CN213459726U - Power module packaging structure - Google Patents
Power module packaging structure Download PDFInfo
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- CN213459726U CN213459726U CN202022386748.3U CN202022386748U CN213459726U CN 213459726 U CN213459726 U CN 213459726U CN 202022386748 U CN202022386748 U CN 202022386748U CN 213459726 U CN213459726 U CN 213459726U
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- power module
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- bolt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a power module packaging structure, it includes: the upper packaging body is connected with an anti-falling assembly; a lower package body connected with the upper package body; a substrate mounted within the lower package body; a chip connected to the substrate; and the terminals are connected to the substrate and extend out of the lower packaging body, and part of the terminals are electrically connected with the chip. The utility model discloses a split type packaging structure prevents through the anti-drop subassembly that dismouting in-process bolt from droing, and packaging body mounted position about effectively guaranteeing realizes power module's accurate encapsulation, and the inside electronic component of being convenient for overhauls, improves power module's reliability.
Description
Technical Field
The utility model relates to a power module technical field, specifically speaking relates to a power module packaging structure.
Background
The power module is widely applied to various switching power supplies, controllers and other related equipment, belongs to an important component of a high-power electronic system, and has great influence on performance and reliability. The packaging of the module is the most basic component of a power module and is critical to the performance, volume and reliability of the power module. The packaging structure of present power module often adopts split type design, through the bolt with the upper and lower packaging body connection, but the dismouting in-process is because the bolt is less, because factors such as improper operation often lose the bolt and drop to power module inside even, influence power module's dismouting and use, consequently, how to design a power module packaging structure, effectively solve the dismouting in-process bolt and lose the problem, realize packaging structure's convenient installation and be the problem that needs to solve at present urgently.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model discloses a power module packaging structure, which prevents the falling of bolts in the process of assembly and disassembly, effectively ensures the mounting positions of an upper packaging body and a lower packaging body, realizes the accurate packaging of a power module, is convenient for the maintenance of internal electronic elements and improves the reliability of the power module; it includes:
the upper packaging body is connected with an anti-falling assembly;
a lower package body connected with the upper package body;
a substrate mounted within the lower package body;
a chip connected to the substrate;
and the terminals are connected to the substrate and extend out of the lower packaging body, and part of the terminals are electrically connected with the chip.
Preferably, the upper package and the lower package are formed in a square structure that fits each other.
Preferably, the lower package includes:
mounting groove, bracket, draw-in groove and screw hole, the mounting groove is seted up in down on the packaging body, the bracket ring is located the mounting groove bottom is a plurality of draw-in groove and screw hole are seted up in down on the packaging body, the draw-in groove with the terminal is connected.
Preferably, the upper package body includes:
the through-hole, the through-hole with the screw hole corresponds the setting, through-hole one end is connected with wedge groove and first recess, the through-hole other end is connected with the second recess, place the joint piece in the wedge groove, elastic gasket has been placed in the first recess, the joint piece with the elastic gasket contact, wear to be equipped with the bolt in the through-hole, the bolt with the elastic gasket contact, the anti-drop subassembly set up in the second recess, the anti-drop subassembly with the bolt contact, the bolt bottom with the screw hole is connected.
Preferably, the drop-off prevention assembly includes:
fixed block, spout, fixture block and spring, the fixed block connect in second recess tank bottoms end, the spout is seted up in on the fixture block, and the orientation the bolt opening, fixture block sliding connection in the spout, and the one end that the spout was kept away from to the fixture block is equipped with the inclined plane, the spring conflict connect in between spout bottom and the fixture block.
Preferably, the substrate is provided as a DBC substrate.
Preferably, the terminals include output terminals and lead terminals, the output terminals and the lead terminals are mounted at intervals on the edge of the substrate and are clamped with the clamping grooves, and the output terminals are connected with the upper surface of the chip through electric connection wires.
Preferably, the substrate is placed on the bracket, and the plurality of chips are connected to the substrate by surface mount technology.
Preferably, the lower package body further includes a fixing post connected to the lower package body and disposed away from the screw hole.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a partial structure of the lower package of the present invention;
FIG. 3 is a schematic cross-sectional view of the lower package structure of the present invention;
FIG. 4 is a schematic cross-sectional view of the upper package structure of the present invention;
fig. 5 is a schematic view of the anti-falling off assembly of the present invention.
In the figure: 1. an upper package body; 2. a lower package body; 3. a substrate; 4. a chip; 5. a terminal; 11. a through hole; 12. an anti-drop assembly; 13. a wedge-shaped groove; 14. a first groove; 15. a clip sheet; 16. an elastic pad; 17. a bolt; 18. a second groove; 21. mounting grooves; 22. a bracket; 23. a card slot; 24. a threaded hole; 25. fixing a column; 41. an electrical connection wire; 51. an output terminal; 52. a lead terminal; 121. a fixed block; 122. a chute; 123. a clamping block; 124. a spring.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 5, the power module package structure provided in this embodiment includes:
the anti-falling device comprises an upper packaging body 1, wherein the upper packaging body 1 is connected with an anti-falling assembly 12;
a lower package body 2, the lower package body 2 being connected to the upper package body 1;
a substrate 3, the substrate 3 being mounted in the lower package 2;
a chip 4, wherein the chip 4 is connected to the substrate 3;
and a plurality of terminals 5, wherein the terminals 5 are connected to the substrate 3 and extend out of the lower package body 2, and part of the terminals 5 are electrically connected with the chip 4.
The utility model discloses a theory of operation and beneficial effect do:
a power module packaging structure, with chip 4 and terminal 5 integrated in on the base plate 3, base plate 3 adopts the DBC base plate, terminal 5 interval install in 3 borders of base plate, and through go up packaging body 1 with packaging body 2 cooperation forms the cavity down, will base plate 3 encapsulates in cavity 1, terminal 5 extends packaging body 2 down, simultaneously, it is connected with anti-drop subassembly 12 to go up packaging body 1.
The utility model provides a power module packaging structure adopts split type packaging structure, prevents through anti-drop subassembly 12 that dismouting in-process bolt from droing, and packaging body mounted position realizes power module's accurate encapsulation about effectively guaranteeing, and the inside electronic component of being convenient for overhauls, improves power module's reliability.
In one embodiment, the upper and lower packages 1 and 2 are provided in a square structure to be fitted to each other.
The working principle and the beneficial effects of the technical scheme are as follows:
the upper packaging body 1 and the lower packaging body 2 are accurately matched, the substrate 3 and the chip 4 of the power module are packaged inside, external impurities are prevented from entering the packaging body, and the use reliability of the power module is improved.
As shown in fig. 2 and 3, in one embodiment, the lower package body 2 includes:
mounting groove 21, bracket 22, draw-in groove 23 and screw hole 24, mounting groove 21 sets up on the lower packaging body 2, bracket 22 encircles and locates mounting groove 21 bottom, and is a plurality of draw-in groove 23 and screw hole 24 set up on the lower packaging body 2, draw-in groove 23 with terminal 5 is connected.
The working principle and the beneficial effects of the technical scheme are as follows:
the base plate 3 is fixedly connected to the bottom of the lower packaging body 2 through the bracket 22, the connection stability of the base plate 3 is improved, the base plate 3 is prevented from falling off, the terminal 5 is clamped in the clamping groove 23, the accuracy of the installation position of the terminal 5 is guaranteed, and the terminal 5 is prevented from being damaged or even falling off in the use process of the power module.
As shown in fig. 4, in one embodiment, the upper package body 1 includes:
through-hole 11 and anti-drop subassembly 12, through-hole 11 with screw hole 24 corresponds the setting, 11 one end of through-hole is connected with wedge groove 13 and first recess 14, the 11 other end of through-hole is connected with second recess 18, place in the wedge groove 13 and have joint piece 15, elastic gasket 16 has been placed in the first recess 14, joint piece 15 with elastic gasket 16 contacts, wear to be equipped with bolt 17 in the through-hole 11, bolt 17 with elastic gasket 16 contacts, anti-drop subassembly 12 set up in the second recess 18, anti-drop subassembly 12 with bolt 17 contacts, bolt 17 bottom with screw hole 24 is connected.
The working principle and the beneficial effects of the technical scheme are as follows:
through-hole 11 with screw hole 24 corresponds the setting, wedge groove 13 is convenient for bolt 17 to put into, be fixed with joint piece 15 on the wedge groove 13, during the installation of elastic gasket 16, elastic gasket 16's breach corresponds with joint piece 15, will elastic gasket 16 slides extremely in the first recess 14, rotates elastic gasket 16, joint piece 15 will elastic gasket 16 is fixed, will bolt 17 inserts in through-hole 11 and the elastic gasket 16, will through bolt 17 go up packaging body 1 and lower packaging body 2 and be connected. The joint piece 15 is realized elastic gasket 16 is fixed, prevents that dismouting in-process elastic gasket 16 from droing, wedge groove 13 is convenient for the bolt 17 installation, has realized go up packaging body 1 and packaging body 2's accurate positioning down, bolt 17 terminal surface is less than go up packaging body 1 surface, guarantee go up packaging body 1 surface and do not have the protrusion, be convenient for power module and other external device contact connection.
As shown in FIG. 5, in one embodiment, the drop off prevention assembly 12 includes:
the fixing block 121 is connected to the groove bottom end of the second groove 18, the sliding groove 122 is formed in the clamping block 123 and faces the opening of the bolt 17, the clamping block 123 is slidably connected to the sliding groove 122, an inclined surface is arranged at one end, away from the sliding groove 122, of the clamping block 123, and the spring 124 is in abutting connection between the bottom end of the sliding groove 122 and the clamping block 123.
The working principle and the beneficial effects of the technical scheme are as follows:
the inclined plane of the fixture block 123 always abuts against the side end of the bolt 17, the fixture block 123 is always pressed against the thread invagination part along with the rotation of the bolt 17, when the upper packaging body 1 is disassembled, after the bolt 17 is separated from the threaded hole 24, the bolt 17 is still fixed on the upper packaging body 1 and cannot fall off, and meanwhile, in the process of reinstalling the upper packaging body 1, the bolt 17 always keeps a vertical state and does not incline, so that the upper packaging body 1 and the lower packaging body 2 are accurately connected. Anti-drop subassembly 12 prevents that power module dismouting in-process bolt from droing, effectively guarantees packaging body mounted position from top to bottom, realizes power module's accurate encapsulation, and the inside electronic component of being convenient for overhauls increase of service life.
In one embodiment, the substrate 3 is provided as a DBC substrate.
The working principle and the beneficial effects of the technical scheme are as follows:
the DBC substrate is a copper-clad ceramic substrate for short, has excellent heat conduction property, high insulativity, high current carrying capacity, excellent soldering resistance and high adhesion strength, can be etched into various circuit patterns like a PCB (printed circuit board), and can meet the requirement of coexistence of a chip and a plurality of components.
In one embodiment, the terminal 5 includes an output terminal 51 and a lead terminal 52, the output terminal 51 and the lead terminal 52 are mounted at the edge of the substrate 3 at intervals and engaged with the card slot 23, and the output terminal 51 is connected with the upper surface of the chip 4 through an electrical connection wire 41.
The working principle and the beneficial effects of the technical scheme are as follows:
the output terminal 51 and the lead terminal 52 are mounted on the edge of the substrate 3 and extend out of the package body through the clamping groove 23, so that the occupation of the surface space of the substrate 3 by the output terminal 51 and the lead terminal 52 is effectively reduced, and the terminal 5 is conveniently and electrically connected with other electronic elements.
In one embodiment, the substrate 3 is placed on the bracket 22, and the chips 4 are attached to the substrate 3 by surface mount technology.
The working principle and the beneficial effects of the technical scheme are as follows:
the chip 4 is effectively fixed on the substrate 3 through a surface mounting technology, and the electric connection among all electronic elements is realized through a printed circuit on the substrate 3, so that the performance requirement of a product is met.
In one embodiment, the lower package 2 further includes a fixing post 25, and the fixing post 25 is connected to the lower package 2 and is disposed away from the screw hole 24.
The working principle and the beneficial effects of the technical scheme are as follows:
the fixing column 25 is used for being connected with other equipment in a positioning mode, and the equipment connected with the fixing column is correspondingly provided with the mounting hole, so that inaccurate positioning when the fixing column is connected with other equipment is effectively prevented, the using effect of the power module is guaranteed, and the power module is prevented from being damaged in use.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (9)
1. A power module package structure, comprising:
the anti-falling device comprises an upper packaging body (1), wherein the upper packaging body (1) is connected with an anti-falling assembly (12);
a lower package (2), the lower package (2) being connected to the upper package (1);
a substrate (3), the substrate (3) being mounted within the lower package (2);
a chip (4), said chip (4) being connected to said substrate (3);
the terminals (5) are connected to the substrate (3) and extend out of the lower packaging body (2), and part of the terminals (5) are electrically connected with the chip (4).
2. A power module package according to claim 1, characterized in that the upper package (1) and the lower package (2) are provided as cooperating square structures.
3. A power module package according to claim 1, characterized in that the lower package (2) comprises: mounting groove (21), bracket (22), draw-in groove (23) and screw hole (24), mounting groove (21) are seted up on lower packaging body (2), bracket (22) ring is located mounting groove (21) bottom, it is a plurality of draw-in groove (23) and screw hole (24) are seted up on lower packaging body (2), draw-in groove (23) with terminal (5) are connected.
4. A power module package according to claim 3, characterized in that the upper package body (1) comprises: through-hole (11), through-hole (11) with screw hole (24) correspond the setting, through-hole (11) one end is connected with wedge groove (13) and first recess (14), through-hole (11) other end is connected with second recess (18), place in wedge groove (13) and have placed joint piece (15), elastic gasket (16) have been placed in first recess (14), joint piece (15) with elastic gasket (16) contact, wear to be equipped with bolt (17) in through-hole (11), bolt (17) with elastic gasket (16) contact, anti-drop subassembly (12) set up in second recess (18), anti-drop subassembly (12) with bolt (17) contact, bolt (17) bottom with screw hole (24) are connected.
5. The power module package structure according to claim 4, wherein the drop-off prevention member (12) includes: fixed block (121), spout (122), fixture block (123) and spring (124), fixed block (121) connect in second recess (18) bottom of the groove end, spout (122) are seted up on fixture block (123), and towards bolt (17) opening, fixture block (123) sliding connection in spout (122), and the one end that spout (122) were kept away from in fixture block (123) is equipped with the inclined plane, spring (124) contradict connect in between spout (122) bottom and fixture block (123).
6. A power module package according to claim 1, characterized in that the substrate (3) is provided as a DBC substrate.
7. A power module package structure according to claim 3, wherein the terminal (5) comprises an output terminal (51) and a lead terminal (52), the output terminal (51) and the lead terminal (52) are mounted at an interval on the edge of the substrate (3) and are engaged with the card slot (23), and the output terminal (51) is connected with the upper surface of the chip (4) through an electrical connection wire (41).
8. A power module package according to claim 7, wherein the substrate (3) is placed on the carrier (22), and the plurality of chips (4) are attached to the substrate (3) by surface mount technology.
9. A power module package according to claim 3, wherein the lower package body (2) further comprises a fixing post (25), the fixing post (25) being connected to the lower package body (2) and being arranged away from the threaded hole (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022386748.3U CN213459726U (en) | 2020-10-23 | 2020-10-23 | Power module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022386748.3U CN213459726U (en) | 2020-10-23 | 2020-10-23 | Power module packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN213459726U true CN213459726U (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022386748.3U Active CN213459726U (en) | 2020-10-23 | 2020-10-23 | Power module packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115148709A (en) * | 2022-06-28 | 2022-10-04 | 爱微(江苏)电力电子有限公司 | Power module for electronic initial charging of battery pack and method for manufacturing same |
-
2020
- 2020-10-23 CN CN202022386748.3U patent/CN213459726U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115148709A (en) * | 2022-06-28 | 2022-10-04 | 爱微(江苏)电力电子有限公司 | Power module for electronic initial charging of battery pack and method for manufacturing same |
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