CN115403386A - 一种晶须增强碳化硼复合陶瓷及其制备方法 - Google Patents
一种晶须增强碳化硼复合陶瓷及其制备方法 Download PDFInfo
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- 229910052580 B4C Inorganic materials 0.000 title claims abstract description 102
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 title claims abstract description 102
- 239000000919 ceramic Substances 0.000 title claims abstract description 86
- 239000002131 composite material Substances 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 238000005245 sintering Methods 0.000 claims abstract description 100
- 238000007731 hot pressing Methods 0.000 claims abstract description 37
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims description 36
- 239000011812 mixed powder Substances 0.000 claims description 35
- 235000015895 biscuits Nutrition 0.000 claims description 23
- 238000001035 drying Methods 0.000 claims description 23
- 238000000465 moulding Methods 0.000 claims description 22
- 239000002002 slurry Substances 0.000 claims description 21
- 238000002156 mixing Methods 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 18
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 238000009694 cold isostatic pressing Methods 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 12
- 229910021641 deionized water Inorganic materials 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000005469 granulation Methods 0.000 claims description 11
- 230000003179 granulation Effects 0.000 claims description 11
- 238000000227 grinding Methods 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 11
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 11
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- OFEAOSSMQHGXMM-UHFFFAOYSA-N 12007-10-2 Chemical compound [W].[W]=[B] OFEAOSSMQHGXMM-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 12
- 238000009766 low-temperature sintering Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000013078 crystal Substances 0.000 abstract description 6
- 230000003014 reinforcing effect Effects 0.000 abstract description 6
- 239000011159 matrix material Substances 0.000 abstract description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 17
- 238000000498 ball milling Methods 0.000 description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical class [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000012300 argon atmosphere Substances 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 7
- 239000010439 graphite Substances 0.000 description 7
- 238000013001 point bending Methods 0.000 description 5
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- 230000009471 action Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000007373 indentation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003623 enhancer Substances 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000001272 pressureless sintering Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
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- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
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- 230000002708 enhancing effect Effects 0.000 description 1
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- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
本发明涉及一种晶须增强碳化硼复合陶瓷,包括如下重量份的组分:碳化硼粉体50~99.5份、晶须0.5~20份、烧结助剂0‑10份、增强剂0‑20份;其中:碳化硼粉体的平均粒径为0.3~1.5μm,烧结助剂的平均粒径为0.2~3μm,增强剂的平均粒径为0.2~3μm。本发明通过添加晶须、烧结助剂和增强剂,所制备的晶须增强碳化硼复合陶瓷具有低密度、高硬度、高强度、高韧性和高弹性模量的特点。本发明还提供一种晶须增强碳化硼复合陶瓷的制备方法,该方法采用热压烧结法,以碳化硼为基体,同时添加增韧相陶瓷晶须、低温烧结助剂和增强相陶瓷颗粒。可以完成对晶须增强碳化硼复合陶瓷的低温烧结,并赋予晶须增强碳化硼复合陶瓷更高的致密度、硬度、韧性和强度,同时降低烧结温度,降低生产成本。
Description
技术领域
本发明属于陶瓷材料的技术领域,具体涉及一种晶须增强碳化硼复合陶瓷及其制备方法。
背景技术
碳化硼陶瓷有极高的硬度和低密度特点,是公认最优秀的防弹材料之一,尤其在单兵防弹、航空装甲等对重量敏感的领域,有绝对优势。
碳化硼防弹陶瓷的主要制备工艺有:反应烧结、无压烧结和热压烧结。其中,反应烧结和无压烧结制备碳化硼陶瓷,具有力学性能较差、性能不稳定等缺点,整体防弹性能较差,应用较少。市场上碳化硼陶瓷生产方法基本上是热压烧结。热压烧结碳化硼防弹陶瓷致密度、力学性能稳定,但其韧性依然较差,防多弹、重弹性能不够。
中国发明专利200610042047.X中公开了一种“碳化硼基复合防弹陶瓷及其制备方法”,该陶瓷由碳化硼粉体、碳化硅晶须、硅粉、硼化物(硼矸、硼酸、金属硼)组成,采用热压烧结,经过高温反应后,得到碳化硼—六硼化硅—碳化硅复合陶瓷。很明显,此类技术面临着反应不完全,微观结构不均匀,从而导致材料硬度低、可靠性低等问题,很难应用在防弹等高要求领域。
发明内容
(一)要解决的技术问题
为了解决现有技术的上述问题,本发明提供了一种晶须增强碳化硼复合陶瓷,通过添加晶须、烧结助剂和增强剂,所制备的晶须增强碳化硼复合陶瓷具有低密度、高硬度、高强度、高韧性和高弹性模量的特点。本发明还提供了晶须增强碳化硼复合陶瓷的制备方法,该制备方法能够完成对晶须增强碳化硼复合陶瓷的低温烧结,并赋予晶须增强碳化硼复合陶瓷更高的致密度、硬度、韧性和强度,同时降低烧结温度,降低生产成本。
(二)技术方案
为了达到上述目的,本发明采用的主要技术方案包括:
根据本发明的第一方面:一种晶须增强碳化硼复合陶瓷,包括如下重量份的组分:
碳化硼粉体:50~99.5份
晶须:0.5~20份
烧结助剂:0-10份
增强剂:0-20份
其中:
所述碳化硼粉体的平均粒径为0.3~1.5μm,所述烧结助剂的平均粒径为0.2~3μm,所述增强剂的平均粒径为0.2~3μm。
进一步地,包括如下重量份的组分:
碳化硼粉体:70~95份
晶须:5~10份
烧结助剂:0-10份
增强剂:0-20份。
进一步地,所述晶须为SiC、BN和SiBCN中的至少一种,所述晶须的直径为0.3~1.5μm,长径比为5~100。
进一步地,所述烧结助剂为硼粉、碳粉、TiO2、MgO、Al2O3、Y2O3、Ce2O3、Sm2O3中的至少一种。
进一步地,所述增强剂为TiB2、TiN、TiC、Ti(C,N)、ZrB2、WC、SiC和硼化钨中的至少一种。
根据本发明的另一方面,一种用于制备上述的晶须增强碳化硼复合陶瓷的方法,包括下述步骤:
S1:混料:将碳化硼粉体、晶须、烧结助剂和增强剂混匀,得到浆料;
S2:干燥:将浆料喷雾造粒,得到混合粉体;
S3:成型:将混合粉体压制成型,得到素坯;
S4:热压烧结:将素坯进行热压烧结,得到晶须增强碳化硼复合陶瓷。
进一步地,步骤S1中,所述混匀包括如下步骤:
S11:将碳化硼粉体、晶须、烧结助剂和增强剂加入去离子水中,超声分散10分钟,得到混合分散液体;
S12:将混合分散液体和研磨球放入球磨机,球料比为1:1,球磨10小时,得到浆料。
进一步地,步骤S2中,浆料喷雾造粒后的干燥温度为200~300℃,干燥后得到混合粉体。
进一步地,步骤S3中,将混合粉体利用钢模干压成型,获得相应形状的块体,再经过冷等静压成型,得到素坯;
其中,所述钢模干压成型和冷等静压成型的成型压力均为20~200 MPa。
进一步地,步骤S4中,热压烧结的温度为1800-2100℃,热压烧结时间为0.5-2小时,热压烧结压力为20-70MPa,热压烧结气氛为真空、氢气或者惰性气体;
其中:
热压烧结采用传统的热压烧结法或电流辅助烧结法。
(三)有益效果
本发明的有益效果是:
(1)本发明通过添加晶须、烧结助剂和增强剂,所制备的晶须增强碳化硼复合陶瓷具有低密度、高硬度、高强度、高韧性和高弹性模量的特点。与现有技术相比,密度≤2.85g/cm3,维氏硬度Hv>37 GPa,三点抗弯强度>544 MPa,压痕断裂韧性>4.5 MPa·m1/2,弹性模量> 452 GPa。
(2)本发明的晶须增强碳化硼复合陶瓷是理想的防弹材料,能够应用在防弹领域、高温承载件、耐磨件、耐腐蚀件及其它耐高温的关键零部件制备领域中。
(3)本发明的晶须增强碳化硼复合陶瓷的制备方法,该方法采用热压烧结法,以碳化硼为基体,同时添加增韧相陶瓷晶须、低温烧结助剂和增强相陶瓷颗粒,能够完成对晶须增强碳化硼复合陶瓷的低温烧结,并赋予晶须增强碳化硼复合陶瓷更高的致密度、硬度、韧性和强度,同时降低烧结温度,降低生产成本。
具体实施方式
为了更好的解释本发明,以便于理解,下面通过具体实施方式,对本发明作详细描述。
根据本发明的第一方面,一种晶须增强碳化硼复合陶瓷,包括如下重量份的组分:
碳化硼粉体:50~99.5份
晶须:0.5~20份
烧结助剂:0-10份
增强剂:0-20份
其中:
所述碳化硼粉体的平均粒径为0.3~1.5μm,所述烧结助剂的平均粒径为0.2~3μm,所述增强剂的平均粒径为0.2~3μm。
通过本发明的技术方案,第一,采用粒径0.3~1.5μm的碳化硼粉体,可以有效降低烧结温度,提高材料的力学性能;第二,所采用的的烧结助剂、增强剂粒径接近碳化硼粉体的粒径,有利于混合均匀,保证材料的可靠性;第三,在碳化硼粉体中加入晶须,能够利用晶须对裂纹的桥接、偏转等作用,从而显著提高碳化硼陶瓷的韧性、强度和可靠性;第四,通过加入烧结助剂,能够降低材料的烧结温度,降低烧结难度,达到细晶强化,提高碳化硼陶瓷的致密度和力学性能;第五,加入增强剂,利用颗粒的增强效应,不仅能够显著提高碳化硼陶瓷的硬度,且不会影响碳化硼陶瓷的韧性、强度,使其同时具有较高的硬度、韧性、强度。
碳化硼粉体、烧结助剂和增强剂的粒径选择,能够使各材料在混合体系中更好地分散和与其他成分间发生物理及化学作用,进而提升所制备的碳化硼陶瓷的物理化学性能。
进一步地,包括如下重量份的组分:
碳化硼粉体:70~95份
晶须:5~10份
烧结助剂:0-10份
增强剂:0-20份。
优选采用本实施例的配方比例,这也是发明人经常大量实验得出的较优比例。
进一步地,所述晶须为SiC、BN和SiBCN中的至少一种,所述晶须的直径为0.3~1.5μm,长径比为5~100。
本发明中,晶须优选的材料种类、直径和长径比,在与配方中其他材料的物理化学作用中,能够发挥较优的效果,使制备的碳化硼陶瓷具有较优的物理化学性能。当然,对晶须的选择并不限于本实施例中的三类,能够提高碳化硼陶瓷的韧性、强度和可靠性的晶须均可。
进一步地,所述烧结助剂为硼粉、碳粉、TiO2、MgO、Al2O3、Y2O3、Ce2O3、Sm2O3中的至少一种。
本发明中优选采用低温烧结助剂,不仅能够降低材料的烧结温度,而且能够降低烧结难度,达到细晶强化,提高碳化硼陶瓷的致密度和力学性能。且烧结助剂的选择并不限于本发明中的类别,能够降低烧结温度和提高碳化硼陶瓷性能的烧结助剂均可。
进一步地,所述增强剂为TiB2、TiN、TiC、Ti(C,N)、ZrB2、WC、SiC和硼化钨中的至少一种。
本发明中的增强剂具有较优的增强作用,利用颗粒增强效应,不仅可显著提高碳化硼陶瓷的硬度,且不会影响碳化硼陶瓷的韧性、强度,使其同时具有较高的硬度、韧性、强度。增强剂的选择并不限于本发明中的种类,能够发挥增强作用的增强剂均可。
根据本发明的另一方面,一种用于制备上述的晶须增强碳化硼复合陶瓷的方法,包括下述步骤:
S1:混料:将碳化硼粉体、晶须、烧结助剂和增强剂混匀,得到浆料;
S2:干燥:将浆料喷雾造粒,得到混合粉体;
S3:成型:将混合粉体压制成型,得到素坯;
S4:热压烧结:将素坯进行热压烧结,得到晶须增强碳化硼复合陶瓷。
通过本发明的制备方法,采用热压烧结法,以碳化硼为基体,同时添加增韧相陶瓷晶须、低温烧结助剂和增强相陶瓷颗粒,能够完成对晶须增强碳化硼复合陶瓷的低温烧结,并赋予晶须增强碳化硼复合陶瓷更高的致密度、硬度、韧性和强度,同时降低烧结温度,降低生产成本。
进一步地,步骤S1中,所述混匀包括如下步骤:
S11:将碳化硼粉体、晶须、烧结助剂和增强剂加入到去离子水中,超声分散10分钟,得到混合分散液体;
S12:将混合分散液体和研磨球放入球磨机,球料比为1:1,球磨10小时,得到浆料。
混料中,通过将各材料加入到去离子水中并超声分散,能够使各材料在超声的作用下,在去离子水中形成较为均匀的分散相,能有效解决晶须材料的团聚;然后再通过研磨球对分散相进行球磨,能够得到更加细致和均匀的浆料,便于后续工艺步骤的处理和提升最终产品碳化硼陶瓷的性能。
进一步地,步骤S2中,浆料喷雾造粒的干燥温度为200~300℃,干燥后得到混合粉体。
通过喷雾造粒,制得的混合粉体中颗粒球精度好,颗粒均匀,方便后续工艺步骤的处理和提升最终产品碳化硼陶瓷的性能。
进一步地,步骤S3中,将混合粉体利用钢模干压成型,获得相应形状的块体,再经过冷等静压成型,得到素坯;
其中,所述钢模干压成型和冷等静压成型的成型压力均为20~200 MPa。
钢模干压成型能够使混合粉体在模具内相互靠近,并借内摩擦力牢固地结合,形成一定形状的块(坯)体,干压成型生产效率高,人工少、废品率低,生产周期短,生产的制品密度大、强度高;再结合冷等静压成型,通过施加各向同等的压力,在高压的作用下,能够制得致密的坯体。两种成型方式连续结合使用,能够使制得的素坏具有较高的强度和致密度,方便后续工艺步骤的处理和提升最终产品碳化硼陶瓷的性能。
进一步地,步骤S4中,热压烧结的温度为1800-2100℃,热压烧结时间为0.5-2小时,热压烧结压力为20-70MPa,热压烧结气氛为真空、氢气或者惰性气体;
其中:
热压烧结采用传统的热压烧结法或电流辅助烧结法。
由于加入了低温烧结助剂,使本方案中的热压烧结在较低的烧结温度下就能够完成对晶须增强碳化硼复合陶瓷的烧结,并赋予晶须增强碳化硼复合陶瓷更高的致密度、硬度、韧性和强度,降低了生产成本。
本发明通过添加晶须、烧结助剂和增强剂,所制备的晶须增强碳化硼复合陶瓷具有低密度、高硬度、高强度、高韧性和高弹性模量的特点。与现有技术相比,密度≤2.85g/cm3,维氏硬度Hv>37 GPa,三点抗弯强度>544 MPa,压痕断裂韧性>4.5 MPa·m1/2,弹性模量> 452GPa。本发明的晶须增强碳化硼复合陶瓷是理想的防弹材料,并可应用在防弹、高温、耐磨、耐腐蚀等领域。
下面例举本发明的晶须增强碳化硼复合陶瓷及制备方法。
实施例1
B4C-SiC晶须-Y2O3-Al2O3-TiB2
S1:混料:将75重量份的B4C粉、10重量份的SiC晶须、2重量份的烧结助剂Y2O3、3重量份的烧结助剂Al2O3、20重量份的增强剂TiB2颗粒加入去离子水中,配成混合粉体,超声分散10分钟,得到混合分散液体;然后放入研磨球,球料比为1:1,球磨10小时,得到浆料;
S2:干燥:将球磨后的浆料喷雾造粒,干燥温度为200~300℃,得到混合粉体;
S3:成型:将混合粉体利用钢模干压成型,压力为30MPa,获得相应形状的块体,再经过冷等静压成型,压力为200MPa,得到素坯;
S4:热压烧结:将步骤S3制得的素坯放在石墨模具中,烧结温度为1900℃,加压至50MPa,氩气气氛保温1小时,得到晶须增强碳化硼复合陶瓷。
实施例2
B4C-SiC晶须-Al2O3-碳粉-TiB2
S1:混料:将75重量份的B4C粉、10重量份的SiC晶须、2重量份的烧结助剂Al2O3、4重量份的烧结助剂碳粉、25重量份的增强剂TiB2颗粒加入去离子水中,配成混合粉体,超声分散10分钟;然后放入研磨球,球料比为1:1,球磨10小时,得到浆料;
S2:干燥:将球磨后的浆料喷雾造粒,干燥温度为200~300℃,得到混合粉体;
S3:成型:将混合粉体利用钢模干压成型,压力为30MPa,获得相应形状的块体,再经过冷等静压成型,压力为200MPa,得到素坯;
S4:热压烧结:将步骤S3制得的素坯放在石墨模具中,烧结温度为1800℃,加压至50MPa,氩气气氛保温1小时,得到晶须增强碳化硼复合陶瓷。
实施例3
B4C-SiC晶须-Y2O3-碳粉-TiB2-TiC
S1:混料:将70重量份的B4C粉、10重量份的SiC晶须、1重量份的烧结助剂Y2O3、1重量份的烧结助剂碳粉、20重量份的增强剂TiB2颗粒、5重量份的增强剂TiC颗粒加入去离子水中,配成混合粉体,超声分散10分钟;然后放入研磨球,球料比为1:1,球磨10小时,得到浆料;
S2:干燥:将球磨后的浆料喷雾造粒,干燥温度为200~300℃,得到混合粉体;
S3:成型:将混合粉体利用钢模干压成型,压力为30MPa,获得相应形状的块体,再经过冷等静压成型,压力为200MPa,得到素坯;
S4:热压烧结:将步骤S3制得的素坯放在石墨模具中,烧结温度为1900℃,加压至50MPa,氩气气氛保温1小时,得到晶须增强碳化硼复合陶瓷。
对比例1
B4C-SiC晶须
S1:混料:将90重量份的B4C粉、10重量份的SiC晶须加入去离子水中,配成混合粉体,超声分散10分钟;然后放入研磨球,球料比为1:1,球磨10小时,得到浆料;
S2:干燥:将球磨后的浆料喷雾造粒,干燥温度为200~300℃,得到混合粉体;
S3:成型:将混合粉体利用钢模干压成型,压力为30MPa,获得相应形状的块体,再经过冷等静压成型,压力为200MPa,得到素坯;
S4:热压烧结:将步骤S3制得的素坯放在石墨模具中,烧结温度为2100℃,加压至70MPa,氩气气氛保温1小时,得到晶须增强碳化硼复合陶瓷。
对比例2
B4C-SiC晶须-Y2O3
S1:混料:将80重量份的B4C粉、20重量份的SiC晶须、5重量份的烧结助剂Y2O3加入去离子水中,配成混合粉体,超声分散10分钟;然后放入研磨球,球料比为1:1,球磨10小时,得到浆料;
S2:干燥:将球磨后的浆料喷雾造粒,干燥温度为200~300℃,得到混合粉体;
S3:成型:将混合粉体利用钢模干压成型,压力为30MPa,获得相应形状的块体,再经过冷等静压成型,压力为200MPa,得到素坯;
S4:热压烧结:将步骤S3制得的素坯放在石墨模具中,烧结温度为1950℃,加压至50MPa,氩气气氛保温1小时,得到晶须增强碳化硼复合陶瓷。
对比例3
B4C-SiC晶须-Y2O3-Al2O3
S1:混料:将75重量份的B4C粉、10重量份的SiC晶须、2重量份的烧结助剂Y2O3、3重量份的烧结助剂Al2O3加入去离子水中,配成混合粉体,超声分散10分钟;然后放入研磨球,球料比为1:1,球磨10小时,得到浆料;
S2:干燥:将球磨后的浆料喷雾造粒,干燥温度为200~300℃,得到混合粉体;
S3:成型:将混合粉体利用钢模干压成型,压力为30MPa,获得相应形状的块体,再经过冷等静压成型,压力为200MPa,得到素坯;
S4:热压烧结:将步骤S3制得的素坯放在石墨模具中,烧结温度为1900℃,加压至70MPa,氩气气氛保温1小时,得到晶须增强碳化硼复合陶瓷。
对比例4
B4C-SiC晶须-TiB2
S1:混料:将75重量份的B4C粉、10重量份的SiC晶须、15重量份的TiB2加入去离子水中,配成混合粉体,超声分散10分钟;然后放入研磨球,球料比为1:1,球磨10小时,得到浆料;
S2:干燥:将球磨后的浆料喷雾造粒,干燥温度为200~300℃,得到混合粉体;
S3:成型:将混合粉体利用钢模干压成型,压力为30MPa,获得相应形状的块体,再经过冷等静压成型,压力为200MPa,得到素坯;
S4:热压烧结:将步骤S3制得的素坯放在石墨模具中,烧结温度为2100℃,加压至70MPa,氩气气氛保温1小时,得到晶须增强碳化硼复合陶瓷。
通过实施例和对比例:用金刚石工具分别对实施例1~3和对比例1~4所制得的晶须增强碳化硼复合陶瓷进行加工,用各实施例的晶须增强碳化硼复合陶瓷分别制成多根3mm×4mm×36mm的样条。样条用于测试碳化硼复合陶瓷的性能。
实施例1~3和对比例1~4制备的碳化硼复合陶瓷样条进行如下性能测试:
(a)密度:采用密度天平,按照阿基米德法测试。
(b)三点抗弯强度:样条中的10根用于测试碳化硼复合陶瓷的三点抗弯强度,外跨距30 mm。
(c)维氏硬度与压痕断裂韧性测试方法:利用维氏硬度计测试,压力0.5kg,保压10s。
(d)弹性模量:采用声波振动法。
其中:密度主要用于测量材料的致密性;三点抗弯强度、维氏硬度和弹性模量是与材料的性能相关的,数值越高越好。
表1 实施例1~3和对比例1~4制备的碳化硼复合陶瓷的性能测试结果
通过性能测试结果可知,与对比例相比,本发明的实施例中,密度≤2.85g/cm3,维氏硬度Hv>37 GPa,三点抗弯强度>544 MPa,压痕断裂韧性>4.5 MPa·m1/2,弹性模量> 452GPa。
最后应说明的是:以上所述的各实施例仅用于说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述实施例所记载的技术方案进行修改,或者对其中部分或全部技术特征进行等同替换;而这些修改或替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。
Claims (10)
1.一种晶须增强碳化硼复合陶瓷,其特征在于:包括如下重量份的组分:
碳化硼粉体:50~99.5份
晶须:0.5~20份
烧结助剂:0-10份
增强剂:0-20份
其中:
所述碳化硼粉体的平均粒径为0.3~1.5μm,所述烧结助剂的平均粒径为0.2~3μm,所述增强剂的平均粒径为0.2~3μm。
2.根据权利要求1所述的晶须增强碳化硼复合陶瓷,其特征在于:包括如下重量份的组分:
碳化硼粉体:70~95份
晶须:5~10份
烧结助剂:0-10份
增强剂:0-20份。
3.根据权利要求1所述的晶须增强碳化硼复合陶瓷,其特征在于:所述晶须为SiC、BN和SiBCN中的至少一种,所述晶须的直径为0.3~1.5μm,长径比为5~100。
4.根据权利要求1所述的晶须增强碳化硼复合陶瓷,其特征在于:所述烧结助剂为硼粉、碳粉、TiO2、MgO、Al2O3、Y2O3、Ce2O3、Sm2O3中的至少一种。
5.根据权利要求1所述的晶须增强碳化硼复合陶瓷,其特征在于:所述增强剂为TiB2、TiN、TiC、Ti(C,N)、ZrB2、WC、SiC和硼化钨中的至少一种。
6.一种用于制备权利要求1-5中任意一项所述的晶须增强碳化硼复合陶瓷的方法,其特征在于:包括下述步骤:
S1:混料:将碳化硼粉体、晶须、烧结助剂和增强剂混匀,得到浆料;
S2:干燥:将浆料喷雾造粒,得到混合粉体;
S3:成型:将混合粉体压制成型,得到素坯;
S4:热压烧结:将素坯进行热压烧结,得到晶须增强碳化硼复合陶瓷。
7.根据权利要求6所述的晶须增强碳化硼复合陶瓷的制备方法,其特征在于:
步骤S1中,所述混匀包括如下步骤:
S11:将碳化硼粉体、晶须、烧结助剂和增强剂加入去离子水中,超声分散10分钟,得到混合分散液体;
S12:将混合分散液体和研磨球放入球磨机,球料比为1:1,球磨10小时,得到浆料。
8.根据权利要求6所述的晶须增强碳化硼复合陶瓷的制备方法,其特征在于:
步骤S2中,浆料喷雾造粒的干燥温度为200~300℃,干燥后得到混合粉体。
9.根据权利要求6所述的晶须增强碳化硼复合陶瓷的制备方法,其特征在于:
步骤S3中,将混合粉体利用钢模干压成型,获得相应形状的块体,再经过冷等静压成型,得到素坯;
其中,所述钢模干压成型和冷等静压成型的成型压力均为20~200 MPa。
10.根据权利要求6所述的晶须增强碳化硼复合陶瓷的制备方法,其特征在于:
步骤S4中,热压烧结的温度为1800-2100℃,热压烧结时间为0.5-2小时,热压烧结压力为20-70MPa,热压烧结气氛为真空、氢气或者惰性气体;
其中:
热压烧结采用传统的热压烧结法或电流辅助烧结法。
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