CN115373477A

CN115373477A - Mounting method of heat dissipation system and related computing device

Info

Publication number: CN115373477A
Application number: CN202110541858.9A
Authority: CN
Inventors: 马志华; 郝佳男
Original assignee: Beijing Tusimple Technology Co Ltd
Current assignee: Beijing Tusimple Technology Co Ltd
Priority date: 2021-05-18
Filing date: 2021-05-18
Publication date: 2022-11-22

Abstract

The present disclosure relates to a method of installing a heat dissipation system and related computing device. The mounting method of the heat dissipation system comprises the following steps: mounting a circuit board on which a heating element is located on a support plate; mounting a support plate on a first fixed bracket in the case; installing a heat dissipation system on the heating element, wherein the heat dissipation system comprises a heat dissipation piece and a heat dissipation pipe; and fixing the radiating pipe under the supporting beam in the case through at least one reinforcing assembly.

Description

Mounting method of heat dissipation system and related computing device

Technical Field

The present disclosure relates to the field of automatic driving technologies, and in particular, to a method for installing a heat dissipation system and a related computing device.

Background

With the development of automatic driving technology, automatic driving vehicles have been applied in the fields of logistics freight, passenger carrying and the like. When the autonomous vehicle is running, external road information is generally sensed by a sensor of the autonomous vehicle, such as a radar, a camera, and the like. And then, an automatic driving calculation device (such as a server) and the like perform calculation to complete the decision and planning of the driving of the automatic driving vehicle, and finally, the automatic driving vehicle is controlled to drive according to the corresponding decision and planning.

Because the technology that automatic driving relates to is comparatively complicated, the on-vehicle end computer server that needs to set up is functional stronger, and not only the computing power is strong, and the treatment effeciency is high, and need can long-term steady operation (if need strong, radiating effect etc.), therefore, the component quantity that on-vehicle end computer server need install is bigger, for example need install many sets of core components, such as power, a plurality of mainboards (be provided with a plurality of CPU on the mainboard), a plurality of display cards (be provided with GPU on the display card), polylith USB (Universal Serial Bus) expansion card, radiator etc..

Because the vehicle space is limited, and some heating elements can generate heat in the operation process, the heating elements can be abnormal along with the rise of the temperature, and therefore the heat generated by the heating elements needs to be dissipated timely. The common heat dissipation assembly is easy to damage, break and be unstable due to triaxial random vibration generated when the vehicle-mounted server operates, and then server faults are caused. Therefore, a method for timely, quickly and stably radiating the vehicle-mounted computer server is needed to be provided.

Disclosure of Invention

The embodiment of the invention provides a method for installing a heat dissipation system, the heat dissipation system installed by the method can better ensure the stability of a heat dissipation piece, and the problem that the heat dissipation piece is failed due to random vibration generated when a computing device (such as a server) runs in a traveling crane is solved. The embodiment of the invention also provides a computing device which is high in reliability and low in failure rate.

In one aspect, the present invention provides a method for installing a heat dissipation system, including: mounting a circuit board on which a heating element is located on a support plate; mounting a support plate on a first fixed bracket in the case; a heat dissipation system is arranged on the heating element, and the heat dissipation system comprises a heat dissipation piece and a heat dissipation pipe; and fixing the radiating pipe under the supporting beam in the case through at least one reinforcing assembly.

The present invention provides in another aspect a computing device comprising: a chassis; the first fixing frame is arranged in the case; a support plate mounted on the first fixing frame; a circuit board mounted on the support plate, the circuit board having a heating element thereon; and a heat dissipation system mounted on the heating element, the heat dissipation system including a heat dissipation member and a heat dissipation tube, the heat dissipation tube being fixed under the support beam in the cabinet by at least one reinforcing member.

According to the installation method of the heat dissipation system, the heating element can be stably installed in the case, the heat dissipation system is stably installed on the heating element, the installation stability of the heat dissipation pipe is ensured, the problem that the heat dissipation pipe is damaged and broken due to random vibration generated when a computing device (such as a server) runs in a traveling process is solved, and the normal operation of the vehicle-mounted server is ensured.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a partially exploded view of a computing device 100 according to an embodiment of the present disclosure;

2-5 are schematic views of first through fourth assemblies, respectively, according to embodiments of the present disclosure;

FIG. 6 is a schematic view of an overall assembly after installation according to an embodiment of the present disclosure;

fig. 7 is a schematic structural view of a heat sink 310 according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a heat dissipation system 300 according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of a heat dissipation system 300 after installation according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a side panel 220 of a chassis according to an embodiment of the disclosure;

fig. 11 is a schematic structural diagram of a rear panel of a chassis after installation according to an embodiment of the disclosure;

FIG. 12 is a schematic block diagram of a computing device 100, according to another embodiment of the present disclosure;

FIG. 13 is a flow chart of a method of installing a heat dissipation system according to an embodiment of the present disclosure;

fig. 14 is a flowchart of an installation process of a heat dissipation system according to another embodiment of the present disclosure.

In the drawings:

200-a chassis; 210-chassis base, 220-chassis side; 221-first component, 222-second component, 223-third opening, 224-low slot, 225-high slot;

300-a heat dissipation system; 310-heat dissipation element, 320-heat dissipation tube, reinforcement member 330, shock pad 340; 311-upper cover, 312-base, 313-liquid inlet hole, 314-liquid outlet hole, 315-cavity, 316-heat dissipation structure; 321-liquid inlet pipe, 322-liquid outlet pipe;

400-a first mount, 410-a first cross member, 420-a first side member;

500-a first assembly; 510-support plate, 520-insulating pad, 530-first opening;

600-a second assembly; 610-circuit board, 620-heat conducting silicone layer;

700-thermally conductive plate, 710-second opening;

800-a second fixed frame, 810-a second cross beam, 820-a second side beam, 830-a base;

900-a cooling device; 910-liquid tank, 920-pump, 930-pipeline group, 940-heat dissipation row, 950-fan group, 960-liquid distributor and 970-quick connector.

Detailed Description

In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

In the present disclosure, the term "plurality" means two or more, unless otherwise specified. In this disclosure, the term "and/or" describes an associative relationship of associated objects, covering any and all possible combinations of the listed objects. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

In the present disclosure, unless otherwise specified, the terms "first", "second", and the like are used for distinguishing similar objects, and are not intended to limit positional relationships, timing relationships, or importance relationships thereof. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in other orientations than those illustrated or otherwise described herein.

Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, system, article, or apparatus.

FIG. 1 is an exploded view of a computing device 100 according to an embodiment of the invention. As shown in FIG. 1, the computing device 100 includes a chassis 200, the chassis 200 including a chassis base 210, chassis side panels 220, and a chassis cover (not shown) for housing and providing environmental protection to the various components and support structures of the computing device 100. The chassis base 210 may mount a circuit board (e.g., motherboard) of the computing device 100 thereon. The chassis-side panel 220 includes a left panel, a right panel, a front panel, and a rear panel.

Elements such as a central processing unit CPU, a memory, a graphics processing unit GPU (graphics processing unit), a sound card, a network card or a CAN card may be mounted or plugged on the motherboard. Because of the limited area on the motherboard, mounting or plugging these components directly onto the motherboard can greatly limit the number of components that can be mounted or plugged onto the motherboard. Thus, according to some embodiments of the present application, some of these components, such as a board card, such as a video card, a sound card, a network card, or a CAN card, may not be directly mounted or plugged onto the motherboard, but rather may be mounted on the support structure and connected to the motherboard via patch cords, which may allow for more components to be mounted to the computing device. The computing device 100 may also include one or more heat dissipation systems 300 for dissipating heat from some components that may generate heat. In some embodiments, each heat generating component is configured with a heat dissipation system 300, for example, a heat dissipation system 300 is configured on the upper surface of each heat generating component, so as to improve the heat dissipation efficiency of the heat generating component.

In some embodiments, some of the heat generating components may also be mounted on a support structure, such as a CPU mounted on a backplane, a GPU mounted on a first level of support structure, a CAN card mounted on a second level of support structure, and a power supply mounted on a third level of support structure, each level of support structure including at least one of a beam, a base, and a sidewall bracket (also referred to as a side beam), the beam length may be less than or equal to the chassis length, and the sidewall bracket may be less than the chassis width. The support structure may be secured to the chassis base 210 or the chassis side 220 and support the components mounted thereon above the motherboard, which may greatly increase the freedom of component placement for the computing device.

As shown in fig. 1, the computing apparatus 100 further includes a first fixing frame 400, a supporting plate 510, a circuit board 610, and a heat dissipation system 300. Wherein, the first fixing frame 400 is installed with a supporting plate 510, the supporting plate 510 is installed with a circuit board 610, the circuit board 610 is installed with a heating element, the heating element is installed with a heat dissipation system 300, and the heat dissipation pipe 320 of the heat dissipation system 300 is fixed under the supporting beam in the chassis 200 through a reinforcing assembly 330.

In some embodiments, the computing device 100 may further include an insulating pad 520, a thermal grease layer 620, a thermal conductive plate 700, a thermal conductive socket (not shown), and a second mount 800. Specifically, the supporting plate 510 is mounted on the first fixing frame 400, the insulating pad 520 is mounted on the supporting plate 510, the circuit board 610 is mounted on the insulating pad 520, the heat conducting silicone layer 620 is mounted on the circuit board 610, the heat conducting plate 700 is mounted on the heat conducting silicone layer 620, the heat conducting plate 700 has a second opening 710 at a position corresponding to the heating element, a heat conducting seat is mounted on the heating element corresponding to the second opening 710, the heat dissipating system 300 is mounted on the heat conducting seat, and the heat dissipating pipe 320 of the heat dissipating system 300 is fixed under the supporting beam of the second fixing frame 800 (e.g., under the second beam 820) through the reinforcing assembly 330. The first fixing frame 400, the supporting plate 510, the reinforcing element 330, and the second fixing frame 800 may be made of a metal material, such as a hard aluminum alloy, but not limited thereto.

It should be understood by those skilled in the art that the components may be assembled in sequence, such as the first fixing frame 400, the supporting plate 510, the insulating pad 520, the circuit board 610, the thermal grease layer 620, the thermal plate 700, the thermal base, the heat dissipation system 300, and the second fixing frame 800, or two or more adjacent components may be assembled together and then assembled with other single components or assembled components, and the order of assembling these structures is not limited by the present disclosure.

In some embodiments, support plate 510 and insulating pad 520 comprise first assembly 500 as shown in fig. 2. Referring to fig. 1 and 2, the support plate 510 has a plurality of posts (i.e., columnar protrusions) thereon, and the insulating pad 520 has corresponding through holes at corresponding post positions, through which the posts pass when the insulating pad 520 is mounted on the support plate 510. The insulating pad 520 has a first opening 530 at a portion corresponding to the heat generating element so that the heat generating element radiates heat downward. Specifically, the insulating pad 520 may be provided with a first opening 530 at a position corresponding to at least one heat generating component, for example, the first opening 530 may be provided at a position corresponding to each heat generating component, or the first opening 530 may be provided at a position of a heat generating component generating more heat, for example, the first opening 530 is provided at a position corresponding to a core heat generating component (such as a GPU, but not limited thereto).

The circuit board 610 and the thermal grease layer 620 constitute a second assembly 600 as shown in fig. 3. Second assembly 600 is mounted on first assembly 500 to form a third assembly, which may be the overall assembly, as shown in fig. 4. The circuit board CAN be a GPU mainboard, a CPU mainboard and a CAN card mainboard, and is preferably a GPU mainboard. The present disclosure may form the heat conductive silicone grease layer 620 by attaching a heat conductive silicone sheet to each of the heating elements of the circuit board 620, or may form the heat conductive silicone grease layer 620 by applying a heat conductive silicone grease paste to the heating elements.

In some embodiments, the overall assembly further includes a heat conducting plate 700 mounted on the heat conducting silicone layer 620, the heat conducting plate 700 having a second opening 710 at a location corresponding to the heat generating element (e.g., GPU). Specifically, the heat conducting plate 700 may be provided with a second opening 710 at each heating element, or may be provided with a second opening 710 at a position of the heating element generating more heat, for example, the second opening 710 is provided at a position corresponding to a core heating element (such as GPU, but not limited thereto). In some embodiments, after the second assembly is mounted on the first assembly 500, the heat conducting plate 700 is mounted on the heat conducting silicone layer 620 of the second assembly 600, resulting in a fourth assembly as shown in fig. 5, which is now the overall assembly.

In some embodiments, computing device 100 also includes a thermal pad (not shown) on the heat-generating component, such as a thermal pad mounted on a core heat-generating component (e.g., GPU, although not limited thereto). The heat conducting seat is located at the second opening 710, and contacts with the heating element corresponding to the second opening 710 through the heat conducting silicone grease. For example, a heat conductive silicone grease may be applied to the core heating element of the fourth assembly, and the heat conductive base may be mounted, where the mounted structure is the overall assembly.

In some embodiments, the overall assembly is mounted on a first fixture 400 within the chassis 200, the result of which is shown in fig. 6. The first fixing frame 400 includes at least one first beam 410 and/or at least one first side beam 420, and the first beam 410 and the second side beam 420 are perpendicular to each other in a horizontal direction. For example, the first mount 400 includes three first cross members 410 and two first side members 420. The first side rail 420 is fixedly mounted to the chassis side panel 220. The first cross member 410 may be fixed to the first side member 420, or may be mounted on a base (not shown) located on both sides of the cabinet 200, and the base may be fixed to the cabinet bottom 210 and/or the cabinet side 220. The first beam 410 may also be directly fixed to the chassis side panel 220, or the first beam 410 may serve as a beam substructure for other support structures that may be directly fixed to the chassis base panel 210 and/or the chassis side panel 220. The first fixing frame 400 may be L-shaped, square-shaped, japanese-shaped, H-shaped, T-shaped, etc., and the present disclosure does not limit the shape of the first fixing frame 400, and the positions and the number of the first cross beams 410 and the first side beams 420.

In some embodiments, to dissipate heat from the heat generating components within the circuit board, the present disclosure provides a heat dissipation system 300 for each heat generating component. Each of the heat generating elements may be disposed corresponding to at least one of the heat dissipating systems 300. In some embodiments, the number and kinds of the heat generating elements and the heat dissipating member 300 may be set according to actual needs. The heat dissipation system 300 may be disposed corresponding to the heat generating elements one by one, or a plurality of heat dissipation systems 300 may be disposed on one heat generating element according to actual requirements, which is not limited by the invention.

The heat dissipation system 300 is disposed in the cabinet 200, and includes a heat dissipation member 310 and a heat dissipation pipe 320, and further may further include a reinforcement assembly 330 and a shock-absorbing pad 340. Fig. 7 shows a schematic view of a heat dissipation member 310 of one embodiment of the present disclosure, and fig. 8 shows a schematic view of a heat dissipation system 300 with a reinforcement assembly 330 and a shock pad engaged.

Referring to fig. 1, 7 and 8, a first end of the radiating pipe 320 is connected to the radiating pipe 310, and a second end of the radiating pipe 320 is a mouthpiece end, i.e., an end that needs to be connected to a duct outside the cabinet 200. The heat sink 310 may be mounted on the heat generating component through the second opening 710 to pass the heat dissipation efficiency of the component. The heat sink 310 includes an upper cover 311 and a base 312, a cavity 315 is formed between the upper cover 311 and the base 312, the cavity 315 is provided with a plurality of heat dissipation structures 316, and the plurality of heat dissipation structures 313 form a plurality of flow channels for guiding the cooling liquid. It should be noted that, the plurality of heat dissipation structures 316 in fig. 7 are gathered together, but actually, the plurality of heat dissipation structures 316 may be an array structure, for example, each heat dissipation structure 316 may be a fin type, and a plurality of flow channels are formed for the cooling liquid to flow through. In some embodiments, the base 312 of the heat sink 310 may be in contact with the heat generating element through a thermally conductive silicone grease, for example, a thermally conductive silicone grease may be applied to the base 312 of the heat sink 310 to contact the heat generating element.

The radiating pipe 320 has a first end connected to the upper cover 311 of the radiating pipe 310 and a second end passing through a certain cabinet side plate 220 (e.g., a rear panel). In some embodiments, the first end of the radiating pipe 320 is welded to the upper cover 311. The radiating pipe 320 includes an inlet pipe 321 and an outlet pipe 322. Correspondingly, the upper cover 311 includes a liquid inlet hole (313) and a liquid outlet hole (314), and the liquid inlet hole 313 and the liquid outlet hole 314 are communicated with the cavity 315 in the heat sink 310. Liquid inlet hole 313 is connected with liquid inlet pipe 321, and liquid outlet hole 314 is connected with liquid outlet pipe 322. Thus, the cooling fluid enters the cavity 315 through the inlet opening 313 and exits the cavity 315 through the outlet opening 314. In this embodiment, heat of the heat generating elements can be transferred to the heat dissipating structure 316, and the cooling liquid flowing into the cavity 315 from the liquid inlet pipe 321 absorbs heat of the heat dissipating structure 313, and exits the cavity 315 through the liquid outlet hole 314, and exits the case 200 through the liquid outlet pipe 322. In some embodiments, the plurality of heat dissipation structures 316 may be formed as copper slot structures, or other heat dissipation structures, to increase the heat dissipation surface area, which is not limited in the present invention.

It should be understood that, for the two heat dissipation pipes 320 fixed to each heat dissipation member 310, one skilled in the art can designate either one of the pipes as the liquid inlet pipe 321 and the other pipe as the liquid outlet pipe 322. Preferably, the first end of the liquid inlet pipe 321 is closer to the cabinet side plate 220 through which the second end penetrates, so that the cooling liquid can enter the cavity 315 as soon as possible to cool the heat generating element. Assuming that the second ends of inlet pipe 321 and outlet pipe 322 are aligned outside the housing, inlet pipe 321 is shorter than outlet pipe 322.

In some embodiments, at least one of the reinforcing member 330 and the damper pad 340 in the heat radiating system 300 may reinforce the heat radiating pipe 320. Wherein the reinforcing member 330 clamps the predetermined middle position of the radiating pipe 320, the stable installation of the radiating pipe 320 is accomplished by fixing the reinforcing member 330 to the cross member of the second fixing bracket 800. The damping pad 340 may clamp a predetermined position of the second end (i.e., the mouthpiece end) of the heat pipe 320, and the clamped heat pipe passes through a slot of one side plate 220 of the housing, thereby achieving damping and stable mounting of the mouthpiece end. The structure of the heat dissipation system 300 after being mounted on the heat generating component is shown in fig. 9.

In some embodiments, the present disclosure fixes the radiating pipe 320 under the support beams in the cabinet by at least one reinforcing member 330. Specifically, the computing device 100 uses the reinforcing member 330 to clamp the predetermined middle position of the radiating pipe 320 and fix the top surface of the reinforcing member 330 under the support beams of the second fixing bracket 800. In some embodiments, after the heat dissipation system 300 with the reinforcing member 330 and the shock absorbing pad 340 mounted thereon is mounted on the heating element, the supporting beams of the second fixing frame 800 are mounted on the reinforcing member 330, and the reinforcing member is fixed on the corresponding supporting beams. Mounting holes are provided on both the top surface of the reinforcing member 330 and the support beam to be mounted, for fixing the reinforcing member 330 under the support beam. Fasteners (e.g., screws) may be used to secure through mounting holes between the two structures, for example, screws may be passed through mounting holes of the cross beam and tightened with mounting holes of the reinforcement assembly.

In some embodiments, the fastening position of the reinforcing member 330 on the radiating pipe 320 corresponds to the installation position of the support beam in the cabinet. For example, knowing the horizontal distance from the center point of the support beam to the side panel 220 of the cabinet through which the radiating pipe 320 passes, the position of the reinforcing member 330 can be determined to be fastened to the radiating pipe 320 according to the horizontal distance.

Similar to the first fixture 400, the second fixture 800 includes at least one support beam including at least one second cross beam 810 and/or at least one second side beam 820, the second cross beam 810 and the second side beam 820 being perpendicular to each other in a horizontal direction. For example, the second fixture 800 includes three second cross members 810 and two second side members 820 (shown in fig. 1). The second side member 820 is fixedly mounted to the cabinet side plate 220. The second cross member 810 may be fixed to the second side member 820, or may be installed on the bases 830 at two sides of the chassis (for example, in fig. 9, three bases 830 are respectively provided at the right side and the middle of the chassis, and a plurality of bases 830 may be similarly provided at the left side of the chassis), and the bases may be fixed on the bottom plate 210 of the chassis, the side plate 220 of the chassis, or the supporting structure at the next floor. The second beam 810 may also be directly fixed to the chassis side panel 220, or the second beam 810 may be a beam substructure of another support structure, which may be directly fixed to the chassis base panel 210 and/or the chassis side panel 220. The second fixing frame 800 may be L-shaped, square-shaped, japanese-shaped, H-shaped, T-shaped, etc., and the present disclosure does not limit the shape of the second fixing frame 800, and the positions and the number of the second cross beam 810 and the second side beam 820.

In some embodiments, there are multiple GPU boards (two shown in fig. 9) in the computing device, so that each GPU board is provided with one overall assembly, and the multiple overall assemblies are all fixed on the first fixing frame 400. In this case, a plurality of total assemblies may be fixed on the same first fixing frame 400, or may be fixed on different first fixing frames 400, for example, fig. 9 shows two GPUs on the left and right, and two total assemblies are installed. In addition, one heat dissipation system 300 is installed for each GPU, and a plurality of heat dissipation systems 300 can be fixed on the same second fixing frame 800. For example, if the second beam 810 of the second fixing frame 800 traverses the entire chassis 200, the reinforcement members 330 located at the same latitude can be mounted on the same second beam 810.

In some embodiments, referring to fig. 1 and 8, two heat pipes 320 of the same heat dissipation member 310 may be fastened using the same reinforcement assembly 330, the reinforcement assembly 330 including three planar structures and a groove between two adjacent planar structures. The reinforcing member 330 has two grooves for the two radiating pipes 320 to pass through. The groove between the two planar structures is provided with a latch, and the heat dissipation tube 320 can be clamped by latching the latch after the heat dissipation tube 320 is placed in the groove. Moreover, a back adhesive can be arranged between the groove of the reinforcing component 330 and the lock catch to prevent the reinforcing component 330 from loosening. The planar structure, i.e., the top surface of the reinforcing component 330, is provided with mounting holes, and the number and positions of the mounting holes are not limited by the present disclosure and can be set by those skilled in the art as needed. For example, the planar structure on both sides of the reinforcement assembly 330 of FIG. 8 has two mounting holes each, and the planar structure in the middle has three mounting holes.

Of course, it is also possible to separately provide one reinforcing member 330 for each radiating pipe 320 and to fix each corresponding reinforcing member 330 to the cross member, respectively, in which case each reinforcing member 330 includes two planar structures and a groove between the two planar structures, and the groove also has a locking buckle and an adhesive.

In some embodiments, referring to fig. 1 and 8, one or more shock-absorbing pads 340 may be installed on each radiating pipe 320. One skilled in the art can set the mounting position of the damping pad 340 as required, for example, the clamping position of the damping pad 340 corresponds to the slot of the cabinet side plate 220 through which the heat pipe 320 passes, for example, the clamping position can be tightly attached to the interface connector at the second end of the heat pipe 320, so that the heat pipe section clamped by the damping pad 340 is exactly located in the slot of the cabinet side plate 220. It should be understood that the material of the shock absorbing pad 340, such as rubber, can be selected by one skilled in the art, and the disclosure is not limited thereto.

In some embodiments, the side panel 220 (e.g., the rear panel) of the cabinet through which the heat pipe 320 passes includes the first unit 221 and the second unit 222. The first component 221 has at least one third opening 223, for example two third openings 223. The bottom of the third opening 223 is provided with a slot, and the shape of the second component 222 matches the shape of the opening of the first component 221. The bottom of the second block 222 also has a slot that forms a through hole with the slot of the first block 221 at the bottom of the third opening 223 for passing the radiating pipe 320. When the second block 222 and the first block 221 are assembled together, the radiating pipe 320 in the groove of the first block 221 is compressed. Of course, if there are a plurality of total assemblies, each of which is installed at a different position in the cabinet, and each of the assemblies has a group of radiating pipes 320, a side plate assembly may be disposed on the side plate of the cabinet through which each of the radiating pipes 320 passes, so as to form a through hole through which the radiating pipe 320 passes with the lower side plate assembly.

In some embodiments, the case side plate 220 has a plurality of second components 222, and each third opening 223 corresponds to one second component 222, and the slot of the second component 222 at each third opening 223 and the slot of the first component 221 form a through hole.

Fig. 10 is a schematic view illustrating a cabinet side plate 220 through which a heat pipe according to an embodiment of the present disclosure passes, the cabinet side plate 220 being, for example, a rear panel, and including a first module 221 and two second modules 222, wherein an opening slot on the first module 221 is divided into a low slot 224 and a high slot 225 according to the heights of the slots, and slots with different positions are used for passing through different heat-generating elements 320. In FIG. 10, a set of elevated slots 225 are provided in the third opening 223 on the left side of the first component 221, and a corresponding slot is provided in the upper second component 222; the third opening 223 on the right side has a set of low slots 224 and a set of high slots 225, and the corresponding second upper component 222 has two slots.

In addition, each second module 222 may be further divided into two or more sub-modules as required, for example, the second module 222 on the left side in fig. 10 may be further divided into two sub-modules, the two sub-modules also have slots respectively, the slot between the two sub-modules is used to form a through hole for passing another group of radiating pipes, for example, a CAN card is disposed at the slot layer of the cabinet, and a radiating system is installed on the CAN card to pass the radiating pipe through the slot layer. This is disclosed can set up heating element's installation position as required to and the installation position of corresponding cooling tube 320, and then confirm the trench position that cooling tube 320 wore out chassis side board 220, and split chassis side board 220 according to this trench position, obtain a plurality of subassemblies. The effect of the second block 222 being mounted to tighten the radiating pipe 320 is shown in fig. 11, in which the right second block 222 shows only the lower sub-block thereof, and the upper sub-block can be mounted after another group of radiating pipes corresponding thereto is mounted.

Also, the opening shapes of the first and

second assemblies

221 and 222 may be set as needed, for example, a completely vertical structure similar to a square shape may be provided, and a shoulder structure or a stepped structure may be provided, which is not limited by the present disclosure.

In this embodiment, the CPU component is located at the bottom layer of the chassis, the GPU component is mounted on the middle layer of the chassis through the supporting structure, each of the heat generating components is provided with a corresponding heat dissipation system 300, and each of the heat dissipation systems 300 includes a heat dissipation member 310 and a heat dissipation pipe 320. Thus, the lower slot 224 is used to pass through the heat pipe 320 of the CPU component, and the two sets of upper slots 225 are used to pass through the heat pipe 320 of the GPU component. When the second module 222 and the first module 221 on the right side are installed together, the CPU radiator in the low slot 224 and the GPU radiator in the high slot 225 are stabilized. When the left second module 222 and the first module 221 are installed together, the GPU heat pipe in the other slot 225 is secured. Of course, those skilled in the art can also replace the installation positions of the CPU and the GPU as required, such as installing the GPU on the bottom layer of the case, installing the CPU on the middle layer of the case, and providing a slot at a corresponding position on the side panel of the case to pass through the corresponding heat dissipation pipe of each heat generation element.

In some embodiments, as shown in fig. 12, the computing device 100 may further include a cooling device 900 disposed outside the chassis 200, where the cooling device 900 includes a liquid tank 910, a pump 920, a pipeline set 930, a heat sink 940, and a fan set 950. The liquid tank 910 is used for storing cooling liquid. A pump 920 is mounted to the liquid tank 910 to pressurize the cooling liquid. The pipe line group 930 is connected between the liquid tank 910 and the second ends of the plurality of heat pipes 320. The coolant pressurized by the pump 920 flows through the plurality of pipe sets 930 and the plurality of heat dissipation pipes 320 to the water cooling flow passages of the plurality of heat dissipation members 310, thereby dissipating heat generated from the plurality of heat generation elements. In the present embodiment, the heat dissipation tube 940 is connected between the second end of the heat dissipation tube 320 and the liquid tank 910 through the pipe group 930 to cool the cooling liquid. The fan set 950 is disposed on the heat dissipation row 940, for example, to achieve better cooling effect. Specifically, in the present embodiment, the fan set 950 can be, for example, two fan walls, and the heat dissipation bank 940 is sandwiched between the two fan walls. The arrangement of the fan set 950 and the heat dissipation row 940 can satisfy the heat dissipation requirement of high power, such as 1400 watts (W), to provide sufficient wind speed and amount to dissipate the heat of the cooling liquid. However, in some embodiments, the fan stack 950 may also be a single layer or a multi-layer fan wall. The number and arrangement of the fans in the fan set 950 can also be adjusted according to the actual heat dissipation requirement, and the invention is not limited thereto.

In some embodiments, the cooling device 900 further includes a dispenser 960 and at least one quick connector 970, such as a plurality of quick connectors 970. The pipe string 930 is connected to the dispenser 960 through the quick couplers 970, and is connected to the second end of the radiating pipe 320 through the dispenser 960. Specifically, the dispenser 960 dispenses the cooling fluid from the pipe set 930 into the radiating pipe 320. By disposing the liquid distributor 960, the number of pipes in the pipe group 930 can be, for example, less than or equal to the number of pipes in the heat pipe 320, thereby reducing the number of pipes outside the cabinet 200. In addition, by the arrangement of the quick connectors 970, the connection relationship between the heat dissipation pipe 320 and the pipe set 930 can be quickly installed and adjusted according to at least different server module architectures and heat dissipation requirements.

In some embodiments, pipeline set 930 includes a second pipeline 930A, a second pipeline 930B, a second pipeline 930C, and a second pipeline 930D. The second pipeline 930A is connected between the pump 920 and the heat pipe 320, the second pipeline 930B is connected between the heat pipe 320 and the heat sink 940, the second pipeline 930C is connected between the heat sink 940 and the liquid tank 910, and the second pipeline 930D is connected between the liquid tank 910 and the pump 920. Specifically, the cooling fluid from the fluid tank 910 is pressurized in the pump 920 and enters the radiating pipe 320 through the second pipe 930A. Then, the cooling liquid radiates heat from the heating elements through the liquid inlet pipe 321 and the heat radiating member 310, and enters the second pipeline 930B through the liquid outlet pipe 322. The cooling liquid then enters the second pipeline 930C through the heat dissipation exhaust 940 via the second pipeline 930B, wherein the heat dissipation exhaust 940 and the fan set 950 further dissipate heat of the cooling liquid. The cooling liquid entering the second line 930C then flows back to the liquid tank 910 to be circulated.

In some embodiments, the heat pipe 320 is made of a different material and has a different hardness than the pipe group 930. The heat pipe 320 is, for example, a plurality of metal water pipes, and the material thereof may, for example, include copper, or may, for example, be a metal or non-metal material that is advantageous for heat conduction and welding. In this embodiment, the second pipeline 930A, the second pipeline 930B, the second pipeline 930C and the second pipeline 930D may be flexible hoses that can be bent, for example, to form a hose set, so that the liquid tank 910, the pump 920, the heat sink 940 and the fan set 950 can be disposed at suitable relative positions with respect to the chassis 200 according to actual requirements.

In addition, the computing device 100 further includes a power supply (not shown), which may be a battery, a disposable battery or a rechargeable battery. The power supply is used for supplying power to components in the computing device 100, such as a motherboard, a heat sink, a video card, a sound card, a network card, or a CAN card. The power supply may be a cuboid with a vent at its front end. In some embodiments, the front end of the power supply also has other elements, such as switches. The rear end of the power supply may be connected to a cable or the like. In some embodiments, the rear end of the power supply has a hole on the bottom surface through which the power supply can be mounted on a predetermined flat plate, and the power supply is fixed using a plurality of fixing brackets. Accordingly, the computing device 100 may also include a tablet for securing a power source and a plurality of holders (all shown). The panel is mounted to the chassis by support structures (e.g., beams and brackets), such as in the top space of the chassis, and the power supply is mounted to the panel, such that a space is formed between the panel and the power supply and the chassis floor, which may increase the freedom of placement of the various components in the chassis, and which may also be used for air circulation to facilitate heat dissipation of the various components within the chassis. The fixing frame may include four fixing frames, an upper fixing frame, a lower fixing frame, a left fixing frame, a right fixing frame, and four fixing frames, wherein the four fixing frames enclose the flat plate and the power supply from four directions, of course, more or fewer fixing frames may be provided, for example, the side fixing frame at the side plate of the power supply may be omitted.

Fig. 13 illustrates a method of installing a heat dissipation system according to an embodiment of the present disclosure. Referring to fig. 13 in conjunction with fig. 1-12, a method for installing a heat dissipation system according to an embodiment of the present disclosure will be described in detail.

In step S101, a circuit board on which the heat generating element is located is mounted on the support plate.

In some embodiments, step S101 comprises: mounting an insulating pad 520 on the supporting plate 510 to obtain a first assembly 500 (see fig. 2); forming a thermal grease layer 620 on the heat generating elements of the circuit board 610, resulting in a second assembly 600 (see fig. 3) as shown in fig. 3; the second assembly 600 is mounted on the first assembly 500 (see fig. 4), thereby mounting the circuit board on which the heat generating element is located on the support board. The insulating pad has a first opening 530 at a position corresponding to the heat generating element.

Here, the first assembly 500 is constructed by attaching an integral insulating pad 520 to the upper surface of the supporting plate 510, so that the circuit on the main board is absolutely insulated from the supporting plate 510, and a fatal failure due to a short circuit is not caused. A heat-conducting silicone sheet is adhered to the surface of a heating element of the circuit board 610 (e.g., a GPU motherboard) to dissipate heat from the inductor, MOS, and devices with large power consumption of the circuit board 610.

In some embodiments, the method of installing a heat dissipation system further comprises: a heat-conducting plate 700 (see fig. 5) is mounted on the second assembly member 600, the heat-conducting plate 700 having a second opening 710 at a portion corresponding to the heat generating element; and a heat conducting seat is arranged on the heating element. The heat-conducting plate 700 and the heat-conducting base can be made of metal, such as copper. The heat-conducting copper base can be mounted after the heat-conducting silicone grease is uniformly coated on the surface of the heating element (such as GPU), and the uniform coating of the heat-conducting silicone grease can effectively reduce the thermal resistance of the contact surface of the heating element and the heat-conducting copper base and dissipate heat more effectively. In addition, after the heat conducting plate 700 is mounted on the second assembly member 600, the second assembly member may be mounted on the first assembly member 500, and then the heat conducting base may be mounted; alternatively, after the heat conducting plate 700 and the heat conducting seat are mounted on the second assembly member 600, the second assembly member 600 may be mounted on the first assembly member 500; it is also possible to mount the heat-conducting plate 700 and the heat-conducting seat on the heat-conducting silicone layer 620 after the second assembly member 600 is mounted on the first assembly member 500. The present disclosure does not limit the order of installation of the components.

In step S102, the support plate 510 is mounted on the first fixing bracket 400 within the cabinet 200. The assembled structure is shown in fig. 6. It should be noted that, the present disclosure does not limit the sequence relationship between steps S102 and S101, the supporting plate 510 may be first mounted on the first fixing frame 400, and then the circuit board 610 is mounted on the supporting plate; the supporting plate 510 and the circuit board 610 may be assembled and then mounted on the first fixing frame 400. The present disclosure does not limit the order of installation of the components.

In step S103, a heat dissipation system 300 including a heat dissipation member 310 and a heat dissipation pipe 320 is mounted on the heat generating element.

In some embodiments, the heat dissipation member 310 includes an upper cover 311 and a base 312, a cavity 315 is formed between the upper cover 311 and the base 312, and a plurality of heat dissipation structures 316 are disposed in the cavity 315. The first end of the radiating pipe 320 is connected to the upper cover 311 of the radiating pipe 310, the predetermined position of the second end of the radiating pipe 320 is clamped by at least one shock pad 340, and the second end of the radiating pipe 320 passes through a slot of a side plate (e.g., a rear panel) of the cabinet.

In some embodiments, step S103 comprises: the heat conductive silicone grease is uniformly applied to the base 312 of the radiating pipe 310 to adhere the reinforcing member 330 and the shock absorbing pad 340 to the corresponding positions of the radiating pipe 320 (see fig. 8).

In some embodiments, step S103 further comprises: the heat dissipating member 310 is mounted on the heat conducting seat through the second opening 710, and the second end of the heat dissipating pipe 320 passes through a slot of a side plate of the cabinet. The assembled structure is shown in fig. 9. Specifically, a heat conductive silicone grease may be applied to the heat conductive socket or the base 312 of the heat sink 310, and the base of the heat sink 310 may be mounted on the heat conductive socket.

In step S104, the radiating pipe 320 is fixed under the support beams within the cabinet 200 by at least one reinforcing member 330.

In some embodiments, step S104 includes: at least one reinforcing member 330 is used to fasten the midway predetermined position of the radiating pipe 320; installing a second fixing frame 800 above the reinforcing component 330 in the chassis 200, wherein the second fixing frame 800 comprises at least one supporting beam; the top surface of the reinforcing member 330 is fixed under the corresponding support beam. In some embodiments, two reinforcing members 330 are fastened to the radiating pipe 320, at least one of the support beams comprises at least one second beam 810 and/or at least one second side beam 820, the reinforcing members 330 are fixed to the second beam 810, for example, to the two second beams 810 at the back, and the side wall brackets 820 are mounted on the side plate of the cabinet.

In some embodiments, the case side plate 220 includes a first member 221 and a second member 222, the first member 221 has a third opening 223, the bottom of the third opening 223 and the bottom of the second member 222 both have a slot, and the slot at the bottom of the third opening 223 of the first member 221 and the slot at the bottom of the second member 222 form a through hole for passing through the radiating pipe 320. Therefore, the method for installing the heat dissipation system further comprises the following steps: the second block 222 is mounted on the third opening 223 of the first block 221 to press the radiating pipe 320 in the groove of the first block 222. The effect of the second component 222 being mounted on the third opening 223 is shown in fig. 11.

In summary, the heat-conducting silicone grease layer is adhered to the heating element of the circuit board 610, so that the heat-dissipating efficiency is improved; an insulating pad 520 is attached to the support plate 510 to prevent a short circuit fault. The heat conducting plate 700 is installed on the heat conducting silicone layer 620, so that the heat conducting efficiency is improved, and the heat radiating system 320 is installed on the heat conducting plate 700 corresponding to the heat generating element, so that the heat radiating efficiency of the heat generating element is improved. The whole assembly frame is fixed by the first fixing frame 400 at the lower end, and the heat dissipation system 300 is stabilized by the second fixing frame 800 at the upper end. After the radiating pipe 320 is clamped by the reinforcing member 330, the top surface of the reinforcing member 330 is fixed under the second beam 820 of the second fixing frame 800. The ends of the radiating pipes 320 are damped by one or more damping cushions 340, and the ends of the radiating pipes 320 with the damping cushions 340 mounted thereon pass through the slots of the cabinet side plate 220, so that the radiating system 300 is reinforced in many ways, the radiating system 300 is prevented from being damaged in the driving process of a vehicle, and the radiating efficiency and the radiating stability of a heating element are improved.

Fig. 14 shows a flow chart of a method of installing a heat dissipation system according to another embodiment of the present disclosure. Referring to fig. 14, in conjunction with fig. 1-12, the method includes:

in step S201, a thermal grease layer is formed on the surface of the circuit board 610 to obtain a second assembly;

in step S202, an insulating pad 520 is attached to the support plate 510 to obtain a first assembly;

in step S203, mounting the second assembly on the first assembly;

in step S204, a heat conducting plate 700 is mounted on the second assembly, the heat conducting plate 700 having an opening at a position corresponding to the heat generating element;

in step S205, a heat conducting base is mounted on the heating element to obtain an overall assembly, wherein the heat conducting base is in contact with the heating element through a heat conducting silicone grease;

in step S206, the assembly is mounted on the first fixing frame 400;

in step S207, the reinforcing member 330 is used to fasten the middle predetermined position of the radiating pipe 320, and the cushion 340 is used to fasten the predetermined position of the second end of the radiating pipe;

in step S208, the heat dissipation system 300 is mounted on the heat conduction base, and the heat dissipation system 300 is in contact with the heat conduction base through the heat conduction silicone grease, so that the second end of the heat dissipation pipe 320 passes through the slot of the case side plate 220;

in step S209, a second fixing frame 800 is installed above the reinforcing component 330, a second cross beam 810 of the second fixing frame 800 is fixed on the base 830, and a second side beam 820 is fixed on the proceeding side plate;

in step S210, the top surface of the reinforcing member 330 is fixed under the second cross member 810, and the second member 222 of the cabinet side plate 220 is installed to compress the mouth ends of the radiating pipes 320.

The installation method of the heat dissipation system of the present disclosure is disclosed in detail in the description based on fig. 1 to 13, and will not be described herein again.

The present disclosure is not intended to limit the execution sequence of the above steps, and a person skilled in the art can set the installation sequence of the components as desired. This is openly realized the firm installation of cooling system at the quick-witted case through multiple tactics, avoids the water-cooling module of server to take place to damage because of triaxial random vibration when the driving, improves heating element's radiating efficiency and stability.

Although exemplary embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it should be understood that the above exemplary discussion is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. Accordingly, the disclosed subject matter should not be limited to any single embodiment or example described herein, but rather construed in breadth and scope in accordance with the appended claims.

Claims

1. A method of installing a heat dissipation system, comprising:

mounting a circuit board on which a heating element is located on a support plate;

mounting the support plate on a first fixed bracket in the case;

installing a heat dissipation system on the heating element, wherein the heat dissipation system comprises a heat dissipation piece and a heat dissipation pipe; and

the radiating pipe is fixed under the supporting beam in the machine case through at least one reinforcing component.

2. The method of claim 1, wherein mounting the circuit board on which the heat generating component is mounted on the support plate comprises:

mounting an insulating pad on the support plate to obtain a first assembly;

forming a heat-conducting silicone grease layer on a heating element of the circuit board to obtain a second assembly;

mounting the second assembly on the first assembly.

3. The method of claim 2, wherein the insulating mat has a first opening at a location corresponding to the heat generating element, the method further comprising:

a heat conducting plate is arranged on the second assembly part, and the heat conducting plate is provided with a second opening at the part corresponding to the heating element;

and a heat conducting seat is arranged on the heating element in the second opening.

4. The method of claim 1, wherein,

the heat dissipation piece comprises an upper cover and a base, a cavity is formed between the upper cover and the base, and a plurality of heat dissipation structures are arranged in the cavity;

the first end of the radiating pipe is connected with the upper cover of the radiating pipe, and the preset position of the second end of the radiating pipe is clamped by at least one shock pad.

5. The method of claim 3, wherein mounting a heat dissipation system on the heat generating element comprises:

mounting the heat sink on the heat conduction seat through the second opening;

and the second end of the radiating pipe passes through a slot position of a certain side plate of the case.

6. The method of claim 1, wherein securing the radiating pipe under the support beams within the cabinet by at least one reinforcing assembly comprises:

clamping the middle preset position of the radiating pipe by adopting at least one reinforcing assembly;

installing a second fixing frame above the reinforcing component in the case, wherein the second fixing frame comprises at least one supporting beam;

and fixing the top surfaces of the reinforcing components below the corresponding support beams.

7. The method of claim 6, wherein the radiator pipe is clamped with two reinforcing members, the at least one support beam comprises at least one cross member and/or at least one side wall bracket, the two reinforcing members are fixed under the at least one cross member, and the side wall bracket is mounted on the side panel of the cabinet.

8. The method of claim 5 wherein the side plate includes a first member and a second member, the first member having a third opening, the third opening bottom and the second member bottom each having a slot, the slot of the first member at the third opening bottom and the slot of the second member bottom forming a through hole for passing the pipe, the method further comprising:

and the second assembly is arranged on the third opening of the first assembly so as to press the radiating pipe in the groove position of the first assembly.

9. A computing device, comprising:

a chassis;

the first fixing frame is arranged in the case;

a support plate mounted on the first fixing frame;

a circuit board mounted on the support plate, the circuit board having a heating element thereon; and

install in cooling system on the heating element, cooling system includes radiating piece and cooling tube, the cooling tube is fixed under the supporting beam of quick-witted incasement through at least one reinforcement subassembly.

10. The computing device of claim 9, wherein,

the support plate is provided with an insulating pad, and the insulating pad is provided with a first opening at a position corresponding to the heating element;

the circuit board is arranged on the insulating pad, and a heat-conducting silicone grease layer is formed on the circuit board.

11. The computing device of claim 10, wherein the computing device further comprises:

the heat conducting plate is arranged on the heat conducting silicone layer, and a second opening is formed in the part, corresponding to the heating element, of the heat conducting plate; and

and the heat conducting seat is arranged on the heating element and is contacted with the bottom surface of the radiating piece through heat conducting silicone grease.

12. The computing device of claim 9, wherein,

the first end of the radiating pipe is connected with the upper cover of the radiating pipe, and the second end of the radiating pipe penetrates through a slot position of a certain side plate of the case.

13. The computing device of claim 9, wherein,

the preset position of the second end of the radiating pipe is clamped by at least one shock pad, and the radiating pipe clamped with the shock pad penetrates through a slot position of a certain side plate of the case;

the middle preset position of the radiating pipe is clamped by at least one reinforcing component, and the top surface of the reinforcing component is fixed below the supporting beam in the case.

14. The computing device of claim 13, wherein the radiating pipe has two reinforcing members clipped thereon, the at least one support beam comprises at least one cross beam and/or at least one side wall bracket, the two reinforcing members are fixed under the at least one cross beam, and the side wall bracket is mounted on a side panel of the cabinet.

15. The computing device of claim 10 wherein the side plate comprises a first component and a second component, the first component having a third opening, the third opening bottom and the second component bottom each having a slot, the slot at the third opening bottom of the first component and the slot at the second component bottom forming a through hole for passing the radiating pipe.