amount of the front side face of the edge is increased, and the light emitting amount of the side face is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a three-view of a conventional LED module provided in comparative example 1.
Fig. 2 is a schematic structural diagram of a three-view LED module coated with silane-modified acrylic resin in four sides according to embodiment 1.
Fig. 3 is a schematic structural diagram of a three-view LED module provided in embodiment 2, wherein the four sides and the upper surfaces of the four corners of the LED module are coated with silane-modified acrylic resin.
Fig. 4 (a) and fig. 4 (b) are schematic diagrams of light extraction efficiency before and after protection of the LED module provided in embodiment 3, respectively.
Fig. 5 is a schematic structural diagram of an LED module provided in example 4, in which the four sides and the upper surfaces of the four corners are coated with silane-modified acrylic resin containing nanoparticles.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
The relevant information of the raw materials used in the embodiment of the invention is as follows:
silane-modified acrylic resin: under the trademark KRN8333.
Silane modified acrylic resin containing nanoparticles: the trade mark is ZnO-20 produced by Nanjing Ai Purui.
Comparative example 1
In this comparative example, a conventional LED module (a schematic structural diagram of three views is shown in fig. 1) is provided, which includes a frame, and a printed circuit board layer, an LED chip layer, and a sealant layer stacked in sequence, wherein the frame is located below the printed circuit board layer, and the sealant layer is made of epoxy resin.
That is, the present comparative example does not protect the edge of the LED module.
Example 1
In this embodiment, a method for protecting an edge of an LED module is provided, which includes the following steps:
and coating silane modified acrylic resin on the periphery of the LED module, and curing for 14h at normal temperature to form a protective adhesive layer with the thickness of 10 microns to protect the edge of the LED module.
The LED module comprises a frame body, a printed circuit board layer, an LED chip layer and a sealing material layer, wherein the printed circuit board layer, the LED chip layer and the sealing material layer are sequentially stacked, the frame body is located below the printed circuit board layer, and the sealing material layer is made of epoxy resin.
Fig. 2 is a schematic structural diagram of a three-view LED module with silane-modified acrylic resin coated on the periphery thereof. As can be seen from the enlarged view encircled by the square frame in the figure, the periphery of the LED module is protected.
Example 2
In this embodiment, a method for protecting an edge of an LED module is provided, which specifically includes the following steps:
silane modified acrylic resin is coated on the periphery of the LED module and the upper surfaces of the four corners of the LED module, and is cured for 14 hours at normal temperature to form a protective adhesive layer with the thickness of 10 microns, so that the edges of the LED module are protected.
The LED module comprises a frame body, a printed circuit board layer, an LED chip layer and a sealing material layer, wherein the printed circuit board layer, the LED chip layer and the sealing material layer are sequentially stacked, the frame body is located below the printed circuit board layer, and the sealing material layer is made of epoxy resin.
Fig. 3 is a schematic structural diagram of three views of an LED module with silane-modified acrylic resin coated on the four sides and the upper surfaces of the four corners. As can be seen from the enlarged view encircled by the square frame in the figure, the periphery of the LED module and the upper surfaces of the four corners are protected.
Example 3
In this embodiment, a method for protecting an edge of an LED module is provided, which specifically includes the following steps:
and coating silane modified acrylic resin containing nano particles on the periphery of the LED module, and curing for 14h at normal temperature to form a protective adhesive layer with the thickness of 10 mu m to protect the edge of the LED module.
The LED module comprises a frame body, a printed circuit board layer, an LED chip layer and a sealing material layer, wherein the printed circuit board layer, the LED chip layer and the sealing material layer are sequentially stacked, the frame body is located below the printed circuit board layer, and the sealing material layer is made of epoxy resin.
In this embodiment, the periphery of the LED module is protected by using the silane modified acrylic resin containing the nanoparticles, and the edge of the protective adhesive formed by curing the silane modified acrylic resin containing the nanoparticles is in the shape of an arc lens, which can improve the light-emitting angle of the side edge of the LED, increase the light-emitting amount of the front surface of the edge, and reduce the light-emitting from the side surface, as shown in fig. 4 (a) and 4 (b), fig. 4 (a) is a schematic diagram of the light-emitting efficiency before coating (protection), and fig. 4 (b) is a schematic diagram of the light-emitting efficiency after coating (protection).
Example 4
In this embodiment, a method for protecting an edge of an LED module is provided, which specifically includes the following steps:
coating silane modified acrylic resin containing nano particles on the periphery of the LED module, chamfering four corners of the sealing material layer, filling the chamfer with the silane modified acrylic resin containing the nano particles, curing for 14h at normal temperature to form a protective adhesive layer with the thickness of 10 mu m, and protecting the edge of the LED module.
The LED module comprises a frame body, a printed circuit board layer, an LED chip layer and a sealing material layer, wherein the printed circuit board layer, the LED chip layer and the sealing material layer are sequentially stacked, the frame body is located below the printed circuit board layer, and the sealing material layer is made of epoxy resin.
Fig. 5 is a schematic structural diagram of an LED module in which the four sides and the upper surfaces of the four corners are coated with silane modified acrylic resin containing nanoparticles.
The edge protection method provided by the embodiment can provide better protection performance on the premise of not influencing the light extraction efficiency.
Comparative example 2
This comparative example differs from example 1 only in that the thickness of the protective adhesive layer was 25 μm.
The LED modules provided by the examples and the comparative examples are subjected to an impact resistance test, and the test method comprises the following steps: three sets of experiments were repeated on the LED modules provided in each example and comparative example using a 115g weight dropped vertically from a height of 0.5m to impact the edge of the LED module, and the number of times of lamp death of each set of experiments was recorded, and the test results are shown in table 1:
TABLE 1
Figure BDA0003823861890000081
As can be seen from table 1, compared with comparative example 1, the embodiment of the present invention protects the edge of the LED module, and the number of times of lamp failure of the corresponding LED module is significantly reduced. Although comparative example 2 has a smaller number of times of dead lamps compared to example 1, subsequent installation is affected due to an excessively thick protective paste.
The post-curing appearance, the post-curing lighting condition, the post-impact appearance, and the post-impact lighting condition of the LED modules provided in example 1 and comparative example 1 were compared, and the results are shown below:
Figure BDA0003823861890000091
it can be seen that the appearance after impact and the lighting condition after impact of the LED module provided in example 1 are not significantly changed from before impact, while the LED module provided in comparative example 1 has a dead light phenomenon (area encircled by an oval circle) after impact.
The applicant states that the present invention describes the edge protection method of the LED module according to the present invention through the above embodiments, but the present invention is not limited to the above embodiments, i.e. it does not mean that the present invention must be implemented by the above embodiments. It will be apparent to those skilled in the art that any modifications to the present invention, equivalent substitutions of selected materials and additions of auxiliary components, selection of specific forms, etc., are within the scope and disclosure of the present invention.

Claims (10)

1. An edge protection method of an LED module is characterized by comprising the following steps:
and coating silane modified acrylic resin or silane modified acrylic resin containing nano particles on the periphery of the LED module, and curing to form a protective adhesive layer to protect the edge of the LED module.
2. The method for protecting the edge of the LED module according to claim 1, wherein the LED module comprises a frame body, and a printed circuit board layer, an LED chip layer and a sealant layer which are sequentially stacked, wherein the frame body is located below the printed circuit board layer.
3. The method for protecting the edge of the LED module according to claim 1 or 2, wherein the silane-modified acrylic resin is KRN8333.
4. The method for protecting the edge of the LED module according to any one of claims 1 to 3, wherein the nanoparticles have a particle size of 8 to 20nm;
preferably, the nanoparticles comprise ZnO and/or TiO 2 。
5. The method for protecting the edge of the LED module according to any one of claims 1 to 4, wherein the content of the nanoparticles is 1 to 4% based on 100% by mass of the silane-modified acrylic resin containing the nanoparticles;
preferably, the grade of the silane modified acrylic resin containing the nano particles is ZnO-20 produced by Nanjing Ai Purui.
6. The method for protecting the edge of the LED module according to any one of claims 1 to 5, wherein the curing temperature is normal temperature, and the curing time is 12 to 16 hours.
7. The method for protecting the edge of the LED module according to any one of claims 1 to 6, wherein the thickness of the protective adhesive layer is less than 20 μm.
8. The method for protecting the edge of the LED module according to any one of claims 1 to 7, wherein the thickness of the protective adhesive layer is 5 to 15 μm.
9. The method for protecting the edge of the LED module according to any one of claims 1 to 8, wherein after the silane-modified acrylic resin or the silane-modified acrylic resin containing the nanoparticles is coated around the LED module, the method further comprises the following steps:
and coating silane modified acrylic resin or silane modified acrylic resin containing nano particles on the upper surfaces of the four corners of the LED module.
10. The method of claim 9, wherein the coating has a thickness of less than 20 μm;
preferably, the thickness of the coating is 5-15 μm.
CN202211052351.8A 2022-08-31 2022-08-31 Edge protection method of LED module Pending CN115435299A (en)

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Application Number Priority Date Filing Date Title
CN202211052351.8A CN115435299A (en) 2022-08-31 2022-08-31 Edge protection method of LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211052351.8A CN115435299A (en) 2022-08-31 2022-08-31 Edge protection method of LED module

Publications (1)

Publication Number Publication Date
CN115435299A true CN115435299A (en) 2022-12-06

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