CN115360108A - High-precision alignment method - Google Patents

High-precision alignment method Download PDF

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Publication number
CN115360108A
CN115360108A CN202211140112.8A CN202211140112A CN115360108A CN 115360108 A CN115360108 A CN 115360108A CN 202211140112 A CN202211140112 A CN 202211140112A CN 115360108 A CN115360108 A CN 115360108A
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Prior art keywords
downward
vision
visual
chip
looking
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Inventor
吴志海
尚明伟
王敕
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Suzhou Accuracy Assembly Automation Co Ltd
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Suzhou Accuracy Assembly Automation Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Wire Bonding (AREA)

Abstract

The invention discloses a high-precision alignment method, which comprises the following steps: s1, picking up a chip by a pick-up head, and turning over for 180 degrees; s2, the welding head sucks the chip from the pick-up head; s3, moving the welding head to the position above the calibration sheet along with the first downward-looking vision equipment and the second downward-looking vision equipment, and enabling the welding head to move horizontally to avoid the calibration sheet; s4, identifying the relative error between the visual center of the upward vision and the visual center of the downward vision; s5, relative errors between the mark points on the chip and the visual center of the first downward-looking visual equipment; s6, identifying relative errors between the mark points on the substrate and the vision center of the first downward-looking vision equipment; s7, calculating to obtain the distance between the mark point on the chip and the mark point on the substrate; s8, position compensation is carried out; and S9, high-precision bonding. Compared with the prior art, the method realizes the position calibration of the chip by utilizing the high-precision position sensor to be matched with a plurality of visual detection devices, and effectively improves the bonding precision.

Description

High-precision alignment method
Technical Field
The invention belongs to the field of chip bonding, and particularly relates to a high-precision alignment method.
Background
The flip chip welding equipment is mainly used for the flip chip welding process of manufacturing large-scale integrated circuit devices, and completes the direct interconnection and bonding of the chip and the substrate, so that the package has more excellent circuit characteristics of high frequency, low delay and low crosstalk, and the reliability of assembly and interconnection of circuits, parts or systems can be effectively improved.
When the chip is bonded, the bonded chip and the substrate are bonded together by pressure, thereby completing the flip chip bonding process of the chip. In the prior art, when the position of a chip is calculated and compensated through a plurality of visual detection devices (top view vision and bottom view vision), a plurality of mark points are required to be arranged on a calibration sheet, and different visual detection devices correspond to different mark points, so that the calculation of position compensation is complicated, the position compensation effect is influenced, and the bonding precision is further influenced.
Disclosure of Invention
The invention aims to: the high-precision alignment method is provided, the position calibration of the chip is realized by matching the high-precision position sensor with a plurality of visual detection devices, and the bonding precision is effectively improved.
In order to achieve the purpose, the invention adopts the following technical scheme: a high precision alignment method comprising the steps of:
s1, identifying the outline of a chip by a first visual detection assembly, moving a pickup head to the position above the chip, picking up the chip downwards, and turning the chip 180 degrees after rising;
s2, the welding head sucks the chip from the pick-up head, and marks points on the chip
Figure DEST_PATH_IMAGE001
Marking points
Figure 158734DEST_PATH_IMAGE002
The direction is downward;
s3, moving the welding head to the position above the calibration sheet along with the first downward-looking vision equipment and the second downward-looking vision equipment, and enabling the welding head to move horizontally to avoid the calibration sheet;
s4, setting mark points on the calibration sheet
Figure DEST_PATH_IMAGE003
、
Figure 339179DEST_PATH_IMAGE004
First-glance vision equipment identification mark point
Figure 938788DEST_PATH_IMAGE003
Second downward vision equipment identification mark point
Figure 546487DEST_PATH_IMAGE004
A first upper visual device and a second upper visual device are arranged below the calibration sheet, and the first upper visual device identifies the mark points
Figure 864336DEST_PATH_IMAGE003
Second upward-looking vision equipment identification mark point
Figure 832160DEST_PATH_IMAGE004
Obtaining the relative error between the visual center of the first downward-looking visual equipment and the visual center of the first upward-looking visual equipment
Figure DEST_PATH_IMAGE005
And the visual center of the second downward vision equipment is aligned with the visual center of the second downward vision equipment
Figure 286276DEST_PATH_IMAGE006
At the moment, a high-precision position sensor on the second downward-looking vision equipment records first position data of the welding head, wherein the first position data comprises the position of the welding head in the XYZ direction;
s5, the calibration sheet moves horizontally to avoid, and meanwhile, the welding head moves horizontally, so that the chip moves to the position above the first upward-looking vision equipment and the second upward-looking vision equipment, and the first upward-looking vision equipment identifies mark points
Figure 330455DEST_PATH_IMAGE001
Marking points for second upward vision equipment identification
Figure 870021DEST_PATH_IMAGE002
To obtain a mark point
Figure 657848DEST_PATH_IMAGE001
Relative error with the visual center of the first upward-looking visual device
Figure DEST_PATH_IMAGE007
And a marking point
Figure 215737DEST_PATH_IMAGE002
Relative error with the visual center of the second upward-looking visual equipment
Figure 430818DEST_PATH_IMAGE008
Thereby calculating to obtain the mark point
Figure 192101DEST_PATH_IMAGE001
Relative error to the visual center of the first downward-looking vision device
Figure DEST_PATH_IMAGE009
And a marking point
Figure 518040DEST_PATH_IMAGE002
Relative error with the visual center of the second downward viewing vision device
Figure 946747DEST_PATH_IMAGE010
；
S6, the welding head moves to the position above the substrate along with the first downward vision equipment and the second downward vision equipment, then the welding head moves horizontally to give way, and the first downward vision equipment identifies the mark points on the substrate
Figure DEST_PATH_IMAGE011
The second downward vision equipment identifies the mark point on the substrate
Figure 316417DEST_PATH_IMAGE012
To obtain a mark point
Figure 96155DEST_PATH_IMAGE011
Relative error to the visual center of the first downward-looking vision device
Figure DEST_PATH_IMAGE013
And a marking point
Figure 694626DEST_PATH_IMAGE012
Relative error with the visual center of the second downward viewing vision device
Figure 977840DEST_PATH_IMAGE014
；
S7, the welding head moves to the position above the substrate, at the moment, a high-precision position sensor on second downward-looking vision equipment records second position data of the welding head, and the second position data are recorded according to relative errors
Figure 783991DEST_PATH_IMAGE009
And relative error
Figure 785445DEST_PATH_IMAGE013
Calculating mark points
Figure 453187DEST_PATH_IMAGE001
And mark points
Figure 590907DEST_PATH_IMAGE011
Of (2) is
Figure DEST_PATH_IMAGE015
According to the relative error
Figure 318691DEST_PATH_IMAGE010
And relative error
Figure 807442DEST_PATH_IMAGE014
Calculating mark points
Figure 528142DEST_PATH_IMAGE002
And mark points
Figure 785948DEST_PATH_IMAGE012
Of (2) is
Figure 950213DEST_PATH_IMAGE016
；
S8, welding heads are used for calculating the distance
Figure 395101DEST_PATH_IMAGE015
And a distance
Figure 670224DEST_PATH_IMAGE016
Carrying out XY motion to realize position compensation;
and S9, after the chip is aligned to the substrate, descending the welding head along the Z axis to bond the chip and the substrate.
As a further description of the above technical solution:
in step S4, the welding head descends along the Z axis along with the first downward vision equipment and the second downward vision equipment, so that the chip below the welding head and the calibration sheet are positioned at the same height, and then the relative error is identified
Figure 48116DEST_PATH_IMAGE005
、
Figure 117703DEST_PATH_IMAGE006
。
As a further description of the above technical solution:
in step S7, the pitch is calculated
Figure 564734DEST_PATH_IMAGE015
And spacing of
Figure 377969DEST_PATH_IMAGE016
Before, the position offset of the welding head is calculated according to the first position data and the second position data, and the welding head carries out height compensation and XY position compensation according to the position offset.
As a further description of the above technical solution:
in step S5, the relative error
Figure 610367DEST_PATH_IMAGE009
Is calculated by the formula
Figure DEST_PATH_IMAGE017
。
As a further description of the above technical solution:
in step (b)In step S7, pitch
Figure 585276DEST_PATH_IMAGE015
Is calculated by the formula
Figure 535915DEST_PATH_IMAGE018
。
As a further description of the above technical solution:
in step S5, the relative error
Figure 136529DEST_PATH_IMAGE010
Is calculated by the formula
Figure DEST_PATH_IMAGE019
。
As a further description of the above technical solution:
in step S7, pitch
Figure 957855DEST_PATH_IMAGE016
Is calculated by the formula
Figure 634824DEST_PATH_IMAGE020
。
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. in the chip bonding process, because the high-precision position sensor can detect errors generated by movement of the welding head so as to compensate, when the upper vision and the lower vision realize the calibration of the chip position by using the calibration sheet, the relative errors between the vision center of the upper vision and the vision center of the lower vision are calculated by using the same mark point on the calibration sheet for the opposite upper vision and the lower vision, then the relative errors between the mark point on the chip and the vision center of the first upper vision equipment are identified so as to obtain the relative errors between the mark point on the chip and the vision center of the first lower vision equipment, then the relative errors between the mark point on the substrate and the vision center of the first lower vision equipment are identified, and finally the distance between the mark point on the chip and the mark point on the substrate is calculated so as to carry out the position compensation and realize the high-precision bonding.
2. According to the invention, the number of the marking points on the calibration sheet can be effectively reduced, the calculation of position compensation is simplified, and the bonding precision is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic diagram of step S3 in a high-precision alignment method.
Fig. 2 is a schematic diagram of step S4 in a high-precision alignment method.
Fig. 3 is a schematic diagram of step S5 in a high-precision alignment method.
Fig. 4 is a schematic diagram of step S6 in a high-precision alignment method.
Fig. 5 is a schematic diagram of step S7 in a high-precision alignment method.
Fig. 6 is a schematic diagram of step S9 in a high-precision alignment method.
Illustration of the drawings:
1. a chip; 2. a welding head; 3. calibrating the sheet; 4. a substrate; 5. high accuracy position sensor.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a high precision alignment method comprising the steps of:
s1, identifying the outline of a chip 1 by a first visual detection assembly, moving a pickup head to the position above the chip 1, picking up the chip 1 downwards, and turning the chip 1 for 180 degrees after rising;
s2, the welding head 2 sucks the chip 1 from the pick-up head, and marks are arranged on the chip 1
Figure 807179DEST_PATH_IMAGE001
Marking point
Figure 962217DEST_PATH_IMAGE002
The direction is downward;
s3, the welding head 2 moves above the calibration sheet 3 along with the first downward-looking vision equipment and the second downward-looking vision equipment, and the welding head 2 moves horizontally to avoid the calibration sheet 3;
s4, setting mark points on the calibration sheet 3
Figure 169208DEST_PATH_IMAGE003
、
Figure 735187DEST_PATH_IMAGE004
First-glance vision equipment identification mark point
Figure 394838DEST_PATH_IMAGE003
Second downward vision equipment identification mark point
Figure 353567DEST_PATH_IMAGE004
A first upward-looking vision device and a second upward-looking vision device are arranged below the calibration sheet 3, and the first upward-looking vision device identifies mark points
Figure 149485DEST_PATH_IMAGE003
Second upward-viewing vision equipmentIdentification mark point
Figure 168256DEST_PATH_IMAGE004
Obtaining the relative error between the visual center of the first downward-looking visual equipment and the visual center of the first upward-looking visual equipment
Figure 49625DEST_PATH_IMAGE005
And the visual center of the second downward vision equipment is aligned with the visual center of the second downward vision equipment
Figure 795733DEST_PATH_IMAGE006
At this time, the high-precision position sensor 5 on the second downward-looking vision equipment records first position data of the welding head 2, wherein the first position data comprises the position of the welding head 2 in the XYZ direction;
s5, the calibration sheet 3 moves horizontally to avoid, and meanwhile, the welding head 2 moves horizontally, so that the chip 1 moves to the positions above the first upper vision equipment and the second upper vision equipment (the position of the original calibration sheet 3), and the first upper vision equipment identifies the mark points
Figure 711736DEST_PATH_IMAGE001
Second top view visual equipment identification mark point
Figure 901409DEST_PATH_IMAGE002
To obtain a mark point
Figure 535653DEST_PATH_IMAGE001
Relative error with the visual center of the first upward-looking visual device
Figure 570605DEST_PATH_IMAGE007
And a marking point
Figure 341115DEST_PATH_IMAGE002
Relative error with the visual center of the second upward-looking visual equipment
Figure 701689DEST_PATH_IMAGE008
Thereby calculating to obtain a mark point
Figure 642855DEST_PATH_IMAGE001
Relative error with the visual center of the first downward-looking visual device
Figure 481498DEST_PATH_IMAGE009
And a marking point
Figure 106514DEST_PATH_IMAGE002
Relative error with the visual center of the second downward viewing vision device
Figure 637989DEST_PATH_IMAGE010
；
S6, the welding head 2 moves to the position above the substrate 4 along with the first downward vision equipment and the second downward vision equipment, then the welding head 2 moves horizontally to give way, and the first downward vision equipment identifies the mark points on the substrate 4
Figure 981246DEST_PATH_IMAGE011
The second downward vision equipment identifies the mark points on the substrate 4
Figure 889159DEST_PATH_IMAGE012
To obtain a mark point
Figure 883529DEST_PATH_IMAGE011
Relative error with the visual center of the first downward-looking visual device
Figure 585906DEST_PATH_IMAGE013
And a marking point
Figure 416458DEST_PATH_IMAGE012
Relative error with the visual center of the second downward viewing vision device
Figure 596904DEST_PATH_IMAGE014
；
S7, the welding head 2 moves to the position above the substrate 4, at the moment, a high-precision position sensor 5 on a second downward-looking vision device records second position data of the welding head 2, the second position data are the same as the first position data,including XYZ-direction position of the welding head, according to relative error
Figure 196513DEST_PATH_IMAGE009
And relative error
Figure 69791DEST_PATH_IMAGE013
Calculating mark points
Figure 387640DEST_PATH_IMAGE001
And mark points
Figure 621044DEST_PATH_IMAGE011
Of (2) is
Figure 340738DEST_PATH_IMAGE015
According to the relative error
Figure 384917DEST_PATH_IMAGE010
And relative error
Figure 190062DEST_PATH_IMAGE014
Calculating mark points
Figure 977890DEST_PATH_IMAGE002
And mark point
Figure 286511DEST_PATH_IMAGE012
Of (2) is
Figure 501592DEST_PATH_IMAGE016
；
S8, arranging a high-precision motion table on the back of the welding head 2, and enabling the welding head 2 to work according to the calculated distance
Figure 777721DEST_PATH_IMAGE015
And a distance
Figure 369240DEST_PATH_IMAGE016
Carrying out XY motion to realize position compensation;
and S9, after the chip 1 is aligned to the substrate 4, the welding head 2 descends along the Z axis, and the chip 1 and the substrate 4 are bonded.
In step S4, the bonding tool 2 descends along the Z axis along with the first downward-looking vision device and the second downward-looking vision device, so that the chip 1 and the calibration sheet 3 below the bonding tool 2 are located at the same height, and then the relative error is identified
Figure 797947DEST_PATH_IMAGE005
、
Figure 183929DEST_PATH_IMAGE006
。
In step S7, the pitch is calculated
Figure 963666DEST_PATH_IMAGE015
And a distance
Figure 93296DEST_PATH_IMAGE016
Before, the position offset of the welding head 2 is calculated according to the first position data and the second position data, the welding head 2 carries out height compensation and XY position compensation according to the position offset, and the position offset of the welding head 2 caused by movement is avoided, so that the distance is ensured
Figure 110931DEST_PATH_IMAGE015
And spacing of
Figure 182661DEST_PATH_IMAGE016
And the accuracy of calculation is ensured, and further the position compensation effect and the bonding precision are ensured.
In calculating relative error
Figure 184115DEST_PATH_IMAGE009
And a distance between
Figure 851857DEST_PATH_IMAGE015
Relative error of
Figure 255156DEST_PATH_IMAGE010
And a distance
Figure 248520DEST_PATH_IMAGE016
When considering twoThere is a possibility that the group visual center positions are opposite in direction, and the relative error calculation is superimposed and subtracted. Therefore, the default relative position is calculated by using the visual center as the reference point for calculation, so that the direction problem is converted into a positive value and a negative value, and the difference is only needed during calculation. Therefore, the specific calculation formula is as follows:
in step S5, the relative error
Figure 471691DEST_PATH_IMAGE009
Is calculated by the formula
Figure 208703DEST_PATH_IMAGE017
。
In step S7, pitch
Figure 466509DEST_PATH_IMAGE015
Is calculated by the formula
Figure 348883DEST_PATH_IMAGE018
。
In step S5, the relative error
Figure 324929DEST_PATH_IMAGE010
Is calculated by the formula
Figure 600053DEST_PATH_IMAGE019
。
In step S7, pitch
Figure 712365DEST_PATH_IMAGE016
Is calculated by the formula
Figure 47532DEST_PATH_IMAGE020
。
The mark points on the calibration sheet 3 are photoetching points, and the precision is nano-scale.
The working principle is as follows: in the chip bonding process, because the high-precision position sensor can detect errors generated by movement of the welding head so as to compensate, when the upper vision and the lower vision realize the calibration of the chip position by using the calibration sheet, the relative errors between the vision center of the upper vision and the vision center of the lower vision are calculated by using the same mark point on the calibration sheet for the opposite upper vision and the lower vision, then the relative errors between the mark point on the chip and the vision center of the first upper vision equipment are identified, the relative errors between the mark point on the chip and the vision center of the first lower vision equipment are obtained, then the relative errors between the mark point on the substrate and the vision center of the first lower vision equipment are identified, and finally the distance between the mark point on the chip and the mark point on the substrate is calculated, so that the position compensation is carried out, and the high-precision bonding is realized. During calibration, the number of the marking points on the calibration sheet can be effectively reduced, the calculation of position compensation is simplified, and the bonding precision is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (7)

1. A high precision alignment method, comprising the steps of:
s1, identifying the outline of a chip (1) by a first visual detection assembly, moving a pickup head to the position above the chip (1), picking up the chip (1) downwards, and turning the chip (1) for 180 degrees after rising;
s2, the welding head (2) sucks the chip (1) from the pick-up head, and mark points on the chip (1)
Figure 418499DEST_PATH_IMAGE001
Marking points
Figure 132377DEST_PATH_IMAGE002
The direction is downward;
s3, the welding head (2) moves above the calibration sheet (3) along with the first downward-looking vision equipment and the second downward-looking vision equipment, and the welding head (2) moves horizontally to avoid the calibration sheet (3);
s4, the calibration sheet (3) is provided with mark points
Figure 443273DEST_PATH_IMAGE003
、
Figure 369641DEST_PATH_IMAGE004
First-look-down visual equipment identification mark point
Figure 715171DEST_PATH_IMAGE003
Second downward vision equipment identification mark point
Figure 68792DEST_PATH_IMAGE004
A first upper vision device and a second upper vision device are arranged below the calibration sheet (3), and the first upper vision device identifies mark points
Figure 70246DEST_PATH_IMAGE003
Second upward-looking vision equipment identification mark point
Figure 301770DEST_PATH_IMAGE004
Obtaining the relative error between the visual center of the first downward-looking visual equipment and the visual center of the first upward-looking visual equipment
Figure 767386DEST_PATH_IMAGE005
And the visual center of the second downward vision equipment is aligned with the visual center of the second downward vision equipment
Figure 291908DEST_PATH_IMAGE006
A high-precision position sensor (5) on a second downward-looking vision device records first position data of the welding head (2), wherein the first position data comprises the position of the welding head (2) in the XYZ direction;
s5, the calibration sheet (3) moves horizontally to avoid, and meanwhile, the welding head (2) moves horizontally, so that the chip (1) moves to the first positionThe first upward-looking vision equipment identifies the mark point above the visual vision equipment and the second upward-looking vision equipment
Figure 780659DEST_PATH_IMAGE001
Second top view visual equipment identification mark point
Figure 48829DEST_PATH_IMAGE002
To obtain a mark point
Figure 368952DEST_PATH_IMAGE001
Relative error with the visual center of the first upward-looking visual device
Figure 533217DEST_PATH_IMAGE007
And a marking point
Figure 306001DEST_PATH_IMAGE002
Relative error with the visual center of the second upward-looking visual equipment
Figure 377862DEST_PATH_IMAGE008
Thereby calculating to obtain a mark point
Figure 552491DEST_PATH_IMAGE001
Relative error with the visual center of the first downward-looking visual device
Figure 622079DEST_PATH_IMAGE009
And a marking point
Figure 383623DEST_PATH_IMAGE002
Relative error with the visual center of the second downward viewing vision device
Figure 259176DEST_PATH_IMAGE010
；
S6, the welding head (2) moves to the position above the substrate (4) along with the first downward vision equipment and the second downward vision equipment, and then the welding is carried outThe head (2) moves horizontally to give way, and the first downward-looking vision equipment identifies the mark point on the substrate (4)
Figure 288311DEST_PATH_IMAGE011
The second downward vision equipment identifies the mark points on the substrate (4)
Figure 794379DEST_PATH_IMAGE012
To obtain a mark point
Figure 541755DEST_PATH_IMAGE011
Relative error with the visual center of the first downward-looking visual device
Figure 955419DEST_PATH_IMAGE013
And a marking point
Figure 42324DEST_PATH_IMAGE012
Relative error with the visual center of the second downward viewing vision device
Figure 516030DEST_PATH_IMAGE014
；
S7, the welding head (2) moves to the position above the substrate (4), at the moment, a high-precision position sensor (5) on second downward-looking vision equipment records second position data of the welding head (2), and according to relative errors, second position data of the welding head (2) are recorded
Figure 750703DEST_PATH_IMAGE009
And relative error
Figure 702478DEST_PATH_IMAGE013
Calculating mark points
Figure 909469DEST_PATH_IMAGE001
And mark points
Figure 321121DEST_PATH_IMAGE011
Of (2) is
Figure 777510DEST_PATH_IMAGE015
According to the relative error
Figure 532976DEST_PATH_IMAGE010
And relative error
Figure 328894DEST_PATH_IMAGE014
Calculating mark points
Figure 144403DEST_PATH_IMAGE002
And mark points
Figure 88088DEST_PATH_IMAGE012
Of (2) is
Figure 912825DEST_PATH_IMAGE016
；
S8, the welding heads (2) calculate the distance
Figure 625566DEST_PATH_IMAGE015
And a distance
Figure 549660DEST_PATH_IMAGE016
Carrying out XY motion to realize position compensation;
and S9, after the chip (1) is aligned to the substrate (4), the welding head (2) descends along the Z axis, and the chip (1) and the substrate (4) are bonded.
2. A high precision alignment method according to claim 1, characterized in that in step S4, the bonding head (2) is lowered along the Z axis with a first downward vision device and a second downward vision device, so that the chip (1) and the calibration sheet (3) are located at the same height under the bonding head (2), and then the relative error is identified
Figure 980641DEST_PATH_IMAGE005
、
Figure 844954DEST_PATH_IMAGE006
。
3. A high accuracy alignment method as claimed in claim 2 wherein, in said step S7, the pitch is calculated
Figure 677781DEST_PATH_IMAGE015
And spacing of
Figure 772776DEST_PATH_IMAGE016
Before, the position offset of the welding head (2) is calculated according to the first position data and the second position data, and the welding head (2) carries out height compensation and XY position compensation according to the position offset.
4. A high precision alignment method as claimed in claim 3, wherein in said step S5, relative error is determined
Figure 956632DEST_PATH_IMAGE009
Is calculated by the formula
Figure 857592DEST_PATH_IMAGE017
。
5. A high precision alignment method as claimed in claim 4, wherein in said step S7, the pitch
Figure 482609DEST_PATH_IMAGE015
Is calculated by the formula
Figure 810822DEST_PATH_IMAGE018
。
6. The method of claim 3A high-precision alignment method, wherein in said step S5, a relative error is determined
Figure 216395DEST_PATH_IMAGE010
Is calculated by the formula
Figure 921046DEST_PATH_IMAGE019
。
7. A high accuracy alignment method in accordance with claim 6 wherein in said step S7, the pitch
Figure 666148DEST_PATH_IMAGE016
Is calculated by the formula
Figure 430842DEST_PATH_IMAGE020
。
CN202211140112.8A 2022-09-20 2022-09-20 High-precision alignment method Pending CN115360108A (en)

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