CN115390310A - Backlight module, manufacturing method thereof and display device - Google Patents
Backlight module, manufacturing method thereof and display device Download PDFInfo
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- CN115390310A CN115390310A CN202211020787.9A CN202211020787A CN115390310A CN 115390310 A CN115390310 A CN 115390310A CN 202211020787 A CN202211020787 A CN 202211020787A CN 115390310 A CN115390310 A CN 115390310A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
- G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/22—Antistatic materials or arrangements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a backlight module, a manufacturing method thereof and a display device. The light guide plate comprises a conductive frame body, a flexible circuit board, a light emitting piece, an electric protection piece and a light guide plate; the flexible circuit board comprises a first sub-portion arranged in the conductive frame and a second sub-portion extending out of the conductive frame; the light-emitting component is arranged on the first sub-part; the electric protection piece is arranged on the flexible circuit board and is electrically connected with the light-emitting piece; the light guide plate is arranged in the conductive frame, one end of the light guide plate is close to the light-emitting element and is attached to the first sub-part, and the light guide plate and the light-emitting element are positioned on the same side of the first sub-part; the second sub-portion includes a conductive element electrically connected to the electrical protection element, and the conductive element is electrically connected to the conductive frame. The invention can improve the lighting effect of the backlight module, realize the electrical protection of the electrical protection piece on the light-emitting piece, improve the yield of the backlight module, and can not influence the alignment and the assembly of the light guide plate and other optical films.
Description
Technical Field
The invention relates to the technical field of display, in particular to a backlight module, a manufacturing method of the backlight module and a display device.
Background
In a Liquid Crystal Display (LCD), a backlight module is generally required to provide a backlight source for a Display panel to realize a Display function; the backlight module may include a direct type backlight module and a lateral type backlight module, and development of the lateral type backlight module is becoming more and more important as the display is required to be light and thin.
Currently, in a side-entry lcd, in order to prevent the light emitting device from being damaged by static electricity or discharge, a Transient Voltage Suppressor (TVS) is connected to a flexible circuit board, and the TVS is grounded to prevent the light emitting device from being damaged by static electricity or discharge.
However, in the related art, the flexible circuit board is usually attached to the iron frame by the conductive double-sided adhesive tape, so as to realize the ground connection of the TVS tube, and the position of the light emitting element disposed on the flexible circuit board is also fixed, when the light guide plate and other optical films are assembled subsequently, because the relative position between the light emitting element and the light guide plate is not fixed, when a reliability test is performed, the light guide plate may shrink, which increases the distance between the light emitting element and the light guide plate, so that the amount of light emitted by the light emitting element and entering the light guide plate is reduced, and the light efficiency of the backlight module is reduced.
Disclosure of Invention
The embodiment of the invention provides a backlight module, a manufacturing method thereof and a display device, which can reduce the distance between a light-emitting element and a light guide plate and improve the lighting effect of the backlight module.
The embodiment of the invention provides a backlight module, which comprises:
a conductive frame body;
a flexible circuit board including a first sub-portion disposed inside the conductive frame and a second sub-portion extending outside the conductive frame;
the light-emitting piece is arranged on the first sub-part;
the electrical protection piece is arranged on the flexible circuit board and is electrically connected to the light-emitting piece;
the light guide plate is arranged in the conductive frame, one end of the light guide plate is close to the light-emitting piece and is attached to the first sub-portion, and the light guide plate and the light-emitting piece are positioned on the same side of the first sub-portion;
the second sub-portion includes a conductive element electrically connected to the electrical protection element, and the conductive element is electrically connected to the conductive frame.
In an embodiment of the invention, an opening is disposed in the conductive frame body near the flexible circuit board, and the second sub-portion is connected to the first sub-portion and extends from the opening to outside of the conductive frame body.
In an embodiment of the invention, the conductive frame includes a first frame disposed on a surface of the light guide plate away from the light exit side of the backlight module, and a second frame disposed around the periphery of the light guide plate, and the first sub-portion is disposed on a surface of the first frame close to the light exit side;
wherein the opening is provided in the first frame body or the second frame body.
In an embodiment of the invention, the conducting element is electrically connected to a surface of the first frame body away from the light emitting side;
or the conducting piece is electrically connected with one surface, far away from the light guide plate, of the second frame body.
In an embodiment of the invention, the light guide plate includes a light incident side surface close to one side of the second frame body, the light emitting element includes a light emitting surface close to one side of the light guide plate, and the light emitting surface contacts with the light incident side surface.
In an embodiment of the invention, the conducting element is attached to the conductive frame through a conductive adhesive, and one end of the light guide plate is attached to the first sub-portion through a transparent adhesive.
In an embodiment of the invention, the flexible circuit board includes two second sub-portions, and the two second sub-portions are respectively connected to two ends of the first sub-portion, each of the second sub-portions includes at least one conducting element, and each of the second sub-portions extends to the outside of the conductive frame and is electrically connected to the conductive frame through the conducting element.
In one embodiment of the present invention, a distance between the light emitting member and the light guide plate is less than or equal to 2 mm.
According to the above object of the present invention, an embodiment of the present invention further provides a method for manufacturing a backlight module, which includes the following steps:
providing a conductive frame body;
providing a flexible circuit board including a first sub-part and a second sub-part in which a conductive member is formed;
forming an electrical protection element on the flexible circuit board, forming a light emitting element on the first sub-portion, wherein the light emitting element is electrically connected with the electrical protection element, and attaching one end of a light guide plate to the first sub-portion close to the light emitting element, wherein the light guide plate and the light emitting element are positioned on the same side of the first sub-portion;
assembling the first sub-portion, the light emitting element and the light guide plate in the conductive frame, and the second sub-portion extending out of the conductive frame;
and electrically connecting the conducting piece with the conductive frame body.
According to the above object of the present invention, an embodiment of the present invention further provides a display device, which includes a display panel and the backlight module, wherein the display panel is disposed on a light emitting side of the backlight module.
The invention has the beneficial effects that: according to the backlight module, the light emitting element is arranged on the first sub-part of the flexible circuit board, one end of the light guide plate is attached to the first sub-part of the flexible circuit board, so that the relative position relation between the light emitting element and the light guide plate can be fixed, and one end of the light guide plate is arranged close to the light emitting element, so that the distance between the light guide plate and the light emitting element can be reduced, the quantity of light rays emitted by the light emitting element and entering the light guide plate is increased, and the lighting effect of the backlight module is improved; in addition, the second sub-portion of the flexible circuit board extends out of the conductive frame body, and the conducting element on the second sub-portion is electrically connected between the electrical protection element and the conductive frame body, so that the electrical protection of the electrical protection element on the light-emitting element is realized, the yield of the backlight module is improved, meanwhile, the second sub-portion extends out of the conductive frame body for being attached, the position of the first sub-portion in the conductive frame body cannot be completely fixed, and the alignment and the assembly of the light guide plate and other optical films cannot be influenced.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 and 2 are schematic views illustrating a structure of a manufacturing process of a backlight assembly in the related art;
FIG. 3 is a schematic structural diagram of a backlight assembly according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a planar expanded structure of a flexible circuit board according to an embodiment of the present invention;
fig. 5 is a schematic view of another planar unfolded structure of the flexible circuit board according to the embodiment of the present invention;
FIG. 6 is a schematic diagram of an electrical protection circuit according to an embodiment of the present invention;
FIG. 7 is a schematic view of another structure of a backlight assembly according to an embodiment of the present invention;
FIG. 8 is a schematic view of another structure of a backlight assembly according to an embodiment of the present invention;
FIG. 9 is a schematic view of another structure of a backlight assembly according to an embodiment of the present invention;
FIG. 10 is a flowchart illustrating a method for manufacturing a backlight assembly according to an embodiment of the present invention;
fig. 11 to 13 are schematic structural diagrams illustrating a manufacturing process of a backlight assembly according to an embodiment of the invention;
fig. 14 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
In the related art, for the side-in type backlight module, in order to prevent the light emitting device from being damaged by static electricity or discharge, a Transient Voltage suppressing diode (TVS) is usually connected to the flexible circuit board, and the TVS tube is grounded to prevent the light emitting device from being damaged by static electricity or discharge. Referring to fig. 1 and 2, in the related art, the manufacturing process of the backlight module generally includes: the flexible circuit board 2 with the LED lamp 3 attached is attached to the inside of the iron frame 1, and in order to prevent the LED lamp 3 from being damaged by static electricity or discharge, the flexible circuit board 2 is usually attached to the inner surface of the iron frame by a conductive double-sided tape 4, and power is released through exposed copper (not shown) disposed on the flexible circuit board 2 and connected to the LED lamp 3 and the iron frame; and a reflector plate 5 is assembled in the iron frame; then, the light guide plate 6 and other optical films 7 are assembled on the reflecting sheet 5 in an aligned manner; however, since the relative position between the LED lamp 3 and the light guide plate 6 is not fixed, when a reliability test is performed, for example, during a high temperature test, the light guide plate 6 may shrink, which increases the distance between the LED lamp 3 and the light guide plate 6, so that the amount of light emitted by the LED lamp 3 and entering the light guide plate 6 is reduced, and the lighting effect of the backlight module is reduced.
Referring to fig. 3, 4 and 5, an embodiment of the invention provides a backlight module, which includes a conductive frame 10, a flexible circuit board 20, a light emitting element 30, an electrical protection element 40 and a light guide plate 50.
The flexible circuit board 20 includes a first sub-portion 21 disposed in the conductive frame 10 and a second sub-portion 22 extending out of the conductive frame 10; the light emitting element 30 is disposed on the first sub-portion 21; the electrical protection member 40 is disposed on the flexible circuit board 20 and electrically connected to the light emitting member 30; the light guide plate 50 is disposed in the conductive frame 10, one end of the light guide plate 50 is close to the light emitting element 30 and attached to the first sub-portion 21, and the light guide plate 50 and the light emitting element 30 are located on the same side of the first sub-portion 21.
Further, the second sub-portion 22 includes a conductive element 60 electrically connected to the electrical protection element 40, and the conductive element 60 is electrically connected to the conductive frame 10.
In the implementation and application process, the light emitting element 30 is disposed on the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is attached to the first sub-portion 21 of the flexible circuit board 20, so that the relative position relationship between the light emitting element 30 and the light guide plate 50 can be fixed, and one end of the light guide plate 50 is disposed close to the light emitting element 30, so that the distance between the light guide plate 50 and the light emitting element 30 can be reduced, the amount of light emitted by the light emitting element 30 and entering the light guide plate 50 can be increased, and the light efficiency of the backlight module can be improved; in addition, in the embodiment of the invention, the second sub-portion 22 of the flexible circuit board 20 extends to the outside of the conductive frame 10, and the conducting element 60 located on the second sub-portion 22 is electrically connected between the electrical protection element 40 and the conductive frame 10, so as to achieve the electrical protection of the electrical protection element 40 on the light emitting element 30, and improve the yield of the backlight module, meanwhile, the second sub-portion 22 extends to the outside of the conductive frame 10 for bonding, and the position of the first sub-portion 21 located in the conductive frame 10 is not completely fixed, so that the alignment and assembly of the light guide plate 50 and other optical films are not affected.
In an embodiment of the invention, referring to fig. 3, fig. 4 and fig. 5, the backlight module includes a conductive frame 10, a flexible circuit board 20, a light emitting element 30, an electrical protection element 40, a light guide plate 50 and other optical films.
The conductive frame 10 has conductivity, and the material of the conductive frame 10 may be a conductive metal material; the conductive frame 10 includes a first frame 11, a third frame 13 disposed opposite to the first frame 11, and a second frame 12 connected between the first frame 11 and the third frame 13 and connected to the periphery of the first frame 11, wherein the second frame 12 surrounds between the first frame 11 and the third frame 13 to form a hollow space 102 between the first frame 11 and the third frame 13, and the second frame 12 is formed with a light outlet 103 to communicate the hollow space 102 with the outside; further, the backlight module includes a light-emitting side, and the third frame 13 is located on a side of the first frame 11 close to the light-emitting side of the backlight module, and the light-emitting port 103 in the third frame 13 can realize light emission of the backlight module.
It should be noted that, in the embodiment of the invention, a portion of the flexible circuit board 20, the light emitting element 30, the electrical protection element 40, the light guide plate 50, and other optical films may be disposed in the hollow space 102.
Specifically, the flexible circuit board 20 includes a first sub-portion 21 disposed in the conductive frame 10 and a second sub-portion 22 extending out of the conductive frame 10, and the first sub-portion 21 is located on a surface of the first frame 11 close to the light emitting side; it can be understood that the first sub-portion 21 is located on one side of the first frame 11, and the conductive frame 10 is provided with an opening 101 near one side where the first sub-portion 21 is located, so that the second sub-portion 22 is connected to the first sub-portion 21 and extends from the opening 101 to the outside of the conductive frame 10.
Alternatively, the opening 101 is provided in the first frame 11 or the second frame 12; in the present embodiment, the opening 101 is disposed in the second frame 12.
Furthermore, the electrical protection member 40 is disposed on the flexible circuit board 20 and may be disposed on the first sub-portion 21 or the second sub-portion 22, and in the embodiment of the present invention, the electrical protection member 40 is disposed on the first sub-portion 21 as an example, and the electrical protection member 40 is disposed on the first sub-portion 21, so that the electrical protection member 40 is located inside the conductive frame 10, which can improve the protection effect of the electrical protection member 40.
Optionally, the electrical protection member 40 may be a Transient Voltage Suppressor (TVS), and the TVS may be any one of a unidirectional TVS tube and a bidirectional TVS tube, which may be selected according to actual requirements, and is not limited herein.
In the embodiment of the present invention, the second sub-portion 22 is further provided with a conducting element 60, and it should be noted that the flexible circuit board 20 includes a substrate, a metal routing layer disposed on the substrate, and an insulating layer covering the metal routing layer, where the metal routing layer is used to form a metal routing for signal transmission, and the insulating layer is used to cover the metal routing layer for protection and insulation.
Further, the light emitting element 30 is disposed on the first sub-portion 21 and electrically connected to the electrically charged protection element 40, and the electrically charged protection element 40 is connected between the light emitting element 30 and the conduction element 60. The second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10 and extends to a surface of the first frame 11 away from the light-emitting side, and the conducting element 60 in the second sub-portion 22 is attached to the surface of the first frame 11 away from the light-emitting side.
Optionally, the conducting element 60 is attached to a surface of the first frame 11 away from the light emitting side by a conductive adhesive 71.
Referring to fig. 1 and 6, the light emitting element 30 is electrically connected to the first frame 11 through the electrical protection element 40, the conduction element 60 and the conductive adhesive 71, and when the electrical protection element 40 can withstand an instantaneous high-energy impact, it can reduce its impedance rapidly at a very high speed to absorb a large current, so as to clamp the voltage across the electrical protection element 40 at a predetermined value, and one end of the electrical protection element 40 is connected to the light emitting element 30, and the other end is connected to the conductive frame 10 through the conduction element 60, which can be regarded as a ground, so that the electrical protection element 40 can effectively protect the light emitting element 30 electrically, thereby preventing the light emitting element 30 from being damaged by static electricity or discharge, and improving the yield of the backlight module.
It should be noted that, in the embodiment of the present invention, the number of the light emitting elements 30 and the electrical protection element 40 is not limited, and can be selected according to actual requirements, and the number and the shape of the second sub-portions 22 are also not limited, but in the embodiment of the present invention, the number of the second sub-portions 22 is two, and the second sub-portions 22 are exemplified as being long-strip-shaped, and the two second sub-portions 22 are respectively connected to two ends of the first sub-portion 21, each second sub-portion 22 is provided with one conducting element 60, and the number of the openings 101 is also two, and the two openings 101 are correspondingly located at two ends of the second frame 12, and the two second sub-portions 22 respectively extend from the two openings 101 to the outside of the conductive frame 10, and are electrically connected to the conductive frame 10 through the respective conducting elements 60. In addition, as the number of the second sub-portions 22 increases, the electrical transmission paths between the flexible circuit board 20 and the conductive frame 10 also increase, so as to improve the electrical protection effect of the electrical protection member 40 on the light emitting member 30, thereby further improving the yield of the backlight module.
In addition, one end of the light guide plate 50 is attached to the first sub-portion 21 near the light emitting element 30, and the light guide plate 50 and the light emitting element 30 are located on the same side of the first sub-portion 21. That is, in the embodiment of the present invention, the light guide plate 50 and the light emitting element 30 are both disposed on the first sub-portion 21, so that the relative position relationship between the light guide plate 50 and the light emitting element 30 is fixed, and the phenomenon that the distance between the light guide plate 50 and the light emitting element 30 is increased due to the shrinkage of the light guide plate 50 in the subsequent reliability test process of the backlight module can be avoided; and the light guide plate 50 is disposed close to the light emitting member 30 to reduce the distance between the light guide plate 50 and the light emitting member 30, thereby increasing the amount of light emitted by the light emitting member 30 and entering the light guide plate 50, and improving the lighting effect of the backlight module.
Optionally, one end of the light guide plate 50 may be attached to the first sub-portion 21 through a transparent adhesive 72, the transparent adhesive 72 is located at the light emitting side of the light emitting element 30, and the transparent adhesive 72 is in a transparent state, so that the light emitting of the light emitting element 30 is not affected, and the light efficiency of the backlight module is further improved.
Further, other optical films are disposed on two sides of the first frame 11, wherein the other optical films may include a reflective sheet 81, a diffusion sheet 82, a lower light-adding sheet 83 and an upper light-adding sheet 84, the reflective sheet 81 is disposed between the first frame 11 and the light guide plate 50, and the diffusion sheet 82, the lower light-adding sheet 83 and the upper light-adding sheet 84 are sequentially disposed on one side of the light guide plate 50 away from the first frame 11.
It can be understood that, the reflective sheet 81, the diffusion sheet 82, the lower brightness enhancement sheet 83 and the upper brightness enhancement sheet 84 all need to be aligned and assembled with the light guide plate 50, and in the embodiment of the present invention, the second sub-portion 22 is extended to the outside of the conductive frame 10 for being attached, so that the position of the first sub-portion 21 in the conductive frame 10 is not completely fixed, and the alignment and assembly of the light guide plate 50 and the reflective sheet 81, the diffusion sheet 82, the lower brightness enhancement sheet 83 and the upper brightness enhancement sheet 84 are not affected, thereby further improving the yield of the backlight module.
Optionally, the distance between the light emitting member 30 and the light guide plate 50 is less than or equal to 2 mm; it is further preferable that the interval between the light emitting member 30 and the light guide plate 50 is less than or equal to 1.5 mm.
In the embodiment of the invention, the light guide plate 50 includes a light incident side surface close to one side of the second frame 12, and the light emitting element 30 includes a light exiting surface close to one side of the light guide plate 50, and the light exiting surface contacts with the light incident side surface, so that the light exiting loss of the light emitting element 30 can be reduced to the greatest extent, and the light efficiency of the backlight module can be effectively improved.
In summary, in the embodiment of the present invention, the light emitting element 30 is disposed on the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is attached to the first sub-portion 21 of the flexible circuit board 20, so that the relative position relationship between the light emitting element 30 and the light guide plate 50 can be fixed, and one end of the light guide plate 50 is disposed close to the light emitting element 30, so that the distance between the light guide plate 50 and the light emitting element 30 can be reduced, the amount of light emitted by the light emitting element 30 and entering the light guide plate 50 is increased, and the light efficiency of the backlight module is improved; in addition, in the embodiment of the invention, the second sub-portion 22 of the flexible circuit board 20 extends to the outside of the conductive frame 10, and the conducting element 60 located on the second sub-portion 22 is electrically connected between the electrical protection element 40 and the conductive frame 10, so as to achieve the electrical protection of the electrical protection element 40 on the light emitting element 30, and improve the yield of the backlight module, meanwhile, the second sub-portion 22 extends to the outside of the conductive frame 10 for bonding, and the position of the first sub-portion 21 located in the conductive frame 10 is not completely fixed, so that the alignment and assembly of the light guide plate 50 and other optical films are not affected.
In another embodiment of the present invention, referring to fig. 7, the difference between the present embodiment and the previous embodiment is: the opening 101 of the conductive frame 10 is disposed in the first frame 11, the second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10, and the conductive member 60 is attached to a surface of the first frame 11 away from the light-emitting side of the backlight module through the conductive adhesive 71.
In summary, in the embodiment of the present invention, the light emitting element 30 is disposed on the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is attached to the first sub-portion 21 of the flexible circuit board 20, so that the relative position relationship between the light emitting element 30 and the light guide plate 50 can be fixed, and one end of the light guide plate 50 is disposed close to the light emitting element 30, which can reduce the distance between the light guide plate 50 and the light emitting element 30, so as to increase the amount of light emitted by the light emitting element 30 and entering the light guide plate 50, and improve the light efficiency of the backlight module; in addition, in the embodiment of the invention, the second sub-portion 22 of the flexible circuit board 20 extends to the outside of the conductive frame 10, and the conducting element 60 located on the second sub-portion 22 is electrically connected between the electrical protection element 40 and the conductive frame 10, so as to achieve the electrical protection of the electrical protection element 40 on the light emitting element 30, and improve the yield of the backlight module, meanwhile, the second sub-portion 22 extends to the outside of the conductive frame 10 for bonding, and the position of the first sub-portion 21 located in the conductive frame 10 is not completely fixed, so that the alignment and assembly of the light guide plate 50 and other optical films are not affected.
In another embodiment of the present invention, referring to fig. 8, the difference between this embodiment and the first embodiment is: the second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10, and the conductive element 60 is attached to the surface of the second frame 12 away from the light guide plate 50 through the conductive adhesive 71.
In summary, in the embodiment of the present invention, the light emitting element 30 is disposed on the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is attached to the first sub-portion 21 of the flexible circuit board 20, so that the relative position relationship between the light emitting element 30 and the light guide plate 50 can be fixed, and one end of the light guide plate 50 is disposed close to the light emitting element 30, so that the distance between the light guide plate 50 and the light emitting element 30 can be reduced, the amount of light emitted by the light emitting element 30 and entering the light guide plate 50 is increased, and the light efficiency of the backlight module is improved; in addition, in the embodiment of the invention, the second sub-portion 22 of the flexible circuit board 20 extends to the outside of the conductive frame 10, and the conducting element 60 located on the second sub-portion 22 is electrically connected between the electrical protection element 40 and the conductive frame 10, so as to achieve the electrical protection of the electrical protection element 40 on the light emitting element 30, and improve the yield of the backlight module, meanwhile, the second sub-portion 22 extends to the outside of the conductive frame 10 for bonding, and the position of the first sub-portion 21 located in the conductive frame 10 is not completely fixed, so that the alignment and assembly of the light guide plate 50 and other optical films are not affected.
In another embodiment of the present invention, referring to fig. 9, the difference between the present embodiment and the previous embodiment is: the opening 101 is disposed on the first frame 11, the second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10, and the conductive element 60 is attached to a surface of the second frame 12 away from the light guide plate 50 through the conductive adhesive 71.
In summary, in the embodiment of the present invention, the light emitting element 30 is disposed on the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is attached to the first sub-portion 21 of the flexible circuit board 20, so that the relative position relationship between the light emitting element 30 and the light guide plate 50 can be fixed, and one end of the light guide plate 50 is disposed close to the light emitting element 30, so that the distance between the light guide plate 50 and the light emitting element 30 can be reduced, the amount of light emitted by the light emitting element 30 and entering the light guide plate 50 is increased, and the light efficiency of the backlight module is improved; in addition, in the embodiment of the invention, the second sub-portion 22 of the flexible circuit board 20 extends to the outside of the conductive frame 10, and the conducting element 60 located on the second sub-portion 22 is electrically connected between the electrical protection element 40 and the conductive frame 10, so as to achieve the electrical protection of the electrical protection element 40 on the light emitting element 30, and improve the yield of the backlight module, meanwhile, the second sub-portion 22 extends to the outside of the conductive frame 10 for bonding, and the position of the first sub-portion 21 located in the conductive frame 10 is not completely fixed, so that the alignment and assembly of the light guide plate 50 and other optical films are not affected.
In addition, an embodiment of the present invention further provides a method for manufacturing a backlight module, referring to fig. 3, fig. 4, fig. 10, and fig. 11 to fig. 13, the method for manufacturing a backlight module includes the following steps:
s10, providing the conductive frame 10.
The conductive frame 10 has conductivity, and the material of the conductive frame 10 may be a conductive metal material; the conductive frame 10 includes a first frame 11, a third frame 13 disposed opposite to the first frame 11, and a second frame 12 connected between the first frame 11 and the third frame 13 and connected to the periphery of the first frame 11, wherein the second frame 12 surrounds between the first frame 11 and the third frame 13 to form a hollow space 102 between the first frame 11 and the third frame 13, and the second frame 12 is formed with a light outlet 103 to communicate the hollow space 102 with the outside; further, the backlight module includes a light-emitting side, and the third frame 13 is located on a side of the first frame 11 close to the light-emitting side of the backlight module, and the light-emitting port 103 in the third frame 13 can realize light emission of the backlight module.
An opening 101 is provided on the second housing 12 on the side closer to the first housing 11.
The reflective sheet 81 is formed in the hollow space 102 of the conductive frame 10, and the reflective sheet 81 is disposed on a surface of the first frame 11 close to the third frame 13, as shown in fig. 11.
And S20, providing the flexible circuit board 20, wherein the flexible circuit board 20 comprises a first sub-portion 21 and a second sub-portion 22, and the conducting piece 60 is formed in the second sub-portion 22.
The flexible circuit board 20 is defined as a first sub-portion 21 and a second sub-portion 22 connected to each other, and the first sub-portion 21 and the second sub-portion 22 are respectively located at two sides of the flexible circuit board 20.
It should be noted that the flexible circuit board 20 includes a substrate, a metal routing layer disposed on the substrate, and an insulating layer covering the metal routing layer, wherein the metal routing layer is used for forming a metal routing to transmit signals, and the insulating layer is used for covering the metal routing to perform a protection and insulation function.
Then, the surface of the conductive member 60 is coated with a conductive adhesive 71, and is attached to a side of the conductive adhesive 71 away from the conductive member 60 by a protective film 73.
S30, forming an electrical protection member 40 on the flexible circuit board 20, forming a light emitting element 30 on the first sub-portion 21, wherein the light emitting element 30 is electrically connected to the electrical protection member 40, and attaching the light guide plate 50 to the first sub-portion 21 near the light emitting element 30, wherein the light guide plate 50 and the light emitting element 30 are located on the same side of the first sub-portion 21.
The light emitting element 30 and the electrical protection element 40 are formed on the first sub-portion 21, and the light emitting element 30 is electrically connected to the electrical protection element 40.
Optionally, the electrical protection member 40 may be a Transient Voltage Suppressor (TVS), and the TVS may be any one of a unidirectional TVS tube and a bidirectional TVS tube, which may be selected according to actual requirements, and is not limited herein.
Next, one end of the light guide plate 50 is attached to the first sub-portion 21 near the light emitting element 30 by using a transparent adhesive 72, and the light guide plate 50 and the light emitting element 30 are located at the same side of the first sub-portion 21.
In the embodiment of the invention, the light guide plate 50 includes a light incident side surface close to one side of the second frame 12, and the light emitting element 30 includes a light emitting surface close to one side of the light guide plate 50, and the light emitting surface is in contact with the light incident side surface, so that the light emitting loss of the light emitting element 30 can be reduced to the greatest extent, and the light efficiency of the backlight module is effectively improved, as shown in fig. 12.
S40, the first sub-portion 21, the light emitting element 30 and the light guide plate 50 are assembled in the conductive frame 10, and the second sub-portion 22 extends out of the conductive frame 10.
The first sub-portion 21, the light emitting element 30 and the light guide plate 50 are disposed in the conductive frame 10 and close to the opening 101, and the second sub-portion 22 passes through the opening 101 and extends out of the conductive frame 10, as shown in fig. 13.
Then, a diffusion sheet 82, a lower brightness enhancement sheet 83 and an upper brightness enhancement sheet 84 are sequentially disposed on the side of the light guide plate 50 away from the reflection sheet 81, and aligned and assembled.
In the embodiment of the invention, the second sub-portion 22 is disposed outside the conductive frame 10, and the position of the second sub-portion 22 is not fixed, so that the first sub-portion 21 can move freely, the light guide plate 50 and the first sub-portion 21 are fixed and attached together, and the light guide plate 50 can move, so as to complete alignment and assembly of the light guide plate 50, the reflective sheet 81, the diffusion sheet 82, the lower brightness enhancement sheet 83 and the upper brightness enhancement sheet 84, and improve yield and stability of the backlight module.
S50, the conductive member 60 is electrically connected to the conductive frame 10.
The protective film 73 on the surface of the conductive adhesive 71 is removed, and then the second sub-portion 22 is bent to a side of the first frame 11 away from the light guide plate 50, so that the conductive member 60 is attached to the first frame 11 through the conductive adhesive 71, as shown in fig. 3.
In addition, referring to fig. 14, the display device includes a display panel and the backlight module described in the above embodiments, and the structure and the manufacturing method of the backlight module can be performed with reference to the above embodiments, which are not described herein again.
The display panel is arranged on the light-emitting side of the backlight module, and the backlight module provides a backlight source for the display panel. The display panel comprises an array substrate 91 and a color film substrate 92 which are arranged on the light-emitting side of the backlight module, and the array substrate 91 is positioned between the color film substrate 92 and the backlight module and is arranged opposite to the color film substrate 92; in addition, the display panel further includes a lower polarizer 93 disposed on a side of the array substrate 91 away from the color filter substrate 92, and an upper polarizer 94 disposed on a side of the color filter substrate 92 away from the array substrate 91.
Further, the display device further comprises foam 96 arranged between the array substrate 91 and the conductive frame 10 to play a role in protection and buffering, the display device further comprises a fixing adhesive tape 95 arranged on the periphery of the display panel and the backlight module, the fixing adhesive tape 95 can reinforce the assembly of the display panel and the backlight module, and the side face and the frame of the display device can be shielded, so that the display effect of the display device is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.
The backlight module, the manufacturing method thereof and the display device provided by the embodiment of the invention are described in detail, specific examples are applied to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A backlight module, comprising:
a conductive frame body;
a flexible circuit board including a first sub-portion disposed inside the conductive frame and a second sub-portion extending outside the conductive frame;
the light-emitting piece is arranged on the first sub-part;
the electric protection piece is arranged on the flexible circuit board and is electrically connected with the light-emitting piece;
the light guide plate is arranged in the conductive frame, one end of the light guide plate is close to the light-emitting piece and is attached to the first sub-portion, and the light guide plate and the light-emitting piece are positioned on the same side of the first sub-portion;
the second sub-portion includes a conductive element electrically connected to the electrical protection element, and the conductive element is electrically connected to the conductive frame.
2. The backlight module according to claim 1, wherein the conductive frame has an opening near the flexible circuit board, and the second sub-portion is connected to the first sub-portion and extends from the opening to outside of the conductive frame.
3. The backlight module according to claim 2, wherein the conductive frame comprises a first frame disposed on a surface of the light guide plate away from the light exit side of the backlight module, and a second frame disposed around the light guide plate, and the first sub-portion is disposed on a surface of the first frame close to the light exit side;
wherein the opening is provided in the first frame body or the second frame body.
4. The backlight module as claimed in claim 3, wherein the conductive member is electrically connected to a surface of the first frame away from the light-emitting side;
or the conducting piece is electrically connected with one surface, far away from the light guide plate, of the second frame body.
5. The backlight module as claimed in claim 3, wherein the light guide plate includes a light incident side surface adjacent to one side of the second frame, the light emitting element includes a light emitting surface adjacent to one side of the light guide plate, and the light emitting surface contacts the light incident side surface.
6. The backlight module as claimed in claim 1, wherein the conductive member is attached to the conductive frame via a conductive adhesive, and one end of the light guide plate is attached to the first sub-portion via a transparent adhesive.
7. The backlight module as claimed in claim 1, wherein the flexible circuit board includes two second sub-portions, the two second sub-portions are respectively connected to two ends of the first sub-portion, each of the second sub-portions includes at least one of the conductive elements, and each of the second sub-portions extends out of the conductive frame and is electrically connected to the conductive frame through the conductive element.
8. The backlight module according to claim 1, wherein the distance between the light emitting member and the light guide plate is less than or equal to 2 mm.
9. A method for manufacturing a backlight module is characterized by comprising the following steps:
providing a conductive frame body;
providing a flexible circuit board including a first sub-part and a second sub-part in which a conductive member is formed;
forming an electrical protection element on the flexible circuit board, forming a light emitting element electrically connected with the electrical protection element on the first sub-portion, and attaching one end of a light guide plate close to the light emitting element to the first sub-portion, wherein the light guide plate and the light emitting element are positioned on the same side of the first sub-portion;
assembling the first sub-portion, the light emitting element and the light guide plate in the conductive frame, and the second sub-portion extending out of the conductive frame;
and electrically connecting the conducting piece with the conductive frame body.
10. A display device, comprising a display panel and the backlight module according to any one of claims 1 to 8, wherein the display panel is disposed on a light-emitting side of the backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211020787.9A CN115390310A (en) | 2022-08-24 | 2022-08-24 | Backlight module, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211020787.9A CN115390310A (en) | 2022-08-24 | 2022-08-24 | Backlight module, manufacturing method thereof and display device |
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| CN115390310A true CN115390310A (en) | 2022-11-25 |
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| CN202211020787.9A Pending CN115390310A (en) | 2022-08-24 | 2022-08-24 | Backlight module, manufacturing method thereof and display device |
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