CN115376872A - Anti-conduction grid fixing structure for ion source and installation method - Google Patents
Anti-conduction grid fixing structure for ion source and installation method Download PDFInfo
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- CN115376872A CN115376872A CN202110541464.3A CN202110541464A CN115376872A CN 115376872 A CN115376872 A CN 115376872A CN 202110541464 A CN202110541464 A CN 202110541464A CN 115376872 A CN115376872 A CN 115376872A
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- circular groove
- grid
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- groove
- fixed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
Abstract
The invention belongs to the technical field of related accessories of ion beam etching, and particularly relates to an anti-conductive grid fixing structure and an installation method for an ion source, wherein the anti-conductive grid fixing structure comprises a circular grid support, and the plane of the grid support is provided with a first fixed circular groove, a first installation circular groove, a second fixed circular groove, a second installation circular groove, a third fixed circular groove and a third installation circular groove which are concentric; the diameters of the six circular grooves are sequentially reduced, and the depths of the six circular grooves from the grid support plane are sequentially increased; the first installation circular groove, the second installation circular groove and the third installation circular groove are respectively provided with a deceleration grid, an acceleration grid and a screen grid, the first installation circular groove, the second installation circular groove and the third installation circular groove are provided with threaded holes, and the deceleration grid, the acceleration grid and the screen grid are respectively fixed in the threaded holes through screws. The Grid is respectively fixed on the Grid supports, so that the positioning accuracy of three grids can be effectively ensured, a plurality of positioning holes on the periphery of the Grid are avoided, the strength of the Grid can be increased, and the maintenance period is greatly shortened.
Description
Technical Field
The invention belongs to the technical field of ion beam etching related accessories, and particularly relates to an anti-conduction grid fixing structure for an ion source and an installation method.
Background
The ion source is a key component of ion beam etching, and the quality of the ion source directly influences the etching performance. The radio frequency inductive coupling ion source has the advantages of high density, no pollution, easy maintenance, long service life and the like, and is widely applied to the fields of ion beam etching, material surface modification, thin film processing and the like. The ion beam etching is to decompose argon into argon ions by utilizing a glow discharge principle, and the argon ions carry out physical bombardment on the surface of a sample through the acceleration of an anode electric field so as to achieve the etching effect. The etching process is to fill Ar and other inert gases into an ion source discharge chamber, form plasma through ionization, transmit the plasma to a target substrate in the form of ion beams through a grid, and irradiate the ion beams to the surface of a solid to bombard atoms on the surface of the solid, so that the atoms of the material are sputtered, thereby achieving the purpose of etching. Ion beam etching can be widely used for etching various metals and alloys thereof, and non-metals, oxides, nitrides, carbides, semiconductors, polymers, ceramics, infrared, superconducting and other materials.
When etching is needed, under the action of the spiral coil, gas in the discharge cavity is ionized, electrons in the discharge cavity are accelerated by an electric field, and dense plasma is generated. And after being led out by the Grid component, the plasma in the discharge cavity bombards the target material in the form of ion beams to etch the wafer. The Grid component can select two grids or three grids, the two grids comprise a screen Grid and an accelerating Grid, the screen Grid can focus the plasma to form ion beams, the accelerating Grid accelerates the ion beams, the three grids are formed by adding a decelerating Grid on the basis of the two grids, the decelerating Grid is grounded or positively charged, and the dispersion of the ion beams can be effectively reduced. The Grid component plays a crucial role in the uniformity of ion beam etching, and the good Grid design can prolong the service cycle of the Grid and reduce the maintenance cycle of the Grid.
In the existing design, the acceleration grid, the screen grid and the deceleration grid are connected in a way of insulating beads, insulating rings (such as ceramic beads and ceramic rings) and the like, so that the grids can be effectively insulated, and risks such as mutual conduction and short circuit between the grids are avoided. However, when the Grid assembly is used for a long time, the Grid material is sputtered onto the insulating material, a layer of conducting medium is plated on the insulating material, the grids are mutually conducted, and normal operation of the grids is affected. The invention provides a Grid fixing mode for an ion source, which can effectively avoid mutual conduction between grids and greatly reduce the Grid maintenance period.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an anti-conduction grid fixing structure for an ion source.
In order to achieve the purpose, the invention adopts the following technical scheme:
an anti-conductive grid fixing structure for an ion source comprises a circular grid support, wherein a first fixed circular groove, a first installation circular groove, a second fixed circular groove, a second installation circular groove, a third fixed circular groove and a third installation circular groove which are concentric are formed in the plane of the grid support;
the diameters of the first fixing circular groove, the first installation circular groove, the second fixing circular groove, the second installation circular groove, the third fixing circular groove and the third installation circular groove are sequentially reduced, and the depths of the first fixing circular groove, the first installation circular groove, the second fixing circular groove, the second installation circular groove, the third fixing circular groove and the third installation circular groove from the grid support plane are sequentially increased;
the first installation circular groove is provided with a deceleration grid, the second installation circular groove is provided with an acceleration grid, and the third installation circular groove is provided with a screen grid.
As a further preferable scheme, the first mounting circular groove, the second mounting circular groove and the third mounting circular groove are provided with threaded holes, and the deceleration grid, the acceleration grid and the screen grid are respectively fixed in the threaded holes through screws.
As a further preferable scheme, a circle of matter deposition grooves are respectively arranged in the second fixed circular groove and the third fixed circular groove.
As a further preferable mode, the substance deposition groove has a lower portion wider than an upper portion; the substance deposition groove of the second fixed circular groove is arranged along the outer edge of the second fixed circular groove, and a gap is reserved between the substance deposition groove and the deceleration grid; the matter deposition groove of the third fixed circular groove is arranged along the outer edge of the third fixed circular groove, and a gap is formed between the matter deposition groove and the accelerating grid.
As a further preferable scheme, the longitudinal section of the matter deposition groove is in a dovetail groove structure, and the aspect ratio of the dovetail groove structure is more than 0.5.
As a further preferred scheme, the longitudinal section of the substance deposition groove is a rectangular groove structure, and the aspect ratio of the rectangular groove structure is more than 1.
As a further preferable scheme, the width of the matter deposition groove is 0.3 mm-5 mm.
As a further preferable scheme, the upper surface of the deceleration grid and the first fixed circular groove are in the same plane, the upper surface of the speed grid and the second fixed circular groove are in the same plane, and the upper surface of the screen grid and the third fixed circular groove are in the same plane.
As a further preferable scheme, the distance between the three grid electrodes can be 0.9mm to 2mm.
A method of mounting an anti-conduction grid attachment structure for an ion source, comprising the steps of:
the method comprises the following steps: a first fixed circular groove, a first installation circular groove, a second fixed circular groove, a second installation circular groove, a third fixed circular groove and a third installation circular groove are sequentially formed downwards on the plane of the grid support, and the diameters of the first fixed circular groove, the first installation circular groove, the second fixed circular groove, the second installation circular groove, the third fixed circular groove and the third installation circular groove are sequentially reduced;
step two: respectively chiseling a circle of material deposition grooves on the inner planes of the second fixed circular groove and the third fixed circular groove;
step three: respectively drilling a plurality of threaded holes in a first ring of a plane in the first mounting circular groove, the second mounting circular groove and the third mounting circular groove;
step four: three circles of through holes are formed in the speed reducing grid, wherein the outer circle of through holes correspond to threaded holes of the first mounting circular groove, the middle circle of through holes correspond to threaded holes of the second mounting circular groove, and the inner circle of through holes correspond to threaded holes of the third mounting circular groove; two circles of through holes are formed in the accelerating grid, wherein the outer circle of through holes correspond to threaded holes of the second mounting circular groove, and the inner circle of through holes correspond to threaded holes of the third mounting circular groove; a circle of through holes are formed in the screen grid and correspond to the threaded holes of the third mounting circular groove;
step five: a deceleration grid is arranged in the first installation circular groove, an acceleration grid is arranged in the second installation circular groove, and a screen grid is arranged in the third installation circular groove and fixed through screws.
Compared with the prior art, the Grid is respectively fixed on the Grid supports, so that the accurate positioning of the three grids can be effectively ensured, a plurality of positioning holes on the periphery of the grids are avoided, and the strength of the grids can be increased. The dovetail grooves are formed in the grid supports, different grids are effectively insulated, the grid conduction problem caused by long-term use is avoided, the maintenance period is greatly shortened, and the production cost is effectively reduced.
Drawings
FIG. 1 is an exploded schematic view of the present invention;
FIG. 2 is a grid mounting diagram of the present invention;
fig. 3 is a partial structural sectional view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
The first embodiment is as follows:
the invention discloses an anti-conduction grid fixing structure for an ion source, which comprises a circular grid support 5, wherein the plane of the grid support 5 is provided with a first fixing circular groove 6, a first mounting circular groove 7, a second fixing circular groove 8, a second mounting circular groove 9, a third fixing circular groove 10 and a third mounting circular groove 11 which are concentric, and the grid support 5 is made of a high-temperature-resistant insulating material, such as ceramic.
The diameters of the first fixed circular groove 6, the first installation circular groove 7, the second fixed circular groove 8, the second installation circular groove 9, the third fixed circular groove 10 and the third installation circular groove 11 are reduced in sequence.
The depths of the first fixed circular groove 6, the first installation circular groove 7, the second fixed circular groove 8, the second installation circular groove 9, the third fixed circular groove 10 and the third installation circular groove 11 from the plane of the grid support 5 are increased in sequence.
First fixed circular slot 6 is firstly opened, first installation circular slot 7 is opened on first fixed circular slot 6, second fixed circular slot 8 is opened on first installation circular slot 7, second installation circular slot 9 is opened on second fixed circular slot 8, third fixed circular slot 10 is opened on second installation circular slot 9, third installation circular slot 11 is opened on third fixed circular slot 10.
The first installation circular groove 7, the second installation circular groove 9 and the third installation circular groove 11 are respectively provided with a deceleration grid 2, the first installation circular groove 7, the second installation circular groove 9 and the third installation circular groove 11 are provided with threaded holes, the deceleration grid 2, the acceleration grid 3 and the screen grid 4 are respectively fixed in the threaded holes through screws 1, the threaded holes are provided along the first installation circular groove 7, the second installation circular groove 9 and the third installation circular groove 11 in a plurality of circles, and the deceleration grid 2, the acceleration grid 3 and the screen grid 4 are provided with holes corresponding to the threaded holes in a circle;
specifically, three circles of threaded holes are formed in the periphery of the uppermost deceleration grid 2, the screw 1 of the most peripheral deceleration grid is used for penetrating through the most peripheral deceleration grid, the other two circles of the most peripheral deceleration grid are used for facilitating installation of the acceleration grid 3 and the screen grid 4, the screw 1 of the most peripheral deceleration grid is used for penetrating through the most peripheral deceleration grid, and the screw 1 of the most peripheral deceleration grid 4 is used for facilitating installation of the most peripheral deceleration grid.
Example two:
a circle of material deposition groove 12 is respectively arranged in the second fixed circular groove 8 and the third fixed circular groove 10, the longitudinal section of the material deposition groove 12 is of a dovetail groove structure or a trapezoid structure, the depth-to-width ratio of the dovetail groove structure is larger than 0.5, the width of the lower part of the material deposition groove 12 is larger than that of the upper part, the larger the slope of the two side edges of the dovetail groove is, the better the slope is, the material deposition on the grid can be effectively avoided, and the conduction between grids can be caused;
the longitudinal section of the substance deposition groove 12 can also be a rectangular groove structure, the depth-to-width ratio of the rectangular groove structure is larger than 1, and the accommodating space is increased.
The substance deposition groove 12 of the second fixed circular groove 8 is arranged along the outer edge of the second fixed circular groove 8 with a gap from the deceleration grid 2.
The material deposition groove 12 of the third fixed circular groove 10 is arranged along the outer edge of the third fixed circular groove 10, a gap is formed between the material deposition groove 12 and the accelerating grid 3, the width of the material deposition groove 12 is 0.3 mm-5 mm, and the storage space is guaranteed.
The upper surface of the deceleration grid 2 and the first fixed circular groove 6 are in the same plane, the upper surface of the deceleration grid 3 and the second fixed circular groove 8 are in the same plane, the upper surface of the screen grid 4 and the third fixed circular groove 10 are in the same plane, and the distance between the three layers of grid electrodes is 0.9mm to 2mm.
In addition, the installation of the holes between the grids can be triangular, and the screws 1 on each grid are installed in a staggered mode, so that the problem of strength of the grids can be solved.
The invention discloses a mounting method of an anti-conduction grid fixing structure for an ion source, which comprises the following steps:
the method comprises the following steps: a first fixed circular groove 6, a first installation circular groove 7, a second fixed circular groove 8, a second installation circular groove 9, a third fixed circular groove 10 and a third installation circular groove 11 are sequentially formed downwards on the plane of the grid support 5, and the diameters of the first fixed circular groove 6, the first installation circular groove 7, the second fixed circular groove 8, the second installation circular groove 9, the third fixed circular groove 10 and the third installation circular groove 11 are sequentially reduced;
step two: cutting a circle of material deposition grooves 12 on the inner planes of the second fixed circular groove 8 and the third fixed circular groove 10;
step three: drilling a plurality of threaded holes in a plane circle in the first installation circular groove 7, the second installation circular groove 9 and the third installation circular groove 11 respectively;
step four: three circles of through holes are formed in the speed reducing grid 2, wherein the outer circle of through holes correspond to threaded holes of the first mounting circular groove 7, the middle circle of through holes correspond to threaded holes of the second mounting circular groove 9, and the inner circle of through holes correspond to threaded holes of the third mounting circular groove 11; two circles of through holes are formed in the accelerating grid 3, wherein the outer circle of through holes correspond to threaded holes of the second mounting circular grooves 9, and the inner circle of through holes correspond to threaded holes of the third mounting circular grooves 11; a circle of through holes are formed in the screen 4 and correspond to the threaded holes of the third mounting circular groove 11;
step five: a deceleration grid 2 is arranged in the first installation circular groove 7, an acceleration grid 3 is arranged in the second installation circular groove 9, and a screen grid 4 is arranged in the third installation circular groove 11 and is fixed through a screw 1.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. An anti-conduction grid fixing structure for an ion source, characterized in that: the grid-electrode mounting structure comprises a circular grid electrode support (5), wherein a first fixed circular groove (6), a first mounting circular groove (7), a second fixed circular groove (8), a second mounting circular groove (9), a third fixed circular groove (10) and a third mounting circular groove (11) which are concentric are formed in the plane of the grid electrode support (5);
the diameters of the first fixing circular groove (6), the first installation circular groove (7), the second fixing circular groove (8), the second installation circular groove (9), the third fixing circular groove (10) and the third installation circular groove (11) are sequentially reduced, and the depths of the first fixing circular groove (6), the first installation circular groove (7), the second fixing circular groove (8), the second installation circular groove (9), the third fixing circular groove (10) and the third installation circular groove (11) from the plane of the grid support (5) are sequentially increased;
the speed reduction grid (2) is installed on the first installation circular groove (7), the acceleration grid (3) is installed on the second installation circular groove (9), and the screen grid (4) is installed on the third installation circular groove (11).
2. The structure of claim 1, wherein: threaded holes are formed in the first installation circular groove (7), the second installation circular groove (9) and the third installation circular groove (11), and the deceleration grid (2), the acceleration grid (3) and the screen grid (4) are fixed in the threaded holes through screws (1) respectively.
3. The structure of claim 1, wherein: and a circle of substance deposition groove (12) is respectively arranged in the second fixed circular groove (8) and the third fixed circular groove (10).
4. The structure of claim 3, wherein: the width of the lower part of the matter deposition groove (12) is larger than that of the upper part; the substance deposition groove (12) of the second fixed circular groove (8) is arranged along the outer edge of the second fixed circular groove (8) and has a gap with the deceleration grid (2); the material deposition groove (12) of the third fixed circular groove (10) is arranged along the outer edge of the third fixed circular groove (10) and has a gap with the accelerating grid (3).
5. The structure of claim 4, wherein: the longitudinal section of the substance deposition groove (12) is of a dovetail groove structure, and the depth-to-width ratio of the dovetail groove structure is greater than 0.5.
6. The structure of claim 3, wherein: the longitudinal section of the substance deposition groove (12) is a rectangular groove structure, and the depth-to-width ratio of the rectangular groove structure is greater than 1.
7. The structure of claim 3, wherein: the width of the substance deposition groove (12) is 0.3 mm-5 mm.
8. The structure of claim 1, wherein: the upper surface of the speed reduction grid (2) and the first fixed circular groove (6) are located on the same plane, the upper surface of the speed reduction grid (3) and the second fixed circular groove (8) are located on the same plane, and the upper surface of the screen grid (4) and the third fixed circular groove (10) are located on the same plane.
9. The structure of claim 1, wherein: the distance between the three layers of grid electrodes is 0.9mm to 2mm.
10. A method of mounting an electrically conductive barrier fixing structure for an ion source as claimed in any one of claims 1 to 9, comprising the steps of:
the method comprises the following steps: a first fixed circular groove (6), a first installation circular groove (7), a second fixed circular groove (8), a second installation circular groove (9), a third fixed circular groove (10) and a third installation circular groove (11) are sequentially formed downwards on the plane of the grid support (5), and the diameters of the first fixed circular groove (6), the first installation circular groove (7), the second fixed circular groove (8), the second installation circular groove (9), the third fixed circular groove (10) and the third installation circular groove (11) are sequentially reduced;
step two: respectively chiseling a circle of material deposition grooves (12) on the inner planes of the second fixed circular groove (8) and the third fixed circular groove (10);
step three: respectively drilling a plurality of threaded holes on a plane circle in a first mounting circular groove (7), a second mounting circular groove (9) and a third mounting circular groove (11);
step four: three circles of through holes are formed in the speed reducing grid (2), wherein the outer circle of through holes correspond to threaded holes of the first mounting circular groove (7), the middle circle of through holes correspond to threaded holes of the second mounting circular groove (9), and the inner circle of through holes correspond to threaded holes of the third mounting circular groove (11); two circles of through holes are formed in the accelerating grid (3), wherein the outer circle of through holes correspond to threaded holes of the second mounting circular groove (9), and the inner circle of through holes correspond to threaded holes of the third mounting circular groove (11); a circle of through holes are formed in the screen grid (4) and correspond to threaded holes of the third mounting circular groove (11);
step five: a deceleration grid (2) is arranged in a first installation circular groove (7), an acceleration grid (3) is arranged in a second installation circular groove (9), and a screen grid (4) is arranged in a third installation circular groove (11) and is fixed through a screw (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110541464.3A CN115376872A (en) | 2021-05-18 | 2021-05-18 | Anti-conduction grid fixing structure for ion source and installation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110541464.3A CN115376872A (en) | 2021-05-18 | 2021-05-18 | Anti-conduction grid fixing structure for ion source and installation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115376872A true CN115376872A (en) | 2022-11-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110541464.3A Pending CN115376872A (en) | 2021-05-18 | 2021-05-18 | Anti-conduction grid fixing structure for ion source and installation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115376872A (en) |
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2021
- 2021-05-18 CN CN202110541464.3A patent/CN115376872A/en active Pending
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