CN115373475A - Computing device and installation method thereof - Google Patents

Abstract

The present disclosure relates to a computing device and a method of installing the same. The installation method of the computing device comprises the steps of installing a main board of the computing device on a bottom board of a machine box, wherein the main board is provided with a first group of heating elements; mounting a first side plate assembly on a chassis floor, the first side plate assembly comprising at least a first opening, the first side plate assembly having one or more grooves at the bottom of the first opening; a first group of radiating modules are arranged on the bottom plate of the machine case and used for radiating the first group of heating elements, and each first group of radiating modules comprises at least one group of radiating pipes, and at least parts of the radiating pipes are positioned in the grooves; and installing a second side plate assembly in the first opening, wherein the bottom of the second side plate assembly is provided with a groove, and the groove at the bottom of the second side plate assembly is aligned with the groove at the bottom of the first opening of the first side plate assembly.

Description

Computing device and installation method thereof

Technical Field

The present disclosure relates to the field of automatic driving technologies, and in particular, to a computing device and an installation method thereof.

Background

With the development of automatic driving technology, automatic driving vehicles have been applied in the fields of logistics freight, passenger carrying and the like. When the autonomous vehicle is running, external road information is generally sensed by a sensor of the autonomous vehicle, such as a radar, a camera, and the like. And then, the automatic driving calculation device (such as a server) and the like perform calculation to complete the decision and planning of the driving of the automatic driving vehicle, and finally, the automatic driving vehicle is controlled to drive according to the corresponding decision and planning.

As for the on-board server, since the technology related to the automatic driving is complex, the functions of the on-board server to be set are very powerful, and the on-board server not only has strong computing power, but also has high processing efficiency, and therefore, compared with an ordinary server, the number of components that may be installed inside the on-board server is more huge.

Disclosure of Invention

The embodiment of the invention provides a computing device and a mounting method of the computing device, and solves the problem that random vibration generated when the computing device runs causes a fault.

The present invention provides, in one aspect, a method of installing a computing device, comprising:

installing a mainboard of a computing device on a bottom plate of a computer case, wherein the mainboard is provided with a first group of heating elements;

mounting a first side plate assembly on a chassis floor, the first side plate assembly comprising at least a first opening, the first side plate assembly having one or more grooves at the bottom of the first opening;

a first group of radiating modules are arranged on the bottom plate of the machine case and used for radiating the first group of heating elements, and each first group of radiating modules comprises at least one group of radiating pipes, and at least parts of the radiating pipes are positioned in the grooves;

and installing a second side plate assembly in the first opening, wherein the bottom of the second side plate assembly is provided with a groove, and the groove at the bottom of the second side plate assembly is aligned with the groove at the bottom of the first opening of the first side plate assembly.

The present invention provides in another aspect a computing device comprising:

a main board arranged on the chassis bottom board, a first group of heating elements arranged on the main board,

the first side plate assembly is arranged on a chassis bottom plate and comprises at least a first opening, and the bottom of the first opening of the first side plate assembly is provided with one or more grooves;

the first group of heat dissipation modules are used for dissipating heat of the first group of heating elements, the first group of heating elements comprise at least one group of heat dissipation pipes, and at least parts of the heat dissipation pipes are located in the grooves.

A second side plate assembly in the first opening, the second side plate assembly having a recess in a bottom thereof, the recess in the bottom of the second side plate assembly being aligned with the recess in the bottom of the first opening.

The present invention provides in another aspect a computing device comprising:

a chassis including a bottom plate, a plurality of side plates, at least one of the plurality of side plates having a plurality of through holes, and a cover plate;

the main board is fixed on the chassis bottom plate;

the multiple groups of support beams are fixed on the case through a support;

the elements are fixed on the support beams and connected with the main board;

a heat dissipation system for dissipating heat from at least one of the plurality of elements, the heat dissipation system including a heat dissipation tube that passes through the plurality of through-holes.

The inventor of the application finds that, for the vehicle-mounted server, as the technology related to automatic driving is complex, the function of the vehicle-mounted server required to be set is very strong, the calculation capability is strong, the processing efficiency is high, but the calorific value is huge, and the challenge is how to effectively radiate the heat of the server.

In addition, because the vehicle-mounted server is installed on the vehicle, the vehicle may vibrate, suddenly brake or collide during the driving process, especially when the vehicle passes through an uneven road surface under high-speed driving, triaxial random vibration may be generated, the vibration is very severe, and each element located in the vehicle-mounted server may generate resonance, resonance and other phenomena in the vibration environment, which may easily cause a hardware fault of the server to cause unstable operation. How to effectively improve the stability of the operation of the device in a vibrating environment is another challenge.

According to the computing device and the installation method thereof provided by the embodiment of the invention, a main board of the computing device is installed on a bottom board of a machine box, and a first group of heating elements are arranged on the main board; mounting a first side panel assembly on a chassis floor, the first side panel assembly comprising at least a first opening, the first side panel assembly having one or more grooves at the bottom of the first opening; a first group of radiating modules are arranged on the bottom plate of the machine case and used for radiating the first group of heating elements, and each first group of radiating modules comprises at least one group of radiating pipes, and at least parts of the radiating pipes are positioned in the grooves; and installing a second side plate assembly in the first opening, wherein the bottom of the second side plate assembly is provided with a groove, and the groove at the bottom of the second side plate assembly is aligned with the groove at the bottom of the first side plate assembly in the first opening, so that the heat of the computing device is effectively dissipated.

In addition, according to the computing device of the application, in the running process of the vehicle, even if the vehicle shakes severely, hardware faults caused by shaking can be reduced, and the running stability of equipment is improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is an exploded view of a computing device according to an embodiment of the present application.

Fig. 2-5 are enlarged schematic structural diagrams of units of the computing device of fig. 1 according to an embodiment of the present application.

6-19 are schematic diagrams of a computing device installation process according to embodiments of the present application.

FIG. 20 is a schematic diagram of a cooling device for dissipating heat from a computing device according to an embodiment of the present application.

Detailed Description

In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present disclosure, the term "plurality" means two or more, unless otherwise specified. In this disclosure, the term "and/or" describes an associative relationship of associated objects, covering any and all possible combinations of the listed objects. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

In the present disclosure, unless otherwise specified, the terms "first", "second", and the like are used for distinguishing similar objects, and are not intended to limit positional relationships, timing relationships, or importance relationships thereof. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in other orientations than those illustrated or otherwise described herein.

Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, system, article, or apparatus.

FIG. 1 is an exploded view of a computing device according to an embodiment of the present invention. Fig. 2 is an enlarged view of a portion indicated by a block a in fig. 1, fig. 3 is an enlarged view of a portion indicated by a block B in fig. 1, fig. 4 is an enlarged view of a portion indicated by a block C in fig. 1, and fig. 5 is an enlarged view of a portion indicated by a block D in fig. 1. As shown in fig. 1-5, computing device 100 includes a chassis formed by a bottom panel 201, side panel(s) (e.g., side panels 202, 203, 204, 205, etc.), and a cover panel 206, for housing and providing environmental protection to some elements of the computing device. The chassis may have a motherboard of the computing device 100 installed therein. Components such as a Central Processing Unit (CPU), memory, various boards, etc. may be mounted or plugged onto the motherboard. The board card may include, for example, a video card, a sound card, a communication card, and the like. The Graphics Processing Unit (GPU) may be provided on the Graphics card. The communication card may be, for example, a Network card or a Controller Area Network (CAN) card. The mainboard can also be provided with one or more slots for connecting various boards. Because of the limited area on the motherboard, mounting or plugging these components directly onto the motherboard can greatly limit the number of components that can be mounted or plugged onto the motherboard. Therefore, according to some embodiments of the present application, some of these components, such as boards, for example, video cards, sound cards, or communication cards, may be mounted on the supporting structure instead of being directly mounted or plugged onto the motherboard, and may be connected to the motherboard through a flexible adapter, where one end of the flexible adapter may be connected to a slot of the motherboard and the other end may be connected to these boards. This allows more components to be installed for the computing device. One example of a flexible interposer is a Peripheral Component Interconnect Express (PCIE) patch cord.

The support structure may include brackets and sets of support beams for supporting various boards, heat sinks, power supplies, storage devices (e.g., hard disks), and the like. The brackets and support beams may be made of a metallic material (e.g., aluminum). The support structure can be fixed on the bottom plate and/or the side plate of the case and support the elements mounted on the support structure above the main plate, so that the freedom degree of the element arrangement of the computing device can be greatly increased.

As shown in FIG. 2, a first set of support beams 212 may be mounted on the brackets 211 and secured to the chassis floor 201, sideboards 202, and/or sideboards 203 by the brackets 211. The first support beam 212 may, for example, support a storage device of the computing apparatus 100, such as a hard disk 281 or the like.

As shown in fig. 3, a second set of support beams 222 are mounted to one or more brackets (not shown), side panel 202 and/or side panel 203, and one or more communication cards, such as CAN card 285, may be mounted on the second set of support beams 222. Brackets 214 may also be mounted to the first and/or second sets of support beams. The third set of support beams 224 may be mounted on one or more of the brackets (e.g., bracket 214), side panel 202, and/or side panel 203. One or more brackets 217 may also be mounted on some of the first through third sets of support beams. A fourth set of support beams 232 may be mounted on the brackets 217, side panels 202, and/or side panels 203. A network card 289 may be mounted on fourth set of support beams 232.

One or more brackets 241 may also be mounted to some of the first through fourth sets of support beams, and a fifth set of support beams 242 may be mounted to the brackets 241, the side panels 202, and/or the side panels 203, as shown in fig. 5.

A plate 250 may be secured to the fifth set of support beams 242 and supports 252 mounted on the plate 250. A sixth set of support beams 243 may be mounted on the bracket 241, the plate 250, the side panel 202, and/or the side panel 203, and a board card, such as a sound card 288, may be mounted on the sixth set of support beams 243.

In some embodiments, each board on the support beam may be connected to a slot of the motherboard by a flexible adapter.

As shown in fig. 2, two opposite side panels 202 and 203 are fixed to two edges of the chassis base 201. The chassis bottom 201, the side panels 202 and 203 may also be an integrally formed integral structure.

Side panel 204 of chassis 200 may be, for example, a rear panel of the chassis, and side panel 205 may be, for example, a front panel of the chassis. Side panel 205 may have various interfaces for connecting a computing device to peripheral devices, for example. Side panel 204 may, for example, include a plurality of side panel assemblies, such as side panel assembly 610, side panel assembly 620, side panel assembly 630, and side panel assembly 640. It should be noted that although the side panel 204 is shown in fig. 2-5 as including four side panel assemblies, one skilled in the art will appreciate that the side panel 600 may have more or fewer side panel assemblies.

As shown in fig. 3, the side panel assembly 610 of the side panel 600 is a generally rectangular or square plate with one or more openings, such as openings 611, 612, formed in one side of the side panel assembly 610. Each opening has a recess, for example. For example, as shown in FIG. 3, openings 611, 612 each have a groove 613 at the bottom. The opening 612 has a groove at the step portion 617 in addition to a groove at the bottom, and the opening 611 has a groove only at the bottom, but the step portion 618 has no groove. The grooves are used for fixing the radiating pipes of the radiating system, and the number of the grooves is determined according to the number of the radiating pipes of the radiating system.

Fasteners (e.g., screws) may be used to secure the side plate assembly 610 relative to the base plate 201, side plates 202, 203. In addition to using fasteners (e.g., screws) to secure the side plate assembly 610 directly to the bottom plate 201, side plates 202, 203, the side plate assembly 610 may be further secured to the bottom plate 201, side plates 202, 203, and support beams using, for example, L-shaped fasteners 262.

In some embodiments, the side panel assembly 610 has a plurality of holes for securing brackets, support beams, mounts, bottom panels, or other side panels of the computing device. As shown in fig. 4, the side plate assembly 620 is generally in the shape of a flat plate. The side plate assembly 620 has a shape corresponding to a portion of one opening (e.g., the opening 611) of the side plate assembly 610, e.g., a lower portion of the opening 611. The side plate assembly 620 has one or more grooves at the bottom and top, respectively. Fasteners (e.g., screws) may be used to secure the side plate assembly 620 to the side plate assembly 610. In addition, when the side plate module 620 is mounted to the side plate module 610, the grooves of the bottom of the side plate module 620 are aligned with the corresponding grooves of the bottom of the opening 611, forming through-holes in the side plates 204 for passing the radiating pipe and for fixing the radiating pipe. In some embodiments, a shock absorbing pad is further disposed between the groove and the heat pipe.

The side plate assembly 630 is generally in the shape of a flat plate. The side plate assembly 630 has a shape corresponding to one opening (e.g., opening 612) of the side plate assembly 610. The side plate assembly 630 also has one or more grooves in the bottom. In the example of fig. 4, the side plate assembly 630 also includes a step and also has a groove at the step. Fasteners (e.g., screws) may be used to secure the side plate assembly 630 to the side plate assembly 610. Further, when the side plate assembly 630 is mounted to the side plate assembly 610, the grooves of the bottom of the side plate assembly 630 and the stepped part are aligned with the corresponding grooves of the bottom of the opening 612 and the stepped part 617 of the side plate assembly 610, forming through-holes in the side plates 204 for passing the radiating pipe and for fixing the radiating pipe. In some embodiments, a shock absorbing pad is further disposed between the groove and the heat pipe.

In some embodiments, the side panel assembly 630 has a plurality of holes, some for securing brackets, support beams, fixtures, or other side panels of the computing device, and some for ventilation.

As shown in fig. 5, the side panel assembly 640 is generally in the shape of a flat panel. The side plate assembly 640 has a shape corresponding to a portion of one opening (e.g., the opening 611) of the side plate assembly 610, such as an upper portion of the opening 611. The side panel assembly 640 also has one or more grooves in the bottom. Fasteners (e.g., screws) may be used to secure the side panel assembly 640 to the side panel assembly 610. In addition, when the side panel assembly 640 is mounted to the side panel assembly 610, the grooves at the bottom of the side panel assembly 640 are aligned with the corresponding grooves at the top of the side panel assembly 620, forming through-holes in the side panels 204 for the passage of the radiating pipes and for the fixing of the radiating pipes. In some embodiments, a shock absorbing pad is further disposed between the groove and the heat pipe. The computing device 100 may also include a heat dissipation system for dissipating heat from some components that may generate heat. The heat dissipation system may also be mounted on a support structure (e.g., on a support beam of the support structure). The heat dissipation system comprises a plurality of groups of heat dissipation modules.

Each heat dissipation module may include one or more heat dissipation elements and a set of heat dissipation tubes (a set of heat dissipation tubes may include one or more heat dissipation tubes). The radiating module radiating piece and the radiating pipe are arranged in the case. The heat sink of each heat sink module may be provided corresponding to one heat generating element (e.g., CPU or GPU). In some embodiments, the number and types of the heat generating elements and the heat dissipating modules (or heat dissipating members) may be set according to actual requirements. The heat dissipation modules (or heat dissipation members) may be disposed corresponding to the heating elements one by one, for example, or a plurality of heat dissipation modules (or heat dissipation members) may be disposed on one heating element according to actual requirements, which is not limited in the present invention.

In some embodiments, each radiating tube has a first end and a second end. The first end of the radiating pipe is connected to the radiating member. The second end of the radiating pipe is connected with the cooling device. The second ends of the radiating pipes are connected with the cooling device through the through holes of the case side plate 204.

In some embodiments, the computing device 100 may be configured with different numbers of cpus, graphic processors or other types of elements according to actual requirements, and adjust the number and the arrangement relationship of the heat dissipation elements and the arrangement of the corresponding heat dissipation tubes, which is not limited in the present invention.

In some embodiments, each radiator element is in communication with a group of radiator tubes. The cooling liquid from the cooling device flows through the radiating pipe and the radiating piece to radiate the heat of the heating element. For example, one radiator member may communicate with two, three or four or more or less radiator pipes. However, in other embodiments, an appropriate number of radiating pipes and a single radiating element can be arranged to communicate with each other according to actual requirements. In some embodiments, the heat dissipation tube may also be fixed to the heat dissipation member by a fixing member and communicated with the heat dissipation member.

The heat dissipation system comprises a plurality of groups of heat dissipation modules. In some embodiments, the first set of heat dissipation modules may include a first heat dissipation module and a second heat dissipation module for dissipating heat to the CPU (i.e., the first set of heat generating components). As shown in fig. 3, the first heat dissipation module may include a first heat dissipation element 321 and a first group of heat dissipation tubes 322, and the second heat dissipation module may include a second heat dissipation element 323 and a second group of heat dissipation tubes 324, the first heat dissipation element 321 may be installed above one CPU, and the second heat dissipation element 323 may be installed above another CPU. The first group of heat pipes 322 and the second group of heat pipes 324 may be located in grooves in the side panel assembly 610, i.e., at least a portion of the first group of heat pipes 322 and the second group of heat pipes 324 are located in grooves at the bottom of one opening (e.g., opening 612) of the side panel assembly 610. I.e., through-holes formed by the grooves in the bottom of the side plate assembly 610 and the grooves in the bottom of the side plate assembly 630.

In some embodiments, one or more clamping members 328 may be provided on the first group of heat radiating pipes 322 and/or the second group of heat radiating pipes 324, and the clamping members 328 are used to clamp the heat radiating pipes to prevent the heat radiating pipes from malfunctioning due to vibration.

As shown in fig. 4, the second group of heat dissipation modules may include at least one heat dissipation module, such as a third heat dissipation module and a fourth heat dissipation module. A board card (e.g., a graphics card) and third and fourth heat dissipation modules may be mounted on the third set of support beams 224, and the second set of heat dissipation modules may dissipate heat from the second set of heat generating components (e.g., GPUs on the graphics card). The third heat dissipation module may include a third heat dissipation member 351 and a third group of heat dissipation pipes 352, the fourth heat dissipation module may include a fourth heat dissipation member 353 and a fourth group of heat dissipation pipes 354, the third heat dissipation member 351 may be mounted on one heat generation element, and the fourth heat dissipation member 353 may be located on another heat generation element. The third group of radiating tubes 352 and the fourth group of radiating tubes 354 may be positioned in recesses in different openings of the side plate assembly 610 with at least a portion of the third group of radiating tubes 352 and the fourth group of radiating tubes 354 being positioned in the recesses in the side plate assembly 610. Specifically, the third group of radiating pipes 352 are at least partially positioned in the grooves of the side plate assembly 610 at the bottom of the opening 611, i.e., through holes formed by the grooves of the side plate assembly 610 and the grooves of the bottom of the side plate assembly 620. The fourth group of radiating tubes 354 are at least partially positioned in the groove of the step portion 617 of the side plate assembly 610 at the opening 612, i.e., through holes formed by the groove of the step portion of the side plate assembly 610 and the groove of the step portion of the side plate assembly 630.

In some embodiments, one or more clamping members 266 may be provided on the third group of radiating pipes 352 and/or the fourth group of radiating pipes 354, the clamping members 266 being used to clamp the radiating pipes to prevent the radiating pipes from malfunctioning due to vibration.

As shown in fig. 4 and 5, the third group of heat dissipation modules may include at least one heat dissipation module, for example, a fifth heat dissipation module. A board (e.g., a graphics card) and a fifth heat sink module may be mounted on the fourth set of support beams 232, and the third set of heat sink modules may dissipate heat from a third set of heat generating components (e.g., a GPU on the graphics card). The fifth heat dissipation module may include a fifth heat dissipation member 357 and a fifth group of heat dissipation tubes 358, and the fifth heat dissipation member 357 may be mounted on a heat generating element (e.g., GPU on a graphic card). The fifth group of heat radiating tubes 358 may be positioned in a recess in the top of the side plate assembly 620 with at least a portion of the fifth group of heat radiating tubes 358 being positioned in the recess in the top of the side plate assembly 620, i.e., through holes formed by the recess in the top of the side plate assembly 620 and the recess in the bottom of the side plate assembly 640.

The power supply 700 is mounted on the flat plate 250 and clamps the power supply in two opposite directions with the fixing brackets 710 and 720 and an insulating pad may be disposed between the fixing brackets 710 and 720 and the power supply, thereby preventing the power supply from shaking, which may occur. The power source may be, for example, a battery, which may be a disposable battery or a rechargeable battery. For supplying power to components in the computing device 100, such as a motherboard, a heat dissipation system, a graphics card, a sound card, a network card, a hard disk, and/or a CAN card.

Referring to fig. 6-19, a computing device installation method of an embodiment of the present application is described in detail below. The computing device may be the computing device of fig. 1.

As shown in FIG. 6, a motherboard 280 of a computing device may be mounted on chassis base 201. Motherboard 280 may have one or more components, such as a CPU282 and a memory 283, thereon. The motherboard may also have one or more slots 284 therein. Various board cards such as a video card, a sound card, a network card or a CAN card CAN be inserted into the slot 284. Or one end of a flexible adapter may be inserted into the slot 284, and the other end of the flexible adapter may be connected to a board card such as a video card, a sound card, a network card, or a CAN card.

In some embodiments, two opposing side panels 202 and 203 are secured to two edges of the chassis base 201. The bottom board 201, the side boards 202 and 203 may also be an integrally formed integral structure.

A plurality of securing and/or support structures, such as a securing bracket 213, a bracket 211, a first set of securing members 261, and a first set of support beams 212, may be mounted on the bottom panel 201 and/or the side panels (e.g., side panel 202 and/or side panel 203). The first set of support beams 212 may be mounted to the brackets 211 and secured to the bottom panel 201, the side panels 202, and/or the side panels 203 via the brackets 211. These fixing structures and support structures may be made of a metallic material (e.g. aluminium). The fixture 213 may have a plurality of recesses 218 therein.

Also shown in FIG. 6 is a hard disk 281, which hard disk 281 may be mounted on the first set of support beams 212 and connected to the motherboard 280 by corresponding wiring. Instead of the hard disk 281, other elements may be mounted on the first group support beam 212.

Next, as shown in fig. 7, a side plate assembly 610 is mounted on the bottom plate 201. The side panel assembly 610 is a generally rectangular or square plate that includes one or more openings, such as openings 611, 612, and has one or more step portions therein.

In some embodiments, the side plate assembly 610 has a groove 613 at the bottom of the openings 611, 612. In the example of fig. 7, the side plate assembly 610 has a groove at the bottom of the opening 612 and a groove at the step portion 617 of the opening 612, and the side plate assembly 610 has a groove only at the bottom in the opening 611, but the step portion 618 has no groove. The recess of the skirt assembly 610 at the bottom of the opening 612 may be at the same height and aligned with the recess of the mounting bracket 213 from the chassis base 201. The grooves are used for fixing the radiating pipes of the radiating system, and the number of the grooves is determined according to the number of the radiating pipes of the radiating system.

Fasteners (e.g., screws) may be used to secure the side plate assembly 610 of the side plate 600 relative to the base plate 201, side plate 202, and side plate 203. For further reinforcement, a first set of fasteners 261, such as L-shaped fasteners, may also be used to further secure the side panel assembly 610 relative to the base panel 201.

Subsequently, as shown in fig. 8, a first set of heat dissipation modules of the heat dissipation system may be installed for dissipating heat to a first set of heat generating components (e.g., CPUs) of the computing device.

In some embodiments, the first set of thermal modules may include a first thermal module and a second thermal module. The first heat dissipation module may include a first heat dissipation element 321 and a first group of heat dissipation tubes 322, and the second heat dissipation module may include a second heat dissipation element 323 and a second group of heat dissipation tubes 324, and the first heat dissipation element 321 may be mounted on one CPU and the second heat dissipation element 323 may be mounted above another CPU. The first group of heat pipes 322 and the second group of heat pipes 324 may be located in grooves in the side panel assembly 610, i.e., at least a portion of the first group of heat pipes 322 and the second group of heat pipes 324 are located in grooves at the bottom of one opening (e.g., opening 612) of the side panel assembly 610.

In some embodiments, one or more clamping members 328 may be provided at the first group of radiating pipes 322 and/or the second group of radiating pipes 324, and the clamping members 328 are used to clamp the radiating pipes to prevent the radiating pipes from malfunctioning due to vibration.

It will be understood by those skilled in the art that only one of the first and second heat dissipation modules may be mounted when there is only one CPU on the motherboard, and that more heat dissipation modules may be mounted when there are more CPUs on the motherboard.

Subsequently, as shown in fig. 9, the member 215 is installed on the groove 218 of the mounting bracket 213, and the member 215 can compress the first and second groups of the radiating pipes 322 and 324 against the groove 218 of the mounting bracket 213, in the sense that the member 215 is also called a compressing member.

Next, as shown in fig. 10, a second set of support beams 222 may be mounted on the bracket 214, the side panel 202, and/or the side panel 203, and one or more communication cards, such as CAN cards 285, may be mounted on the second set of support beams 222. While the brackets 214 may be mounted on the first and/or second set of support beams. Then, as shown in FIG. 11, a third set of support beams 224 may be mounted on the bracket 214, side panel 202, and/or side panel 203.

Then, as shown in fig. 12, a second set of heat dissipation modules of the heat dissipation system is installed for dissipating heat to a second set of heat generating components (e.g., GPUs) of the computing device. For example, a board card (e.g., a graphics card) and a corresponding heat sink module may be mounted on the third set of support beams 224, and the heat sink module may dissipate heat from the second set of heat generating components (e.g., a GPU on the graphics card). When two graphic cards are mounted on the third group of support beams 224, two heat dissipation modules, i.e., a third heat dissipation module and a fourth heat dissipation module, may be mounted. The third heat dissipation module may include a third heat dissipation member 351 and a third group of heat dissipation pipes 352, the fourth heat dissipation module may include a fourth heat dissipation member 353 and a fourth group of heat dissipation pipes 354, the third heat dissipation member 351 may be mounted on the GPU of one graphics card, and the fourth heat dissipation member 353 may be located on the GPU of another graphics card. The third and fourth groups of radiating tubes 352 and 354 may be positioned in recesses in the side plate assembly 610 with at least a portion of the third and fourth groups of radiating tubes 352 and 354 being positioned in the recesses in the side plate assembly 610. Specifically, the third group of radiating tubes 352 are at least partially positioned in the grooves of the side plate assembly 610 at the bottom of the opening 611, and the fourth group of radiating tubes 354 are at least partially positioned in the grooves of the side plate assembly 610 at the step of the opening 612.

As shown in fig. 12, a plurality of brackets 217 may also be mounted on some of the first through third sets of support beams.

In some embodiments, one or more clamping members 266 may be provided at the third group of radiating pipes 352 and/or the fourth group of radiating pipes 354, and the clamping members 266 are used to clamp the radiating pipes to prevent the radiating pipes from malfunctioning due to vibration.

In some embodiments, the side panel assembly 610 may be further secured relative to the side panels 202, 203 and the third set of support beams 224 using, for example, L-shaped fasteners 262 (i.e., the second set of fasteners).

Although two second groups of heat generating elements are described above, one skilled in the art will appreciate that there may be more or fewer second groups of heat generating elements and that the number of second groups of heat dissipation modules of the heat dissipation system may be the same as the number of second groups of heat generating elements of the computing device.

Next, as shown in fig. 13A, the side plate assembly 620 and the side plate assembly 630 are installed. The side plate assembly 620 is generally in the shape of a flat plate. The side plate assembly 620 has a shape corresponding to a first portion of one opening (e.g., the opening 611) of the side plate assembly 610, e.g., a lower portion of the opening 611. The side plate assembly 620 also has one or more grooves in the bottom. The sideplate assembly 620 also has one or more grooves 624 in the top. Fasteners (e.g., screws) may be used to secure the side plate assembly 620 to the side plate assembly 610. In addition, when the side plate module 620 is mounted to the side plate module 610, the grooves of the bottom of the side plate module are aligned with the grooves of the bottom of the side plate module 610 at the opening 611, forming through-holes for passing the third group radiating pipe 352 and fixing the third group radiating pipe 352. In some embodiments, a shock absorbing pad is further disposed between the groove and the heat pipe.

The side plate assembly 630 is generally in the shape of a flat plate. The side plate assembly 630 has a shape corresponding to one opening (e.g., opening 612) of the side plate assembly 610. The side plate assembly 630 also has one or more grooves in the bottom. The side plate assembly 630 further includes a stepped portion, and the side plate assembly 630 has a groove at the stepped portion in addition to a groove at the bottom. Fasteners (e.g., screws) may be used to secure the side plate assembly 630 to the side plate assembly 610. In addition, when the side plate module 630 is mounted to the side plate module 610, the grooves formed in the bottom of the side plate module 630 are aligned with the grooves formed in the bottom of the opening 612 of the side plate module 610, form through-holes for the passage of the first and second groups of radiating pipes 322 and 324, and fix the first and second groups of radiating pipes 322 and 324. The grooves formed at the step of the side plate assembly 630 are aligned with the grooves formed at the step of the opening 612 of the side plate assembly 610 to form through holes for passing the fourth group radiating pipes 354 and fixing the fourth group radiating pipes 354. In some embodiments, a damping pad is further disposed between the groove and the radiating pipe.

As shown in fig. 13A, a fourth set of support beams 232 may also be mounted on the brackets 217, side panels 202, and/or side panels 203.

Fig. 13B shows that the respective side plate assemblies are fitted to each other, and the side plate assembly 620 and the side plate assembly 630 are fitted into the openings of the side plate assembly 610 as shown in fig. 13B and have shapes corresponding to the openings. And 6, installing a third group of heat dissipation modules of the heat dissipation system, wherein the third group of heat dissipation modules are used for dissipating heat of a third group of heating elements (such as GPU) of the computing device.

Next, as shown in fig. 14, a board card (e.g., a graphics card) and a corresponding heat dissipation module may be mounted on the fourth set of support beams 232, and the heat dissipation module may dissipate heat for the third set of heat generating elements (e.g., GPUs on the graphics card). When a graphic card is mounted on the fourth group support beam 232, a heat dissipation module, i.e., a fifth heat dissipation module, may be mounted. The fifth heat dissipation module may include a fifth heat dissipation member 357 and a fifth group of heat dissipation tubes 358, and the fifth heat dissipation member 357 may be mounted on the GPU of the graphic card. The fifth group of heat pipes 358 may be positioned in a recess in the top of the side plate assembly 620 with at least a portion of the fifth group of heat pipes 358 positioned in a recess in the top of the side plate assembly 620.

As shown in fig. 14, a network card 289 may be mounted on fourth set of support beams 232.

In some embodiments, one or more clamping members 359 may be provided on the fifth group of radiating pipes 358, and the clamping members 359 may be used to clamp the radiating pipes to prevent the radiating pipes from malfunctioning due to vibration.

Subsequently, as shown in fig. 15, a plurality of brackets 241 may be further installed on some of the first to fourth groups of support beams, and a fifth group of support beams 242 may be installed on the plurality of brackets 241, the side panel 202, and/or the side panel 203.

And a third set of securing members 263, for example L-shaped, may be secured to the side plate assembly 610 and/or the side plate assembly 620.

Next, as shown in FIG. 16, the side plate assembly 64 is installed. The side plate assembly 640 is generally in the shape of a flat plate. The side plate assembly 640 has a shape corresponding to a second portion of one opening (e.g., opening 611) of the side plate assembly 610, such as an upper portion of the opening 611. The side panel assembly 640 also has one or more grooves in the bottom.

Fasteners (e.g., screws) may be used to secure the side panel assembly 640 to the side panel assembly 610. In addition, when the side plate module 640 is mounted to the side plate module 610, the grooves formed at the bottom of the side plate module 640 are aligned with the grooves formed at the top of the side plate module 620, forming through-holes for passing the fifth group of radiating pipes, and fixing the fifth group of radiating pipes. In some embodiments, a damping pad is further disposed between the groove and the radiating pipe.

As shown in fig. 16, the flat plate 250 may be fixed to the fifth set of support beams 242 and the third set of fixing members 263, and the support members 252 are installed on the flat plate 250.

Meanwhile, a sixth set of support beams 243 may be mounted on the bracket 241, the flat plate 250, the side plate 202, and/or the side plate 203, and a sound card 288 may be mounted on the sixth set of support beams 243.

As shown in fig. 17, a power supply 700 is mounted on a flat plate 250 and clamped in two opposite directions by a holder 710 and a holder 730 and an insulating pad may be provided between the holder 710 and the holder 730 and the power supply, thereby preventing shaking of the power supply that may occur.

A fourth set of fasteners 265 may be attached to the side panel of the enclosure after the power source is attached to the plate 250 and the corresponding wiring is attached, as shown in fig. 18. The cover 204 and side panel 205 are then installed, and as shown in fig. 19, fasteners (e.g., screws) may be used to secure the cover 204 and side panel 205 through holes in the respective panels (bottom, side, and cover) of the chassis and/or fasteners (e.g., fifth set of fasteners 265). Side panel 205 may have various interfaces for connecting a computing device to peripheral devices, for example.

Fig. 20 is a structure of a cooling device 330 according to some embodiments of the invention. As shown in fig. 20, cooling device 330 includes a liquid tank 332, a pump 334, a pipeline 335, a heat sink row 336, and a fan pack 337. The liquid tank 332 stores the cooling liquid, and the pump 334 is mounted on the liquid tank 332 to pressurize the cooling liquid. The pipe 335 is connected between the liquid tank 332 and the radiating pipe. Specifically, the coolant pressurized by pump 334 sequentially enters the heat sink of computing device 100 through line 335 and the heat dissipation tubes. Computing device 100 may be, for example, the computing device shown in FIG. 1. The cooling fluid from the radiator element enters the fluid tank 332 through the radiator tube and line 335 in sequence.

In some embodiments, the heat dissipating tube 336 is connected between the second end of the heat dissipating tube 320 and the liquid tank 332 through a pipeline 335 to cool the cooling liquid. The fan set 337 is disposed on the heat dissipation row 336 to achieve a better cooling effect. Specifically, the fan assembly 337 may be, for example, a two-layer fan wall with the heat dissipation row 336 sandwiched therebetween. The arrangement of the fan set 337 and the heat dissipation row 336 can satisfy the heat dissipation requirement of high power to provide enough wind speed and amount to dissipate the heat of the cooling liquid. However, in some embodiments, the fan assembly 337 may also be a single layer or a multi-layer fan wall. The number and arrangement of the fans in the fan set 337 can also be adjusted according to the actual heat dissipation requirement, and the invention is not limited thereto.

In some embodiments, the pipe 335 is connected to the dispenser 340 through the quick connectors 350, and is connected to the radiating pipe through the dispenser 340. Specifically, the dispenser 340 diverts the coolant from the line 335 into the radiating pipe. The number of the pipes 335 may be, for example, less than or equal to the number of the radiating pipes by the arrangement of the dispenser 340.

In some embodiments, the pipelines 335 include a first pipeline 335A, a second pipeline 335B, a third pipeline 335C, and a fourth pipeline 335D. The first pipeline 335A is connected between the pump 334 and the heat pipe, the second pipeline 335B is connected between the heat pipe and the heat dissipation bank 336, the third pipeline 335C is connected between the heat dissipation bank 336 and the liquid tank 332, and the fourth pipeline 335D is connected between the liquid tank 332 and the pump 334. Specifically, the coolant from the liquid tank 332 is pressurized in the pump 334 to enter the radiating pipe through the first pipe 335A. Then, the cooling liquid radiates heat from the heat generating element through the heat radiating pipes and the heat radiating pieces, and enters the second pipeline 335B through the heat radiating pipes. The cooling fluid then passes through the heat dissipation row 336 via the second pipeline 335B and into the third pipeline 335C, wherein the heat dissipation row 336 and the fan set 337 further dissipate heat from the cooling fluid. The cooling fluid entering the third line 335C then flows back to the fluid tank 332 for circulation.

In the embodiment of the present invention, the first end of the radiating pipe is connected to the radiating pipe, and the second end of the radiating pipe is connected to the cooling device 330. The cooling liquid of the cooling device 330 dissipates heat of the heating element through the heat dissipation pipe and the heat dissipation member, so that the liquid cooling heat dissipation can be rapidly performed on the heating element, and the stable operation of the heating element is ensured.

In some embodiments, the heat pipe is, for example, a metal pipe, such as a copper pipe, or may be, for example, made of a non-metallic material that facilitates heat conduction. The line 335 may be a flexible hose, for example, so that the liquid tank 332, the pump 334, the heat sink 336 and the fan assembly 337 may be arranged at suitable relative positions with respect to the chassis according to actual needs.

In some embodiments, a radiator that does not require coolant may be used in place of the heat sink, in which case the liquid tank 332, pump 334, and line 335 in the cooling device 330 may be omitted, with the heat pipes connected directly to the heat sink drain 336 through the cabinet. That is, heat may be dissipated by transferring heat from the heat sink to the heat dissipation bank 336 through the heat dissipation pipe instead of using the cooling fluid.

Although exemplary embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it should be understood that the above exemplary discussion is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. Accordingly, the disclosed subject matter should not be limited to any single embodiment or example described herein, but rather construed in breadth and scope in accordance with the appended claims.

Claims (18)

1. A method of installing a computing device, comprising:

installing a mainboard of a computing device on a bottom plate of a chassis, wherein the mainboard is provided with a first group of heating elements;

mounting a first side plate assembly on a chassis floor, the first side plate assembly comprising at least a first opening, the first side plate assembly having one or more grooves at the bottom of the first opening;

a first group of radiating modules are arranged on the bottom plate of the machine case and used for radiating heat of the first group of heating elements, the first group of radiating modules comprise at least one group of radiating pipes, and at least parts of the radiating pipes are positioned in the grooves;

and installing a second side plate assembly in the first opening, wherein the bottom of the second side plate assembly is provided with a groove, and the groove at the bottom of the second side plate assembly is aligned with the groove at the bottom of the first opening of the first side plate assembly.

2. The method of claim 1, further comprising:

a plurality of groups of supporting beams are arranged above a chassis base plate and are fixed on the chassis through a support.

3. The method of claim 2, wherein the plurality of sets of support beams have different heights,

the method further comprises the following steps:

and mounting a storage device and one or more board cards on the plurality of groups of support beams.

4. The method of claim 3, wherein the board card comprises at least one of a video card, a network card, a sound card, and a CAN card.

5. The method of claim 1, further comprising:

a board card is arranged above the main board, a second group of heating elements are arranged on the board card,

and a second group of heat dissipation modules are arranged above the second group of heating elements and used for dissipating heat of the second group of heating elements.

6. The method of claim 5, wherein the first side plate assembly further comprises a second opening with one or more grooves at a bottom of the second opening, the first side plate assembly having a step in the first opening, the step having one or more grooves;

the second group of radiating modules comprise at least two radiating modules, each radiating module comprises at least one group of radiating pipes, and at least parts of the radiating pipes are positioned in the grooves at the bottom of the second opening and the grooves at the step parts of the first opening.

7. The method of claim 6, further comprising installing a third side panel assembly in the second opening, the third side panel assembly having a groove on a top thereof,

the method further comprises the following steps:

a board card is arranged above the second group of radiating modules, the board card is provided with a third group of heating elements,

and installing a third group of radiating modules above the third group of heating elements, wherein the third group of radiating modules comprise at least one group of radiating pipes, and at least part of the radiating pipes are positioned in the grooves at the top of the third side panel assembly.

8. The method of claim 5, wherein the second set of thermal modules is a predetermined distance from the first set of thermal modules.

9. The method of claim 5, wherein at least one board is mounted between the second set of thermal modules and the first set of thermal modules.

10. The method of claim 5, further comprising mounting a power supply above the second set of thermal modules.

11. A computing device, comprising:

the main board is arranged on the chassis bottom board and is provided with a first group of heating elements;

the first side plate assembly is arranged on a chassis bottom plate and comprises at least a first opening, and the bottom of the first opening of the first side plate assembly is provided with one or more grooves;

the first group of heat dissipation modules are used for dissipating heat of the first group of heating elements, the first group of heating elements comprise at least one group of heat dissipation pipes, and at least parts of the heat dissipation pipes are positioned in the grooves;

a second side plate assembly in the first opening, the second side plate assembly having a recess in a bottom thereof, the recess in the bottom of the second side plate assembly being aligned with the recess in the bottom of the first opening.

12. The computing device of claim 11, further comprising

A second group of heat-generating elements is provided,

and the second group of radiating modules on the second group of heating elements are used for radiating the second group of heating elements, and each second group of radiating modules comprises at least one group of radiating pipes.

13. The computing device of claim 12, wherein the first side-plate assembly further comprises a second opening with one or more grooves at a bottom of the second opening, the first side-plate assembly having a step in the first opening, the step having one or more grooves;

the second group of radiating modules comprise at least two radiating modules, each radiating module comprises at least one group of radiating pipes, and at least parts of the radiating pipes are positioned in the grooves at the bottom of the second opening and the grooves at the step parts of the first opening.

14. The computing device of claim 13, further comprising:

a third side panel assembly in the second opening, the third side panel assembly having a groove on a top thereof,

a third group of heat-generating elements,

and the third group of radiating modules are arranged above the third group of heating elements and comprise at least one group of radiating pipes, and at least parts of the radiating pipes are positioned in the grooves at the top of the third side plate assembly.

15. A computing device, comprising:

a chassis including a bottom plate, a plurality of side plates, at least one of the plurality of side plates having a plurality of through holes, and a cover plate;

the main board is fixed on the chassis bottom plate;

the multiple groups of support beams are fixed on the chassis through a support;

a plurality of elements fixed to the plurality of sets of support beams and connected to the main board;

a heat dissipation system for dissipating heat from at least one of the plurality of elements, the heat dissipation system including a heat dissipation tube that passes through the plurality of through-holes.

16. The computing device of claim 15, wherein the computing device,

wherein the at least one side panel comprises a first side panel assembly, a second side panel assembly, and a third side panel assembly,

wherein the first side plate assembly includes at least one opening, the first side plate assembly having a groove in the opening,

wherein the second and third side plate assemblies are positioned in the opening, the second and third side plate assemblies having a groove,

wherein the grooves of the first side plate assembly, the second side plate assembly, and the third side plate assembly form the plurality of through-holes.

17. The computing device of claim 15, wherein the computing device,

wherein the element comprises at least one of a video card, a sound card, a communication card, a power supply and a hard disk.

18. The computing device of claim 15, wherein the plurality of sets of support beams have different heights.

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