CN115394735A - Semiconductor circuit module - Google Patents
Semiconductor circuit module Download PDFInfo
- Publication number
- CN115394735A CN115394735A CN202211321748.2A CN202211321748A CN115394735A CN 115394735 A CN115394735 A CN 115394735A CN 202211321748 A CN202211321748 A CN 202211321748A CN 115394735 A CN115394735 A CN 115394735A
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- pin
- pins
- self
- semiconductor circuit
- control board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
Abstract
The present invention provides a semiconductor circuit module, including: the packaging structure comprises a packaging body, a plurality of pins and a plurality of self-adjusting devices, wherein one ends of the pins are fixed on one side of the packaging body, and the other ends of the pins are fixed on the self-adjusting devices; the self-adjusting device comprises an upper pin, a lower pin and a self-adjusting structure, wherein one end of the upper pin and one end of the lower pin are respectively fixed on the pins, and the other end of the upper pin and the other end of the lower pin are connected through the self-adjusting structure and are used for realizing the automatic adjustment of the lengths of the upper pin and the lower pin; can realize flexible regulation through the pin, through the installation that can realize two automatically controlled boards, realize strong, the weak current separation simultaneously, improve the product interference killing feature. The semiconductor circuit module can automatically stretch and regulate pins and has strong anti-interference capability.
Description
Technical Field
The present invention relates to the field of semiconductor chip technology, and more particularly, to a semiconductor circuit module.
Background
The semiconductor circuit, namely a Modular Intelligent Power System (MIPS), not only integrates a Power switch device and a driving circuit, but also incorporates a fault detection circuit for overvoltage, overcurrent, overheat, etc., and can send a detection signal to a CPU or a DSP for interrupt processing. The high-speed low-power-consumption chip-on-chip protection circuit is composed of a high-speed low-power-consumption chip, an optimized gate-level driving circuit and a quick protection circuit. Even if a load accident occurs or the use is improper, the MIPS can be prevented from being damaged. MIPS generally uses an IGBT as a power switching element, and has an integrated structure in which a current sensor and a driving circuit are built.
The inverter circuit composed of low-voltage control circuits such as an existing MIPS modular intelligent power system IC drive control circuit, an MIPS sampling amplification circuit, a PFC current protection circuit and the like and a high-voltage semiconductor circuit is arranged on the same board, meanwhile, the existing MIPS modular intelligent power system only integrates a single MIPS module, integration of a plurality of MIPS modular intelligent power systems is not achieved, market miniaturization and low-cost competition are met, higher requirements are provided for high integration and high heat dissipation technologies of the MIPS modular intelligent power system, and requirements are provided for electric control diversified installation.
Disclosure of Invention
Aiming at the defects of the related technologies, the invention provides the semiconductor circuit module which has the advantages that the pins are automatically adjusted in a telescopic mode, the installation space is saved, meanwhile, the strong current and the weak current are separated, and the anti-jamming capability of the product is improved.
In order to solve the above technical problem, an embodiment of the present invention provides a semiconductor circuit module, including: the packaging structure comprises a packaging body, a plurality of pins and a plurality of self-adjusting devices, wherein one ends of the pins are fixed on one side of the packaging body, and the other ends of the pins are fixed on the self-adjusting devices;
the self-adjusting device comprises an upper pin, a lower pin and a self-adjusting structure, one end of the upper pin and one end of the lower pin are respectively fixed on the pins, and the other end of the upper pin and the other end of the lower pin are connected through the self-adjusting structure and used for achieving automatic adjustment of the lengths of the upper pin and the lower pin.
Preferably, the self-adjusting structure includes: the spring sleeve is arranged on the connecting column, the two ends of the connecting column are respectively arranged in the upper mounting groove and the lower mounting groove, the two ends of the spring are tightly pressed between the upper pin and the lower pin, the frame is used for fixing the connecting column, the upper pin and the lower pin, and the elastic force of the spring on the connecting column is used for realizing the automatic adjustment of the length of the upper pin and the lower pin.
Preferably, the spliced pole includes the cylinder and set up in the stopper at cylinder both ends, the cylinder set up in go up the mounting groove with in the installation down, two the stopper be spacing respectively in go up the one side of pin with one side of pin down.
Preferably, the frame is of rectangular configuration.
Preferably, the plurality of pins are arranged on one side of the package body side by side, wherein the pins include a low-voltage circuit output pin and a high-voltage circuit output pin.
Preferably, the plurality of self-adjusting devices are respectively connected to the plurality of pins.
Preferably, the packaging body is a powder molding compound prepared by mixing epoxy resin serving as matrix resin, high-performance phenolic resin serving as a curing agent, silicon micropowder serving as a filler and a plurality of auxiliaries, and is extruded into a die cavity by a heat transfer molding method, the semiconductor chip in the die cavity is embedded, and the semiconductor chip is cross-linked, cured and molded to form a device with a certain shape structure.
Preferably, the pins are made of copper materials, 0.5mm copper plates are punched through machining to form needed shapes, the surfaces are plated with nickel firstly, the thickness of the nickel is 0.1-0.5um, and then the thickness of the tin is 2-5um for forming.
Preferably, still include support, the automatically controlled board of low pressure and the automatically controlled board of high pressure, the packaging body is installed the upper surface of support, the automatically controlled board of low pressure is installed the lower surface of support, low pressure circuit output pin is installed realize the electricity on the automatically controlled board of low pressure and connect, the automatically controlled board of high pressure set up in one side of support, high pressure circuit output pin is installed realize the electricity on the automatically controlled board of high pressure and connect.
Preferably, the low-voltage circuit output pin is welded on the low-voltage electric control plate, and the high-voltage circuit output pin is welded on the high-voltage electric control plate.
Compared with the prior art, one end of the pin is fixed on one side of the packaging body, and the other end of the pin is fixed on the self-adjusting device; the self-adjusting device comprises an upper pin, a lower pin and a self-adjusting structure, wherein one end of the upper pin and one end of the lower pin are respectively fixed on the pins, and the other end of the upper pin and the other end of the lower pin are connected through the self-adjusting structure and are used for realizing the automatic adjustment of the lengths of the upper pin and the lower pin; can realize flexible regulation through the pin, through the installation that can realize two automatically controlled boards, not only reduce installation space, realize strong, the weak current separation simultaneously, improve the product interference killing feature.
Drawings
The present invention will be described in detail below with reference to the accompanying drawings. The foregoing and other aspects of the invention will become more apparent and more readily appreciated from the following detailed description, taken in conjunction with the accompanying drawings. In the drawings:
FIG. 1 is a schematic diagram of an overall structure of a semiconductor circuit module according to the present invention;
FIG. 2 is a schematic structural diagram of the self-adjusting apparatus of the present invention;
FIG. 3 is a top view of the self-adjusting apparatus of the present invention;
FIG. 4 is a schematic diagram illustrating the internal structure of the self-adjusting apparatus according to the present invention;
FIG. 5a is a first state diagram of the semiconductor circuit module according to the present invention;
FIG. 5b is a schematic view of the installation of FIG. 5 a;
FIG. 6a is a second state diagram of the semiconductor circuit module according to the present invention;
FIG. 6b is a schematic view of the installation of FIG. 6 a;
FIG. 7a is a state diagram of a semiconductor circuit module according to the present invention;
fig. 7b is a schematic view of the installation of fig. 7 a.
In the figure, 1, a packaging body, 2, pins, 3, a self-adjusting device, 301, upper pins, 302, lower pins, 303, a frame, 304, a connecting column, 305, a spring, 4, a self-adjusting structure, 5, an upper mounting groove, 6, a lower mounting groove, 7, a cylinder, 8, a limiting block, 9, a bracket, 10, a low-voltage control board, 11 and a high-voltage control board.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings.
The embodiments/examples described herein are specific embodiments of the present invention, are intended to be illustrative of the concepts of the present invention, are intended to be illustrative and exemplary, and should not be construed as limiting the embodiments and scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification of the present application, and these technical solutions include the technical solutions of making any obvious replacement or modification of the embodiments described herein, and are within the scope of the present invention.
Example one
As shown in fig. 1 to 4, the present invention provides a semiconductor circuit module including: the packaging structure comprises a packaging body 1, a plurality of pins 2 and a plurality of self-adjusting devices 3, wherein one ends of the pins 2 are fixed on one side of the packaging body 1, and the other ends of the pins 2 are fixed on the self-adjusting devices 3. The packaging body 1 is used for packaging a semiconductor chip, the semiconductor chip is connected with one end of the pin 2, the other end of the pin 2 is connected with the self-adjusting device 3, the pin 2 is automatically adjusted to stretch through the self-adjusting device 3, so that the semiconductor circuit module is used for installing a plurality of electric control boards for pesticide application, and the electric control arrangement is flexible.
The self-adjusting device 3 comprises an upper pin 301, a lower pin 302 and a self-adjusting structure 4, wherein one end of the upper pin 301 and one end of the lower pin 302 are respectively fixed on the pin 2, and the other end of the upper pin 301 and the other end of the lower pin 302 are connected through the self-adjusting structure 4, so that the length of the upper pin 301 and the length of the lower pin 302 can be automatically adjusted. Can realize flexible regulation through pin 2, through the installation that can realize two automatically controlled boards, not only reduce installation space, realize strong, the weak current separation simultaneously, improve the product interference killing feature.
In the present embodiment, the self-adjusting structure 4 includes: frame 303, spliced pole 304 and spring 305, the other end of going up pin 301 is equipped with mounting groove 5, the other end of pin 302 is equipped with down mounting groove 6 down, spring 305 cover is located on the spliced pole 304, the both ends of spliced pole 304 install respectively in last mounting groove 5 with in the mounting groove 6 down, the both ends of spring 305 compress tightly in go up pin 301 with down between the pin 302, frame 303 will the spliced pole 304 go up pin 301 and pin 302 is fixed down, through on the spliced pole 304 the elasticity of spring 305 realizes go up pin 301 with the automatically regulated of pin 302 length down.
Specifically, an upper pin 301 and a lower pin 302 are respectively connected to pins 2 at two ends, a spring 305 is firstly installed on a connecting column 304, then the connecting column 304 with the spring 305 is installed in an upper installation groove 5 and a lower installation groove 6 which are respectively arranged on the left sides of the upper pin 301 and the lower pin 302, the connecting column 304, the upper pin 301 and the lower pin 302 are fixed through a frame 303, and the length of the upper pin 301 and the length of the lower pin 302 are automatically adjusted through the elastic force of the spring 305 on the connecting column 304.
In this embodiment, the connecting column 304 includes a cylinder 7 and a limiting block 8 disposed at two ends of the cylinder 7, the cylinder 7 is disposed in the upper mounting groove 5 and the lower mounting groove, and the limiting block 8 is respectively limited at one side of the upper pin 301 and one side of the lower pin 302. The limiting block 8 is used for limiting the two ends, so that the upper pin 301 and the lower pin 302 are prevented from popping up under the elastic force of the spring 305, and the limiting effect is good.
In this embodiment, the frame 303 has a rectangular structure.
In this embodiment, the plurality of pins 2 are disposed side by side on one side of the package body 1, wherein the pins 2 include a low voltage circuit output pin 2 and a high voltage circuit output pin 2.
In this embodiment, the plurality of self-adjusting devices 3 are respectively connected to the plurality of pins 2. The length of the plurality of pins 2 can be adjusted automatically and conveniently.
In this embodiment, the package 1 is a powder molding compound prepared by mixing epoxy resin as a matrix resin, high performance phenolic resin as a curing agent, silica powder as a filler, and a plurality of additives, and is extruded into a mold cavity by a heat transfer molding method to embed a semiconductor chip therein, and simultaneously, is cross-linked, cured and molded to form a device with a certain shape structure.
In this embodiment, pin 2 is made for the copper material, carries out stamping process to 0.5mm copper sheet material through machining and forms required shape, carries out nickel plating thickness 0.1-0.5um to the surface earlier, and the shaping of tin plating thickness 2-5um again.
In this embodiment, still include support 9, the automatically controlled board of low pressure 10 and the automatically controlled board of high pressure 11, packaging body 1 is installed the upper surface of support 9, the automatically controlled board of low pressure 10 is installed the lower surface of support 9, low pressure circuit output pin 2 is installed realize the electricity on the automatically controlled board of low pressure 10 and connect, high pressure automatically controlled board 11 set up in one side of support 9, high pressure circuit output pin 2 is installed realize the electricity on the automatically controlled board of high pressure 11 and connect.
The bracket 9 prevents the semiconductor circuit from directly contacting the electric control board, and prevents the reliability of the semiconductor circuit from being affected by the long-term contact between the condensed water generated on the electric control board and the semiconductor circuit. The circuit on the low-voltage electric control board 10 is mainly a peripheral circuit of a control part of the semiconductor circuit, and the interference of the control signal can be reduced by separating the circuit from the strong electric circuit. The high-voltage electric control board 11 is mainly a peripheral circuit of an inverter part of the semiconductor circuit and other strong circuits.
In this embodiment, the low-voltage circuit output pin 2 is welded to the low-voltage electronic control board 10, and the high-voltage circuit output pin 2 is welded to the high-voltage electronic control board 11.
Specifically, three different mounting modes can be realized according to different mounting positions of the high-voltage electric control board 11 and the low-voltage electric control board 10.
As shown in fig. 5a-5b, the first installation state: firstly, a support 9 is installed on a semiconductor circuit installation position of a low-voltage electric control board 10, then a semiconductor circuit is placed on the support 9, the low-voltage electric control board 10 is fixed under the support 9, a high-voltage electric control board 11 is stacked under the low-voltage electric control board 10, so that an output pin 2 of the low-voltage circuit of the semiconductor circuit is installed on the low-voltage electric control board 10, then the high-voltage electric control board 11 is stacked and installed on an output pin 2 of the high-voltage circuit of the semiconductor circuit, and the semiconductor circuit is electrically connected with the two electric control boards through wave soldering. By means of downward extension of the pins 2, superposition installation of the double electric control plates can be achieved, installation space is reduced, strong and weak current separation is achieved, and anti-interference capacity of products is improved.
As shown in fig. 6a-6b, the second installation state: firstly, a support 9 is installed on a semiconductor circuit installation position of a low-voltage electric control board 10, then a semiconductor circuit is placed on the support 9, the low-voltage electric control board 10 is fixed under the support 9, a high-voltage electric control board 11 is arranged on one side of the low-voltage electric control board 10 side by side, so that a semiconductor circuit low-voltage circuit output pin 2 is installed on the low-voltage electric control board 10, then the high-voltage electric control board 11 is overlapped and installed on a semiconductor circuit high-voltage circuit output pin 2, and the semiconductor circuit is electrically connected with the two electric control boards through wave soldering. The pin 2 is made to stretch left, double-electric-control horizontal installation can be achieved, strong and weak current classification can be achieved through the installation mode, the anti-interference capacity of the product is improved, the creepage distance of the product can be increased, and the overcurrent capacity of the product is improved.
As shown in fig. 7a-7b, the installation state three: firstly, a support 9 is arranged on a semiconductor circuit installation position of a low-voltage electric control board 10, then a semiconductor circuit is placed on the support 9, the low-voltage electric control board 10 is fixed below the support 9, a high-voltage electric control board 11 is arranged on one side of the low-voltage electric control board 10 side by side and stacked below the low-voltage electric control board 10, so that an output pin 2 of the low-voltage circuit of the semiconductor circuit is arranged on the low-voltage electric control board 10, then the high-voltage electric control board 11 is stacked and arranged on an output pin 2 of the high-voltage circuit of the semiconductor circuit, and the semiconductor circuit is electrically connected with the two electric control boards through wave soldering. Therefore, the pin 2 can be adjusted in length up and down and left and right under the self-adjusting device 3, double-electric-control overlapping installation can be achieved, double-electric-control horizontal installation can also be achieved, and even triple-electric-control installation can be achieved according to application scenes. The method can be applied to the installation of various plug-in components on the electric control board in different occasions. The peripheral electronic control installation of the high-integration semiconductor circuit can be met, the height integrated installation of the electronic control board is realized, and the requirement of double-integrated installation is met. The problem that peripheral circuits are increased and cannot be installed due to a high-integration semiconductor circuit is solved, installation space of the multi-electric control board is reduced, and integration of the electric control board is achieved from a certain angle.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A semiconductor circuit module, comprising: the packaging structure comprises a packaging body, a plurality of pins and a plurality of self-adjusting devices, wherein one ends of the pins are fixed on one side of the packaging body, and the other ends of the pins are fixed on the self-adjusting devices;
the self-adjusting device comprises an upper pin, a lower pin and a self-adjusting structure, one end of the upper pin and one end of the lower pin are respectively fixed on the pins, and the other end of the upper pin and the other end of the lower pin are connected through the self-adjusting structure and used for achieving automatic adjustment of the lengths of the upper pin and the lower pin.
2. The semiconductor circuit module of claim 1, wherein the self-adjusting structure comprises: frame, spliced pole and spring, the other end of going up the pin is equipped with the mounting groove, the other end of pin is equipped with down the mounting groove down, the spring housing is located on the spliced pole, the both ends of spliced pole install respectively in go up the mounting groove with down in the mounting groove, the both ends of spring compress tightly in go up the pin with down between the pin, the frame will the spliced pole go up the pin and the pin is fixed down, through on the spliced pole the elasticity of spring is realized go up the pin with the automatically regulated of pin length down.
3. The semiconductor circuit module according to claim 2, wherein the connection post comprises a cylinder and stoppers disposed at both ends of the cylinder, the cylinder is disposed in the upper mounting groove and the lower mounting groove, and the stoppers are respectively restricted on one side of the upper pin and one side of the lower pin.
4. The semiconductor circuit module of claim 2, wherein the frame is a rectangular structure.
5. The semiconductor circuit module of claim 1, wherein the plurality of pins are disposed side-by-side on one side of the package, wherein the pins include a low voltage circuit output pin and a high voltage circuit output pin.
6. The semiconductor circuit module of claim 5, wherein the plurality of self-adjusting devices are respectively connected to the plurality of pins.
7. The semiconductor circuit module of claim 1, wherein the package is a powder molding compound prepared by mixing epoxy resin as a matrix resin, high performance phenolic resin as a curing agent, silica powder as a filler, and a plurality of additives, and the powder molding compound is extruded into the mold cavity by a heat transfer molding method to embed the semiconductor chip therein, and is cross-linked, cured and molded to form a device with a certain shape structure.
8. The semiconductor circuit module according to claim 1, wherein the leads are made of a copper material, a 0.5mm copper plate is formed into a desired shape by press working through machining, and the surface is formed by first plating nickel to a thickness of 0.1 to 0.5um and then plating tin to a thickness of 2 to 5 um.
9. The semiconductor circuit module as claimed in claim 5, further comprising a support, a low voltage control board and a high voltage control board, wherein the package is mounted on an upper surface of the support, the low voltage control board is mounted on a lower surface of the support, the low voltage circuit output pins are mounted on the low voltage control board for electrical connection, the high voltage control board is disposed at one side of the support, and the high voltage circuit output pins are mounted on the high voltage control board for electrical connection.
10. The semiconductor circuit module of claim 9, wherein the low voltage circuit output pin is soldered to the low voltage control board and the high voltage circuit output pin is soldered to the high voltage control board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211321748.2A CN115394735B (en) | 2022-10-27 | 2022-10-27 | Semiconductor circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211321748.2A CN115394735B (en) | 2022-10-27 | 2022-10-27 | Semiconductor circuit module |
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| Publication Number | Publication Date |
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| CN115394735A true CN115394735A (en) | 2022-11-25 |
| CN115394735B CN115394735B (en) | 2023-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211321748.2A Active CN115394735B (en) | 2022-10-27 | 2022-10-27 | Semiconductor circuit module |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847720A (en) * | 2015-12-04 | 2017-06-13 | 瑞萨电子株式会社 | The manufacture method of semiconductor device |
| CN209822626U (en) * | 2019-04-24 | 2019-12-20 | 苏州富达仪精密科技有限公司 | Connecting piece for packaging integrated circuit |
| CN111584704A (en) * | 2020-05-19 | 2020-08-25 | 赵光宇 | Light emitting diode |
| CN113192918A (en) * | 2021-06-01 | 2021-07-30 | 广东汇芯半导体有限公司 | Semiconductor circuit and device for the same |
| CN216488139U (en) * | 2021-12-07 | 2022-05-10 | 江苏宝浦莱半导体有限公司 | Pin-adjustable light-emitting diode |
-
2022
- 2022-10-27 CN CN202211321748.2A patent/CN115394735B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847720A (en) * | 2015-12-04 | 2017-06-13 | 瑞萨电子株式会社 | The manufacture method of semiconductor device |
| CN209822626U (en) * | 2019-04-24 | 2019-12-20 | 苏州富达仪精密科技有限公司 | Connecting piece for packaging integrated circuit |
| CN111584704A (en) * | 2020-05-19 | 2020-08-25 | 赵光宇 | Light emitting diode |
| CN113192918A (en) * | 2021-06-01 | 2021-07-30 | 广东汇芯半导体有限公司 | Semiconductor circuit and device for the same |
| CN216488139U (en) * | 2021-12-07 | 2022-05-10 | 江苏宝浦莱半导体有限公司 | Pin-adjustable light-emitting diode |
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| CN115394735B (en) | 2023-03-24 |
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