CN115428152A - 一种单光子雪崩二极管及其制造方法、光检测器件及系统 - Google Patents
一种单光子雪崩二极管及其制造方法、光检测器件及系统 Download PDFInfo
- Publication number
- CN115428152A CN115428152A CN202080099985.1A CN202080099985A CN115428152A CN 115428152 A CN115428152 A CN 115428152A CN 202080099985 A CN202080099985 A CN 202080099985A CN 115428152 A CN115428152 A CN 115428152A
- Authority
- CN
- China
- Prior art keywords
- doping
- material layer
- doping structure
- doped
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 397
- 230000005684 electric field Effects 0.000 claims abstract description 42
- 239000000969 carrier Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims description 73
- 238000002955 isolation Methods 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 25
- 230000003287 optical effect Effects 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 25
- 238000010586 diagram Methods 0.000 description 20
- 230000009471 action Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- 230000031700 light absorption Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Light Receiving Elements (AREA)
Abstract
本申请实施例提供一种单光子雪崩二极管及其制造方法、光检测器件及系统,第一掺杂结构形成于第二掺杂结构的一侧水平表面以及侧壁,第一掺杂结构与第二掺杂结构相邻近的区域用于形成雪崩区,而第二掺杂结构和第一掺杂结构相邻近的拐角区域的高场区更容易形成雪崩区,即雪崩效应发生在第二掺杂结构和第一掺杂结构的边缘区,因此产生雪崩效应的概率较大,而覆盖材料能够提供使第一掺杂材料层中的多子从边缘向中心运动的电场,利于第一掺杂材料层中的光生载流子向雪崩区移动,因此在一定程度上提高电荷收集效率,因此该器件具有较高的量子效率,从而可以具有较高的光探测效率。
Description
PCT国内申请,说明书已公开。
Claims (19)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/102783 WO2022011701A1 (zh) | 2020-07-17 | 2020-07-17 | 一种单光子雪崩二极管及其制造方法、光检测器件及系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115428152A true CN115428152A (zh) | 2022-12-02 |
Family
ID=79556079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080099985.1A Pending CN115428152A (zh) | 2020-07-17 | 2020-07-17 | 一种单光子雪崩二极管及其制造方法、光检测器件及系统 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115428152A (zh) |
WO (1) | WO2022011701A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2024517315A (ja) | 2021-05-10 | 2024-04-19 | エヌアイ・システムズ・インコーポレイテッド | 2次元シリコン・フォトニックmemsスイッチ・アレイを有する擬似モノスタティックlidar |
CN117597603A (zh) * | 2021-05-19 | 2024-02-23 | 尼亚系统有限公司 | 具有微透镜阵列及集成光子开关阵列的lidar |
CN116884981B (zh) * | 2023-06-07 | 2024-04-23 | 边际科技(珠海)有限公司 | 一种响应0.85微米雪崩二极管与平面透镜的集成结构及其制程 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4034153B2 (ja) * | 2002-09-20 | 2008-01-16 | ユーディナデバイス株式会社 | 半導体受光装置 |
CN106298816A (zh) * | 2016-10-11 | 2017-01-04 | 天津大学 | 集成淬灭电阻的单光子雪崩二极管及其制造方法 |
CN107946389A (zh) * | 2017-11-14 | 2018-04-20 | 重庆邮电大学 | 一种针对长波段微弱光的cmos单光子雪崩二极管 |
CN108550592B (zh) * | 2018-04-02 | 2020-08-04 | 重庆邮电大学 | 一种低暗计数率cmos spad光电器件 |
-
2020
- 2020-07-17 WO PCT/CN2020/102783 patent/WO2022011701A1/zh active Application Filing
- 2020-07-17 CN CN202080099985.1A patent/CN115428152A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022011701A1 (zh) | 2022-01-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111682039B (zh) | 堆叠式背面照明spad阵列 | |
US9257589B2 (en) | Single photon avalanche diode with second semiconductor layer burried in epitaxial layer | |
EP3882981A1 (en) | Photodetector, preparation method for photodetector, photodetector array, and photodetection terminal | |
CN115428152A (zh) | 一种单光子雪崩二极管及其制造方法、光检测器件及系统 | |
JP6577601B2 (ja) | 同一面電極のフォトダイオードアレイ及びその製造方法 | |
KR20110136786A (ko) | 반도체 광검출 소자 | |
EP3544064B1 (en) | Photodetector and light detection and ranging | |
EP3809472B1 (en) | A single-photon avalanche diode and a sensor array | |
US20210183919A1 (en) | Image sensing device | |
WO2022011694A1 (zh) | 一种单光子雪崩二极管及其制造方法、光检测器件及系统 | |
WO2018031093A2 (en) | Photodiode array structure for cross talk suppression | |
CN104952893B (zh) | 图像传感器 | |
KR101762431B1 (ko) | 크로스톡 방지 구조를 가지는 실리콘 광전자 증배센서 | |
US20240120427A1 (en) | SINGLE PHOTON DETECTION ELEMENT, ELECTRONIC DEVICE, AND LiDAR DEVICE | |
US20240069168A1 (en) | SINGLE PHOTON DETECTION ELEMENT, ELECTRONIC DEVICE, AND LiDAR DEVICE | |
CN117059694B (zh) | 单光子雪崩二极管、制备方法、光电检测装置和电子设备 | |
US20240105741A1 (en) | Single photon avalanche diode, electronic device, and lidar device | |
CN111508980B (zh) | 增强收集效率的光侦测装置 | |
US11942492B2 (en) | Image sensing device | |
US20240120352A1 (en) | AVALANCHE PHOTODETECTION DEVICE, ELECTRONIC DEVICE, AND LiDAR DEVICE | |
WO2022113515A1 (ja) | センサデバイス | |
KR101762430B1 (ko) | 이면 조사형 실리콘 광전자 증배센서 및 그 제조방법 | |
US20230065873A1 (en) | Single-photon detection device, single-photon detector, and single-photon detector array | |
KR20230103524A (ko) | 단일 광자 검출 픽셀 및 이를 포함하는 단일 광자 검출 픽셀 어레이 | |
KR20220114879A (ko) | 이미지 센싱 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |