CN115338502A

CN115338502A - Automatic PCB assembling system

Info

Publication number: CN115338502A
Application number: CN202211042555.3A
Authority: CN
Inventors: 李玉琼; 周强; 彭吉利
Original assignee: Shenzhen Xfanic Technology Co Ltd
Current assignee: Shenzhen Xfanic Technology Co Ltd
Priority date: 2022-08-29
Filing date: 2022-08-29
Publication date: 2022-11-15
Anticipated expiration: 2042-08-29
Also published as: CN115338502B

Abstract

The invention discloses an automatic assembly system of a PCB, which comprises: the device comprises a rack, a feeding device, a Harper welding device, a tin soldering device, a dispensing device and a curing device. When the PCB to be assembled is placed on the feeding device, the Harper welding treatment, the tin soldering treatment, the dispensing treatment and the curing can be automatically carried out, the assembled PCB is obtained, and the working efficiency and the quality control are improved.

Description

Automatic PCB assembling system

Technical Field

The invention relates to the technical field of mechanical automation, in particular to an automatic PCB assembling system.

Background

A Printed Circuit Board (PCB) is a support for electronic components. The PCB preparation comprises a plurality of links of plug-in, welding, pin reduction, inspection and finishing. If the wire is adopted to weld the PCB, the welding link can also specifically comprise the steps of welding a Bama, welding a tinplate, dispensing, curing and the like.

At present, the welding process needs manual operation, and because the PCB is provided with a plurality of components, a large amount of time needs to be spent at this stage, the production efficiency is low, and the labor cost is high. Meanwhile, manual operation has extremely high instability, so that the quality stability of the produced PCB is low, and the quality control difficulty is high.

Disclosure of Invention

The invention aims to solve the technical problems that the assembly efficiency of a PCB is low and the prior art is insufficient, and provides an automatic assembly system of the PCB.

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

an automated PCB assembly system, the system comprising:

the PCB automatic assembly system comprises a rack, a feeding device, a Harper welding device, a soldering device, a dispensing device and a curing device;

the Harper welding device comprises a Harper welding bracket, a Harper welding moving mechanism arranged on the Harper welding bracket and a Harper welding head fixedly connected with the Harper welding moving mechanism, wherein the Harper welding moving mechanism drives the Harper welding head to move;

the soldering device comprises a soldering support, a soldering moving mechanism arranged on the soldering support and a soldering head fixedly connected with the soldering moving mechanism, and the soldering moving mechanism drives the soldering head to move;

the glue dispensing device comprises a glue dispensing support, a glue dispensing moving mechanism arranged on the glue dispensing support, and a glue dispensing head fixedly connected with the glue dispensing moving mechanism, and the glue dispensing moving mechanism drives the glue dispensing head to move;

the curing device comprises a curing bracket and a curing lamp fixedly connected with the curing bracket;

the Harper welding device, the soldering device, the glue dispensing device and the curing device are all arranged on the rack and positioned beside the feeding device and are sequentially arranged along the extension direction of the feeding track;

when the feeding device transmits the PCB to be assembled, the Harper welding device performs Harper welding on the PCB, the soldering device performs soldering on the PCB, the glue dispensing device performs glue dispensing on the PCB, and the curing device cures the PCB to obtain the assembled PCB.

The PCB automatic assembly system is characterized in that the rack comprises a plurality of fixed bases and a machine cover, and the feeding device, the Harba welding device, the soldering device and the dispensing device are arranged on the fixed bases;

the hood is located the unable adjustment base top and be used for holding haba welding device, soldering device, adhesive deposite device and/or solidification equipment.

The PCB automatic assembly system is characterized in that the feeding device comprises a Harper welding transmission rail, a tin welding transmission rail and a dispensing transmission rail;

the input end of the Harper welding transmission track is arranged at the first end part of the fixed base;

the input end of the soldering transmission track is adjacent to the output end of the Harba welding transmission track;

the input end of the dispensing transmission rail is adjacent to the output end of the soldering transmission rail;

the output end of the dispensing transmission track is arranged at the second end part of the fixed base.

The PCB automatic assembly system is characterized in that the Harper welding device comprises a positive Harper welding module and a reverse Harper welding module;

the positive Harper welding module is arranged on the fixed base, and the reverse Harper welding module is arranged in the fixed base;

the positive Harper welding module comprises a first support, a first moving mechanism and a first welding head, wherein the first support is arranged on the surface of the fixed base and located beside the feeding device, the first moving mechanism is arranged on the first support, the first welding head is fixedly connected with the first moving mechanism and faces the surface of the fixed base, and the first moving mechanism drives the first welding head to move;

the anti-Harper welding module comprises a second support arranged in the fixed base, a second moving mechanism arranged on the second support, and a second welding head fixedly connected with the second moving mechanism and facing the surface of the fixed base, wherein the second moving mechanism drives the second welding head to move.

The PCB automatic assembly system is characterized in that the first moving mechanism comprises a first left-right moving module for driving the first welding head to move left and right, a first front-back moving module for driving the first welding head to move front and back, and a first up-down moving module for driving the first welding head to move up and down;

the second moving mechanism comprises a second left-right moving module for driving the second welding head to move left and right, a second front-back moving module for driving the second welding head to move front and back, and a second up-down moving module for driving the second welding head to move up and down.

The PCB automatic assembly system is characterized in that the soldering moving mechanism comprises a third front-and-back moving module which is fixedly connected with the soldering support and drives the soldering head to move back and forth, a third left-and-right moving module which is in sliding fit with the third front-and-back moving module and drives the soldering head to move left and right, and a third up-and-down moving module which is in sliding fit with the third left-and-right moving module and drives the soldering head to move up and down.

The automatic PCB assembling system is characterized in that the dispensing moving mechanism comprises a third left-right moving module for driving the dispensing head to move left and right, a third front-back moving module for driving the dispensing head to move front and back, and a third up-down moving module for driving the dispensing head to move up and down.

The PCB automatic assembly system comprises a feeding device, a reflux device and a PCB automatic assembly device, wherein the reflux device is arranged in parallel with the feeding device;

the Harper welding device, the soldering device, the dispensing device and the curing device are all arranged on the rack and located beside the feeding device and the backflow device, and are sequentially arranged along the extending direction of the feeding track.

The PCB automatic assembly system comprises a feeding device, a conveying device and a control device, wherein the feeding device comprises belt frameworks which are arranged at intervals, a conveying belt sleeved on the belt frameworks, a driving wheel arranged below the belt frameworks and driven wheels arranged on two sides of the belt frameworks, and the driving wheel drives the conveying belt and the driven wheels to rotate along the extension direction of the feeding device;

the system also comprises a turnover mechanism, wherein the turnover mechanism comprises a turnover support, a turnover shaft arranged on the turnover support and a clamping piece connected with the turnover shaft in a turnover manner;

the turnover mechanism is arranged in the fixed base, and the clamping piece is located in an interval area between the belt frameworks.

The PCB automatic assembly system is characterized in that the curing device comprises a positive curing support, a curing lamp fixedly connected with the curing support, a reverse curing support and a reverse curing lamp fixedly connected with the reverse curing support;

the positive curing support and the negative curing support are arranged on the fixed base;

just solidify the lamp set up in interval region top between the belt skeleton, anti-solidification lamp with just solidify the lamp and set up relatively and be located interval region's below.

Has the advantages that: the PCB automatic assembly system comprises a rack, a feeding device arranged on the rack, a Harper welding device, a soldering device, a dispensing device and a curing device. The Harper welding device, the soldering device, the dispensing device and the curing device are sequentially arranged beside the feeding device. The Harba welding device, the soldering device and the dispensing device comprise a support, a moving mechanism and a welding head/dispensing head, when a PCB to be assembled passes through, the Harba welding, the soldering, the dispensing and the curing are automatically realized in sequence, so that the PCB to be assembled is placed on the feeding device, manual operation is not needed, the output of a finished product is automatically completed at the output end, the labor cost is reduced, the automation degree of production is improved, the production efficiency is improved, and the stability of a product is also improved.

Drawings

Fig. 1 is an overall structural view of an automatic PCB assembly system according to the present invention.

Fig. 2 is a schematic structural diagram of a feeding device of an automatic PCB assembly system provided in the present invention.

Fig. 3 is a structural schematic diagram of a positive haba welding module of the automatic PCB assembly system provided by the present invention.

Fig. 4 is a schematic structural diagram of a first moving mechanism of the automatic PCB assembly system according to the present invention.

Fig. 5 is a schematic structure of a positive haba welding module and a negative haba welding module of the automatic PCB assembly system provided by the present invention.

Fig. 6 is a schematic structural diagram of an upper and lower positioning module of the automatic PCB assembly system provided in the present invention.

Fig. 7 is a schematic structural diagram of a soldering device of an automatic PCB assembly system according to the present invention.

Fig. 8 is a partially enlarged view of the area a in fig. 7.

Fig. 9 is a schematic structural view of a dispensing device of the automatic PCB assembling system according to the present invention.

Fig. 10 is a partially enlarged view of the region B in fig. 9.

Fig. 11 is a partially enlarged view of the area C in fig. 9.

Fig. 12 is a schematic structural view of a turnover mechanism of the automatic PCB assembly system according to the present invention.

Fig. 13 is a schematic structural diagram of a curing device of the automatic PCB assembling system according to the present invention.

Fig. 14 is a schematic structural view of a solder transfer rail of an automatic PCB assembly system according to the present invention.

And (3) identification and explanation:

10c, a hood; 10a, opening the box body; 10b, a movable box body; 20, a feeding device; 20a, welding a transmission rail by a Harper; 20b, soldering the transfer rail; 20c, a belt framework; 20d, a transmission belt; 20e, a driving wheel; 20f, a driven wheel; 20h, clamping; 30, a haba welding device; 30a, welding a bracket by a Harper; 30b, a sensor; 30d, welding a module by positive Harper; 31d, a first bracket; 32d, a first left-right moving module; 32g, a first left-right moving unit; 32h, a first support shield; 32e, a first back-and-forth movement module; 32i, a first back-and-forth movement unit; 32j, a second support shield; 32f, a first up-and-down moving module; 32k, a first up-and-down moving unit; 32l, moving the fixed cover; 33g, a first welding head; 30e, an inverse haba welding module; 31e, a second bracket; 31f, a second left-right moving unit; 31g, a second back-and-forth moving unit; 31h, a second up-and-down moving unit; 31k, a second bonding tool; 30c, a positioning mechanism for Harper welding; 34a, an up-down positioning unit; 34b, a fixing plate; 34c, a limit plate; 34d, a via hole; 34e, active area; 34f, a front and rear positioning unit; 34g, a left and right positioning unit; 34h, positioning a plate; 30f, cooling the air blowing pipe; 40, a soldering device; 40a, soldering the holder; 40b, a third back-and-forth movement unit; 40c, soldering the belt track; 40d, soldering the sliding rail; 40e, a limiting block; 40f, soldering a protective cover; 40g, a third left-right moving module; 40h, a third up-down moving module; 40i, a tin soldering tip; 40j, a soldering positioning mechanism; 50, a glue dispensing device; 50a, a third left-right moving unit; 50b, a fourth support cage; 50c, a third forward-backward moving unit; 50d, a first belt track; 50e, a first sliding track; 50f, a third up-down moving unit; 50g, a second belt track; 50h, a second sliding track; 50i, a second connecting piece; 50j, dispensing head; 60, a curing device; 60a, curing the stent; 60b, a positive curing light; 60c, reverse curing the stent; 60d, a reverse curing lamp; 70, a reflux device; 80, a turnover mechanism; 80a, turning over the bracket; 80b, a turnover shaft; 80c, a clamping member.

Detailed Description

The invention provides an automatic assembly system of a PCB, which is further described in detail below by referring to the attached drawings and embodiments in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As shown in fig. 1, the present embodiment provides an automatic assembly system for PCB boards, which comprises a rack, a feeding device 20, a haba welding device 30, a soldering device 40, a dispensing device 50, and a curing device 60. Hereinafter, "front" and "rear" refer to "front" and "rear" with respect to the assembling situation operated or viewed by the operator, the "left" is a direction as an assembling starting point, the "right" is a direction of an assembling end point with respect to the assembling starting point, and the "up" and "down" are relative concepts with respect to the ground height, so that the orientation concepts such as "up" and "down" may be changed according to different needs, and are not limited to the orientation words used in the present embodiment.

The frame is used for accommodating the haba welding device 30, the soldering device 40, the dispensing device 50 and the curing device 60. The frame includes a plurality of unable adjustment base and aircraft bonnet 10c, and unable adjustment base mainly is used for providing the support for devices such as haba welding device 30, and the aircraft bonnet 10c mainly is in order to provide the protection for haba welding device 30 etc. with it with external relative isolation. In addition, still can set up the fan among the unable adjustment base to reduce the temperature in the frame.

As shown in fig. 1, the fixed base can be an open box 10a, which mainly provides support for the starting end of the transmission device; the stationary base may further include a movable box 10b having a movable door. The welding apparatus 30 and the soldering apparatus 40 can be arranged adjacent to each other due to their close distance and supported by the first movable housing 10b. The second movable box 10b is used to support the dispensing device 50 and the curing device 60. The blower may be provided in the first movable box 10b and the second movable box 10b. A hood 10c may be provided outside the haba welding device 30, the soldering device 40, the dispensing device 50 and the curing device 60 to protect the safe operation of these devices.

The feeding device 20 is used for conveying the PCB to be assembled, and for convenience of description, the left side is defined as a starting side of the feeding device 20, and the extending direction of the feeding device 20 is from left to right. The feeding device 20 may be a single long feeding rail or a multi-sectional feeding rail. According to different functions, the feeding device 20 can be divided into a Hubban welding transmission track 20a, a soldering transmission track 20b and a dispensing transmission track. The input end of the Harper welding transmission track 20a is arranged at the first end part of the fixed base; the input end of the soldering transmission track 20b is adjacent to the output end of the haba welding transmission track 20 a; the input end of the dispensing transmission track is adjacent to the output end of the soldering transmission track 20 b; the output end of the dispensing transmission track is arranged at the second end part of the fixed base.

In the first feeding device 20 of the present embodiment, the feeding device 20 may adopt a conventional belt conveyor. However, only one surface of the belt conveyor can be processed in one transmission, and two transmissions or other structures are required to implement the positive processing, so as shown in fig. 2, in the second feeding device 20 of this embodiment, in order to facilitate processing of the sample to be processed on the upper and lower sides, the feeding device 20 includes belt frames 20c arranged at intervals, a transmission belt 20d sleeved on the belt frame 20c, a driving wheel 20e arranged below the transmission belt 20d, and driven wheels 20f arranged on two sides of the belt frame 20 c. The driving wheel 20e drives the transmission belt 20d and the driven wheel 20f to rotate along the extending direction of the feeding device 20, the driving wheel 20e rotates to drive the transmission belt 20d to move, and the driven wheel 20f rotates along with the movement of the transmission belt 20d to control the movement of the transmission belt 20 d. The PCB to be assembled is spanned by the two belt skeletons 20c to complete the transportation of the PCB. If the PCB to be assembled is smaller, the PCB can be placed on the clamp 20h to increase the size and facilitate assembly, or the distance between the belt frameworks 20c is adjusted to enable the distance between the belt frameworks 20c to be larger than the width of the PCB to be processed.

The Harper welding device 30 is used for welding an object to be welded on a PCB board, so as to achieve the purposes of light weight, thinness, short length and small size. The Harper welding device 30 comprises a Harper welding support 30a, a Harper welding moving mechanism arranged on the Harper welding support 30a, and a Harper welding head fixedly connected with the Harper welding moving mechanism, wherein the Harper welding moving mechanism drives the Harper welding head to move.

As shown in fig. 3 to 5, the harp welding apparatus 30 can perform harp welding from above the PCB or from below the PCB. Accordingly, the harp welding apparatus 30 includes a positive harp welding module 30d and/or a negative harp welding module 30e depending on whether the harp welding apparatus 30 is located above or below the PCB board. The positive Harper welding module 30d performs Harper welding on the PCB from the upper part, and is arranged on the surface of the fixed base; the inverse haba welding module 30e performs haba welding on the PCB board from below, and thus is installed in the fixing base.

The positive haba welding module 30d comprises a first support 31d arranged on the surface of the fixed base and positioned beside the feeding device 20, a first moving mechanism arranged on the first support 31d, and a first welding head 33g fixedly connected with the first moving mechanism and facing the surface of the fixed base, wherein the first moving mechanism drives the first welding head 33g to move. The inverse haba welding module 30e comprises a second support 31e arranged in the fixed base, a second moving mechanism arranged on the second support 31e, and a second welding head 31k fixedly connected with the second moving mechanism and facing the surface of the fixed base, wherein the second moving mechanism drives the second welding head 31k to move.

The first moving mechanism and the second moving mechanism can adopt a combination of various moving elements to realize the movement in multiple directions. For example, as shown in fig. a (haba welding moving mechanism), the first moving mechanism may include a first left-right moving module 32d for driving the first welding head 33g to move left and right, a first front-back moving module 32e for driving the first welding head 33g to move front and back, and a first up-down moving module 32f for driving the first welding head 33g to move up and down. Similarly, the second moving mechanism includes a second left-right moving module for driving the second welding head 31k to move left and right, a second front-back moving module for driving the second welding head 31k to move front and back, and a second up-down moving module for driving the second welding head 31k to move up and down.

The connection object can be selected freely between the respective modules of the first moving mechanism/the second moving mechanism as long as it can drive the first welding head 33 g/the second welding head 31k to move. In this embodiment, in the first moving mechanism, a first left-right moving module 32d is disposed on the haba welding bracket 30a and parallel to the feeding device 20, a first front-back moving module 32e is slidably connected above the first left-right moving module 32d, the first front-back moving module 32e is disposed perpendicular to the extending direction of the feeding device 20, and the first up-down moving module 32f is slidably connected in the first front-back moving module 32e in the direction close to the feeding device 20. Further, the first left-right moving module 32d may include a first left-right moving unit 32g disposed on the first bracket 31d and sliding left and right, and a first support cover 32h fixedly connected to the first left-right moving unit 32 g. The first back-and-forth movement module 32e includes a first back-and-forth movement unit 32i disposed on the first support cover 32h and sliding back and forth, and a second support cover 32j fixedly linked with the first back-and-forth movement unit 32 i. The first up-and-down moving module 32f includes a first up-and-down moving unit 32k disposed at one side of the second support housing 32j close to the feeding device 20 and sliding up and down, and a first welding head 33g disposed at one side of the first up-and-down moving unit 32k close to the feeding device 20. When the first left-right moving unit 32g slides, the first front-back moving unit is driven to move left and right based on the first support cover 32h, and at the same time, the first up-down moving unit 32k also moves up and down, thereby driving the first welding head 33g to move left and right. In order to fix the movement of the first up-and-down moving unit 32k, a movement fixing cover 32l may be provided outside the first up-and-down moving unit 32 k.

In the second moving mechanism, a second left-right moving module is arranged on the Harper welding support 30a and is parallel to the feeding device 20, the second front-back moving module is connected above the second left-right moving module in a sliding mode, the second front-back moving module is arranged in the direction perpendicular to the extending direction of the feeding device 20, and the second up-down moving module is connected in the direction, close to the feeding device 20, in the second front-back moving module in a sliding mode. Further, the second left-right moving module may include a second left-right moving unit 31f disposed on the second bracket 31e and sliding left and right, and a third support cover fixedly connected to the second left-right moving unit 31 f. The second back-and-forth movement module includes a second back-and-forth movement unit 31g disposed on the third support cover and sliding back and forth, and a fourth support cover 50b fixedly linked with the second back-and-forth movement unit 31 g. The second up-and-down moving module includes a second up-and-down moving unit 31h disposed at one side of the fourth support cover 50b close to the feeding device 20 and sliding up and down, and a second welding head 31k disposed at the other side of the second up-and-down moving unit 31h close to the feeding device 20. When the second left-right moving unit 31f slides, the second front-rear unit is driven to move left and right based on the fourth support cap 50b, and at the same time, the second up-down moving unit 31h also moves up and down, thereby driving the second welding head 31k to move left and right. Each moving unit in the moving mechanism may adopt a structural element such as an air cylinder which can be pushed to operate.

In addition, in order to detect whether the PCB board enters the working range of the harp welding device 30, a sensor 30b may be disposed on the harp welding bracket 30a to monitor the entry of the PCB board. The welding is carried out after the Harper welding head is heated, and after the welding, the welding head needs to be eaten up and cooled rapidly without being heated, so that the upward Harper welding device 30 further comprises a cooling gas blowing pipe 30f. Because the Harper welding head can move, the cooling gas blowing pipe 30f is fixedly connected with the moving mechanism in order to be capable of cooling in time after welding. Specifically, in the present embodiment, the haba horn is fixedly connected to the first up-and-down moving unit 32 k. In order to fix the passing PCB for welding, the haba welding device 30 further includes a haba welding positioning mechanism 30c, and the haba welding positioning mechanism 30c can fix the passing PCB from the front-back and left-right directions to ensure that no displacement occurs in the haba welding process. The haba welding positioning mechanism 30c can include the upper and lower locating module, front and back locating module and control the locating module, wherein, the upper and lower locating module is used for fixed PCB board position in the upper and lower direction, and the front and back locating module is used for fixed PCB board position in the front and back direction, controls fixed module and is used for fixed PCB board position in the left and right directions.

For example, as shown in fig. 6, in the present embodiment, the upper and lower positioning module includes an upper and lower positioning unit 34a, a fixing plate 34b fixedly connected to the upper and lower positioning unit 34a, and a limiting plate 34c disposed on the upper and lower positioning unit 34a and spaced from the fixing plate 34 b. The limiting plate 34c is provided with a through hole 34d corresponding to the upper and lower positioning units 34a and an active area 34e corresponding to the Harper welding head, so that the Harper welding head only moves in the active area 34e, and the left and right positioning modules and the front and rear positioning modules are arranged below the limiting plate 34c. The front and rear positioning unit 34f includes a plurality of front and rear positioning units 34f, the front and rear positioning units 34f may be located in the same direction of the active area 34e, or in both front and rear directions, and the left and right positioning module includes a positioning plate 34h located on the left side of the active area 34e, and a left and right positioning unit 34g disposed on the right side of the active area 34 e. When the PCB passes, the left and right positioning units 34g and the positioning plate 34h may be fixed in the left and right directions of the PCB, the front and rear positioning units 34f may be fixed in the front and rear directions of the PCB, and the up and down positioning units 34a may fix the PCB in the up and down directions through the through holes 34 d.

The soldering device 40 is used for soldering a PCB to be assembled, and specifically comprises a soldering bracket 40a, a soldering moving mechanism arranged on the soldering bracket 40a, and a soldering head 40i fixedly connected with the soldering moving mechanism, wherein the soldering moving mechanism drives the soldering head 40i to move. The soldering apparatus 40 may be similar in structure to the haba welding apparatus 30.

As shown in fig. 7 to 8, in the present embodiment, a mechanism different from the haba welding apparatus 30 can be used for the soldering apparatus 40. The soldering bracket 40a comprises a fixing bracket and soldering slide rails arranged on the fixing bracket, and the extending direction of the soldering slide rails is perpendicular to the extending direction of the feeding device 20. The soldering moving mechanism comprises a third left-right moving module 40g in sliding fit with the soldering slide rail and a third left-right moving module 40g in sliding fit with the third left-right moving module. And a tin welding head 40i is fixedly connected to the third side close to the feeding device 20. The third left-right moving module 40g can slide back and forth on the soldering slide rail and drive the third to slide up and down, and a soldering head 40i is fixedly connected to the side, close to the feeding device 20, of the third center. In order to fix the passing PCB, a soldering positioning mechanism 40j is further arranged on the soldering conveying track 20b, and when the passing PCB is detected, the soldering positioning mechanism 40j is started to fix the PCB.

In a structure of a soldering bracket 40a that can be used, the soldering moving mechanism includes a third front-and-back moving module that is fixedly connected with the soldering bracket 40a and drives the soldering tip 40i to move forward and backward, a third left-and-right moving module 40g that is in sliding fit with the third front-and-back moving module and drives the soldering tip 40i to move left and right, and a third up-and-down moving module 40h that is in sliding fit with the third left-and-right moving module 40g and drives the soldering tip 40i to move up and down.

As for the sliding fit between the moving modules, as shown in fig. 7 and 8, taking the third front-back moving module as an example, the third front-back moving module includes a third front-back moving unit 50c40b disposed on the soldering bracket 40a, a soldering belt rail 40c in transmission connection with the third front-back moving unit 50c40b, and a soldering sliding rail 40d disposed on the soldering bracket 40a and in parallel with the soldering belt rail 40c, wherein the direction of disposition of the soldering belt rail 40c is perpendicular to the extending direction of the feeding device 20, and the third left-right moving module 40g is in sliding fit with the soldering sliding rail 40d and in transmission connection with the soldering belt rail 40 c. When the third forward-backward moving unit 50c40b moves, the belt of the driving belt is driven to rotate, and the third forward-backward moving module is driven to move between a position far from the feeding device 20 and a position close to the feeding device 20 by means of the soldering sliding rail 40 d. In addition, two third front-rear moving modules may be provided, which are respectively provided at both sides of the soldering bracket 40a, to improve the support of the third left-right moving module 40g and the third up-down moving module 40h. Meanwhile, in order to restrict the movement of the third left-right movement module 40g, stoppers 40e are provided at both ends of the soldering slide rail 40 d. In order to protect the third forward-and-backward movement module, the soldering bracket 40a may further include a soldering protector 40f to protect the operation of the soldering belt rail 40c and the soldering slide rail 40 d. A third side-to-side device may be connected to the soldered belt track 40c by a clamping structure.

When the PCB to be assembled enters the area corresponding to the soldering device 40, the soldering head 40i is moved to a preset soldering position (i.e. the position of the PCB to be soldered) based on the soldering moving mechanism, then soldering is performed, after the soldering is finished, the soldering moving mechanism lifts the soldering head 40i, and the feeding device 20 transports the soldered PCB to the next stage.

The dispensing device 50 is used for dispensing a PCB to be assembled, and comprises a dispensing support, a dispensing moving mechanism arranged on the dispensing support, and a dispensing head 50j fixedly connected with the dispensing moving mechanism, wherein the dispensing moving mechanism drives the dispensing head 50j to move. The dispensing device 50 may also be configured similarly to the haba welding device 30 or the soldering device 40.

As shown in fig. 9 to 11, the dispensing moving mechanism may include a third left-right moving module 40g for driving the dispensing head 50j to move left and right, a third front-back moving module for driving the dispensing head 50j to move front and back, and a third up-down moving module 40h for driving the dispensing head 50j to move up and down. The third left-right moving module 40g comprises a third left-right moving unit 50a and a fourth supporting cover 50b fixedly connected with the third left-right moving unit 50a, and the third front-back moving module comprises a third front-back moving unit 50c40b arranged on the fourth supporting cover 50b, a first belt track 50d in transmission connection with the third front-back moving unit 50c40b and arranged on the first supporting cover 32h, a first sliding track 50e arranged on the fourth supporting cover 50b, and a first connecting piece in transmission fit with the first belt track 50d and in sliding fit with the first sliding track 50 e. The third up-and-down moving module 40h comprises a third up-and-down moving unit 50f, a second belt track 50g which is in transmission connection with the third moving unit and is arranged on the first connecting piece, a second sliding track 50h which is arranged on the first connecting piece, a second connecting piece 50i which is in transmission connection with the second belt track 50g and is in sliding fit with the second sliding track 50h, and a dispensing head 50j is arranged on one side, close to the feeding device 20, of the second connecting piece 50 i. The working principle of the third left-right moving module 40g, the third front-back moving module and the third up-down moving module 40h has been described in the soldering apparatus 40 and the haba welding apparatus 30, and thus, it is not described one by one here. In order to protect the operation of the mobile modules, a cover can also be provided for each mobile module.

When the PCB to be dispensed enters the dispensing device 50, the dispensing head 50j is moved to a predetermined dispensing position (i.e., a position in the PCB where dispensing is required) based on the dispensing moving mechanism, and then dispensing is performed, after dispensing, the dispensing moving mechanism lifts the dispensing head 50j, so that the feeding device 20 feeds the PCB into the next process.

It should be noted that although the front and the back of the PCB board need to be dispensed, the dispensing difficulty from the back is large, and therefore, in order to reduce the dispensing difficulty, as shown in fig. 12, in this embodiment, the system further includes a turnover mechanism, which includes a turnover bracket 80a, a turnover shaft 80b disposed on the turnover bracket 80a, and a clamping member 80c connected to the turnover shaft 80b in a turnover manner. Since the feeding device 20 used in this embodiment includes the belt frames 20c arranged at intervals, the clamping members 80c of the turnover mechanism can be located in the interval areas between the belt frames 20 c. When the PCB board enters the range of the clamping piece 80c, the clamping piece 80c clamps the PCB board, and the turnover shaft 80b is turned over based on the turning connection with the turnover shaft 80b, so that the PCB board is turned over from the front side to the back side.

Curing is required after dispensing to solder the dispensed components to the PCB, and the curing device 60 includes at least a curing support and a curing lamp connected to the curing support. In order to cure the dispensed PCB as soon as possible, as shown in fig. 13, the curing device 60 in this embodiment includes a forward curing bracket 60a, a curing lamp fixedly connected to the curing bracket, a reverse curing bracket 60c, and a reverse curing lamp 60d fixedly connected to the reverse curing bracket 60 c. The forward curing support 60a and the reverse curing support 60c are disposed on the fixing base, but the forward curing support 60a has a height greater than that of the reverse curing support 60c, so that the forward curing lamp 60b is disposed above a spacing region between the belt frames 20c, and the reverse curing lamp 60d is disposed opposite to the forward curing lamp 60b and below the spacing region. As shown in fig. 12, the curing support 60a is L-shaped, one end of which is fixedly connected to the support base and the other end of which is fixedly connected to the curing lamp. When the PCB to be assembled passes through the curing support, the front curing lamp 60b and the back curing lamp 60d cure the dispensed PCB from the front surface and the back surface, and the assembly of the PCB is completed. The curing lamp may be a UV lamp or the like.

After the assembly is completed, the PCB reaches the output end of the feeding device 20, at the moment, an inspector can stand at the position of the output end to detect whether the assembled PCB is qualified or not, and if the assembled PCB is not qualified, the PCB needs to be fed back to the input end of the feeding device 20 to enter the assembly process again. In order to facilitate the reflow of the PCB, as shown in fig. 14, the system further includes a reflow device, the reflow device is parallel to the feeding device 20, and the haba soldering device 30, the soldering device 40, the dispensing device 50 and the curing device 60 are all disposed on the rack and located beside the feeding device 20 and the reflow device, and are sequentially arranged along the extending direction of the feeding track. The reflux device can adopt a conventional belt conveyor.

The whole process can realize the automatic assembly of the PCB only by placing the PCB or the clamp 20h provided with the PCB on the feeding device 20, is simple and convenient, reduces the labor cost, and is easier to control.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. An automatic PCB assembling system is characterized by comprising a rack, a feeding device, a Harper welding device, a soldering device, a dispensing device and a curing device;

the soldering device comprises a soldering bracket, a soldering moving mechanism arranged on the soldering bracket and a soldering head fixedly connected with the soldering moving mechanism, and the soldering moving mechanism drives the soldering head to move;

the Harper welding device, the soldering device, the dispensing device and the curing device are all arranged on the rack and beside the feeding device and are sequentially arranged along the extending direction of the feeding track;

2. The automatic PCB assembling system of claim 1, wherein the rack comprises a plurality of fixed bases and a hood, and the feeding device, the Harper welding device, the soldering device and the glue dispensing device are arranged on the fixed bases;

3. The automatic PCB assembling system of claim 2, wherein the feeding device comprises a Hubban welding transmission rail, a soldering transmission rail and a dispensing transmission rail;

4. The automatic PCB assembly system of claim 2, wherein the Harper welding device comprises a positive Harper welding module and a negative Harper welding module;

5. The automatic PCB assembling system of claim 4, wherein the first moving mechanism comprises a first left-right moving module for driving the first welding head to move left and right, a first front-back moving module for driving the first welding head to move front and back, and a first up-down moving module for driving the first welding head to move up and down;

6. The automatic PCB assembling system of claim 1, wherein the soldering moving mechanism comprises a third front-and-back moving module fixedly connected with the soldering bracket and driving the soldering head to move forward and backward, a third left-and-right moving module in sliding fit with the third front-and-back moving module and driving the soldering head to move left and right, and a third up-and-down moving module in sliding fit with the third left-and-right moving module and driving the soldering head to move up and down.

7. The automatic PCB assembling system of claim 1, wherein the dispensing moving mechanism comprises a third left-right moving module for driving the dispensing head to move left and right, a third front-back moving module for driving the dispensing head to move front and back, and a third up-down moving module for driving the dispensing head to move up and down.

8. The automatic PCB assembling system of claim 1, further comprising a reflow device disposed in parallel with said feeding device;

the Harper welding device, the soldering device, the glue dispensing device and the curing device are all arranged on the rack and positioned beside the feeding device and the backflow device, and are sequentially arranged along the extending direction of the feeding track.

9. The automatic PCB assembling system of claim 1, wherein the feeding device comprises belt frameworks arranged at intervals, a transmission belt sleeved on the belt frameworks, a driving wheel arranged below the belt frameworks and driven wheels arranged at two sides of the belt frameworks, and the driving wheel drives the transmission belt and the driven wheels to rotate along the extending direction of the feeding device;

10. The automatic PCB assembling system of claim 9, wherein the curing device comprises a forward curing bracket, a curing lamp fixedly connected with the curing bracket, a reverse curing bracket and a reverse curing lamp fixedly connected with the reverse curing bracket;