CN115360126A - Wafer photoresist removing machine and use method thereof - Google Patents
Wafer photoresist removing machine and use method thereof Download PDFInfo
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- CN115360126A CN115360126A CN202211266384.2A CN202211266384A CN115360126A CN 115360126 A CN115360126 A CN 115360126A CN 202211266384 A CN202211266384 A CN 202211266384A CN 115360126 A CN115360126 A CN 115360126A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of intelligent manufacturing, and discloses a wafer degumming machine and a using method thereof. The wafer is fixed through the compression ring and the inner rotating ring, the fixing part of the wafer is located on the conveying mechanism, when the conveying mechanism drives the wafer to switch and move, the wafer is always kept in a fixed state, so that the trouble of repeated fixing is avoided, the processing precision of wafer photoresist removing is improved, repeated dismounting and fixing are avoided, the photoresist removing quality is effectively guaranteed, repeated fixing operation is avoided, the processing precision is influenced, and the processing precision of the semiconductor wafer is further improved.
Description
Technical Field
The invention relates to the technical field of intelligent manufacturing, in particular to a wafer photoresist remover and a using method thereof.
Background
The wafer refers to a crystalline silicon wafer used for manufacturing a silicon semiconductor circuit, in the production and processing process of the silicon semiconductor circuit, the steps of gluing and removing the glue are usually included, in the intelligent processing technology, the glue is removed from the wafer in batches, during the glue removal, the wafer is placed in a glue remover in batches, and the glue removal operation is completed through the glue remover.
The existing degumming machine comprises an outer machine body, a clear water cleaning cabin, a reagent ultrasonic cleaning cabin, an ultrasonic rinsing cabin and a drying cabin, wherein a fixing part is arranged inside each cabin body, a conveying part is arranged outside the cleaning cabin, when wafers are conveyed, the wafers are usually required to be detached, then the wafers are conveyed to the next cleaning cabin through the conveying part, and then the wafers are fixed again, so that the degumming cleaning process needs to be fixed for multiple times, the process difficulty is increased, the degumming efficiency is reduced, the degumming efficiency needs to be fixed for multiple times, the fixing precision is easily influenced, the degumming quality of the wafers is influenced, and the preparation precision of silicon semiconductor circuits is influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a wafer photoresist remover and a use method thereof, which have the advantages of avoiding multiple fixing operations, improving photoresist removing efficiency, improving photoresist removing precision and ensuring wafer processing quality.
In order to achieve the purpose, the invention provides the following technical scheme: a wafer degumming machine and a using method thereof comprise a main track, wherein the main track is arranged at the tops of a plurality of cleaning cabins of the degumming machine, a hanging slide block is movably arranged at the bottom of the main track, a lifting mechanism is arranged at the bottom of the hanging slide block, a moving part of the lifting mechanism is fixedly connected with a conveying mechanism, and the conveying mechanism comprises a positioning component which is arranged to move along with the lifting mechanism. The lifting mechanism is used for controlling the wafer to enter or separate from the cleaning cabin, so that the wafer can be conveniently switched among different cleaning cabins. When the conveying mechanism drives the wafer to switch and move, the wafer is always kept in a fixed state, so that the trouble of repeated fixing is avoided.
Preferably, the main track is an annular track, the shape of the main track is matched with the distribution state of a plurality of cleaning cabins in the degumming machine, and the main track is used for driving the hanging slide block to be arranged above the top of the cleaning cabin in the degumming machine. The top of the main rail is provided with a plurality of hanging sliding blocks for driving different conveying mechanisms to move, and a plurality of cleaning cabins are convenient to synchronously carry out a photoresist removing process.
Preferably, elevating system includes that fixed connection erects the slide rail in the activity of hanging the slider bottom, and the outside swing joint that the slide rail was erect in the activity has a drive slider, and the location spout has been seted up to the outsourcing portion fixedly connected with backup pad of drive slider, the both sides that the slide rail was erect in the activity, the both sides fixedly connected with location slider of backup pad, location slider sliding connection is in the inside of location spout. Through location slider sliding connection in the spout of location, cooperation drive slider and activity erect the slide rail, effectively guarantee the stability of carrying the mechanism removal in-process.
Preferably, the conveying mechanism is fixedly connected to the outside of the supporting plate, the conveying mechanism comprises a cover plate fixedly connected with the supporting plate, the cover plate is matched with a plurality of cleaning cabin top openings of the degumming machine, a supporting block and a bottom fixing block are fixedly connected to the outside of the supporting plate, and the bottom fixing block is located below the supporting block. The bottom in the cleaning cabin is provided with a slot matched with the bottom fixing block and used for being matched with the bottom fixing block to keep the stability of the whole conveying mechanism and ensure the stability of the photoresist removing process.
Preferably, the positioning assembly is arranged between the cover plate and the supporting block and comprises a hydraulic pump fixedly connected to the top of the cover plate, a hydraulic rod is arranged at the top of the hydraulic pump, a top plate is fixedly connected to the top of the hydraulic rod, a positioning rod is fixedly connected to the bottom of the top plate, penetrates through the cover plate and is fixedly connected to the tail side of the bottom of the cover plate, and a pressing ring is fixedly connected to the positioning rod;
the positioning assembly further comprises an inner rotating ring arranged inside the supporting block, and an installation groove is formed in the inner side of the inner rotating ring.
Preferably, be provided with the sealing ring between locating lever and the apron, the clamping ring is located interior swivel becket directly over, the size shape adaptation of clamping ring and mounting groove, clamping ring are used for the joint in the inside of mounting groove.
Preferably, the conveying mechanism further comprises an adjusting assembly for adjusting the rotation of the wafer, the adjusting assembly comprises an adjusting motor fixedly connected to the top of the cover plate, a speed reducer is fixedly connected to the outside of the adjusting motor, a telescopic sleeve shaft is fixedly connected to the output end of the bottom of the speed reducer, the telescopic sleeve shaft is located at the bottom of the cover plate, a movable shaft is movably connected to the bottom of the telescopic sleeve shaft, and an adjusting wheel is fixedly connected to the outside of the movable shaft;
the adjusting assembly further comprises a positioning ring which is rotatably connected to the bottom of the pressing ring, a convex ring is fixedly connected to the top of the positioning ring, and the adjusting wheel is abutted to the side face of the convex ring.
Preferably, the positioning ring is clamped in the mounting groove of the inner rotating ring, and a limiting clamping groove and a limiting clamping block for radial limiting are arranged between the positioning ring and the inner rotating ring. When the positioning ring rotates, the positioning ring synchronously drives the inner rotating ring to rotate.
Preferably, the adjustment motor is used for driving the loose axle and rotates, and loose axle and clamping ring rotate to be connected, are provided with the axial between loose axle and the clamping ring spacing, regulating wheel swing joint is in the inside of clamping ring. When the clamping ring moves up and down under the action of the positioning rod, the clamping ring drives the movable shaft to slide in the telescopic sleeve shaft.
A use method of a wafer photoresist stripper is realized by the wafer photoresist stripper, and comprises the following steps:
s1, placing a wafer in a mounting groove, controlling a top plate to move downwards by a hydraulic pump through a hydraulic rod, controlling a positioning rod to move downwards by the top plate, controlling a pressing ring and a positioning ring to move downwards by the positioning rod, and extruding and fixing the wafer through the positioning ring and an inner rotating ring;
s2, controlling the hanging slide block to slide at the bottom of the main track, moving the hanging slide block to the position above a cleaning cabin arranged in the degumming machine, controlling the driving slide block to slide downwards outside the movable vertical slide rail, combining and sealing the cover plate and the top opening of the cleaning cabin, and simultaneously clamping the bottom fixing block at the inner bottom of the degumming machine cleaning cabin;
s3, starting an adjusting motor in the cleaning process, wherein the adjusting motor drives a movable shaft to rotate through a telescopic sleeve shaft, the movable shaft drives an adjusting wheel to rotate, the adjusting wheel drives a positioning ring to rotate through a convex ring, and the positioning ring drives an inner rotating ring to synchronously rotate so as to synchronously rotate the wafer;
s4, when the wafer is operated in a cleaning cabin in the degumming machine, the slide block is driven to drive the integral conveying mechanism to move upwards;
s5, when the wafer is separated from the cleaning cabin, the hanging slide block drives the conveying mechanism to move to the next cleaning process in sequence;
and S6, when the wafer is subjected to photoresist removing in the photoresist removing machine, controlling the hydraulic pump to drive the hydraulic rod to move upwards, so that the wafer is separated from being fixed, and the photoresist removing operation of the wafer is completed.
Has the advantages that:
1. according to the wafer degumming machine and the using method thereof, the wafer is fixed through the compression ring and the inner rotating ring, the fixed part of the wafer is located in the conveying mechanism, and when the conveying mechanism drives the wafer to switch and move, the wafer is always kept in a fixed state, so that the trouble of repeated fixing is avoided, the processing precision of wafer degumming is improved, repeated disassembly and fixing are avoided, the degumming quality is effectively guaranteed, the influence on the processing precision due to repeated fixing operation is avoided, and the processing precision of the semiconductor wafer is further improved.
2. According to the wafer degumming machine and the using method thereof, when the driving slide block drives the conveying mechanism to move downwards through the supporting plate, the positioning slide block is connected in the positioning sliding groove in a sliding manner and matched with the driving slide block and the movable vertical sliding rail, so that the stability of the conveying mechanism in the moving process is effectively ensured.
3. According to the wafer degumming machine and the use method thereof, the bottom fixing block is arranged, when the cover plate is combined with the top opening of the cleaning cabin, the bottom fixing block is inserted into the slot at the bottom in the cleaning cabin, and the stability of the whole conveying mechanism is kept through the bottom fixing block and the cover plate, so that the stable proceeding of a degumming process is ensured.
4. According to the wafer degumming machine and the using method thereof, the wafer is fixed through the positioning ring and the inner rotating ring in a pressing mode, the positioning ring is driven to rotate through the adjusting wheel in the cleaning process, the positioning ring synchronously drives the inner rotating ring to rotate through the limiting clamping groove and the limiting clamping block, and then the wafer synchronously rotates in the degumming process, so that the degumming effect is effectively improved, and the production and processing quality of a silicon semiconductor circuit is further ensured.
Drawings
FIG. 1 is a schematic view of the connection between a wafer moving mechanism and a main rail of a degumming machine according to the present invention;
FIG. 2 is a schematic connection diagram of the lifting mechanism and the conveying mechanism of the degumming machine according to the present invention;
FIG. 3 is a schematic side view of the lift mechanism and the carrying mechanism of the degumming machine according to the present invention;
FIG. 4 is a schematic view of a conveying mechanism according to the present invention;
FIG. 5 is a schematic view of a retaining ring of the present invention;
FIG. 6 is a schematic cross-sectional view of the compression ring, positioning ring and adjustment wheel connection of the present invention.
In the figure: 1. a main track; 2. hanging a sliding block; 3. a movable vertical slide rail; 31. positioning the chute; 4. driving the slide block; 5. a support plate; 51. positioning the sliding block; 6. a cover plate; 7. a hydraulic pump; 8. a hydraulic lever; 9. a top plate; 10. positioning a rod; 11. pressing a ring; 12. a positioning ring; 121. a convex ring; 13. a support block; 14. an inner rotating ring; 15. mounting grooves; 16. a bottom fixed block; 17. adjusting the motor; 18. a speed reducer; 19. a telescopic sleeve shaft; 20. a movable shaft; 21. and an adjusting wheel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1-4, a wafer degumming machine and a using method thereof comprise a main track 1, wherein the main track 1 is arranged at the tops of a plurality of cleaning cabins of the degumming machine, a hanging slide block 2 is movably arranged at the bottom of the main track 1, a lifting mechanism is arranged at the bottom of the hanging slide block 2, a moving part of the lifting mechanism is fixedly connected with a conveying mechanism, and the conveying mechanism comprises a positioning assembly which is arranged to move along with the conveying mechanism. The wafer is controlled to be switched among the cleaning cabins without passing through the hanging sliding block 2, and the lifting mechanism is used for controlling the wafer to enter or be separated from the cleaning cabins, so that the wafer can be conveniently switched among different cleaning cabins. When the carrying mechanism drives the wafer to switch and move, the wafer is always kept in a fixed state, so that the trouble of repeated fixation is avoided, the processing precision of wafer photoresist stripping is improved, repeated disassembly and fixation are avoided, the photoresist stripping quality is effectively guaranteed, the processing precision is prevented from being influenced by repeated fixing operation, and the processing precision of the semiconductor wafer is further improved.
The positioning assembly is arranged between the cover plate 6 and the supporting block 13 and comprises a hydraulic pump 7 fixedly connected to the top of the cover plate 6, a hydraulic rod 8 is arranged on the top of the hydraulic pump 7, the top of the hydraulic rod 8 is fixedly connected with a top plate 9, the bottom of the top plate 9 is fixedly connected with a positioning rod 10, and the positioning rod 10 penetrates through the cover plate 6 and is fixedly connected with a pressing ring 11 positioned on the tail side of the bottom of the cover plate 6;
the positioning component also comprises an inner rotating ring 14 arranged inside the supporting block 13, and the inner side of the inner rotating ring 14 is provided with a mounting groove 15.
When fixing the wafer, the wafer is placed in the mounting groove 15 of the inner rotating ring 14, the hydraulic pump 7 controls the hydraulic rod 8 to move downwards, the hydraulic rod 8 controls the pressing ring 11 to move downwards through the top plate 9 and the positioning rod 10, the wafer is fixed through the pressing ring 11 and the inner rotating ring 14, and the fixed part of the wafer is located on the conveying mechanism.
Wherein, be provided with the sealing ring between locating lever 10 and the apron 6, clamping ring 11 is located directly over interior rotating ring 14, the size shape adaptation of clamping ring 11 and mounting groove 15, and clamping ring 11 is used for the joint in the inside of mounting groove 15. When the top opening in apron 6 and washing cabin merges, be provided with the sealing ring between locating lever 10 and the apron 6 simultaneously, and then guarantee the inside leakproofness of washing cabin, guarantee to come to glue the cleaning performance.
The main track 1 is arranged to be an annular track, the shape of the main track 1 is matched with the distribution state of a plurality of cleaning cabins inside the degumming machine, and the main track 1 is used for driving the hanging slide block 2 to be arranged above the top of the cleaning cabin inside the degumming machine. The top of the main track 1 is provided with a plurality of hanging sliding blocks 2 for driving different conveying mechanisms to move, and the synchronous photoresist removing process of a plurality of cleaning cabins is convenient to carry out.
Wherein, elevating system includes that fixed connection erects slide rail 3 in the activity of hanging 2 bottoms of slider, and the outside swing joint that slide rail 3 was erected in the activity has drive slider 4, and drive slider 4's outsourcing portion fixedly connected with backup pad 5, and the location spout 31 has been seted up to the both sides that slide rail 3 was erected in the activity, and the both sides fixedly connected with location slider 51 of backup pad 5, location slider 51 sliding connection is in the inside of location spout 31. The drive slider 4 slides in the outside of the vertical slide rail 3 of activity, controls the drive slider 4 and moves down, and the drive slider 4 drives the transport mechanism through the backup pad 5 and moves down, and through location slider 51 sliding connection in the spout 31 of location, the cooperation drive slider 4 erects slide rail 3 with the activity, effectively guarantees the stability of transport mechanism removal in-process simultaneously.
The conveying mechanism is fixedly connected to the outside of the supporting plate 5, the conveying mechanism comprises a cover plate 6 fixedly connected with the supporting plate 5, the cover plate 6 is matched with a plurality of cleaning cabin top openings of the degumming machine, a supporting block 13 and a bottom fixing block 16 are fixedly connected to the outside of the supporting plate 5, the bottom fixing block 16 is located below the supporting block 13, and a slot matched with the bottom fixing block 16 is formed in the bottom of the cleaning cabin. The driving sliding block 4 is controlled to move downwards, the driving sliding block 4 drives the cover plate 6 and the bottom fixing block 16 to move downwards through the supporting plate 5, when the cover plate 6 is combined with a top opening of a cleaning cabin, the bottom fixing block 16 is inserted into a slot at the bottom in the cleaning cabin, the stability of the whole conveying mechanism is kept through the bottom fixing block 16 and the cover plate 6, and the stable glue removing process is guaranteed.
Example two
Referring to fig. 1 to 6, further based on the first embodiment, the conveying mechanism further includes an adjusting assembly for adjusting the rotation of the wafer, the adjusting assembly includes an adjusting motor 17 fixedly connected to the top of the cover plate 6, a reducer 18 is fixedly connected to the outside of the adjusting motor 17, a telescopic sleeve shaft 19 is fixedly connected to the bottom output end of the reducer 18, the telescopic sleeve shaft 19 is located at the bottom of the cover plate 6, a movable shaft 20 is movably connected to the bottom of the telescopic sleeve shaft 19, and an adjusting wheel 21 is fixedly connected to the outside of the movable shaft 20; when the adjustment is needed, the adjustment motor 17 drives the telescopic sleeve shaft 19 to rotate through the speed reducer 18, the telescopic sleeve shaft 19 drives the movable shaft 20 to rotate, and the movable shaft 20 drives the adjustment wheel 21 to rotate.
The adjusting assembly further comprises a positioning ring 12 rotatably connected to the bottom of the pressing ring 11, a convex ring 121 is fixedly connected to the top of the positioning ring 12, and the adjusting wheel 21 is abutted to the side face of the convex ring 121. When the adjusting wheel 21 rotates, the adjusting wheel 21 drives the protruding ring 121 to rotate, and the protruding ring 121 drives the positioning ring 12 to rotate.
The positioning ring 12 is clamped in the mounting groove 15 of the inner rotating ring 14, and a limiting clamping groove and a limiting clamping block for radial limiting are arranged between the positioning ring 12 and the inner rotating ring 14. As the retaining ring 12 rotates, the retaining ring 12 simultaneously rotates the inner rotating ring 14.
Wherein, adjusting motor 17 is used for driving loose axle 20 to rotate, and loose axle 20 rotates with clamping ring 11 to be connected, is provided with the axial between loose axle 20 and the clamping ring 11 spacing, and regulating wheel 21 swing joint is in the inside of clamping ring 11. When the press ring 11 moves up and down under the action of the positioning rod 10, the press ring 11 drives the movable shaft 20 to slide in the telescopic sleeve shaft 19.
The first embodiment is characterized in that the positioning ring 12 and the inner rotating ring 14 are used for compressing and fixing the wafer, the adjusting wheel 21 is used for driving the positioning ring 12 to rotate in the cleaning process, the positioning ring 12 synchronously drives the inner rotating ring 14 to rotate through the limiting clamping groove and the limiting clamping block, and the wafer synchronously rotates in the photoresist removing process, so that the photoresist removing effect is effectively improved, and the production and processing quality of the silicon semiconductor circuit is further ensured.
EXAMPLE III
Referring to fig. 1-6, a method for using a wafer photoresist stripper is implemented by the wafer photoresist stripper, which includes the steps of:
s1, a wafer is placed in a mounting groove 15, a hydraulic pump 7 controls a top plate 9 to move downwards through a hydraulic rod 8, the top plate 9 controls a locating rod 10 to move downwards, the locating rod 10 controls a pressing ring 11 and a locating ring 12 to move downwards, and the wafer is extruded and fixed through the locating ring 12 and an inner rotating ring 14;
s2, controlling the hanging slide block 2 to slide at the bottom of the main track 1, moving the hanging slide block 2 to the position above a cleaning cabin arranged in the degumming machine, controlling the driving slide block 4 to slide downwards outside the movable vertical slide rail 3, combining and sealing the cover plate 6 and the top opening of the cleaning cabin, and simultaneously clamping the bottom fixing block 16 at the inner bottom of the degumming machine cleaning cabin;
s3, starting the adjusting motor 17 in the cleaning process, wherein the adjusting motor 17 drives the movable shaft 20 to rotate through the telescopic sleeve shaft 19, the movable shaft 20 drives the adjusting wheel 21 to rotate, the adjusting wheel 21 drives the positioning ring 12 to rotate through the convex ring 121, and the positioning ring 12 drives the inner rotating ring 14 to synchronously rotate so as to synchronously rotate the wafer;
s4, when the wafer is operated in a cleaning cabin in the degumming machine, the slide block 4 is driven to drive the integral conveying mechanism to move upwards;
s5, when the wafer is separated from the cleaning cabin, the hanging slide block 2 drives the conveying mechanism to move to the next cleaning procedure in sequence;
and S6, when the wafer is subjected to photoresist removing in the photoresist removing machine, controlling the hydraulic pump 7 to drive the hydraulic rod 8 to move upwards to separate from the fixation of the wafer, and completing the photoresist removing operation of the wafer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a wafer degumming machine, includes main track (1), and main track (1) are installed in a plurality of cleaning cabin tops of degumming machine, its characterized in that: the utility model discloses a cleaning machine, including main track (1), elevating system, locating slide way (31), the both sides fixedly connected with location slider (51) of backup pad (5), location slider (51) sliding connection is in the inside of location spout (31), elevating system's movable part fixedly connected with transport mechanism, transport mechanism is including setting up the locating component who is used for following the removal including setting up and is used for moving, and the shape of main track (1) and a plurality of cleaning cabin distribution state adaptations of the inside of degumming machine, main track (1) are used for hanging slider (2) drive to the top of the inside cleaning cabin of degumming machine, elevating system includes that fixed connection erects slide rail (3) in the activity of hanging slider (2) bottom, and the outside swing joint of slide rail (3) is had drive slider (4) in the activity, and the outsourcing portion fixedly connected with backup pad (5) of drive slider (4), and the activity of slide rail (3) has seted up location spout (31) in the activity, and has location slider (51) sliding connection in the inside of location spout (31), and transport mechanism.
2. The wafer resist remover according to claim 1, wherein: the conveying mechanism is fixedly connected to the outer portion of the supporting plate (5), the conveying mechanism comprises a cover plate (6) fixedly connected with the supporting plate (5), the cover plate (6) is matched with a plurality of cleaning cabin top openings of the degumming machine, a supporting block (13) and a bottom fixing block (16) are fixedly connected to the outer portion of the supporting plate (5), and the bottom fixing block (16) is located below the supporting block (13).
3. The wafer resist remover according to claim 2, wherein: the positioning assembly is arranged between the cover plate (6) and the supporting block (13), the positioning assembly comprises a hydraulic pump (7) fixedly connected to the top of the cover plate (6), a hydraulic rod (8) is arranged on the top of the hydraulic pump (7), a top plate (9) is fixedly connected to the top of the hydraulic rod (8), a positioning rod (10) is fixedly connected to the bottom of the top plate (9), and the positioning rod (10) penetrates through the cover plate (6) and is located on the tail side of the bottom of the cover plate (6) and is fixedly connected with a pressing ring (11);
the positioning component also comprises an inner rotating ring (14) arranged in the supporting block (13), and the inner side of the inner rotating ring (14) is provided with a mounting groove (15).
4. The wafer resist remover according to claim 3, wherein: be provided with the sealing ring between locating lever (10) and apron (6), directly over clamping ring (11) were located interior rotating ring (14), the size shape adaptation of clamping ring (11) and mounting groove (15), clamping ring (11) were used for the joint in the inside of mounting groove (15).
5. The wafer resist remover according to claim 3, wherein: the conveying mechanism further comprises an adjusting assembly used for adjusting rotation of the wafer, the adjusting assembly comprises an adjusting motor (17) fixedly connected to the top of the cover plate (6), a speed reducer (18) is fixedly connected to the outside of the adjusting motor (17), a telescopic sleeve shaft (19) is fixedly connected to the output end of the bottom of the speed reducer (18), the telescopic sleeve shaft (19) is located at the bottom of the cover plate (6), a movable shaft (20) is movably connected to the bottom of the telescopic sleeve shaft (19), and an adjusting wheel (21) is fixedly connected to the outside of the movable shaft (20);
the adjusting assembly further comprises a positioning ring (12) which is rotatably connected to the bottom of the pressing ring (11), a convex ring (121) is fixedly connected to the top of the positioning ring (12), and the adjusting wheel (21) is abutted to the side face of the convex ring (121).
6. The wafer resist remover according to claim 5, wherein: the positioning ring (12) is clamped in a mounting groove (15) of the inner rotating ring (14), and a limiting clamping groove and a limiting clamping block for radial limiting are arranged between the positioning ring (12) and the inner rotating ring (14).
7. The wafer resist remover according to claim 5, wherein: adjusting motor (17) are used for driving loose axle (20) and rotate, and loose axle (20) and clamping ring (11) rotate to be connected, and it is spacing to be provided with the axial between loose axle (20) and clamping ring (11), regulating wheel (21) swing joint is in the inside of clamping ring (11).
8. A method for using a wafer photoresist stripper, which is implemented by the wafer photoresist stripper as claimed in any one of claims 1-9, characterized in that the method comprises the following steps:
s1, a wafer is placed in a mounting groove (15), a hydraulic pump (7) controls a top plate (9) to move downwards through a hydraulic rod (8), the top plate (9) controls a positioning rod (10) to move downwards, the positioning rod (10) controls a pressing ring (11) and a positioning ring (12) to move downwards, and the wafer is extruded and fixed through the positioning ring (12) and an inner rotating ring (14);
s2, controlling the hanging sliding block (2) to slide at the bottom of the main track (1), enabling the hanging sliding block (2) to move to the position above a cleaning cabin arranged in the degumming machine, controlling the driving sliding block (4) to slide downwards outside the movable vertical sliding rail (3), enabling the cover plate (6) and the top opening of the cleaning cabin to be combined and sealed, and meanwhile, clamping the bottom fixing block (16) at the inner bottom of the degumming machine cleaning cabin;
s3, starting the adjusting motor (17) in the cleaning process, wherein the adjusting motor (17) drives the movable shaft (20) to rotate through the telescopic sleeve shaft (19), the movable shaft (20) drives the adjusting wheel (21) to rotate, the adjusting wheel (21) drives the positioning ring (12) to rotate through the convex ring (121), and the positioning ring (12) drives the inner rotating ring (14) to synchronously rotate so as to synchronously rotate the wafer;
s4, when the wafer is operated in a cleaning cabin in the degumming machine, the slide block (4) is driven to drive the integral conveying mechanism to move upwards;
s5, when the wafer is separated from the cleaning cabin, the hanging slide block (2) drives the conveying mechanism to move to the next cleaning process in sequence;
and S6, when the wafer is subjected to photoresist removing in the photoresist removing machine, controlling the hydraulic pump (7) to drive the hydraulic rod (8) to move upwards, so that the wafer is separated from being fixed, and the photoresist removing operation of the wafer is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211266384.2A CN115360126B (en) | 2022-10-17 | 2022-10-17 | Wafer photoresist removing machine and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211266384.2A CN115360126B (en) | 2022-10-17 | 2022-10-17 | Wafer photoresist removing machine and use method thereof |
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| CN115360126A true CN115360126A (en) | 2022-11-18 |
| CN115360126B CN115360126B (en) | 2023-03-21 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208161987U (en) * | 2018-03-12 | 2018-11-30 | 南通尚明精密模具有限公司 | A kind of full-automatic resist remover of semiconductor packages |
| CN210379004U (en) * | 2019-10-11 | 2020-04-21 | 冠礼控制科技（上海）有限公司 | Double-power automatic wafer carrying mechanism |
| CN212161771U (en) * | 2020-01-13 | 2020-12-15 | 无锡市邑勉微电子有限公司 | Driving device of dry-method degumming machine |
| CN114472332A (en) * | 2022-01-21 | 2022-05-13 | 智程半导体设备科技(昆山)有限公司 | Soaking type photoresist removing, cleaning and drying integrated machine |
| CN216728405U (en) * | 2021-12-17 | 2022-06-14 | 昆山超瀚电子科技有限公司 | Automatic cleaning machine for wafer sticking ring |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208161987U (en) * | 2018-03-12 | 2018-11-30 | 南通尚明精密模具有限公司 | A kind of full-automatic resist remover of semiconductor packages |
| CN210379004U (en) * | 2019-10-11 | 2020-04-21 | 冠礼控制科技（上海）有限公司 | Double-power automatic wafer carrying mechanism |
| CN212161771U (en) * | 2020-01-13 | 2020-12-15 | 无锡市邑勉微电子有限公司 | Driving device of dry-method degumming machine |
| CN216728405U (en) * | 2021-12-17 | 2022-06-14 | 昆山超瀚电子科技有限公司 | Automatic cleaning machine for wafer sticking ring |
| CN114472332A (en) * | 2022-01-21 | 2022-05-13 | 智程半导体设备科技(昆山)有限公司 | Soaking type photoresist removing, cleaning and drying integrated machine |
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| CN115360126B (en) | 2023-03-21 |
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