CN115383540A

CN115383540A - Automatic stacking and packaging production line after composite wafer forming and deburring

Info

Publication number: CN115383540A
Application number: CN202211084032.5A
Authority: CN
Inventors: 许瑞琦; 曾超超
Original assignee: Shanghai Jingwei Intelligent Technology Co ltd
Current assignee: Shanghai Jingwei Intelligent Technology Co ltd
Priority date: 2022-09-06
Filing date: 2022-09-06
Publication date: 2022-11-25

Abstract

The invention belongs to the field of composite wafer forming and machining, and particularly relates to an automatic stacking and packaging production line for composite wafers after forming and deburring, which comprises a polishing machine body and a polishing mechanism arranged at the top of the polishing machine body, wherein the polishing mechanism comprises a clamping component and a rotating component; the clamping assembly comprises a polishing machine body, an adjusting seat, a first chain belt, a sliding seat, a first support, a rotating wheel, a polishing wafer and a second support, wherein the adjusting seat is installed at the top of the polishing machine body, the first chain belt is arranged on the side of the adjusting seat, the end part of the first chain belt is connected with the sliding seat, the first support is installed at the top of the sliding seat, the rotating wheel is installed at the top of the first support, and the polishing wafer is installed on the inner side of the rotating wheel.

Description

Automatic production line for stacking and packaging after deburring in composite wafer forming process

Technical Field

The invention relates to the field of composite wafer forming and processing, in particular to an automatic stacking and packaging production line after composite wafers are formed and deburred.

Background

After the composite wafer is formed and processed, irregular burrs are prone to occur on the periphery of the composite wafer, so that the quality and the appearance of a finished product are affected, burrs on the outer side need to be removed, grinding and processing are needed, in the prior art, a large number of workers use an air mill to repair one shift of 20 to 30 workers manually, grinding is time-consuming and labor-consuming, manual processing is needed, dust is large, pollution is strong, efficiency is low, investment is large, and processing of the finished product is very labor-consuming.

Therefore, the prior art does not meet some of the requirements and there is a need to develop new functional lift tables.

Disclosure of Invention

This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. In this section, as well as in the abstract and the title of the invention of this application, simplifications or omissions may be made to avoid obscuring the purpose of the section, the abstract and the title, and such simplifications or omissions are not intended to limit the scope of the invention.

Therefore, the technical problems to be solved by the invention are as follows: the inconvenient processing of polishing of automizing wastes time and energy, and the precision of polishing is not high, has certain influence to processing.

In order to solve the technical problems, the invention provides the following technical scheme: an automatic stacking and packaging production line for formed and deburred composite wafers comprises a polishing machine body and a polishing mechanism arranged at the top of the polishing machine body, wherein the polishing mechanism comprises a clamping component and a rotating component;

the clamping assembly comprises a polishing machine body, an adjusting seat, a first chain belt, a sliding seat, a first support, a rotating wheel, a polishing wafer and a second support, wherein the adjusting seat is installed at the top of the polishing machine body, the first chain belt is arranged on the side of the adjusting seat, the end part of the first chain belt is connected with the sliding seat, the first support is installed at the top of the sliding seat, the rotating wheel is installed at the top of the first support, the polishing wafer is installed on the inner side of the rotating wheel, and the second support is arranged on the other side of the polishing wafer;

the rotating assembly comprises a funnel, a grinding block, a leakage groove, a connection control frame and a motor, the funnel is arranged on the inner side of the second support, the grinding block is mounted at the top of the second support, the leakage groove is formed in the lower portion of the funnel, the connection control frame is mounted on the side of the leakage groove, and the motor is connected to the bottom of the connection control frame.

As an optimal scheme of the automatic production line for stacking and packaging after the composite wafer is formed and deburred, the invention comprises the following steps: first leading truck is installed to the top of the organism of polishing, and the outside of first leading truck installs the conveying frame, the avris of conveying frame is connected with the second chain belt, the avris of the organism of polishing is provided with conveyer, and conveyer's the outside installs installation mechanism, conveyer's tip is provided with the second leading truck, and the top of second leading truck is provided with the guide rail, the top of guide rail is provided with the transmission dish, the tip of second leading truck is provided with the support, and installs adjustment mechanism in the outside of support, adjustment mechanism's offside is provided with the spacing frame of second, the avris of support is connected with the arm, and the avris of arm is provided with the pile up neatly roller, the tip of pile up neatly roller is provided with the buffer memory roller, online strapper sets up in the avris of buffer memory roller.

As an optimal scheme of the automatic production line for stacking and packaging after the composite wafer is formed and deburred, the invention comprises the following steps: the polishing wafer forms a clamping structure between the rotating wheel and the first support, and the first support forms a sliding structure between the sliding seat and the adjusting seat.

As an optimal scheme of the automatic production line for stacking and packaging after the composite wafer is formed and deburred, the invention comprises the following steps: the polishing wafer forms a rotating structure through the connection control frame and the adjusting seat, and the polishing wafer forms a transmission structure through the connection control frame and the polishing block.

As an optimal scheme of the automatic production line for stacking and packaging after the composite wafer is formed and deburred, the invention comprises the following steps: the mounting mechanism comprises a mounting frame, a clamping block and a guide rod, the clamping block is connected to the outer side of the mounting frame, and the guide rod is connected to the outer side of the clamping block.

As an optimal scheme of the automatic production line for stacking and packaging after the composite wafer is formed and deburred, the invention comprises the following steps: the guide rod passes through to constitute the block structure between fixture block and the mounting bracket, and the guide rod sets up in the axis symmetry of mounting bracket.

As an optimal scheme of the automatic production line for stacking and packaging after the composite wafer is formed and deburred, the invention comprises the following steps: the adjusting mechanism comprises a third chain belt, a first limiting frame and a guide rod, the outer side of the third chain belt is connected with the first limiting frame, and the guide rod penetrates through the middle of the first limiting frame.

As an optimal scheme of the automatic production line for stacking and packaging after the composite wafer is formed and deburred, the invention comprises the following steps: the first limiting frame and the guide rod form a sliding structure through the third chain belt, and the guide rod and the second limiting frame are oppositely arranged.

The invention has the following beneficial effects:

according to the invention, the polishing machine body is arranged, when the polishing machine body is used, the bottom of the conveying frame adsorbs a polished wafer to move, so that the polished wafer is accurately positioned and placed at the center of the top of the connection control frame, at the moment, the first chain belt at the outer side is controlled to drive the first supports at the two sides and the second support to move relatively, the outer side of the polished wafer at the middle part is clamped and limited, the subsequent flexible and stable integral rotating polishing operation can be ensured, multiple groups of polished wafers can be simultaneously processed, the manpower and material resources are effectively saved, and the effect efficiency and the precision are improved.

According to the automatic polishing machine, the rotating assembly is arranged, after the clamping is completed, the bottom motor is controlled to drive the connection control frame to perform uniform rotation control, the whole polishing wafer can be stably adsorbed by the top and is matched with the outer rotating wheel to perform integral limiting, the whole polishing wafer can be stably and uniformly contacted with the outer polishing block, automatic polishing processing and using are performed, the integral processing efficiency is improved, the processing stability is also improved, the disassembly and the assembly are convenient, and after the processing is completed, the polishing wafer is further moved to a transmission position by the transmission frame in a sliding mode along the first guide frame to enter the next processing.

According to the invention, by arranging the mounting mechanism, when the polishing wafer moves to the conveying belt, the conveying operation of the polishing wafer can be stably carried out at a constant speed through the conveying belt, and meanwhile, the mounting mechanism additionally arranged at the top can be oppositely arranged relative to the conveying belt, so that the polishing wafer moving below can be further oriented through the guide rod, the stability of movement is ensured, the deviation situation is prevented, the next processing operation is influenced, and the use is convenient and flexible.

According to the automatic transmission device, the mechanical arm is arranged, a polished wafer enters a guide rail position, the automatic transmission device scans and automatically adapts to polished wafers of different specifications, the polished wafer can be stably moved to a next processing position through the transmission disc and can be flexibly adjusted, the processing operation under different conditions can be more accurate, the polished wafer can be automatically moved to the top of the support, the device automatically drives the first limiting frame to adjust through controlling the third chain belt, the device can be matched with the relative adjustment of the second limiting frame on the opposite side, the adjustment and adaptation can be more flexibly and multidirectional, the automatic sensing and stopping are carried out at the proper position, the polished wafer stacking is carried out, the operation is flexible and convenient, the adaptive operation of processed products of different specifications can be conveniently carried out, the polished wafer stacked can be clamped and transferred through controlling the rear side mechanical arm, the moving range of the mechanical arm is 180 degrees, the mechanical arm can be grabbed and transferred to the top of the stacking roller on the other side to be aligned and placed, so that a subsequent packaging procedure can be conveniently carried out, the effect of stably transmitting and polishing can be achieved through the stacking roller and the stacked polishing roller, the polished wafer can be further transported into an online bundling machine, the whole machine, the automatic transmission device can be conveniently used, the automatic transmission device can effectively reduce labor input, the manual transmission device can be more easily compared with 20-to 30, the processing efficiency, the full-scale processing efficiency can be greatly improved, and the dust pollution can be improved, and the full-scale processing efficiency can be improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise. Wherein:

fig. 1 is a schematic structural view of an entire top view in the first to eighth embodiments.

Fig. 2 is a schematic top view of the sander body in the first to fourth embodiments.

Fig. 3 is a schematic structural view of the grinding mechanism in the first to fourth embodiments.

FIG. 4 is a schematic structural view of the mounting mechanism in the first, second, fifth and sixth embodiments.

Fig. 5 is a schematic top view of the disk docking mechanism in the first, second, seventh and eighth embodiments.

In the figure: 1 grinding machine body, 2 adjusting seats, 3 first chain belts, 4 sliding seats, 5 first supports, 6 rotating wheels, 7 grinding wafers, 8 second supports, 9 funnels, 10 grinding blocks, 11 leakage grooves, 12 connection control frames, 13 motors, 14 first guide frames, 15 conveying frames, 16 second chain belts, 17 conveying belts, 18 mounting mechanisms, 1801 mounting frames, 1802 fixture blocks, 1803 guide rods, 19 second guide frames, 20 guide rails, 21 conveying discs, 22 supports, 23 adjusting mechanisms, 2301 third chain belts, 2302 first limiting frames, 2303 guide rods, 24 second limiting frames, 25 mechanical arms, 26 stacking rollers, 27 caching rollers and 28 online bundling machines.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Example 1

The invention provides a stacking and packaging automatic production line after forming and deburring of composite wafers, which comprises a polishing machine body 1 and a polishing mechanism arranged at the top of the polishing machine body 1, wherein the polishing mechanism comprises a clamping component and a rotating component;

referring to fig. 1-3, the clamping assembly includes a polishing machine body 1, an adjusting seat 2, a first chain belt 3, a sliding seat 4, a first support 5, a rotating wheel 6, a polishing disc 7 and a second support 8, the adjusting seat 2 is installed at the top of the polishing machine body 1, the first chain belt 3 is arranged on the side of the adjusting seat 2, the end of the first chain belt 3 is connected with the sliding seat 4, the first support 5 is installed at the top of the sliding seat 4, the rotating wheel 6 is installed at the top of the first support 5, the polishing disc 7 is installed on the inner side of the rotating wheel 6, the second support 8 is arranged on the other side of the polishing disc 7, the first chain belt 3 on the outer side is controlled to drive the first supports 5 and the second supports 8 on the two sides to move relatively, the polishing disc 7 on the outer side is clamped and limited, subsequent flexible and stable integral rotating polishing operation can be guaranteed, multiple sets of processing can be performed simultaneously, manpower and material resources are effectively saved, and effect efficiency and accuracy are improved;

referring to fig. 1-3, the rotating assembly includes a funnel 9, a polishing block 10, a leakage groove 11, a connection control frame 12 and a motor 13, the funnel 9 is disposed on the inner side of the second support 8, the polishing block 10 is mounted on the top of the second support 8, the leakage groove 11 is disposed below the funnel 9, the connection control frame 12 is mounted on the side of the leakage groove 11, the motor 13 is connected to the bottom of the connection control frame 12, automatic polishing operation can be stably performed, the funnel 9 and the leakage groove 11 are disposed below the connection control frame, the recovery of polishing scraps can be conveniently performed, the occurrence of dust is effectively reduced, pollution is reduced, and the processing efficiency and precision are improved.

Example 2

The present embodiment is based on the previous embodiment, and is different from the previous embodiment in that the present embodiment provides an automatic production line for stacking and packaging after forming and deburring composite wafers, specifically.

Referring to fig. 1-5, a first guide frame 14 is installed above a grinding machine body 1, a conveying frame 15 is installed outside the first guide frame 14, a second chain belt 16 is connected to the side of the conveying frame 15, a conveying belt 17 is installed on the side of the grinding machine body 1, an installation mechanism 18 is installed outside the conveying belt 17, a second guide frame 19 is installed at the end of the conveying belt 17, a guide rail 20 is installed at the top of the second guide frame 19, a conveying disc 21 is installed above the guide rail 20, a support 22 is installed at the end of the second guide frame 19, an adjusting mechanism 23 is installed outside the support 22, a second limiting frame 24 is installed opposite to the adjusting mechanism 23, a mechanical arm 25 is connected to the side of the support 22, a stacking roller 26 is installed at the side of the mechanical arm 25, a buffer roller 27 is installed at the end of the stacking roller 26, an online binding machine 28 is installed at the side of the buffer roller 27, and the whole equipment is processed in a production line.

Example 3

The present embodiment is based on the previous embodiment, and is different from the previous embodiment in that the present embodiment provides a connection structure of the engaging element, specifically.

Referring to fig. 1-3, the polishing disc 7 forms a clamping structure with the first support 5 through the rotating wheel 6, and the first support 5 forms a sliding structure with the adjusting seat 2 through the sliding seat 4, so that the outer side of the polishing disc 7 in the middle is clamped, clamped and limited, and the subsequent flexible and stable overall rotation polishing operation can be ensured.

Example 4

The present embodiment is based on the previous embodiment, and is different from the previous embodiment in that the present embodiment provides a connection structure of a rotating assembly, specifically.

Referring to fig. 1-3, the polishing wafer 7 forms a rotating structure with the adjusting seat 2 through the connection control frame 12, and the polishing wafer 7 forms a transmission structure with the polishing blocks 10 through the connection control frame 12, so that the whole polishing wafer 7 can stably and uniformly contact with the outer polishing blocks 10, the automatic polishing is performed, and the whole processing efficiency is improved.

Example 5

The present embodiment is based on the previous embodiment, and is different from the previous embodiment in that the present embodiment provides a connection structure of the guide rod 1803 and the conveyor belt 17, specifically.

Referring to fig. 1 and 4, the mounting mechanism 18 includes a mounting frame 1801, a fixture block 1802, and a guide rod 1803, the fixture block 1802 is connected to the outer side of the mounting frame 1801, and the guide rod 1803 is connected to the outer side of the fixture block 1802, so that the mounting and dismounting are convenient and fast, and the passage limit of the polishing wafers 7 of different specifications can be met.

Example 6

The present embodiment is based on the previous embodiment, and is different from the previous embodiment in that the present embodiment provides a mounting structure of the guide bar 1803, specifically.

Referring to fig. 1 and 4, the guide rod 1803 forms a clamping structure with the mounting frame 1801 through the clamping block 1802, and the guide rod 1803 is symmetrically arranged about the central axis of the mounting frame 1801, so as to further orient the polishing wafer 7 moving below through the guide rod 1803, thereby ensuring the stability of the movement.

Example 7

The present embodiment is based on the previous embodiment, and is different from the previous embodiment in that the present embodiment provides an overall structure of the wafer diameter switching pair wire, specifically.

Referring to fig. 1 and 5, the adjusting mechanism 23 includes a third chain belt 2301, a first limiting frame 2302 and a guide rod 2303, the first limiting frame 2302 is connected to an outer side of the third chain belt 2301, the guide rod 2303 penetrates through a middle portion of the first limiting frame 2302, and the automatic adjusting device scans and drives the disc 7 to adapt to polishing discs 7 of different specifications, so as to ensure that the polishing discs 7 can stably move to a next processing position through the transmission disc 21.

Example 8

The present embodiment is based on the previous embodiment, and is different from the previous embodiment in that the connection structure of the first limiting frame 2302 provided in the present embodiment is specific.

Referring to fig. 1 and 5, the first position-limiting frame 2302 forms a sliding structure with the guide rod 2303 through the third chain belt 2301, and the guide rod 2303 and the second position-limiting frame 24 are oppositely arranged and matched with the opposite second position-limiting frame 24 to be relatively adjusted, so that adjustment and adaptation can be more flexibly performed in multiple directions, and self-induction stop can be performed at a proper position to stack the polished wafers 7.

The working principle is as follows: firstly, when the device is used, the bottom of the conveying frame 15 adsorbs the polished wafer 7 to move, so that the polished wafer is accurately positioned and placed at the center of the top of the connection control frame 12, at the moment, the first chain belt 3 on the outer side is controlled to drive the first supports 5 on the two sides and the second supports 8 to move relatively, the polished wafer 7 on the middle part is clamped and limited on the outer side, the subsequent flexible and stable integral rotating polishing operation can be ensured, multiple groups of wafers can be processed simultaneously, the manpower and material resources are effectively saved, and the effect efficiency and the precision are improved;

then, after the clamping is completed, the bottom motor 13 is controlled to drive the connection control frame 12 to perform uniform rotation control, the whole wafer 7 can be stably adsorbed through the top and is matched with the outer rotating wheel 6 to perform integral limiting, the whole polished wafer 7 can be stably and uniformly contacted with the outer polishing block 10, automatic polishing and processing are performed, the integral processing efficiency is improved, the processing stability is also improved, the disassembly and the assembly are convenient, after the processing is completed, the polished wafer 7 is further moved to a transmission position by sliding the transmission frame 15 along the first guide frame 14, and the next processing is performed;

then, when the polished wafer 7 moves to the position of the conveying belt 17, the conveying operation of the polished wafer 7 can be stably carried out at a constant speed through the conveying belt 17, and meanwhile, the mounting mechanism 18 additionally arranged at the top can be oppositely arranged relative to the conveying belt 17, so that the polished wafer 7 moving below can be further oriented through the guide rod 1803, the stability of movement is ensured, the offset condition is prevented from occurring, the next processing operation is influenced, and the use is convenient and flexible;

after that, the polished wafer 7 enters the position of the guide rail 20, the polished wafer 7 can be automatically adapted to polished wafers 7 of different specifications through scanning of an automatic adjusting device and transmission equipment, so that the polished wafer 7 can be stably moved to a next processing position through a transmission disc 21, flexible adjustment can be realized, the processing operation under different conditions can be more accurate, only the polished wafer 7 needs to be moved to the top of a support 22, the equipment automatically drives a first limiting frame 2302 through controlling a third chain belt 2301 to be adjusted, the adjustment can be more flexibly and multidirectionally realized by matching with relative adjustment of an opposite side second limiting frame 24, self-induction stop is realized at a proper position, stacking of the polished wafers 7 is realized, the operation is flexible and convenient, adaptation operation of processed products of different specifications is convenient, the subsequent polished wafers 7 stacked can be clamped and transferred through controlling a rear side mechanical arm 25, the movable range of the mechanical arm 25 is 180 degrees, the wafers can be grabbed and then transferred to the top of an aligned stacking roller 26 at the other side to be placed, so that the wafer stacking can enter a subsequent packaging process procedure, the wafer 7 can play a role in stably conveying the buffer polished wafers and can be further bundled in a subsequent binding machine 28, the whole process can be realized, the whole dust pollution reduction can be greatly improved, and the whole processing efficiency of the whole packaging process is improved by a more convenient and convenient for people.

Claims

1. The utility model provides a pile up neatly packing automation line behind compound disk shaping burring which characterized in that: the polishing machine comprises a polishing machine body (1) and a polishing mechanism arranged at the top of the polishing machine body (1), wherein the polishing mechanism comprises a clamping component and a rotating component;

the clamping assembly comprises a polishing machine body (1), an adjusting seat (2), a first chain belt (3), a sliding seat (4), a first support (5), a rotating wheel (6), a polishing wafer (7) and a second support (8), wherein the adjusting seat (2) is installed at the top of the polishing machine body (1), the first chain belt (3) is arranged on the side of the adjusting seat (2), the end part of the first chain belt (3) is connected with the sliding seat (4), the first support (5) is installed at the top of the sliding seat (4), the rotating wheel (6) is installed at the top of the first support (5), the polishing wafer (7) is installed on the inner side of the rotating wheel (6), and the second support (8) is arranged on the other side of the polishing wafer (7);

the rotating assembly comprises a funnel (9), a grinding block (10), a leakage groove (11), a connection control frame (12) and a motor (13), the inner side of the second support (8) is provided with the funnel (9), the grinding block (10) mounted at the top of the second support (8), the leakage groove (11) is formed in the lower portion of the funnel (9), the connection control frame (12) is installed on the side of the leakage groove (11), and the bottom of the connection control frame (12) is connected with the motor (13).

2. The automatic production line for the formed and deburred composite wafers as claimed in claim 1, wherein the production line comprises: first leading truck (14) is installed to the top of the machine body of polishing (1), and the outside of first leading truck (14) installs transfer frame (15), the avris of transfer frame (15) is connected with second chain belt (16), the avris of the machine body of polishing (1) is provided with conveyer (17), and the outside of conveyer (17) installs installation mechanism (18), the tip of conveyer (17) is provided with second leading truck (19), and the top of second leading truck (19) is provided with guide rail (20), the top of guide rail (20) is provided with transmission dish (21), the tip of second leading truck (19) is provided with support (22), and installs adjustment mechanism (23) in the outside of support (22), the offside of adjustment mechanism (23) is provided with spacing frame of second (24), the avris of support (22) is connected with arm (25), and the avris of arm (25) is provided with pile up neatly roller (26), the tip of pile up neatly roller (26) is provided with buffer memory roller (27), buffer memory online strapper (28) sets up in the avris roller (27).

3. The post-deburring palletized packaging automatic production line for composite wafer molding as claimed in claim 1, characterized in that: polishing disk (7) constitute the block structure through between runner (6) and first support (5), and just first support (5) constitute sliding construction through sliding seat (4) and between adjusting seat (2).

4. The automatic production line for the formed and deburred composite wafers as claimed in claim 1, wherein the production line comprises: the polishing wafer (7) forms a rotating structure with the adjusting seat (2) through the connection control frame (12), and the polishing wafer (7) forms a transmission structure with the polishing block (10) through the connection control frame (12).

5. The automatic production line for the formed and deburred composite wafers as claimed in claim 2, wherein: the mounting mechanism (18) comprises a mounting frame (1801), a clamping block (1802) and a guide rod (1803), wherein the clamping block (1802) is connected to the outer side of the mounting frame (1801), and the guide rod (1803) is connected to the outer side of the clamping block (1802).

6. The automatic production line for the formed and deburred composite wafers as claimed in claim 5, wherein: guide bar (1803) pass through and constitute the block structure between fixture block (1802) and mounting bracket (1801), and guide bar (1803) set up about the axis symmetry of mounting bracket (1801).

7. The post-deburring palletized packaging automatic production line for composite wafer molding as claimed in claim 2, characterized in that: the adjusting mechanism (23) comprises a third chain belt (2301), a first limiting frame (2302) and guide rods (2303), the first limiting frame (2302) is connected to the outer side of the third chain belt (2301), and the guide rods (2303) penetrate through the middle of the first limiting frame (2302).

8. The automatic production line for the formed and deburred composite wafers as claimed in claim 7, wherein: the first limiting frame (2302) forms a sliding structure through the third chain belt (2301) and the guide rod (2303), and the guide rod (2303) and the second limiting frame (24) are oppositely arranged.