CN115410944A - Die bonding equipment and die bonding method - Google Patents

Die bonding equipment and die bonding method Download PDF

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Publication number
CN115410944A
CN115410944A CN202111438293.8A CN202111438293A CN115410944A CN 115410944 A CN115410944 A CN 115410944A CN 202111438293 A CN202111438293 A CN 202111438293A CN 115410944 A CN115410944 A CN 115410944A
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China
Prior art keywords
substrate
area
chip
die bonding
welding
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CN202111438293.8A
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Chinese (zh)
Inventor
雷伟庄
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Weijian Intelligent Packaging Technology Shenzhen Co ltd
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Weijian Intelligent Packaging Technology Shenzhen Co ltd
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Priority to CN202111438293.8A priority Critical patent/CN115410944A/en
Publication of CN115410944A publication Critical patent/CN115410944A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/30—Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors

Abstract

The invention relates to the technical field of die bonding, in particular to die bonding equipment and a die bonding method. The die bonding equipment is used for fixing a chip on a substrate and comprises a main body, wherein a mechanical arm assembly is arranged on the main body, at least a welding area and a light curing area which are arranged at intervals are defined on the main body, the die bonding equipment also comprises a control module, and the mechanical arm assembly, the welding area and the light curing area are respectively and electrically connected with the control module; the mechanical arm assembly can independently enter the welding area or the light curing area or sequentially enter the light curing area and the welding area to fix the chip on the substrate according to the type of the substrate under the control of the control module. The application is favorable for enriching the diversity of the functions of the mechanical arm assembly and enhancing the universality of the die bonding equipment.

Description

Die bonding equipment and die bonding method
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of die bonding, in particular to die bonding equipment and a die bonding method.
[ background of the invention ]
At present, die bonding of related electronic products is usually completed through die bonding equipment, but the existing die bonding equipment can only perform welding or bonding operation independently, and is single in function and poor in universality.
[ summary of the invention ]
The invention provides die bonding equipment and a die bonding method, aiming at solving the problem of poor universality of the existing die bonding equipment.
The technical scheme for solving the technical problem is that the die bonding equipment is used for fixing a chip on a substrate and comprises a main body, wherein a mechanical arm assembly is arranged on the main body, at least a welding area and a light curing area which are arranged at intervals are defined on the main body, the die bonding equipment also comprises a control module, and the mechanical arm assembly, the welding area and the light curing area are respectively and electrically connected with the control module; the mechanical arm assembly can independently enter the welding area or the light curing area or sequentially enter the light curing area and the welding area to fix the chip on the substrate under the control of the control module according to the type of the substrate.
Preferably, the welding zone is provided with a eutectic platform, the eutectic platform comprises a bearing part and an upper cover arranged on the bearing part, a die bonding area is enclosed between the upper cover and the bearing part, the bearing part is provided with a first vacuum suction hole for adsorbing the substrate, and the bearing part is internally provided with a heating assembly for heating the die bonding area.
Preferably, a light curing table and an irradiation device for curing the light curing adhesive are arranged in the light curing area, and the irradiation device emits light to irradiate at least one part of area of the light curing table; the light curing table and the irradiation device can be relatively moved so that the irradiation device can irradiate different areas on the light curing table.
Preferably, the die bonding equipment further comprises a vision adjusting module for precision calibration, the vision adjusting module is electrically connected with the control module, and the vision adjusting module comprises a first vision assembly for observing the state of the substrate and a second vision assembly for observing the state of the chip; the mechanical arm assembly can also adjust the relative orientation of the chip and the substrate according to the sensing results of the first visual assembly and the second visual assembly.
The invention also provides a die bonding method for bonding a substrate by using the die bonding equipment, which aims to solve the technical problems and comprises the following steps:
identifying a substrate to be die bonded, and confirming the type of the substrate;
transporting the substrate into a bonding area or a photocuring area;
moving a chip to be processed to be welded to a welding area and welding the chip to be processed to the substrate positioned in the welding area; or
Moving the chip to be processed to be bonded to a light curing area and bonding the chip to be processed to the substrate positioned in the light curing area; or the chip to be processed is firstly adhered to the substrate positioned in the light curing area and then is conveyed to the welding area for welding processing.
Preferably, the step of: the method for carrying out welding treatment on the substrate positioned in the welding area specifically comprises the following steps:
identifying a chip to be processed;
picking up a chip, moving and placing it on a substrate within a bonding pad;
and heating the substrate and the chip in the welding area for a preset time to complete welding.
Preferably, before placing the chip on the substrate in the bonding pad, the method further comprises the steps of:
calibrating the orientations of the substrate and the chip;
and calibrating the orientation of the substrate or the chip according to the acquired substrate and chip images.
Preferably, the step of: carrying out photocuring treatment on the substrate positioned in the photocuring area, and specifically comprising the following steps of:
identifying a substrate disposed within the photocured area;
carrying out gluing treatment on a preset area of the substrate in the photocuring area;
moving and placing a chip to be bonded to a preset area where glue is bonded to complete pre-bonding;
and carrying out photocuring treatment on the pre-bonded substrate and the chip in the photocuring area.
Preferably, the gluing process comprises a glue dispensing process and/or a painting process.
Preferably, the step of: carrying out photocuring treatment on the substrate and the chip in the photocuring area, and specifically comprising the following steps of:
moving the substrate with the chip placed in the irradiation area for photocuring;
the substrate with the chip placed thereon stays in the irradiation area for a preset time;
and removing the irradiated substrate, and simultaneously making the next substrate enter the irradiation range of photocuring.
Compared with the prior art, the die bonding equipment and the die bonding method have the following advantages:
1. the die bonding equipment is provided with a welding area and a photocuring area, and as can be understood, the mechanical arm assembly can enter the welding area or the photocuring area to perform corresponding operation under the control of the control module, and can also go between photocuring of the welding area; the operating head conversion frame is convenient for the mechanical arm assembly to rapidly change the operating head of the mechanical arm assembly, the mechanical arm assembly can complete various operation processes by replacing the operating head, and the functional diversity of the mechanical arm assembly is favorably enhanced.
2. According to the eutectic platform, the heating function is realized through the heating assembly in the bearing part, so that soldering tin is melted, the first vacuum suction holes can adsorb the substrate, and the substrate is prevented from being deviated; and the vent hole on the bearing part leads to the inert gas which can be introduced into the solid crystal area through the vent hole when heating, and can avoid the oxidation of the substrate and the chip in the heating process.
3. The light curing area in the invention can ensure that two steps of light curing and glue drawing are not influenced mutually through the matching of the light curing table and the irradiation device, the substrate with glue and chips placed in the light curing area can be moved to the irradiation range for light curing through the driving assembly, and the mechanical arm assembly can continue to operate the substrate to be processed.
4. The vision adjusting module can assist in identifying the positioning positions of the substrate and the chip, and is convenient and quick to pick up the substrate and the chip; in addition, can also finely tune the position of chip through the vision adjustment module at the removal with placing the chip in-process, make the cooperation of chip and base plate more accurate, do benefit to and improve solid brilliant quality.
5. In the die bonding method, the substrate to be processed is identified in advance, so that whether the subsequent process is welding or photocuring can be automatically judged; and transporting the substrate into the corresponding area.
6. In the die bonding method, the orientation of the chip is calibrated according to the orientation of the substrate before the chip is placed on the substrate in the welding area, so that the placement precision between the chip and the substrate can be effectively enhanced, the product quality is favorably improved, and the reject ratio is reduced.
7. In the die bonding method, the orientation calibration between the chip and the substrate is completed through image comparison, and the calibration precision is high.
8. In the die bonding method, the mechanical arm assembly can automatically replace the corresponding operating head aiming at different processes, and has high automation degree and strong universality.
9. In the die bonding method, the substrate after photocuring is moved away, and the lower substrate enters the photocuring irradiation range, so that the overall photocuring efficiency is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.
Fig. 1 is a block diagram of a die bonding apparatus according to a first embodiment of the present invention.
Fig. 2 is a block diagram of a robot assembly of a die bonding apparatus according to a first embodiment of the invention.
FIG. 3 is a block diagram of a bonding pad of the die bonding apparatus according to the first embodiment of the present invention.
FIG. 4 is a block diagram of a light-curing region of a die bonding apparatus according to a first embodiment of the present invention.
FIG. 5 is a block diagram of a vision adjusting module of a die bonding apparatus according to a first embodiment of the present invention.
Fig. 6 is a block diagram of a turntable in the die bonding apparatus according to the first embodiment of the present invention.
Fig. 7 is a block diagram of a die bonding method according to a second embodiment of the present invention.
FIG. 8 is a block diagram of step S3A of a die bonding method according to a second embodiment of the present invention.
FIG. 9 is a block diagram of step 1B of the die bonding method according to the second embodiment of the present invention.
The attached drawings indicate the following:
100. die bonding equipment;
1. a main body; 11. a processing table; 111. a machining area;
12. a mechanical arm assembly; 121. a movable mechanical arm; 122. a movable end; 123. universal binding; 124. an operating head;
2. a welding area; 21. an eutectic platform; 211. a bearing part; 2111. a first vacuum suction hole; 2112. a heating assembly; 2113. a vent hole; 212. an upper cover;
3. a light-curing zone; 31. a light curing station; 311. a drive assembly; 312. a clamp; 3121. a slot position; 32. an irradiation device; 33. dipping the glue platform;
4. a material box; 5. a conversion frame;
6. a vision adjusting module; 61. a first visual component; 62. a second visual component;
7. a transfer table; 71. a second vacuum suction hole;
8. a control module.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The terms "vertical," "horizontal," "left," "right," "up," "down," "left up," "right up," "left down," "right down," and the like as used herein are for illustrative purposes only.
Referring to fig. 1 and fig. 2, a die bonder 100 according to a first embodiment of the present invention includes a main body 1, where the main body 1 includes a carrier 11, a robot arm assembly 12 disposed on the carrier 11, an operating head converting frame 5, and at least two operating heads 124 disposed on the operating head converting frame 5, the operating head converting frame 5 is provided with at least one suction head positioning clamp and at least one adhesive head positioning clamp, and the carrier 11 defines different processing areas 111; the robot arm assembly 12 comprises a movable robot arm 121 and a universal binding head 123 arranged on the robot arm, the universal binding head 123 is detachably connected with the operating head 124, and the operating head 124 connected with the universal binding head 123 can be automatically replaced by the robot arm assembly 12 according to the requirements of different processing areas 111.
It is understood that the die bonding apparatus 100 of the present invention defines the welding area 2 and the light-curing area 3, and the mechanical arm assembly 12 can operate in the welding area 2 and also can operate in the light-curing area 3; meanwhile, the mechanical arm assembly 12 can replace the operating heads 124 such as suction heads or bonding heads of different models through the operating head conversion frame 5, and under the cooperation of the above mechanisms, the die bonder 100 of the present invention can be freely converted between the welding process and the bonding process, so that the functional diversity of the die bonder 100 can be effectively enhanced.
Further, at least the welding area 2 and the photocuring area 3 are defined in the processing area 111. This design is beneficial to enrich the diversity of functions of the die bonding apparatus 100.
Further, the die bonding equipment 100 further comprises a control module 8, and the mechanical arm assembly 12 is electrically connected with the control module 8; the robot arm assembly 12 automatically changes the operating head 124 under the control of the control module 8 to accommodate the requirements of different processing regions 111. The design facilitates real-time detection and control of the die bonder 100, and the automation degree is high.
Further, a material box 4 for containing the substrate and the chip is arranged on the bearing table 11.
With continued reference to figures 1 and 2, the robot assembly 12 includes a moveable robot 121 and a moveable end 122 disposed on the moveable robot 121, and a universal tie-up 123 disposed on the moveable end 122, the universal tie-up 123 being moveable within the processing region 111 in response to operation of the moveable robot 121.
Specifically, in this embodiment, the movable mechanical arm 121 is a three-axis movable mechanical arm, the movable mechanical arm 121 includes an X-axis guide rail, a Y-axis guide rail and a Z-axis guide rail that are movably engaged, and the movable end 122 is located at the end of the Z-axis guide rail; in other embodiments, other styles of three-axis or multi-axis robotic arm assemblies 12 may be used.
Specifically, in this embodiment, the operating head 124 includes a suction head and an adhesive head, and one end of each of the suction head and the adhesive head, which is used for being matched with the universal binding head 123, is a universal end with the same structure and size; it will be appreciated that the suction head may be provided with one or more suction apertures of equal or different size.
Referring to fig. 1 and 3, a eutectic stage 21 is disposed in the welding zone 2, the eutectic stage 21 includes a supporting portion 211 and an upper cover 212 movably disposed on the supporting portion 211, a first vacuum hole 2111 is disposed on the supporting portion 211, and a heating element 2112 is disposed in the supporting portion 211. In the eutectic table 21 of the present invention, the heating function is realized by the heating elements 2112 in the supporting portion 211, so that the solder is melted, and the first vacuum suction holes 2111 can suck the substrate to prevent the substrate from being deviated.
Specifically, in this embodiment, the heating assembly 2112 includes an infrared heating device.
Further, the middle area of the side of the upper cover 212 far away from the bearing part 211 is provided with an opening through which the robot assembly 12 can access the substrate and the chip. Specifically, in this embodiment, the opening is located in a central region of the top surface of the upper cover 212.
Furthermore, a die bonding area is enclosed between the top cover 212 and the supporting portion 211, and the supporting portion 211 is further provided with a vent 2113 for venting in the die bonding area. It can be understood that, during heating, the inert gas is introduced into the solid crystal region through the vent 2113, so as to prevent the substrate and the chip from being oxidized during heating. After heating, cooling gas such as nitrogen and the like can be introduced into the die bonding area through the vent 2113 for rapid cooling, which is beneficial to improving die bonding efficiency.
Specifically, in this embodiment, the upper cover 212 is directly placed on the supporting portion 211 to form a die bonding area, and the upper cover 212 is not fixed between the two areas so as to be removed.
Referring to fig. 1 and 4, a light curing table 31 and an illumination device 32 are disposed in the light curing region 3, and the illumination device 32 emits light to illuminate a part of the light curing table 31; the light curing station 31 includes a driving assembly 311 and a clamp 312 disposed on the driving assembly 311, wherein a plurality of slots 3121 for placing a substrate are disposed on the clamp 312, and the clamp 312 can move along with the driving assembly 311 to make each slot 3121 enter the illumination range of the illumination device 32 in sequence.
It can be understood that, in this embodiment, through the cooperation of the light curing table 31 and the irradiation device 32, the two steps of irradiating light curing and glue drawing are not affected, the substrate on which the glue drawing and the chip are placed can be moved to the irradiation range through the driving component 311 to perform light curing, and the mechanical arm component 12 can continue to operate the substrate to be processed at other positions on the light curing table 31.
Specifically, in this embodiment, the driving assembly 311 includes a sliding rail assembly and an electrode for driving the sliding rail assembly; in other embodiments, the driving assembly 311 may also take other forms such as an electrode-driven conveyor belt.
In other embodiments, the irradiation device 32 may be driven by the driving component 311 to move the irradiation device 32 and the light curing table 31 relatively; the irradiation device 32 and the light-curing stage 31 can be driven to move relative to each other.
Further, the slots 3121 are equidistantly spaced on the fixture 312. This design may allow the slot 3121 to be changed by moving the drive assembly 311 only a fixed distance.
Further, a glue dipping table 33 is further arranged in the light curing area 3, and the glue dipping table 33 is arranged in the processing area 111.
Referring to fig. 1 and 5, the die bonding apparatus 100 further includes a vision adjusting module 6 for precision calibration, the vision adjusting module includes a first vision component 61 and a second vision component 62, the first vision component 61 is located on the movable end 122 and is disposed near the universal tie head 123, and the second vision component 62 is disposed in the processing area 111.
It can be understood that the vision adjusting module 6 of the invention can assist in identifying the positioning positions of the substrate and the chip, and can conveniently and quickly pick up the substrate and the chip; in addition, can also finely tune the position of chip through vision adjustment module 6 at the removal with placing the chip in-process, make the cooperation of chip and base plate more accurate, do benefit to and improve solid brilliant quality.
Further, the robot arm assembly 12 can adjust the relative orientation between the chip and the substrate according to the sensing results of the first vision assembly 1 and the second vision assembly 62
Specifically, in this embodiment, the first vision assembly 61 includes a downward-looking CCD camera, and the second vision assembly 62 includes an upward-looking CCD camera.
Referring to fig. 1 and 6, the die bonding apparatus 100 further includes a transfer table 7 for cooperating with the first vision assembly 61, the transfer table 7 is provided with a second vacuum suction hole 71, and the transfer table 7 is disposed in the processing area 111.
It can be understood that the transfer table 7 of the invention can assist the mechanical arm assembly 12 to adjust the orientation of the chip, which is beneficial to improving the adjustment efficiency; the second vacuum suction hole 71 on the transfer table 7 can adsorb the chip, so that the chip is prevented from deviating and the calibration precision is prevented from being influenced.
Further, the relay table 7 is disposed near the welding zone 2 in the processing area 111.
It will be appreciated that the positioning of the transfer table 7 close to the welding area 2 facilitates the first vision assembly 61 to quickly acquire an image of the substrate on the welding area 2, which may further improve the conditioning efficiency.
Referring to fig. 1, fig. 3, fig. 4 and fig. 6, a plurality of mounting holes are formed on the carrying table 11, and the eutectic table 21, the light curing table 31, the operating head converting frame 5, the material box 4, the second vision assembly 62 and the middle rotating table 7 are detachably connected to the carrying table 11 through the mounting holes. The design facilitates later maintenance of the die bonder 100, meanwhile, modules of different models can be replaced conveniently for different products, and the universality is high.
Referring to fig. 7 to 9, a second embodiment of the invention provides a die bonding method, including the following steps:
step S1: identifying a substrate to be processed and confirming the type of the substrate;
step S2: transporting the substrate into a bonding area or a photocuring area;
step S3A: moving a chip to be processed to be welded to a welding area and welding the chip to be processed to the substrate positioned in the welding area;
step S3B: moving the chip to be processed to be bonded to a light curing area and bonding the chip to be processed to the substrate positioned in the light curing area;
step S3C: the chip to be processed is firstly adhered to the substrate positioned in the light curing area and then conveyed to a welding area for welding processing.
The step S3A, the step S3B and the step S3C are three schemes, and the application can be selected according to the actual product requirement.
It can be understood that in the die bonding method of the invention, the substrate to be processed is identified in advance, and whether the subsequent process is welding or photocuring can be automatically judged; and transporting the substrate into the corresponding area.
Specifically, in this embodiment, the substrate in step S3A is transported to the carrying portion at the eutectic stage in the bonding pad; at the same time, the first vacuum suction hole on the carrying part is opened to suck the substrate tightly.
Further, step S3A specifically includes the following steps:
step S3A1: identifying a chip to be processed which needs to be welded; it will be appreciated that identifying the chips to be processed first facilitates improving the operational progress of the robot arm assembly.
Step S3A2: picking up a chip, moving the chip and placing the chip on a preset welding position of a substrate in a welding area;
specifically, in this embodiment, the chip is sucked and moved by the operating head on the robot arm assembly.
Step S3A3: and heating the substrate and the chip in the welding area for a preset time to complete welding.
Further, before placing the chip on the substrate in the bonding pad, the method further comprises the following steps:
step S3A4: and calibrating the orientation of the chip according to the orientation of the substrate.
In this embodiment, the numerical values of the steps do not completely represent the order of the steps.
It can be understood that in the die bonding method of the present invention, the orientation of the chip is calibrated according to the orientation of the substrate before the chip is placed on the substrate in the bonding region, so that the placement accuracy between the chip and the substrate can be effectively enhanced, the improvement of the product quality is facilitated, and the defective rate is reduced.
Further, before performing step S3A3, the following steps are also included:
step S3A5: opening the protective gas, heating the heating sheet to a preset temperature through the temperature controller, and keeping the preset temperature for a preset time;
further, after the step S3A3, the following steps are included:
S3A6: and opening the cooling gas, reducing the temperature to a preset value, and closing the eutectic table for vacuum suction. Specifically, in this embodiment, the cooling gas is nitrogen.
Further, the step S3A4 specifically includes the following steps:
step S3a41: obtaining an image of a substrate in a welding area;
step S3a42: acquiring an image of a chip;
step S3a43: and calibrating the orientation of the chip according to the acquired images of the substrate and the chip.
It can be understood that in the die bonding method of the present invention, the orientation calibration between the chip and the substrate is completed by image contrast, and the calibration precision is high.
Further, step S3B specifically includes the following steps:
step S3B1: identifying a substrate disposed within the photocured area;
specifically, the type of the substrate is confirmed, and the adhesive area and/or the adhesive point position on the substrate are/is obtained.
Step S3B2: the mechanical arm assembly moves to the operating head conversion frame to replace the operating head;
step S3B3: carrying out gluing treatment on a preset area of the substrate in the photocuring area;
step S3B4: the mechanical arm assembly moves to the operating head conversion frame to replace the operating head;
step S3B5: moving and placing a chip to be bonded to a preset area where glue is bonded;
step S3B6: and carrying out photocuring treatment on the substrate and the chip in the photocuring area.
It can be understood that in the die bonding method, the mechanical arm assembly can automatically replace the corresponding operating head according to different processes, and the die bonding method has high automation degree and strong universality.
Specifically, in the embodiment, before the chip and the substrate are moved, it is ensured that the operating head of the mechanical arm assembly is replaced by the corresponding suction head; before the viscose processing, the suction head is replaced by a corresponding viscose head.
Optionally, the gluing process includes a dispensing process and/or a painting process.
It can be understood that when the bonding area between the chip and the substrate is small, the dispensing treatment is adopted; when the bonding area between the chip and the substrate is large, glue painting treatment or glue dispensing and glue painting synergistic treatment can be selected.
Further, step S3B6 specifically includes the following steps:
step S3B61: moving the substrate with the chip placed in the irradiation area for photocuring;
step S3B62: the substrate with the chip placed thereon stays in the irradiation area for a preset time;
step S3B63: and removing the irradiated substrate, and simultaneously allowing the next substrate to enter the irradiation range of photocuring.
Further, step S3C specifically includes the following steps:
step S3C1: bonding a chip to be processed on a substrate positioned in the photocuring area; the specific steps can refer to step S3B.
Step S3C2: moving the photocured chip and the substrate and placing the chip and the substrate in a welding area;
step S3C3: and welding the chip and the substrate in the welding area.
Compared with the prior art, the die bonding equipment and the die bonding method have the following advantages:
1. the die bonding equipment is provided with a welding area and a photocuring area, and as can be understood, the mechanical arm assembly can enter the welding area or the photocuring area to perform corresponding operation under the control of the control module, and can also go between photocuring of the welding area; the operating head conversion frame is convenient for the mechanical arm assembly to rapidly change the operating head of the mechanical arm assembly, the mechanical arm assembly can complete various operation processes by replacing the operating head, and the functional diversity of the mechanical arm assembly is favorably enhanced.
2. According to the eutectic platform, the heating function is realized through the heating assembly in the bearing part, so that soldering tin is melted, the first vacuum suction holes can adsorb the substrate, and the substrate is prevented from being deviated; and the vent hole on the bearing part leads to the inert gas to be introduced into the solid crystal region through the vent hole during heating, thereby avoiding the oxidation of the substrate and the chip in the heating process.
3. The light curing area in the invention can ensure that two steps of light curing and glue drawing are not influenced mutually through the matching of the light curing platform and the irradiation device, the substrate with the glue drawing and the chips placed therein can be moved to the irradiation range through the driving assembly for light curing, and the mechanical arm assembly can continue to operate the substrate to be processed.
4. The vision adjusting module can assist in identifying the positioning positions of the substrate and the chip, and can conveniently and quickly pick up the substrate and the chip; in addition, can also finely tune the position of chip through the vision adjustment module at the removal with placing the chip in-process, make the cooperation of chip and base plate more accurate, do benefit to and improve solid brilliant quality.
5. In the die bonding method, the substrate to be processed is identified in advance, so that whether the subsequent process is welding or photocuring can be automatically judged; and transporting the substrate into the corresponding area.
6. In the die bonding method, the orientation of the chip is calibrated according to the orientation of the substrate before the chip is placed on the substrate in the welding area, so that the placement precision between the chip and the substrate can be effectively enhanced, the product quality is favorably improved, and the reject ratio is reduced.
7. In the die bonding method, the orientation calibration between the chip and the substrate is completed through image comparison, and the calibration precision is high.
8. In the die bonding method, the mechanical arm assembly can automatically replace the corresponding operating head aiming at different processes, and has high automation degree and strong universality.
9. In the die bonding method, the substrate after photocuring is moved away, and the lower substrate enters the photocuring irradiation range, so that the overall photocuring efficiency is improved.
The die bonding equipment and the die bonding method disclosed by the embodiment of the invention are described in detail, the principle and the embodiment of the invention are explained by applying specific examples, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for the persons skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present description should not be construed as a limitation to the present invention, and any modification, equivalent replacement, and improvement made within the principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A die bonding device is used for fixing a chip on a substrate, and is characterized in that: the die bonding equipment comprises a main body, wherein a mechanical arm assembly is arranged on the main body, at least welding areas and light curing areas which are arranged at intervals are defined on the main body, the die bonding equipment also comprises a control module, and the mechanical arm assembly, the welding areas and the light curing areas are respectively and electrically connected with the control module; the mechanical arm assembly can independently enter the welding area or the light curing area or sequentially enter the light curing area and the welding area to fix the chip on the substrate according to the type of the substrate under the control of the control module.
2. The die bonding apparatus according to claim 1, wherein: the welding zone comprises an eutectic platform, the eutectic platform comprises a bearing part and an upper cover arranged on the bearing part, a first vacuum suction hole is formed in the bearing part, and a heating assembly is arranged in the bearing part.
3. The die bonding apparatus according to claim 1, wherein: a light curing table and an irradiation device which are used for curing light curing glue are arranged in the light curing area, and the irradiation device emits light to irradiate at least one part of area of the light curing table; the light curing table and the irradiation device can be relatively moved so that the irradiation device can irradiate different areas on the light curing table.
4. The die bonding apparatus according to claim 1, wherein: the die bonding equipment further comprises a vision adjusting module for precision calibration, the vision adjusting module is electrically connected with the control module, and the vision adjusting module comprises a first vision component for observing the state of the substrate and a second vision component for observing the state of the chip; the mechanical arm assembly can also adjust the relative orientation of the chip and the substrate according to the sensing results of the first visual assembly and the second visual assembly.
5. A die bonding method, characterized in that the die bonding equipment according to any one of claims 1-3 is used for die bonding of a substrate, and the method comprises the following steps:
identifying a substrate to be die bonded, and confirming the type of the substrate;
transporting the substrate into a bonding area or a photocuring area;
moving a chip to be processed to be welded to a welding area and welding the chip to be processed to the substrate positioned in the welding area; or
Moving the chip to be processed to be bonded to a light curing area and bonding the chip to be processed to the substrate positioned in the light curing area; or the chip to be processed is firstly adhered to the substrate positioned in the photocuring area and then conveyed to the welding area for welding treatment.
6. The die bonding method according to claim 5, wherein the step of: the method for carrying out welding treatment on the substrate positioned in the welding area specifically comprises the following steps:
identifying a chip to be processed;
picking up a chip, moving and placing it on a substrate within a bonding pad;
and heating the substrate and the chip in the welding area for a preset time to complete welding.
7. The die attach method of claim 6, further comprising, prior to placing the die on the substrate in the bond pad, the steps of:
calibrating the orientations of the substrate and the chip;
and calibrating the orientation of the substrate or the chip according to the acquired substrate and chip images.
8. The die bonding method according to claim 5, wherein the step of: carrying out photocuring treatment on the substrate positioned in the photocuring area, and specifically comprising the following steps of:
identifying a substrate disposed within the photocured area;
carrying out gluing treatment on a preset area of the substrate in the photocuring area;
moving and placing a chip to be bonded to a preset area where glue is bonded;
and carrying out photocuring treatment on the substrate and the chip in the photocuring area.
9. The die bonding method according to claim 8, wherein: the adhesive treatment comprises adhesive dispensing treatment and/or painting treatment.
10. The die bonding method according to claim 8, wherein the step of: carrying out photocuring treatment on the substrate and the chip in the photocuring area, and specifically comprising the following steps of:
moving the substrate with the chip placed in the irradiation area for photocuring;
the substrate with the chip placed thereon stays in the irradiation area for a preset time;
and removing the irradiated substrate, and simultaneously allowing the next substrate to enter the irradiation range of photocuring.
CN202111438293.8A 2021-11-26 2021-11-26 Die bonding equipment and die bonding method Pending CN115410944A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111438293.8A CN115410944A (en) 2021-11-26 2021-11-26 Die bonding equipment and die bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111438293.8A CN115410944A (en) 2021-11-26 2021-11-26 Die bonding equipment and die bonding method

Publications (1)

Publication Number Publication Date
CN115410944A true CN115410944A (en) 2022-11-29

Family

ID=84155370

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111438293.8A Pending CN115410944A (en) 2021-11-26 2021-11-26 Die bonding equipment and die bonding method

Country Status (1)

Country Link
CN (1) CN115410944A (en)

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