CN115433900B - Mask plate and evaporation device - Google Patents
Mask plate and evaporation device Download PDFInfo
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- CN115433900B CN115433900B CN202211203376.3A CN202211203376A CN115433900B CN 115433900 B CN115433900 B CN 115433900B CN 202211203376 A CN202211203376 A CN 202211203376A CN 115433900 B CN115433900 B CN 115433900B
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- mask plate
- evaporation
- frame
- mask
- groove
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- 230000008020 evaporation Effects 0.000 title claims abstract description 113
- 238000001704 evaporation Methods 0.000 title claims abstract description 113
- 230000005291 magnetic effect Effects 0.000 claims abstract description 41
- 210000001503 joint Anatomy 0.000 claims abstract description 14
- 238000007740 vapor deposition Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 6
- 238000007747 plating Methods 0.000 abstract description 26
- 239000002184 metal Substances 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses mask plate, including being used for with the relative evaporation plating surface of evaporation plating source and deviating from the butt joint face of evaporation plating surface one side, the mask plate still includes at least one evaporation plating area and first frame district, and first frame district is located evaporation plating area at least one side of first direction, and first direction is parallel with the net direction of opening of mask plate, is equipped with at least one first recess in the first frame district, and the opening of first recess is located the evaporation plating surface, and the extending direction of first recess is parallel with first direction. The application also discloses evaporation device, including foretell mask plate and braced frame, the mask plate is fixed in on the braced frame. The utility model discloses a mask plate through setting up the first frame district in evaporation zone one side and the first recess in the first frame district, can reduce the metal level in first frame district, reduces the weight in first frame district, reduces the magnetic force that first frame district received, and then reduces the edge in evaporation zone because of the deformation that magnetic force brought.
Description
Technical Field
The application belongs to the technical field of evaporation, and especially relates to a mask plate and evaporation device.
Background
At present, in the preparation of an Organic Light-Emitting Diode (OLED) display panel, an evaporation process is adopted to form a luminescent material layer, and a precision mask plate is required in the evaporation process. The precision mask plate is made of Invar (nickel-iron alloy) material with extremely low thermal expansion rate, and the Invar material has magnetism and can be magnetized by a ferromagnetic plate in an evaporation cavity.
The evaporation area of the mask plate comprises a hollowed-out structure such as a mask opening, the metal amount is less than that of other positions on the mask plate, and the weight of the evaporation area is small. The edge of the evaporation area is a transition area of metal quantity, the magnetic force applied to the precise mask plate is changed in the area, the area is easily influenced by a magnetic field to deform, and then evaporation deviation is caused to influence the evaporation precision, so that the yield of the display panel is influenced.
Disclosure of Invention
The embodiment of the application provides a mask plate, which can reduce the deformation of the edge of an evaporation zone caused by magnetic force.
On the one hand, this application embodiment provides a mask, including being used for with the relative evaporation plating surface of evaporation plating source and deviating from the butt joint face of evaporation plating surface one side, the mask still includes at least one evaporation plating area and first frame district, first frame district is located evaporation plating area in at least one side of first direction, first direction is parallel with the net direction of opening of mask, is equipped with at least one first recess in the first frame district, the opening of first recess is located the evaporation plating surface, the extending direction of first recess is parallel with first direction.
According to an embodiment of the first aspect of the present application, the depth of the first recess decreases gradually in a direction away from the evaporation zone.
According to an embodiment of the first aspect of the present application, the two first frame regions are separately disposed on two sides of the same evaporation area in the first direction.
According to an embodiment of the first aspect of the present application, the number of first grooves in the two first frame regions located at both sides of the same evaporation region is equal; preferably, the depths of the first grooves in the two first frame areas positioned at two sides of the same evaporation area are equal; preferably, the lengths of the first grooves in the first direction in the two first frame regions positioned on two sides of the same evaporation region are equal.
According to an embodiment of the first aspect of the present application, the vapor deposition device further comprises a second frame area, the second frame area is located at least one side of the vapor deposition area in a second direction, the second direction intersects the first direction, at least one second groove is arranged in the second frame area, an opening of the second groove is located on the vapor deposition surface, and an extending direction of the second groove is parallel to the first direction; preferably, the first frame area and the second frame area are connected with each other and are enclosed on the periphery of the same evaporation area; preferably, the mask plate comprises a plurality of evaporation areas, and a first frame area and a second frame area are arranged on the periphery of each evaporation area; preferably, the number of the second grooves is multiple, the second grooves are arranged at intervals along the second direction, and the depth of the former second groove is greater than that of the latter second groove along the direction close to the evaporation zone.
According to an embodiment of the first aspect of the present application, the two second frames are separately disposed on two sides of the same evaporation area in the second direction.
According to an embodiment of the first aspect of the present application, the number of second grooves in the two second frame areas located at two sides of the same evaporation area is equal; preferably, the depths of the second grooves in the two second frame areas positioned at two sides of the same evaporation area are equal; preferably, the lengths of the second grooves in the two second frame areas positioned at two sides of the same evaporation area in the first direction are equal.
According to an embodiment of the first aspect of the present application, the depth of the second recess decreases gradually in a direction away from the evaporation zone.
According to an embodiment of the first aspect of the present application, the cross-sectional shape of the first groove and the second groove in the first direction is one or more of polygonal, circular, elliptical.
On the other hand, the embodiment of the application also provides an evaporation device, which comprises the mask plate and the support frame of any one of the embodiments, wherein the mask plate is fixed on the support frame.
The mask plate that this application provided through setting up in the first frame district of evaporation zone one side and the first recess in the first frame district, can reduce the metal level in first frame district, reduces the weight in first frame district, reduces the magnetic force that first frame district received, and then reduces the edge in evaporation zone because of the deformation that magnetic force brought. The evaporation area is larger in stress in the net pulling direction and is easier to deform, and the deformation of the evaporation area at the edge in the net pulling direction caused by magnetic force can be better improved through the first frame area arranged in the first direction and the first groove extending in the first direction, wherein the first direction is parallel to the net pulling direction of the mask plate. The first groove is positioned on the vapor plating surface through the opening, and because the first groove does not penetrate through the mask plate, the first frame area is a complete plane on the butt joint surface, the influence of the first groove on the lamination of the mask plate and the substrate to be vapor plated can be improved, and the vapor plating effect is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.
Fig. 1 is a schematic top view of a mask plate according to some embodiments of the present disclosure;
FIG. 2 illustrates an exemplary cross-sectional view of the mask plate of FIG. 1 at section A-A;
FIG. 3 illustrates an exemplary cross-sectional view of the mask plate of FIG. 1 at section B-B;
FIG. 4 illustrates another example cross-sectional view of the mask plate of FIG. 1 at section B-B;
FIG. 5 shows a schematic top view of another example mask;
FIG. 6 shows a schematic top view of another example mask;
FIG. 7 shows a cross-sectional view of an example of the mask of FIG. 6 at section C-C;
FIG. 8 shows a schematic top view of another exemplary mask;
FIG. 9 shows another example cross-sectional view of the mask of FIG. 6 at section C-C;
FIG. 10 shows another example cross-sectional view of the mask of FIG. 6 at section C-C;
fig. 11 is a schematic top view of a vapor deposition apparatus according to some embodiments of the present disclosure.
Reference numerals:
10. a mask plate; 11. steaming and plating the surface; 12. a butt joint surface; 13. an evaporation zone;
20. a first frame region; 21. a first groove;
30. a second frame region; 31. a second groove;
40. a support frame; 41. a frame; 42. a support bar;
x, a first direction; y, second direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present application are described in detail below to make the objects, technical solutions and advantages of the present application more apparent, and to further describe the present application in conjunction with the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative of the application and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
The applicant finds that in the prior art, the vapor deposition area of the mask plate has less metal than other positions on the mask plate due to the hollow structure such as the mask opening, and the weight of the vapor deposition area is small. The edge of the evaporation area is a transition area of metal quantity, the magnetic force applied to the mask plate is changed in the area, the area is easily influenced by a magnetic field to deform, and then evaporation deviation is caused to influence the evaporation precision, so that the yield of the display panel is influenced.
In view of the above, the applicant proposes a mask plate, including a deposition surface opposite to a deposition source and a butt-joint surface facing away from one side of the deposition surface, the mask plate further includes at least one deposition area and a first frame area, the first frame area is located at least one side of the deposition area in a first direction, the first direction is parallel to a net-opening direction of the mask plate, at least one first groove is disposed in the first frame area, an opening of the first groove is located on the deposition surface, and an extending direction of the first groove is parallel to the first direction.
The mask plate that this application provided through setting up in the first frame district of evaporation zone one side and the first recess in the first frame district, can reduce the metal level in first frame district, reduces the weight in first frame district, reduces the magnetic force that first frame district received, and then reduces the edge in evaporation zone because of the deformation that magnetic force brought. The evaporation area is larger in stress in the net pulling direction and is easier to deform, and the deformation of the evaporation area at the edge in the net pulling direction caused by magnetic force can be better improved through the first frame area arranged in the first direction and the first groove extending in the first direction, wherein the first direction is parallel to the net pulling direction of the mask plate. The first groove is positioned on the vapor plating surface through the opening, and because the first groove does not penetrate through the mask plate, the first frame area is a complete plane on the butt joint surface, the influence of the first groove on the lamination of the mask plate and the substrate to be vapor plated can be improved, and the vapor plating effect is ensured.
The mask plate provided by the embodiment of the application is described below. In this description, the x-direction in the drawing is the first direction, and the y-direction is the second direction.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic top view of a mask plate according to some embodiments of the present application; FIG. 2 illustrates an exemplary cross-sectional view of the mask plate of FIG. 1 at section A-A.
As shown in fig. 1 and 2, the present embodiment provides a mask plate 10, which includes a vapor plating surface 11 opposite to a vapor plating source (not shown) and a butt-joint surface 12 facing away from the vapor plating surface 11. In the vapor deposition process of the display panel (not shown), the vapor deposition source is located below the mask plate 10, and the butt joint surface 12 of the mask plate 10 is attached to the substrate (not shown) to be vapor deposited in the display panel. A magnet (not shown) is arranged on one side of the substrate to be evaporated, which is away from the mask plate 10, that is, the magnet is located on one side of the butt joint surface 12 of the mask plate 10. The magnet is used for adsorbing the mask plate 10, so that the mask plate 10 is attached to the substrate to be evaporated against the action of gravity. The mask plate 10 further comprises at least one evaporation zone 13 and a first frame zone 20, wherein the first frame zone 20 is located at least one side of the evaporation zone in a first direction (x direction in the figure), and the first direction (x direction in the figure) is parallel to the net-stretching direction of the mask plate 10. At least one first groove 21 is disposed in the first frame region 20, an opening of the first groove 21 is located on the plating surface 11, and an extending direction of the first groove 21 is parallel to a first direction (x direction in the drawing).
On the mask plate 10, the vapor deposition area 13 has a hollow structure such as a mask opening, so that the metal amount is smaller than that of other positions on the mask plate 10, and the weight of the vapor deposition area 13 is small. The first frame region 20 is located at the edge of the evaporation region 13 and is a transition region of metal amount, and the magnetic force applied to the mask plate 10 will also change in this region, so that the first frame region 20 is easily affected by the magnetic field and deformed. The mask plate 10 that this application provided through setting up the first recess 21 in the first frame district 20 of evaporation zone 13 one side and first frame district 20, can reduce the metal quantity in first frame district 20, reduces the weight in first frame district 20, reduces the magnetic force that first frame district 20 received, and then reduces the edge in evaporation zone 13 because of the deformation that magnetic force brought. The deformation of the evaporation area 13 in the drawing direction is more easily caused by the larger stress of the evaporation area 13 in the drawing direction, and the deformation of the edge of the evaporation area 13 in the drawing direction due to the magnetic force can be better improved by the first frame area 20 arranged in the first direction (x direction in the drawing) and the first groove 21 extending in the first direction (x direction in the drawing) which is parallel to the net-opening direction of the mask plate 10. The first groove 21 with the opening located on the vapor plating surface 11 is provided, and the first groove 21 does not penetrate through the mask plate 10, so that the first frame area 20 is a complete plane on the butt joint surface 12, the influence of the first groove 21 on the lamination of the mask plate and the substrate to be vapor plated can be improved, and the vapor plating effect is ensured.
In addition, for the technical scheme that the opening of the first groove 21 is located on the butt joint surface 12, the plane integrity of the butt joint surface 12 is not affected, and the situation that the butt joint surface 12 is subjected to the combined action of gravity, the magnetic force of the magnet and the extrusion force of the substrate to be evaporated at the same time and is deformed seriously due to the fact that the opening of the first groove 21 is arranged on the butt joint surface 12 is improved.
Referring to fig. 3 and 4, fig. 3 shows a cross-sectional view of an exemplary mask plate in fig. 1 at section B-B; fig. 4 shows another example of a cross-sectional view of the mask plate of fig. 1 at section B-B.
As shown in fig. 3 and 4, in some alternative embodiments, the depth of the first recess 21 decreases gradually in a direction away from the evaporation zone 13.
The utility model provides a mask plate 10 is through the first recess 21 that reduces gradually along the direction degree of depth that deviates from evaporation zone 13 for the magnetic force that first frame district 20 received reduces gradually along the direction that is close to evaporation zone 13, and the magnetic force that mask plate 10 received is at the steady transition of first frame district 20 position, further reduces the deformation of mask plate 10.
The depth of the first recess 21 decreases gradually in a direction away from the evaporation zone 13, and the gradually decreasing manner may be a linear decrease (as shown in fig. 3) or a stepwise decrease (as shown in fig. 4).
Referring to fig. 5, fig. 5 shows a schematic top view of another exemplary mask plate.
In some alternative embodiments, as shown in fig. 5, two first frame regions 20 are disposed on both sides of the same vapor deposition region 13 in the first direction (x direction in the drawing).
The mask plate 10 provided by the application is through two first frame areas 20 that set up respectively in same evaporation zone 13 both sides for the magnetic force that mask plate 10 received in evaporation zone 13 both sides is as close as possible, improves mask plate 10 because of the deformation that magnetic force caused better.
In some alternative embodiments, the number of first grooves 21 in two first border regions 20 located on both sides of the same vapor deposition region 13 is equal.
In some alternative embodiments, the depths of the first grooves 21 in the two first border regions 20 located on both sides of the same vapor deposition region 13 are equal.
In some alternative embodiments, the lengths of the first grooves 21 in the first direction (x direction in the drawing) in the two first frame regions 20 located on both sides of the same vapor deposition region 13 are equal.
The mask plate 10 that this application provided is through the quantity, degree of depth, the length that are located two first recesses 21 in the first frame district 20 of 13 both sides of same evaporation zone, and the magnetic force that makes mask plate 10 receive in the evaporation zone 13 both sides is as close as possible, further reduces the deformation of mask plate 10.
Referring to fig. 6 and 7, fig. 6 illustrates a schematic top view of another exemplary mask plate; fig. 7 shows a cross-sectional view of an example of the mask of fig. 6 at section C-C.
As shown in fig. 6 and 7, in some alternative embodiments, the mask plate 10 may further include a second frame region 30, where the second frame region 30 is located on at least one side of the evaporation region 13 in a second direction (y direction in the drawing), and the second direction (y direction in the drawing) intersects the first direction (x direction in the drawing). At least one second groove 31 is disposed in the second frame region 30, an opening of the second groove 31 is located on the plating surface 11, and an extending direction of the second groove 31 is parallel to the first direction (x direction in the drawing).
The mask plate 10 provided by the application reduces the metal quantity of the second frame area 30, reduces the weight of the second frame area 30, reduces the magnetic force born by the second frame area 30 and further reduces the deformation of the edge of the evaporation area 13 caused by the magnetic force through the second frame area 30 arranged at one side of the evaporation area 13 along the second direction (y direction in the figure) and the second groove 31 on the second frame area 30. The extending direction of the second groove 31 is parallel to the net pulling direction of the mask plate 10, so that the deformation of the mask plate 10 is further reduced. The second groove 31 with the opening on the vapor deposition surface 11, because the second groove 31 does not penetrate through the mask plate 10, the first frame region 20 is a complete plane on the abutting surface 12, and the second groove 31 reduces the deformation of the edge of the vapor deposition region 13 caused by magnetic force, and does not reduce the rigidity of the mask plate 10.
In some alternative embodiments, the first border region 20 and the second border region 30 are connected to each other and enclose the perimeter of the same vapor deposition region 13.
The mask plate 10 that this application provided through enclosing in the first frame district 20 and the second frame district 30 of same coating by vaporization district 13 week side, makes the magnetic force that the edge homoenergetic all around of mask plate 10 received through first recess 21, second recess 31 reduction, can improve the deformation that the edge atress condition is inconsistent and cause around the mask plate 10 better.
Referring to fig. 8, fig. 8 shows a schematic top view of another exemplary mask plate.
In some alternative embodiments, as shown in fig. 8, the mask plate 10 includes a plurality of vapor deposition regions 13, and a first frame region 20 and a second frame region 30 are disposed on a peripheral side of each vapor deposition region 13.
In some alternative embodiments, two second frame regions 30 are separately disposed on both sides of the same vapor deposition region 13 in the second direction (y direction in the drawing).
The mask plate 10 provided by the application is provided with the two second frame areas 30 which are respectively arranged at the two sides of the same evaporation area 13, so that the magnetic force born by the mask plate 10 at the two sides of the evaporation area 13 is as close as possible, and the deformation of the mask plate 10 caused by the magnetic force is better improved.
In some alternative embodiments, the number of second grooves 31 in two second border regions 30 located on both sides of the same vapor deposition region 13 is equal.
In some alternative embodiments, the depths of the second grooves 31 in the two second border regions 30 located on both sides of the same vapor deposition region 13 are equal.
In some alternative embodiments, the lengths of the second grooves 31 in the first direction (x direction in the drawing) in the two second frame regions 30 located at both sides of the same vapor deposition region 13 are equal.
The mask plate 10 that this application provided is through the quantity, degree of depth, the length that are located the second recess 31 in two second frame district 30 of 13 both sides of same evaporation zone, and the magnetic force that makes mask plate 10 receive in the evaporation zone 13 both sides is as close as possible, improves mask plate 10 because of the deformation that magnetic force caused better.
Referring to fig. 9, fig. 9 shows another example of a cross-sectional view of the mask plate in fig. 6 at section C-C.
In some alternative embodiments, as shown in fig. 9, the number of the second grooves 31 is plural, and the plural second grooves are arranged at intervals along the second direction (y direction in the figure), and the depth of the previous second groove 31 is greater than the depth of the next second groove 31.
According to the mask plate 10, the second direction (y direction in the figure) is arranged at intervals, the depth of the front second groove 31 is larger than that of the rear second groove 31, the magnetic force received by the second frame area 30 is gradually reduced along the direction close to the evaporation area 13, the magnetic force received by the mask plate 10 is stably transited at the position of the second frame area 30, and the deformation of the mask plate 10 is further reduced.
Referring to fig. 10, fig. 10 shows a cross-sectional view of another example of the mask plate in fig. 6 at section C-C.
In some alternative embodiments, as shown in fig. 10, the depth of the second recess 31 decreases gradually in a direction away from the evaporation zone 13.
The utility model provides a mask plate 10 through the second recess 31 that reduces gradually along the direction degree of depth that deviates from evaporation zone 13 for the magnetic force that second frame district 30 received reduces gradually along the direction that is close to evaporation zone 13, and the magnetic force that mask plate 10 received is at the steady transition of second frame district 30 position, further reduces the deformation of mask plate 10.
In some alternative embodiments, the cross-sectional shape of the first groove 21, the second groove 31 in the first direction (x direction in the figure) is one or more of polygonal, circular, elliptical.
Preferably, the cross-sectional shapes of the first grooves 21, 31 in the first direction (x direction in the drawing) are rectangular.
Referring to fig. 11, fig. 11 is a schematic top view of a vapor deposition apparatus according to some embodiments of the present disclosure.
As shown in fig. 11, the present application further provides an evaporation device, including any one of the mask plates 10 provided in the above technical solution of the present application, further including a support frame 40, where the support frame 40 includes a frame 41 and a plurality of support bars 42 fixed on the frame 41, and the plurality of support bars 42 define at least one evaporation opening (not labeled). The mask plate 10 is fixed on the supporting frame 40, and each evaporation opening corresponds to each evaporation area 13 one by one.
Wherein a portion of the support bars 42 extend in a first direction (x-direction in the figure) and another portion of the support bars 42 extend in a second direction (y-direction in the figure).
The mask plate 10 that this application provided through setting up the first recess 21 in the first frame district 20 of evaporation zone 13 one side and first frame district 20, can reduce the metal quantity in first frame district 20, reduces the weight in first frame district 20, reduces the magnetic force that first frame district 20 received, and then reduces the edge in evaporation zone 13 because of the deformation that magnetic force brought. The deformation of the evaporation area 13 in the drawing direction is more easily caused by the larger stress of the evaporation area 13 in the drawing direction, and the deformation of the edge of the evaporation area 13 in the drawing direction due to the magnetic force can be better improved by the first frame area 20 arranged in the first direction (x direction in the drawing) and the first groove 21 extending in the first direction (x direction in the drawing) which is parallel to the net-opening direction of the mask plate 10. The first groove 21 with the opening located on the vapor plating surface 11 is provided, and the first groove 21 does not penetrate through the mask plate 10, so that the first frame area 20 is a complete plane on the butt joint surface 12, the influence of the first groove 21 on the lamination of the mask plate and the substrate to be vapor plated can be improved, and the vapor plating effect is ensured.
In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, which are intended to be included in the scope of the present application.
Claims (15)
1. The utility model provides a mask, includes and is used for with the relative evaporation coating surface of evaporation coating source and deviates from the butt joint face of evaporation coating surface one side, its characterized in that, the mask still includes at least one evaporation coating region and first frame district, two first frame district locates same evaporation coating region's both sides in first direction, first direction with the net direction of opening of mask is parallel, be equipped with at least one first recess in the first frame district, the opening of first recess is located the evaporation coating surface, first recess does not run through the mask, the extending direction of first recess with first direction is parallel, the degree of depth of first recess is along deviating from the direction of evaporation coating region reduces gradually for the magnetic force that first frame district received is along being close to the direction of evaporation coating region reduces gradually, the magnetic force that the mask received is in the steady transition of first frame district position, further reduces the deformation of mask.
2. The mask plate according to claim 1, wherein the number of the first grooves in the two first frame regions on both sides of the same vapor deposition region is equal.
3. The mask plate according to claim 2, wherein the depths of the first grooves in the two first frame regions located at both sides of the same evaporation region are equal.
4. The mask plate according to claim 2, wherein the lengths of the first grooves in the first direction in the two first frame regions located on both sides of the same evaporation region are equal.
5. The mask plate according to claim 1, further comprising a second frame area, wherein the second frame area is located at least one side of the evaporation area in a second direction, the second direction intersects the first direction, at least one second groove is arranged in the second frame area, an opening of the second groove is located on the evaporation surface, the second groove does not penetrate through the mask plate, and an extending direction of the second groove is parallel to the first direction.
6. The mask of claim 5, wherein the first and second border regions are interconnected and bound to a perimeter of the same evaporation region.
7. The mask plate according to claim 5, wherein the mask plate comprises a plurality of evaporation areas, and the first frame area and the second frame area are arranged on the periphery of each evaporation area.
8. The mask plate according to claim 5, wherein the number of the second grooves is plural, the plural second grooves are arranged at intervals along the second direction, and the depth of the former second groove is greater than the depth of the latter second groove along the direction close to the evaporation zone.
9. The mask plate according to claim 5, wherein the two second frame regions are separately disposed on two sides of the same evaporation region in the second direction.
10. The mask plate according to claim 9, wherein the number of the second grooves in the two second frame regions located at both sides of the same evaporation region is equal.
11. The mask plate according to claim 10, wherein the depths of the second grooves in the two second frame regions located at both sides of the same evaporation region are equal.
12. The mask plate according to claim 10, wherein the lengths of the second grooves in the two second frame regions located at both sides of the same evaporation region in the first direction are equal.
13. The mask plate of claim 5, wherein the depth of the second recess decreases gradually in a direction away from the evaporation zone.
14. The mask plate according to claim 5, wherein the cross-sectional shape of the first groove and the second groove in the first direction is one or more of polygonal, circular, elliptical.
15. An evaporation device, characterized by comprising the mask plate according to any one of claims 1 to 14 and a support frame, wherein the mask plate is fixed on the support frame.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211203376.3A CN115433900B (en) | 2022-09-29 | 2022-09-29 | Mask plate and evaporation device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211203376.3A CN115433900B (en) | 2022-09-29 | 2022-09-29 | Mask plate and evaporation device |
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| CN115433900A CN115433900A (en) | 2022-12-06 |
| CN115433900B true CN115433900B (en) | 2024-02-20 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108642440A (en) * | 2018-05-14 | 2018-10-12 | 昆山国显光电有限公司 | Mask plate and mask assembly |
| CN110079763A (en) * | 2019-05-15 | 2019-08-02 | 昆山维信诺科技有限公司 | Mask plate and mask assembly |
| CN214361643U (en) * | 2021-01-29 | 2021-10-08 | 昆山国显光电有限公司 | Mask plate |
| CN114032499A (en) * | 2021-11-18 | 2022-02-11 | 昆山国显光电有限公司 | Precision mask plate and mask plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106480404B (en) * | 2016-12-28 | 2019-05-03 | 京东方科技集团股份有限公司 | A kind of exposure mask integrated framework and evaporation coating device |
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- 2022-09-29 CN CN202211203376.3A patent/CN115433900B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108642440A (en) * | 2018-05-14 | 2018-10-12 | 昆山国显光电有限公司 | Mask plate and mask assembly |
| CN110079763A (en) * | 2019-05-15 | 2019-08-02 | 昆山维信诺科技有限公司 | Mask plate and mask assembly |
| CN214361643U (en) * | 2021-01-29 | 2021-10-08 | 昆山国显光电有限公司 | Mask plate |
| CN114032499A (en) * | 2021-11-18 | 2022-02-11 | 昆山国显光电有限公司 | Precision mask plate and mask plate |
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| CN115433900A (en) | 2022-12-06 |
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