CN115397049A - Heating assembly - Google Patents

Heating assembly Download PDF

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Publication number
CN115397049A
CN115397049A CN202210194221.1A CN202210194221A CN115397049A CN 115397049 A CN115397049 A CN 115397049A CN 202210194221 A CN202210194221 A CN 202210194221A CN 115397049 A CN115397049 A CN 115397049A
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CN
China
Prior art keywords
heating
heat transfer
region
groove
transfer member
Prior art date
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Granted
Application number
CN202210194221.1A
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Chinese (zh)
Other versions
CN115397049B (en
Inventor
金龙洙
金亨源
郑熙锡
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GigaLane Co Ltd
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GigaLane Co Ltd
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Publication date
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Publication of CN115397049A publication Critical patent/CN115397049A/en
Application granted granted Critical
Publication of CN115397049B publication Critical patent/CN115397049B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • H01J37/32449Gas control, e.g. control of the gas flow
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/0004Devices wherein the heating current flows through the material to be heated
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • H05B3/06Heater elements structurally combined with coupling elements or holders

Abstract

An embodiment of the present invention discloses a heating assembly, including: a heating member formed to generate heat; a heating body receiving heat generated by the heating member; and a heat transfer member disposed in at least one region between the heating body and the heating member.

Description

Heating assembly
Technical Field
The present invention relates to a heating assembly.
Background
As technology develops, a wide variety of electrical and electronic devices are manufactured and used, and these electronic devices may be formed with electrical or electronic characteristics through a wide variety of processes.
In addition, semiconductor processes using gases or plasmas generated from gases are used in processes for forming a variety of electrical or electronic characteristics in these electronic devices.
To prevent the gases from condensing into clusters during such semiconductor processing, devices including heating elements may be used to apply heat to the gases.
On the other hand, when the heating member is utilized according to diverse conditions and kinds of semiconductor processes, there is a limitation in effectively transferring heat.
Disclosure of Invention
Technical problem
The present invention can provide a heating assembly that reduces heat loss and improves heat transfer efficiency.
Technical scheme
An embodiment of the present invention discloses a heating assembly, including: a heating member formed to generate heat; a heating body receiving heat generated by the heating member; and a heat transfer member disposed in at least one region between the heating body and the heating member, wherein the heating body includes a concave groove formed corresponding to the heat transfer member, the heating member is disposed to face at least one region of an inner side surface of the concave groove, and the heat transfer member includes a side surface member formed between the heating member and the inner side surface of the concave groove to face the heating member and the inner side surface of the concave groove.
In this embodiment, the heat transfer member may be disposed such that at least one region thereof protrudes from the groove when the heat transfer member is disposed in the groove.
In this embodiment, the heat transfer member may be formed to include an upper member formed to cover an upper surface of the heating member.
In this embodiment, the side member may be connected to the upper side member and formed to correspond to at least two facing sides of the heating member.
In this embodiment, the upper member may include an opposing surface that faces the heating member, and the opposing surface of the upper member may be formed to have a shape corresponding to an upper surface of the heating member.
In this embodiment, the heat transfer member includes a lower member connected to the side member and disposed to face the upper member with the heating member interposed therebetween.
In this embodiment, the heating assembly may include a clamp portion disposed on the heating body portion and formed to support one region of the heat transfer member.
In this embodiment, the clamping portion may fix the heating member in a manner of applying a pressure to one region of the outer surface of the heat transfer member.
In this embodiment, the clamp portion may be configured not to correspond to and spaced apart from the inner space of the groove.
In this embodiment, the clamp portion may be formed to have a form extending from a region spaced apart from the groove in the one surface of the heating body portion to correspond to a position overlapping with at least one region of the groove.
In this embodiment, the clamp portion may be formed to have a curved form between a region spaced apart from the groove and a region overlapping at least one region of the groove.
In this embodiment, the heating assembly may be formed with a spaced space at least one region between the side member and the heating member.
Other aspects, features, and advantages in addition to those previously described will become apparent from the following drawings, claims, and detailed description of the invention.
ADVANTAGEOUS EFFECTS OF INVENTION
The heating assembly of the present invention can reduce heat loss and easily improve heat transfer efficiency.
Drawings
Fig. 1 is a schematic cross-sectional view showing a heating assembly relating to an embodiment of the present invention.
Fig. 2 is an exemplary perspective view of the heating assembly of fig. 1 viewed from one direction.
Fig. 3 is a perspective view exemplarily showing a heating part of the heating assembly of fig. 2.
Fig. 4 is a perspective view exemplarily illustrating a heat transfer member of the heating assembly of fig. 2.
Fig. 5 is an exemplary diagram for use with a heating assembly in connection with an embodiment of the invention.
Fig. 6 is a schematic enlarged view of B of fig. 5.
Description of the symbols
100: heating assembly, 110: heating body, 111: groove, 120: heat transfer member, 121, 122: side member, 123: upper member, 123C: facing surface, 125: lower member, 130: clamp portion, HB: heating means, SH: shower head, SA: spacer, SW: material to be treated, DEW: a dielectric window.
Detailed Description
The constitution and action of the present invention will be described in detail with reference to the embodiments of the present invention shown in the drawings.
While the invention is susceptible to various modifications and alternative embodiments, specific embodiments thereof are shown in the drawings and will herein be described in detail. The effects and features of the present invention and the method of achieving the same will become apparent in the course of referring to embodiments described in detail later with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings, in which the same or corresponding constituent elements are given the same reference numerals, and repeated description thereof will be omitted.
In the following embodiments, the terms first, second, etc. are used for the purpose of distinguishing one constituent element from another constituent element, and are not used in a limiting sense.
In the following embodiments, the singular expressions include the plural expressions unless the context clearly defines otherwise.
In the following embodiments, the terms including or having mean that there are the features or constituent elements described in the specification, and do not exclude the possibility of adding one or more other features or constituent elements in advance.
In the drawings, the sizes of constituent elements may be exaggerated or reduced for convenience of description. For example, the size and thickness of each member shown in the drawings are arbitrarily illustrated for convenience of description, and thus the present invention is not limited to the illustration.
In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on an orthogonal coordinate system, but may be broadly construed to include the meanings thereof. For example, the x-axis, the y-axis, and the z-axis may be orthogonal to each other, but may also refer to different directions from each other that are not orthogonal to each other.
Where an embodiment may be implemented differently, the particular process sequence may be performed differently than described. For example, two processes described in succession may be executed substantially concurrently, or may be executed in the reverse order to that described.
Fig. 1 is a schematic sectional view showing a heating assembly relating to an embodiment of the present invention.
The heating assembly 100 of the present embodiment may include a heating member HB, a heating body 110, and a heat transfer member 120.
The heating part HB described in the present application can be used for various purposes. As an example, it may be used in applications where heat is applied to an apparatus that processes a material to be processed (e.g., SW of fig. 5) such as a substrate or wafer using one or more gases, ions, or plasmas.
As a specific example, the heating part HB may be applied to an apparatus that performs an etching process, a cleaning process, an ashing (ashing) process, an evaporation process, an ion implantation process, or the like on a material to be processed.
As an alternative embodiment, the heating member HB may also be utilized adjacent to or to transfer heat to a shower head (e.g., SH of fig. 5) that supplies gas in the direction of the material being processed.
The heating part HB may be formed to generate heat. For example, the heat may be generated by a heating element provided inside the tube in which the hollow portion is formed or hot water circulating inside the tube in which the hollow portion is formed.
As an alternative embodiment, the heating member HB may be formed to generate heat by applying current from a power supply, and as a specific example, may have a heat generating body in the form of a coil formed of a metal material.
As an alternative example, the heating member HB may have a curved surface with respect to the thickness direction, and for example, the heating member HB may have a cross-sectional shape close to a circle.
The heating body 110 may be formed to receive heat generated from the heating member HB. The heating body 110 may receive heat generated by the heating member HB and transfer it to a member adjacent to the heating body 110. As an alternative embodiment, the heating body 110 may transfer heat to the showerhead SH or a gas supply (not shown) or a dielectric window (e.g., the DEW of fig. 5) or the like.
The heating body 110 may be formed of various materials, may be formed of a metal material so as to be capable of effectively transferring heat, and may also contain, for example, aluminum, steel, etc., or include an alloy thereof. As a specific example, it may be formed of an aluminum-based material.
The heating member HB may be disposed in one region on the upper surface of the heating body 110.
As an alternative embodiment, the heating body 110 may include a groove 111 in an upper region thereof. The heating member HB may be disposed in the recess 111 of the heating body 110.
The form of the groove 111 of the heating body 110 may be various, and for example, may be a groove form having a depth in the thickness direction of the heating body 110 and a width in the direction crossing it. At this time, the width of the groove 111 may be constant according to the depth. However, as another example not shown, the width of the groove 111 may be different depending on the depth, and as a specific example, the inner side surface of the groove 111 may be formed to have a curved surface form.
As an alternative embodiment, the groove 111 of the heating body 110 may be formed to have a shape corresponding to the heat transfer member 120 described later so as to be suitable for the arrangement of the heat transfer member 120, and may be formed to have a shape corresponding to the outer side surface of the heat transfer member 120 or to be in close contact with the outer side surface, for example.
Further, as an alternative embodiment, the heating body 110 may be formed to have a spacing portion SA, and such a spacing portion SA may be a region where the heating body 110 is not formed, for example, in an open form. As a specific example, such a spacer SA may correspond to a region for inflow or travel of a raw material gas or the like used in a process for a material to be processed.
The heat transfer member 120 may be formed to be disposed in at least one region between the heating body 110 and the heating member HB. Thereby, heat radiation into the air due to the exposure of the heating member HB to the air, which is the outside of the heating body 110, is reduced or prevented, and heat generated at least one region or the whole of the heating member HB can be transferred to the heating body 110 through the heat transfer member 120. In order to improve the heat transfer efficiency, the heat transfer member 120 may be formed of a material having good heat transfer characteristics, for example, a metal material.
As an alternative embodiment, the heat transfer member 120 may be formed of the same material as the heating body 110, for example, an aluminum-series material.
The heat transfer member 120 may be disposed on one surface of the heating body 110, and may be disposed to correspond to the groove 111 of the heating body 110, for example. As a specific example, at least one region may be formed to be received in the groove 111 of the heating body 110 in the thickness direction of the heat transfer member 120.
The heat transfer member 120 may have various forms, and may include, for example, at least one of an upper side member 123, side members 121, 122, and a lower side member 125.
The upper member 123 is located on one side of the heating member HB, for example, in a direction opposite to the direction toward the recess 111, that is, in an upper direction of the heating member HB, and may be formed to cover an upper surface of the heating member HB as a specific example. This can effectively reduce the loss of heat generated by heating member HB due to heat dissipation in a direction away from the upper surface of heating body 110.
As an alternative example, the upper member 123 may have a shape corresponding to the inner side surface of the groove 111, and may be formed to be in close contact with or adjacent to the inner side surface of the groove 111, for example.
The upper member 123 may include an opposite surface 123C opposite to the heating member HB. Such facing surfaces 123C may be connected with the space SR between the side members 121, 122.
As an alternative embodiment, the facing surface 123C may be formed to have a form corresponding to the upper surface of the heating member HB, for example, may be formed to have a curved surface form corresponding to the curved surface of the upper surface of the heating member HB.
As a specific example, the facing surface 123C may be formed to have a circular-arc or semicircular sectional shape so as to correspond to a part of a circular section with reference to the thickness direction of the heating member HB. In addition, as an example, at least one region of the facing surface 123C may be in contact with or in close contact with the upper side of the heating member HB. This effectively reduces heat loss due to heat generated by the heating member HB being easily transmitted to the upper member 123 or the side members 121 and 122 through the facing surface 123C, and improves heat efficiency.
Further, for example, the heating member HB may be supported by the upper member 123, so that a stable arrangement of the heating member HB may be easily maintained.
As an alternative embodiment, the heat transfer member 120 may further include side members 121, 122 formed to be connected with the upper side member 123.
The side surface members 121 and 122 of the heat transfer member 120 facing each other may be disposed between the inner surface of the concave groove 111 and the heater block HB. As an alternative embodiment, the side members 121 and 122 may have a shape corresponding to the inner side surface of the groove 111, and may be formed to abut or be adjacent to the inner side surface of the groove 111, for example.
The heat transfer area is increased by the side members 121, 122, so that the heat efficiency is increased when the heat generated from the heating elements HB is transferred to the heating body 110 through the inner sides of the groove 111, and the heat generated from the heating elements HB is reduced from being radiated to the air to be lost.
As an alternative embodiment, the heat transfer member 120 may further include a lower member 125, and the lower member 125 is connected to the side members 121 and 122 connected to the upper member 123 and is disposed to face the upper member 123 with the heating member HB interposed therebetween.
The lower member 125 may be accommodated in the groove 111, and may be disposed to contact an inner bottom surface of the groove 111. Accordingly, the area of the heating member HB through which heat is transferred to the heating body 110 in the downward direction is increased, and the heat generated from the heating member HB may be reduced from being dissipated into the air and lost.
The lower member 125 may have various shapes, and may be formed to be connected to inner surfaces of the side members 121 and 122 facing each other, respectively.
As an alternative embodiment, the upper member 123 and the side members 121 and 122 may have an integrally extended structure, and the lower member 125 may be coupled to a region of the inner side of each of the side members 121 and 122 facing each other, for example, by welding. As a specific example, the lower member 125 and the side members 121 and 122 may be joined by welding after the heating member HB is accommodated in a structure in which the upper member 123 and the side members 121 and 122 integrally extend. On the other hand, instead of the welding, the welding may be performed by various methods such as interference fit or screws.
Accordingly, the heat transfer member 120 can be easily accommodated inside the heat transfer member 120, and the heat transfer member 120 accommodating the heat transfer member HB can be disposed in the concave groove 111, thereby effectively transferring heat to the heating body 110.
The thickness of the upper member 123 may be various. For example, it may have a first thickness T1 and a second thickness T2. The second thickness T2 may have a variable value, for example, corresponding to a thickness in a region between the facing surface 123C and the upper surface of the upper member 123 (for example, a surface facing in a direction opposite to the direction facing the lower member 125), and the first thickness T1 may have a value larger than the second thickness T2, for example, corresponding to a maximum value of a thickness between the lower surface of the upper member 123 (for example, a surface facing the lower member 125) and the facing surface 123C in a region between the facing surface 123C and the side members 121 and 122.
The lower member 125 may have a third thickness T3.
As an alternative embodiment, the first thickness T1 and the second thickness T2 of the upper member 123 may have values greater than the third thickness T3 of the lower member 125, respectively. By the thicker upper side member 123, heat loss in a direction away from the upper face of the heating body 110 can be effectively reduced or blocked, and heat transfer efficiency to the heating body 110 can be improved. Further, the supporting effect of the heating member HB by the upper side member 123 can be easily increased.
Further, as an alternative embodiment, the first thickness T1 and the second thickness T2 of the upper member 123 may have a value greater than the thickness of each of the side members 121, 122 (for example, the thickness with reference to the X-axis direction of fig. 1), respectively, the effect of reducing heat loss to the upper side may be increased, and the effect of direct heat transfer to the side members 121, 122 may be improved.
As an alternative embodiment, the clamp part 130 may be configured in such a manner as to support one region of the heat transfer member 120. For example, the clamp part 130 may be formed to support the upper member 123 of the heat transfer member 120.
As a specific example, one region of the clamp part 130 may be disposed on the heating body 110 and may be fixed to one region of the heating body 110, and the other region extended therefrom may support the upper surface of the upper member 123 of the heat transfer member 120 or may apply pressure so that the heat transfer member 120 is in close contact with the heating body 110. Thereby, the heat transferred to the heat transfer member 120 is enabled to be efficiently transferred to the heating body 110.
The clamp portion 130 may be formed of various materials, for example, a material different from the heat transfer member 120, and as a specific example, a material having a lower thermal conductivity than the heat transfer member 120.
As an alternative embodiment, the clamp portion 130 may be formed to include a non-metal material, such as a plastic material.
Thereby, the heat transferred to the heat transfer member 120 is enabled to be efficiently transferred to the heating body 110, not to the clamp portion 130.
The heating member HB generating heat of the present embodiment may be accommodated in the inner space of the heat transfer member 120, and the heat transfer member 120 accommodating the heating member HB may be disposed at the heating body 110, thereby reducing the heat generated from the heating member HB from being radiated or lost in a direction away from the heating body 110 and enabling the heat to be efficiently transferred to the heating body 110. In addition, for example, the heat transfer member 120 has a box-like shape with respect to the thickness direction, and by disposing the heat transfer member 120 in the concave groove 111 corresponding to the shape of the heat transfer member 120, at least one region can be accommodated in the concave groove 111 in the thickness direction of the heat transfer member 120. This increases the heat transfer area to the heating body 110, and increases the effect of reducing heat loss.
Further, as an alternative embodiment, while maintaining the effect of reducing heat loss and the effect of improving heat transfer by disposing the jig part 130 so as to support the heat transfer member 120 from the upper side, by fixing the heat transfer member 120 to the heating body part 110, the disposition of the heat transfer member 120 can be stably maintained even with the passage of time or by performing a plurality of processes.
Fig. 2 is an exemplary perspective view of the heating assembly of fig. 1 viewed from one direction.
Fig. 3 is a perspective view exemplarily showing a heating part of the heating assembly of fig. 2, and fig. 4 is a perspective view exemplarily showing a heat transfer part of the heating assembly of fig. 2.
Referring to fig. 2, the heating body 110 of the heating assembly 100 may be formed to have a curved edge, for example, an edge that is approximately circular.
Further, the heating body 110 may be formed to have a partition SA having an open form inside, and as a specific example, may be formed to surround the partition SA.
The heating body 110 may include a groove 111 corresponding to the heat transfer member 120, and the groove 111 may have a form surrounding the space SA, for example, may have a circular form on a plane.
The heat transfer member 120 may be configured to correspond to the groove 111 and have a form surrounding the space SA, for example, may have a circular form on a plane.
The heat transfer member 120 may be supported by the plurality of clamp portions 130 in one region disposed above the recess 111.
As an alternative embodiment, the plurality of clamp portions 130 may be configured to be spaced apart from each other, and may be arranged in plurality, for example, in the circumferential direction of the heat transfer member 120.
Referring to fig. 3, the heating member HB may have a curved planar form, and a cross-section may have a circular coil form. For example, the heating member HB may be formed in a shape having a circular edge surrounding at least one region of the spacer SA of the heating body 110.
Exemplarily, the heating part HB may include a first terminal HBT1 and a second terminal HBT2 formed to be connected to an external power source or a pump. As a specific example, first terminal HBT1 and second terminal HBT2 may be connection portions for connecting heating member HB with an external member.
When heating member HB is disposed in the space inside heat transfer member 120, first end HBT1 and second end HBT2 may have a shape protruding to the outside of heat transfer member 120.
For example, first and second ends HBT1 and HBT2 of heating member HB may be formed to be spaced apart from each other and to project in a direction away from groove 111, for example, upward. This can improve the reliability of connection to the power supply or the pump while maintaining the heat generation effect of the heating member HB.
As an alternative embodiment, when a heating element is provided inside heating member HB, it is possible to input a current to one of first terminal HBT1 and second terminal HBT2 and output a current from the other. On the other hand, when hot water circulates inside the heating member HB, it is possible to introduce the hot water to one of the first terminal HBT1 and the second terminal HBT2 and to lead the hot water from the other.
Referring to fig. 2 and 4, heat transfer member 120 may include through region 120H in such a manner as to extend through first and second end HBT1 and HBT2 of heating member HB. For example, the through region 120H may be formed in one region of the upper member 123 of the heat transfer member 120.
The heat transfer member 120 may be formed to surround the space SA, and may have a circular planar shape corresponding to the heating member HB, for example.
As an exemplary manufacturing method, after the heating part HB is inserted into the inner space of the integrated structure of the side members 121 and 122 and the upper member 123 on both sides, the lower member 125 may be coupled, and as a specific example, the lower member 125 and the side members 121 and 122 may be connected by welding.
Fig. 5 is an exemplary view for use of a heating assembly relating to an embodiment of the present invention, and fig. 6 is a schematic enlarged view of B of fig. 5.
Referring to fig. 5, as an example, a shower head SH is disposed adjacent to the heating element 100. For example, the shower head SH may be formed to flow more than one gas into the material SW to be processed.
Further, a material SW to be processed to be subjected to a process by gas distribution or a process using a plasma reaction may be disposed at a lower portion of the shower head SH. For example, the material SW to be processed may be a substrate, a wafer, or the like.
The shower head SH may be disposed in an inner region of the heating body 110 of the heating module 100, and may be disposed adjacent to, for example, one region of the lower surface of the heating body 110, which is the opposite surface to the surface on which the heating member HB is disposed.
As an alternative embodiment, a dielectric window DEW may be arranged in the inner region of the heating body 110. For example, the heating member HB may be disposed adjacent to a region on the upper surface of the heating body 110, which is the opposite surface to the surface on which the heating member HB is disposed.
The dielectric window DEW may support a gas supply part (not shown) that supplies gas to the showerhead SH.
Accordingly, when heat generated from the heating member HB is transferred to the shower head SH, the dielectric window DEW, the gas supply unit (not shown), or the like through the heating body 110, uniformity of heat transfer is improved, and defects due to local heat concentration can be reduced.
Referring to fig. 6, the clamp part 130 may include a first contact part 131 interfacing with the upper member 123 and a second contact part 132 interfacing with the heating body 110, and the clamp part 130 may be formed to form a spaced region when one region of the clamp part 130 is fixed to the heating body 110 and the other region supports the upper member 123 of the heat transfer member 120.
For example, the interval region ET of the heating body 110 and the interval region ES of the upper side member 123 may be spaced apart from the clamp portion 130. Accordingly, heat generated from the heating member HB may be prevented from being unnecessarily stopped at the clamp part 130 or lost through the clamp part 130 after being transferred to the heat transfer member 120 or the heating body 110.
As a result, the effect of improving the heat transfer characteristics and reducing the heat loss with the heating assembly 100 can be easily increased.
While the invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those of ordinary skill in the art will understand that various modifications and equivalent other embodiments can be made therein. Therefore, the true technical scope of the present invention should be defined by the technical idea of the appended claims.
The particular implementations described in the examples are examples and are not intended to limit the scope of the examples in any way. Further, unless specifically mentioned as "indispensable", "important", etc., it may not be an indispensable constituent element for the application of the present invention.
In the description of the embodiments (and in the claims especially), the use of the terms "a", "an", and similar referents may correspond to both the singular and the plural. Further, when a range (range) is recited in the embodiments, the invention including application of individual values belonging to the range (unless otherwise stated) is equivalent to the description of each individual value constituting the range in the detailed description. Finally, as for the steps constituting the method of the embodiment, the steps may be performed in an appropriate order unless an order is explicitly described or otherwise described. The order of the steps is not necessarily limited to the examples. The use of all examples or exemplary terms (e.g., etc.) in an embodiment is intended only to provide a detailed description of the embodiment, and the scope of the embodiment is not intended to be limited by these examples or exemplary terms, unless otherwise specified by the claims. Further, it will be understood by those of ordinary skill in the art that various modifications, combinations, and variations may be made in accordance with design conditions and factors within the scope of the appended claims or their equivalents.

Claims (12)

1. A heating assembly, comprising:
a heating member formed to generate heat;
a heating body receiving heat generated by the heating member; and
a heat transfer member disposed in at least one region between the heating body and the heating member,
the heating body includes a groove formed corresponding to the heat transfer member,
the heating member is disposed to face at least one region of the inner side of the groove,
the heat transfer member includes a side member formed between the heating member and the inner side surface of the recess so as to face the heating member and the inner side surface of the recess.
2. The heating assembly of claim 1,
the heat transfer member is disposed such that at least one region is projected from the groove when the heat transfer member is disposed in the groove.
3. The heating assembly of claim 1,
the heat transfer member is formed to include an upper member formed to cover an upper surface of the heating member.
4. The heating assembly of claim 3,
the side member is connected to the upper member and formed to correspond to at least two facing sides of the heating member.
5. The heating assembly of claim 4,
the upper member includes an opposing surface that opposes the heating member,
the upper member has an opposing surface formed to correspond to an upper surface of the heating member.
6. The heating assembly of claim 4,
the heat transfer member includes a lower member connected to the side member and disposed to face the upper member with the heating member interposed therebetween.
7. The heating assembly of claim 1,
includes a clamp portion disposed on the heating body and formed to support one region of the heat transfer member.
8. The heating assembly of claim 7,
the clamp portion fixes the heating member in a manner of applying a pressure to an area outside the heat transfer member.
9. The heating assembly of claim 7,
the clamp portion is configured not to correspond to and spaced apart from an inner space of the groove.
10. The heating assembly of claim 7,
the clamp portion is formed to have a shape extending from a region spaced apart from the groove in one face of the heating body to correspond to a position overlapping with at least one region of the groove.
11. The heating assembly of claim 10,
the clamp portion is formed to have a curved form between a region spaced apart from the groove and a region overlapping at least one region of the groove.
12. The heating assembly of claim 1,
a spaced-apart space is formed in at least one region between the side member and the heating member.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6035101A (en) * 1997-02-12 2000-03-07 Applied Materials, Inc. High temperature multi-layered alloy heater assembly and related methods
KR20060031581A (en) * 2004-10-08 2006-04-12 후루카와 스카이 가부시키가이샤 Heater plate and method for manufacturing thereof
KR100875388B1 (en) * 2006-12-07 2008-12-23 에이비엠 주식회사 Method for manufacturing hot plate for TF-LC, semiconductor and ODL manufacturing equipment
CN108470669A (en) * 2017-02-14 2018-08-31 朗姆研究公司 The spacer of controlled temperature for substrate processing chambers
CN111212489A (en) * 2018-11-21 2020-05-29 南韩商H&世温股份有限公司 Heater assembly
CN210745597U (en) * 2019-05-27 2020-06-12 佛山市顺德区美的电热电器制造有限公司 Coupling heating device and heating system
CN112542370A (en) * 2019-09-23 2021-03-23 中微半导体设备(上海)股份有限公司 Plasma processor and heater assembly thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6035101A (en) * 1997-02-12 2000-03-07 Applied Materials, Inc. High temperature multi-layered alloy heater assembly and related methods
KR20060031581A (en) * 2004-10-08 2006-04-12 후루카와 스카이 가부시키가이샤 Heater plate and method for manufacturing thereof
KR100875388B1 (en) * 2006-12-07 2008-12-23 에이비엠 주식회사 Method for manufacturing hot plate for TF-LC, semiconductor and ODL manufacturing equipment
CN108470669A (en) * 2017-02-14 2018-08-31 朗姆研究公司 The spacer of controlled temperature for substrate processing chambers
CN111212489A (en) * 2018-11-21 2020-05-29 南韩商H&世温股份有限公司 Heater assembly
CN210745597U (en) * 2019-05-27 2020-06-12 佛山市顺德区美的电热电器制造有限公司 Coupling heating device and heating system
CN112542370A (en) * 2019-09-23 2021-03-23 中微半导体设备(上海)股份有限公司 Plasma processor and heater assembly thereof

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