CN115377045B - Lead frame pad and solid welding device - Google Patents
Lead frame pad and solid welding device Download PDFInfo
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- CN115377045B CN115377045B CN202211306887.8A CN202211306887A CN115377045B CN 115377045 B CN115377045 B CN 115377045B CN 202211306887 A CN202211306887 A CN 202211306887A CN 115377045 B CN115377045 B CN 115377045B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a lead frame pad and solid device that welds, belong to semiconductor device production facility field, at least one department has been seted up to the top surface of lead frame pad and has been stacked the groove, the bottom surface of pad is equipped with two at least bracing pieces, the top surface of bracing piece is equipped with the locating pin that upwards passes the pad perpendicularly, the axis direction removal setting of bracing piece along the locating pin, when the bracing piece removes to extreme position to the below of pad, the top surface of locating pin is less than or the parallel and level in the bottom surface that stacks the groove, the both ends of bracing piece all have the lug of protrusion in the pad top surface, the outer wall of lug and the both sides outer wall parallel and level of pad, the bottom surface of bracing piece is protrusion in the bottom surface of pad downwards, be used for the location when carrying the pad, and convex size is less than the protruding pad top surface of lug. The lead frame fixedly welding device comprises the lead frame bonding pad and the heating furnace. The lead frame can be automatically separated from the bonding pad, the lead frame can be prevented from being deformed, high efficiency is achieved, and the solid welding device can improve the solid welding effect.
Description
Technical Field
The invention belongs to the technical field of semiconductor device production equipment, and particularly relates to a lead frame bonding pad and a solid welding device.
Background
The semiconductor device is generally made of lead frames, two or more lead frames are overlapped during production, chips are adhered to pins between the lead frames through solder paste before overlapping, the lead frames are fixedly welded together through high-temperature sintering equipment after overlapping, then an injection molding equipment is used for forming a packaging body in a corresponding packaging area, and finally a single semiconductor device is formed through stamping and rib cutting.
The existing equipment has the following problems in the use process:
1. the pad used for superposing the multi-layer lead frame generally utilizes the locating pin to position the lead frame, because the semiconductor device belongs to the precision device, in order to improve the relative position precision between the lead frames, the fit clearance between the locating pin of the pad and the locating hole of the lead frame is smaller, the chamfer structure at the top of the locating pin is required to be smoothly inserted into the locating hole of the lead frame during the assembly, after the fixation, because the lead frame has micro deformation, the clamping stagnation phenomenon exists between the locating hole of the lead frame and the locating pin of the pad, the lead frame integrated with the fixation can be separated from the pad only by manually beating the vibration mode from the back of the pad at present, the efficiency of the operation mode is lower, the temperature during the fixation can reach more than 370 degrees, therefore, the operation can be carried out when the temperature of the pad is reduced, and the production efficiency is influenced; if the lead frame is pulled out, the lead frame is easy to deform, and the packaging position precision of the packaging body is influenced;
2. the existing equipment is in solid welding process, and the lead frame is placed in the pad all the time, so the heating temperature of the uppermost layer and the lowermost layer of the multi-layer lead frame is uneven, and the consistent solid welding effect cannot be achieved.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides the lead frame bonding pad and the fixing and welding device, which can automatically separate the lead frame after pre-fixing and welding from the bonding pad, prevent the lead frame from deforming and have higher efficiency, and the fixing and welding device can perform heating and fixing and welding from two sides of the overlapped lead frame, thereby improving the fixing and welding effect.
In order to realize the purpose of the invention, the following scheme is adopted:
the utility model provides a lead frame pad, at least one department has been seted up to the top surface of pad and has been stacked the groove, the bottom surface of pad is equipped with two at least bracing pieces along pad direction of delivery interval, the top surface of bracing piece is equipped with the locating pin of connecting the lead frame locating hole, the locating pin upwards passes the pad perpendicularly, the axis direction removal setting of bracing piece along the locating pin, when the bracing piece removes to extreme position to the below of pad, the top surface of locating pin is less than or the parallel and level in the bottom surface that stacks the groove, the both ends of bracing piece all have the lug of protrusion in the pad top surface, the outer wall of lug and the both sides outer wall parallel and level of pad, the bottom surface of bracing piece is protrusion in the bottom surface of pad downwards, be used for the location when carrying the pad, and convex size is less than the size of lug protrusion pad top surface.
Furthermore, the bottom surface at both ends of the supporting rod is provided with a right-angle notch, the right-angle notch and the two side walls of the groove for penetrating the lug form positioning grooves, and when the welding discs are stacked, the lug of the welding disc below is clamped in the positioning groove at the bottom of the welding disc above.
A lead frame fixedly welding device comprises the lead frame bonding pad and a heating furnace.
A feeding part and an output belt are arranged in the heating furnace along the same direction, a pad output channel is arranged above the output belt and comprises two rails which are parallel to each other and arranged at intervals, the front section of the pad output channel is positioned in the heating furnace, and the rear section of the pad output channel is positioned outside the heating furnace;
a rotatable rotating frame is arranged between the tail end of the feeding part and the front ends of the output belt and the pad output channel, the rotating frame is driven by a motor, the motor can be arranged on the outer wall of the heating furnace, the rotating frame is provided with four clamping grooves along the circumferential array of the rotation axis, and the four clamping grooves are mutually vertical and have the same distance with the rotation axis of the rotating frame;
when the solid welding work is carried out, the welding disc overlapped with the lead frame enters a heating furnace through a feeding part, and the top of the lead frame is heated and pre-solid welded; when the bonding pad moves to the preset position of the feeding part, the bonding pad is just clamped in the clamping groove; the swivel mount is rotatory 180 to make the pad be the top surface down the state be located the anterior segment that the pad exported the way, and the pad supports respectively on the track of both sides through the lug of both sides, the lead frame that welds in advance on the pad passes down the interval between two tracks and falls to the output area, the lead frame another side that welds in advance at this moment is upwards facing to weld fixedly, the lead frame exports to the heating furnace outside through the output area at last, empty pad exports the way through the pad and exports to the heating furnace outside.
Furthermore, the two rails have the same structure and are of symmetrical structures, the rails all comprise side plates, the side walls of the side plates are provided with transmission belts, pressing strips parallel to the side plates are arranged above the transmission belts, each pressing strip is provided with at least two connecting rods vertically penetrating through the side plates, side ejector rods vertically penetrate through the side plates and correspond to the lower portions of the connecting rods, side pressing blocks are arranged on the front sections of the side ejector rods, the top surfaces of the side pressing blocks are inclined planes, the inclined planes face towards the middle of the pad output channel, pressure springs are arranged between the side pressing blocks and the inner walls of the side plates, the tail ends of the side ejector rods and the connecting rods are respectively connected to two ends of a swing rod, the tail ends of the side ejector rods and the tail ends of the connecting rods can move relatively along the length direction of the swing rod, the middle of the swing rod is hinged to a convex hinge rod on the outer wall of the side plate, and the hinge rod is located between the side ejector rods and the connecting rods;
when the pressure spring is in a natural state, the pressing strips are in contact with the inner wall of the side plate, the distance between the pressing strips of the two rails is larger than the width of the bonding pad, the side pressing block is positioned above the conveying belt, the front end of each pressing strip is provided with a downward convex guide inclined plane, the lowest point of each guide inclined plane is lower than the bottom surface of each pressing strip, and the height difference between the guide inclined planes and the bottom surfaces of the stacking grooves is larger than or equal to the height of the positioning pin protruding out of the bottom surfaces of the stacking grooves.
Further, the bottom surface of the conveying belt is provided with a supporting plate.
Further, the feeding part includes the transfer board for bear and shift the pad that is equipped with the coincide lead frame, the transfer board removes the setting along the direction of delivery of feeding part, and the transfer board top surface is equipped with an at least bar hole, and the bar hole is used for the joint support pole.
Further, the entry end of feeding part is equipped with temporary storage mechanism, a pad for temporary storage stack coincide has lead wire frame, temporary storage mechanism includes the rectangle frame of vertical setting, a plurality of pin that are in same horizontal plane are all worn to be equipped with by the both sides wall that the rectangle frame is relative, the front end of pin is towards the inboard of rectangle frame, and the front end of pin has the ascending support inclined plane of slope, all be equipped with tension spring between the end of pin and the outer wall of rectangle frame, tension spring is when natural state, the front end of pin is located the rectangle frame, a pad for supporting the top stack.
Furthermore, the stop lever all corresponds the both ends setting of bracing piece, and the rectangular channel has all been seted up along vertical direction to the front end of stop lever for the cooperation bracing piece.
Furthermore, all the stop levers positioned on the same side of the rectangular frame are connected to the same rod piece.
The invention has the beneficial effects that:
1. the locating pin of all bracing pieces on the pad all can be all and extract simultaneously from the locating hole of lead frame, can relax take out the lead frame from the pad, is whole and smooth taking out moreover, not only swift, can prevent moreover that the lead frame from being dragged the deformation, has solved the problem that the lead frame that exists when the manual work takes out the pad warp.
2. The lead frame can be quickly taken out without waiting for cooling the bonding pad, so that the production efficiency can be greatly improved, the waiting time is reduced, and the problem of low efficiency caused by manual separation is solved.
3. The lead frame after the coincide makes the upper and lower face of lead frame be heated more evenly through the removal on feeding part and output belt and the face position transform from top to bottom, has solved the uneven problem of the temperature of being heated of multilayer lead frame the superiors and the lower floor, helps improving the solid welding effect.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 shows a top structural view of the bond pad of the present application.
Fig. 2 shows a bottom structural view of the pad of the present application.
Fig. 3 shows a cross-sectional view of a bond pad of the present application.
Fig. 4 shows a schematic view of a stacking state of the pads of the present application.
Fig. 5 is a schematic view showing the overall external structure of the lead frame soldering apparatus of the present application.
Fig. 6 shows a schematic view of the internal structure of the lead frame soldering apparatus of the present application.
Fig. 7 is a schematic diagram showing the structure and position relationship of the feeding unit, the output tape, the pad output lane, and the rotary frame according to the present application.
FIG. 8 is a diagram showing a state where a pad is located above a pad output via.
FIG. 9 is a diagram showing a state during a pad entering a pad output lane.
Fig. 10 shows a partial enlarged view at a in fig. 9.
Fig. 11 shows a partial enlarged view at B in fig. 9.
Fig. 12 is a schematic view showing a state where the bump of the pad is in contact with the transmission belt.
Fig. 13 shows a partial enlarged view at C in fig. 12.
Fig. 14 is a schematic view showing a state in which the pad is moved toward the leading end of the molding.
Fig. 15 shows a partial enlarged view at D in fig. 14.
Fig. 16 shows a partial enlarged view at E in fig. 14.
Fig. 17 shows an overall structural diagram of the temporary storage mechanism of the present application.
Fig. 18 shows a partial enlarged view at F in fig. 17.
Fig. 19 shows a schematic view of a preferred construction of the stop lever of the present application.
Fig. 20 shows a partial schematic view of a bar inserted between two layers of pads of a stack.
The labels in the figure are: the device comprises a stacking groove-11, a positioning groove-111, a support rod-12, a positioning pin-121, a bump-122, a heating furnace-2, a feeding component-3, a transfer plate-31, a strip hole-311, an output belt-4, a pad output channel-5, a track-51, a side plate-52, a hinge rod-521, a transmission belt-53, a support plate-531, a pressing strip-54, a connecting rod-541, a guide inclined plane-542, a side ejector rod-55, a side pressing block-551, a pressure spring-552, a swing rod-56, a rotating frame-6, a clamping groove-61, a temporary storage mechanism-7, a rectangular frame-71, a stop rod-72, a support inclined plane-721, a rectangular groove-722 and a tension spring-73.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
Example 1
As shown in fig. 1 to 3, in a lead frame pad, at least one stacking groove 11 is formed in a top surface of the pad, the stacking groove 11 is used for accommodating a lead frame, at least two support rods 12 are arranged on a bottom surface of the pad at intervals along a conveying direction of the pad, positioning pins 121 connected with positioning holes of the lead frame are arranged on the top surface of the support rods 12, the positioning pins 121 vertically penetrate through the pad upwards and are located in an area of the stacking groove 11, and the support rods 12 are movably arranged along an axial direction of the positioning pins 121. Specifically, as shown in fig. 3, a plurality of counter bores are formed in the bottom surface of the support rod 12 and used for penetrating screws, the front ends of the screws are connected to the bottom of the bonding pad, the heads of the screws are hidden in the counter bores, the support rod 12 has a moving space along the length direction of the screws, a spring is arranged between the heads of the screws and the bottom surface of the counter bores and can enable the top surface of the support rod 12 to be constantly attached to the bottom surface of the bonding pad, so that the positioning pin 121 protrudes out of the bottom surface of the stacking groove 11, when the support rod 12 moves in the direction away from the bonding pad, the spring is compressed, and the positioning pin 121 is retracted and hidden in a bottom solid of the bonding pad. When the supporting rod 12 moves to the limit position below the bonding pad, the top surface of the positioning pin 121 is lower than or flush with the bottom surface of the stacking groove 11, two ends of the supporting rod 12 are provided with bumps 122 protruding out of the top surface of the bonding pad, the top surfaces of all the bumps 122 are on the same plane, the plane is parallel to the top surfaces of the bonding pad, the outer walls of the bumps 122 are flush with the outer walls of two sides of the bonding pad so as to facilitate smooth conveying, the bottom surface of the supporting rod 12 protrudes downwards out of the bottom surface of the bonding pad and is used for positioning during conveying of the bonding pad, a space can be formed between the bonding pad and the supporting platform below so as to facilitate the insertion of fingers or tools into the space to transfer the bonding pad, and the protruding size is smaller than that the bumps 122 protrude out of the top surface of the bonding pad, so that when the bonding pads are stacked up and down, a space is formed between the supporting rod 12 of the bonding pad above and the top surface of the bonding pad below.
When the lead frame is used, the bonding pad is downwards arranged on a platform, the top surface of the bump 122 is supported on the top surface of the platform, and the bump 122 protrudes out of the top surface of the bonding pad, so that an interval is formed between the top surface of the bonding pad and the top surface of the platform, the interval is the size of the bump 122 protruding out of the top surface of the bonding pad, the bonding pad is downwards pressed or the self weight of the bonding pad is utilized, the bonding pad drives the fixedly welded lead frame to downwards move together, all the positioning pins 121 on all the supporting rods 12 are simultaneously and smoothly pulled out from the positioning holes of the lead frame, the lead frame can be easily taken out of the bonding pad, the lead frame can be integrally and flatly taken out, the lead frame is not only fast, but also can be prevented from being pulled and deformed, the problem that the lead frame is deformed when the bonding pad is manually taken out is solved, and based on the structure of the bonding pad, the lead frame is taken out in a separating mode, the contact time between a hand and the bonding pad is extremely short, even the bonding pad can be pressed by a stick and a hand and a tool such as a rod can replace the hand, so that the bonding pad is not cooled, the lead frame can be quickly taken out, the bonding pad can be quickly taken out without waiting time is greatly improved, and the problem that the efficiency of manual separation efficiency is low. As shown in fig. 4, the bumps 122 protruding from the top surface of the pads can also space the pads stacked up and down, so as to prevent the bottom surface of the pad on the upper layer from pressing on the lead frame disposed in the pad on the lower layer, so as to maintain the shape of the lead frame, and thus, the pad stacking up and down mode is also used for transferring and temporarily storing the pads, which includes both transferring and temporarily storing empty pads and pads stacked with lead frames.
Preferably, as shown in fig. 2 and 3, the bottom surfaces of the two ends of the support rod 12 have right-angle notches, the right-angle notches and the pads are used for penetrating through two side walls of the groove of the bump 122 to form positioning grooves 111, and when the pads are stacked, the bump 122 of the pad below is clamped in the positioning groove 111 at the bottom of the pad above, so as to improve the stability of the stacked pads and prevent the pads from sliding.
Example 2
As shown in fig. 5, a lead frame fixing and welding apparatus includes a lead frame pad and a heating furnace 2 described in the embodiment.
Specifically, as shown in fig. 6 and 7, the feeding component 3 and the output belt 4 are arranged inside the heating furnace 2 along the same conveying direction, the output belt 4 is a stainless steel belt structure, a pad output channel 5 is arranged above the output belt 4, the pad output channel 5 includes two rails 51 which are parallel to each other and arranged at intervals, the front section of the pad output channel 5 is located inside the heating furnace 2, and the rear section of the pad output channel is located outside the heating furnace 2.
Specifically, as shown in fig. 6 and 7, a rotatable rotating frame 6 is disposed between the end of the feeding component 3 and the front ends of the output tape 4 and the pad output channel 5, the rotating frame 6 is driven by a motor, the motor can be disposed on the outer wall of the heating furnace 2, the rotating frame 6 is provided with four slots 61 along the circumferential array of the rotation axis, and the four slots 61 are perpendicular to each other and have the same distance with the rotation axis of the rotating frame 6.
When the welding operation is carried out, the welding disc overlapped with the lead frame enters the heating furnace 2 through the feeding part 3, and the top of the lead frame is heated and pre-welded; when the bonding pad moves to the preset position of the feeding part 3, the bonding pad is just clamped into the clamping groove 61; the swivel mount 6 is rotatory 180, so that the pad is the top surface down state and is located the anterior segment of pad output way 5, and the pad supports respectively on the track 51 of both sides through the lug 122 of both sides, the pad upwards rotates when swivel mount 6 is anticlockwise rotation in this embodiment, thereby avoid the pad to drop from draw-in groove 61, the lead frame that welds in advance on the pad passes the interval between two tracks 51 downwards and falls to output belt 4 on, the lead frame another face that welds in advance at this moment is upwards welded firmly, the lead frame is exported to the heating furnace 2 outside through output belt 4 at last, empty pad passes through pad output way 5 and exports to the heating furnace 2 outside, can make the pad export heating furnace 2 in advance in order to make things convenient for cool off the pad in advance, be convenient for fast flow and reuse. The overlapped lead frame enables the upper side and the lower side of the lead frame to be heated more uniformly through the movement on the feeding part 3 and the output belt 4 and the position conversion of the upper surface and the lower surface, solves the problem that the heating temperature of the uppermost layer and the lowermost layer of the multi-layer lead frame is not uniform, so that the consistent welding effect cannot be achieved, and enables the welding effect to be better. And the lead frame and the bonding pad are automatically separated in the process of changing the position of the lead frame, so that the subsequent manual separation process is reduced, the bonding pad does not need to be cooled, the problem of low efficiency caused by manual separation is fundamentally avoided, the bonding pad can separate the whole lead frame after fixation welding from the bonding pad at the same time, and the problem of lead frame deformation when the bonding pad is manually taken out is solved.
Preferably, as shown in fig. 8 to 16, the two rails 51 have the same structure and are of a symmetrical structure, each rail 51 includes a side plate 52, a conveyor belt 53 is disposed on a side wall of the side plate 52, a pressing bar 54 parallel to the side plate 52 is disposed above the conveyor belt 53, the pressing bar 54 is provided with at least two connecting rods 541 vertically penetrating through the side plate 52, the side plate 52 is vertically penetrated by side push rods 55 below the connecting rods 541, side push rods 551 are disposed at front sections of the side push rods 55, top surfaces of the side push rods 551 are inclined toward a middle portion of the pad output channel 5, the side push rods 551 are disposed inside the side plates 52, pressure springs 552 are disposed between the side push rods 551 and inner walls of the side push rods 52, ends of the side push rods 55 and the connecting rods 541 are respectively connected to two ends of a swing rod 56, and ends of the side push rods 55 and the connecting rods 541 are capable of relatively moving along a length direction of the swing rod 56, a middle of the swing rod 56 is hinged to a convex rod 521 on an outer wall of the side plate 52, and the hinged rod 521 is disposed between the side push rod 55 and the connecting rod 541.
As shown in fig. 8 to 11, when the compression spring 552 is in a natural state, the compression beads 54 contact the inner walls of the side plates 52, the distance between the compression beads 54 of the two rails 51 is larger than the width of the bonding pad, and the side pressing block 551 is positioned above the conveyor belt 53 at this time, the front end of the compression beads 54 has a guide inclined surface 542 protruding downwards, the lowest point of the guide inclined surface 542 is lower than the bottom surface of the compression beads 54, and the height difference between the guide inclined surface 542 and the bottom surface of the stacking groove 11 is larger than or equal to the height of the positioning pin 121 protruding from the bottom surface of the stacking groove 11.
The working principle is as follows: the rotary frame 6 moves the bonding pad taken out from the feeding part 3 from top to bottom to the bonding pad output channel 5, as shown in fig. 8, at this time, the top surface of the bonding pad and the lead frame face downward, as shown in fig. 9 to 11, the bonding pad firstly passes through the pressing strips 54 at both sides, then, the edges at both sides of the top surface of the bonding pad are contacted with the inclined surfaces at the tops of the side pressing blocks 551, and the side pressing blocks 551 and the side ejector rods 55 are pushed by the inclined surfaces to move to the outer side of the rail 51, the side ejector rods 55 push the swing rods 56 to swing, the swing rods 56 push the connecting rods 541 to move to the inner side of the rail 51, the connecting rods 541 drive the pressing strips 54 to move to the inner side of the rail 51 at the same time, and the rear ends of the side ejector rods 55 and the connecting rods 541 move along the length direction of the swing rods 56 during the swing rods 56 to adapt to the change of the relative positions with the swing rods 56. As shown in fig. 12 and 13, when the bumps 122 on both sides of the pad are supported on the conveyor belt 53, the front ends of the side press blocks 551 contact the side walls of the pad, and the middle section of the press strip 54 is just above both sides of the pad, and the pad is smoothly transferred onto the pad output channel 5 by the rotary frame 6. The pad is moved to the front end of the bead 54 by the transmission belt 53, as shown in fig. 14 to 16, under the guiding action of the guiding inclined plane 542, the pad moves downward, and at this time, the bump 122 is supported on the transmission belt 53 to keep the horizontal height unchanged, in the process, the pad drives the lead frame after pre-fixing welding to move downward, so that the lead frame after pre-fixing welding is separated from the positioning pin 121, and the lead frame after pre-fixing welding falls onto the output belt 4, in the process, the support rod 12 moves to the top surface of the pad relative to the pad, in order to prevent the support rod 12 from abutting against the bead 54, an avoiding groove can be formed at the position of the bead 54 corresponding to the support rod 12, and also right-angled notches can be formed at the bottom surfaces of the two ends of the support rod 12, so as to form an avoiding structure. In the process that the pad moves towards the front end of the pressing strip 54, because the side pressing block 551 always keeps in contact with the side face of the pad, the side ejector rods 55 and the connecting rods 541 are all kept fixed in position, the pressing strip 54 is guaranteed to be always stably located above the pad, the pad is limited and prevented from falling upwards, the pad with the structure enables a pre-welded lead frame to be automatically separated from the pad in the moving process, the problem that manual separation efficiency is low is solved, production efficiency can be effectively improved, and the influence of the temperature of the pad does not need to be considered.
Preferably, as shown in fig. 11 and 13, the bottom surface of the transmission belt 53 is provided with a support plate 531 for providing sufficient support force to the transmission belt 53 to prevent the transmission belt 53 from being deformed by the bumps 122.
Preferably, as shown in fig. 6 and 7, the feeding member 3 includes a transfer plate 31 for carrying and transferring the pad with the stacked lead frame, and the transfer plate 31 is disposed to move along the conveying direction of the feeding member 3, specifically, the transfer plate 31 may be driven by a screw drive or a telescopic cylinder. The top surface of the transfer plate 31 is provided with at least one strip-shaped hole 311, and the strip-shaped hole 311 is used for connecting the support rod 12 to keep the relative position between the pad and the transfer plate 31 fixed, so as to determine the position of the card slot 61 when the pad is connected, and simultaneously prevent the pad from falling.
Preferably, as shown in fig. 5 to 7 and 17 to 20, a temporary storage mechanism 7 is disposed at an inlet end of the feeding member 3 for temporarily storing the pads on which the lead frames are stacked, the temporary storage mechanism 7 includes a vertically disposed rectangular frame 71, a plurality of blocking rods 72 are disposed through two opposite side walls of the rectangular frame 71 and located on the same horizontal plane, front ends of the blocking rods 72 face the inner side of the rectangular frame 71, front ends of the blocking rods 72 have inclined support slopes 721 facing upward, tension springs 73 are disposed between the ends of the blocking rods 72 and the outer wall of the rectangular frame 71, and when the tension springs 73 are in a natural state, the front ends of the blocking rods 72 are located in the rectangular frame 71 and are used for supporting the pads on the upper stack. When the bottommost pad needs to be discharged downwards, the pad of the stack only needs to be pressed or pushed downwards, the tension spring 73 is stretched by the pressing of the bottom edge of the pad, the blocking rod 72 moves towards the outer side of the rectangular frame 71 until the bottommost pad completely moves to the position below the blocking rod 72, the bump 122 protrudes out of the top surface of the pad, so that a space is formed between the pads of the stack, when the pad below moves downwards to the position below the blocking rod 72, an acute angle part formed by the supporting inclined surface 721 at the front end of the blocking rod 72 and the bottom surface is rapidly inserted into the space between the pads under the resilience force of the tension spring 73, the pad above is supported, and the pad of the stack above continuously rises for a certain distance under the action of the supporting inclined surface 721, so that the two pads at the bottommost are completely separated, and the discharged pad is convenient to transfer.
Preferably, as shown in fig. 18 and 19, the two ends of the support rod 12 are respectively corresponding to the stop lever 72, the rectangular groove 722 has been all seted up along vertical direction to the front end of the stop lever 72, be used for cooperating the support rod 12, the concrete usage is that the rectangular groove 722 is used for dodging the tip of the support rod 12, thereby make things convenient for the front end of the stop lever 72 to insert between two blocks of pads that overlap, utilize the rectangular groove 722 card to establish the support rod 12 simultaneously, position accuracy when improving the pad stack, thereby be convenient for the pad and transfer spare part to combine, transfer spare part is for transferring board 31 in this embodiment, through this structural setting, can make the support rod 12 insert smoothly in the bar hole 311.
Preferably, as shown in fig. 17, all the blocking rods 72 on the same side of the rectangular frame 71 are connected to the same rod member, so that the blocking rods 72 on the same side can move simultaneously, thereby preventing the pad from being stuck due to the unsmooth movement of a single or a part of the blocking rods 72.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention as defined by the claims below.
Claims (9)
1. The utility model provides a lead frame pad, a serial communication port, at least one department has been seted up to the top surface of pad stacks groove (11), the bottom surface of pad is equipped with two at least bracing pieces (12) along pad direction of delivery interval, the top surface of bracing piece (12) is equipped with locating pin (121) of connecting the lead frame locating hole, locating pin (121) upwards passes the pad perpendicularly, bracing piece (12) move along the axis direction of locating pin (121) and set up, when bracing piece (12) move to extreme position to the below of pad, the top surface of locating pin (121) is less than or the parallel and level in the bottom surface that stacks groove (11), the both ends of bracing piece (12) all have lug (122) of protrusion in the pad top surface, the outer wall of lug (122) and the both sides outer wall parallel and level of pad, the bottom surface of bracing piece (12) protrusion in the bottom surface of pad downwards, be used for the location when carrying the pad, and protruding size is less than the size that lug (122) protrude the pad top surface.
2. The lead frame pad of claim 1, wherein the bottom surface of the support bar (12) at both ends has a right-angle notch, the right-angle notch and the two side walls of the groove for the bump (122) to pass through form a positioning groove (111), and when the pads are stacked, the bump (122) of the lower pad is clamped in the positioning groove (111) at the bottom of the upper pad.
3. A lead frame solder bonding apparatus comprising the lead frame pad and the heating furnace (2) according to claim 1 or 2;
a feeding part (3) and an output belt (4) are arranged in the heating furnace (2) along the same direction, a pad output channel (5) is arranged above the output belt (4), the pad output channel (5) comprises two rails (51) which are parallel to each other and arranged at intervals, the front section of the pad output channel (5) is positioned in the heating furnace (2), and the rear section of the pad output channel is positioned outside the heating furnace (2);
a rotatable rotating frame (6) is arranged between the tail end of the feeding component (3) and the front ends of the output belt (4) and the pad output channel (5), the rotating frame (6) is provided with four clamping grooves (61) along the circumferential array of the rotation axis, and the four clamping grooves (61) are mutually vertical and have the same interval with the rotation axis of the rotating frame (6);
when the solid welding work is carried out, the welding disc overlapped with the lead frame enters a heating furnace (2) through a feeding part (3) to heat and pre-weld the top of the lead frame; when the bonding pad moves to a preset position of the feeding part (3), the bonding pad is clamped into the clamping groove (61); the rotating frame (6) rotates 180 degrees to ensure that the bonding pad is positioned on the front section of the bonding pad output channel (5) in a state that the top surface is downward, and the bonding pad is respectively supported on the rails (51) at two sides through the bumps (122) at two sides,between the top surface of the pad and the top surface of the rail (51) PartitionThe lead frame pre-welded on the bonding pad downwards passes through the interval between the two rails (51) and falls onto the output belt (4), the other side of the lead frame pre-welded at the moment faces upwards for welding, finally the lead frame is output to the outer side of the heating furnace (2) through the output belt (4), and the empty bonding pad is output to the outer side of the heating furnace (2) through the bonding pad output channel (5).
4. The lead frame fixedly welding device according to claim 3, characterized in that two rails (51) are identical in structure and are symmetrical, each rail (51) comprises a side plate (52), a conveying belt (53) is arranged on the side wall of each side plate (52), a pressing strip (54) parallel to the side plate (52) is arranged above each conveying belt (53), each pressing strip (54) is provided with at least two connecting rods (541) vertically penetrating through the side plate (52), each side plate (52) is vertically provided with a side ejection rod (55) through the lower portion of the corresponding connecting rod (541), a side pressing block (551) is arranged at the front section of each side ejection rod (55), the top surfaces of the side pressing blocks (551) are inclined surfaces facing the middle portion of the pad output channel (5), a pressure spring (552) is arranged between each side pressing block (551) and the inner wall of the side plate (52), the tail ends of the side ejection rods (55) and the connecting rods (541) are respectively connected to two ends of a swing rod (56), the tail ends of the side ejection rods (55) and the connecting rods (541) can relatively move along the length direction of the swing rods (56), and the tail ends of the middle side ejection rods (521) are hinged to the outer walls of the swing rods (541) and located between the swing rods (52);
when the pressure spring (552) is in a natural state, the pressing strips (54) are in contact with the inner walls of the side plates (52), the distance between the pressing strips (54) of the two rails (51) is larger than the width of the bonding pad, the side pressing block (551) is positioned above the conveying belt (53), the front end of each pressing strip (54) is provided with a guide inclined plane (542) protruding downwards, the lowest point of each guide inclined plane (542) is lower than the bottom surface of each pressing strip (54), and the height difference between the guide inclined planes and the bottom surface of the stacking groove (11) is larger than or equal to the height of the positioning pin (121) protruding out of the bottom surface of the stacking groove (11).
5. A lead frame solder joint arrangement as claimed in claim 4, characterized in that the bottom surface of the conveyor belt (53) is provided with a support plate (531).
6. The lead frame fixedly welding device according to claim 3, characterized in that the feeding member (3) comprises a transfer plate (31) for carrying and transferring the pad with the overlapped lead frame, the transfer plate (31) is movably arranged along the conveying direction of the feeding member (3), the top surface of the transfer plate (31) is provided with at least one strip-shaped hole (311), and the strip-shaped hole (311) is used for connecting the support rod (12).
7. The lead frame fixedly welding device according to claim 3 or 6, characterized in that a temporary storage mechanism (7) is arranged at the inlet end of the feeding part (3) and used for temporarily storing pads on which lead frames are stacked, the temporary storage mechanism (7) comprises a vertically arranged rectangular frame (71), a plurality of stop rods (72) which are positioned on the same horizontal plane penetrate through two opposite side walls of the rectangular frame (71), the front ends of the stop rods (72) face the inner side of the rectangular frame (71), supporting inclined surfaces (721) which incline upwards are arranged at the front ends of the stop rods (72), tension springs (73) are arranged between the tail ends of the stop rods (72) and the outer walls of the rectangular frame (71), and when the tension springs (73) are in a natural state, the front ends of the stop rods (72) are positioned in the rectangular frame (71) and used for supporting the pads of the upper stack.
8. The lead frame fixedly welding device according to claim 7, wherein the stop bars (72) are arranged corresponding to two ends of the support bar (12), and the front ends of the stop bars (72) are provided with rectangular grooves (722) along the vertical direction for matching with the support bar (12).
9. Lead frame solder attachment according to claim 7, characterized in that all bars (72) on the same side of the rectangular frame (71) are connected to the same bar.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211306887.8A CN115377045B (en) | 2022-10-25 | 2022-10-25 | Lead frame pad and solid welding device |
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| CN202211306887.8A CN115377045B (en) | 2022-10-25 | 2022-10-25 | Lead frame pad and solid welding device |
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| CN113725133A (en) * | 2021-11-01 | 2021-11-30 | 四川富美达微电子有限公司 | Lead frame feeding and conveying device |
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| WO2006109287A1 (en) * | 2005-04-15 | 2006-10-19 | Pressco Limited | A carrier device |
| CN207441670U (en) * | 2017-11-21 | 2018-06-01 | 铜陵三佳山田科技股份有限公司 | Ultra-wide multi-row lead frame frame abnormity holding frame feeding device |
| JP7464472B2 (en) * | 2020-07-17 | 2024-04-09 | 株式会社ディスコ | Processing Equipment |
| CN112687593B (en) * | 2021-03-12 | 2021-06-04 | 四川晶辉半导体有限公司 | Multilayer rectifier bridge frame assembling device and assembling method |
| CN112802786B (en) * | 2021-04-12 | 2021-06-25 | 四川旭茂微科技有限公司 | Stacking device of semiconductor lead frame |
| CN112802787B (en) * | 2021-04-13 | 2021-06-22 | 四川旭茂微科技有限公司 | Feeding device for lead frame assembly |
| CN113421842B (en) * | 2021-08-23 | 2021-11-16 | 四川旭茂微科技有限公司 | Lead frame wire jumper composite set |
| CN113644015B (en) * | 2021-10-15 | 2021-12-24 | 四川晶辉半导体有限公司 | Semiconductor frame glues core device |
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