CN115411608A - Micro-channel heat sink device - Google Patents

Abstract

The invention discloses a microchannel heat sink device, which comprises a first side cover, a backwater cover body, a guide cover body, a water inlet cover body and a second side cover, wherein the first side cover is provided with a water inlet; the water return cover body is provided with a water outlet channel; the guide cover body is arranged on one side of the water return cover body, which is far away from the first side cover, and is provided with a guide channel communicated with the water outlet channel; the water inlet cover body is provided with a slow flow region, the slow flow region comprises a water inlet channel, a water inlet hole is communicated with the slow flow region through a water return cover body and a guide cover body, the water inlet channel is communicated with the guide channel, and the side walls of the water inlet channel and the water outlet channel are provided with convex ribs and grooves which are arranged at intervals; the guide cover body and the second side cover are respectively arranged at two sides of the water inlet cover body, and the second side cover is provided with a water outlet hole communicated with the water outlet channel.

Description

Micro-channel heat sink device

Technical Field

The invention relates to the technical field of heat sinks, in particular to a micro-channel heat sink device.

Background

The high-power semiconductor laser has been widely used in various industries due to the advantages of light weight, small volume, high electro-optic conversion rate and the like. In the working process of the semiconductor laser, about 60% of energy of the laser diode is effectively utilized, and the unused energy is converted into heat energy, so that the temperature of the laser diode is rapidly increased, the threshold current of a laser chip is increased, and the working stability of the semiconductor laser is influenced. The microchannel heat sink device is a key device for solving the problem of high temperature rise of the high-power semiconductor laser because of the characteristics of compact structure, small unit volume, light weight and the like, and the microchannel heat sink device in the prior art has uneven local temperature, low heat exchange efficiency and poor integral heat dissipation capability.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the microchannel heat sink device, which can improve the heat exchange efficiency, thereby greatly improving the overall heat dissipation capacity of the microchannel heat sink device and being beneficial to reducing the phenomenon of uneven local temperature.

The embodiment of the invention provides a microchannel heat sink device, which comprises a first side cover, a water return cover body, a guide cover body, a water inlet cover body and a second side cover, wherein the first side cover is provided with a water inlet, and one side of the first side cover is used for connecting a semiconductor laser rake bar; the water return cover body is arranged on the other side of the first side cover and is provided with a water outlet channel; the guide cover body is arranged on one side, away from the first side cover, of the water return cover body, and is provided with a guide channel communicated with the water outlet channel; the water inlet cover body is provided with a slow flow region, the slow flow region comprises a water inlet channel, the water inlet hole is communicated with the slow flow region through the water return cover body and the guide cover body, the water inlet channel is communicated with the guide channel, and the side walls of the water inlet channel and the water outlet channel are provided with convex ribs and grooves which are arranged at intervals; the guide cover body and the second side cover are respectively arranged on two sides of the water inlet cover body, and the second side cover is provided with a water outlet hole communicated with the water outlet channel.

The microchannel heat sink device provided by the invention has at least the following beneficial effects: the cooling medium enters the microchannel heat sink device from a water inlet arranged on the first side cover, the water inlet is communicated with the water return cover body, the guide cover body and the water inlet cover body, the cooling medium flows through the water return cover body and the guide cover body and then slowly flows into a slow flow region of the water inlet cover body, the flow speed of the cooling medium can be effectively slowed down, the cooling medium is favorable for full development of the cooling medium, the cooling medium flows into a water outlet channel through the guide channel after entering the water inlet channel, namely flows through the guide cover body and the water return cover body again, the flowing path of the cooling medium in the microchannel heat sink device can be increased, the better heat dissipation effect is favorable, the cooling medium flows out of the water outlet channel, flows to a water outlet arranged on the second side cover through the guide cover body and the water inlet cover body, and finally flows out of the water outlet hole to realize the circulating refrigeration effect, the heat dissipation effect can be realized, the heat dissipation area of the water inlet channel and the water outlet channel is the main fluid region, the phenomenon of strong fluid disturbance and the internal vortex can be generated by arranging the combined microstructure of the convex ribs and the grooves, and the heat dissipation area of the water inlet channel and the water outlet channel can be increased, the heat dissipation efficiency can be improved, thereby greatly improving the integral heat dissipation capability of the microchannel heat sink device and reducing the phenomenon of uneven local temperature.

According to some embodiments of the invention, the ribs are right-angled trapezoids in cross-section.

According to some embodiments of the invention, the side walls of the water inlet channel on two opposite sides are provided with the ribs, wherein the inclined planes of the ribs on the side walls on one side are parallel to the inclined planes of the ribs on the side walls on the other side.

According to some embodiments of the invention, the side walls of the outlet channel on two opposite sides are provided with the ribs, wherein the inclined planes of the ribs on the side walls on one side are parallel to the inclined planes of the ribs on the side walls on the other side.

According to some embodiments of the invention, the groove comprises an arc structure and a ramp structure connected to each other.

According to some embodiments of the present invention, the backwater cover body is further provided with a first water inlet cross hole corresponding to the water inlet hole, the guide cover body is further provided with a second water inlet cross hole corresponding to the first water inlet cross hole, the slow flow region further includes a slow flow groove corresponding to the second water inlet cross hole, and the slow flow groove is respectively communicated with the second water inlet cross hole and the water inlet channel.

According to some embodiments of the present invention, the backwater cover body is further provided with a first water outlet flow guide channel communicated with the water outlet channel, the guiding cover body is further provided with a second water outlet flow guide channel corresponding to the first water outlet flow guide channel, the water inlet cover body is further provided with a third water outlet flow guide channel corresponding to the second water outlet flow guide channel, and the water outlet hole is communicated with the first water outlet flow guide channel, the second water outlet flow guide channel and the third water outlet flow guide channel.

According to some embodiments of the present invention, the guiding cover body is further provided with a first outlet port communicating with the second outlet diversion channel, the water inlet cover body is further provided with a second outlet port communicating with the third outlet diversion channel, and the water outlet port communicates with the first outlet port and the second outlet port.

According to some embodiments of the present invention, the water inlet cover body is further provided with a plurality of first flow dividing ridges, the water inlet channel is formed between two adjacent first flow dividing ridges, the water return cover body is further provided with a plurality of second flow dividing ridges, and the water outlet channel is formed between two adjacent second flow dividing ridges.

According to some embodiments of the invention, the first side cover, the return water cover, the guide cover, the water inlet cover and the second side cover are all 3D printed pieces of copper chromium zirconium alloy.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is an exploded view of a microchannel heat sink device according to an embodiment of the present invention;

FIG. 2 is a schematic view of a water return cover according to some embodiments of the present invention;

FIG. 3 is a schematic view of a guide cover according to some embodiments of the present invention;

FIG. 4 is a schematic view of a water inlet cover according to some embodiments of the present invention;

FIG. 5 is an enlarged view of FIG. 4 at A;

fig. 6 is a schematic view of a first side cover according to some embodiments of the present invention;

FIG. 7 is a top view of a water intake cover according to some embodiments of the invention;

fig. 8 is an enlarged view of fig. 7 at B.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings only for the convenience of description of the present invention and simplification of the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means is one or more, a plurality of means is two or more, and greater than, less than, more than, etc. are understood as excluding the essential numbers, and greater than, less than, etc. are understood as including the essential numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

As shown in fig. 1 to 5, an embodiment of the present invention provides a microchannel heat sink device 100, including a first side cover 200, a water return cover 300, a guide cover 400, a water inlet cover 500, and a second side cover 600, wherein the first side cover 200 is provided with a water inlet 210, and one side of the first side cover 200 is used for connecting a semiconductor laser rake bar 220; the water return cover body 300 is arranged at the other side of the first side cover 200, and the water return cover body 300 is provided with a water outlet channel 310; the guide cover body 400 is arranged at one side of the backwater cover body 300 far away from the first side cover 200, and the guide cover body 400 is provided with a guide channel 410 communicated with the water outlet channel 310; the water inlet cover body 500 is provided with a slow flow area 510, the slow flow area 510 comprises a water inlet channel 511, the water inlet hole 210 is communicated with the slow flow area 510 through the water return cover body 300 and the guide cover body 400, the water inlet channel 511 is communicated with the guide channel 410, and the side walls of the water inlet channel 511 and the water outlet channel 310 are provided with convex ribs 700 and grooves 800 which are arranged at intervals; the guide cover 400 and the second side cover 600 are respectively disposed at both sides of the water inlet cover 500, and the second side cover 600 is provided with a water outlet hole 610 communicated with the water outlet passage 310.

As shown in fig. 6, it should be noted that the microchannel heat sink device 100 of the present embodiment can dissipate heat of the semiconductor laser rake bars 220, and when the semiconductor laser rake bars 220 are disposed on the outer side of the first side cover 200, the water inlet holes 210 are disposed close to the semiconductor laser rake bars 220.

According to the microchannel heat sink device 100 provided by the invention, the microchannel heat sink device 100 comprises a first side cover 200, a return water cover 300, a guide cover 400, a water inlet cover 500 and a second side cover 600 which are sequentially arranged, a cooling medium enters the microchannel heat sink device 100 from a water inlet 210 arranged on the first side cover 200, the water inlet 210 is communicated with the return water cover 300, the guide cover 400 and the water inlet cover 500, the cooling medium flows through the return water cover 300 and the guide cover 400 and then enters a slow flow region 510 of the water inlet cover 500 to slowly flow, so that the flow rate of the cooling medium can be effectively slowed down, the cooling medium can be fully developed, the cooling medium flows into a water outlet channel 310 through a guide channel 410 after entering a water inlet channel 511, namely flows through the guide cover 400 and the return water cover 300 again, the path of the cooling medium flowing through the microchannel heat sink device 100 can be increased, a better heat dissipation effect can be realized, then the cooling medium flows out from the water outlet channel 310, flows into a water outlet 610 arranged on the second side cover 600 through the guide cover 400 and the water inlet 500, finally flows out of a water outlet 610 to realize a circulation refrigeration effect, and the heat dissipation effect can be greatly improved due to the phenomenon that the heat dissipation efficiency of the heat sink device is greatly increased by the combination of a main vortex 511 and a heat sink channel 700, and a heat dissipation groove 800, so that the heat dissipation groove.

As shown in fig. 1 and 5, it should be noted that, by the mutual cooperation of the convex rib 700 and the cavity structure, interruption and re-expansion of the speed boundary layer and the thermal boundary layer are mainly achieved, the convex rib 700 can change the flow direction of the main flow, so that the cooling medium can flow through a longer path in the water inlet passage 511 and the water outlet passage 310, and simultaneously impact the side wall of the microchannel heat sink device 100, so that the boundary layer becomes thinner, thereby greatly reducing thermal resistance caused by the boundary layer, and enhancing the heat transfer effect.

It can be understood that the combined microstructure of the convex rib 700 and the cavity structure has better heat dissipation effect than the single convex rib 700 or the cavity structure, and has better heat transfer performance.

As shown in fig. 1 and 4, in the present embodiment, the slow flow region 510 is formed by combining hollow regions on the water inlet cover 500, and is an open space.

As shown in fig. 4, 5, 7, and 8, according to some embodiments of the invention, the rib 700 has a right-angled trapezoidal cross-section.

It should be noted that, the cross section of the rib 700 is a right trapezoid, which is different from a structure of a cuboid or a cube, the rib 700 of this embodiment is in an offset form in structure, and when a cooling medium flows through the rib 700, the flow direction can be changed to directly impact the contraction zone of the grooves 800 arranged at intervals, so that the boundary layer of the grooves 800 becomes thinner, a better fluid mixing effect is achieved, the local temperature of the microchannel heat sink device 100 is more uniform, and the improvement of the heat dissipation performance is facilitated.

As shown in fig. 5 and 8, according to some embodiments of the present invention, the sidewalls of the opposite sides of the water inlet passage 511 are provided with the rib 700, wherein the inclined surface of the rib 700 on the sidewall of one side is parallel to the inclined surface of the rib 700 on the sidewall of the other side.

The inclined planes of the convex ribs 700 distributed on the side walls at the two opposite sides of the water inlet passage 511 are parallel, so that the flow direction of the cooling medium can be guided, the flow direction of the cooling medium in the water inlet passage 511 is kept consistent, and the cooling efficiency of the micro-channel heat sink device 100 is improved.

As shown in fig. 5, in the present embodiment, in particular, the side walls on the opposite sides of the inlet passage 511 include a first side wall 541 and a second side wall 542, the cross section of the rib 700 on the first side wall 541 is gradually reduced from the direction entering the inlet passage 511 to the edge of the inlet cover body 500, and the cross section of the rib 700 on the second side wall 542 is gradually increased from the direction entering the inlet passage 511 to the edge of the inlet cover body 500.

It can be understood that the side walls of the water inlet passage 511 are provided with the grooves 800, the cooling medium can be fully mixed by providing the combined microstructures of the convex ribs 700 and the grooves 800, and in addition, the combined microstructures of the side walls of the water inlet passage 511 at two opposite sides adopt an asymmetric arrangement, so that the heat exchange efficiency can be better improved.

According to some embodiments of the present invention, the sidewalls of the opposite sides of the outlet channel 310 are provided with the ribs 700, wherein the inclined surfaces of the ribs 700 on the sidewall of one side are parallel to the inclined surfaces of the ribs 700 on the sidewall of the other side.

It should be noted that, by making the inclined planes of the ribs 700 distributed on the side walls at two opposite sides of the water outlet channel 310 parallel, the flow direction of the cooling medium can be guided, so that the flow direction of the cooling medium in the water outlet channel 310 is kept consistent, which is beneficial to improving the cooling efficiency of the microchannel heat sink apparatus 100.

It is understood that the specific arrangement direction of the convex rib 700 in the present embodiment can refer to the arrangement direction shown in fig. 5.

In an embodiment, the side walls of the opposite sides of the water outlet channel 310 are provided with the grooves 800, the cooling medium can be sufficiently mixed by providing the combined microstructures of the convex ribs 700 and the grooves 800, and in addition, the combined microstructures of the side walls of the opposite sides of the water outlet channel 310 adopt an asymmetric arrangement, so that the heat exchange efficiency can be better improved.

As shown in fig. 5, according to some embodiments of the invention, the groove 800 includes an arcuate structure 810 and a ramp structure 820 connected to each other.

It should be noted that the groove 800 includes the arc-shaped structure 810 and the slope structure 820, which enable the cooling medium to form a vortex at the groove 800, and are beneficial to increase the convective heat transfer area of the fluid in the water inlet passage 511 and the water outlet passage 310.

As shown in fig. 8, it can be understood that the cross-section of the rib 700 is fan-like.

As shown in fig. 1 to 4, according to some embodiments of the present invention, the backwater cover 300 is further provided with a first water inlet coupling hole 320 corresponding to the water inlet hole 210, the guide cover 400 is further provided with a second water inlet coupling hole 420 corresponding to the first water inlet coupling hole 320, and the slow flow region 510 further includes a slow flow groove 512 corresponding to the second water inlet coupling hole 420, and the slow flow groove 512 is respectively communicated with the second water inlet coupling hole 420 and the water inlet passage 511.

In this embodiment, the cooling medium enters the microchannel heat sink device 100 from the water inlet 210, then sequentially enters the slow flow groove 512 in the slow flow region 510 through the first water inlet cross hole 320 and the second water inlet cross hole 420, and flows from the slow flow groove 512 to the water inlet 511 by performing slow flow in the slow flow region 510, and reaches a fully developed stage in the water inlet 511, and then flows into the guide channel 410, so that the path through which the cooling medium flows in the microchannel heat sink device 100 can be increased, and the heat dissipation effect of the microchannel heat sink device 100 can be improved.

As shown in fig. 1 to 4, according to some embodiments of the present invention, the water returning cover body 300 is further provided with a first water outlet flow guiding channel 330 communicated with the water outlet channel 310, the guiding cover body 400 is further provided with a second water outlet flow guiding channel 430 corresponding to the first water outlet flow guiding channel 330, the water inlet cover body 500 is further provided with a third water outlet flow guiding channel 520 corresponding to the second water outlet flow guiding channel 430, and the water outlet hole 610 is communicated with the first water outlet flow guiding channel 330, the second water outlet flow guiding channel 430 and the third water outlet flow guiding channel 520.

In this embodiment, when the cooling medium flows into the water outlet channel 310 from the guiding channel 410, and reaches a fully developed stage in the water outlet channel 310, then flows to the first water guiding channel 330, and sequentially flows through the second water guiding channel 430 and the third water guiding channel 520, that is, flows through the guiding cover 400 and the water inlet cover 500, then flows to the water outlet 610 of the second side cover 600, and finally flows out from the water outlet 610, the uniform circulation flow of the cooling medium in the microchannel heat sink device 100 is realized, and the heat dissipation effect of the microchannel heat sink device 100 is improved.

As shown in fig. 1 to 4, according to some embodiments of the present invention, the guide cover 400 is further provided with a first outlet port 440 communicating with the second outlet guide channel 430, the inlet cover 500 is further provided with a second outlet port 530 communicating with the third outlet guide channel 520, and the outlet hole 610 communicates with the first outlet port 440 and the second outlet port 530.

In this embodiment, after the cooling medium flows from the guiding channel 410 into the water outlet channel 310 and then flows to the first outlet diversion channel 330 and the second outlet diversion channel 430, the cooling medium may further sequentially enter the first outlet intersection hole 440 and the second outlet intersection hole 530, and by providing the first outlet intersection hole 440 and the second outlet intersection hole 530, the pressure of the second outlet diversion channel 430 and the third outlet diversion channel 520 can be reduced, and the water outlet area can be increased.

As shown in fig. 2 and 4, according to some embodiments of the present invention, the water inlet cover body 500 is further provided with a plurality of first diversion ridges 540, a water inlet passage 511 is formed between two adjacent first diversion ridges 540, and the water return cover body 300 is further provided with a plurality of second diversion ridges 340, and a water outlet passage 310 is formed between two adjacent second diversion ridges 340.

It should be noted that, by providing the first diversion ridge 540 on the water inlet cover body 500, the water inlet passage 511 can be separated by the first diversion ridge 540, and it can be understood that, the water inlet cover body 500 is provided with a plurality of water inlet passages 511, by providing the second diversion ridge 340 on the water outlet cover body, the water outlet passage 310 can be separated by the second diversion ridge 340, and the water return cover body 300 is provided with a plurality of water outlet passages 310, wherein the protruding ribs 700 and the grooves 800 are provided on the side walls of the first diversion ridge 540 and the second diversion ridge 340.

As shown in fig. 2, in an embodiment, the second division ridge 340 is formed by bending at a predetermined angle, and the second division ridge 340 is bent toward the side wall of the water return cover 300, so as to facilitate the backflow of the cooling medium.

As shown in fig. 1 to 4, in particular, the inlet cover body 500 is provided with ten inlet channels 511, the return cover body 300 is provided with ten outlet channels 310, the guide channel 410 includes ten guide holes 411, each guide hole 411 is respectively communicated with the corresponding inlet channel 511 and outlet channel 310, which is beneficial to achieving the effect of uniform heat dissipation,

according to some embodiments of the present invention, the first side cover 200, the return water cover 300, the guide cover 400, the water inlet cover 500, and the second side cover 600 are all 3D printed copper chromium zirconium alloy pieces.

Make first side cap 200, return water lid 300, guide lid 400, the lid 500 of intaking and second side cap 600 through 3D printing, can avoid introducing extra thermal stress and thermal contact resistance because the welding between each layer lid, because copper chromium zirconium alloy has good heat conductivility, carry out 3D printing through adopting copper chromium zirconium alloy material, microchannel heat sink device 100 inner wall does not need the gilding, avoided appearing the gilding material and come off and lead to the problem of heat sink jam, be favorable to improving heat exchange efficiency.

As shown in fig. 1, in an embodiment, the first side cover 200, the return water cover 300, the guide cover 400, the water inlet cover 500, and the second side cover 600 are respectively provided with a corresponding positioning hole 910 and a corresponding screw hole 920, and the positioning hole 910 and the screw hole 920 are used to fix the entire microchannel heat sink apparatus 100.

According to the microchannel heat sink device 100, the combined microstructures of the convex ribs 700 and the grooves 800 are arranged in the water inlet channel 511 and the water outlet channel 310, the boundary layer is periodically damaged by the convex ribs 700 and the grooves 800, and the interruption and the re-expansion of the speed boundary layer and the thermal boundary layer are realized, so that the temperature distribution in the water inlet channel 511 and the water outlet channel 310 is more uniform, namely, the existence of the convex ribs 700 and the grooves 800 can play a significant role in the microchannel heat transfer enhancement, and the good heat dissipation performance of the microchannel heat sink device 100 is ensured.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (10)

1. A microchannel heat sink apparatus, comprising:

the first side cover is provided with a water inlet, and one side of the first side cover is used for connecting the semiconductor laser rake bar;

the water return cover body is arranged on the other side of the first side cover and is provided with a water outlet channel;

the guide cover body is arranged on one side, away from the first side cover, of the backwater cover body, and is provided with a guide channel communicated with the water outlet channel;

the water inlet cover body is provided with a slow flow region, the slow flow region comprises a water inlet channel, the water inlet hole is communicated with the slow flow region through the water return cover body and the guide cover body, the water inlet channel is communicated with the guide channel, and the side walls of the water inlet channel and the water outlet channel are provided with convex ribs and grooves which are arranged at intervals;

and the guide cover body and the second side cover are respectively arranged at two sides of the water inlet cover body, and the second side cover is provided with a water outlet hole communicated with the water outlet channel.

2. The microchannel heat sink device of claim 1, wherein the ribs are right-angled trapezoidal in cross-section.

3. The microchannel heat sink device of claim 2, wherein the fins are provided on both of the side walls of the inlet channel, wherein the fins on one side wall have a slope parallel to the slope of the fins on the other side wall.

4. The microchannel heat sink device of claim 2, wherein the fins are provided on both of the side walls of the outlet channel, wherein the fins on one side wall have slopes parallel to the slopes of the fins on the other side wall.

5. The microchannel heat sink device of claim 1, wherein the groove comprises an arcuate structure and a beveled structure interconnected.

6. The microchannel heat sink apparatus according to claim 1, wherein the water return cover further has a first water inlet port corresponding to the water inlet, the guide cover further has a second water inlet port corresponding to the first water inlet port, and the slow flow region further includes a slow flow groove corresponding to the second water inlet port, and the slow flow groove communicates with the second water inlet port and the water inlet channel, respectively.

7. The microchannel heat sink apparatus of claim 1, wherein the return cover further comprises a first outlet flow channel communicating with the outlet channel, the guide cover further comprises a second outlet flow channel corresponding to the first outlet flow channel, the inlet cover further comprises a third outlet flow channel corresponding to the second outlet flow channel, and the outlet hole communicates with the first outlet flow channel, the second outlet flow channel, and the third outlet flow channel.

8. The microchannel heat sink apparatus of claim 7, wherein the guide cover further has a first outlet port communicating with the second outlet flow guide, the inlet cover further has a second outlet port communicating with the third outlet flow guide, and the outlet port communicates with the first outlet port and the second outlet port.

9. The microchannel heat sink apparatus of claim 1, wherein the water inlet cover further comprises a plurality of first flow-dividing ridges, the water inlet channel is formed between two adjacent first flow-dividing ridges, the water return cover further comprises a plurality of second flow-dividing ridges, and the water outlet channel is formed between two adjacent second flow-dividing ridges.

10. The microchannel heat sink apparatus of claim 1, wherein the first side cover, the return water cover, the guide cover, the inlet water cover, and the second side cover are all 3D printed pieces of copper chromium zirconium alloy.

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